System for use in a ventilation device and ventilation device

Abstract

The invention relates to a system 100 for use in a ventilation device, the system comprising: (i) a heating element 110 configured to heat air flowing from an inlet side of the heating element in a flow direction (S) to an outlet side of the heating element, (ii) a circuit board element 120 aligned along the flow direction and configured to support electronic components at least on a first side of the circuit board element, the first side of the circuit board element facing the heating element, (iii) at least one triac component 121, 122 arranged on the first side of the circuit board element and electrically connected to the heating element, and (iv) a cooling element 130 arranged along the circuit board element on the first side of the circuit board element and at least largely covering the first side of the circuit board element,wherein the cooling element is positioned between the circuit board element and the heating element in such a way that the cooling element projects beyond the heating element in the opposite direction to the flow direction.

Description

[0001] The present invention relates to the field of ventilation devices and, in particular, to a system for use in a ventilation device.

[0002] Ventilation units are used for room ventilation in buildings and enable the control of supply air into the building and exhaust air from the building, whereby the air is typically filtered and / or heat is recovered.

[0003] Heating elements are typically used in ventilation units in the outside air flow area to preheat the cold air to a certain level, especially in winter. This ensures that the heat exchanger remains ice-free and prevents damage to the heat exchanger due to ice formation.

[0004] In order to efficiently control the heating element and adjust it to the ambient conditions (outside air temperature, volume flow, etc.), a triac component is usually used.

[0005] There is also increasing demand for ventilation units that provide ever-increasing airflow volumes. This requires increased heating element power to reliably heat the larger air volume. The greater the power of the holding element, the more waste heat the triac component emits, and therefore requires active or passive cooling.

[0006] Passive heat dissipation from the triac component can cause problems in the intended electronics compartment if the triac component is enclosed. In this case, additional fans would be required to cool the triac component. These fans would significantly increase device noise and manufacturing costs.

[0007] An object underlying the present invention is to provide a powerful heating element for a ventilation device and at the same time to ensure a simple structure of the ventilation device.

[0008] According to a first aspect of the invention, a system is proposed as defined in claim 1, namely a system for use in a ventilation device, the system comprising: (i) a heating element configured to heat air flowing from an inlet side of the heating element in a flow direction to an outlet side of the heating element, (ii) a circuit board element aligned along the flow direction and configured to support electronic components at least on a first side of the circuit board element, the first side of the circuit board element facing the heating element, (iii) at least one triac component arranged on the first side of the circuit board element and electrically connected to the heating element, and (iv) a cooling element arranged along the circuit board element on the first side of the circuit board element and at least largely covering the first side of the circuit board element,wherein the cooling element is positioned between the circuit board element and the heating element such that the cooling element is arranged parallel to the flow direction.,

[0009] The system according to the invention enables reliable cooling for at least one triac component, so that a more powerful heating element can be provided in a ventilation unit while ensuring a simple design of the ventilation unit.

[0010] The system is designed and configured for use in a ventilation unit.

[0011] The system comprises a heating element, wherein the heating element is configured to heat air flowing from an inlet side of the heating element in a flow direction to an outlet side of the heating element. The heating element preferably comprises openings between the inlet side of the heating element and the outlet side of the heating element, so that air can flow through the openings of the heating element from the inlet side of the heating element to the outlet side of the heating element. The air to be heated is to be understood in particular as an air stream.

[0012] The heating element is preferably cuboid-shaped, with the heating element more preferably having a grid-like structure. In particular, the heating element is designed to be electrically heated, i.e., the heating element is designed to convert electrical energy into thermal energy.

[0013] The system further comprises a circuit board element, wherein the circuit board element is aligned along the flow direction. The circuit board element is preferably plate-shaped and has a first side and a second side. The circuit board element is further configured to support electronic components on at least a first side of the circuit board element. Electronic components can comprise any components provided for operating the heating element and / or for operating other components of the ventilation device. In particular, the electronic components on the first side of the circuit board element comprise at least one triac component.

[0014] The first side of the circuit board element faces the heating element. "Facing" here means that the heating element is arranged at least largely on the first side of the circuit board element. A perpendicular line perpendicular to the first side of the circuit board element does not necessarily have to be directed toward the heating element, nor does the heating element have to be arranged entirely on the first side of the circuit board element.

[0015] The system further comprises at least one triac component. The triac component is arranged on the first side of the circuit board element. In particular, the triac component is provided and configured to operate the heating element. The triac component is then electrically connected to the heating element. However, for the invention, it is not necessary for the triac component to be provided and configured to operate the heating element. Alternatively, the triac component can also be provided and configured to operate other components of the ventilation unit.

[0016] The system further comprises a cooling element, wherein the cooling element is arranged along the circuit board element on the first side of the circuit board element. The cooling element is preferably plate-shaped and has a first side and a second side. The cooling element is designed to cover the first side of the circuit board element at least largely, preferably completely. "Covering" here means that the cooling element is designed to at least largely enclose the first side of the circuit board element. The cooling element is thus designed to at least largely, preferably completely, protect the first side of the circuit board element from external influences. The cooling element can thus preferably be understood as a housing element of the first side of the circuit board element. In particular, the second side of the cooling element faces the first side of the circuit board element. Then, the first side of the cooling element faces the heating element.Preferably, the cooling element is directly connected to the circuit board element and thus held to the cooling element. The cooling element and the circuit board element are then designed to be connected to one another, for example, by gluing, plugging, screwing, locking, etc.

[0017] The cooling element is positioned between the circuit board element and the heating element such that the cooling element extends over the heating element parallel to the flow direction. This means that the system has an arrangement of the elements perpendicular to the flow direction in the following order: circuit board element, cooling element, heating element. The expansion of the cooling element along the flow direction is greater than the expansion of the heating element against the flow direction.

[0018] Before the air flows through the heating element and is heated by the heating element, the air can be used according to the invention to cool the cooling element and thus nearby components. Thus, the circuit board element, and in particular electronic components on the first side of the circuit board element, such as the triac component, are also cooled by the air before the air flows through the heating element. Additionally, the cooling element protects the circuit board element, in particular the first side of the circuit board element and the electronic components located thereon, from external influences.

[0019] In an advantageous embodiment of one aspect of the invention, the heating element is arranged substantially perpendicular to the circuit board element, and the cooling element is arranged substantially parallel to the circuit board element. "Substantially perpendicular" here means that the invention does not require the heating element and the circuit board element to be exactly perpendicular to one another. It is sufficient if the heating element and the circuit board element are tilted to one another, with the angle between the heating element and the circuit board element preferably occupying an angle in the range of 90°, for example, 90° ± 10°. "Substantially parallel" means that the invention does not require the circuit board element and the cooling element to be exactly parallel to one another.It is sufficient if the circuit board element and the cooling element run next to each other, whereby the angle between the cooling element and the circuit board element preferably takes an angle in the range of 0°, for example 0° ± 10°.

[0020] In a further advantageous embodiment of an aspect of the invention, the circuit board element and the cooling element are arranged relative to one another such that the triac component is in direct contact with the cooling element. "Direct contact" also exists if the triac component is in contact with the cooling element via a connecting element, such as a thermal paste.

[0021] In a further embodiment of an aspect of the invention, the system further comprises a first housing element configured to cover the heating element on the inlet side of the heating element. The first housing element is preferably a grid element. Furthermore, the first housing element is preferably arranged parallel to the heating element. Accordingly, in this embodiment, air flowing through the heating element first flows through the first housing element and then through the heating element.

[0022] Additionally or alternatively, the system further preferably comprises a second housing element which is designed to cover at least a second side of the circuit board element opposite the first side. In particular, in the case in which the circuit board element has electronic components on the second side, the second housing element is further designed to cover the electronic components on the second side of the circuit board element. In this embodiment, the second housing element and the cooling element can be understood as the housing of the circuit board element, which is designed to protect the circuit board element and in particular electrical components on the circuit board element from external influences. In particular, the second housing element and the cooling element are designed to protect the circuit board element, and in particular electronic components on the circuit board element, from external influences.In this embodiment, the circuit board element is then housed at least by the second housing element and the cooling element.

[0023] In a preferred variant of the above embodiment, the second housing element has at least one projection in the direction of the second side of the circuit board element. Furthermore, the second housing element and the circuit board element are preferably arranged relative to one another such that the projection is in direct contact with the circuit board element. Particularly preferably, the second housing element and the circuit board element are arranged relative to one another such that the projection exerts a predefined pressure on the circuit board element. This ensures that the circuit board element, and thus the triac component, is pressed onto the cooling element with the predefined pressure, thus allowing heat to be dissipated to the cooling element.

[0024] In a further embodiment of an aspect of the invention, the cooling element is a plate, which may have recesses, projections, locking means, etc. The plate is particularly preferably made of metal to ensure particularly good heat transfer. In one example, the plate is made of aluminum. Alternatively, only parts of the plate may be made of metal or aluminum.

[0025] The cooling element further preferably comprises beads. The beads can be understood as notches. In particular, the beads are preferably arranged on the second side of the cooling element, which is opposite the first side of the circuit board element.

[0026] In a preferred embodiment, the heating element and the circuit board element are connected to one another, in particular screwed, in such a way that the circuit board element is held to the heating element. In other words, the heating element and the circuit board element are connected to one another in such a way that the heating element is held to the circuit board element. In addition to or alternatively to a screw connection, the heating element and the circuit board element can also be latched, glued, or otherwise detachably or permanently connected to one another in order to be held against one another.

[0027] In a further preferred embodiment, the circuit board element has at least one wave-shaped opening for connection, in particular screwing, to the heating element. The wave-shaped openings have the advantage that the connection, in particular screwing, of the circuit board element to the heating element places little or no stress on the circuit board element, and in particular on the electronic components arranged on the first side and / or the second side of the circuit board element.

[0028] Additionally or alternatively, the circuit board element has at least one point-shaped opening for connection to a temperature safety element on the heating element. In particular, the temperature safety element can be included in the system according to the invention.

[0029] The invention further relates to a ventilation device with an outside air duct, wherein the outside air duct has an outside opening. The ventilation device comprises a heat exchanger, wherein the heat exchanger is connected to the outside air duct such that air passes through the outside opening into the outside air duct and to the heat exchanger. The ventilation device comprises a system according to the invention according to one of the above embodiments, wherein the system is arranged within the ventilation device such that the heating element is arranged in the outside air duct between the outside opening and the heat exchanger, and the circuit board element is arranged on the outside air duct. Here, "on the outside air duct" means that the circuit board element is arranged on a wall region of the outside air duct. Preferably, the circuit board element is arranged on the outside air duct such that the cooling element functions as a wall region of the outside air duct.

[0030] According to a second aspect of the invention, a method is proposed as defined in claim 11, namely a method for using a ventilation device, wherein the ventilation device has an outside air duct, wherein the outside air duct has an outside opening, and wherein a heating element is arranged in the outside air duct. The method according to the invention comprises the following steps: (i) heating an air flow flowing through the heating element by the heating element, (ii) prior to heating, cooling a cooling element via the air flow flowing through the outside air duct, (iii) cooling an electronic component via the cooling element, and (iv) covering the electronic component via the cooling element.

[0031] Preferably, the electronic component is a triac component. Furthermore, the method preferably comprises operating the heating element via the triac component.

[0032] Features of advantageous embodiments of the invention are defined in particular in the subclaims, wherein further advantageous features, embodiments and configurations can also be gathered from the above explanation and the following discussion by the person skilled in the art.

[0033] In the following, the present invention is further illustrated and explained with reference to exemplary embodiments shown in the figures. Fig. 1 is a schematic representation to illustrate a first embodiment of the system according to the invention, Fig. 2 is a schematic representation to illustrate the first embodiment of the system according to the invention from a different perspective, Fig. 3 is a schematic sectional view to illustrate the first embodiment of the system according to the invention, Fig. 4 is a schematic representation to illustrate at least part of the first embodiment of the system according to the invention from yet another perspective, Fig. 5 is a further schematic sectional view to illustrate the first embodiment of the system according to the invention, Fig. 6 is a schematic representation to illustrate a first embodiment of a circuit board element, and Fig. 7 is a schematic flow diagram of an embodiment of the method according to the invention.

[0034] In the accompanying drawings and the explanations to these drawings, corresponding or related elements are - where appropriate - identified by corresponding or similar reference numerals, even if they are found in different embodiments.

[0035] Fig. 1 shows a schematic representation to illustrate a first embodiment of the system 100 according to the invention. The system 100 is intended and configured for use in a ventilation device.

[0036] The system 100 has a heating element 110. In Fig. 1 In particular, a first housing element 140 can be seen, under which the heating element 110 is arranged. The heating element 110 is designed to heat air flowing from the inlet side of the heating element 110 in a flow direction S to an outlet side of the heating element 110. In Fig. 1 the flow direction S is shown from top to bottom.

[0037] The system 100 also has a circuit board element 120. In Fig. 1 In particular, a second housing element 150 can be seen, behind which the circuit board element 120 is arranged. The circuit board element 120 is aligned along the flow direction S. The circuit board element 120 is designed to support electronic components at least on a first side of the circuit board element 120. The first side of the circuit board element 120 faces the heating element 110.

[0038] The system 100 includes at least one triac component disposed on the first side of the circuit board element 120 and facing the heating element 110 and electrically connected to the heating element 110.

[0039] The system 100 further comprises a cooling element 130, which is arranged along the circuit board element 120 on the first side of the circuit board element 120 and at least largely covers the first side of the circuit board element 120. The cooling element 130 is thus arranged between the circuit board element 120 and the heating element 110, or between the triac component and the heating element 110. The cooling element 130 is positioned between the circuit board element 120 and the heating element 110 such that the cooling element 130 protrudes beyond the heating element 110 against the flow direction S. This is particularly true in Fig. 2 to recognize.

[0040] Fig. 2 shows a schematic representation to illustrate the first embodiment of the system according to the invention from a different perspective. In particular, Fig. 2 It can be seen that the cooling element 130 projects beyond the heating element 110 in the opposite direction to the flow direction S. In particular, the cooling element 130 also projects beyond the first housing element 140 in the opposite direction to the flow direction S. The cooling element 130 has a first side and a second side, wherein Fig. 2 at least a part of the first side of the cooling element 130, which faces the heating element 110, can be seen.

[0041] The cooling element 130 and the second housing element 150 can be understood as a closed housing for the circuit board element 120.

[0042] Fig. 3 shows a schematic sectional view to illustrate the first embodiment of the system 100 according to the invention. In particular, the sectional view shows the heating element 110, the circuit board element 120 and the cooling element 130, the first housing element 140 and the second housing element 150.

[0043] The heating element 110 is mechanically connected to the circuit board element 120 and is held on the circuit board element 120. Additionally or alternatively, the heating element 110 can also be connected to the cooling element 130 and held on the cooling element 130. In this case, the cooling element 130 is further connected to the circuit board element 120 and held on the circuit board element 120.

[0044] The cooling element 130 and the circuit board element 120 are shown (at least largely) spaced apart from each other, wherein the cooling element 130 and the circuit board element 120 have contact points, in particular through the one or more triac components (see Fig. 5 ).

[0045] Fig. 4 shows a schematic representation to illustrate the first embodiment of the system 100 according to the invention from yet another perspective. In particular, Fig. 4 In addition to the first housing element 140 and the second housing element 150, a temperature safety element 160 can be seen, which is arranged between the first housing element 140 and the heating element 110.

[0046] Fig. 5 shows a further schematic sectional view to illustrate the first embodiment of the system according to the invention. In the sectional view in Fig. 5 at least a part of the system 100 can be seen in section perpendicular to the flow direction S. This means that in this illustration the circuit board element 120 and the cooling element 130 can be seen in section, with a second side of the circuit board element 120 in Fig. 5 is directed downwards, a first side of the circuit board element 120 is directed upwards, a second side of the cooling element 130 is directed downwards and a first side of the cooling element 130 is directed upwards.

[0047] In particular, Fig. 5 a triac component 121 and a triac component 122 can be seen.

[0048] In the embodiment shown, the second housing element 150 has projections 151, 152. The projections 151, 152 are in direct contact with the circuit board element 120 and exert a predefined pressure on the circuit board element 120 (in Fig. 5 from bottom to top). This pressure then presses the triac components 121, 122 against the cooling element 130.

[0049] Fig. 6 shows a schematic representation to illustrate a first embodiment of a circuit board element 120. In particular, Fig. 6 the second side of the circuit board element can be seen, whereby the triac components 121, 122, which are arranged on the back of the circuit board element 120, can be seen through holes in the circuit board element.

[0050] The circuit board element 120 has wave-shaped openings 123, 124, which are provided for connection to the heating element 110. The circuit board element 120 also has a plurality of point-shaped openings 125, which are provided, among other things, for connection to a temperature safety element 160 positioned on the heating element.

[0051] Further electronic components 126, 127, 128, and 129 are arranged on the second side of the circuit board element 120. The further electronic components 126, 127, 128, and 129 are covered by the second housing element 150 in the assembled state. In particular, the electronic components on the first side of the circuit board element 120 are covered by the cooling element 130, and the electronic components on the second side of the circuit board element 120 are covered by the second housing element 150, thus protecting them from external influences.

[0052] Fig. 7shows a schematic flow diagram of an embodiment of the method 200 according to the invention. The method 200 is carried out using a ventilation device according to the invention. The ventilation device has an outside air duct, wherein the outside air duct has an outside opening. Furthermore, a heating element is arranged in the outside air duct.

[0053] In a first step 210 of the method 200, an air stream flowing through the heating element is heated by the heating element. In a second step 220, which is performed prior to the heating 210, a cooling element is cooled by the air stream flowing through the outside air duct. Furthermore, in a third step 230, an electronic component is cooled by the cooling element. In a fourth step 240, the electronic component is further covered by the cooling element. In a further step of the method 200, the electronic component can be a triac component, which is provided and configured in particular to operate the heating element.

[0054] Although various aspects or features of the invention are shown in combination in the figures, it will be apparent to those skilled in the art—unless otherwise stated—that the illustrated and discussed combinations are not the only possible ones. In particular, corresponding units or feature complexes from different embodiments can be interchanged.

[0055] Further considerations regarding the invention follow: It is known that in ventilation devices, in particular in comfort residential ventilation devices, heating elements are used in the outside air flow area in order to preheat the cold air to a certain level in winter so that a heat exchanger located in the ventilation device remains free of ice.

[0056] Preheating is useful to prevent damage caused by ice formation in the heat exchanger and, last but not least, to ensure that the pressure loss and thus also the energy consumption and noise level of the ventilation unit remain constant.

[0057] The size of ventilation units has steadily increased in recent years to accommodate ever-increasing airflow volumes. This requires the heating element's power to become increasingly larger in order to reliably heat the larger air volumes.

[0058] In order to efficiently control the heating element and adjust it to the ambient conditions (outside air temperature, volume flow, etc.), a triac component is usually used.

[0059] The greater the power of the heating element, the more waste heat the triac component emits and must therefore be actively or passively cooled.

[0060] In the current state of the art, the triac component is typically housed in a main electronics compartment, encased, for example, in EPS and / or sheet metal. In this case, the triac's waste heat cannot be dissipated passively, so additional fans would be required to cool the triac component. These fans would massively increase device noise and manufacturing costs.

[0061] The invention solves the above-mentioned problems by installing the triac component with the heating element, which can also be called a heating register, on, preferably in, the outside air duct. Preferably, the triac element and the heating element are housed in a (common) housing, i.e., the heating register housing. The heating register housing can be formed by the first housing element, the second housing element, and the cooling element. This allows the waste heat to be directly and effectively used to heat the outside air volume flow.

[0062] The heating element is, for example, a PTC heating register.

[0063] The triac component is typically located on a circuit board element, which can also be called a printed circuit board. This circuit board element can be a separate triac board.

[0064] Particularly preferably, the heating element is screwed directly to the circuit board element. This means, for example, that the connection terminals of the heating element, such as the PTC heating register, are screwed directly to the circuit board element (for fastening and power supply). The triac component is preferably positioned on the back of the circuit board (toward the cooling element) and, more preferably, rests against the heat sink (possibly with the use of thermal paste, etc.).

[0065] The cooling element itself is preferably made of aluminum to increase thermal conductivity and is arranged between the heating element and the circuit board element, preferably without touching the connection terminals of the heating register.

[0066] The cold outside air (less than -3°C when the heating element is in use) preferably flows from above, first through a grid housing which corresponds to the first housing element, and then through the heating element, so that the cold air flow also flows along the cooling element, which is preferably designed as a cooling plate, and absorbs the waste heat from the cooling element.

[0067] A temperature safety element (fusible link) is preferably provided above the heating element, i.e., on one of the heating element's input sides. This interrupts the N connection if the temperature exceeds a limit value. These cables are preferably also screwed to the printed circuit board element, for example, using a ring terminal. This eliminates the need for additional connectors. A ring terminal can be screwed directly to the heating element's N connection terminal, so that only one additional screw point needs to be provided on the printed circuit board element. Heating element connections can be, for example, NLNL N.

[0068] The above embodiments have the following advantages: Due to a direct connection between the heating element and the circuit board element, for example by screws, no additional cables and / or connectors are necessary.

[0069] The waste heat from the triac component is used effectively to heat the outside air, eliminating the need for active cooling of the electronics compartment.

[0070] The board is optimally protected from external influences (dust, moisture). Due to the preferred double-sided assembly of the board, some of the feet / soldering points of the electronic components protrude. At these points, the cooling element, which is preferably a heat sink, can be provided with beads to prevent interruptions. This provides better protection. The beads are also useful for maintaining the minimum clearances to the conductive components (creepage distances).

[0071] The circuit board in the heating element offers the preferred option of implementing an additional triac component. Each triac component can be controlled individually, potentially providing additional control options that can help with EMC problems (e.g., flicker).

[0072] In addition, additional temperature sensors can be accommodated on the circuit board element to measure, for example, triac temperatures or the temperature of the outside air.

[0073] Additionally or alternatively, temperature safety elements (fuse, etc.) can be implemented using the circuit board element in the heating element housing.

[0074] The preferred wave-shaped screw-on contour (clearances) of the circuit board element reduces the force acting on the entire circuit board element (force relief). Deformation caused by excessive screw-on forces occurs only in the wave crests and has a reduced effect on the entire circuit board element. This provides better protection for the circuit paths.

[0075] A temperature safety element can, for example, be easily attached to the circuit board element using ring terminals (no additional connectors).

[0076] The circuit board element is preferably SMD-mountable, and the triac components are preferably assembled fully automatically. This enables simple production.

[0077] The second housing element, which is preferably made of plastic and can correspond to a front cover of the circuit board element, is preferably designed such that, after assembly, it exerts direct pressure on the circuit board element and thus on the triac component, causing the triac component in turn to press on the cooling element. This ensures contact between the triac component and the cooling element and guarantees good heat dissipation.

[0078] The invention relates to a system for use in a ventilation device, the system comprising: (i) a heating element configured to heat air flowing from an inlet side of the heating element in a flow direction to an outlet side of the heating element, (ii) a circuit board element aligned along the flow direction and configured to support electronic components at least on a first side of the circuit board element, wherein the first side of the circuit board element faces the heating element, (iii) at least one triac component arranged on the first side of the circuit board element and electrically connected to the heating element, and (iv) a cooling element arranged along the circuit board element on the first side of the circuit board element and at least largely covering the first side of the circuit board element, wherein the cooling element is positioned between the circuit board element and the heating element,that the cooling element protrudes over the heating element against the direction of flow.

Claims

1. A system (100) for use in a ventilation device, the system (100) comprising: a heating element (110) configured to heat air flowing from an inlet side of the heating element (110) in a flow direction (S) to an outlet side of the heating element (110); a circuit board element (120) aligned along the flow direction (S) and configured to carry electronic components at least on a first side of the circuit board element (120), the first side of the circuit board element (120) facing the heating element (110); at least one triac component (121, 122) arranged on the first side of the circuit board element (120) and electrically connected to the heating element (110); and a cooling element (130) arranged along the circuit board element (120) on the first side of the circuit board element (120). and covers at least most of the first side of the circuit board element (120),wherein the cooling element (130) is positioned between the circuit board element (120) and the heating element (110) such that the cooling element (130) projects beyond the heating element (110) opposite to the flow direction (S).

2. The system (100) of claim 1, wherein the heating element (110) is arranged substantially perpendicular to the circuit board element (120) and the cooling element (130) is arranged substantially parallel to the circuit board element (120).

3. System (100) according to one of claims 1 and 2, wherein the circuit board element (120) and the cooling element (130) are arranged relative to one another such that the triac component (121, 122) is in direct contact with the cooling element (130).

4. System (100) according to one of the preceding claims, wherein the system (100) further comprises a first housing element (140) which is designed to cover the heating element (110) on the input side of the heating element (110), wherein the first housing element (140) is preferably arranged parallel to the heating element (110).

5. System (100) according to one of the preceding claims, wherein the system (100) further comprises a second housing element (150) which is designed at least to cover a second side of the circuit board element (120) opposite the first side, and in particular electronic components on the second side of the circuit board element (120).

6. System (100) according to claim 5, wherein the second housing element (150) has at least one projection (151, 152) in the direction of the second side of the circuit board element (120), wherein the second housing element (150) and the circuit board element (120) are arranged relative to one another such that the projection (151, 152) is in direct contact with the circuit board element (120), and in particular exerts a predefined pressure on the circuit board element (120).

7. System (100) according to one of the preceding claims, wherein the cooling element (130) is a plate which preferably comprises or consists of metal, particularly preferably aluminum, and / or wherein the cooling element (130) has beads.

8. System (100) according to one of the preceding claims, wherein the heating element (110) and the circuit board element (120) are connected to one another, in particular screwed, in such a way that the circuit board element (120) is held on the heating element (110).

9. System (100) according to one of the preceding claims, wherein the circuit board element (120) has at least one wave-shaped opening (123, 124) for connection, in particular screwing, to the heating element (110) and / or wherein the circuit board element (120) has at least one point-shaped opening (125) for connection to a temperature safety element (160) on the heating element (110).

10. Ventilation device comprising: an outside air duct having an outside opening, a heat exchanger connected to the outside air duct such that air passes through the outside opening into the outside air duct and to the heat exchanger, wherein the ventilation device comprises a system (100) according to one of claims 1 to 9, wherein the system (100) is arranged within the ventilation device such that the heating element (110) is arranged in the outside air duct between the outside opening and the heat exchanger and the circuit board element (120) is arranged on the outside air duct.

11. A method (200) for using a ventilation device, wherein the ventilation device has an outside air duct, wherein the outside air duct has an outside opening, wherein a heating element is arranged in the outside air duct, the method comprising the steps of: heating (210) an air flow flowing through the heating element by the heating element before heating, cooling (220) a cooling element via the air flow flowing through the outside air duct, cooling (230) an electronic component by the cooling element, and covering (240) the electronic component by the cooling element.

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