Condensate drain device, electronic assembly and method for manufacturing a condensate drain device

Description

[0001] The invention relates to a condensate drain device for draining condensate from a component, an electronic assembly with a component and such a condensate drain device, and a method for manufacturing such a condensate drain device.

[0002] In the prior art, a large number of components are known that incorporate a cooling device. Particularly with actively cooled components, such as those cooled by water cooling, excessive cooling can lead to condensation, resulting in the formation of condensate on the component.

[0003] Such condensation can occur particularly when the actively cooled component, which is primarily an electronic component such as power electronics, is not itself in operation, so that no excess heat needs to be or can be dissipated from it.

[0004] Condensation forming on the component can cause corrosion and short circuits, thus damaging the component.

[0005] To avoid such damage, various countermeasures are already known.

[0006] For example, it is planned to at least partially encapsulate the component with a potting compound, so that condensation occurs on the potting compound rather than on the component itself. However, the condensate is usually not drained away by the potting compound, which can lead to defects and damage in areas adjacent to the component or in unencapsulated areas of the component.

[0007] Condensate drainage devices are also known, for example, from document EP 3 910 253 A1.

[0008] The invention is therefore based on the objective of overcoming the aforementioned disadvantages and providing a condensate drainage device, an electronic assembly and a manufacturing method, wherein a condensate is to be completely separated from the component by fluid technology and preferably be able to be discharged independently of a spatial orientation of the component and / or the condensate drainage device.

[0009] This problem is solved by the combination of features according to claim 1.

[0010] According to the invention, a condensate drain device for removing condensate from at least one cooled component is proposed. The at least one component is, in particular, cooled electronics or electronic components, such as power electronics, which may be cooled by water cooling. For the sake of simplicity, the term (single) component will be used hereinafter, whereby this is to be understood as at least one component. Such a component has a surface on which condensate can form, at least without the condensate drain device according to the invention. According to the invention, the condensate drain device comprises a heat-conducting element with a condensation surface.The heat-conducting element is preferably made of an electrically non-conductive material and lies close and directly against the surface of the component, so that no cavity is formed between the component, and especially its surface, and the heat-conducting element in which condensation could occur. The heat-conducting element is designed to cover at least sections or partially, and especially completely, the surface of the component and to transfer any cold that would cause condensation on the surface of the component to the condensation area, so that condensation occurs not on the surface of the component, but on the condensation area. For targeted control of condensation, the condensation area can be smaller than the surface of the component.Furthermore, the condensate drainage device according to the invention comprises a housing, which is preferably made of a material with poor thermal conductivity compared to the heat-conducting element. The housing is provided with at least one condensate drain, preferably several condensate drains, and / or a condensate chamber for collecting or receiving condensate forming on the condensation surface. The at least one condensate drain defines at least one predetermined flow path, fluidically separated from the component, for draining the condensate from the housing.

[0011] This prevents condensation from occurring on the component itself, instead directing it to the designated condensation surface, from which it is then systematically drained away. Consequently, corrosion, short circuits, or other malfunctions caused by condensation no longer occur on the component.

[0012] The fundamental idea of ​​the invention is to allow condensation in a defined area, the condensation surface, while simultaneously minimizing the dew point through heat exchange with the environment and encapsulating it from the component, for example, an electronic device. To protect the area where condensation is permitted, the component is sealed against it using a potting compound and protected from damage / short circuits.

[0013] According to a further training document, which will be explained in more detail below, the condensation area defined by the condensation surface and the multiple condensate drains also make it possible to mount the electronics or component to be protected in various installation positions. In these installation positions, the condensate is always drained away from the electronics or component.

[0014] According to an advantageous embodiment, the housing may have a lower part and / or an upper part which are designed to enclose the component, particularly in the area of ​​the surface, from two opposite sides.

[0015] The component can, for example, consist of a printed circuit board (PCB) and a power module mounted on it, which is contacted on the PCB and has a cooling surface on the side facing away from the PCB. Excessive cooling, or cooling of the power module when it is deactivated, can lead to condensation on the side of the PCB facing away from the power module. In this case, the surface of the component where condensation can occur is the same as the surface of the PCB facing away from the power module in the area of ​​the power module.

[0016] The two-part housing of the condensate drainage device can accordingly provide that the lower part of the housing adjoins the cooling and encloses the power module on a side of the circuit board facing the cooling, with the upper part of the housing being provided on the side of the circuit board facing away from the cooling and thus enclosing the surface on which condensation can occur.

[0017] Furthermore, it is preferably provided that the condensation surface is exposed in the condensate chamber, i.e., in particular free from the housing or any material of the housing, and forms part of a surface bounding the condensate chamber. Accordingly, the condensate chamber is bounded section by section by the housing and section by section by the condensation surface.

[0018] For condensate drainage, it is preferably provided that at least one condensate drain, or each of the condensate drains, is designed to convey condensate that forms on the condensation surface and collects in the condensate chamber along the flow path, fluidically separated from the component, and out of the housing. For this purpose, each condensate drain may also have guide channels and / or fluid channels through which the condensate can be directed out of the housing.

[0019] In principle, a component from which the condensate drainage device according to the invention is intended to drain the condensate can be arranged in various installation positions or orientations in space. Particularly in transient systems, the orientation in space can also change during operation. For example, the component can be arranged in a first spatial orientation or in a different second spatial orientation, or its spatial orientation can change from the first to the second.To ensure condensate drainage in the first and second orientations, and preferably in all possible orientations, an advantageous embodiment provides that the housing has a first condensate drain, which defines at least one predetermined flow path for draining the condensate from the housing and is fluidically separate from the component, and a second condensate drain, which defines at least one second predetermined flow path for draining the condensate from the housing and is fluidically separate from the component. The condensate drain device can be fixed to the component and preferably does not change its relative position with respect to the component, so that it can be arranged with the component in the first spatial orientation or in the different second spatial orientation, or change its spatial orientation with the component.To drain the condensate, it is provided that the condensate can be directed out of the housing via the first condensate drain and / or the second condensate drain in the first spatial orientation, and via the second condensate drain and / or the first condensate drain in the second spatial orientation.

[0020] It may be stipulated that, in the first orientation, the condensate can drain exclusively via the first condensate drain, and in the second orientation, exclusively via the second condensate drain. This might be the case, for example, if the component is rotated from a first orientation by 90° or 180° around a spatial axis orthogonal to a vertical axis of the room into a second orientation.

[0021] Preferably, at least one associated condensate drain is provided for a multitude of orientations and, more preferably, for every possible spatial orientation of the component, through which the condensate can be conveyed out of the housing, particularly by gravity.

[0022] The housing and its condensate chamber can also be funnel-shaped and open on one side opposite the condensation surface. This means that the funnel-shaped outer wall of the housing forms a multitude of condensate drains.

[0023] Preferably, the condensate chamber widens due to its funnel shape with increasing distance from the condensation surface.

[0024] To prevent condensate from collecting at the bottom of the condensate chamber or on the condensation surface, one or more condensate drains can be provided adjacent to the condensation surface. Preferably, the condensate chamber has a rectangular base, with a condensate drain provided in at least one corner, and preferably in each corner. A guide channel can be provided extending from the condensation surface to each of the condensate drains, allowing the condensate to flow from the condensation surface through the guide channel into the respective drain. Such guide channels can, for example, be formed by one or more inclined planes.

[0025] The component, or for example a circuit board, can have an opening as part of the component through which at least one condensate drain or one of the condensate drains can run.

[0026] According to the invention, the heat-conducting element is formed from a casting compound which is still flowable or liquid during processing and can then harden into the heat-conducting element.

[0027] The housing also features a mold chamber for receiving the heat-conducting element, the mold chamber being completely filled by the heat-conducting element. The wall of the mold chamber can be formed section by section by the housing and section by section by the component and / or the cooling device. Furthermore, the mold chamber is designed to enclose the component at least section by section and the component's surface completely. The mold chamber forms a mold for the potting compound. Accordingly, the mold chamber is preferably open only towards the condensate chamber, so that the potting compound can be introduced into the mold chamber through the condensate chamber, and the potting compound, once cured to form the heat-conducting element, closes the opening of the mold chamber to the condensate chamber and forms the condensation surface.

[0028] In order to form a fluid-tight mold chamber together with the component, serving as a casting mold for the potting compound, a further embodiment may provide that the housing has at least one sealing section, which is designed, in particular, as a sealing lip, for example, for contact with the component. The sealing section is designed to seal the mold chamber, which serves as a casting mold, against the environment, particularly in conjunction with the component, and preferably in a fluid-tight manner. If the housing has a lower and an upper part, or if the housing is multi-part, a sealing section, in particular designed as a sealing lip, may also be provided on each part or at least on several parts of the housing.

[0029] Another aspect concerns an electronic assembly comprising a cooling device, at least one electrical component, and a condensate drainage device according to the invention. The electronic assembly can also be referred to as an electronic unit. The cooling device for cooling the at least one component is arranged on this component(s), and the at least one component has a surface on which condensation can form due to cooling by means of the cooling device, at least without the condensate drainage device. This condensation is prevented by the condensate drainage device according to the invention.

[0030] Preferably, the electronic assembly is provided with an assembly housing, which in particular surrounds the at least one component with the condensate drain. The housing of the condensate drain is, in particular, arranged entirely within the assembly housing. The at least one condensate drain is designed to discharge the condensate from the assembly housing. Accordingly, the condensate chamber can be connected to the surrounding environment via each of the condensate drains, either fluidically or via a flow path, so that the condensate can preferably be discharged into the environment by gravity.

[0031] Furthermore, an important aspect of the invention relates to a method for manufacturing an electronic assembly according to the invention. The housing is arranged in a manner forming the mold chamber, adjacent to the at least one component, and is preferably sealed against the at least one component and further preferably sealed liquid-tight, so that the mold chamber is open only to the condensate chamber and liquid (condensate) can only flow out or be discharged via the condensate chamber. A gas-tight seal, for example, is not necessary. Subsequently, a potting compound, which distributes itself within the mold chamber by gravity and completely fills it, is poured into the mold chamber through an opening to the condensate chamber. After the potting compound has hardened, it forms the thermal conductivity element.

[0032] The features disclosed above can be combined in any way, provided that this is technically possible and they do not contradict each other.

[0033] Other advantageous embodiments of the invention are characterized in the dependent claims or are described in more detail below together with the description of the preferred embodiment of the invention with reference to the figures. The figures show: Fig. 1 a perspective view of a condensate drain mounted on a component; Fig. 2 a top view of the condensate drain; Fig. 3 a first section through the condensate drain; Fig. 4 a second section through the condensate drain.

[0034] The Figures 1 to 4The figures are schematic examples and show a condensate drain 1 and an electronic assembly with a cooling device 4, a component 2 cooled by the cooling device 4, and a condensate drain 1. Identical reference numerals in the figures indicate identical functional and / or structural features. Although not every reference numeral is used in every figure, corresponding features are present. The following description applies to all figures accordingly.

[0035] Component 2 shows, as particularly in the Figures 3 and 4 As can be seen, for example, a power electronics 5 is shown, which is electrically contacted on a circuit board 6.

[0036] During operation, the power electronics 5 can become very hot, so it must be cooled by the cooling device 4. For this purpose, the cooling device 4 has a heat sink 7, which dissipates the heat from the power electronics 5 and transfers it to a cooling tube 8 or to a coolant flowing through the cooling tube 8.

[0037] In most cases, the coolant cools a large number of components, so that the coolant also flows past the heat sink 7 or component 2 in a cooling effect when the power electronics 5 is deactivated, i.e., switched off, and therefore does not emit any heat.

[0038] This results in low temperatures on component 2, which can lead to condensation on component 2 and in particular to condensation on a surface 3 of component 2.

[0039] The condensate drainage device 1 is provided for the targeted removal of condensate that would otherwise form on component 2.

[0040] This has a housing 20, which consists of a top part 26 and a bottom part 25.

[0041] The lower part 25 is provided on a first side or underside of the printed circuit board 6, on which the power electronics 5 and the cooling device 4 are also arranged. The lower part 25 surrounds the power electronics in a circumferential direction about a vertical axis Z lying in the plane of the image and seals tightly with the heat sink 7 and with the printed circuit board 6 by means of a sealing lip 28.

[0042] The upper part 26 is arranged on the opposite side of the circuit board 6 with respect to the lower part 25 and seals against the circuit board 6 by means of a further sealing lip 28.

[0043] The upper part 26 and the lower part 25 of the housing 20 together define a fluid-tight mold chamber 27 around the power electronics 5, on which the surface 3 of the component, where condensation can occur, is located. The mold chamber 27 is open to a condensate chamber 24 formed by the housing 20 only through an opening 29. Thus, the mold chamber 27 forms a mold in which the power electronics 5 and sections of the printed circuit board 6, or more generally, a part of the component 2 and the entire surface 3, on which condensation can occur, are arranged or contained.

[0044] During the manufacturing process, a still-flowable or liquid casting compound is poured into the mold chamber 27, which forms a casting mold. This compound spreads throughout the mold chamber 27 and completely fills it. As the casting compound hardens, it forms a heat-conducting element 10, which completely covers the surface 3 where condensation could occur, thus preventing condensation on that surface.

[0045] Since the housing 20, with the exception of the area of ​​the opening 29, is in direct contact with the heat-conducting element 10 and is preferably significantly less thermally conductive than the heat-conducting element 10, condensation can only occur in the area of ​​the opening 29 or on the condensation surface 11 formed in the area of ​​the opening 29. Consequently, condensation on component 2 is prevented and specifically induced on the condensation surface 11.

[0046] The condensation surface 11 is located within the condensate chamber 24 or forms part of the area bounding the condensate chamber 24. Accordingly, any condensate formed on the condensation surface 11 is collected in the condensate chamber 24. To prevent malfunctions and damage to surrounding areas, the condensate must be able to be drained from the condensate chamber 24 in a controlled and safe manner.

[0047] For example, in the Figures 3 and 4 In the installation position shown, in which gravity acts parallel to the vertical axis Z and downwards in the plane of representation, the condensate can be drained from the condensation surface 11 via specially designed guide channels 30 to a first and second condensate drain 21, 22, which are located particularly in the Figures 1 and 2 are recognizable.

[0048] The guide channels 30 and the condensate drains 21, 22 are formed by the housing 20. The first and second condensate drains 21, 22 allow the condensate to be drained away separately from the component 2 in a fluid-technical manner. For this purpose, recesses are provided in the component 2 and in the circuit board 6 of the component, through which the first and second condensate drains 21, 22 pass.

[0049] An important aspect of a particularly advantageous further development of the invention is to be able to drain the condensate not only in a single predetermined position from the condensate chamber 24, but to drain the condensate from the condensate chamber 24 in a multitude of positions, so that the condensate drainage device 1 can be used on differently positioned components 2 or can change its spatial orientation or position in space together with the component 2, while still ensuring reliable condensate drainage.

[0050] For this purpose, the condensate chamber 24 is designed as an open funnel, which is open on a side facing away from component 2 along the vertical axis Z.

[0051] Starting from a starting position as described in the Figures 3 and 4As shown, the condensate can initially flow by gravity through the first and second condensate drains 21, 22 and along the flow paths 21S, 22S defined by them. If the component 2 is rotated about the spatial axis Y with the condensate drain device 1, or arranged rotated with it, the condensate can flow through the first condensate drain 21 or the second condensate drain 22 up to a critical angle. If the rotation exceeds the critical angle, the condensate can no longer enter the first or second condensate drain 21, 22, but flows out via a condensate drain 23 formed by the funnel shape of the condensate chamber 24, whereby the condensate chamber 24, due to its upwardly open shape, forms a plurality of possible condensate drains 23. Four possible flow paths 23S1 to 23S4 are shown as examples.If the rotation about the spatial axis Y exceeds the limiting angle, the condensate can flow out of the condensate chamber 24 along the flow path 23S1 or along the flow path 23S3, depending on the direction of rotation about the spatial axis Y.

[0052] In this case, the critical angle can be assumed to be approximately 90° by way of example.

[0053] Accordingly, the condensate drainage device 1 can be rotated or arranged in a rotated position around the spatial axis Y, ensuring in each case a safe and fluidically separate discharge of the condensate from the component.

[0054] Two further flow paths 23S2 and 23S4 are also shown as examples, which enable condensate drainage from the condensate chamber 24 when the condensate drain device 1 is rotated around the spatial axis X.

[0055] Not shown here, in addition to the first and second condensate drains 21, 22, further condensate drains may also be provided which pass through the circuit board 6.

[0056] Not shown in the figures, the entire electronic assembly can have a housing that encloses component 2 and the condensate drain device 1. Preferably, the condensate drains 21, 22, 23 are arranged to lead out of the housing, so that the condensate can be carried out of the housing along the flow paths 21S, 22S, 23S1, 23S2, 23S3, 23S4 and, for example, by means of hoses, without coming into fluid contact with the component.

[0057] The invention is not limited in its implementation to the preferred embodiments specified above. Rather, a number of variants are conceivable which make use of the solution presented even in fundamentally different designs.

Claims

1. A condensate draining device (1) for discharging condensate from at least one cooled component (2) which is in particular a cooled electronic system and has a surface (3) on which condensate formation can occur, wherein the condensate draining device (1) has a heat conducting element (10) which has a condensation surface (11) and which is designed to at least partially cover said surface (3) of the at least one component (2) and to transfer a cold causing condensation on said surface (3) of the at least one component (2) to the condensation surface (11), further having a housing (20) with at least one condensate drain (21, 22, 23), wherein the at least one condensate drain (21, 22, 23) determines in each case at least one predetermined flow path (21S, 22S, 23S1, 23S2, 23S3, 23S4) which is fluidically separated from the at least one component (2) for draining off a condensate forming on the condensation surface (11) from the housing (20), characterized in that the heat conducting element (10) is formed from a potting compound and the housing (20) has a mold chamber (27) for accommodating the heat conducting element (10), wherein the mold chamber (27) is completely filled by the heat conducting element (10) and is designed to enclose the at least one component (2) at least in certain sections and said surface (3) of the at least one component (2) completely, and forms a mold for the potting compound.

2. The condensate draining device according to claim 1, wherein the housing (20) has a lower part (25) and / or an upper part (26), which are designed to enclose the at least one component (2) from two opposite sides, in particular in the region of said surface (3).

3. The condensate draining device according to claim 1 or 2, wherein the housing (20) further has a condensate chamber (24) for collecting the condensate.

4. The condensate draining device according to the preceding claim, wherein the condensation surface (11) in the condensate chamber (24) is exposed and forms part of a surface delimiting the condensate chamber (24).

5. The condensate draining device according to one of the two preceding claims, wherein the at least one condensate drain (21, 22, 23) is designed to drain off a condensate forming on the condensation surface (11) and accumulating in the condensate chamber (24) from the housing (20) along the flow path (21S, 22S, 23S1, 23S2, 23S3, 23S4) such that it is fluidically separated from the at least one component (2).

6. The condensate draining device according to any one of the preceding claims, wherein the at least one component (2) can be arranged in a first spatial orientation or in a second spatial orientation differing therefrom, wherein the housing (20) has a first condensate drain (21, 22, 23) which determines at least one first predetermined flow path (21S, 22S, 23S1, 23S2, 23S3, 23S4) fluidically separated from the at least one component (2) for draining off the condensate from the housing (20), and has a second condensate drain (21, 22, 23) which determines at least one second predetermined flow path (21S, 22S, 23S1, 23S2, 23S3, 23S4) fluidically separated from the at least one component (2) for draining off the condensate from the housing (20), and wherein the condensate draining device (1) can be arranged with the at least one component (2) in the first spatial orientation or in the second spatial orientation differing therefrom, and wherein in the first spatial orientation, the condensate can be guided out of the housing via the first condensate drain (21, 22, 23) and / or via the second condensate drain (21, 22, 23) and in the second spatial orientation via the second condensate drain (21, 22, 23) and / or via the first condensate drain (21, 22, 23).

7. The condensate draining device according to one of the preceding claims, wherein the housing (20) has at least one sealing section which is formed in particular by a sealing lip (28) and which is designed to seal off the mold chamber (27) formed as a mold from an environment, in particular by cooperating with the at least one component (2).

8. An electronic assembly with a cooling device (4), at least one electrical component (2) and a condensate draining device (1) according to any one of the preceding claims, wherein the cooling device (4) for cooling the at least one component (2) is arranged on the latter and the at least one component (2) has a surface (3) on which condensate formation can occur as a result of the cooling by means of the cooling device (4).

9. The electronic assembly according to the preceding claim, further having an assembly housing, wherein the housing (20) of the condensate draining device (1) is arranged in particular completely within the assembly housing and the at least one condensate drain (21, 22, 23) is designed in each case to discharge the condensate from the assembly housing.

10. A method for producing an electronic assembly according to any one of the two preceding claims and a condensate draining device (1) according to any one of claims 3 to 7, wherein the housing (20) forming the mold chamber (27) is arranged resting against the at least one component (2) and is in particular sealed with respect to the at least one component (2) so that the mold chamber (27) is open exclusively towards the condensate chamber (24), wherein through an opening (29) to the condensate chamber (24), a potting compound is filled into the mold chamber (27), which potting compound is distributed in the mold chamber (27) by gravity and completely fills the mold chamber (27) and forms the heat conducting element (10) after curing of the potting compound.