Light module

Abstract

A light module for use in a headlight, the light module comprising: a heat sink; a printed circuit board assembly connected to the heat sink, wherein the printed circuit board assembly comprises a connector electrically connected to the printed circuit board assembly; and a light-emitting diode assembly (LED assembly) that is connected to the heat sink and electrically connected to the printed circuit board assembly, the LED assembly comprising: an interposer, at least one LED connected to the interposer and at least one electrical contact connected to the interposer, wherein the interposer is connected to the heat sink via an adhesive.

Description

REFERENCE TO RELATED REGISTRATIONS

[0001] This application claims precedence over the preliminary US application No. 63 / 522.634 entitled “LIGHTING MODULE”, filed on June 22, 2023, which is deemed to be reproduced in its entirety by reference. FIELD OF INVENTION

[0002] The present disclosure relates to vehicle headlights, in particular an improved light module for an LED vehicle headlight. BACKGROUND

[0003] Automotive headlights, such as LED (light-emitting diode) headlights, comprise light modules that can be attached to a reflector of the headlight, with the mounted components configured to generate light and direct it outwards from the headlight. In other examples, the light modules can be attached to other optics, such as a total internal reflector (TIR) ​​or light guides, among other options not explicitly listed. Standard or conventional light modules include white LEDs with a specific density of LEDs to produce the desired amount of light. Furthermore, standard or conventional light modules include LEDs soldered onto a printed circuit board (PCB) or an insulated metal substrate (IMS), with the PCB or IMS subsequently mounted on a heat sink of the light module.The (previously described) standard or conventional light module has problems regarding the reliability of the solder joints and the thermal contact with the heat sink, which can lead to reliability and performance problems for the standard or conventional light module. SUMMARY

[0004] According to one aspect of the disclosure, a light module for use in a headlight is disclosed, for example, a headlight used in automobiles, motorcycles (two-wheelers), trains, aircraft, general lighting, and special lighting applications. The light module may comprise a heat sink, a printed circuit board assembly, and a light-emitting diode (LED) assembly. The printed circuit board assembly may be connected to the heat sink and may include a connector electrically connected to the printed circuit board. The LED assembly may be connected to the heat sink and electrically connected to the printed circuit board assembly. The LED assembly may include an interposer, at least one LED connected to the interposer, and at least one electrical contact connected to the interposer. The interposer may be connected to the heat sink via an adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] The foregoing summary and the following detailed description are best understood when read in conjunction with the accompanying drawings, which illustrate a preferred embodiment of the disclosure. In the drawings: Fig. Figure 1 shows a perspective view of a light module. Fig. 2A is an example of an LED assembly used with a light module of the present disclosure. Fig. 2B is another example of an LED assembly used with a light module of the present disclosure. Fig. Figure 3A is a perspective view of the light module of the present disclosure including an LED assembly. Fig. 3B is a top view of the light module made of Fig. 3A. Fig. 4A is an enlarged view of the part of the light module made of Fig. 3A, which contains the LED assembly. Fig. 4B is another enlarged view of the part of the light module made of Fig. 3A, which includes the LED assembly and a light guide. Fig. Figure 5 is another perspective view of a light module of the present disclosure with two LED assemblies. Fig. 6A is an enlarged top view of the part of the light module made of Fig. 5, which contains the LED assembly. Fig. 6B is another enlarged top view of the part of the light module made of Fig. 5, which shows the installation positions of the LED assemblies. Fig. Figure 7 is a flowchart illustrating an example procedure for assembling a light module of the present disclosure. Fig. Figure 8 is a diagram of an example of a vehicle headlight system in which a light module of the present disclosure can be used. DETAILED DESCRIPTION

[0006] Certain terms are used in the following description for simplicity only and are not restrictive. The terms "front," "back," "top," and "bottom" denote directions in the drawings referenced. The terms "inward" and "outward" refer to directions to and from parts referenced in the drawings. "Axial" refers to a direction along the axis of a shaft or other cylindrical element. A reference to a list of elements described as "at least one of a, b, or c" (where a, b, and c are the elements listed) means that each of the elements a, b, or c, or combinations thereof, is included. The terms "about" and "approximately" include + / - 10% of a given value unless otherwise specified. The terminology includes the terms expressly mentioned above, derivatives thereof, and terms of similar meaning.

[0007] One problem with standard or conventional light modules is that the solder joint between the LEDs and the circuit board or IMS is typically unreliable because the solder joint has different thermal expansion properties than the surrounding metallic materials. Therefore, the solder can weaken or break during thermal expansion, leading to problems with the light module and the automotive headlight. Furthermore, standard or conventional light modules are only available in certain colors and may not be suitable for other automotive applications such as daytime running lights, turn signals, taillights, etc.

[0008] Automotive headlights, such as LED (light-emitting diode) headlights, can contain light modules mounted on a reflector. These components can be configured to generate light and direct it outwards from the headlight. In other cases, the light modules can be attached to the headlight to couple and generate light in other types of optics. Standard or conventional light modules may include white LEDs with a specific density of LEDs to produce the desired amount of light. Furthermore, standard or conventional light modules may include LEDs soldered to a heat sink within the module, and the LEDs may be electrically coupled to a power source to receive electrical energy to generate the light.

[0009] Fig. Figure 1 is a perspective view of an example of a light module 100 that can be used in LED headlights for motor vehicles. The light module 100 comprises a heat sink 102, a printed circuit board assembly 104 connected to the heat sink 102, and a light-emitting diode (LED) 106 connected to the heat sink 102. The printed circuit board assembly 104 includes a connector 108 extending from the assembly and electrically connected to it to supply electrical power when the connector 108 is connected to a power source. In some examples, the LED 106 can be soldered directly to the heat sink 102 or glued to it. The LED 106 is electrically connected to the printed circuit board assembly 104 to receive electrical power from it.

[0010] One problem with the light module 100, which has an LED soldered directly to the heat sink 102, is that the solder joint between the LED 106 and the heat sink 102 is generally unreliable because the solder joints have different thermal expansion properties than the surrounding metallic materials. Therefore, the solder can weaken or break during thermal expansion, which can lead to problems with the light module 100 and the entire vehicle headlight. Furthermore, the light module 100 is only available in certain colors and may not be suitable for other automotive applications such as daytime running lights, turn signals, taillights, etc. Therefore, an improved light module for an LED car headlight is desirable, one that addresses the problems of the light module 100 used in LED car headlights.

[0011] Fig. 2A is an example of an LED assembly 20, which is equipped with a light module 10 (shown in Fig. 3A) of the present disclosure can be used. Fig. 2B is another example of an LED assembly 20 that can be used with the light module 10 of the present disclosure. Fig. Items 2A and 2B will be discussed together.

[0012] As in the Fig. As shown in Figures 2A-2B, the LED assembly 20 comprises an interposer 22, at least one LED 24 coupled to the interposer 22, and at least one electrical contact 26 coupled to or integrally formed with the interposer 22. The interposer 22 can be a component or a substrate with which the other components of the LED assembly 20 are coupled or integrally formed. In the examples shown, the interposer 22 generally has a rectangular shape due to the fact that it is quick and inexpensive to manufacture and produce. However, it is understood that in other embodiments the interposer 22 can have any other desired shape.Furthermore, the interposer 22 can be made of a material that has approximately the same thermal expansion properties as the at least one LED 24, to ensure that the interposer 22 and the at least one LED 24 expand and contract at approximately the same rate. In some non-limiting examples, the interposer 22 can be made of, among other things, a ceramic material, aluminum nitride, aluminum oxide, aluminum IMS, anodized aluminum, or copper, with other options not expressly listed. In exemplary embodiments, the interposer should be made of a highly conductive material.

[0013] As shown, the minimum of one LED 24 can comprise a multitude of LEDs 24. As in Fig. As shown in 2A, the minimum of one LED 24 can comprise five LEDs 24 in some examples. As in Fig. As shown in Figure 2B, the minimum LED 24 can comprise up to seven LEDs 24 in some examples. The number of LEDs 24 in the LED assembly 20 can vary depending on the intended use of the LED assembly 20. Furthermore, the color of each of the minimum LEDs 24 can vary depending on the intended use of the LED assembly 20. In some non-restrictive examples, the LEDs 24 can be one of the following colors: cool white, warm white, yellow, amber, red, and cyan, among other colors not explicitly listed. Additionally, the specific pattern or orientation of the different colored LEDs 24 can vary to achieve the desired light output.

[0014] The LED assembly 20 can be flexibly designed, so that the ones in the Fig. The LED assemblies 20 shown represent only two example configurations among many different configurations. For example, the flexible design of the LED assembly 20 can include a different number of LEDs 24, different colors of the LEDs 24, different spacings between the LEDs 24, different orientations of the LEDs 24, different densities of the LEDs 24, as well as other aspects not explicitly listed. Thus, the LED assembly 20 of this disclosure can be used for a variety of automotive purposes, such as headlights, low beams, fog lights, daytime running lights, turn signals, and taillights, among other options not explicitly listed.The LED assembly 20 can be designed and configured for a wide variety of automotive lighting purposes, offering many advantages over previous designs which are typically designed for a single purpose, as explained below and appreciated by professionals in the field.

[0015] In the Fig. In the example shown in Figure 2A, the LED assembly 20 comprises two white LEDs 24 and three yellow LEDs 24 to produce the desired light output. In the example shown in Fig. In the example shown in Figure 2B, the LED assembly 20 comprises three white LEDs 24 and four yellow LEDs 24 to produce the desired light output. Thus, the number of LEDs 24, the color of each LED 24, and the orientation of the LEDs 24 on the interposer 22 of the LED assembly 20 can be freely selected depending on the specific application or intended use (headlights, low beam, fog lights, daytime running lights, turn signals, and taillights, etc.).

[0016] Each of the at least one LED 24 can be soldered to the interposer 22 to securely connect each of the at least one LED 24 to the interposer 22. The solder material can be a tin-silver-copper solder (SAC solder), a gold-tin solder (AuSn solder), or another solder material with a high operating temperature. Furthermore, in some examples, the solder material can be chosen to approximately match the thermal expansion properties of the interposer 22 and the at least one LED 24 to ensure a more reliable solder joint. Thus, the approximately identical thermal expansion properties of the interposer 22, the at least one LED 24, and the solder joint ensure that the solder joint does not weaken or break during use of the LED assembly 20, which inevitably expands and contracts during operation.

[0017] Each of the at least one LED 24 can be electrically contacted to receive electrical energy in any way, for example, via a common ground contact, completely independent contacts, or individual addressable contacts. The specific approach is not so important as long as each of the at least one LED 24 can be supplied with electrical energy. For this purpose, each of the at least one electrical contacts 26 of the LED assembly 20 can be electrically coupled to one or more of the at least one LED 24 to supply the at least one LED 24 with electrical energy. As shown in the Fig. As shown in Figures 2A-2B, the at least one LED 24 and the at least one electrical contact 26 can be positioned on the same side or surface of the interposer 22, which can be referred to as an electrical connection with top contact or LED assembly 20 with top contact.

[0018] The top-contact configuration of the LED assembly 20 is desirable because, with the LEDs 24 and the electrical contacts 26 on the same side or surface of the interposer 22, the underside of the interposer 22 (not shown) is free of components, and the entire underside of the interposer 22 can be used as a heat sink or heat dissipation surface, as explained in more detail below. In contrast, with conventional or earlier surface-mount devices (SMDs) for LED assemblies, the LEDs are located on a top side and the electrical contacts on the (opposite) underside, which means that only a limited area on the underside of the assembly can be used as a heat sink or heat dissipation surface.Therefore, the upper contact configuration of the LED assembly 20 is advantageous compared to SMD approaches, as the heat dissipation area on the underside of the assembly “ ” is increased, resulting in higher efficiency and heat transfer capability of the LED assembly 20.

[0019] Fig. Figure 3A is a perspective view of the light module 10 of the present disclosure, including the LED assembly 20. Fig. 2B. Fig. 3B is a top view of light module 10. Fig. 3A. The Fig. The following will be explained together. The light module 10 can comprise a heat sink 12, a printed circuit board assembly 14, and the LED assembly 20. The heat sink 12 can generally have a rectangular shape with flanges extending downwards from the heat sink 12. The heat sink 12 can be made of sheet metal, anodized sheet metal, die-cast aluminum, extruded aluminum, anodized aluminum, a polymer material, a combination of metallic and polymeric materials, or any other material with desirable heat dissipation properties. In an example where the intermediate body 22 and / or the heat sink 12 are made of anodized aluminum, the surfaces of the intermediate body 22 and / or the heat sink 12 that are to be joined should be free of anodizing to ensure proper adhesion of the intermediate body 22 to the heat sink 12.The heat sink 12 is configured to absorb the heat generated by the at least one LED 24 in order to lower the temperature of the at least one LED 24, and then the heat sink 12 is configured to dissipate the absorbed heat to the environment.

[0020] The printed circuit board assembly 14 can be connected to a surface of the heat sink 12 via a soldered or adhesive bond. Furthermore, the printed circuit board assembly 14 can be connected to the same surface as the LED assembly 20, so that the printed circuit board assembly 14 and the LED assembly 20 are located on the same side of the heat sink 12. The printed circuit board assembly 14 can include a connector 16 that is mechanically and electrically connected to the printed circuit board assembly 14. The connector 16 can extend from the printed circuit board assembly 14 in a direction away from the heat sink 12. The connector 16 can be an electrical connector configured to receive electrical energy from an electrical power source, such as a battery or another electrical power source in a motor vehicle.When the connector 16 is connected to an electrical power source, the connector 16 can thus supply electrical energy to the printed circuit board assembly 14 and the entire light module 10 to generate light through the at least one LED 24.

[0021] The printed circuit board assembly 14 further comprises at least one electrical pad 18, which is connected to or integrally formed with the printed circuit board assembly 14. In some embodiments, the at least one electrical pad 18 can be positioned at an end of the printed circuit board assembly 14 opposite the connector 16, as shown. As shown, the at least one electrical pad 18 can also be positioned next to the LED assembly 20 at one end of the heat sink 12 and the entire light module 10. In some examples, the at least one electrical pad 18 can be located at a distal end of the printed circuit board assembly 14 in the longitudinal direction and approximately in the middle of the printed circuit board assembly 14 in the width direction. The at least one electrical pad 18 is electrically coupled to the connector 16, and therefore the at least one electrical pad 18 is configured to receive electrical energy from the connector 16.Furthermore, the at least one electrical pad 18 is configured to be electrically coupled to the at least one electrical contact 26 of the LED assembly 20 in order to supply the LED assembly 20 with electrical energy, which is described in relation to the . Fig. 4A-4B will be explained further.

[0022] The printed circuit board assembly 14 may also contain other components, such as filter capacitors, temperature sensors, and coding resistors, among other components not specifically listed. Coding resistors may be included to define and control the electrical current sent to the at least one LED 24. Temperature sensors may be provided to monitor the temperature of the entire light module 10, and in particular the LED assembly 20, to ensure that the LED assembly 20 remains within the desired operating temperature range and below a predefined temperature limit. If the temperature of the LED assembly 20 exceeds the predefined limit, the coding resistor can reduce or limit the amount of current sent to the LED assembly 20 to lower its temperature and prevent damage to the LED assembly 20.Filter capacitors may be included to filter the electrical signal and provide a cleaner / more consistent signal. These filter capacitors ensure that electromagnetic interference is reduced and that the light module 10 complies with safety regulations.

[0023] As in the Fig. As shown in Figures 3A-3B, the LED assembly 20 is connected to the heat sink 12 on the same side or surface of the heat sink 12 as the printed circuit board assembly 14. Furthermore, the LED assembly 20 is coupled to the connector 16 at one longitudinal end of the heat sink 12, such that the LED assembly 20 and the connector 16 are positioned at opposite (longitudinal) ends of the heat sink 12. The LED assembly 20 is electrically connected to the printed circuit board assembly 14, so that the LED assembly 20 receives electrical power from the printed circuit board assembly 14, as described below with reference to the Fig. 4A-4B will be explained in more detail.

[0024] Fig. 4A is an enlarged view of part of light module 10. Fig. 3A, which includes the LED assembly 20. Fig. 4B is another enlarged view of part of light module 10. Fig. 3A, which includes the LED assembly 20 and a light guide 32. The Fig. Sections 4A-4B are explained together. As already explained, the LED assembly 20 is connected to a surface of the heat sink 12, and the at least one LED 24 is connected to the interposer 22 via a soldered connection. More precisely, the interposer 22 of the LED assembly 20 is connected to the heat sink 12 via an adhesive connection 28, which is not a soldered connection. Therefore, the interposer 22 can be described as being positioned in a stacked configuration between the adhesive connection 28 and the at least one LED 24.

[0025] In other words, the interposer 22 can be described as being bonded to the heat sink 12 via the adhesive bond 28. The adhesive bond 28 between the interposer 22 and the heat sink 12 provides the desired thermal performance and enables a desirable thermal conductivity between the components. Furthermore, the adhesive bond 28 offers better thermal performance than a soldered connection, which is why the adhesive bond 28 is preferable to a soldered connection. The interposer 22 can be described as thermally coupled to the heat sink 12 via a thermally conductive path created by the adhesive bond 28. Thus, the heat generated by the at least one LED 24 can be transferred via the adhesive bond 28 and the interposer 22 to the heat sink 12, where it is dissipated to the environment.

[0026] In some examples, the adhesive compound 28 may be a silicone adhesive, or a silicone adhesive mixed with one or more of the following components: silver particles, carbon black particles, graphite particles, stainless steel particles, ceramic particles, aluminum nitride particles, and boron nitride particles, among other options not explicitly listed. In some examples, the adhesive compound 28 may also contain filler particles configured to increase the thermal conductivity of the adhesive compound 28. In some non-restrictive examples, the filler particles may include at least one of the following: silver particles, carbon black particles, graphite particles, stainless steel particles, ceramic particles, aluminum nitride particles, and boron nitride particles, among other options not explicitly listed.Furthermore, the specific material composition of the adhesive bond can be configured to absorb differences in thermal expansion between the heat sink 12 and the LED assembly 20 in order to prevent weakening or breakage of the adhesive bond 28 between the heat sink 12 and the LED assembly 20 due to thermal expansion during use of the LED assembly 20.

[0027] As experts know, the combination of the soldered connection between the at least one LED 24 and the interposer 22, and the adhesive bond 28 between the interposer 22 and the heat sink 12, ensures improved thermal performance of the light module 10 compared to a purely soldered connection between the individual components. The improved thermal performance of the light module 10 results in improved and higher light output of the LED assembly 20 and the light module 10 compared to previous purely soldered light modules.

[0028] With reference to Fig. Figure 4A shows that the at least one electrical pad 18 of the printed circuit board assembly 14 is electrically coupled to the at least one electrical contact 26 of the LED assembly 20 via at least one connection 30 that extends between the components and connects them. In the illustrated embodiment, the printed circuit board assembly 14 comprises four electrical pads 18, and the LED assembly 20 comprises four electrical contacts 26. Therefore, in the illustrated example, four connections 30 are provided, each electrically connecting one of the four electrical pads 18 to the four electrical contacts 26. The at least one connection 30 is configured to transmit electrical energy from the printed circuit board assembly 14 to the LED assembly 20, which uses the electrical energy to generate light through the at least one LED 24.As shown and explained above, the electrical connection between the at least one electrical pad 18 and the at least one electrical contact 26 is a top-contact electrical connection. A top-contact electrical connection means that the at least one electrical contact 26 of the LED assembly 20 is positioned on the light-emitting side of the at least one LED 24 of the LED assembly 20.

[0029] In some examples, the at least one connection 30 can be ultrasonically bonded to the at least one electrical pad 18 of the printed circuit board assembly 14 and to the at least one electrical contact 26 of the LED assembly 20. In other examples, the at least one connection 30 can be coupled to each of the components by other known means or techniques. In some examples, each of the at least one connection 30 can be an electrical wire or an electrical strip extending between the LED assembly 20 and the printed circuit board assembly 14, electrically connecting them.

[0030] With reference to Fig. 4B (also shown in Fig. 2B) The light module 10 can further comprise a light guide 32 which is arranged above the LED assembly 20 and connected to the heat sink 12. It is understood that the in Fig. The optical fiber 32 shown in 4B represents only a part of the optical fiber 32 and that the optical fiber 32 extends far beyond the area shown in Fig. The light guide 32 can extend beyond the length shown in Figure 4B. It can have a tubular shape and a circular cross-section. In other embodiments, the light guide 32 can have a cross-section of any other shape. The light guide 32 is configured to receive light generated by the at least one LED 24 at one end of the light guide 32, and the light is transmitted through the light guide 32 to create a "luminous" or light-producing tube, pipe, or the like. The light guide 32 can be used for various automotive purposes, such as daytime running lights, turn signals, etc.

[0031] Fig. Figure 5 is another perspective view of the light module 10 of the present disclosure with two LED assemblies 20. Fig. 6A is an enlarged top view of part 10 of the light module. Fig. 5 with the LED assembly 20. Fig. 6B is another enlarged top view of part of light module 10. Fig. Figure 5 shows the installation locations of the two LED assemblies 20. It goes without saying that the ones in the Fig. The embodiments shown in 5-6B are essentially the same as those described in the Fig. The embodiments shown in 3A-4B are similar and therefore the description to the Fig. 3A-4B equally for the Fig. 5-6B applies. Therefore, only the differences between the embodiments will be explained in detail below. Furthermore, the only significant difference between the Fig. 3A-4B and the Fig. 5-6B in that the latter comprise more than one LED assembly 20.

[0032] As shown, the light module 10 can comprise more than one LED assembly 20. In some examples, the light module 10 can comprise a first LED assembly 20A and an LED assembly 20B. The first and second LED assemblies 20A and 20B can each be connected to the heat sink 12 and electrically connected to the printed circuit board assembly 14. Furthermore, in some examples, both the first LED assembly 20A and the second LED assembly 20B can have a side surface that is parallel to a longitudinal surface of the heat sink 12. In other examples, each of the first LED assemblies 20A and the second LED assembly 20B can have a side surface that is neither parallel nor perpendicular to a longitudinal surface of the heat sink 12, as shown in Fig. Figure 6B illustrates this. Therefore, in some examples, the first LED assembly 20A and the second LED assembly 20B can be arranged asymmetrically around the heat sink 12. Up to this point, the first LED assembly 20A and the second LED assembly 20B can be positioned at any angle to each other and to the heat sink 12 to achieve the desired light output.

[0033] A method 200 for assembling the light module 10 can also be provided. The method can comprise one or more of the method steps 202 to 206. Method step 202 can comprise soldering at least one LED 24 to a surface of an interposer 22. Method step 204 can comprise attaching the interposer 22 to a heat sink 12 using an adhesive bond 28, wherein the interposer 22 comprises at least one electrical contact 26. Method step 206 can comprise providing a printed circuit board assembly 14 and coupling it to the heat sink 12, wherein the printed circuit board assembly 14 comprises at least one electrical pad 18 that is coupled to the printed circuit board assembly 14.Process step 208 can include electrically coupling the at least one electrical pad 18 of the printed circuit board assembly 14 to the at least one electrical contact 26 of the interposer 22 via at least one connection 30 by means of an electrical connection via an upper contact. Process 200 can also include electrically connecting the at least one electrical pad 18 of the printed circuit board assembly 14 to the at least one electrical contact 26 of the interposer 22 by ultrasonic welding. Furthermore, it should be noted that process 200 is for illustrative purposes only and that process 200 may include more or fewer of process steps 202 to 206.

[0034] Fig. Figure 8 is a diagram of an exemplary vehicle headlight system 300. The one in Fig. The exemplary vehicle headlight system 300 shown comprises an application platform 302, two LED lighting systems 306 and 308, and secondary optics 310 and 312.

[0035] The LED lighting system 308 can emit light beams 314 (shown between arrows 314a and 314b in Fig. 8) The LED lighting system 306 can emit light beams 316 (shown between arrows 316a and 316b in Fig. 8). In the Fig. In the embodiment shown in Figure 8, a secondary optic 310 is arranged adjacent to the LED lighting system 308, and the light emitted by the LED lighting system 308 passes through the secondary optic 310. Similarly, a secondary optic 312 is arranged next to the LED lighting system 306, and the light emitted by the LED lighting system 306 passes through the secondary optic 312. In alternative embodiments, no secondary optics 310 / 312 are provided in the vehicle headlight system.

[0036] If present, the secondary optics 310 / 312 can be or contain one or more light guides. The one or more light guides can be edge-illuminated or have an inner opening that defines an inner edge of the light guide. The LED illumination systems 308 and 306 can be inserted into the inner openings of the one or more light guides such that they inject light into the inner edge (inner opening of the light guide) or outer edge (edge-illuminated light guide) of the one or more light guides. In embodiments, the one or more light guides can shape the light emitted by the LED illumination systems 308 and 306 in a desired manner, for example, with a gradient, a beveled distribution, a narrow distribution, a wide distribution, or an angular distribution.

[0037] The application platform 302 can supply the LED lighting systems 306 and / or 308 with power and / or data via lines 304, which may include one or more or a portion of power lines and a data bus. One or more sensors (which may be the sensors in the vehicle headlight system 300 or other additional sensors) may be located inside or outside the housing of the application platform 302. Alternatively or additionally, each LED lighting system 308 and 306 may include its own sensor module, a connection and control module, a power module, and / or an LED assembly. Therefore, it can be understood that each LED lighting system 308 and 306 may be the previously described light module 10.

[0038] In embodiments, the vehicle headlight system 300 can represent an automobile with controllable light beams, in which LEDs can be selectively activated to provide controllable light. For example, an assembly of LEDs or emitters can be used to define or project a shape or pattern, or to illuminate only selected sections of a roadway. In one embodiment, infrared cameras or detector pixels within the LED lighting systems 306 and 308 can be sensors that identify parts of a scene (e.g., roadway or pedestrian crossing) that need to be illuminated.

[0039] The light module 10 of the present disclosure is advantageous over previous light modules for a variety of reasons, as will be known to those skilled in the art. More specifically, the light module 10 is dual-functional (can be used for a variety of automotive applications), can support different colored LEDs 24, can support different LED densities 24, and exhibits high thermal conductivity and improved heat dissipation compared to previous light modules. Furthermore, the light module 10 of the present disclosure prevents solder breaks, ensures stronger and more reliable connections between the components, and the interposer 22 is quick and inexpensive to develop and manufacture.The flexible design options (different numbers of LEDs, different LED colors, different spacing between LEDs, different LED orientations, dense assembly of various LEDs) of the Light Module 10, combined with its compact / small housing design, high reliability, extended lifespan, and excellent thermal performance, offer a cost-effective automotive Light Module 10 for various lighting applications in motor vehicles. Some non-limiting lighting applications could include, but are not limited to, reflector headlights, projector headlights, low beam, high beam, fog lights, daytime running lights (DRL), and turn signals, among other lighting applications not explicitly listed.

[0040] Now that the present embodiments have been described in detail, it will be clear to the person skilled in the art that many physical modifications, only a few of which are listed by way of example in the detailed description of the disclosure, could be made without altering the inventive concepts and principles embodied therein. It should also be noted that numerous embodiments are possible which contain only a part of the preferred embodiment and which, with respect to these parts, do not alter the inventive concepts and principles embodied therein.The present embodiment and the optional configurations are therefore to be regarded in every respect as exemplary and / or illustrative and not as limiting, the scope of disclosure being specified rather by the attached claims than by the foregoing description, and all alternative embodiments and modifications to this embodiment which fall within the meaning and scope of equivalence of the aforementioned claims are therefore included therein. List of reference numbers 10 light modules 12 heat sinks 14 Printed circuit board assembly 16 connectors 18 Electric Pad 20 LED assembly 22 Interposer 24 LED 26 Electrical contact 28 Adhesive bond 30 Bond 32 fiber optic cables QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] US 63 / 522.634

[0001]

Claims

[1] A light module for use in a headlight, the light module comprising: a heat sink; a printed circuit board assembly connected to the heat sink, wherein the printed circuit board assembly comprises a connector electrically connected to the printed circuit board assembly; and a light-emitting diode assembly (LED assembly) that is connected to the heat sink and electrically connected to the printed circuit board assembly, the LED assembly comprising: an interposer, at least one LED connected to the interposer and at least one electrical contact connected to the interposer, wherein the interposer is connected to the heat sink via an adhesive. [2] The light module according to claim 1, wherein the at least one LED and the at least one electrical contact are electrically connected to the interposer via an electrically conductive path. [3] The light module according to claim 1, wherein each of the at least one LED is soldered to the interposer. [4] The light module according to claim 1, wherein the interposer is positioned in a stacked configuration between the adhesive and the at least one LED. [5] The light module according to claim 1, wherein the interposer is thermally coupled to the heat sink via a heat-conducting path. [6] The light module according to claim 1, wherein the interposer has approximately the same thermal expansion properties as the at least one LED. [7] The light module according to claim 1, wherein the adhesive contains filler particles to increase the thermal conductivity of the adhesive. [8] The light module according to claim 7, wherein the filler particles comprise at least one of the following elements: silver particles, carbon black particles, graphite particles, stainless steel particles, ceramic particles, aluminium nitride particles and boron nitride particles. [9] The light module according to claim 1, wherein the adhesive is at least one of a silicone adhesive or a silicone adhesive mixed with one or more of silver particles, carbon black particles, graphite particles, stainless steel particles, ceramic particles, aluminium nitride particles and boron nitride particles. [10] The light module according to claim 1, wherein the heat sink is made of an anodized sheet, an aluminium die-casting, an extruded aluminium, a polymer material or a combination of metallic and polymeric material. [11] The light module according to claim 1, wherein the printed circuit board assembly comprises at least one electrical pad connected to the printed circuit board assembly, and the at least one electrical pad is electrically connected to the at least one electrical contact of the LED assembly via at least one connection, wherein the electrical connection of the at least one electrical pad and the at least one electrical contact is an electrical connection via an upper contact. [12] The light module according to claim 11, wherein the at least one connection is ultrasonically bonded to the at least one electrical pad of the printed circuit board assembly and the at least one electrical contact of the LED assembly. [13] The light module according to claim 11, wherein each of the at least one connection is an electrical wire or an electrical strip extending between the LED assembly and the printed circuit board assembly and electrically connecting them. [14] A light module comprising: a heat sink; a printed circuit board assembly connected to the heat sink; and a first light-emitting diode (LED) assembly and a second light-emitting diode (LED) assembly, wherein each of the first and second LED assemblies is connected to the heat sink and electrically connected to the printed circuit board assembly, each comprising: an interposer, at least one LED connected to the interposer and at least one electrical contact connected to the interposer, wherein the interposer is connected to the heat sink via an adhesive. [15] The light module according to claim 14, wherein both the first LED assembly and the second LED assembly have a side surface that runs parallel to a longitudinal surface of the heat sink. [16] The light module according to claim 14, wherein both the first LED assembly and the second LED assembly have a side surface that is neither parallel nor perpendicular to a longitudinal surface of the heat sink. [17] The light module according to claim 14, wherein the first LED assembly and the second LED assembly are arranged asymmetrically around the heat sink. [18] The light module according to claim 14, wherein the light module is configured so that it can be used and positioned in a vehicle headlight.

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