METHOD FOR PRODUCE A WIRE-CONNECTED BUILDING ELEMENT ASSOCIATION AND WIRE-CONNECTED BUILDING ELEMENT ASSOCIATION

Description

[0001] The invention relates to a method for manufacturing a component assembly comprising the production of a wire connection between a first contact surface and at least one further contact surface according to claim 1. The invention further relates to a component assembly manufactured by the method. Devices for producing wire connections have long been known, particularly under the name "wire bonders." These devices are typically designed such that, as is known, for example, from US 8,657,181 B2, both the positioning of a contact end of a wire guided in a wire guide capillary relative to the contact surfaces to be joined and the production of the connection between the wire and the contact surfaces are carried out by the wire guide tool.

[0002] To create the connection, a stamp-like part of the wire guiding tool, regularly also referred to as a "wedge", is subjected to ultrasound, so that the wire arranged between the "wedge" and the contact surface is connected to the contact surface in a friction welding process by the ultrasonic exposure.

[0003] In addition to the ultrasonic stimulation of the wedge, which causes it to oscillate parallel to the contact surface, this welding process requires sufficient pressure on the wire to press it against the contact surface with a corresponding force. This type of stress results in a corresponding mechanical load on the contact surface and the component to which it is attached.

[0004] Further wire connection devices of the same type, as well as methods for producing a wire connection, are known from DE 30 51 232 C2, US 4,484,054 A, EP 2 837 458 A1 and FR 2 605 176 A1. WO 2017 / 023060 A1 discloses a component arrangement in which a component connection is formed between the facing rear sides of two superimposed components, and wire sections are provided for connecting contact surfaces of the components.

[0005] It is evident from the above that creating a wire connection using ultrasonic bonding requires a corresponding level of mechanical strength and accessibility of the contact point. Therefore, ultrasonic bonding is generally used where the goal is to create a wire with an easily accessible contact surface on a mechanically robust circuit board, also known in technical terminology as a printed circuit board.

[0006] The present invention is based on the objective of enabling the production of wire connections between contacts even in cases where the contact point is poorly accessible or where an electrical contact between a wire and a contact or contact body is to be established that is not to be subjected to mechanical stress. Furthermore, the invention is based on the objective of enabling component arrangements using wire connections produced in this way. To achieve this objective, the method according to the invention has the features of claim 1.

[0007] According to the invention, in contrast to the known wire guide tool designed as a wire bonder, which serves both to position the wire to be contacted with a contact surface and to produce the mechanical contact between the wire and the contact surface by ultrasonic action on the wire, a wire guide tool is used which serves only to position the wire relative to the contact, but not to produce the contact connection between the wire and the contact.Rather, the electrically conductive and mechanically holding connection is produced by wetting a contact area formed between the first contact surface and the contact end with a first amount of solder material formed from a solder material molded piece, at least partially melted, to form a first solder material connection, such that a mechanical, electrically conductive connection is formed between the first contact surface and the contact end.

[0008] The wire guiding tool is then moved to the next contact surface in such a way that a contact area is formed between a wire section end of a wire section formed by moving the wire guiding tool between the first contact surface and the second contact surface and the second contact surface.

[0009] The contact area is then wetted with a second quantity of solder, formed from a shaped piece of solder material, which is at least partially melted, to form a further solder connection, such that a mechanical, electrically conductive connection is formed between the wire end and the further contact surface. The electrically conductive connection is designed such that a component connection is formed between the facing rear surfaces (93, 94) of two superimposed components (91, 92), and wire segments (99) formed to connect contact surfaces (97, 98) of the components extend in an arc over adjacent side edges of the components.

[0010] The wire section can then be separated from the wire guided by the wire guiding tool. This separation can be achieved mechanically or thermally, for example, by applying a laser to the intended cutting point.

[0011] The differentiation according to the invention between positioning the wire relative to the contact surfaces with the formation of a contact area by means of a wire guiding tool and establishing the electrically conductive and mechanical contact between the wire and the contact surfaces by wetting the contact area with solder material, independent of the wire guiding tool, results in the contact surface to be connected with the wire not being subjected to mechanical stress. Due to the creation of the wire connection between the contact surface and the wire by means of wetting, multi-core wires or pressure-sensitive wires or conductors, such as, in particular, electrically conductive coated optical fibers, can also be connected to the contact surface.

[0012] Apart from the fact that this avoids applying force to the contact, thus enabling even particularly pressure-sensitive contacts to be electrically connected with a wire, a substantially flat surface of the contact, as is essential for ultrasonic bonding, is also unnecessary. This allows, for example, contact between a wire and a curved or even spherical contact surface. In particular, series or serial connections can also be made, in which a large number of contact surfaces are connected to a continuous wire conductor.

[0013] It is particularly advantageous if the wetting of the first and second contact areas is achieved by positioning a solder material mold at a distance from the contact area in a starting position, at least partially melting the solder material mold in the starting position, and then flinging the at least partially melted solder material mold from the starting position against the contact area. This allows even those contact areas formed between a contact surface and the wire to be wetted with the solder material, areas which would be inaccessible with a mechanical transfer device for applying the solder material to the contact area. Instead, it is possible to carry out the wetting from a starting position inaccessible to the contact area.

[0014] It is particularly advantageous if, for defining the starting position, the solder material mold piece is arranged in a mouthpiece of a capillary above an output opening of the mouthpiece, wherein the diameter of the output opening is smaller than the diameter of the solder material mold piece, the melting of the solder material mold piece is carried out by applying laser energy to the solder material mold piece, and the output of the melted solder material mold piece is carried out by applying gas pressure to the solder material mold piece.

[0015] A laser device used for applying pressure to the molded part can preferably also be used as a cutting device or to remove insulation from the wire before wetting the wire arranged on the contact surface, so that insulated wires can also be used to carry out the process.

[0016] The method according to the invention can be carried out with a device comprising a wire guiding tool for positioning a contact end of a wire relative to a first contact surface and forming a wire section between the first contact surface and at least one further contact surface, as well as positioning a wire section end relative to the further contact surface, and a solder material application device for applying an at least partially melted solder material mold piece in a contact area formed between the contact end and the first contact surface and a contact area formed between the wire section end and the further contact surface.

[0017] The device may include a separating device for separating the wire section.

[0018] The solder material application device can be designed independently of the wire guiding tool, so that the positioning of the application device can be carried out independently of the wire guiding tool, i.e., for example, in successive contact positions of the wire guiding tool, the application of the solder material components can take place from different starting positions, which enable the best wettability of the contact area in each case.

[0019] If the wire guiding tool has a wire guide capillary for dispensing a wire conveyed by means of a feed device from a dispensing opening formed on a mouthpiece of the wire guide capillary, an exact positioning of a contact end protruding from the dispensing opening relative to the contact surface to be contacted is ensured.

[0020] The separating device can be formed at least partially by the mouthpiece of the wire guide capillary, so that the mouthpiece performs several functions at once.

[0021] The separating device can have a separating element that is movable relative to the mouthpiece of the wire guide capillary, so that if the separating element is designed as a first cutting edge of the separating device, the mouthpiece of the wire guide capillary can form a counter-cutting edge.

[0022] The wire guide capillary can be rigidly connected to a wire holder via a base body of the wire guide tool. The wire holder is spaced from the nozzle of the wire guide capillary by a gap provided with a separating element. This allows for a particularly compact design of the multifunctional wire guide tool.

[0023] The component arrangement according to the invention comprises a plurality of electronic components, in particular designed as chips, wherein the components are arranged in a stack arrangement and contact surfaces arranged on connection sides of the components are connected to each other by a wire connection produced according to one of claims 1 to 4, such that a wire section is formed between a first solder material connection, which connects a first contact surface of the first component to a contact end of a wire, and a second solder material connection, which connects a second contact surface of a further component to the wire.

[0024] In an advantageous embodiment not included in the invention, the components can form a pyramid-shaped stacking arrangement, such that a component connection is formed between a connection side and a rear side of two superimposed components, and wire sections designed to connect contact surfaces of the components extend cascade-like over adjacent side edges of the components.

[0025] According to the invention, a component connection is formed between the mutually facing rear sides of two superimposed components of the component arrangement, and wire sections designed to connect contact surfaces of the components extend in an arc over adjacent side edges of the components.

[0026] A preferred variant of the method according to the invention, a preferred embodiment of the device used, and advantageous component arrangements are explained in more detail below.

[0027] They show: Fig. 1 the production of a wire connection between a wire and a contact pin of a contact plug provided with a plurality of contact pins by means of a first embodiment of a wire connection device; Fig. 2 the creation of a connection between a wire and a contact surface of a contact board held in the connector; Figs. 3 to 5 the production of a wire connection by means of a second embodiment of a wire connection device; Fig. 6 a component arrangement in a first embodiment that does not fall under the attached claims; Fig. 7 a component arrangement according to the invention.

[0028] Fig. 1Figure 1 shows a schematic representation of a shell-shaped housing part 10 of a contact plug 11, wherein in the housing part 10 on a front side 12, i.e. the side which is facing a contact socket not shown in detail here, which is intended for combination with the contact plug 11, a plurality of contact pins 13 are provided, of which only one contact pin 13 is shown here for the sake of simplicity.

[0029] The contact pin 13 has a contact surface 15 on its rear terminal part 14, which is located inside the housing part 10. This contact surface 15 is formed by a flattened area. Above or to the right of the contact surface 15 is a wire connection device 16, which comprises a wire guide tool 17 and a solder application device 18.

[0030] The wire guiding tool 17 has a wire guiding capillary 19 and a retainer 21 connected to the wire guiding capillary 19 via a base body 20. A separating element 23, designed here as a knife edge with a cutting edge 24, is received in a space 22 formed between the retainer 21 and the wire guiding capillary 19.

[0031] The wire guide capillary 19 has a mouthpiece 25 which is provided with a counter-cutting edge 27 adjacent to a dispensing opening 26, which together with the separating element 23 provided with the cutting edge 24 forms a separating device 28.

[0032] To execute a multi-axis movement of the wire guide tool 17, the base body 20 is provided with a coupling device 29, which enables the connection of the wire guide tool 17 to a hand axis of a robot device (not shown in detail).

[0033] The solder material application device 18 has an application capillary 30 with a nozzle 31, which is provided with a dispensing opening 32. To apply solder material to a solder material component 33 held in the nozzle 31 above the dispensing opening 32, the solder material application device 18 is equipped with a laser device (not shown in detail here) that emits laser radiation along a channel axis 34 of the application capillary 30. The solder material application device 18, as well as the wire guide tool 17, can be connected to a hand axis of a robot device for performing multi-axis movement.

[0034] Both the wire guiding tool 17 and the solder material application device 18 are each provided with a feeding device, which in the case of the wire guiding tool 17 has a feed device, which is not shown in detail here, with which a wire 35 guided longitudinally in the wire guiding capillary 19 is moved forward in the direction of a channel axis 36 and is unwound from a wire supply roll, which is also not shown in detail.

[0035] In the case of the solder material application device 18, the feeding device is provided with a reservoir for receiving solder material components 33, which are individually removed from the solder material reservoir by means of the feeding device and placed in the Fig. 1 The starting position P shown is used for the application of the solder material fitting 33.

[0036] The in Fig. 1The configuration shown depicts the wire connection device 16 immediately after the formation of a solder material connection 38 between a contact end 37 of the wire 35 and the contact surface 15 of the contact pin 13.

[0037] To produce the in Fig. 1 In the solder material connection 38 shown, the contact end 37, which emerges from the wire guide capillary 19, is positioned on the contact surface 15 to form a contact area 39. The wire 35 is guided through a receiving groove 40 of the retainer 21, which in this case is open downwards. When the contact end 37 is in the Fig. 1When the solder material component 33, which is held in the mouthpiece 31 of the application capillary 30, is located in the contact position shown, at least partial melting occurs. This melting is then caused by pressurizing the solder material component 33 with gas, which ejects the component 33, whose diameter d before partial melting is larger than the diameter D of the dispensing opening 32, through the dispensing opening 32 and flings it against the contact area 39. As a result of the impact of the at least partially melted solder material component 33 on the contact area 39, the following occurs: Fig. 1 depicted wetting of the same.

[0038] After production of the in Fig. 1 In the solder material connection 38 shown, the wire guide tool 17 or the base body 20 of the wire guide tool 17 moves into the area shown. Fig. 2The second contact position shown, wherein, due to the mechanical fixing of the contact end 37 of the wire 35 to the contact pin 13, a wire section 41 is formed between the contact pin 13 and the mouthpiece 25 of the wire guide capillary 19 of the wire guide tool 17, such that a further contact area 44 is formed between a contact surface 42 of a circuit board 43 received in the housing part 10 and a wire section end 45, in which the wire 35 rests on the contact surface 42 with the wire section end 45.

[0039] In order to support the contact area 45 resting or bearing on the contact surface 42 with the formation of the contact area 44, in the present case the base body 20 is pivoted about a pitching axis 46, such that the hold-down device 21 now causes a slight angling in the course of the wire section 35.

[0040] In the Fig. 2In the contact position of the wire guide tool 17 shown, the solder material application device 18 then comes into action again in the manner already explained above, such that a further solder material mold 33 is flung against the contact area 44 to form a wetting of the contact area 44 in order to form a solder material connection 48.

[0041] Subsequently, the wire section 41 is separated by an axial cutting movement 49 of the knife edge 23, whereby the wire 35 is cut.

[0042] In the Figures 3 to 5 In a further embodiment, a wire connection device 50 is shown, which differs from the one described in the Figures 1 and 2The wire joining device 16 shown comprises an arrangement of a wire guiding tool 51 and a separating device 52, such that a solder material application device 18, which in the present case is identical to the solder material application device 18 and is therefore provided with identical reference numerals, is arranged in an intermediate space 62 formed between the wire guiding tool 51 and the separating device 52.

[0043] In particular the wire guiding tool 51, the solder material application device 18 and the separating device 52 of the in the Figs. 3 to 5 The wire connection device shown can, if required, be designed to be multi-axial and, in particular, independently movable in space in order to connect contact surfaces oriented differently in space.

[0044] The wire guiding tool 51 has a vertically oriented wire guiding capillary 54, which is provided at its free end with an angled nozzle 55 with a dispensing opening 56. As shown in the figure below. Fig. 3 As can be seen, the wire guide capillary 54, in its essentially vertical arrangement, enables the alignment of a contact end 37 of the wire 35 with the contact surface 15, such that the contact end 37 is arranged in overlap with the contact surface 15 and simultaneously intersects an application axis defined by the channel axis 34 of the solder material application device 18. In this configuration, as already mentioned above with reference to the Fig. 1 explained, an application of at least partially melted solder material mold piece 33 to the contact surface 15 takes place.

[0045] After the first solder material connection 38 is made between the contact end 37 and the contact surface 15, the wire section 41 is formed, as already described in the Figures 1 and 2 described, a movement of the wire guide tool 51 into the in Fig. 4 The second contact position shown is such that a further contact area 44 is formed between the further contact surface 42 and the wire section end 45, in which the wire with the wire section end 45 rests on the contact surface 42.

[0046] In the Fig. 4In the contact position of the wire guiding tool 51 shown, a further, at least partially melted, solder material form 33 is applied to the contact area 44 to form a further solder material connection 48, so that the contact area 44 and the wire 35 are wetted. If the further solder material connection 48 is the last of several solder material connections formed between the wire 35, which is continuously guided from the nozzle 55 of the wire guiding tool 51, and the contact surfaces, the wire section is subsequently cut off by a cutting movement 53 of the cutting device 52, such that a cutting edge 61 formed on a cutting element 60 of the cutting device 59 cuts the wire 35, as shown. Fig. 5 depicted, cut through.

[0047] Fig. 6Figure 1 shows a component arrangement 70 with three components 71, 72, 73 arranged one above the other in a pyramidal stacking arrangement, here designed as chips. To fix the components 71, 72, 73 to one another, a component connection 85, here formed by an underfiller, is provided between a connection side 83 provided with contact surfaces 75, 76, 77 and a back side 84 of adjacent components.

[0048] The component arrangement 70 preferably uses a component located in the Figures 3 to 5 The wire connection device 50 shown produces wire connections, wherein the contact surfaces 75, 76, 77 provided on each side edge of the connection side 83 are connected to each other via wire sections 78 in such a way that a solder material connection 80, 81 and 82 is formed between a wire 79 forming the wire section 78 and the contact surfaces 75, 76, 77.

[0049] Fig. 7Figure 1 shows a component arrangement 90, preferably manufactured with the wire connection device 50, which has two components 91, 92, also designed as chips, which are connected to each other via their back sides 93, 94, such that connection sides 95, 96 of the components 91, 92, which in the present case are each provided with two contact surfaces 97, 98, each form an outside of the component arrangement 90.To connect each pair of mutually associated contact surfaces 97, 98 arranged on the opposite connection sides 95, 96, these are connected to each other via wire sections 99 such that a wire 101 forming the wire sections 99 forms a wire connection between the components 91, 92 via a first solder material connection 102 formed on the lower connection side 95 with the contact surface 97 and via a second solder material connection 103 formed with the contact surface 96 arranged on the upper contact side 94.

Claims

1. A method for producing a component arrangement, comprising establishing a wire connection between a first contact surface (15, 75, 97) of a first component (91) and at least one other contact surface (42, 76, 77, 98) of another component (92), in which a contact end (37) of a wire (35, 79, 101) is positioned in a contact position relative to the first contact surface (15, 75, 97) by means of a wire guiding tool (17, 51) and a contact area (39), which is formed between the first contact surface (15, 75, 97) and the contact end (37), is subsequently wetted using an at least partially fused first solder material amount formed from a solder material molded piece (33) in order to establish a first solder material connection (38, 80, 102) in such manner that a mechanical, electrically conductive connection is established between the first contact surface (15, 75, 97) and the contact end (37), the wire guiding tool (17, 51) is subsequently moved to the other contact surface (42) in such a manner that a contact area (44) is formed between a wire section end (45) of a wire section (41), which is formed between the first contact surface (15, 75, 97) and the other contact surface (42, 76, 77, 98) by means of the movement of the wire guiding tool (17, 51), and the other contact surface (42, 76, 77, 98), and the second contact area (44) is subsequently wetted using an at least partially fused second solder material amount formed from a solder material molded piece (33) in order to establish at least one other solder material connection (48, 81, 82, 103) in such a manner that a mechanical electrically conductive connection is established between the wire section end (45) and the other contact surface (42, 76, 77, 98), characterized in that a component connection is established between opposing rear sides (93, 94) of the two components (91, 92) arranged on top of each other and wire sections (99) formed for connecting contact surfaces (97, 98) of the components extend over adjacent lateral edges of the components in arches.

2. The method according to claim 1, characterized in that after establishing the other solder material connection (48, 81, 82, 103), the wire section (41, 78, 99) is separated from the wire (35, 79, 101) which is guided by means of the wire guiding tool (17, 51).

3. The method according to claim 1 or 2, characterized in that the first contact area and the second contact area (39, 44) are wetted by a solder material molded piece (33) being arranged in an initial position at a distance from the contact area, said solder material molded piece (33) being at least partially fused in the initial position and said at least partially fused solder material molded piece (33) being thrown against the contact area (39, 44) from the initial position.

4. The method according to claim 3, characterized in that for defining the initial position, the solder material molded piece (33) is arranged in a mouthpiece (31) of an application capillary (30) above a dispenser opening (32) of the mouthpiece (31), the diameter D of the dispenser opening (32) being smaller than the diameter d of the solder material molded piece (33), said solder material molded piece (33) being fused by laser energy being applied to the solder material molded piece (33) and the fused solder material molded piece (33) being dispensed by means of gas pressure being applied to the solder material molded piece (33).

5. A component arrangement (70, 90), produced according to any one of the claims 1 to 4, having a plurality of electronic components (71, 72, 73, 91, 92) realized in particular as chips, said electronic components being arranged in a stack arrangement, and contact surfaces (75, 76, 77, 97, 98) arranged on connection sides (83, 95, 96) of the components being connected to each other using a wire connection in such a manner that a wire section (78, 99) is formed between a first solder material connection (80, 102), which connects a first contact surface (75, 97) of the first component (71, 91) to a contact end of a wire (79, 101), and a second solder material connection (81), which connects a second contact surface (76, 98) of another component (72, 73, 92) to the wire, wherein a component connection is established between opposing rear sides (93, 94) of the two components (91, 92) arranged on top of each other, and wire sections (99) formed for connecting contact surfaces (97, 98) of the components extend over adjacent lateral edges of the components in arches.