COMPONENT CARRIER WITH ADHESION-PROMOTING WIRING STRUCTURE
Patent Information
- Application Number
- DE602016091257
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2016-11-10
- Publication Date
- 2025-02-19
- Estimated Expiration
- 2036-11-10
AI Technical Summary
Component carriers face challenges in maintaining mechanical robustness and electrical reliability, especially under harsh conditions, due to issues like delamination between layers and the need for effective heat dissipation. Additionally, the miniaturization of electronic components and the increasing number of contacts on component carriers complicate adhesion and signal propagation.
A component carrier with a base structure and an electrically conductive wiring structure featuring a nonrectangular cross-sectional shape is introduced. This design creates adhesion promoting constrictions that enhance mechanical interlocking between the wiring structure and the surrounding material, improving adhesion without the need for surface roughening, which can interfere with signal propagation.
The nonrectangular cross-sectional shape of the wiring structure effectively increases adhesion between the wiring structure and the component carrier material, preventing delamination and maintaining mechanical and electrical reliability. This design allows for continued miniaturization of component carriers and improves signal integrity, especially for high-frequency radiofrequency signals.