Method for matting a surface of a device for embossing or printing, and device

Abstract

The invention relates to a method for matting a surface (1) of a device (2) for embossing or printing, preferably a roller (11), an embossing plate (12), or printing plate, said method comprising the following steps: dividing points (3, 4) on the surface (1) to be matted into points (3) to be structured and points (4) not to be structured; structuring, preferably laser direct structuring, the surface (1) using a laser (5), wherein the structuring process involves forming structures (6) at the points (3) to be structured, wherein the structures (6) are designed to scatter incident light in a locally diffuse manner, wherein the structuring process uses a laser (5) which is designed to emit pulses (10) with a pulse duration of less than 30 ps, preferably a picosecond laser or a femtosecond laser. The invention also relates to a corresponding device.

Description

[0001] Method for matting a surface of a device for embossing or printing, and device

[0002] The invention relates to a method for matting a surface of a device for embossing or printing, as well as to a device.

[0003] Such devices can be embossing devices or printing devices and are used, for example, to create decorative patterns or the like on a substrate. Corresponding devices can be or include rollers, e.g., embossing rollers, counter rollers, or printing rollers, or embossing plates or printing plates. The embossing device can, for example, have a macrostructure that can emboss a pattern.

[0004] For a wide variety of decorative embossing or printing applications, it can be advantageous if the surface of the device has different gloss levels (e.g. matt-gloss, matt, high gloss, etc.) in a location-selective manner, ie the gloss level varies so that a decorative print or impression produced with the device can have a desired optical effect.

[0005] Sandblasting or brushing devices is known. However, a desired location-selective or device-dependent gloss level cannot be achieved by sandblasting, as sandblasting or brushing is not location-selective or precise enough, meaning the "resolution" achievable by sandblasting or brushing is insufficient.

[0006] The use of nanosecond lasers has also proven insufficient, as they create sharp edges on the lasered surface. These edges prevent clean embossing or imprinting during the production process, and they can also cause adhesion of the substrate to be printed or embossed. Such sharp edges should therefore be avoided. These conventional processes are particularly unsuitable when the surface is made of, or contains, chrome or nickel.

[0007] It is therefore an object of the present invention to provide a method according to claim 1 that enables selective matting of a surface of a device. A corresponding device according to claim 11 is also provided. The subclaims relate to advantageous embodiments of the invention.

[0008] A first aspect of the invention relates to a method for matting a surface of an embossing or printing device, comprising the following steps:

[0009] Dividing points of the surface to be matted into points to be structured and points not to be structured;

[0010] Structuring, preferably laser direct structuring, of the surface with a laser, wherein during structuring structures are formed at the points to be structured, wherein the structures are configured to locally diffusely scatter incident light, wherein during structuring a laser is used which is configured to emit pulses with a pulse duration of less than 30 ps (30 picoseconds).

[0011] By dividing the surface into points to be structured and points not to be structured, structures can be formed in a location-selective manner, which can also define a surface's gloss level in a location-selective manner. Because the structures are designed to diffusely scatter incident light locally, the matting of the surface can be predetermined or adjusted in a location-selective manner. The terms "gloss", "shine" or similar can mean that incident light is fully or partially reflected in a specular manner, e.g. from the surface. If a surface is (locally or location-selectively) "glossy" or similar, this can mean that incident light is (locally or location-selectively) reflected in a specular manner. The terms "matt", "matting" or similar can mean that the surface is less shiny than an unmatt surface. If a surface is (locally orWhen "matte" (i.e., locally selective) or the like is used, it can mean that incident light is (locally or locally selectively) diffusely scattered or diffusely reflected. "Matting" can be or include a surface treatment that results in a less shiny surface. Because the laser emits pulses with a pulse duration of less than 30 ps (30 picoseconds), the resulting structures can be smaller than those created with nanosecond lasers or sandblasting, and can have fewer or no sharp edges or the like.

[0012] With the method according to the invention, a device can be laser-treated in such a way that a print or impression produced with the treated device can have a predetermined gloss level at a predetermined viewing angle. The surface of the device can be structured in such a way that a selected gloss level of a print or impression produced with the device can result at a selected viewing angle.

[0013] The device can be or comprise a roller, in particular an embossing roller, a counter roller or a printing roller, or an embossing plate or printing plate. The laser can be or comprise a picosecond laser. The counter roller can be arranged opposite an embossing roller or a printing roller, for example, during embossing or printing. The embossing roller and / or embossing plate can be configured to produce an embossing or an engraving in or on a substrate and / or to be or be used in engraving a substrate. The printing roller and / or printing plate can be configured to print on a substrate and / or to be or be used in printing a substrate.

[0014] The laser can be or have a picosecond laser or a femtosecond laser.

[0015] The surface may comprise chromium or be made of chromium. Alternatively or additionally, the surface may comprise nickel or be made of nickel. It may be provided that the surface is arranged on a core of the device. It may be provided that the surface is multi-layered. The surface may have an outer layer which is made of chromium or comprises chromium. The method may be particularly suitable if the surface comprises chromium and / or nickel or is made of chromium and / or nickel. During structuring, at least one of the structures may be formed by at least partially ablating the surface. The ablating of the surface may be carried out by laser ablation. The laser can vaporize at least part of the surface. The structure may be or have a depression.

[0016] During structuring, at least one of the structures can be formed by melting the surface. The structure can be a spherical structure.

[0017] In some embodiments, at least one of the structures can be formed by at least partially removing the surface, and at least one other of the structures can be formed by melting the surface. Alternatively, it can be provided that all of the structures are formed by at least partially removing the surface or are formed by melting the surface.

[0018] The structure may be formed such that it may have a characteristic dimension of less than 10 pm. In some embodiments, the structure may have a structure height of up to 2 pm. Alternatively or additionally, the structure may have a structure width of up to 3 pm. The characteristic dimension may be or include a height, a depth, a width, a thickness, a length, or a diameter.

[0019] When dividing the surface to be matted, the dots can be arranged in a grid. The dots can be arranged at a spacing of less than 50 pm. In some embodiments, it can also be provided that the dots can be arranged at a spacing of less than 20 pm or less than 10 pm. Alternatively or additionally, a grid spacing of the grid can be less than 50 pm, in some embodiments less than 20 pm or less than 10 pm.

[0020] When dividing the surface to be matted, the points to be textured can be randomly selected. Each point can have a probability of 10% or more of being assigned to a point to be textured. The points can be divided in such a way that the ratio of points to be textured to the total number of points can be between 10% and 100%. The ratio can be 10%, 20%, 30%, 50%, 80%, or 100%.

[0021] When dividing the surface to be matted, the points of a first part of the surface can be divided differently than the points of a second part of the surface, into points to be structured and points not to be structured. For example, the first part and the second part can each have a different ratio of points to be structured to the total number of points per part of the surface, or the points of the first part and the second part can be divided accordingly. This allows the first part to be structured differently than the second part when structuring the surface.

[0022] The method may include forming one or more macrostructures. The macrostructures may be formed in such a way that they are configured to emboss or print a pattern. Forming the macrostructures may occur before structuring the surface. In some embodiments, forming the macrostructures may occur before dividing the dots. When structuring the surface, at least one structure may be formed on or over at least one of the macrostructures.

[0023] The macrostructure may comprise an elevation and / or depression of the surface, or be or become formed by such. In some embodiments, the macrostructures may be or become formed by a polishing process. For example, the surface may be or become selectively or fully polished, optionally with different intensities. In some embodiments, the macrostructure may be or become formed by engraving the surface and / or comprise an engraving. In some embodiments, the macrostructure may be or become formed with a laser, e.g., by means of laser engraving. The laser may be the laser used to form the structures. Alternatively or additionally, the macrostructures may be or become formed with a laser that differs from the laser used to form the structures, e.g., in its pulse duration, pulse frequency, power, or the like.However, the formation of the macrostructure is not limited to laser engraving; other engraving processes, polishing processes, and / or general processes for forming corresponding elevations and / or depressions can also be used. The macrostructure can be formed in such a way that the macrostructure has a characteristic dimension that is larger than one or more of the characteristic dimensions of the structure. For example, the macrostructure can have a characteristic dimension that is one or more orders of magnitude larger than the characteristic dimension of the structure. The macrostructure(s) can be arranged or formed in such a way that they correspond to and / or represent a pattern to be printed or embossed.

[0024] In some embodiments, however, the macrostructures may also be a side effect of a surface treatment or the like, e.g., they may be formed or become formed during a surface treatment prior to the process. In some embodiments, the macrostructures may not be configured to print or emboss a pattern onto a substrate.

[0025] Before structuring, the surface can be plated. The surface can be plated with chrome and / or nickel. However, other plating materials are also conceivable, such as aluminum or copper.

[0026] In some embodiments, the plating of the surface can occur after the formation of the macrostructure. It can be provided to plate the macrostructures. The macrostructures can be plated with chromium and / or nickel. However, other plating materials are also conceivable, for example, aluminum or copper. It can be provided to structure the plated surface and / or the plated macrostructures, or to form structures on the plated surface and / or on the plated macrostructures.

[0027] When forming the structure, the structure can be formed using multiple laser pulses. For example, the structure can be formed using ten or more pulses.

[0028] A second aspect of the invention relates to a device for embossing or printing, wherein the device has a matt surface, wherein the surface has a plurality of structured dots, wherein a proportion of the structured dots to the total area of ​​the surface is between 10% and 100%, wherein the surface at each of the structured dots has a structure which is configured to locally diffusely scatter incident light. The device can be manufactured and / or mattified using a method described above. A method described above can be used to mattify a surface of the device.

[0029] The device can be or comprise a roller, in particular an embossing roller, a printing roller, a counter roller, an embossing plate, or a printing plate. The counter roller can be arranged opposite an embossing roller or printing roller, for example, during embossing or printing. The embossing roller and / or embossing plate can be configured to produce an embossing or engraving in or on a substrate, and / or to be or be used in engraving a substrate. The printing roller and / or printing plate can be configured to print on a substrate and / or to be or be used in printing a substrate.

[0030] The surface may contain chromium and / or nickel, or be made of chromium and / or nickel. In some embodiments, the surface may be plated. The surface may be plated with chromium and / or nickel. However, other materials are also conceivable, for example, aluminum or copper.

[0031] At least one of the structures may comprise ablation and / or melting of the surface. Alternatively or additionally, at least one of the structures may be spherical.

[0032] The structure may have a characteristic dimension of less than 10 pm. In some embodiments, the structure may have a structure height of up to 2 pm and / or a structure width of up to 3 pm.

[0033] The structured dots and / or structures can be arranged in a grid. The grid spacing can be less than 50 pm. In some embodiments, the grid spacing can be less than 20 pm or less than 10 pm.

[0034] The surface may have a first part and a second part, wherein structures of the first part may differ from structures of the second part. In some embodiments, the first part may have a number of structures that may differ from the number of structures of the second part. Alternatively or additionally, the structures of the first part may be distributed and / or arranged differently compared to the structures of the second part, or at least partially have a different shape or characteristic dimension.

[0035] The device may have one or more macrostructures. The macrostructures may be arranged on or at the surface. The macrostructures may be configured to print or emboss a pattern.

[0036] It can be provided that at least one of the structures is arranged on or above at least one of the macrostructures,

[0037] The invention is further explained with reference to the following figures. They show:

[0038] Fig. 1: Arrangements comprising a laser and devices according to the invention for carrying out the method according to the invention;

[0039] Fig. 2: further arrangements of a laser and inventive

[0040] Devices for carrying out the method according to the invention;

[0041] Fig. 3: a grid with a division of a surface into sections to be structured

[0042] Points and points not to be structured;

[0043] Fig. 4: a plan view of a surface of an inventive

[0044] Device and a section of the surface along a line AA with structures;

[0045] Fig. 5: a top view of a surface with a macrostructure;

[0046] Fig. 6: Embodiments of devices according to the invention with different matting; and

[0047] Fig. 7: A degree of gloss of embossed with the device according to the invention

[0048] Silicone structures as a function of the proportion of points to be structured relative to the total surface area of ​​the devices. Figure 1 shows devices 2 according to the invention, in which a method according to the invention is carried out using a laser 5. The device 2 can, for example, be or comprise a roller 11 or an embossing plate 12 or printing plate 12. The device 2 has a surface 1 that is or will be processed by a laser 5. The device 2 and / or the roller 11 can be or comprise an embossing roller, a printing roller, or a counter-roller. The counter-roller can, for example, be arranged opposite an embossing roller or a printing roller during embossing or printing. The embossing roller and / or embossing plate can be configured to produce an embossing or an engraving in or on a substrate, and / or to be or will be used in the engraving of a substrate.The printing roller and / or printing plate may be configured to print on a substrate and / or to be or be used in printing on a substrate. In some embodiments, the plate 12 illustrated in the figures may be or include a printing plate 12. In some embodiments, the plate 12 illustrated in the figures may be or include an embossing plate 12.

[0049] The surface 1 can comprise chromium and / or nickel. Alternatively or additionally, the surface can consist of chromium or nickel. In some embodiments, parts or sections of the surface can comprise different materials, and / or the proportion of the respective materials can vary section by section. It can be provided that the surface 1 is arranged on a core of the device 2. It can be provided that the surface 1 is multi-layered. In some embodiments, surface 1 can be plated, for example with chromium and / or nickel. The surface 1 can have an outer layer consisting of chromium or nickel, or comprises chromium and / or nickel. The method can be particularly suitable if the surface 1 comprises chromium or nickel, or consists of chromium or nickel.

[0050] Pulses 10 emitted by the laser 5 can impinge on the surface 1 of the device 2 at a point 3 to be structured, in order to form a structure 6 at the structuring point 3. The surface 1 can be or be structured by or with the laser 5. The laser 5 can mattify the surface 1, or the surface 1 can be or have a matt surface. “Gloss,” “shine,” or the like can mean that incident light is reflected entirely or partially in a specular manner, e.g., from the surface. If a surface is (locally or location-selectively) “glossy” or the like, this can mean that incident light is (locally or location-selectively) reflected in a specular manner. “Matted,” “matting,” or the like can mean that the surface has less shine than an unmatted surface. If a surface is (locally or location-selectively) “matt” or similar, this can mean that incident light (locally or(spatially selective) diffusely scattered or diffusely reflected. Matting can be or include a surface treatment that reduces the gloss of the surface.

[0051] The surface 1 can be part of an outer surface of the device 2. In some embodiments, however, it can also be provided that the entire outer surface of the device 2 is or is structured. In some embodiments, the surface 1 can correspond to the complete outer surface of the device 2. If the device 2 is, for example, a roller 11 and / or roller-shaped, the surface 1 can, for example, correspond to at least part of the cylindrical outer surface, or be identical to the cylindrical outer surface. If the device 2 is, for example, an embossing plate 12 and / or plate-shaped, the surface 1 can, for example, correspond to at least part of the end face, or be identical to the end face.

[0052] Laser 5 is configured to emit one or more pulses 10 with a pulse duration of less than 30 picoseconds (ps). Laser 5 can be, for example, a picosecond laser or a femtosecond laser.

[0053] Laser 5 is used to create a structure 6 at points 3 of surface 1 that are to be structured. No structure 6 is created at points 4 of surface 1 that are not to be structured. The structuring of surface 1 can be achieved by laser direct structuring.

[0054] In some embodiments, the structure 6 can be created by at least partially ablating the surface 1. For example, laser ablation can be or will be performed at a point 3 to be structured. During the laser ablation, the surface 1 can be at least partially evaporated at or near the point 3 to be structured. In some embodiments, the structure 6 can comprise a depression. Alternatively or additionally, the structure 6 can be or will be formed by locally melting the surface 1 at or near the point 3 to be structured. As a result of the melting, a substantially spherical structure 6 can be or will be formed at or near the point 3 to be structured. The melting can be performed without material removal, or no material from the surface 1 can be removed during the melting. It can be provided, for example, to select a laser power of 60 W for the melting, e.g. with a pulse duration of 1 picosecond (1 ps).

[0055] In some embodiments, at least one or all of the structure 6 can be or will be formed by a single pulse 10. In some other embodiments, alternatively or additionally, at least one or all of the structure 6 can be or will be formed by a plurality of pulses 10, i.e. the laser 5 can structure the point 3 to be structured using a plurality of pulses 10 or form the structure 6. For example, the structure 6 can be or will be formed by two, five, ten, fifteen, twenty or fifty or more pulses 10, or a corresponding number of pulses 10 can be emitted to the point 3 to be structured. In some embodiments, it can be provided that the number of pulses 10 depends on the power of the laser 5, for example, several pulses 10 are emitted with a lower power or fewer pulses 10 with a higher power.In some embodiments, the number of pulses 10 may depend on the pulse duration, for example, multiple pulses 10 with a shorter pulse duration or fewer pulses 10 with a longer pulse duration may be delivered.

[0056] It may be provided to produce at least one structure 6 by at least partially removing the surface 1 and at least one other structure 6 by melting the surface 1. Alternatively, all of the structures 6 may be formed either by at least partially removing the surface 1 or by melting the surface 1.

[0057] The structure 6 formed or to be formed at the point 3 to be structured can locally diffusely scatter or locally diffusely reflect incident light. A directed light beam striking the structure 6 can, for example, be diffusely reflected by the structure 6, or be reflected non-directively, and / or be scattered and / or reflected non-directively and / or in different spatial directions. Depending on the number and distribution of the structures 6 on the surface 1, a matting of the surface i can be predetermined, or a predetermined matting can be achieved or set.

[0058] It can be provided to matt the surface i differently in sections, and / or to form different structures 6 in or on different parts of the surface i and / or to provide or form a different distribution and / or number of structures 6.

[0059] As shown in Figure 2, for example, a first part 8 of the surface 1 can be spatially separated and / or spaced from a second part 9 of the surface 1. Alternatively or additionally, the surface 1 can be or become divided into several parts, for example into a first part 8 and a second part 9. The first part 8 and the second part 9 can be arranged directly next to one another (see, for example, Fig. 2 above) and / or be spatially separated from one another (see, for example, Fig. 2 below). In some embodiments, it can be provided that the surface 1 can be or become divided into more than two parts.

[0060] It may be provided to structure the first part 8 and the second part 9 differently. For example, the first part 8 may have a different number of structures 6 than the second part 9, and / or the structures 6 of the respective parts may be distributed or shaped differently, or have different characteristic dimensions. Accordingly, the structures 6 of the first part 8 and the second part 9 may be or become formed differently.

[0061] It can be provided that, when dividing the points of surface 1, the points of the first part 8 are or will be divided differently than the points of the second part 9 into points to be structured and points not to be structured. For example, the number of points 3 to be structured, their distribution, and / or the ratio of points 3 to be structured to the area of ​​the respective part of surface 1 can differ.

[0062] Figure 3 shows an exemplary division of a section of a surface 1, and / or a section of a first part 8 or a second part 9 of the surface 1, into points 3 to be structured and points 4 not to be structured. In Figure 3, points 3 to be structured are shown as black grid cells and points 4 not to be structured are shown as white grid cells. It can be provided that a point is represented by a grid cell or corresponds to a grid cell. A point can thus have, encompass, or represent an area. Even if a uniform grid or raster 7 is shown in Figure 3, in some other embodiments the raster 7 or the division into points 3 to be structured and points 4 not to be structured can be carried out with an irregular grid 7 or lattice. The raster 7 or its grid cells can completely cover the surface 1 and / or the first part 8 and / or second part 9.The grid points of the grid 7 do not necessarily have to be evenly spaced from one another. The grid cells of the grid 7 do not necessarily have to be rectangular. It can be provided that the point 3 to be structured corresponds to the center point and / or centroid of the grid cell. In some embodiments, however, it can also be provided that the point 3 to be structured essentially corresponds to the grid cell. In some embodiments, it can be provided alternatively or additionally that at least one, several or all of the points can be arranged at nodes of the grid. The grid can have a grid spacing g. The grid spacing g can be less than 50 μm. However, it can also be provided that the grid spacing g can be less than 20 μm. The grid spacing g can be less than 10 μm. In some embodiments, exactly one point can be arranged in a grid cell.In some embodiments, the lattice spacing g may substantially correspond to the characteristic dimension of the structure 6.

[0063] The division into points 3 to be structured and points 4 not to be structured can be carried out in such a way that, after structuring, the surface 1 has a predetermined marking and / or a predetermined gloss. It can be provided that the ratio of points 3 to be structured to points 4 not to be structured, or the ratio of points 3 to be structured to the total number of points, to the area of ​​the surface 1, and / or the total area of ​​the grid cells, increases with increasing predetermined matting and / or lower predetermined gloss, or is or becomes larger. In the example shown in Figure 3, the ratio can be 0.71 or 71%.

[0064] In some embodiments, the division can be carried out in such a way that the surface 1 is first divided into grids 7 or grid cells of the grid 7. Subsequently, it can be randomly determined successively for each grid cell of the grid 7 whether the corresponding grid cell corresponds to a point 3 to be structured or is or will be selected as such. For example, a probability can be specified with which a corresponding grid cell corresponds to a point 3 to be structured or is or will be selected as such. The probability can be selected depending on the specified matting and / or the specified gloss of the surface 1. In some embodiments, the probability can be between 10% and 100%. In some embodiments, the probability can be 10%, 20%, 30%, 50%, 80% or 100%.

[0065] In some embodiments, at least one macrostructure 13, which is not shown in Figure 3, can be arranged on the surface. The macrostructure 13 can have been formed before the points were divided. It can be provided that the grid 7 or lattice extends at least partially over a macrostructure 13. In some embodiments, a macrostructure 13 can extend over several grid cells. It can be provided that at least one or more of the points 3 to be structured lie on or above a macrostructure 13, and / or at least one or more points lying on or above a macrostructure are assigned to points 3 to be structured. During a subsequent structuring of the surface 1, one or more structures 6 can thus be or will be formed on or above the macrostructure 13.

[0066] In some embodiments, after splitting, the ratio of 3 points to be structured to the total number of points or grid cells may be between 10% and 100%. In some embodiments, the ratio may be 10%, 20%, 30%, 50%, 80%, or 100%.

[0067] In some embodiments, however, the points 3 to be structured need not be or become randomly selected. It can be provided that the points 3 to be structured and / or the points 4 not to be structured have a pattern and / or a regularity, and / or are or become distributed according to a pattern and / or a regularity.

[0068] In some embodiments, the division of the points can take place completely before the structuring of the surface 1. It can be provided that all points of the surface 1 are first divided accordingly and then corresponding structures 6 are formed at or near the points 3 to be structured using the laser 5. Accordingly, no structures 6 are formed at or near the points 4 not to be structured. In some embodiments, it can be provided that a plurality of devices 2 are or will be structured with the same division of the points. In some other embodiments, it can be provided that for each device 2 points of the surface 1 are redistributed, so that the distribution and / or number of structures 6 of two devices 2 can differ.

[0069] In some other embodiments, it can alternatively be provided that the division of the points into points 3 to be structured and points 4 not to be structured takes place “on the fly”. For example, a decision can first be made for one or more points on the surface 1 as to whether this or these is or are a point 3 to be structured. A structure 6 can then be formed or will be formed at each of the points 3 to be structured using a laser 5. After that, a decision can be made for one or more further points 3 as to whether this or these is or are a point 3 to be structured, and subsequently corresponding structures 6 can be formed or will be formed using a laser 5. In this case, it can be provided that the distribution and / or number of structures 6 of two devices 2 can differ.

[0070] In some embodiments, the division of the points can be computer-aided and / or automated. The division can be performed by or with a computer and / or a control unit. In some embodiments, the control unit can control the laser 5.

[0071] Figure 4 shows an example of a matte surface 1 structured by a method according to the invention. The section along line AA is shown at the bottom of Figure 4.

[0072] As can be seen in Figure 4 above and in particular Figure 4 below, the surface 1 of the exemplary embodiment has a macrostructure 13. The macrostructure 13 can, for example, be wavy as shown in Figure 4. The macrostructure 13 can be designed to emboss or engrave a pattern during embossing with the device 2 if the device 2 is, for example, an embossing roller or an embossing plate. If the device 2 is a printing roller or a printing plate, the macrostructure 13 can be designed to produce an impression or the like. By means of a macrostructure, for example, a pattern can be embossed or printed onto a substrate. In some embodiments, the macrostructure 13 can be produced during manufacture of the roller or plate, for example when it is engraved or when elevations and depressions are created on the surface for printing or embossing, or when its surface is treated in some other way.

[0073] However, the macrostructure 13 can also be a macrostructure 13 of a counter roller which is not designed to produce an impression, imprint, engraving or the like.

[0074] The macrostructure 13 may be a "side effect" of such a treatment. The macrostructure may have characteristic dimensions that may be smaller, possibly much smaller, than the characteristic dimensions of an engraving, elevation, or depression on the roller or plate.

[0075] If the device 2 or the surface 1 has a macrostructure 13, it can be provided that this is or will be plated. For example, the macrostructure 13 can be or will be plated with chromium and / or nickel.

[0076] The structures 6 can be or become superimposed on the macrostructure 13. The structures 6 can have a smaller, in some cases significantly smaller, for example one or more orders of magnitude smaller, characteristic dimension d compared to the macrostructure 13. The characteristic dimension d can be less than 10 pm in some embodiments. The characteristic dimension d can be less than 5 pm, less than 3 pm or less than 2 pm in some embodiments. The characteristic dimension d can be or have a height, width, depth, length, thickness and / or diameter. The structure 6 can, for example, have a structure height of less than or up to 2 pm. The structure 6 can, for example, have a structure width of less than or up to 3 pm. In some embodiments, the characteristic dimension of the macrostructure 13 can be one or more orders of magnitude larger than the lattice spacing g.

[0077] The structure 6 can be spherical. "Spherical" can also include structures 6 that have an ellipsoidal shape, a cylindrical shape, or a conical shape, and / or are rotationally symmetrical about at least one axis of symmetry. In some embodiments, a spherical structure 6 can have at least one edge and / or does not necessarily have to be smooth. In some embodiments, the structure 6 can alternatively or additionally comprise a recess.

[0078] Figure 5 shows a surface i with macrostructures 13 formed thereon. In Figure 5, white areas correspond to elevations, black depressions. At least one, several or all of the macrostructures 13 can be or will be formed by engraving. Alternatively or additionally, several or all of the macrostructures 13 can be or will be formed, for example, by polishing. If the macrostructures 13 are formed by polishing, the ratio of the area of ​​the macrostructures to the total area of ​​the surface can be or will be predetermined, adjusted or selected, for example, by selective polishing. However, the formation of the macrostructures 13 is not necessarily limited to engraving processes or polishing processes; other processes for forming the macrostructures 13 are also applicable.

[0079] It may be provided to structure or matte the surface 1 shown in Figure 5 as described above. Structures 6 (not shown in Figure 5) can thus be distributed over the entire surface 1 shown in Figure 5. Structures 6 can, in particular, be formed on or above the macrostructures 13.

[0080] However, it can also be provided to structure only parts of the surface 1, for example only a first part 8, a second part 9, and a third part 14. As described above, the grids 7 or lattices and / or the assignment of the points 3 to be structured can differ for the respective parts 8, 9, and / or 14, so that the different parts can be or become structured differently. It can also be provided that the characteristic dimensions and / or shapes of the structures 6 of the respective parts 8, 9, and / or 14 can differ.

[0081] The selection of the areas or parts of the surface 1 and / or their arrangement, area, the respective assignment of the points or grids 7, and / or the structures 6 to be formed can be or will be selected depending on a given gloss.

[0082] In some embodiments, Figure 5 shows the surface 1 after structuring or after forming the structures 6, but the characteristic dimensions of the structures 6 and / or the lattice spacing g are so small compared to the characteristic dimensions of the macrostructures 13 that the structures 6 are not recognizable in Figure 5. In some other embodiments, Figure 5 shows a surface after forming the macrostructures 13, but before structuring the surface 1.

[0083] Figure 6 shows exemplary embodiments of a device 2 according to the invention, or of surfaces 1 mattified using a method according to the invention. The proportion of points 3 and / or structures 6 to be structured relative to the area of ​​the surface 1 is approximately 10% (top left), 30% (top right), 80% (bottom left), and 100% (bottom right). As can be seen in Figure 6, the matt finish of the surface 1 can thus increase, or surface 1 can shine less. Four separate devices 2 can be shown in Figure 6. Alternatively, a device 2 can be shown in Figure 6 viewed from four different sides, so that the device 2 or its surface 1 can have different parts or regions with different matt finishes.

[0084] Figure 7 shows the degree of gloss of silicone impressions printed with devices 2 according to the invention as a function of the proportion of points 3 to be structured to the total area of ​​the surface 1 of the respective devices 2. A silicone impression can, for example, comprise a silicone substrate with an impression produced by the device 2.

[0085] The gloss level is measured in "gloss units" (GU), for a measurement angle of 20°, 60°, and 85°. Gloss measurement methods are known, for example, from ASTM D523 (e.g., ASTM D523-14(2018)) or DIN EN ISO 2813.

[0086] A value of 100 GU can correspond to a reference value, which can be the value for a polished, black glass with a defined refractive index. A value of 0 GU, for example, can be defined as the value of a perfectly matt surface. Measured values ​​do not necessarily have to be between 0 GU and 100 GU. A value of more than 70 GU can correspond to a high gloss, a value of 10 - 70 GU to a medium gloss, and a value less than 10 GU to a low gloss. In some cases, gloss levels greater than 100 GU can be measured. A higher GU value can correspond to a higher gloss value. During a measurement, it can be intended to vary the measuring angle, possibly depending on the measured values. For example, according to ISO 2813, the gloss can first be measured at a measuring angle of 60°. If the measured value in this first measurement is above 70 GU, the measuring angle can be reduced to 20°.If the measured value is below 10 GU, the measuring angle can be increased to 85°. Otherwise, the measured value can be adopted.

[0087] The measurement angle can be 0° if it is perpendicular to the measured surface and 90° if it is parallel to the measured surface. The "gloss impression," or measured or recorded gloss, can depend on the measurement angle or viewing angle.

[0088] Figure 7 shows the degree of gloss of the silicone impression with increasing proportion of points 3 or structures 5 to be structured to the area of ​​the surface 1, corresponding to the proportion of the lasered area relative to the surface 1, measured for measuring angles of 20°, 60° and 85°.

[0089] As can be seen in Figure 7, the gloss level of the silicone impression can decrease with increasing proportion of dots 3 or structures 5 to be structured relative to the surface area 1, corresponding to the proportion of the lasered area relative to the surface 1. For a completely matte surface 1 (corresponding to a proportion of 1 or 100%), the gloss level of the silicone impression can be minimal, regardless of the measurement angle. In particular, at a measurement angle of 60°, an exponentially decreasing relationship can occur, see Figure 7.

[0090] At a measuring angle of 60°, a proportion of 1 or 100%, i.e., a completely lasered surface 1, can result in a gloss level of 0.9 GU. With the same proportion and a measuring angle of 20°, a very low gloss level of approximately 0.9 GU can also result, while at a steeper measuring angle of 85°, a gloss level of slightly more than 50 GU can be present. Thus, in some embodiments, the silicone impression can appear glossy essentially only at a flat viewing angle (e.g., a viewing angle almost parallel to the surface), and appear matte and / or non-glossy when viewed at a wide range of angles measured to the perpendicular to the surface.

[0091] It can be provided to structure the surface 1 accordingly or to divide it into points 3 to be structured and points 4 not to be structured and / or to form structures 5 in such a way that an impression produced with the corresponding device 2 has a predetermined gloss or matting for predetermined viewing angles.

[0092] The features disclosed in the claims, the description and the figures may be essential for the realization of the invention, individually or in any combination.

[0093] List of reference symbols

[0094] Surface i

[0095] Device 2 Point to be structured 3 Point not to be structured 4 Laser 5

[0096] Structure 6

[0097] Grid 7 first part 8 second part 9

[0098] Pulse 10

[0099] Roller 11

[0100] Embossing plate 12

[0101] Macrostructure 13 third part 14

[0102] Characteristic dimension d

[0103] Grid spacing g

Claims

Patent claims Method for matting a surface (1) of a device (2) for embossing or printing, preferably a roller (11), an embossing plate (12) or printing plate, with the following steps: Dividing points (3, 4) of the surface (1) to be matted into points (3) to be structured and points (4) not to be structured; Structuring, preferably laser direct structuring, of the surface (1) with a laser (5), wherein during structuring structures (6) are formed at the points (3) to be structured, wherein the structures (6) are designed to locally diffusely scatter incident light, wherein during structuring a laser (5) which is designed to emit pulses (10) with a pulse duration of less than 30 ps, ​​preferably a picosecond laser or a femtosecond laser, is used. Method according to claim 1, wherein the surface (1) comprises chromium and / or nickel, or consists of chromium and / or nickel. Method according to one of the preceding claims, wherein during structuring at least one of the structures (6) is formed by at least partially ablating the surface (1).Method according to one of the preceding claims, wherein during structuring at least one of the structures (6) is formed by melting the surface (1), wherein the structure (6) is preferably a spherical structure (6). - Method according to one of the preceding claims, in which the structure (6) is formed such that it has a characteristic dimension of less than 10 pm, preferably a structure height of up to 2 pm and / or a structure width of up to 3 pm. . Method according to one of the preceding claims, wherein, when dividing the surface (1) to be matted, the points (3, 4) are arranged in a grid (7), preferably at a distance of less than 50 pm, particularly preferably less than 20 pm or less than 10 pm. . Method according to one of the preceding claims, in which, when dividing the surface (1) to be matted, the points (3) to be structured are chosen at random, wherein preferably each point (3, 4) has a probability of 10% or more of being assigned to a point (3) to be structured.Method according to one of the preceding claims, in which the division of the points (3, 4) is carried out in such a way that a ratio of points (3) to be structured to the total number of points (3, 4) is between 10% and 100%, preferably 10%, 20%, 30%, 50%, 80% or 100%. Method according to one of the preceding claims, in which, when dividing the surface (1) to be matted, the points (3, 4) of a first part (8) of the surface (1) are divided differently than points (3, 4) of a second part (9) of the surface (1) into points (3) to be structured and points (4) not to be structured, preferably in a respectively different ratio of points (3) to be structured to the total number of points (3, 4) per part (8, 9) of the surface (1), so that when structuring the surface (1), the first part (8) is structured differently than the second part (9).Method according to one of the preceding claims, wherein, when forming the structure (6), the structure (6) is formed with a plurality of pulses (10) of the laser (5), preferably with ten or more pulses (10). Method according to one of the preceding claims, which comprises forming one or more macrostructures (13), wherein the macrostructures (13) are preferably formed such that they are configured for embossing or printing a pattern, wherein the formation of the macrostructures (13) takes place before the structuring of the surface (1), wherein preferably during the structuring of the surface (1) at least one structure (6) is preferably formed on or over at least one of the macrostructures (13).

12. Method according to one of the preceding claims, wherein before the structuring of the surface (1) the surface (1) is plated, preferably with chromium and / or nickel, wherein the plating preferably takes place after the formation of the macrostructures (13), so that the macrostructures (13) are plated.Device (2) for embossing or printing, preferably a roller (11) or embossing or printing plate (12), with a matte surface (1), wherein the surface (1) has a plurality of structured points, wherein a proportion of the structured points to the total area of ​​the surface (1) is between 10% and 100%, wherein the surface (1) has a structure (6) at each of the structured points that is designed to diffusely scatter incident light locally. Device (2) according to claim 13, wherein the surface (1) has chromium and / or nickel, or consists of chromium and / or nickel, and / or wherein the surface (1) is plated, preferably plated with chromium and / or nickel. Device (2) according to one of the preceding claims 13 to 14, wherein at least one of the structures (6) comprises a removal and / or melting of the surface (1) and / or is spherical.Device (2) according to one of the preceding claims 13 to 15, wherein the structure (6) has a characteristic dimension of less than 10 pm, preferably a structure height of up to 2 pm and / or a structure width of up to 3 pm. - Device (2) according to one of the preceding claims 13 to 16, in which the structured dots and / or the structures (6) are arranged in a grid (7), wherein a grid spacing of the grid (7) is preferably less than 50 pm, particularly preferably less than 20 pm or less than 10 pm. - Device (2) according to one of the preceding claims 13 to 17, in which the surface (1) has a first part (8) and a second part (9), wherein structures (6) of the first part (8) are different from structures (6) of the second part (9), preferably differently distributed and / or formed in different numbers. . Device (2) according to one of the preceding claims 13 to 18, which has one or more macrostructures (13), wherein the macrostructures (13) are preferably designed to print or emboss a pattern. .Device (2) according to one of the preceding claims 13 to 19, wherein at least one of the structures (6) is arranged on or above at least one of the macrostructures (13).

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