Half-bridge module with insulated contact areas between two transistor strip sections

Abstract

A half-bridge module (M) has a carrier (T), which has a conducting path layer. The conducting path layer comprises a first transistor strip section (LA), a second transistor strip section (HA) and an intermediate section (ZA), each section extending in a first direction (R1). The intermediate section (ZA) is arranged between the first transistor strip section (LA) and the second transistor strip section (HA). In the intermediate section (ZA) there extend connecting area portions (VF) of a first area (F1) that also extends in the first transistor strip section (LA). Contact areas (P) insulated therefrom alternate with the connecting area portions in the first direction (R1).

Description

[0001] Description

[0002] Half-bridge module with insulated connection surfaces between two

[0003] T ransistor strip sections

[0004] Electric vehicles have electrical machines whose windings are supplied with switchable current. To achieve the required power outputs, often exceeding 100 kW, high currents of frequently more than 100 amperes and operating voltages of frequently more than 100 V, especially 800 V, are used. Power transistors are used to switch the current supply to the windings, generating switching edges with high current swings in a short time. Extremely fast-switching transistors such as SiC transistors are used, particularly to achieve even shorter switching edges or higher current rise rates in the transistors. To effectively use such fast-switching transistors, a very low-inductance circuit is required, whereby signal propagation times must also be taken into account for reliable switching.It is an object of the invention to show a possibility with which high-performance transistors can be connected to half-bridges in a low-induction manner.

[0005] This object is achieved by the half-bridge module according to claim 1. Further properties, features, embodiments, and advantages are revealed by the dependent claims, the description, and the figures.

[0006] It is proposed to divide a conductor layer of a carrier into two strip sections and an intermediate section located between the strip sections. The sections are strip-shaped and extend in the same direction. Thus, the strips lie one above the other (seen perpendicular to the longitudinal direction of the strips), with the intermediate section located between the first-mentioned strip sections. The two strip sections on either side of the intermediate section are intended for transistors, which can be applied there, for example, as a bare die (unpackaged semiconductor component).A low overall inductance is achieved by providing insulated contact pads in the intermediate section, which, due to their proximity, enable direct and short connections to the first, upper strip section. Furthermore, power contact pads can be provided in the intermediate section, which are located in close proximity to the lower (second) strip section, so that a contact point on the insulated contact pads can be located directly next to a contact point on the second strip section. This provides a contacting option between the insulated contact pads and the lower, second strip section, ensuring a very small area between the connections of the contact pads and the second strip section, as these are directly adjacent.Secondly, it ensures that the current connection from the connection pads to the upper, first strip section can be very short, since the insulated connection pads also abut or border on the first (upper) strip section. The fact that the connection pads border both strip sections results in a low-inductance connection. The first and second strip sections are located on either side of the connection pads.

[0007] A first surface extends in the (upper) first strip section and further comprises connecting surface sections that extend into the intermediate section, preferably as far as the (lower) second strip section. This enables a direct, low-inductance connection of the potential of the first surface to contact points in the (lower) second strip section. Due to the connecting surface sections, the first surface borders on the (lower) second strip section, so that very short connections are possible. The terms "bottom" and "top" refer to a plan view of the module, as shown in Fig. 1, in which the longitudinal direction of the carrier or the conductor track layer runs from left to right. The term "strip section" is also used for shortening as "strip". The strips are aligned with one another, in particular in a direction perpendicular to the first direction (i.e., perpendicular to the longitudinal direction).

[0008] In the intermediate section, the connecting surface sections (in particular as part of the first surface extending in the first strip) and the insulated connection surfaces alternate along the course of the strips (i.e. along a first direction or the longitudinal direction). The first surface, which extends over the first strip section and the intermediate sections, and the insulated connection surfaces border on the (lower) second strip section, but are electrically separated from it, preferably via a trench in the conductor layer. For the connecting surface sections (i.e. parts of the first surface), this means a very short connection option to the second (lower) strip section, and for the insulated connection surfaces, this means a contact option that is very close to the contact options of the second (lower) strip section.This allows the leads to these contact points to be positioned very close to each other. The close routing of the leads results in low inductances.

[0009] Finally, the connecting surface sections of the first surface, which also extends in the (upper) first strip section, enable contact points for a feed that is located essentially midway between the first and second strip sections. This allows the contact points for feeds to be arranged at approximately the same distance from components such as transistors located in or on the strip sections. This results in approximately the same signal propagation times to the transistors of the various strip sections. As a result, a switching edge generated by components on or in the first strip section reaches the contact sections on the connecting surface sections at approximately the same time as switching edges generated in or on the second strip section. This avoids asymmetries in the control, so that no signal propagation times have to be adjusted in a controller.Rather, a temporal symmetry for components of both strips results solely from the layout of the conductor layer. The terms used here refer in particular to the illustration in Figure 1, which is explained in more detail in the description of the figures. The strip sections described here can in particular be equipped with transistors and are therefore also referred to as transistor strip sections. The conductor layer described here has a layout which has a first surface, a second surface and insulated connection surfaces. These three elements are separated from one another in the conductor layer and are in particular electrically separated by structures of the conductor layer. The surfaces of the conductor layer are thus isolated; structures of the conductor layer provide the electrical separation of the surfaces. The separation of the surfaces can be provided by etching or milling or other structuring forming measures.

[0010] The conductor track layer is further geometrically divided into two strip sections and an intermediate section in between. This division into sections is merely conceptual or functional, whereas the surfaces are physically and in particular electrically separated from one another in the conductor track layer. A division into strips does not necessarily have to imply an electrical subdivision, but does not exclude it. The strip sections and the intermediate section are arranged directly next to one another (in a direction perpendicular to the first direction). The sections preferably completely cover the carrier or a power area thereof. In particular, the sections are aligned in a direction perpendicular to the first direction. Like the surfaces, the sections refer to the largest lateral surface of the carrier (i.e. in plan view, not also a cross-section). The conductor track layer is in particular a conductive outer layer of the carrier.In particular, the strip sections each extend from an outer edge of the conductor track layer to the intermediate section. These outer edges extend along the first direction and in particular along the longest edge of the carrier. The strip sections and the intermediate section preferably extend from one side to the opposite side of the conductor track layer, with these sides being perpendicular to the outer edges. In a rectangular carrier, these sides are the shorter sides of the rectangle, and the outer edges are the longer sides of the rectangle.

[0011] The first surface extends over a first strip section and over connecting surface sections that protrude from the first strip section into the intermediate section and in particular border the second strip section. The part of the first surface that lies in the first strip section and the connecting surface sections are electrically connected to one another, preferably by a one-piece construction or else by electrical connecting elements. The first surface is electrically insulated from the second surface (by structures of the conductor track layer) because the conductor track layer has a gap between them that extends through the entire thickness of the conductor track layer. This gap or the resulting trench extends between the second surface and the connecting surface sections.

[0012] The insulated connection surfaces are surrounded, on the one hand, by the connecting surface portions of the first surface (within the intermediate portion) and by (a part of) the first surface extending in the first strip portion, and are further surrounded by (portions of) the second surface. The second surface may have an edge that extends substantially along the first direction (along which the strip portions or intermediate portions also extend). The first surface and the connection surfaces extend to this edge (except for an electrically isolating trench). An edge parallel thereto may correspond to an outer edge.

[0013] The connecting surface sections and the insulated connection surfaces extend to the second surface. However, the connecting surface sections and the insulated connection surfaces are electrically insulated from the second surface by structures in the conductor layer. Between the first surface, the second surface, and the connection surfaces, the conductor layer has insulating structures that extend through the entire thickness of the conductor layer. The structures are preferably recesses, such as gaps or trenches. The resulting distance between these surfaces can correspond to a minimum creepage distance to ensure that the surfaces are sufficiently insulated from one another.

[0014] The first surface, the second surface, and the connection surfaces extend in the same conductor layer. The conductor layer is thus structured only by the trench that separates the second surface from the first surface and the connection surfaces, and the trench that separates the insulated connection surfaces from the first surface. In particular, the connection surfaces and the connecting surface sections can be repeated several times in succession along the first direction in order to enable a connection that is symmetrical with regard to propagation times. This ensures, in particular, that components on the first surface and components on the second surface are electrically contacted in the same way (i.e., with regard to the inductance per unit length of the connection and with regard to propagation time and the resistance of the connection).

[0015] One side of the conductor track layer preferably forms an outer side of the carrier. In other words, the conductor track layer is preferably not an intermediate layer of a multi-layer carrier, but rather forms the top or bottom side of the carrier. The carrier further comprises an insulator layer onto which the conductor track layer is applied. The conductor track layer is in particular a metal layer, for example a layer made of copper or a copper material or of aluminum or an aluminum material. The insulator can be a plastic, a plastic composite, or preferably a ceramic insulator. The carrier can be designed, for example, as a circuit board, for example as a printed circuit board, as a DCB circuit board, or as an IMS circuit board. The carrier can be single-layered, with the layer being formed by the conductor track layer, or can be multi-layered, with one of the two layers being formed by the conductor track layer.Additional conductive layers can also be provided within the carrier, with the conductor layer being the outer layer of the carrier. The outer layer can be provided with an insulating coating. The coating is removed at contact points for supply lines or in areas where a component is to be mounted.

[0016] The conductor layer is structured, i.e., forms conductor track structures. These conductor track structures comprise the first surface, the second surface, and / or the insulated connection pads, as described herein. In particular, the conductor track layer extends in a plane. With a single-layer design of the carrier, the carrier can be connected to a heat sink on the side facing away from the conductor track layer. An insulating layer of the carrier can be connected to the heat sink, or a conductive layer of the carrier can be connected to the heat sink, which is provided on the opposite side of the conductor track layer. The half-bridge module can be provided with or without components.

[0017] The carrier is used in particular within a half-bridge module. A (populated) half-bridge module has several high-side transistors connected in parallel and several low-side transistors connected in parallel. The high-side transistors are connected in series with the low-side transistors via a connection point. The connection point can serve as a phase connection or load connection, while the two ends of this series connection can be connected to a supply voltage, i.e., to two supply potentials. Using the present embodiment, the high-side transistors can be placed in the second strip section (or on the second surface), while the low-side transistors can be arranged on the first strip section (or on the first surface, preferably in the first strip section).Since the two strip sections mentioned are suitable for placing transistors, the strips are also called transistor strips.

[0018] The carrier can have a rectangular shape, wherein the long side corresponds to the first direction along which the strip sections also extend. The first strip section, the intermediate section, and the second strip section are arranged next to one another transversely to this. The carrier can also have a power section on which the strip sections and the intermediate section are located, and can also have at least one further section, for example for connection technology, filters, controls, and the like. Preferably, however, the carrier ends with edges of the two strip sections. The strip sections are arranged opposite one another, with perpendicular edges ending the strip sections and the intermediate section in the longitudinal direction. The first direction preferably extends along the longer edge of the rectangular shape of the carrier, but can also extend along the shorter edge of the rectangular shape of the carrier.

[0019] A half-bridge module is thus proposed, comprising a carrier having a conductor layer. The carrier is applied, in particular, to an insulator layer and has an uncovered surface (top side) opposite the side of the conductor layer (bottom side) adjacent to the insulator layer. The conductor layer has three sections in the form of strips. These strips each extend along a first direction. The strips extend parallel to each other in this direction. The conductor layer has a first transistor strip section, a second transistor strip section, and an intermediate section (which can also be referred to as an intermediate strip section because, like the other two strip sections, it has a strip shape).The shape of the strip sections is in particular the shape of a rectangle, where the length of each rectangle corresponds to the length of the conductor layer, the sum of the widths of the strip sections and the intermediate section together giving the width of the conductor layer.

[0020] The conductor track layer is structured and formed according to a layout as mentioned above. The intermediate section is located between the first and second transistor strip sections. Thus, transverse to the first direction, i.e., along the width of the conductor track layer, there is a sequence: first transistor strip section, intermediate section, and second transistor strip section. These sections relate in particular to a plane in which the conductor track layer extends. The strips thus extend in the same area or in the same plane. The strip sections and the intermediate section preferably largely or completely fill the conductor track layer. The strip sections and the intermediate section are functional subdivisions of the conductor track layer and are not necessarily also electrical subdivisions.In particular, there is a first surface extending both in the first strip section and in the intermediate section, wherein there is no electrical subdivision between the surface subregions extending in the intermediate section and surface subregions extending in the first strip section.

[0021] Connecting surface portions of a first surface extend into the intermediate section. This first surface also extends into the first transistor strip section. The connecting surface portions are electrically connected to the surface extending in the first strip section. Preferably, the first strip section is substantially completely or at least largely filled by the first surface, wherein in the intermediate section only partial regions of the intermediate section are covered by the first surface (and form the connecting surface portions).

[0022] The intermediate section also contains insulated connection surfaces. These fill the same area as the partial areas of the intermediate section. However, these partial areas do not overlap with the connecting surface sections.

[0023] In particular, the connection surface sections are electrically separated from the contact surfaces. The electrical separation or insulation between the contact surfaces and the connection surface sections refers to the conductor track layer, which may have structures in the conductor track layer that separate the electrical separation. In other words, the contact surfaces are isolated from the connection surface sections in that the surface of the conductor track layer that represents the contact surfaces is separated from the connection surface sections in the conductor track layer. However, this does not necessarily mean that these two surfaces can be electrically connected to one another outside the conductor track layer, for example indirectly via a component or the like. The contact surfaces are therefore isolated from the connection surface sections in that the conductor track layer itself does not establish a connection between these two surfaces or surface sections.The isolation of the contact pads from the connecting surface sections is achieved by physical separation in the conductor layer, for example, by providing a trench between the contact pads and the connecting surface sections. Similarly, a second surface (of the same conductor layer) in the second strip section can be separated from both the connecting surface sections and the contact pads.

[0024] In the intermediate section, the insulated terminal pads and the connecting surface sections alternate along the first direction. The first direction runs along the longitudinal direction of the strip sections or the longitudinal direction of the conductor layer or the carrier or also the intermediate section. This first direction is perpendicular to a second direction. The first and second directions are directions in which the conductor layer extends planarly. Both directions are perpendicular to the thickness of the conductor layer.

[0025] The first strip section, the intermediate section, and the second strip section are arranged next to one another along the second direction. In other words, the region of the first surface lying in the first strip section, the connecting surface sections and connection surfaces alternating in the first direction, and, thirdly, the second surface or the second strip section are arranged next to one another in the second direction. Since the connecting surface sections and the connection surfaces alternate in the first direction (and within the intermediate section), it results in particular that in a first longitudinal position the first strip section, the connecting surface sections, and the second strip section are arranged next to one another, while in a second longitudinal position the first strip section, the connection surfaces, and the second strip section are arranged next to one another.In a first section perpendicular to the first direction, the first surface (including the connecting surface sections) may be adjacent to the second surface, while in a second section perpendicular to the first direction, the first surface, the connecting surfaces, and the second surface are arranged in a row. The first and second sections are at different positions in the first direction (i.e., the longitudinal direction).

[0026] Preferably, the connecting surface portions adjoin the second transistor strip section. A second surface of the conductor track layer, which extends largely or substantially completely into the second strip section, is electrically insulated from the connecting surface portions (which belong to the first surface). The connection surfaces preferably also adjoin the first transistor strip section, but are preferably electrically separated from the first surface, which extends (among other things) in the first strip section. The connection surfaces are electrically separated from the connecting surface portions within the conductor track layer. The surfaces mentioned here are, in particular, conductive surfaces of the conductive layer formed by the conductor track layer.The sections refer to geometric divisions of the conductor track layer and are not necessarily to be understood as electrically separated sub-regions of the conductor track layer. While the first area extends in the first strip section and (as connecting area sections) in the intermediate section (and thus a connection exists between area regions of different strips), the second area extends in the second strip section, so that the area in the second strip section is separated from the intermediate section and from the first strip section within the conductor track layer. Areas within the first strip section and areas in the intermediate section are provided separately from the area in the second strip section. The separation is provided by separating structures in the conductor track layer.

[0027] The connecting surface sections or the first surface and / or the connection surfaces border on the second transistor strip section, but without being electrically connected (by means of the conductor track layer) to the second surface located in the second strip section. The connection surfaces border in particular on the second strip section, but without being electrically connected (by means of the conductor track layer) to the second surface located therein. The connection surfaces are preferably electrically separated by the conductor track layer from the first surface, in particular from the part of the first surface located in the first strip section, as well as from the connecting surface sections. The conductor track layer can thereby have a separating effect by being structured into conductor tracks or pads or by having separating structures such as recesses between the surfaces to be separated.The conductor layer has an insulating effect, in particular, by having grooves or recesses that extend through the entire thickness of the conductor layer. These grooves, gaps, or recesses provide a physical separation between surfaces, surface sections, or partial surface areas of the conductor layer. However, the carrier comprises at least one insulating layer to which the conductor layer is attached, so that despite the physical separation, a mechanical connection exists in the conductor layer (which, however, provides electrical insulation).

[0028] The connecting surface sections preferably widen towards the second transistor strip section. In other words, the portions of the first surface that represent the connecting surface sections widen towards the second transistor strip section. The widening thus takes place along the second direction or perpendicular to the first direction, in particular in the plane of the conductor track layer. Alternatively or in combination with this, the connection surfaces taper towards the second transistor strip section. A decreasing width is referred to as a taper. This taper or decreasing width also refers to the course along the second direction. The widening or tapering refers to the dimension of the relevant surfaces or sections in the longitudinal direction, i.e. along the first direction.Alternatively, the width of the connecting surface sections can remain the same or decrease from the first to the second strip section. In the same way, the connection surfaces can widen from the first to the second strip section, or the width can remain the same. Here, too, the width is considered to be the dimension in the longitudinal direction (= first direction). As an alternative possibility, it can be provided that the connection surfaces have a greater width at the point where they border the first strip section than at the point or edge where they border the second surface or the second strip section. Between these points, the course can also be discontinuous or provide a taper and a widening.In addition, the width of the connecting surface sections at the point where they border the first strip section is preferably smaller than at the edge with which the connecting surface sections border the second strip section or the second surface. The thickness of the conductor layer is preferably constant (apart from the points where it has recesses).

[0029] The connection surfaces can have a plurality of connection points in a region adjacent to the first strip section. From each connection point, at least one connector can extend into the first strip section, preferably to mounting surfaces for components or to the components themselves. Furthermore, the connection surfaces can have connection points, in particular with a connection element configured for contacting a supply potential. In addition, the connection surface sections can have a plurality of connection points in a region of the connection surface sections adjacent to the second strip section. From each connection point, at least one connector can extend into the second strip section, in particular to mounting surfaces for components or to a component itself.If multiple connectors extend from a connection point, they can be connected to multiple components in one of the strip sections or lead to multiple mounting surfaces in the respective strip section. Furthermore, multiple connectors extending from the same connection point can be connected to the same component in one of the strip sections or lead to the same mounting surface, thus increasing the current-carrying capacity. Multiple connector groups can extend from at least one terminal surface and / or from at least one connection surface section, with each group comprising multiple connectors intended for connecting the same component or extending to the same mounting surface.

[0030] The first surface and / or the second surface are preferably each continuous surfaces. In particular, the partial region of the first surface that extends in the first strip section, together with the connecting surface sections, is a continuous surface (or at least directly electrically connected). This partial region of the first surface that extends in the first strip section is in particular formed as a continuous strip, in particular as a strip that is continuous along the first direction (and also along the second direction).

[0031] The connecting surface sections, which also belong to the first surface, are not continuous in the first direction, but alternate with the connection surfaces. From the partial region of the first surface that extends in the first strip section, i.e. from the continuous strip, the connecting surface sections extend to the second transistor strip section. The connecting surface sections extend in particular as far as the second surface. The connecting surface sections thus have an edge (which can extend along the first direction) that lies opposite the second surface or the second strip section. In particular, there is a trench (or another separating structure) in the conductor track layer between the edge of the connecting surface sections that point towards the second surface or the second strip section, and the second strip section or the second surface itself.The second surface can have an edge that lies opposite the edge of the connecting surface sections. The edges of the connection surfaces provided on the side of the second surface or the second strip section also preferably run substantially along the first direction. The continuous design of the connecting surface sections and the partial region of the first surface that extends into the first strip section enables particularly simple electrical connection, for example, of components in the first strip section with contacting or connecting elements in the connecting surface sections.

[0032] A second surface is provided in the second strip section. This second surface is conductive, for example made of a copper material, an aluminum material, or another electrically conductive material. The second surface is designed as a surface that is continuous in the first direction. The second surface is insulated from the first surface, that is to say in particular from the connecting surface sections, as well as from the connection surfaces (by means of separating structures in the conductor track layer). Preferably, a trench is located between the second surface, on the one hand, and the connecting surface sections of the first surface and the connection surfaces, on the other hand, which trench preferably extends through the entire thickness of the conductor track layer. The second surface can have mounting surfaces for transistors. The transistors or the associated mounting surfaces are preferably lined up along the first direction.The transistors can extend along one or more rows along the first direction. These rows extend along the first direction. This results in mounting surfaces that can be offset from one another perpendicular to the first direction, in particular periodically or alternatingly. This occurs in particular when the mounting surfaces are arranged in several rows (parallel rows) along the first direction. The mounting surfaces are thus lined up in the second surface along the first direction, in particular along one or more rows. The rows extend along the first direction. Embodiments of the half-bridge module with mounting surfaces are, in particular, unpopulated half-bridge modules, in which, however, the arrangement of the mounting surfaces on the second surface already guarantees small distances to the connection surfaces and the connecting surface sections, thereby resulting in a low-inductance layout.The mounting surfaces are designed specifically for mounting an SMD component such as a transistor.

[0033] The first surface preferably also has mounting surfaces in the first strip section. Like the previously mentioned mounting surfaces, these are suitable for transistors, i.e., they are designed for SMD mounting of a bare-die transistor or for populating transistors based on a different connection technology. The mounting surfaces are arranged in a row along the first direction. Like the previously mentioned mounting surfaces, these are arranged in a row along the first direction at a distance and do not directly adjoin one another. The mounting surfaces can be arranged in one or more rows that extend along the first direction. In other words, the mounting surfaces can be provided at different heights, relative to a direction perpendicular to the first direction, i.e., they can have alternating different distances from a center line along the first direction.A half-bridge module with such mounting surfaces is, in particular, unpopulated. The mounting surfaces are designed for high-current applications, i.e., for continuous currents of at least 10 A or at least 100 A. This also applies to the transistors in populated modules.

[0034] The connecting surface sections of the first surface, which extend from the first strip section to the second strip section (and thus extend into the intermediate section), result in very low-resistance connections that can be manufactured cost-effectively. Furthermore, the aforementioned arrangement of the mounting surfaces in the first strip section automatically results in short connecting distances to the connection surfaces (located in the intermediate section), allowing a low-inductance connection to the first surface or to components or connection elements on the connection surfaces.

[0035] A group of connection elements is preferably provided on each of the first surface, on the connection surfaces and in the second strip section (i.e. on the second surface). The group of connection elements on the first surface is preferably located in the first strip section and thus along the strip of the first surface which extends continuously in the first direction. Each group of connection elements preferably has a plurality of connection elements which are arranged next to one another (at a distance from one another) along the first direction. A group can also have a plurality of subgroups of connection elements, which are each arranged next to one another along a row in the direction of the first direction, wherein the rows are, however, offset from one another perpendicular to the first direction. The connection elements can be designed as a sintered pad, contact surface, soldering pad, welding surface, connection pin, connection plate piece or fastening hole.The connection elements in particular have flat sections that extend across the conductor track surface, resulting in a flat connection to the conductor track layer. Connection pins can be provided, which are, for example, pressed into the conductor track surface or fastened thereto (for example by welding, such as friction welding, or soldering, sintering, or the like). The connection elements are electrically conductive. Preferably, a supply line is used, in particular a connecting sheet piece, wherein the supply line has end sections that are fastened flatly across the conductor track surface. For each first surface, for each second surface, and for the connection surfaces, a plurality of end sections or contact points are preferably provided in order to distribute the connection of the supply lines. The contact points that belong to the same potential are preferably arranged in a row (spaced apart) along the first direction.In one example, the connection elements are designed as a mounting hole, for example to be connected by means of a screw or press fit pin connection or groove connection.

[0036] A group of connection elements is preferably defined as elements that are electrically connected to one another via the conductor layer and that are arranged one after the other, in particular, along the first direction or extend in this direction. If the second strip section or the second surface is provided for a positive DC voltage supply potential, and the connection surfaces are provided for a negative DC voltage supply potential, then a low inductance results solely from the proximity of the connection elements in question. In particular, the connection elements of the first surface can be assigned to a phase potential, whereby on one side on the first surface there are connection surfaces for the phase, and on the other side there are connection elements on the second strip section and on the connection surfaces that are assigned to DC voltage supply potentials.In this way, coupling of a clocked signal at the phase potential to the potentials of a supply voltage can be prevented or reduced. The connection elements of the phase potential are preferably located outside a region extending from the connection elements of the first supply potential to the connection elements of the second supply potential.

[0037] A semiconductor module with connection pads is preferably unpopulated. However, as mentioned above, the arrangement of the connection pads results in a low-inductance connection option and a generally low-inductance layout.

[0038] One embodiment provides that the group of connection elements located on the first surface is provided in the intermediate section. In other words, in these embodiments, the group of connection elements located on the first surface is located on the connecting surface sections. This results in a current path for these connection elements to the mounting surfaces on the first surface that is approximately as long as the current path to the mounting surfaces (for transistors) on the second surface. Due to this symmetry, improved

[0039] Signal properties, particularly for edges with a high slew rate, and also related to the resistance of the connection of the mounting surfaces / transistors. One embodiment provides that the group of connection elements located on the first surface is located midway between a row of mounting surfaces in the first strip section and a row of mounting surfaces in the second strip section. The deviation from this center is preferably no more than 20, 15, 10, or 5 mm.

[0040] First connectors preferably extend from the connection surfaces. These extend in particular into the first strip section. The connectors are preferably located on the upper side of the carrier or above the conductor track layer. The connectors extend from a region of the connection surfaces which faces the first strip section. The connectors extend into the first strip section and can be connected there to contact surfaces. These contact surfaces can be parts of the first surface, but can also be designed for the application of components. In particular, one end of the connectors which is opposite the connection surfaces is designed for physical connection to a contact surface of a component. A first connector can extend from a connection surface and extend into the first strip section (or(across a half-space above it), or multiple connectors are connected to the same pad and extend to different locations on the first strip section. This allows multiple elements in the strip section to be connected to the same pad.

[0041] Further embodiments provide that the half-bridge module has second connectors that are connected to the connecting surface sections. The second connectors extend from these connecting surface sections across the carrier into the second strip section. Starting from the connecting surface sections, the second connectors extend into the second strip section in a half-space above the carrier or the conductor layer. The second connectors have ends that are located opposite the connecting surface sections and that are configured to be connected to elements in the second strip section, for example to contact points of the strip section or preferably to contact surfaces that are designed to connect components in the second strip section, for example metallization surfaces of components.A plurality of second connectors may extend from a connecting surface section into the second strip section.

[0042] The connectors are designed, in particular, as bonding wires or bonding strips and can be made of a conductive material such as copper or aluminum. In particular, the second connectors are connected to the connecting surface sections in an area adjacent to the second strip section. The connectors can be designed as one-piece or multi-piece components, in particular with end contact elements and a conductor that connects these end contact elements to one another. The end contact elements can be designed, for example, as pins, screw elements, connecting plate pieces, or even bonded conductor ends.

[0043] The half-bridge module can be provided as a partially populated, populated, or unpopulated module. In particular, the half-bridge module can be populated with surface-mounted components, i.e., with SMD components. The half-bridge module, as a populated half-bridge module, can be populated with first and second transistors. The first surface of the conductor layer, which is located in the first strip section, can be populated with the first transistors. In other words, the first transistors are provided on the surface section of the first surface that is located in the first strip section, i.e., in the section in which it is continuous along the first direction. The second surface, which extends in the second strip section, can be populated with the second transistors.Since these strip sections are intended for assembling transistors in unpopulated half-bridge modules, and in populated half-bridge modules, the strip sections are populated with transistors, these can also be referred to as the first and second transistor strip sections. In addition to assembly using SMD technology, assembly using through-hole or embedded technology is also possible.

[0044] The transistors each have first power path contact surfaces that face the conductor track. The first power path contact surfaces are connected to the first surface. These contact surfaces are contact surfaces of the transistor and are thus connected to the emitter, the collector, the source, or the drain of the transistors. The transistors further have second power path contact surfaces that face away from the first contact surfaces. The second contact surfaces are thus accessible from above when the transistors are mounted and, in particular, form a surface above the conductor track layer. However, the first contact surfaces are not accessible from above when the transistor is mounted because they face the conductor track layer and are thus covered by the transistor itself.

[0045] The second power path contact pads are also contact pads connected to a collector, emitter, drain, or source of the transistors. The first and second contact pads are connected to different electrodes of the transistor. The first contact pads can thus be connected to the collector, while the second contact pads are connected to the emitter, or vice versa. The first contact pads can be connected to the source of the transistor, while the second contact pads are connected to the drain, or vice versa.

[0046] The second contact pads are connected via connectors, in particular via the connectors described herein. The second contact pads of the first transistors, which are provided on the first pad, are connected to the connection pads (in the intermediate section of the conductor layer). The second contact pads of the second transistors are connected to connection pad sections. This connection is direct and leads in particular via first and second connectors. The connectors extend over the carrier. The first connectors, which connect the connection pads to the contact pads of the first transistors, extend from the connection pads into the first strip section, in particular onto the contact pads of the first transistors. The connectors, which are connected to the connection pad sections, extend to the contact pads of the second transistors, which connect in the second strip section.The connectors create a conductive connection between the contact pads of the transistors and the connection pads or connecting pad sections. The connectors can be directly adjacent to the contact pads, or there can be a connecting layer between the contact pads and the connectors, such as a sintered layer, a solder interlayer, and / or a conductive buffer layer to reduce mechanical stresses. The contact pads (= metallization pads) described above are power path contact pads.

[0047] The transistors may further comprise signal contact areas, which are referred to as such herein. Preferably, the half-bridge module, in assembled form, comprises a half-bridge formed by a low-side transistor element and a high-side transistor element, as well as an internal connection between the transistor elements. Each transistor element of the half-bridge is preferably formed by a plurality of transistors connected in parallel. Connecting the transistors in parallel results in a multiple of the current-carrying capacity for the resulting transistor element. The internal connection comprises the first area or at least partial areas thereof. The internal connection leads, in particular, via the connecting area sections. The internal connection may further comprise connectors, in particular connectors that extend from the connecting area sections into the second strip section.

[0048] Embodiments provide that the internal connection between the transistor elements leads from the first contact surfaces of the first transistors to the first surface, in particular to sections of the first surface that extend in the first strip section, wherein from there the first surface continues to the connecting surface sections. The internal connection is continued from the connecting surface sections (i.e. from the first surface) by means of connectors that lead to second contact surfaces of the second transistors. Starting from the first transistors or from their contact surfaces, a part of the internal connection thus extends along a surface section of the first surface that is located in the first strip section, wherein the internal connection is continued from there through the connecting surface sections that also belong to the first surface and that are located in the intermediate section.

[0049] Because the connecting surface sections abut the second surface or the second strip section, only short distances result for the connectors that continue the internal connection from the connecting surface sections to the second transistors. The internal connection can further comprise connecting elements located on the contact surfaces of the transistors, for example solder layers, solder mediation layers, sintered layers and / or conductive buffer layers to reduce mechanical stress. Although the first transistors and the second transistors are located on strip sections between which the intermediate section is located, the connecting surface sections that protrude from the first strip section to the second strip section result in a short and highly conductive connection (as part of the internal connection), which is provided by the conductor track layer.The two opposite ends of the half-bridge are preferably formed by the connection pads on the one hand and the second surface (in the second strip section) on the other. The connection pads and the second surface can each have power contact pads (or other connection elements), for example, to apply a DC supply voltage to them. In particular, the connection pads form a connection for a negative supply potential, and the second surface forms a connection for a negative DC supply potential. The power contact pads provided on the connection pads can form the negative connection for the half-bridge. The power contact pads provided on the second surface can form the positive connection for the half-bridge.The power contact pads provided on the first surface may form the phase connection for the half-bridge (and be connected to its internal connection).

[0050] The first surface can serve as a connection point for a phase potential or alternating current potential. In particular, the first surface can serve as a load connection.

[0051] The transistors can each have at least one signal contact surface. The signal contact surfaces of the first transistors are preferably provided on a side of the transistors that faces away from the intermediate section, i.e., that faces outward toward a longitudinal edge (relative to the first direction). The signal contact surfaces of the second transistors are preferably provided on a side of the second transistors that faces away from the intermediate section, i.e., that faces a second longitudinal edge that is opposite the first longitudinal edge. This allows the signal contact surfaces to be contacted from the outside via a short path. The signal contact surfaces are, in particular, control signal contact surfaces, such as gate contacts or base contacts. Furthermore, the signal contact surfaces can serve as monitoring signal connections, such as temperature signal connections or current measuring connections.The half-bridge module can further comprise a filter circuit (in unpopulated, partially populated, or fully populated form). In particular, the half-bridge module is equipped with a filter circuit that shorts high-frequency signal components. The filter circuit can be designed as a snubber filter. The filter circuit can be arranged in the second transistor strip section, in particular on the second surface. Furthermore, the filter circuit can be arranged on the connection surfaces. In addition, a filter circuit can be provided that has at least one component on the second surface or in the second strip section, as well as at least one component on the connection surfaces (or the connecting surface sections).

[0052] The half-bridge module is, in particular, a half-bridge module of an inverter module, wherein an inverter module comprises several half-bridge modules. The inverter module can be designed as a vehicle traction inverter. The half-bridge module is, in particular, a high-voltage module with a nominal voltage of more than 60 V or of at least 200 V, 400 V, or 800 V. In addition, a vehicle-mounted charging circuit with a power factor correction filter can be provided, which has at least one of the half-bridge modules. Finally, a vehicle-mounted, clocked DC-DC converter can be provided, the operating switches of which are preceded by the half-bridge module.

[0053] Figures 1, 2a-c and 3 serve to explain exemplary embodiments of the half-bridge module in more detail.

[0054] Figure 1 shows a schematic plan view of a half-bridge module M with a carrier T on which a conductor track layer is located. The conductor track layer is structured into several areas F1, F2, i.e. divided from an electrical point of view, and is geometrically and functionally divided into several sections LA, ZA, HA for the purpose of a more detailed description below. The sections used to geometrically subdivide the conductor track layer are a first strip section LA, a second strip section HA and an intermediate section located between the strip sections. In the example shown, the strip sections directly border on the intermediate section. Thus, the entire surface or conductor track layer shown is divided into the two strip sections and the intermediate section with the reference symbols LA, HA and ZA. The intermediate section ZA also has a strip shape. The sections are aligned with one another perpendicular to the first direction R1.

[0055] The strip sections LA, HA and the intermediate section ZA are shown in the form of (rectangular) strips that extend along a first direction R1 with its longer dimension. A second direction runs perpendicular to the direction R1 in the plane of the drawing, along which the first strip section LA, the intermediate section ZA and the second strip section HA (in this order) are arranged one after the other. The direction R1 extends along the length of the rectangular support shown, while the direction R2 extends in the width (i.e. along the shorter dimension of the rectangle). The entire surface or upper side of the support is divided into the sections LA, HA and ZA. A support can also be provided which, in addition to at least one further region, has a power region divided into the sections LA, ZA and HA.

[0056] The first surface F1 extends, on the one hand, in the first strip section LA, wherein the surface F1 essentially completely fills this strip section in Figure 1. The surface F1 further extends into the intermediate section ZA and forms connecting surface sections VF. While in the first strip section the first surface is continuous (in particular in the direction R1), the first surface is repeatedly interrupted in the direction R1 within the intermediate section ZA (by insulated connection surfaces P). This results in a plurality of connecting surface sections VF which belong to the first surface F1 and which branch off from the continuous surface area of ​​the surface F1 in the first strip section.Other embodiments provide a two-part first surface, with a first part in the section LA and second parts (as connecting surface sections VF) in the section ZA, wherein the first part and the second part are connected via connecting elements, but together belong to the same conductor track surface.

[0057] In the intermediate section ZA, there also extend connection surfaces P which are electrically separated from the first surface (i.e. also from the connection surface sections VF) (i.e. they can assume different potentials). In Figure 1, the connection surfaces P alternate with the connection surface sections VF along the direction R1. The connection surface sections VF extend from the first strip section LA to the second strip section HA and border on the second strip section HA. The connection surfaces P also extend into the intermediate section ZA from the first strip section LA to the second strip section HA (and are electrically separated from the surface F2 in the intermediate section ZA in the conductor track surface). The extension of the connection surfaces P in the intermediate section ZA from the first strip section LA to the second strip section HA is perpendicular to the direction R1 (and along the carrier T).

[0058] The first surface F1 and the connection surfaces P are insulated from the second surface F2. There is a gap L between the intermediate section ZA and the second strip section HA. The gap electrically separates the second surface (and thus the second strip section) from the first surface F or from its connection surface sections VF as well as from the connection surfaces P. The gap L is shown in the form of a trench that runs along the direction R1. The conductor track layer is completely severed in its thickness along the trench. The connection surfaces P are also insulated from the first surface F1 in that the conductor track layer has a gap that runs along a large part of the outer edge of the connection surfaces P. The connection surfaces are therefore insulated from the connection surface sections VF and from the surface area of ​​the first surface F1 that extends in the first strip section LA by means of a trench.Compared to the second surface F2, the connection surfaces P (and also the first surface or its connecting surface sections VF) are separated by the illustrated gap L. This separation creates the electrical insulation of the second surface F2 from the first surface F1, as well as the electrical insulation of the second surface F2 from the connection surfaces P. For this purpose, the carrier T has an insulator layer on which the conductor track layer is formed.

[0059] The conductor layer is therefore structured by the described trenches or gaps. The trenches or gaps define the layout of the conductor layer. According to another perspective, the surfaces or their outer edges of the conductor layer define the layout of the conductor layer or the half-bridge module.

[0060] The connection surfaces P have a substantially rectangular cross-section in schematic Figure 1. This also applies to the connection surface sections VF. However, this is one of many possibilities and is intended only to schematically illustrate that the connection surface sections VF and the connection surfaces P together essentially completely fill the intermediate section ZA, that the connection surface sections VF and the connection surfaces P extend essentially as far as the second surface F2 or as far as the second strip section HA, and that the connection surface sections VF and the connection surfaces P can thus be contacted from the second surface F2 using short connectors V'.

[0061] Figures 2a-2c schematically show some further embodiments of the geometric design of the connection surfaces P or the connecting surface sections VF.

[0062] The embodiment of a half-bridge module M shown in Figure 1 is a populated half-bridge module with first transistors LT and second transistors HT. The first transistors LT are provided on the first surface F1 in the first strip section LA. The first transistors are thus mounted on a partial area of ​​the first surface F1 that is continuous along the direction R1 (or that is located in the first strip section LA). The connecting surface sections VF extend from this continuous surface area of ​​the first surface F1 toward the second strip section HA.

[0063] The second transistors HT are accommodated on the second surface F2 and thus in the second strip section HA. The second transistors HT are arranged in a row at regular intervals along the direction R1. The first transistors LT are also arranged in a row at regular intervals on the first surface F1 (in the first strip section LA) along the first direction R1. This results in two rows of transistors which are located on opposite edge regions (i.e. in the separate first and second strip sections LA, HA) of the carrier T or the conductor track surface. The connecting surface sections VF or the connection surfaces P extend between the first transistors on the one hand and the second transistors on the other. In other words, the second strip section extends between the rows of transistors LT, HT, with the surfaces or surface sections provided there serving to connect the transistors.

[0064] Within the conductor layer, the connection pads P are electrically insulated from the first surface F1 (and also from the second surface F2). However, there are connectors V that connect the connection pads P to the transistors LT. A variant is shown in which a connection pad is connected to several transistors (here: two) via several connectors V (two are shown). For this purpose, each transistor LT has a power path contact pad OK, from which the connector V extends to the connection pad P. The power path contact pads OK are in particular metallization layers of the transistor LT and relate to a power connection of the transistor (drain, source, emitter or collector). The connectors V can in particular be wires, sheet metal pieces, conductive bridge elements, bonding ribbons or bonding strips, for example made of an aluminum material or a copper material or another electrically conductive material.It is shown that the larger connection pads P (in Figure 1, the three left-hand connection pads P) are each connected to two transistors or two contact pads OK. One connection pad P is smaller, namely the rightmost connection pad, and is connected to only one transistor LT. The connection pads P can thus be connected to a different number of transistors simultaneously, whereby the connection pads P can also be of different sizes.

[0065] The same applies to the connection surface section VF, which, as shown in Figure 1, can have different widths (dimensions in the direction R1). The connection surface section VF shown furthest to the left is less wide than the connection surface sections VF following it to the right. Here, too, the connection surface sections VF are connected to different numbers of transistors LT. The three larger connection surface sections are connected to two transistors LT, while the narrower connection surface section VF on the left is connected to only one transistor LT. Despite the different numbers or surface sizes or widths, however, there is no asymmetry from an electrical point of view. The second transistors HT also each have power path contact surfaces OK'. These can be designed like the power surfaces power contact surfaces OK.The connecting surface sections VF are connected via respective connectors V to corresponding contact surfaces OK' of the transistors HT.

[0066] Each transistor LT is connected to one of the illustrated pads P. Each transistor LT is connected to one of the illustrated connection pad sections VF. However, additional connection pad sections or pads may be provided that do not have a connection to a transistor, i.e., no connection leading via a connector V, V.

[0067] Figure 1 shows a plurality of groups of connection elements 1, 2, 3. The first group of connection elements 1 is located on the connecting surface sections VF. In general, the group of connection elements 1 is located on the first surface F1. Therefore, embodiments can also be provided in which the first group of connection elements 1 is not provided in the intermediate section ZA on the first surface F1 as shown, but is provided in the first strip section LA on the first surface F1. In other words, the connection elements can also be located on the surface region of the first surface F1 that is continuous in the direction R1, i.e. that is located in the first strip section LA. Therefore, two possibilities for arranging the first group of connection elements 1 can be placed.It is therefore possible to arrange a group of first connection elements 1 as shown on the connection surface sections VF, or, as shown with the reference symbol T, to place the first connection elements in an edge region of the first strip section LA which faces away from the intermediate section ZA. Thus, a group of first connection elements 1' is shown which are arranged between the transistors LT of the first strip section LA. The group of first connection elements 1 or also of the first connection elements T comprises connection elements which are distributed along the direction R1 (and spaced from one another). As a result, the potential of the first surface can be connected at several points to a (first) connecting conductor which carries the potential of the first surface F1. This is in particular a phase potential ora load potential and corresponds electrically to the potential of the inner connection of the half-bridge.

[0068] Furthermore, a group of second connection elements 2 is shown. Each connection surface P shown has (at least) one connection element 2. The connection elements 2 are intended to be connected to the same (second) connecting conductor, i.e., they are connected to one another via this. The second connection elements are intended to carry the same potential, in particular a DC supply potential (for example, a negative supply potential). The group of second connection elements 2 is located on the connection surfaces P and thus in the intermediate section ZA.

[0069] In the illustrated embodiments, the group of first connection elements 1 and the group of second connection elements 2 are provided in two rows extending along the direction R1 and located in the intermediate section ZA. The use of connection elements arranged as shown by the reference symbol 1 allows connection paths to the various transistors LT, HT that are approximately the same length. The connection elements shown by the reference symbol T enable connection to the first surface F1 at locations facing away from the second strip section. Furthermore, these locations are spaced from the connection surfaces P and the connection elements 2 by at least half the width of the first strip section.

[0070] A group of third connecting elements 3 is provided in the second strip section HA, i.e., on the second surface F2. These connecting elements are also arranged along a row extending in the direction R1. In general, the various groups of connecting elements 1, 1', 2, and 3 can each be provided in several rows, which are offset from one another approximately perpendicular to the direction R1 (in particular along the support T).

[0071] Connectors V are shown which connect the contact surfaces OK of the transistors LT with the connection surfaces P. In the same way, connectors V are shown which connect the connection surface sections VF with contact surfaces OK' of the transistors HT. If the half-bridge module M is not populated with the transistors, then the layout alone allows the connectors V, V to be designed accordingly short and to extend from the connection surface sections VF or the connection surfaces P into the strip sections LA, HA. In an unpopulated embodiment, at the locations where a transistor is shown in Figure 1, there are mounting surfaces for transistors or connection elements for transistors, such as conductive connection elements or the like.

[0072] Figure 1 shows a populated half-bridge module M with transistors that, in addition to the power contact pads OK, OK', have signal contacts SK. The transistors shown each have two signal contacts. These can be configured as a gate terminal, a Kelvin terminal (temperature signal terminal), or a sense terminal (current detection terminal). Transistors with three signal contact pads SK, SK' or just one signal contact pad SK, SK' can also be provided.

[0073] Since in the layout of the conductor layer shown in Figure 1 both the connection areas P and the connecting surface sections VF extend between the two strip sections LA, HA, direct and short connection paths are obtained for both transistors in the first strip section LA and transistors in the second strip section HA, thus creating a half-bridge. The transistors LT shown are connected in parallel. This also applies to the transistors HT in the second strip section HA. The parallel connection results from the fact that the first transistors LT are mounted on the same first surface F1, and from the fact that the second transistors HT are all mounted on the second surface F2.Furthermore, the parallel connection of the first transistors LT results from the fact that a connecting conductor (also referred to as a connecting conductor) or a short-circuiting connection (not shown) contacts the connecting surfaces P together, thereby short-circuiting them. Furthermore, the parallel connection of the second transistors HT results from the fact that they are each connected (via connector V) to the first surface F1 or to connecting surface sections VF, which converge in the first strip section, since surface 1 is continuous there.

[0074] The connection elements 2 are, in particular, connection elements for a negative potential, and the connection elements 3 are connections for a positive potential. These two potentials are potentials of a DC supply voltage. The connection elements 1 form connections for the potential of the connection point or the internal connection between the two transistor elements of the illustrated half-bridge module, which result from the various transistor groups. The potential of the connection elements 1 can serve as a load connection or as a phase connection, for example for an electrical machine. This also applies to the connection elements 1'. A first connection conductor can be provided, which is connected to the first connection elements 1. The first connection conductor can be a phase connection of the half-bridge module. A second connection conductor can be provided, which is connected to the second connection elements 2.The second connection conductor can be a negative supply potential conductor of the half-bridge module. A third connection conductor can be provided, which is connected to the third connection elements 3. The third connection conductor can be a positive supply potential conductor of the half-bridge module.

[0075] Filter circuits can be provided, such as snubbers, which can be arranged, for example, at the locations marked with a cross. These locations are in an edge region of the second surface that borders the intermediate section (or the connection surfaces P). For example, the filter circuits can each be designed as an SMD component that is mounted on the second surface F2. Furthermore, the filter circuits can also be connected to the connection surfaces by means of a bonding connection. If the filter circuit has a surface contact, the bonding connection can extend from the connection surface P opposite the filter circuit to the surface contact. Such an SMD component also has a further contact surface with which it is mounted on the second surface.The filter circuit can also be located on a connection surface P in an edge region of the connection surface P which is adjacent to the second surface.

[0076] Figures 2a, b and c show further geometric embodiments for illustrating the connection surfaces P and the connecting surface sections VF. The respective surfaces F1 of Figures 2a - 2c correspond to the first surface F1 within the first strip section LA and within the surface area of ​​the first surface F1 that forms the connecting surface sections. A first partial area of ​​the first surface F1 lies in the first strip section LA and is continuous in the direction R1. From this, the connecting surface sections VF extend to the second strip section HA and to the second surface F2. Connection surfaces P are provided in the intermediate section, which is located between the first surface area of ​​the surface F1 and the second surface F2.It is schematically shown that the connecting surface sections VF and the connection surfaces P essentially completely cover the intermediate section (also with a part of the conductor track layer), with only gaps between the connecting surface sections VF and the connection surfaces P interrupting the otherwise continuous conductor track layer.

[0077] In Figure 2a, the connection surface P has a first region which borders on the continuous partial region of the first surface F1 and which is essentially rectangular, followed by a tapered section in the direction of the second surface F2. A taper in the shape of a trapezoid is shown. In the direction of the second surface F2, there follows a further partial region which, like the first partial region, is rectangular but narrower than it. The connecting surface section VF, which is shown in Figure 2, is designed to be complementary to this. Starting from a partial region of the first surface F1, which lies in the first strip section, the connecting surface section VF shown extends in the direction of the second surface F2 essentially in the shape of a rectangle, followed by a widening section.Adjacent to this, in turn, in the direction of the second surface F2, is a similarly rectangular sub-area, but wider than the first-mentioned sub-area. Figure 2a thus shows an isolated connection surface P in the shape of a trapezoid, to which rectangles of different sizes adjoin in a direction perpendicular to the parallel pairs of sides of the trapezoid.

[0078] Figure 2b shows a further embodiment of an insulated connection surface P. This has a first rectangular partial area, which is adjoined by a trapezoidal shape in the direction of the second surface F2. As in Figure 2a, in Figure 2b the respective adjacent connecting surface section VF is designed to be complementary to the connection surface P. The adjoining trapezoidal shape, which tapers towards the second surface F2, borders the second surface F2.

[0079] Figure 2c shows another embodiment with a trapezoidal

[0080] Connection surface P, whose wider side of the parallel side pair of the trapezoid borders the surface section of the first surface F1 located in the first strip section, whereas the shorter side of the parallel side pair of the trapezoid borders the second surface F2 (but is not in contact with it). Here, too, it can be seen that the connecting surface sections VF can generally be designed to be complementary to the connection surfaces P.

[0081] A trench between the connection surfaces P and the connecting surface sections VF runs around a large part of the connection surfaces P and preferably has a substantially constant width along its length. A trench is also provided between the second surface F2 on the one hand and the connecting surface sections VF and the connection surfaces P on the other. This trench can also have a constant width in the direction of its length. The two previously mentioned trenches completely enclose the connection surfaces P, so that the electrical insulation created by the trenches within the conductor track layer means that the connection surfaces P are electrical islands in the conductor track layer, i.e. they are insulated (from surrounding areas) within the structured conductor track layer. In addition to conductive surfaces, the conductor track layer also includes structures that provide an electrical interruption within the conductor track layer.

[0082] Figure 3 shows an alternative embodiment of a filter circuit with a capacitor component C and a resistor component R. Between the second surface F2 and the connection surface P there is an intermediate island ZI, which is separated from the second surface F2 as well as from the connection surfaces P and also from the first surface or from the connecting surface sections VF by a trench. The intermediate island ZI is a conductive surface that is insulated from the adjacent regions of the conductor layer. The intermediate island ZI is located in an edge region of the second strip section HA that faces the intermediate section ZA, in an edge region of the intermediate section ZA that faces the second strip section HA, or in a region that includes both edge regions. The resistor R bridges the trench between the second surface F2 and the intermediate island ZI, starting from the second surface F2.In other words, the resistor R connects the second surface F2 to the intermediate pad. The intermediate pad ZI is further connected to the connection pad P via the capacitor C, with the capacitor C bridging the gap between the intermediate pad and the connection pad. The capacitor and the resistor can also be interchanged. This results in a series RC element, via which the second surface F2 is connected to the connection pad P. The RC element thus connects the module's two DC supply potentials as a high-pass filter.

[0083] The filter circuit shown in Figure 3 can be arranged, in particular, at or above the locations marked with a cross in Figure 1. The intermediate island is formed as part of the conductor layer. Similarly, the second surface, the first surface, and the connection surface form parts of the conductor layer, but are separated from each other (within the conductor layer).

Claims

Patent claims 1. Half-bridge module (M) with a carrier (T) having a conductor layer having a first transistor strip section (LA), a second transistor strip section (HA) and an intermediate section (ZA), each extending along a first direction (R1), wherein the intermediate section (ZA) is arranged between the first transistor strip section (LA) and the second transistor strip section (HA), and wherein in the intermediate section (ZA) connecting surface sections (VF) of a first surface (F1), which also extends into the first transistor strip section (LA), and connecting surfaces (P) isolated from it in the first direction (R1) alternate.

2. Half-bridge module (M) according to claim 1, wherein the connecting surface sections (VF) are adjacent to and insulated from the second transistor strip section (LA) and / or wherein the connection surfaces (P) are adjacent to the first transistor strip section (LA).

3. Half-bridge module (M) according to claim 1 or 2, wherein the connecting surface sections (VF) widen towards the second transistor strip section (HA) and / or wherein the connection surfaces (P) taper towards the second transistor strip section (HA).

4. Half-bridge module (M) according to claim 1, 2 or 3, wherein the first surface in the first transistor strip section (LA) extends as a continuous strip in the first direction (R1), wherein the connecting surface sections (VF) extend from this continuous strip to the second transistor strip section (HA).

5. Half-bridge module (M) according to one of the preceding claims, wherein in the second transistor strip section (HA) a second area (F2) extends which is insulated from the first area (F1 ) and from the terminal areas (P) and has mounting areas for transistors (HT) which extend in one or more rows along the first direction (R1 ).

6. Half-bridge module (M) according to one of the preceding claims, wherein the first surface (F1 ) in the first transistor strip section (LA) has mounting surfaces for transistors (HT) extending in one or more rows along the first direction (R1 ).

7. Half-bridge module (M) according to one of the preceding claims, wherein a group of connection elements (1 , 2, 3) are provided on the first surface (F1 ), on the connection surfaces (P) and in the second transistor strip section (HA), which are designed as a sintered pad, solder pad, weldable surface, connection pin, connection plate piece or mounting hole.

8. Half-bridge module (M) according to claim 7, wherein the group of terminal elements (1) located on the first surface (F1) is provided in the intermediate section (ZA) or is located with a deviation in the middle between a series of transistor mounting surfaces in the first transistor strip section (LA) and a series of transistor mounting surfaces in the second transistor strip section (LA), wherein the deviation is not more than 20 mm, 15 mm, 10 mm or 5 mm.

9. Half-bridge module (M) according to one of the preceding claims, comprising first connectors (V) connected to the terminal pads (P) and extending from these terminal pads (P) over the carrier (T) into the first transistor strip section (LA), and the half-bridge module (M) further comprising second connectors (V') connected to the are connected to the connecting surface sections (VF), and extend from these connecting surface sections (VF) over the carrier (T) into the second transistor strip section (HA).

10. Half-bridge module (M) according to one of the preceding claims, which is equipped with first and second transistors (LT, HT), wherein the first area (F1 ) of the conductor layer in the first transistor strip section (LA) is equipped with the first transistors (LT) and a second area (F2) extending into the second transistor strip section (HA) is equipped with the second transistors (HT).

11. Half-bridge module (M) according to claim 10, wherein first power path contact surfaces of the first transistors (LT) are connected to the first surface (F1), first power path contact surfaces of the second transistors (HT) are connected to the second surface (F2), second power path contact surfaces (OK) of the first transistors (LT) are connected to the terminal surfaces (P) via first connectors (V) extending over the carrier (T), and second power path contact surfaces (OK') of the second transistors (HT) are connected to the connecting surface sections (VF) via second connectors (V') extending over the carrier (T).

12. Half-bridge module (M) according to claim 10 or 11, comprising a half-bridge with a low-side transistor element, a high-side transistor element and an internal connection between the transistor elements, wherein the low-side transistor element is formed by the first transistors (LT), the high-side transistor element is formed by the second transistors (HT), and the internal connection comprises the first surface (F1 ).

13. Half-bridge module (M) according to claim 10, 11 or 12, wherein the first and second transistors (LT, HT) each have signal contact pads (SK, SK'), wherein the signal contact pads (SK) of the first transistors (LT) are provided on a side of the first transistors (LT) facing away from the intermediate section (ZA), and the signal contact pads (SK') of the second transistors (LT) are provided on a side of the second transistors (LT) facing away from the intermediate section (ZA). Half-bridge module according to one of the preceding claims, which is equipped with at least one filter circuit (Fl; C, R), wherein the at least one filter circuit (Fl; C, R) is arranged in the second transistor strip section (HA) and / or on the connection pads (P).

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