Parameterizing an electronics production line

Abstract

The invention relates to a method for parameterizing an electronics production line (201) on the basis of device parameters (P20, …, P40) of a reference production line (200). The electronics production lines (200, 201) each have at least: - a device (20) for applying joining material on one or more component carriers (PCB), - a fitting device (30) for fitting electronic components on the component carriers (PCB), - a joining device (40) for joining the electronic components to the component carriers (PCB), and - a transport system (250) that is designed to transport the component carriers (PCB) by the devices (20, 30, 40). In order to simplify a location-independent scaling of production volumes to a plurality of production lines, the method comprises the following steps: - parameterizing the devices (20, …, 40) of the electronics production line (201) on the basis of the device parameters (P20, …, P40) of the reference production line (201), - determining actual process parameter values (ACT) in a limited region (h) about the transport system (250) of the parameterized electronics production line (201), - determining deviations (DEV) between the actual process parameter values (ACT) and reference process parameter values (REF), wherein the reference process parameter values (REF) have been detected in a limited region (h) about the transport system (250) of the reference production line (200). The invention further relates to a method for producing a series of electronic assemblies (100) and to an electronics production line (200, 201).

Description

[0001] Description

[0002] Parameterizing an electronics production line

[0003] The invention relates to a method for parameterizing an electronics production line

[0004] Such a process is used, for example, during the commissioning of a new electronics production line or during the introduction of a new series to be manufactured for the first time on an existing system. This is particularly the case in industrial electronics, power electronics, and microelectronics production facilities.

[0005] Electronic products are manufactured worldwide and are subject to different environmental and framework conditions. If a product or assembly is to be manufactured on two geographically separate production lines, this regularly presents a challenge. Commissioning additional production lines at the same location for existing products is also not trivial.

[0006] The invention is based on the object of simplifying the location-independent scaling of production volumes across several production lines.

[0007] This object is achieved by a method for parameterizing an electronics production line on the basis of device parameters of a reference production line having the features specified in claim 1.

[0008] The electronics production lines each have at least:

[0009] - a device for applying joining material to one or more component carriers,

[0010] - a placement device for placing electronic components on the component carriers,

[0011] - a joining device for joining the electronic components to the component carriers and - a transport system which is designed to transport the component carriers through the devices.

[0012] The fixtures on the electronics production line are parameterized based on the fixture parameters of the reference production line. If the production lines are equipped with identical fixtures, the parameters can be adopted directly. For example, configuration data can be copied and immediately adopted for the electronics production line and its fixtures to be parameterized. If the fixtures are similar or from different manufacturers, the process parameters to be maintained can be configured in the equivalent data fields of the fixtures to be parameterized. This can include, for example, temperature specifications, feed speeds, placement forces, solder temperatures (joining temperatures), etc.

[0013] Furthermore, actual process parameter values ​​are determined in a limited area around the transport system of the parameterized electronics production line. This determines how the process parameters configured in the fixtures actually affect the new electronics production line and, above all, the assemblies to be manufactured.

[0014] The area is a limited area around the transport system, in other words an area that is regularly traversed by the assemblies or the components arranged on them and in which the conditions decisive for the actual process prevail. Recording process parameters in the area allows direct conclusions to be drawn about the conditions that actually affect the assemblies and components. The parameters occurring in the area and their values ​​include temperatures, residual oxygen concentrations, accelerations, line timing, forces acting on the component carriers and components and other parameters. In a further step, deviations between the actual process parameter values ​​and the reference process parameter values ​​are determined, with the reference process parameter values ​​being recorded in a limited area around the transport system of the reference production line.

[0015] The reference production line and its reference process parameter values ​​represent the benchmark for the values ​​to be maintained, and deviations can be tolerated if they do not exceed a definable threshold.

[0016] In a further embodiment, the method comprises the step of determining offset values ​​for the devices of the electronics production line on the basis of the deviations. In particular, the offset values ​​are determined when the deviations exceed a respective threshold value. The threshold values ​​can be defined for each individual parameter. Depending on the device, the offset values ​​can be implemented as a true offset (i.e. from a defined parameter) or as a change in the parameter value. The offset values ​​can be saved in production documentation. The offset values ​​are set such that the actual process parameter values ​​of the electronics production line correspond to the reference process parameter values ​​of the reference production line.If the deviations are too large, i.e. if they exceed a second, much larger threshold, it can be assumed that maintenance is required or that an error occurred during commissioning of the line.

[0017] In a further embodiment, the actual process parameter values ​​and / or the reference process parameter values ​​are recorded using a process parameter recording system designed to run through the electronics production lines on the transport system. The reference process parameter values ​​in the reference production line are recorded or made available before the actual process parameter values ​​are recorded. Furthermore, there is no time dependency, so that at any time after the reference process parameter values ​​have been determined, they can again be used as a reference in a system to be newly parameterized.

[0018] In a further embodiment, the range extends from a maximum of 40 mm above a transport plane of the transport system to a maximum of 30 mm below the transport plane. Values ​​of 35 mm above the transport plane and 25 mm below the transport plane have proven particularly advantageous. The transport plane is defined by the fact that the component carriers rest on the transport system, and thus the support surface defines a zero point or the transport plane.

[0019] In a further embodiment, the production lines each manufacture electronic assemblies of a series of electronic assemblies, with at least one assembly of the series having already been manufactured on the reference production line. A series is defined as a number of similar electronic assemblies. Similar can, for example, mean identical in terms of the bill of materials or minor deviations of individual components with the same layout.

[0020] The method is also applicable for similar assemblies, especially for different layouts with similar components (i.e. the same performance class). However, after setting the offset values, it may still be necessary to carry out appropriate quality checks and to adjust the offset values ​​again.

[0021] In a further embodiment, the reference process parameter values ​​are recorded after at least one assembly has been manufactured on the reference production line. This allows quality requirements for the assemblies to be verified, and if the specifications have been met, the reference process parameter values ​​can be released and used for other electronics production lines.

[0022] In a further embodiment, the reference process parameter values ​​include at least a residual oxygen concentration and / or a temperature in the area around the transport system of the reference production line. Recording the reference process parameter values, in particular the residual oxygen concentration and / or the temperature in the area, has the great advantage that process conditions directly affecting the assemblies can be recorded and, accordingly, transferred to the system to be parameterized.

[0023] In a further embodiment, the reference process parameter values ​​comprise at least one acceleration curve and / or a force curve acting on the component carriers or assemblies passing through a reference production line. Such force or acceleration curves can be recorded, for example, using a process parameter recording system designed to pass through the reference production line. The force curve is understood to mean, for example, placement forces or other forces on the components and / or the component carriers during joining. The acceleration curve refers in particular to the accelerations that act on the component carriers or the then finished assemblies as a result of the transport system or individual process steps.

[0024] In a further embodiment, deviations between ambient conditions, in particular temperature, humidity and air pressure in the vicinity of the production lines are also taken into account when determining the deviations. In a simple embodiment, a process parameter recording system can be stored in the vicinity of the reference production line for a while after it has passed through the production line in order to determine the ambient parameters. It is also conceivable for ambient parameters to be recorded using separate measuring devices. The environment is defined such that the ambient conditions that directly affect the production lines prevail in the environment. As a rule, the environment extends only a few meters around the production lines.

[0025] In another embodiment, the same process parameter acquisition system is used to determine the actual process parameter values ​​and the reference process parameter values. This ensures that measurement inaccuracies that can influence the parameterization due to the use of different process parameter acquisition systems can be eliminated. For example, a technician can use the process parameter acquisition system with the reference process parameter values ​​stored on it to commission the production line to be parameterized and directly obtain the deviations and set offset values.

[0026] In another embodiment, two process parameter acquisition systems calibrated under the same, definable ambient conditions (e.g., normal conditions) are used to determine the actual process parameter values ​​and the reference process parameter values. This means that the process parameter acquisition systems used do not necessarily have to be calibrated or shipped at the same location, but can be calibrated in the immediate vicinity of the electronics production line to be parameterized. It is also conceivable that process parameter values ​​are weighted based on the ambient conditions during calibration.

[0027] In another embodiment, a calibration data set for the process parameter acquisition system is determined when the reference process parameter values ​​are determined. The calibration data set includes the ambient conditions under which the reference process parameter values ​​were acquired, as well as calibration data from the sensors of the process parameter acquisition system. For example, ambient conditions prior to the determination of the reference process parameter values ​​can be saved so that the digital data can be used later at another location without having to transport the process parameter acquisition systems.

[0028] The object is further achieved by a method for producing a series of electronic assemblies. The series of electronic assemblies is manufactured on a production line, wherein the production line has been parameterized using a method according to the invention. This means that corresponding process parameters are determined on a reference production line and transferred to the production line. Deviations are also determined in order to ensure that the series of electronic modules can be produced under sufficiently similar conditions on both production lines. This simplifies the transfer of production lines to other locations, whereby quality requirements for the individual products, i.e. defined electronic assemblies, can remain in place. The scaling of electronics production is also made easier and more efficient in this way.

[0029] The object is further achieved by an electronics production line which is designed to carry out the method according to the invention. For this purpose, the electronics production line has at least one device for applying joining material to component carriers. Furthermore, a placement device for placing electronic components on the component carriers, a joining device for joining the electronic components to the component carriers and a transport system which is designed to transport the component carriers through the devices. Furthermore, the electronics production line has an interface unit which is designed to receive reference process parameter values. The interface unit can be designed as an industrial controller with industrial communication interfaces.The interface unit can also be designed as an edge box, which is dedicated to the parameterization and monitoring of the process parameters and communicates, for example, with an industrial control system of the electronics production line or the individual devices.

[0030] In a further embodiment, the interface unit is designed to determine deviations and / or offset values. The deviations are determined from the reference process parameter values ​​and the actual process parameter values. The offset values ​​can be derived from the deviations.

[0031] The invention is described and explained in more detail below with reference to the exemplary embodiments shown in the figures. They show:

[0032] FIG 1 schematically shows a reference production line or an electronics production line,

[0033] FIG 2 an electronics production line with device parameters,

[0034] FIG 3 processing of the actual and reference process parameters,

[0035] FIG 4 shows a schematic cross-section through a transport system,

[0036] FIG 5 schematically shows a process parameter acquisition system on a transport system and

[0037] FIG 6 schematically shows a joining device with area .

[0038] FIG 1 shows a schematic diagram of an electronics production line 200, 201, which stands for a reference production line 200 and an electronics production line 201, respectively. The components of the reference production line 200 are described below, whereby these components can also be used wholly or partially in the electronics production line 201. The reference production line 200 has devices 10, ..., 50. This includes, among other things, a supply device 10 which is suitable for supplying component carriers PCB, for example substrate materials or printed circuit boards. Furthermore, a transport system 250 is shown which is designed to transport the component carriers PCB through the reference production line 200. A device 20 for applying joining material can be designed, for example, as a solder paste printer or solder paste dispenser. Sintering pastes can also be applied here.One or more placement devices 30 place components, for example SMD components, onto the component carriers PCB provided with joining materials. A joining device 40 completes the joints between the components and the component carriers PCB using the joining materials. This can be, for example, a reflow oven or a sintering system. At the end of the reference production line 200, a collecting device 50 can be seen, which collects the manufactured assemblies 100. An interface unit 210 is in communication with the devices 10, ..., 50 of the reference production line 200 and can be designed to determine and / or output process parameters or device parameters.The electronics production line 201 is constructed in the same way as the reference production line 200, whereby individual fixtures can come from the same manufacturers, from different manufacturers but with similar fixture parameters, or from different manufacturers. Ideally, the fixtures of the electronics production line 201 and those of the reference production line 200 are identical in design. If the fixtures differ, parameters can either be adopted directly as initial parameters or customized parameters can be created based on the technical data of the fixtures (maximum heating power, etc.).

[0039] FIG 2 schematically shows an electronics production line 201 to be parameterized, which is parameterized with device parameters P20, ..., P40 and checked with reference process parameter values ​​REE of a reference production line 200. The reference process parameter values ​​REE and the process parameter values ​​are made available to an interface unit 210, which is designed, for example, as an industrial controller and can be used to parameterize the individual devices 10, ..., 50. In the present case, parameter P20 is made available for the device 20 for applying joining material, parameter P30 for the placement device 30 and parameter P40 for the joining device 40. If the devices 20, ..., 40 are then parameterized, a process parameter acquisition system AIO can be transported on the transport system 250 through the electronics production line 201 and can thereby acquire actual process parameter values ​​ACT.The actual process parameter values ​​ACT can be transmitted via a wireless connection between the process parameter acquisition system AIO and, for example, the interface unit 210 and / or a commissioning computer (laptop, tablet, smartphone, each with a program / app).

[0040] Figure 3 shows a schematic diagram of how deviations DEV are determined in the interface unit 210 from the actual process parameter values ​​ACT of the electronics production line 201 parameterized with the process parameters P20, ..., P40 and the reference process parameter values ​​REE of the reference production line 201. Based on the deviations, offset values ​​can then be determined for the electronics production line 201 and its devices 20, ..., 40 so that the production conditions correspond to those of the reference production line. If adjusting the offset values ​​does not produce satisfactory results, the process can be repeated, or in the case of serious deviations, the system can be checked (e.g., defects such as inadequate sealing causing process gas to escape).

[0041] In other words, FIG 3 shows how, for an electronics production line 201 to be parameterized, the actual process parameter values ​​ACT and the reference

[0042] Deviations DEV are generated from the process parameter values ​​REE of a reference production line 200, on the basis of which deviations DEV the interface unit 210 creates offset values ​​OFF for the electronics production line 201. These offset values ​​OFF can be set directly by the interface unit 210 in the electronics production line 201; alternatively or additionally, it is possible for individual devices (not shown) of the electronics production line 201 to have their own control devices to which the offset values ​​OFF are communicated and which can then be set in the devices themselves via the control device of the respective device. It is conceivable for individual devices to have control devices which manage the offset values ​​OFF for several devices.

[0043] FIG 4 shows a schematic cross-section through the transport system 250 of the electronics production lines 200, 201 shown in FIG 1. The transport system 250 can, for example, be designed as a chain-based transport system which transports the component carriers PCB, for example with a clamp, through the electronics production line 200, 201. The transport system 250 is able to be adjusted in width b so that the different component carriers PCB can be transported safely. Also visible is a transport plane hO which results from the support of the transport system 250 on which the component carriers PCB rest. An area h around the transport plane is defined, as is an area hl above the transport plane hO and an area h2 below the transport plane hO.For the area hl above the transport system 250, values ​​of a maximum of 35 mm and for the area h2 below a maximum of 25 mm have proven to be advantageous, since these are maintained or achieved in common electronics production lines 200, 201 and with common populated component carriers. It can therefore be assumed that a measured value recorded in the area h represents the conditions or process parameters as they actually affect a component carrier PCB. The width of the area h is limited to the maximum transport width b that can be provided by the transport system 250. The best measured values ​​are obtained within the area h, at the locations where the average number of components pass through. For example, this can be in the middle with regard to the width b and from 1 to 5 mm above the transport level h0. Likewise, several measuring points can be distributed over the width b.

[0044] FIG. 5 schematically shows a process parameter acquisition system AIO being transported on the transport system 250. The area h and the width b are specified analogously to FIG. 4. It can also be seen that the process parameter acquisition system AIO does not necessarily have to fill the entire area h. If the process parameter acquisition system AIO traverses the area h, a profile of the process parameter values ​​can be created over the traversed distance by acquiring process parameter values ​​at several points or (quasi-) continuously, e.g., with a suitable sampling frequency.

[0045] FIG. 6 schematically shows a joining device 40, such as can be used in a reference production line 200 and a production line 201. Shown is a section of the transport system 250 and a graphical representation of how the area h extends along the direction of movement x through the joining device 40. The area h thus forms a virtual tunnel around the transport system, in which the actual process parameter values ​​ACT should correspond to the reference process parameter values ​​REF. The area h is always within the respective device 10,..., 50, except in sections of the transport system 250 that are arranged between, before, or after the respective devices.

[0046] In summary, the invention relates to a method for parameterizing an electronics production line (201) based on device parameters (P20, ..., P40) of a reference production line (200). The electronics production lines (200, 201) each have at least:

[0047] - a device (20) for applying joining material to one or more component carriers (PCB),

[0048] - a placement device (30) for placing electronic components on the component carriers (PCB),

[0049] - a joining device (40) for joining the electronic components to the component carriers (PCBs), and - a transport system (250) designed to transport the component carriers (PCBs) through the devices (20, 30, 40). To simplify location-independent scaling of production volumes to multiple production lines, the method comprises the following steps:

[0050] - parameterizing the devices (20,..., 40) of the electronics production line (201) on the basis of the device parameters (P20, ..., P40) of the reference production line (201),

[0051] - Determining actual process parameter values ​​(ACT) in a limited area (h) around the transport system (250) of the parameterized electronics production line (201),

[0052] - Determining deviations (DEV) between the actual process parameter values ​​(ACT) and the reference process parameter values ​​(REE), wherein the reference process parameter values ​​(REE) were recorded in a limited area (h) around the transport system (250) of the reference production line (200). The invention further relates to a

[0053] Method for producing a series of electronic assemblies (100) and an electronics production line (200,201).

[0054] Reference sign

[0055] 100 electronic assemblies

[0056] PCB component carrier 200 Reference production line 201 Electronics production line 210 Interface unit

[0057] 10 Provisioning device

[0058] 20 Device for applying joining material

[0059] 30 placement device

[0060] 40 Joining device

[0061] 50 collection device

[0062] P20 , P40 fixture parameters

[0063] 250 Transport system hO Transport level h Area hl , h2 Area above / below the transport level

[0064] SPI inspection device

[0065] REF Reference process parameter values

[0066] ACT I st process parameter values

[0067] DEV deviations

[0068] OFF Of fset values

[0069] AIO process parameter acquisition system

Claims

Patent claims 1. Method for parameterizing an electronics production line (201) based on device parameters (P20 , ..., P40 ) of a reference production line (200) , wherein the electronics production lines (200, 201) each have at least: - a device (20) for applying joining material to one or more component carriers (PCBs) , - a placement device (30) for placing electronic components onto the component carriers (PCB) , - a joining device (40) for joining the electronic components to the component carriers (PCB) and - a transport system (250) designed to transport the component carriers (PCBs) through the devices (20, 30, 40), comprising the steps: - Parameterizing the fixtures (20,..., 40) of the electronics production line (201) based on the fixture parameters (P20, ..., P40) of the reference production line (201) , - Determining actual process parameter values ​​(ACT) in a limited area (h) around the transport system (250) of the parameterized electronics manufacturing line (201) , - Determining deviations (DEV) between the actual process parameter values ​​(ACT) and reference process parameter values ​​(REE), wherein the reference process parameter values ​​(REE) were recorded in a limited area (h) around the transport system (250) of the reference production line (200).

2. The method of claim 1, comprising the step of: - Determining offset values ​​(OFF) for the devices (20,..., 40) based on the deviations (DEV) .

3. A method according to claim 1 or 2, wherein the actual process parameter values ​​(ACT) and / or the reference process parameter values ​​(REE) are and / or were acquired using a process parameter acquisition system (AIO) that is used for is trained to pass through the electronics production lines (200, 201) on the transport system (250).

4. Method according to one of the preceding claims, wherein the area (h) extends from a maximum of 40mm above a transport level (hO) of the transport system (250) to a maximum of 30mm below the transport level (hO).

5. Method according to one of the preceding claims, wherein the production lines (200, 201) each produce electronic assemblies (100) of a series (S100) and wherein at least one assembly (100) of the series (S100) was produced on the reference production line (200).

6. The method of claim 5, wherein the reference process parameter values ​​(REE) are recorded after the at least one assembly (100) has been placed on the reference production line. (200) was manufactured.

7. Method according to any of the preceding claims, wherein the reference process parameter values ​​(REE) comprise at least a residual oxygen concentration and / or a temperature, each in the range (h) around the transport system (250) of the reference production line (200).

8. Method according to one of the preceding claims, wherein the reference process parameter values ​​(REE) comprise at least an acceleration profile and / or a force profile acting on the component carriers (PCBs) or assemblies (100) as they pass through the reference production line (200).

9. Method according to one of the preceding claims, wherein when determining deviations (DEV) deviations between environmental conditions, in particular temperature, humidity and air pressure of the production lines (200, 201), are also determined.

10. Method according to one of the preceding claims, wherein the same process parameter acquisition system (AIO) is used when determining the actual process parameter values ​​(ACT) and the reference process parameter values ​​(REE).

11. Method according to one of the preceding claims, wherein two process parameter acquisition systems (AIO) calibrated under the same environmental conditions are used to determine the actual process parameter values ​​(ACT) and the reference process parameter values ​​(REE).

12. A method according to any of the preceding claims, wherein the reference process parameter values ​​(REE) for a calibration data set for the process parameter acquisition system (AIO) are determined. <transferred to other locations> 13. Method for producing a series of electronic assemblies (100) on a production line (201) parameterized by a method according to one of the preceding claims.

14. Electronics production line (200, 201) for carrying out a method according to one of claims 1 to 12, comprising - a device (20) for applying joining material to component carriers (PCB) , - a placement device (30) for placing electronic components onto the component carriers (PCB) , - a joining device (40) for joining the electronic components to the component carriers (PCB) , - a transport system (250) designed to transport the component carriers (PCBs) through the devices (20, 30, 40) and - at least one interface unit (210) designed to receive reference process parameter values ​​(REE).

15. Electronics manufacturing line (200) according to claim 14, wherein the interface unit (210) is configured to determine deviations (DEV) and / or offset values ​​(OFF).

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