Epoxide-alcohol-based multi-component resin system

Abstract

The present invention relates to a multi-component resin system comprising (i) at least one resin component (A) comprising at least one curable expoxy resin, and (ii) at least one hardener component (B) comprising at least one primary alcohol and copper(II) tetrafluoroborate. The present invention also relates to the use of such a multi-component resin system for chemically fastening construction elements in holes (for example bore holes) or gaps, and to the use as adhesive or as a coating.

Description

[0001]2021P00131EP Hilti Aktiengesellschaft Fürstentum Liechtenstein Multi-component resin system based on epoxy alcohol DESCRIPTION The present invention relates to a multi-component resin system comprising (i) at least one resin component (A) comprising at least one curable epoxy resin and (ii) at least one hardener component (B) comprising at least one primary alcohol and copper(II) tetrafluoroborate. The present invention further relates to the use of such a multi-component resin system for the chemical fastening of structural elements in holes (for example drill holes) or gaps, and to the use as an adhesive or as a coating. In construction, resin systems are used for the chemical fastening of structural elements, such as anchor rods, reinforcing bars and screws, in drill holes or gaps in buildings. Such resin systems are also referred to as “chemical anchors”.Resin systems also play an important role in their use as adhesives or coatings (e.g., for floor coverings). These resin systems can be in the form of a single resin mass or as a system consisting of several components. Typically, resin systems are available commercially as a multi-component resin system. A multi-component resin system is a resin system with several components, typically two components (two-component system), with (i) at least one resin component (A) and (ii) at least one hardener component (B), as well as optionally other separate components. The components are in separate containers so that they do not come into contact with each other during storage and prior to use and cannot react with each other.For the intended use of a multi-component resin system, components (A) and (B) and, if required, further components are mixed at the desired location so that the curing reaction can take place there. Cartridges made of, for example, plastic, ceramic or glass, in which the components are separated from one another by destructible barrier walls or integrated, separate, destructible containers are suitable for storage before use; for example, as nested cartridges, preferably two-chamber cartridges, and in particular multi- or preferably two-component cartridges, in whose chambers the components (A) and (B) of a multi-component resin system are contained. By destroying the barriers in the cartridges or by squeezing the cartridges, for example using a static mixer, the two or more components are mixed. This triggers a curing reaction, i.e.a polymerization, is initiated and the resin is cured. In a multi-component resin system, other conventional components, such as fillers, additives, accelerators, inhibitors, solvents, and reactive diluents, can be present in one or both components (A) and / or (B), as well as optionally further components. Multi-component resin systems can optionally also contain fillers which can themselves contribute to solidification through hydraulic setting, as in the case of cement. A widely used multi-component resin system is an epoxy-amine-based epoxy resin system (as described, for example, in EP2826796 A1 and EP 3626756 A1). In such an epoxy resin system, the resin component (A) contains at least one curable epoxy resin, and the curing agent component (B) contains at least one amine which can cure the curable epoxy resin.The amines contained in such epoxy-amine-based epoxy resin systems are often labeled as "corrosive" (GHS05), which presents handling problems for the user and may require protective equipment, making use on sensitive substrates that are attacked by the corrosive effects of the amines difficult. Furthermore, the amines contained in these systems usually come from non-renewable, i.e., fossil, sources. In contrast, commercially available epoxy resins already contain a high proportion of renewable raw materials, as they can be produced, for example, from epichlorohydrin, which in turn is obtained from glycerol. Glycerol is produced on a large scale as a byproduct of biodiesel production. The epoxy resin can come partially (via synthesis with epichlorohydrin) or entirely from sustainable sources.Examples of epoxy resins from sustainable sources are isosorbide diglycidyl ether (CAS 13374-44-2), limonene 1,2:8,9 dioxide (LDO, CAS 96-08-2), vanillin diglycidyl ether (DGEVA, CAS 1584677-14-4), phloroglycinol triglycidyl ether (PTHE, CAS 4223-14-7), vanillic acid bisepoxide (CAS 1393710-63-8), and epoxidized vegetable oil, such as epoxidized castor oil (CAS 105839-17-6) and epoxidized cardanol oil (mixture containing, among others, CAS 1260636-34-7 and CAS 63284-28-6). Examples of commercially available bio-based polyepoxides that can be used for epoxy-amine systems are Erisys GE 35-H (epoxidized castor oil, Huntsman, Belgium), Erisys GE 60 and GE 61 (multifunctional epoxy based on sorbitol, Huntsman, Belgium) and Araldite DY-S (multifunctional epoxy based on polyglycerol, Huntsman, Belgium).An object of the present invention is therefore to provide a more environmentally friendly epoxy resin system in whose hardener component (B) the amine is replaced by another compound. Preferably, the amine is at least partially replaced by a compound that can be obtained from renewable raw materials. A further object is to provide an epoxy resin system for use on sensitive substrates that are attacked by the corrosive action of the amines. Curing of the system should be possible at typical ambient and substrate temperatures of and in buildings, in particular at room temperature (25°C), since many of the applications take place in the construction sector where it is not possible to introduce heat. The objects underlying the invention are achieved by providing a multi-component resin system according to claim 1.Preferred embodiments of a multi-component resin system according to the invention are specified in the subclaims, which can be combined with one another unless otherwise stated. The invention relates to a multi-component resin system comprising at least one resin component (A) comprising at least one curable epoxy resin; and at least one hardener component (B) comprising a hardener for the epoxy resin contained in the resin component (A), wherein the hardener is at least one primary alcohol with an average OH functionality of about 2 or greater; further comprising copper(II) tetrafluoroborate. The copper(II) tetrafluoroborate is typically copper(II) tetrafluoroborate in anhydrous form or copper(II) tetrafluoroborate hydrate. The invention also relates to the use of an epoxy resin composition produced from a multi-component resin system according to the invention as an adhesive, as a coating, or as a chemical anchor.The invention is particularly intended for use as a chemical anchor for the chemical fastening of structural elements, particularly in (drilled) holes or gaps, and as an adhesive or coating. It is typically used on or in a substrate found in buildings, such as steel, wood, stone, or brick. This substrate is preferably non-basic, i.e., preferably not concrete, for example. The present invention replaces the amine used as a hardener in commercially available multi-component epoxy resin systems with a primary alcohol having an average OH functionality of approximately 2 or greater. It has surprisingly been found that the resulting multi-component epoxy resin-alcohol system cures at 25°C within an acceptable time to form a polymer suitable for the respective applications when copper(II) tetrafluoroborate is used as an accelerator.It is therefore essential to the invention that a multi-component resin system according to the invention comprises copper(II) tetrafluoroborate; preferably, a multi-component resin system according to the invention comprises copper(II) tetrafluoroborate only in component (B). This is because copper(II) tetrafluoroborate in component (A) could lead to at least partial homopolymerization of the at least one curable epoxy resin in component (A).Copper(II) tetrafluoroborate is present in component (B) in a molar fraction of about 0.1 to about 20 mol% based on the molar fraction of the at least one primary alcohol, preferably in a molar fraction of about 1 to about 17 mol% based on the molar fraction of the at least one primary alcohol, more preferably in a molar fraction of about 2 to about 15 mol%, even more preferably in a molar fraction of about 2 to about 12 mol% based on the molar fraction of the at least one primary alcohol in component (B).For the purposes of the invention, the terms used here and in the following description have the following meaning: - “Multi-component resin system” refers to a resin system comprising a plurality of components stored separately from one another, wherein the resin system comprises at least one resin component (A) and at least one hardener component (B), so that hardening only occurs after all components have been mixed. In a preferred embodiment, a multi-component resin system is a two-component resin system. - “Epoxy resin composition” refers to a reactive composition comprising a curable epoxy resin and a suitable hardener for the curable epoxy resin. According to the invention, this is typically obtained by mixing the resin component (A) and the hardener component (B) and then used for chemical fastening, as an adhesive or as a coating.- “curable epoxy resin” refers to a resin containing reactive epoxy groups that can be reacted with a suitable hardener in a polymerization reaction to form a cured resin. An epoxide is a cyclic ether with a three-atom ring. Another term for epoxy group is glycidyl group. - “average epoxy functionality” describes the average number of reactive epoxy groups of one or a mixture of several curable epoxy resins per molecule. - “alcohol” refers to an organic compound that has at least one hydroxyl group (R-OH; also referred to here as an OH group). A distinction is made between primary (R-CH2-OH), secondary (R- 1 -CR 2 H-OH) and tertiary (R 1 -CR 2 R 3-OH) alcohols or OH groups; aromatic alcohols or OH groups (the hydroxyl group is directly linked to an aromatic compound), as well as mono- and polyhydric alcohols (with one or more hydroxyl groups). A primary alcohol can contain one or more primary OH groups, and in addition to the one or more primary OH groups, it can also contain other, non-primary (e.g., secondary) OH groups. - "Average OH functionality" describes the average number of OH groups (hydroxyl groups) in an alcohol or a mixture of alcohols that can react with an epoxide group. In the context of the present invention, the average OH functionality refers only to primary OH groups, since these are the groups that can react with an epoxide group in the presence of copper(II) tetrafluoroborate.In the context of the present invention, "average OH functionality" describes the average number of primary OH groups (hydroxyl groups) in an alcohol or a mixture of alcohols. It is determined for a mixture according to the formula: average OH functionality (mixture) = ∑ OH functionality (alcohol i) / ni, i.e., the sum of the OH functionality (number of primary OH groups per molecule) of the individual alcohols i divided by the number of individual alcohols i. If only one alcohol or a mixture of alcohols with the same OH functionality is present, the "average OH functionality" corresponds to the OH functionality of the alcohol. - "Hydrate" refers to a chemical compound to which one or more water molecules are bound. In crystalline solids, such as salts, the bound water of hydration is also called water of crystallization. The number of bound water molecules can vary. Typically, the number of water molecules in salts is in the range of 1 to 12.Copper(II) tetrafluoroborate crystallizes with an unknown number of crystal water molecules; the only currently commercially available copper(II) tetrafluoroborate with a defined number of crystal water molecules is copper(II) tetrafluoroborate hexahydrate. - "Non-basic substrate" refers to a substrate, in particular a building material, which, upon contact with water, produces an aqueous solution that reacts in a non-basic manner, i.e., neutral or acidic. A non-basic reaction is caused by a balanced ratio of hydronium cations and hydroxide anions, or the presence of an excess of hydronium cations in solution, with a measured pH value of ≤ 7. As a counterexample: A basic substrate is, for example, concrete. Concrete is therefore preferably not a substrate when using the multi-component resin system according to the invention.- "Substrate temperature" refers to the temperature of the substrate at the contact surface with the epoxy resin mass to be cured. The substrate temperature depends on the ambient temperature, typically the outside temperature in construction, as well as possible heating by solar radiation and external heat sources such as a heating block or fan heater. The substrate temperature can be determined using an infrared thermometer. - "Aliphatic compounds" are acyclic or cyclic, saturated or unsaturated carbon compounds, excluding aromatic compounds. - "Cycloaliphatic compounds" are aliphatic compounds comprising or consisting of a carbocyclic ring structure, excluding benzene derivatives or other aromatic systems. - "Aromatic compounds" are compounds that follow the Hückel (4n+2) rule.- “araliphatic compounds” are compounds with an aliphatic and an aromatic substructure; in the case of a functionalized araliphatic compound, a functional group (e.g., a primary OH group) is bonded to the aliphatic and not the aromatic part of the compound. - “heteroaromatic compounds” are compounds that also contain a heteroatom in the aromatic system. - “poly,” “poly” as a prefix means that two or more of the groups following this prefix are contained in a compound. - “a,” “an,” “an” as an article before a chemical compound class, e.g., before the word “filler,” means that one or more compounds belonging to this chemical compound class, e.g., various “fillers,” can be meant.- "at least one", "at least one", "at least one" numerically "one or more"; in a preferred embodiment, this term means numerically "one", "an", "another". - "about" before a numerical value allows a deviation of ±10%, in a preferred embodiment ±5%, in a highly preferred embodiment ±1% from this numerical value; in the most highly preferred embodiment, "about" means exactly this numerical value, i.e. a deviation of ±0%. - "contain", "comprise" and "include" mean that, in addition to the named components, further components may be present; these terms are meant inclusively and therefore also include "consist of"; "consist of" is meant conclusively and means that no further components may be present; in a preferred embodiment, the terms "contain", "comprise" and "include" mean the term "consist of". All standards mentioned in this text (e.g.DIN standards) were used in the edition current on the filing date of this application. All trade names correspond to the products as they were available under these trade names on the date of filing of this application. As explained above, a multi-component resin system according to the present invention is a system that comprises two or more components stored spatially separately from one another. In a preferred embodiment, a multi-component resin system according to the invention is a two-component resin system. The constituents of components (A) and (B) of a multi-component resin system according to the invention are explained in more detail below using a two-component system as an example.Epoxy-alcohol systems according to the invention are multi-component systems in which one epoxy group of the curable epoxy resin contained in component (A) reacts mathematically with one primary alcohol group of the alcohol contained in component (B). The mixing ratio of an epoxy and an alcohol is calculated from the epoxy equivalent weight (EEW) and the molecular weight of the alcohol divided either by the number of primary alcohol groups per alcohol molecule (calculated AHEW) or by the previously experimentally determined experimental AHEW. However, mixtures containing, for example, several epoxides and / or alcohols and other substances, such as fillers, are generally used. In this case, the EEW of the mixture is calculated as follows: The AHEW of a mixture is calculated using the individual AHEWs of the individual alcohols, the weight of the alcohols, and the total weight of component (B). For commercially available epoxy resins, the EEW is usually specified by the manufacturer or is determined or calculated using known methods (such as the method shown above). The EEW value indicates the amount in g of resin containing 1 mol of epoxy groups and is expressed as g / EQ (i.e., g per molar equivalent). The AHEW can also be determined experimentally. The experimental determination of the AHEW is described below. Curable Epoxy Resin The resin component (A) of a multi-component resin system according to the invention comprises at least one curable epoxy resin.A variety of commercially available compounds known to those skilled in the art, individually or in any desired mixtures with one another, are suitable as the at least one curable epoxy resin in component (A) of the present invention. An epoxy resin usable according to the invention can be saturated or unsaturated, as well as aliphatic, cycloaliphatic, aromatic, or heterocyclic (e.g., isosorbide diglycidyl ether), and can also contain hydroxyl groups. It can also contain substituents that do not cause disruptive side reactions under the mixing or reaction conditions according to the invention, for example, alkyl or aryl substituents, ether groups, and the like. Trimeric and tetrameric epoxides are also suitable within the scope of the invention. Epoxy resins are preferably liquid and generally have an average molecular weight of MW ≤ 2000 g / mol.The curable epoxy resin preferably has an average epoxy functionality of about 1.5 or greater, more preferably about 2 or greater, even more preferably from about 2 to about 10, even more preferably from about 2 to about 3, most preferably about 2. A curable epoxy resin used in the present invention can have an epoxy equivalent weight (EEW) of about 120 to about 2000 g / EQ, preferably from about 140 to about 400 g / EQ, in particular from about 155 to about 300 g / EQ, most particularly from 158 to 290 g / EQ. Curable epoxy resins having the EEW specified in the embodiments are particularly preferred. Preferably, the at least one curable epoxy resin is a glycidyl ether derived from a polyhydric alcohol, in particular from a polyhydric phenol, such as bisphenol and novolak.Examples of such suitable epoxy resins are compounds selected from the group of diglycidyl ethers based on resorcinol, hydroquinone, 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), isomer mixtures of dihydroxyphenylmethane (bisphenol F), tetrabromobisphenol A, novolaks, 4,4'-dihydroxyphenylcyclohexane, and 4,4'-dihydroxy-3,3'-dimethyldiphenylpropane. Particular preference is given to curable epoxy resins selected from the group of diglycidyl ethers based on bisphenol A and bisphenol F, and mixtures thereof, for example the epoxy resins used in the exemplary embodiments. A preferred example of a commercially available bisphenol F-based epoxy resin containing bisphenol F diglycidyl ether is Araldite GY 282. An example of a commercially available bisphenol A-based epoxy resin containing bisphenol A diglycidyl ether is Araldite GY 240.In a further preferred embodiment, the at least one curable epoxy resin is an epoxy resin produced from renewable sources. Such epoxy resins from renewable sources are, for example, isosorbide diglycidyl ether (CAS 13374-44-2), limonene 1,2:8,9 dioxide (LDO, CAS 96-08-2), vanillin diglycidyl ether (DGEVA, CAS 1584677-14-4), phloroglycinol triglycidyl ether (PTHE, CAS 4223-14-7), vanillic acid bisepoxide (CAS 1393710-63-8), and epoxidized vegetable oil, such as, for example, E.g. epoxidized castor oil (CAS 105839-17-6, commercially available as Erisys GE 35-H from Huntsman, Belgium) and epoxidized cardanol oil (mixture containing, among others, CAS 1260636-34-7 and CAS 63284-28-6).In addition to Erisys GE 35-H, examples of bio-based polyepoxides commercially available in larger quantities that can be used in the context of the invention include Erisys GE 60 and GE 61 (epoxy resin based on sorbitol, Huntsman, Belgium) and Araldite DY-S (epoxy resin based on polyglycerol, Huntsman, Belgium). The proportion of the at least one curable epoxy resin in the resin component (A) is >0 to 100 wt. %, preferably from about 10 to about 70 wt. %, more preferably from about 30 to about 60 wt. %, and particularly preferably from about 40 to about 60 wt. %, based on the total weight of the resin component (A). Primary alcohol having an average OH functionality of about 2 or greater The hardener component (B) of a multi-component resin system according to the invention comprises at least one primary alcohol having an average OH functionality of about 2 or greater and copper(II) tetrafluoroborate in anhydrous form or as a hydrate.A variety of primary alcohols with an average OH functionality of about 2 or greater, individually or in any desired mixtures with one another, can be considered as hardeners in component (B) of the present invention. An average OH functionality of about 2 to about 4 is preferred, more preferably an average OH functionality of about 2 to about 3. A primary alcohol used as a hardener according to the invention comprises at least one primary OH group, but preferably comprises at least two primary OH groups. Furthermore, the alcohol can be saturated or unsaturated, as well as aliphatic, cycloaliphatic, araliphatic, or heteroaraliphatic, and can further contain substituents that do not cause disruptive side reactions under the mixing or reaction conditions, for example, alkyl or aryl substituents, ether groups, and the like. Furthermore, the primary alcohols can contain further secondary or tertiary OH groups.The primary alcohol used as a hardener according to the invention is preferably an aliphatic, cycloaliphatic, or araliphatic alcohol. An aliphatic alcohol preferably comprises 2 to 30, more preferably 2 to 20, even more preferably 2 to 10, particularly preferably 2 to 6 carbon atoms. The carbon chain of the aliphatic alcohol can be branched or unbranched; it is preferably unbranched. A cycloaliphatic alcohol preferably comprises 6 to 30, more preferably 7 to 20, even more preferably 7 to 15, particularly preferably 8 to 12 carbon atoms. The cycloaliphatic alcohol comprises at least one aliphatic side chain bearing a primary OH group, preferably at least two aliphatic side chains bearing a primary OH group. The aliphatic side chain preferably comprises 1 to 10, more preferably 1 to 8, even more preferably 1 to 6 carbon atoms. The aliphatic side chains can be branched or unbranched, but are particularly preferably unbranched.An araliphatic alcohol preferably comprises 6 to 30, more preferably 6 to 20, even more preferably 7 to 15, and particularly preferably 8 to 12 carbon atoms. An araliphatic alcohol comprises at least one aliphatic side chain, wherein the aliphatic side chain comprises 1 to 10, more preferably 1 to 8, even more preferably 1 to 6, and particularly preferably 1 to 2 carbon atoms. The aliphatic side chains can be branched or unbranched; they are particularly preferably unbranched. Particularly suitable araliphatic alcohols comprise at least two aliphatic side chains, which are positioned at different locations on the aromatic backbone of the araliphatic alcohol and each comprise a primary OH group. Examples of particularly suitable alcohols are glycerol (1,2,3-propanetriol, CAS No. 56-81-5), 1,3-benzenedimethanol (CAS No. 626-18-6), 1,3-cyclohexanediol (CAS No. 504-01-8), 2,6-bis(hydroxymethyl)-p-cresol (CAS No. 91-04-3), 4,8-bis(hydroxymethyl)tricyclo[5.2.1.02,6]decane (CAS No. 26896-48-0), 1,3-propanediol (1,3-PDO, CAS 504-63-2), 1,5-pentanediol (1,5-PDO, CAS 111-29-5), 1,4-butanediol (1,4-BDO, 110-63-4), dipentaerythritol, pentaerythritol, erythritol, polyether polyols (e.g. polytrimethylene glycol, polytetramethylene glycol), polyester polyols, xylitol, lactitol, isomalt, sorbitol, mannitol, ethylene glycol (1,2-ethanediol), lignin polyols, cellulose, fructose, polyols obtained from unsaturated fatty acids by ozonolysis and hydrogenation, and mixtures thereof. Preferred alcohols are those from renewable sources, such as glycerin, 1,3-PDO, 1,5-PDO, and 1,4-BDO, and sugar alcohols such as xylitol, lactitol, isomalt, sorbitol, mannitol, lignin polyols, cellulose, and fructose. Glycerin, 1,3-PDO, 1,5-PDO, and 1,4-BDO are particularly suitable from this group.A particularly preferred example of a suitable alcohol is glycerin, alone or in a mixture with another alcohol, in particular in a mixture with one or more of the alcohols used in the exemplary embodiments in mixtures with glycerin. The proportion of the at least one primary alcohol in the hardener component (B) is about 20 to about 90 wt. %, preferably about 30 to about 80 wt. %, more preferably about 40 to about 80 wt. %, and particularly preferably about 50 to about 70 wt. %, based on the total weight of the hardener component (B). Copper(II) tetrafluoroborate The copper(II) tetrafluoroborate is required according to the invention in order to effect curing of the curable epoxy resin with the primary alcohol within an acceptable time. It therefore acts as an accelerator. Copper(II) tetrafluoroborate hydrate (CAS No. 207121-39-9) with the molecular formula Cu(BF4)2 x H2O is used.Copper(II) tetrafluoroborate hydrate crystallizes with an indeterminate number of crystal water molecules. Preferably, a number of 1 to 12 water molecules are present as water of hydration, more preferably 4 to 8 water molecules. In some embodiments, mixtures of the hydrates are present. In one embodiment, copper(II) tetrafluoroborate hexahydrate (CAS No. 72259-10-0) with 6 water molecules is present as water of hydration. In one embodiment, anhydrous copper(II) tetrafluoroborate (CAS No. 38465-60-0) is used. Typically, the molar fraction of copper(II) tetrafluoroborate in component (B) is from about 1 to about 20 mol% based on the molar amount of the at least one primary alcohol (i.e., the total amount of all alcohols with at least one primary OH group in mol) in component (B). Preferably, the molar fraction is about 2 to about 15 mol% based on the molar amount of the at least one primary alcohol in component (B).Even more preferably, the molar fraction is from about 2 to about 12 mol% based on the molar fraction of the at least one primary alcohol in component (B). The molar fractions are calculated, as is known to those skilled in the art, via the molar mass of the at least one primary alcohol used and the molar mass of the copper(II) tetrafluoroborate used. The proportion of copper(II) tetrafluoroborate used according to the invention depends on the curing time required for the application, the curing temperature, as well as on the at least one primary alcohol used and the curable epoxy resin used, and can be varied according to the respective application. For example, the proportion of copper(II) tetrafluoroborate used according to the invention can be reduced if the curing temperature is increased.Further constituents of components (A) and (B) Both the resin component (A) and the hardener component (B), as well as both components (A) and (B), typically comprise at least one further constituent in addition to the curable epoxy resin or the primary alcohol and the copper(II) tetrafluoroborate. Other common constituents are, in particular, reactive diluents, fillers, adhesion promoters, rheology additives and thickeners (thixotropic agents). Depending on the further constituent, it may be preferred that the at least one further constituent is present only in the resin component (A), only in the hardener component (B), or in both components. Reactive diluent In one embodiment, the resin component (A) and / or the hardener component (B), preferably at least the resin component (A), can contain at least one reactive diluent.Glycidyl ethers of aliphatic, cycloaliphatic or aromatic mono- or especially polyalcohols are used as reactive diluents, which have a lower molecular mass and viscosity than the curable epoxy resins described above. Examples of suitable reactive diluents are monoglycidyl ethers, e.g. o-cresyl glycidyl ether, and glycidyl ethers with an epoxide functionality of at least 2, such as 1,4-butanediol diglycidyl ether (BDDGE), cyclohexanedimethanol diglycidyl ether and hexanediol diglycidyl ether (HDDGE), as well as tri- or higher glycidyl ethers, such as glycerol triglycidyl ether, pentaerythritol tetraglycidyl ether, trimethylolpropane triglycidyl ether (TMPTGE) or trimethylolethane triglycidyl ether (TMETGE), with BDDGE, HDDGE, trimethylolpropane triglycidyl ether and trimethylolethane triglycidyl ether being preferred.Mixtures of two or more of these reactive diluents can also be used, preferably mixtures containing triglycidyl ether, particularly preferably as a mixture of 1,4-butanediol diglycidyl ether (BDDGE) and trimethylolpropane triglycidyl ether (TMPTGE) or 1,4-butanediol diglycidyl ether (BDDGE) and trimethylolethane triglycidyl ether (TMETGE). Particular preference is given to the reactive diluents used in the examples and the mixtures thereof used therein. The at least one reactive diluent, if present, is preferably present in a proportion of >0 to about 30 wt.% based on the total weight of the component in which the reactive diluent is present (for example the resin component (A)), in particular in a proportion of about 10 to about 25 wt.% based on the total weight of the component. Fillers Both the resin component (A) and the hardener component (B) can contain at least one filler.It is preferred that both the resin component (A) and the hardener component (B) each contain at least one filler. Inorganic fillers, in particular quartz, aluminum oxide, glass, corundum, porcelain, earthenware, barite, light spar, gypsum, talc, and / or chalk, as well as mixtures thereof, are preferably used as fillers. Preferably, the at least one filler is a non-basic filler. In particular, the at least one filler is not cement. Basic fillers such as cements (e.g., Portland cement or aluminate cement) are typically omitted according to the invention, since they can slow down or prevent the curing of the epoxy resin composition after mixing components (A) and (B) of a multi-component resin system according to the invention. The fillers can be added in the form of particles (for example, in the form of powders, sands, or flours) or molded bodies (the latter preferably in the form of fibers or spheres).By selecting the appropriate fillers in terms of type and particle size distribution, particle size, or (fiber) length, application-relevant properties such as rheological behavior, extrusion forces, internal strength, tensile strength, pull-out forces, and impact strength can be controlled. Suitable fillers include non-surface-treated quartz flours, fine quartz flours, and ultra-fine quartz flours, such as Millisil W3, Millisil W6, Millisil W8, and Millisil W12, preferably Millisil W12. Silanized quartz flours, fine quartz flours, and ultra-fine quartz flours can also be used. These are available, for example, under the Silbond product series from Quarzwerke. The Silbond EST (epoxysilane-modified) and Silbond AST 25 (aminosilane-treated) product series are particularly preferred.Furthermore, aluminum oxide-based fillers such as the ASFP aluminum oxide fine filler from Denka, Japan (d50 = 0.3 µm) or grades such as DAW or DAM with the type designations 45 (d50 < 0.44 µm), 07 (d50 > 8.4 µm), 05 (d50 < 5.5 µm), and 03 (d50 < 4.1 µm) can be used. Furthermore, the surface-treated fine and ultra-fine fillers Aktisil AM 30 (aminosilane-treated, d50 = 2.2 µm) and Aktisil EM (epoxysilane-treated, d50 = 2.2 µm) from Hoffman Mineral can be used. The fillers can be used individually or in any desired mixture. Non-surface-treated quartz powder, in particular Millisil W12, is particularly preferred. The total filler content of an epoxy resin composition comprising components (A) and (B), when at least one filler is present, is in a range from >0 to about 60% by weight, preferably in a range from about 10 to about 50% by weight, more preferably in a range from about 15 to about 35% by weight.The total filler content of the epoxy resin composition refers to the weight percentage of filler based on the total weight of component (A) and component (B). The proportion of fillers in the resin component (A) is preferably about 1 to about 60 wt. %, more preferably about 15 to about 50 wt. %, based on the total weight of the resin component (A). The proportion of fillers in the hardener component (B) is preferably about 1 to about 50 wt. %, more preferably about 5 to about 40 wt. %, based on the total weight of the hardener component (B). Thickeners and other optional constituents In one embodiment, the resin component (A), the hardener component (B), or both components may contain at least one thickener. Suitable thickeners are, if appropriate, organically post-treated pyrogenic silica, bentonites, alkyl and methyl celluloses, and castor oil derivatives, or mixtures of two or more thereof.Organically post-treated fumed silica is particularly preferred. In a preferred embodiment, component (A) and / or component (B) of a multi-component resin system according to the invention comprises quartz powder and silica. Furthermore, adhesion promoters can be used to improve the crosslinking of a substrate (for example, a borehole wall) with an epoxy resin composition produced from a multi-component resin system. Suitable adhesion promoters are silanes that have at least one Si-bonded hydrolyzable group.Preferred examples are 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldiethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminoethyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and trimethoxysilylpropyldiethylenetetramine, as well as mixtures thereof. Further silanes are described, for example, in EP 3 000 792 A1. Further optional components are rheology additives for adjusting the flow properties. Suitable rheology additives are: layered silicates such as laponites, bentonites or montmorillonite, Neuburg Siliceous Earth, fumed silica, polysaccharides; polyacrylate, polyurethane or polyurea thickeners and cellulose esters.For optimization, wetting and dispersing agents, desensitizers, surface additives, plasticizers such as phthalic or sebacic esters, wax additives, stabilizers, antistatic agents, flexibilizers, curing catalysts, other reaction rate controllers, defoamers and deaerators, viscosity reducers, or other process additives can also be added. Coloring additives such as dyes or pigments are also conceivable, for example, to color the components differently for better control of their mixing. Mixing ratios of components (A) and (B): Components (A) and (B) are preferably mixed in such a ratio that the EEW and the alcohol hydrogen equivalent weight (AHEW) result in a balanced stoichiometry of reactive epoxy groups and primary alcohol groups.As already mentioned above, the EEW for commercially available epoxy resins is usually specified by the manufacturer or is determined or calculated using known methods. The EEW value indicates the amount in g of resin containing 1 mol of epoxy groups and has the unit g / EQ (i.e., g per molar equivalent). The AHEW is determined mathematically or experimentally in a manner known to those skilled in the art based on the alcohol used. The AHEW value indicates the amount in g of alcohol containing 1 mol of primary OH groups and has the unit g / EQ (i.e., g per molar equivalent). The calculated AHEW value can be determined mathematically as described above. The experimental AHEW value can be obtained experimentally by determining the glass transition temperature (Tg) of a mixture comprising an epoxy resin (with known EEW) and one or more alcohols. The glass transition temperatures of epoxy resin / alcohol mixtures with different ratios are determined.The sample is cooled from 20 to -50°C at a heating rate of -10 K / min, heated to 180°C in a first heating run (heating rate 10 K / min), then cooled back to -50°C (heating rate -10 K / min), and heated to 180°C (20 K / min) in the final step. The mixture with the highest glass transition temperature in the second heating run ("Tg2") has the optimal ratio of epoxy resin to alcohol. The AHEW value can be calculated as follows from the known EEW and the optimal epoxy resin / alcohol ratio. Example: EEW = 158 g / EQ Mixture of alcohol / epoxy resin with maximum Tg2: 1 g alcohol with 4.65 g epoxy resin AHEW (alcohol) = 1 g*158 g / EQ : 4.65 g = 33.9785 g / EQ Use When used, the resin component (A) and the hardener component (B) are mixed in a suitable device, for example a static mixer or a dissolver, resulting in an epoxy resin mass.When used as a "chemical anchor" for chemical fastening, the mixture is prepared directly in front of or in a hole (preferably a drilled hole) or gap, and the epoxy resin compound is then injected into the (possibly previously cleaned) hole or gap using a known injection device. The component to be fixed is then inserted into the epoxy resin compound, which is preferably a mortar compound, and adjusted. The compound then hardens. When used as an adhesive or coating, the epoxy resin compound is mixed using a suitable method (static mixer, manual stirring) and then applied to the parts to be bonded or to the substrate to be coated. Optionally, the compound can be heated to cure.The reactive components of the hardener component (B) react with the epoxy resins of the resin component (A), so that the epoxy resin mass cures within a desired time under ambient conditions, for example on the construction site. This chemical reaction depends on the temperature, the humidity in the environment and the substrate, the chemical composition of the substrate, and the components used for components (A) and (B). Ambient conditions can vary, such as low temperatures (e.g., -5°C) or high temperatures (e.g., 40°C) during the night-day cycles. At high ambient temperatures, the substrate can heat up, with substrate temperatures of over 30°C; even over 40°C, and even of approximately 100°C or more being possible. A multi-component resin system according to the invention is preferably used for construction purposes.The term "for construction purposes" refers to construction bonding and coating, as well as the use of the multi-component resin system as a chemical anchor. The substrates onto or into which the multi-component system is applied are preferably non-basic. It is used in particular on or in brick, stone, steel, or wood. It is used as an adhesive (in construction bonding) in particular for bonding combinations of brick / brick, brick / steel, wood / wood, wood / steel, steel / steel, or one of the aforementioned materials to other mineral materials (which are preferably non-basic), for the structural reinforcement of components made of wood, masonry, and other mineral materials (which are preferably non-basic), for the reinforcement of building structures with fiber-reinforced polymers, and for chemical fastening to surfaces made of brick, stone, wood, steel, or other mineral materials (which are preferably non-basic).The use as a chemical anchor is particularly for the chemical fastening of structural elements and anchoring means, such as anchor rods, anchor bolts, (threaded) rods, (threaded) sleeves, reinforcing iron, screws and the like, in (drilled) holes or gaps in various substrates, such as masonry, other mineral materials (which are preferably non-basic), metals (e.g. steel), ceramics, plastics, glass and wood. The substrates are preferably non-basic. In particular, the substrate is preferably not concrete or cement. Very particularly preferably, a multi-component resin system according to the invention is used for the chemical fastening of anchoring elements in a hole (in particular a drilled hole) or gap in a building substrate. The use typically takes place at a substrate temperature of approximately -10°C to approximately 180°C.Use as a chemical anchor typically occurs at a substrate temperature of about -10°C to about 180°C, preferably from about 0°C to about 120°C, more preferably from about 10°C to about 60°C, even more preferably from about 20°C to about 40°C, particularly preferably at a substrate temperature of about 25°C. In contrast, use as an adhesive can preferably also occur at temperatures of about 20°C to about 180°C, more preferably at temperatures of about 50°C to about 150°C, even more preferably from about 80°C to about 120°C. A higher temperature achieves faster curing and / or less copper(II) tetrafluoroborate is required.Substrate temperatures of approximately 120°C to approximately 180°C are possible, particularly with external heat input. External heat input is particularly suitable for accelerating the fastening of small components in holes or gaps and in particular as a means of accelerating curing or reducing the amount of copper(II) tetrafluoroborate required for curing. For use as a chemical anchor in the construction sector, particularly for large components, the substrate temperature typically depends on the ambient temperature. In addition, use as a chemical anchor typically occurs on a substrate found in buildings, such as steel, wood, stone, or brick. This substrate is preferably non-basic. In particular, the substrate is preferably not concrete or cement.Preferred Embodiments Component (A): In a preferred embodiment, component (A) of a multi-component resin system according to the invention comprises bisphenol F diglycidyl ether, quartz flour, and silica. In another preferred embodiment, component (A) of a multi-component resin system according to the invention comprises bisphenol F diglycidyl ether and bisphenol A diglycidyl ether, as well as 1,4-butanediol diglycidyl ether, trimethylolpropane triglycidyl ether, quartz flour, and silica. In a particularly preferred embodiment, component (A) of a multi-component resin system according to the invention comprises from about 55 to about 65 wt. % bisphenol F diglycidyl ether, as well as from about 35 to about 45 wt. % quartz flour, and from about 1 to about 3 wt. % silica, based on the total weight of component (A). In another particularly preferred embodiment, component (A) of a multi-component resin system according to the invention comprises from about 35 to about 45 wt.-% bisphenol F diglycidyl ether, from about 15 to about 25 wt.% bisphenol A diglycidyl ether, and from about 5 to about 10 wt.% 1,4-butanediol diglycidyl ether, from about 5 to about 10 wt.% trimethylolpropane triglycidyl ether, from about 35 to about 45 wt.% quartz flour and from about 1 to about 3 wt.% silica, based on the total weight of component (A). In a preferred embodiment, component (B) of a multi-component resin system according to the invention comprises 1,2,3-propanetriol and copper(II) tetrafluoroborate hydrate. In a highly preferred embodiment, component (B) of a multi-component resin system according to the invention comprises from about 40 to about 65 wt. % 1,2,3-propanetriol and from about 5 to about 25 wt. % copper(II) tetrafluoroborate hydrate, based on the total weight of component (B). In an even more preferred embodiment, component (B) of a multi-component resin system according to the invention comprises from about 40 to about 65 wt. % 1,2,3-propanetriol and from about 5 to about 25 wt. % copper(II) tetrafluoroborate hydrate, from about 10 to about 40 wt. % quartz flour, and from about 1 to about 3 wt. % silica, based on the total weight of component (B).In another highly preferred embodiment, component (B) of a multi-component resin system according to the invention comprises from about 40 to about 65 wt.% 1,2,3-propanetriol, from about 30 to about 40 wt.% of another primary alcohol having an OH functionality of about 2 or greater, and from about 5 to about 25 wt.% copper(II) tetrafluoroborate hydrate, based on the total weight of component (B). In an even more preferred embodiment, component (B) of a multi-component resin system according to the invention comprises from about 40 to about 65 wt.% 1,2,3-propanetriol, from about 30 to about 40 wt.% of another primary alcohol having an OH functionality of about 2 or greater, and from about 5 to about 25 wt.% copper(II) tetrafluoroborate hydrate, from about 10 to about 40 wt.% quartz flour and from about 1 to about 3 wt.% silica, based on the total weight of component (B).Components A+B Very particularly preferred as components of a multi-component resin system according to the invention are the combinations of the epoxy resins and the primary alcohols which are used in the example compositions, in particular in the weight proportions used there and very particularly preferably in combination with the other components of components (A) and (B) used there. Most preferred are those compositions of components (A) and (B) which are described in the examples. In a particularly preferred embodiment of a multi-component resin system according to the invention, component (A) comprises from about 55 to about 65 wt. % bisphenol F diglycidyl ether, as well as from about 35 to about 45 wt. % quartz powder and from about 1 to about 3 wt. % silica, based on the total weight of component (A); and component (B) from about 40 to about 65 wt. % 1,2,3-propanetriol, from about 5 to about 25 wt.-% copper(II) tetrafluoroborate hydrate, from about 10 to about 40 wt.% quartz flour and from about 1 to about 3 wt.% silica based on the total weight of component (B). In another particularly preferred embodiment of a multi-component resin system according to the invention, component (A) comprises from about 35 to about 45 wt.% bisphenol F diglycidyl ether, from about 15 to about 25 wt.% bisphenol A diglycidyl ether, and from about 5 to about 10 wt.% 1,4-butanediol diglycidyl ether and from about 5 to about 10 wt.% trimethylolpropane triglycidyl ether, from about 35 to about 45 wt.% quartz flour and from about 1 to about 3 wt.% silica based on the total weight of component (A); and component (B) from about 40 to about 65 wt.% 1,2,3-propanetriol, from about 5 to about 25 wt.% copper(II) tetrafluoroborate hydrate, from about 10 to about 40 wt.% quartz flour and from about 1 to about 3 wt.% silicic acid based on the total weight of component (B).The invention is further described below using exemplary embodiments, which, however, are not intended to be limiting. EXEMPLARY EMBODIMENTS Preparation of Components (A) and (B) The ingredients used for components (A) and (B) are listed in Table 2. Table 2: Ingredients used. The proportions of the individual constituents in components (A) and (B) in Examples A1-A5, B1-B3, and C1-C4 are given below in Tables 3, 7, and 9, respectively, in weight percent (wt%). To prepare the resin component (A), its liquid components were first mixed. Then, quartz powder and silica were added and stirred in a dissolver (PC laboratory system, volume 1L) under vacuum at 3500 rpm for 10 minutes. To prepare the hardener component (B), the alcohols contained therein were mixed. Then, copper(II) tetrafluoroborate hydrate was added and dissolved in the resulting mixture. The quartz powder and silica were then added and stirred in a dissolver (PC laboratory system, volume 1L) under vacuum at 3500 rpm for 10 minutes.Preparation for the use of components (A) and (B) For use as a chemical anchor, as an adhesive or as a coating, components (A) and (B) were mixed together for 30 seconds using a Speedmixer (Hauschild, Hamm) shortly before their use and the resulting mixture was immediately filled into a 1-component cartridge. The mixing ratio was selected so that a balanced stoichiometry of EEW and AHEW was achieved, as described above. The material was injected from the 1-component cartridge through a nozzle at the desired location. Measurement methods for the characterization of the multi-component resin systems To characterize a multi-component resin system, the gel time, ShoreA hardness, ShoreD hardness, tensile shear strength and / or glass transition temperature of the resulting mixture were analyzed after mixing its components (A) and (B).These parameters are key figures for determining the suitability of a multi-component resin system for use according to the invention as a chemical anchor, coating, and / or adhesive. Determination of the gel time: 20 mL of an epoxy resin composition were prepared from components (A) and (B), and these were mixed in a speed mixer for 30 s. The mixing ratio was selected so that a balanced stoichiometry of EEW and AHEW was achieved. Immediately after mixing, the silicone bath was heated to 25°C, and the temperature of the sample was measured. The gel time was determined using a commercially available device (GELNORM® Gel Timer) at a temperature of 25°C. The sample itself is placed in a test tube, which is placed in an air jacket immersed in the silicone bath for temperature control. The heat development of the sample is plotted against time. The evaluation is carried out according to DIN 16945. The maximum temperature reached (T. max) and the time after which the temperature maximum was reached (= gel time, t Tmax) Determination of Shore A and Shore D hardness The epoxy resin mass consisting of components (A) and (B) prepared as described above (under “Preparation”) was dispensed from the 1-component cartridge for use as a coating into an aluminum crucible, spread out to form a 0.4 cm thin layer and then cured at 25°C. The Shore hardness was determined in accordance with ASTM D2240. The Shore A hardness of the 0.4 cm thin layer of the curing epoxy resin mass was measured 4.5 h and 6.5 h (see below) after spreading using the HBD 100-0 hardness tester from Sauter GmbH. The Shore D hardness of the 0.4 cm thin layer of the cured epoxy mass was measured 24 hours after spreading using the HBD 100-0 hardness tester from Sauter GmbH.Pull-out tests For pull-out tests on wood, the following procedure was followed in accordance with EAD 130006-00-0304: First, boreholes (diameter as specified below for the individual examples, borehole depth 122 mm) were drilled into a horizontally lying test specimen made of GLT (glue laminated timber, spruce) using a hammer drill. The boreholes were cleaned (blown out twice with 6 bar compressed air). The boreholes were then filled two-thirds full, starting from the bottom of the borehole, with the respective curable epoxy resin compound to be tested, which was prepared as described above (under “Preparation”) from the respective components (A) and (B), using the 1-component cartridge. A steel threaded rod (diameter as specified below for the examples) was pressed into each borehole by hand (embedment depth as specified in the respective example). The excess epoxy resin compound was removed using a spatula. Curing took place at 25°C.After the time specified for each test, the threaded rod was pulled out until failure, while the failure load was measured. A support with a diameter of 26 mm was used for the pull-out tests. For brick pull-out tests, the following procedure was followed according to EAD 330076-00-0604: First, holes (diameter as specified in the examples, hole depth approx. 87 mm) were drilled into a horizontally positioned solid brick (supplier: Rais Ziegel Schmid, Schwabmünchen, Germany; dimensions: 240 x 113 x 113 mm; compressive strength: 21.8 N / mm). 2 ; Gross density 1.8 kg / dm 3) were drilled with a hammer drill. The drill holes were cleaned (2x blowing out (compressed air) 6 bar, 2x brushing, 2x blowing out (compressed air 6 bar)). Sieve sleeves (type specified in the respective examples) were inserted into the cleaned drill holes. The sieve sleeves were then filled two-thirds full from the bottom with the respective curable epoxy resin compound to be tested, which was prepared as described above (under "Preparation") from the respective components (A) and (B), using the 1-component cartridge. A steel threaded rod (diameter as specified below in the examples) was pressed into each drill hole by hand (embedment depth as specified in the example). The excess mortar was removed using a spatula. After curing at 25°C for the time specified in the respective example, the threaded rod was pulled until failure and the failure load was measured.For concrete pull-out tests, the following procedure was followed in accordance with EAD 330499-00-0601: First, holes (14 mm diameter; 62 mm depth) were drilled into a horizontally positioned concrete test specimen (strength class C20 / 25) using a hammer drill. The holes were cleaned (2x blowing out (compressed air) at 6 bar, 2x brushing, 2x blowing out (compressed air at 6 bar)). The holes were then filled two-thirds full, starting from the bottom of the hole, with the curable epoxy resin compound, which was prepared from the respective components (A) and (B) as described above (under "Preparation"), using the 1-component cartridge. A steel threaded rod (diameter as specified below in the examples) was pressed into each hole by hand (embedment depth as specified in the example). The excess mortar was removed using a spatula.After curing at 25°C for the time specified for each example, the threaded rod was pulled until failure, measuring the failure load. Determination of the tensile shear strength: The epoxy resin compound prepared from the respective components (A) and (B) as described above (under "Preparation") was applied to a steel plate measuring 12 x 25 mm using a single-component cartridge in a layer thickness of 2 mm. A second steel plate was then manually pressed onto the plate. Curing took place for 1 or 2 hours at 100°C. The tensile shear strength was then determined according to DIN EN 1465:2009-07 at a test speed of 10 mm / min. Determination of the glass transition temperature To determine the glass transition temperature, the epoxy resin mass obtained by mixing in the Speedmixer (30 sec), consisting of components (A) and (B) of the multi-component resin system, was cured for 24 h at 25°C.The sample was spread out in a layer thickness of 1 mm for curing and cured at this layer thickness. An amount of approximately 15 mg of the cured sample was used for the measurement. The glass transition temperature was determined using the differential scanning calorimetry (DSC) method (STARe System DSC from Mettler Toledo). The sample was cooled from 20°C to -50°C at a heating rate of -10 K / min and held there for 5 minutes. The sample was then heated to 180°C in a first heating run (heating rate 10 K / min), held there for 5 minutes, then cooled back to -50°C (heating rate -10 K / min), held there for 5 minutes, and finally heated again to 180°C (20 K / min). The "Tg1" was determined graphically in the first heating run and the "Tg2" in the second heating run. Examples A1-A5 The multi-component resin systems of (comparative) examples A1-A5 were tested according to Table 3. Table 3: Examples A1-A5. *Comparative example EEW = 290 g / EQ (manufacturer's information), AHEW = 73 g / EQ (calculated as described above) Example A1 is a non-inventive comparative example in which the copper(II) tetrafluoroborate hydrate is missing. Results A1-A5 for gel time tTmax and maximum temperature Tmax The test results of the (comparative) examples A1-A5 in Table 4 show that the use of the copper(II) tetrafluoroborate hydrate in component (B) enables curing of the epoxy resin composition after mixing components (A) and (B), whereas in the absence of copper(II) tetrafluoroborate hydrate in comparative example A1 no curing reaction takes place. A proportion of 10 wt. % copper(II) tetrafluoroborate hydrate in component (B) in example A2 initially leads to slow curing without a noticeable temperature increase.With increasing weight fraction of copper(II) tetrafluoroborate hydrate in component (B), the gel time tTmax becomes shorter, which indicates faster curing. At the same time, the maximum temperature Tmax also increases, as the exothermic curing reaction releases the reaction heat in a shorter time. Thus, the curing time can be controlled by the amount of copper(II) tetrafluoroborate hydrate used. Table 4: Gel time t determined for examples A1 to A5. Tmax and T max *nb = not determined Results A3 and A4 for Shore A and Shore D hardness The epoxy resin compounds from Examples A3 and A4 were applied as a coating as described above, and their Shore A and Shore D hardnesses were determined as described above. The test results in Table 5 show that the coating made from epoxy resin compound A4 had a higher Shore A hardness after just 4.5 hours than the coating made from epoxy resin compound A3 after 6.5 hours. The Shore D hardness reached the same value for A3 and A4. Thus, the epoxy resin compounds are also suitable as a coating, although a higher proportion of copper(II) tetrafluoroborate hydrate leads to a harder coating more quickly. Table 5: Shore A and Shore D hardness determined for Examples A3 and A4 at a layer thickness of 0.4 cm *nb = not determined The measured hardnesses are typical for coatings (common coating Shore D hardnesses are typically between 50 and 100), which demonstrates the suitability of the tested epoxy resin compounds for the production of coatings. Results A2 and A4 for pull-out tests Components (A) and (B) of Example A2 were mixed as described above and tested with a wooden pull-out test as described above. In the pull-out test, an M12 threaded rod was used, with a borehole diameter of 14 mm and an embedment depth of 120 mm. The measured tensile force (in kN) was expressed as the area of ​​the borehole wall (in mm 2 ) and converted into a tensile strength (in MPa). The tensile strength calculated in this way is shown in Table 6. Table 6: Pull-out tests on wood using Example A2 These results represent acceptable tensile strengths for chemical anchors. Components (A) and (B) of Example A2 were mixed as described above and tested with a concrete pull-out test as described above. An M12 threaded rod was used in the pull-out test, with an embedment depth of 60 mm. Even after 24 hours at 25°C, no curing was observed. This demonstrates that the epoxy resin is unsuitable for anchoring in concrete. Components (A) and (B) of Example A4 were mixed as described above and tested with a brick pull-out test as described above. Drill hole diameter 16 mm, HIT-SC 16x85 sieve sleeve, M10 threaded rod, embedment depth 80 mm. After 24 hours of curing at 25°C, the measured failure load was 19.1 kN. This failure load is in the order of magnitude measured with commercially available chemical anchors.Examples B1-B3 The multi-component resin systems of Examples B1-B3 were tested according to Table 7. Table 7: Examples B1-B3. EEW = g / EQ (manufacturer's specifications), AHEW = 82 g / EQ (calculated as described above) Results B1-B3 for lap shear strength. Examples B1-B3 were tested for lap shear strength as described above. The test results in Table 8 show that lap shear strength increases with higher proportion of copper(II) tetrafluoroborate hydrate in component (B) and longer curing time. Table 8: Lap shear strength when used as an adhesive for B1-B3 Examples C1-C4 Table 9 shows the compositions of components (A) and (B) of Examples C1-C4, which contain various alcohols in component (B). C1 contains only glycerol, while C2-C4 contain mixtures of other alcohols with glycerol. Table 9: Examples C1-C4 with different alcohols For Examples C1-C4, the glass transition temperature was determined as described above. The test results in Table 10 show that the cured epoxy resin compositions have similar glass transition temperatures for Tg1 in the range of -17.5°C to 9.5°C and for Tg2 in the range of 30°C to 59°C, and consequently, these cured epoxy resin compositions are also suitable for use according to the invention. Table 10: Glass transition temperatures of Examples C1-C4 Example D1 Analogous to Example A4, in Example D1, quartz powder was replaced with cement as the filler in component (B). Table 11: Example with cement as the filler EEW = 290 g / EQ (manufacturer's specifications), AHEW = 73 g / EQ (calculated as described above). Components (A) and (B) of Example D1 were mixed as described above. Curing was tested by stirring with a wooden spatula. The epoxy resin mass showed no observable curing within 24 hours at 25°C, i.e., it had a very low viscosity, as it did immediately after mixing. This example demonstrates that cement is unsuitable as a filler.

Claims

PATENT CLAIMS 1. A multi-component resin system comprising at least one resin component (A) comprising at least one curable epoxy resin; and at least one curing agent component (B) comprising a curing agent for the epoxy resin contained in the resin component (A), wherein the curing agent is at least one primary alcohol having an average OH functionality of about 2 or greater; further comprising copper(II) tetrafluoroborate in anhydrous form or as a hydrate.

2. The multi-component resin system according to claim 1, in the form of a two-component system.

3. The multi-component resin system according to claim 1 or 2, wherein the copper(II) tetrafluoroborate is contained only in component (B). 4.The multicomponent resin system according to claim 3, wherein the copper(II) tetrafluoroborate is present in component (B) in a molar fraction of about 0.1 to about 20 mol% based on the molar fraction of the at least one alcohol, preferably the copper(II) tetrafluoroborate is present in component (B) in a molar fraction of about 1 to about 20 mol% based on the molar fraction of the at least one alcohol. 5.The multi-component resin system according to any one of claims 1 to 4, wherein the curable epoxy resin is a compound selected from the group consisting of glycidyl ethers of polyhydric phenols having an epoxide functionality of about 1.5 or greater and epoxidized vegetable oils, and mixtures thereof; preferably glycidyl ethers based on resorcinol, bisphenol A and F, novolaks, 4,4'-dihydroxyphenylcyclohexane isosorbide diglycidyl ether, 4,4'-dihydroxy-3,3'-dimethyldiphenylpropane isosorbide diglycidyl ether, limonene 1,2:8,9-dioxide, vanillin diglycidyl ether, phloroglycinol. triglycidyl ether, vanillic acid bisepoxide, epoxidized castor oil and epoxidized cardanol oil, as well as mixtures thereof.

6. The multi-component resin system according to any one of claims 1 to 5, wherein the at least one primary alcohol is a compound selected from the group consisting of 1,2,3-propanetriol (glycerol), 1,3-benzenedimethanol, 1,3-cyclohexanediol, 2,6-bis(hydroxymethyl)-p-cresol, 4,8-bis(hydroxymethyl)tricyclo[5.2.1.0 2,6 ]decane, 1,3-propanediol, 1,5-pentanediol, and 1,4-butanediol, as well as mixtures thereof, wherein the at least one primary alcohol is preferably 1,2,3-propanetriol or a mixture of 1,2,3-propanetriol and one or more other alcohols having an average OH functionality of about 2 or greater. 7.The multi-component resin system according to any one of claims 1 to 6, additionally comprising at least one filler, wherein the filler is present either in component (A) or in component (B) or in both components (A) and (B).

8. The multi-component resin system according to claim 7, wherein the filler is a compound selected from the group consisting of oxides of silicon and aluminum, optionally with additional further cations, preferably selected from the group consisting of quartz, silicates, and aluminates, in particular quartz powder.

9. The multi-component resin system according to claim 7, wherein the filler is a non-basic filler, and wherein the filler is preferably not cement.Epoxy resin composition produced by mixing the resin component (A) and the hardener component (B) of the multi-component resin system according to any one of claims 1 to 9, characterized in that the mixing ratio of the at least one resin component (A) to the at least one hardener component (B) is selected such that the stoichiometric ratio between reactive epoxy groups and primary alcohol groups is approximately 1:

1.

11. Use of the multi-component resin system according to any one of claims 1 to 9 or the epoxy resin composition according to claim 10 as an adhesive or as a coating.

12. Use of the multi-component resin system according to any one of claims 1 to 9 or the epoxy resin composition according to claim 10 for the chemical fastening of structural elements in boreholes or cracks.

13. The use according to any one of claims 11 and 12, wherein the use takes place at a substrate temperature of about -10°C to about 180°C.

14. The use according to any one of claims 11 to 13 on a non-basic substrate, wherein the substrate is preferably not concrete.

15. The use according to any one of claims 11 to 13, wherein the substrate is steel, wood, stone, or brick.

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