Lock chamber

Abstract

The invention relates to a lock chamber for a substrate treatment system with a inlet lock flap and an outlet lock flap, wherein the lock chamber is suitable and designed for introducing a ventilation gas into the interior of the lock chamber, wherein the lock chamber furthermore has, in its interior, at least two parallel shielding plates, a transport device for transporting a substrate through between the shielding plates and a heating device, wherein the shielding plates have a material which is at least partially transparent at least in the infrared range. The invention also relates to a substrate treatment system having such a lock chamber, and to a method for transferring a glass substrate from a low-pressure region into a region with higher pressure by means of such a lock chamber.

Description

[0001] Lock chamber

[0002] The present invention relates to a lock chamber and a substrate treatment system. In particular, the invention relates to a lock chamber suitable for transferring large-area glass substrates between two areas of different pressure, for example, from a vacuum area to an atmospheric pressure area.

[0003] Lock chambers can generally be used in systems in which substrates, for example glass substrates, are subjected to a treatment, preferably in a vacuum or in a process gas atmosphere.

[0004] For example, DE 10 2010 028 958 A1 describes a substrate treatment system for vacuum coating plate-shaped substrates such as glass panes. The system described has an entry lock, a vacuum area, and an exit lock. The vacuum area of ​​the substrate treatment system can also contain areas for heating or cooling the substrates. To treat glass substrates in the vacuum area, the glass substrates are usually heated. Depending on the type of treatment, the glass substrates are heated to or above their softening point. Particularly problematic is the cooling of the glass substrates required after heating, or the transfer of the glass substrates from the vacuum area via the exit lock chamber into an atmospheric pressure area, as this can lead to undesirable stresses in the glass part, which can cause the glass part to deform or even crack.Therefore, cooling in the vacuum section should generally be carried out in a well-controlled manner in order to reduce uneven heating or cooling and thus the introduction of undesirable residual stresses.

[0005] Various devices are known from the prior art that address the problem of uniform temperature distribution within the substrates. For example, DE 10 2009 037 299 A1 discloses a treatment chamber for thermally processing a flat substrate, with the goal of achieving well-controlled cooling of the substrates in a lock chamber. The patent discloses that heating and cooling are to be achieved using preheated or precooled gas from nozzles. Compared to tempering the substrate using radiant energy, tempering using gas could offer time advantages. However, the described design is technically extremely complex and therefore expensive to implement as a vacuum lock.Furthermore, the process is difficult to manage within the typically required processing times of often less than one minute, particularly since the gas introduction, which also serves to increase the pressure in the lock, must be controlled with regard to the substrate temperature and cannot be carried out with maximum time efficiency. Another method for heating or cooling glass substrates is disclosed in WO 03 / 006390 A1. The method aims to simplify the structural design of substrate treatment systems by heating or cooling the glass substrates in a lock chamber via convection using a warm or cooled air stream. This air stream can be pre-tempered within the chamber by heating or cooling elements.A glass substrate transferred on rollers through the substrate treatment system can then be exposed to the pre-tempered air by directing it onto the glass substrate through nozzles arranged in a partition wall above and below the glass substrate. Again, this method, known as lock flooding, cannot be carried out in a maximum time-efficient manner, but rather with consideration for the required temperature control on the glass substrate.

[0006] A similar structure is also disclosed in DE 698 12 251 T2. The disclosure shows an air system for heating glass plates during a heating cycle, using both radiation from heating elements and convection of a preheated air stream to heat the glass substrate to a desired target temperature.

[0007] Systems that use pre-tempered gas or air to control the temperature of the glass substrate cannot be used in the vacuum area of ​​a substrate treatment system. Furthermore, the known systems cannot simply be used in a lock chamber, as implementation would be particularly technically complex. For example, the gas distribution over the substrate when flooding the lock is very complex, especially during the transition from molecular to laminar flow. Depending on the temperature conditions in the lock and the thickness of the glass substrate, the known processes are difficult to control even in typical lock times of less than one minute, at least because the additional gas distribution volume influences the pumping time in the inlet lock or the time required to flood the exit lock.

[0008] Patent specification EP 3 094 605 B1 shows a known system design for quenching and subsequently cooling a glass substrate using an air flow from above and below, as well as radiant heat from infrared radiators. The aim of the system shown is initially to quickly cool the glass substrate via the air flow from a temperature above the "strain point" to the "tempering point." Depending on the type of substrate, this corresponds to a cooling of approximately 50 K to 250 K. The glass substrate can then be cooled further to its cooling point. The system has temperature sensors with which the temperature on the surface of the glass substrate can be measured in order to achieve the most time-efficient tempering and cooling of the glass. However, the known patent specification does not address how, when the system is used in a lock chamber, the temperature can be controlled independently of the lock chamber's ventilation.how time-efficient ventilation of the lock chamber can be achieved in conjunction with the described temperature control.

[0009] DE 34 27 057 discloses a system for producing semiconductor layer structures. The system comprises at least one carrier holding the semiconductor wafer to be coated, a reaction chamber, a heating device, a loading station upstream of the reaction chamber, a removal station downstream of the reaction chamber, and a conveyor device.

[0010] US 2021 / 0272839 A1 discloses an RTP system 100 having an RTP chamber, a rotatable support plate, heat sources and windows comprising quartz material.

[0011] DE 10 2009 011 495 discloses a method for the continuous treatment of flat substrates in a vacuum, in which a substrate is transported in a substrate plane in the transport direction through at least one compartment of a vacuum system and is treated in the process.

[0012] No known system currently exists that decouples the challenges of rapid pressure change in the lock from those of targeted temperature change of a substrate within the lock. Therefore, the use of known systems always results in a conflict of objectives between, on the one hand, rapid pressure change in the lock (through venting / extraction) and, on the other hand, controlled temperature change of the glass substrate within the lock (through temperature control and control of the aeration gas flow).

[0013] All known systems therefore have the disadvantage that, on the one hand, it cannot be guaranteed that undesirable residual stresses could occur in glass substrates during the transition from the suppressed to the atmospheric region, or that the substrates could crack, while, on the other hand, simultaneously maintaining short process times, i.e., short flooding or pumping times in the lock. This problem is particularly acute with large-area glass substrates.

[0014] There is therefore a need for a lock chamber for transferring a glass substrate between two regions of different pressure, for example a negative pressure region and an atmospheric region, in which the pressure can be changed rapidly, whereby the introduction of undesirable residual stresses into the glass substrate can be avoided or at least reduced.

[0015] This need cannot be met with the current state of technology.

[0016] It is therefore an object of the present invention to provide a processing system that can at least partially compensate for the aforementioned disadvantages and / or at least partially satisfy the identified need. In other words, the present invention proposes a lock chamber with which large-area glass substrates can be transferred between two different pressure ranges within the shortest possible time, while largely avoiding residual stresses and deformations in the glass substrate.

[0017] This object is achieved by the present invention by a lock chamber for a substrate treatment system with an inlet lock flap and an outlet lock flap, wherein the lock chamber has thermal insulation and a pumping system, and wherein the lock chamber is suitable and configured to introduce a ventilation gas into the interior of the lock chamber, wherein the lock chamber further has in its interior two parallel shielding plates, a transport device for transporting a substrate from the inlet lock flap between the shielding plates to the outlet lock flap, and a heating device, wherein the shielding plates comprise a material that is at least partially transparent at least in the infrared range. Preferably, the shielding plates comprise a material that is at least partially transparent and / or not completely transparent at least in the infrared range.

[0018] Preferably, the lock chamber can be suitable and designed to move a large-area glass substrate from the entrance lock flap to the exit lock flap. Preferably, the large-area glass substrate has an area of ​​at least 0.1 m 2 , more preferably at least 0.2 m 2 , more preferably at least 0.3 m 2 , more preferably at least 0.5 m 2 , and particularly preferably at least 1.0 m 2The longest edge length of the glass substrate is preferably greater than 0.4 m, more preferably greater than 0.6 m, more preferably greater than 0.9 m, and most preferably greater than 1.2 m. With such large-area glass substrates, targeted temperature control is particularly relevant in order to avoid or at least reduce the incorporation of stress, for example, residual stresses, in the hot glass substrate. Targeted temperature control is therefore all the more relevant while the glass substrate is being transferred between two regions of different pressure, in particular from a vacuum region to an atmospheric region. A hot glass substrate within the meaning of the present disclosure can preferably be a glass substrate with a temperature of 300°C to 650°C.

[0019] Preferably, an intermediate space can be defined between the two parallel shielding plates, with the heating devices more preferably being arranged outside the intermediate space. The intermediate space can preferably have a relatively small gas volume. Preferably, the gas volume in the intermediate space can amount to a maximum of 50%, more preferably a maximum of 10% of the total gas volume of the lock chamber. Preferably, the inner surfaces of the two parallel shielding plates can have a maximum distance of less than 70 mm, preferably less than 40 mm, and particularly preferably less than 15 mm from one another. Preferably, the lock chamber can be adjustable or tuned for glass substrates with a specific substrate thickness. The distance between the inner surfaces of the two parallel shielding plates can then preferably be less than ten, more preferably less than five, and more preferably less than two substrate thicknesses.This makes it possible to ensure that the gas entering the space can be quickly heated or brought to a desired target temperature during the venting of the lock.

[0020] Preferably, the two parallel shielding plates in the lock chamber can extend over an area that corresponds to at least the area of ​​the glass substrate, more preferably at least 1.5 times the area of ​​the glass substrate, more preferably at least 2 times the area of ​​the glass substrate, more preferably at least 2.5 times the area of ​​the glass substrate, more preferably at least 3 times the area of ​​the glass substrate. In other words, each of the two parallel shielding plates can preferably extend over an area of ​​at least 0.1 m 2 extend, more preferably of at least 0.2 m 2 , more preferably at least 0.3 m 2 , more preferably at least 0.5 m 2, more preferably at least 1.0 m 2 , more preferably at least 1.5 m 2 , more preferably at least 2.0 m 2 , more preferably at least 2.5 m 2 , more preferably at least 3 m 2 .

[0021] Preferably, each of the two parallel shielding plates can consist of several individual plates. Large-area plate dimensions that exceed readily available sizes of ceramics or other materials for the shielding plates can thereby preferably be realized more easily. In other words, the design can preferably be simplified, particularly in the case of large-area shielding plates. In addition, the formed gap can preferably be covered better or over a larger area by the shielding plates. Furthermore, access to the gap and / or to the shielding plates can be simplified, which can preferably facilitate maintenance.

[0022] The shielding plates can preferably have a variation in transmission across their surface of less than 5%, more preferably less than 2%. The shielding plates can particularly preferably have a constant transmission across their surface. The optical transmission of the shielding plates can preferably be greater than 30%, preferably greater than 40% and particularly preferably greater than 60% at at least one wavelength in the spectral range from 0.5 pm to 5 pm. These transmission values ​​have proven advantageous, on the one hand, in order to be able to preheat the shielding plates in a time-efficient manner, but on the other hand also in order to be able to introduce sufficient radiant energy into the space between the shielding plates in order to maintain or heat up a glass substrate or gas located therein. The optical transmission of the

[0023] Shielding plates can be less than 90%, preferably less than 85%, and particularly preferably less than 80% at at least one wavelength in the spectral range from 0.5 pm to 5 pm. The shielding plates can preferably comprise at least one of the following materials: ceramic, quartz glass, glass ceramic, Schott Nextrema 712-3, Schott Nextrema 724-8, Schott Nextrema 724-3. Shielding plates comprising these materials, alone or in combination, can preferably be well suited to achieving a desired compromise between transmission and absorption of the radiant energy emitted by the heating devices. In other words, when using one or more of the preferred materials, alone or in combination, a particularly fine tuning of transmission and absorption can be achieved.

[0024] Preferably, at least one of the shielding plates can have a thickness of at least 2 mm, preferably at least 4 mm, and particularly preferably at least 6 mm. Further preferably, at least one of the shielding plates can have a thickness of at most 20 mm, further preferably at most 10 mm, and particularly preferably at most 5 mm. Shielding plates with the preferred thicknesses can advantageously serve as heat storage devices. This can preferably contribute to preventing uncontrolled cooling of a glass substrate moving past the shielding plates through the lock chamber, or can reduce uncontrolled cooling of this glass substrate.

[0025] Preferably, the heating device may comprise one or more infrared sources, wherein the heating device may preferably comprise at least two types of infrared sources which may differ in the emitted wavelength spectra.

[0026] The heating device can preferably comprise short-wave infrared radiators with a usable emitted wavelength between 780 nm and 6500 nm, preferably between 1000 nm and 1400 nm, and / or medium-wave infrared radiators with a usable emitted wavelength between 1400 nm and 8000 nm, preferably between 1500 nm and 3000 nm. Preferably, the heating device can be specifically controlled with several different infrared sources so that different areas on the glass substrate or on the shielding plates can be heated to different intensities.

[0027] The heating device is preferably suitable and configured to heat the parallel shielding plates to a defined plate temperature, preferably to specifically control the plate temperature. Thus, the temperature of a glass substrate transferred between the shielding plates can preferably also be influenced or controlled.

[0028] The parallel shielding plates can preferably extend horizontally along a longitudinal axis of the lock. In the transverse direction, the parallel shielding plates can preferably have two edge regions and a central region located between the edge regions. The heating devices can preferably be suitable for heating the space in the central region and in the edge regions of the shielding plates to different intensities, preferably by means of segmented infrared radiators, more preferably by means of segmented short-wave and / or medium-wave infrared radiators. The heating unit can preferably also be suitable and configured to heat the edge regions of the glass substrate defined in the transverse direction of the plate more intensely than a central region of the glass substrate.Preferably, a constant temperature distribution can be achieved within the entire glass substrate in a glass substrate located between the shielding plates, even if the temperature in an edge region of the glass substrate is generally more susceptible to temperature fluctuations than in a central region of the glass substrate.

[0029] Preferably, the heating device can be arranged at least partially, more preferably completely, outside the gap between the two parallel shielding plates. This allows, on the one hand, the gap between the shielding plates to be kept small, and, on the other hand, the heating device can heat both the shielding plates and the glass substrate in the same emission direction. This can also contribute to a simple, robust, and / or cost-effective design of the system.

[0030] The transport unit can preferably have one or more transport rollers, wherein a lower shielding plate preferably has openings through which the transport rollers can at least partially protrude.

[0031] The heating device can preferably be suitable and configured to heat the transport rollers to a defined transport roller temperature, preferably to specifically regulate the transport roller temperature. The transport rollers can preferably have a thermal conductivity of less than 2 W / mK, preferably less than 1 W / mK, and particularly preferably less than 0.5 W / mK. Furthermore, a contact surface of an individual transport roller can preferably have a maximum of 25 mm 2 , more preferably maximum 9 mm 2 , and particularly preferably a maximum of 4 mm 2large. This can preferably prevent temperature imbalances from being transferred to the glass substrate via the transport rollers. In other words, it can preferably prevent the glass substrate from being heated or cooled uncontrollably at the points where it rests on the transport rollers, or from having a different temperature than the surrounding areas, thus preventing unwanted residual stresses from forming in the glass substrate.

[0032] For thermal insulation, the lock chamber can preferably be lined with non-transparent and / or partially transparent sheets, preferably with the lining reducing heat flow from the chamber interior toward the chamber wall by a factor greater than 1.5, more preferably greater than 2.5, and particularly preferably greater than 3.5. The factors preferably indicate a reduction in heat flow from the chamber interior toward the chamber wall in relation to a thermally insulated lock chamber with a lining compared to a lock chamber without a lining.

[0033] The pump system can preferably be suitable for generating a pressure inside the lock chamber of less than 0.1 bar, more preferably less than 0.01 bar. Preferably, the pressure in the lock chamber can also be increased again. Preferably, aeration gas at atmospheric pressure can be introduced into the lock chamber, more preferably, the aeration gas is not preheated, and more preferably, the aeration gas can be introduced at ambient temperature.

[0034] Preferably, according to the present invention, a lock chamber can be provided which can accommodate a glass substrate from a first, e.g. upstream, pressure region, which is heated to a first substrate temperature which is preferably close to the strain point. In addition, it is preferably possible to adjust the pressure in the lock chamber to a pressure in a second, e.g. downstream, pressure region. In this case, it can be ensured according to the invention that the temperature of the glass substrate changes only as slightly as possible, more preferably not at all. This can preferably be achieved according to the invention in that the shielding plates are heated to a temperature close to the first substrate temperature, preferably to the first substrate temperature with a tolerance of 10 K, before the glass substrate is introduced into the intermediate space.Once the glass substrate is positioned between the shielding plates in the lock, not only the shielding plates but also the glass substrate itself can be heated directly by the heating devices – due to the semi-transparency of the shielding plates. This makes it possible to measure the temperature in different areas of the glass substrate and regulate the heating of the glass substrate and shielding plates accordingly, so that the glass substrate temperature remains constant. This can prevent unwanted residual stresses from developing in the glass substrate, and the glass substrate from cracking or shattering.

[0035] Preferably, the lock can be flooded, i.e., ventilated, within a very short time. The ventilation time of the lock is preferably decoupled from the temperature control of the glass substrate. Ventilation gas that penetrates the space between the shielding plates can be brought to a preset target temperature within a very short time, preferably without the mechanical properties of the glass substrate being influenced by the ventilation gas. This can preferably be achieved by the small distance between the shielding plates and / or by the semi-transparent properties of the shielding plates. The design of the lock chamber according to the invention can preferably be used to completely flood the lock chamber, wherein the temperature of the glass substrate preferably changes only minimally during flooding, more preferably not at all. Thus, flooding can be carried out extremely quickly, especially compared to known systems.Controlled cooling of the glass substrate can then preferably be carried out under atmospheric conditions. Cooling under atmospheric conditions can be carried out faster and with better control than in a vacuum or low-pressure environment, since the glass substrate is already surrounded by gas. Cooling can therefore be carried out in a time-efficient and well-controlled manner via convection along a preset cooling curve.

[0036] Preferably, the lock chamber can be suitable and / or designed to be coupled to a reaction chamber. Further preferably, the lock chamber can be suitable and designed to be used upstream and / or downstream of a reaction chamber in an inline system. Particularly preferably, the lock chamber is suitable for transferring a substrate into and / or out of a reaction chamber coupled to the lock chamber.

[0037] The invention further relates to a substrate treatment system with a lock chamber, preferably with a lock chamber according to at least one of the above features. The substrate treatment system can preferably be an inline system and have an upstream area, preferably a vacuum area, coupled to the lock chamber, and a downstream area, preferably an atmospheric pressure area, coupled to the lock chamber.

[0038] In the upstream region, a temperature of at least 300°C, more preferably at least 450°C, and particularly preferably at least 600°C can preferably prevail. In the downstream region, ambient temperature, i.e., a temperature of around 20°C, preferably a temperature between 15°C and 25°C, can more preferably prevail. The upstream region can preferably be a reaction chamber.

[0039] A substrate treatment system according to the invention, preferably with the lock chamber according to the invention, can preferably have a particularly simple technical structure. In particular, complex preheating of aeration gas and – because the aeration gas is not directed directly onto the glass substrate through aeration nozzles, but rather the glass substrate is protected in the semi-transparent tunnel – complex control of the aeration valves can be dispensed with. The control of the aeration valves can therefore preferably be designed in a greatly simplified manner. In particular, the use of a semi-transparent tunnel preferably results in heating units, preferably infrared radiators, being able to both heat or preheat the tunnel and – if a glass substrate is located in the tunnel – heat the glass substrate itself using radiant heat or maintain it at a constant temperature.This combination can preferably achieve that the lock chamber is ventilated, i.e., the pressure in the lock chamber can be increased without the temperature of the glass substrate located in the lock chamber changing substantially due to the supplied air flow. Preferably, the temperature of the glass substrate located in the lock chamber changes by a maximum of 50 K, preferably a maximum of 40 K, more preferably a maximum of 30 K, more preferably a maximum of 20 K, and particularly preferably a maximum of 10 K. Such small temperature differences in the glass substrate can preferably ensure that no undesirable residual stresses arise in the glass and, in particular, that deformation or cracks in the glass substrate can be effectively prevented.

[0040] The invention further relates to a method for transferring a glass substrate from a low-pressure region to a higher-pressure region using a lock chamber. The lock chamber has at least two parallel shielding plates made of a material that is at least partially transparent, at least in the infrared range. The method comprises:

[0041] 1. Heating the two parallel shielding plates to a defined plate temperature;

[0042] 2. Inserting a glass substrate from the negative pressure area into a space between the two parallel shielding plates of the lock chamber;

[0043] 3. Ventilate the lock with ventilation gas; and

[0044] 4. Control of the temperature in the intermediate space so that a temperature change of the glass substrate is a maximum of 50 K, preferably a maximum of 40 K, more preferably a maximum of 30 K, more preferably a maximum of 20 K.

[0045] Preferably, the glass substrate has a first glass substrate temperature TG when introduced into the lock chamber, wherein the parallel shielding plates are heated in step 1 to a plate temperature TP, for which preferably the following applies:

[0046] TG - 20 K < TP < TG + 50 K

[0047] Heating the semi-transparent shielding plates to a plate temperature in the preferred range can preferably ensure that the temperature of a glass substrate that is introduced into the space between the shielding plates does not change uncontrollably, preferably only minimally, and preferably the mechanical properties of the glass substrate therefore remain unchanged.

[0048] The method according to the invention may preferably further comprise: 5. Heating a transport device for introducing the glass substrate into the intermediate space to a defined transport device temperature TT, for which the following applies:

[0049] TG - 100 K < TT, preferably TG - 50 K < TT, and particularly preferably TG - 20 K < TT.

[0050] By heating the transport rollers, an undesirable temperature change of the glass substrate can be reliably minimized, preferably also at the contact points of the glass substrate on the transport rollers.

[0051] The method can preferably be carried out in a lock chamber according to the present invention according to at least one of the above-mentioned features.

[0052] Preferably, step 1 of the method can be carried out using short-wave infrared radiators with a usable emitted wavelength between 780 nm and 6500 nm, more preferably between 1000 nm and 1400 nm. Step 5 of the method according to the invention can preferably be carried out using medium-wave infrared radiators with a usable emitted wavelength between 1400 nm and 8000 nm, more preferably between 1500 nm and 3000 nm.

[0053] Preferably, in step 3, the aeration gas can be at ambient temperature and / or the aeration gas can be unheated. Preferably, the first glass substrate temperature can be a temperature between 300°C and 650°C, more preferably between 450°C and 650°C, and most preferably between 500°C and 600°C, and / or the first glass substrate temperature can correspond to a temperature above the strain point of the glass substrate.

[0054] The following can preferably apply to the process according to the invention:

[0055] TG - 10 K < TP < TG + 30 K, preferably TG - 5 K < TP < TG + 10 K

[0056] The glass substrate in the process according to the invention may preferably have a substrate thickness of at most 10 mm, more preferably of at most 5 mm, and particularly preferably of at most 3 mm.

[0057] The inner surfaces of the two shielding plates can preferably have a maximum distance of less than ten, more preferably less than five, and particularly preferably less than two substrate thicknesses from the glass substrate surface and / or the inner surfaces of the two shielding plates can have a maximum distance of less than 20 mm, more preferably less than 10 mm, and particularly preferably less than 5 mm from the corresponding glass substrate surface.

[0058] The invention can preferably be described by means of the following aspects:

[0059] 1. A lock chamber for a substrate treatment system with an inlet lock flap and an outlet lock flap, wherein the lock chamber has thermal insulation and a pump system, and wherein the lock chamber is suitable and configured to introduce a ventilation gas into the interior of the lock chamber, wherein the lock chamber further comprises in its interior at least two parallel shielding plates, a transport device for transporting a substrate from the inlet lock flap between the shielding plates to the outlet lock flap, and a heating device, wherein the shielding plates comprise a material that is at least partially transparent, at least in the infrared range. Lock chamber according to aspect 1, wherein the lock chamber is suitable and configured to move a large-area glass substrate from the inlet lock flap to the outlet lock flap, wherein the large-area glass substrate has an area of ​​at least 0.1 m 2, preferably at least 0.3 m 2 and particularly preferably at least

[0060] 0.5 m 2 Lock chamber according to one of the aspects 1 or 2, wherein a gap can be defined between the two parallel shielding plates and wherein the heating device is located outside the gap. Lock chamber according to one of the preceding aspects, wherein inner surfaces of the two parallel shielding plates have a maximum distance of less than 70 mm, preferably less than 40 mm and particularly preferably less than 15 mm from each other. Lock chamber according to one of the preceding aspects, wherein the optical transmission of the shielding plates at at least one wavelength in the spectral range from 0.5 pm to

[0061] 5 pm is greater than 30%, preferably greater than 60%, and / or wherein the shielding plates comprise at least one of the following materials: quartz glass, glass ceramic, Schott NEXTREMA 712-3, Schott NEXTREMA 724-8, Schott NEXTREMA 724-3. Lock chamber according to one of the preceding aspects, wherein at least one shielding plate has a thickness of at least 2 mm, preferably of at least 4 mm, and / or wherein at least one shielding plate has a thickness of at most 20 mm, more preferably of at most 10 mm, and particularly preferably of at most 5 mm. Lock chamber according to one of the preceding aspects, wherein the heating device comprises one or more infrared sources, preferably wherein the heating device comprises at least two types of infrared sources that differ in their emitted wavelength spectra. 8.Lock chamber according to one of the preceding aspects, wherein the heating device is suitable and configured to heat the parallel shielding plates to a defined plate temperature, preferably to specifically control the plate temperature.

[0062] 9. Lock chamber according to one of the preceding aspects, wherein the parallel shielding plates extend horizontally along a lock longitudinal axis, preferably wherein the parallel shielding plates have two edge regions and a central region lying between the edge regions in the transverse direction.

[0063] 10. Lock chamber according to one of the preceding aspects, wherein the transport unit has one or more transport rollers, and wherein a lower shielding plate preferably has openings through which the transport rollers can at least partially protrude.

[0064] 11. Lock chamber according to aspect 10, wherein the heating device is suitable and configured to heat the transport rollers to a defined transport roller temperature, preferably to specifically regulate the transport roller temperature.

[0065] 12. Lock chamber according to one of aspects 10 or 11, wherein the transport rollers have a thermal conductivity of less than 2 W / mK, preferably less than 1 W / mK and particularly preferably less than 0.5 W / mK.

[0066] 13. Lock chamber according to one of aspects 10 to 12, wherein a support surface of a single transport roller has a maximum of 25 mm 2 , preferably maximum 9 mm 2 and particularly preferably a maximum of 4 mm 2 is large.

[0067] 14. Lock chamber according to one of the preceding aspects, wherein the thermal insulation of the lock chamber has a lining with non-transparent and / or partially transparent sheets, preferably wherein the lining reduces a heat flow from the chamber interior towards the chamber wall by a factor greater than 1.5, more preferably greater than 2.5 and particularly preferably greater than 3.5.

[0068] 15. Lock chamber according to one of the preceding aspects, wherein the pump system is suitable for generating a pressure inside the lock chamber of less than 0.1 bar, preferably less than 0.01 bar, and / or wherein the aeration gas can be introduced at atmospheric pressure, preferably wherein the aeration gas is not preheated, further preferably wherein the aeration gas can be introduced at ambient temperature. A substrate treatment system with a lock chamber according to one of the preceding aspects, wherein the substrate treatment system is preferably an in-line system and has an upstream region coupled to the lock chamber, preferably a vacuum region, and a downstream region coupled to the lock chamber, preferably a region with atmospheric pressure.Substrate treatment system according to aspect 16, wherein a temperature of at least 300°C, preferably at least 450°C, and particularly preferably at least 600°C prevails in the upstream region and / or wherein ambient temperature prevails in the downstream region. A method for transferring a glass substrate from a negative pressure region to a region with higher pressure by means of a lock chamber, wherein the lock chamber has at least two parallel shielding plates with a material that is at least partially transparent at least in the infrared range, the method comprising: i. heating the two parallel shielding plates to a defined plate temperature; ii. introducing a glass substrate from the negative pressure region into a space between the two parallel shielding plates of the lock chamber; iii. ventilating the lock with ventilation gas; and iv.Control of the temperature in the intermediate space such that a temperature change of the glass substrate is a maximum of 50 K, preferably a maximum of 30 K. Method according to aspect 18, wherein the glass substrate has a first glass substrate temperature TG upon introduction into the lock chamber, and wherein the parallel shielding plates in step i. are heated to a plate temperature T. P be heated, for which the following applies:

[0069] T G - 20 K < T P < T G + 50 K. 20. Method according to aspect 18 or 19, further comprising: v. heating a transport device for introducing the glass substrate into the intermediate space to a defined transport device temperature TT, for which the following applies: TG - 100 K < T T , preferably TG - 50 K < T T and especially preferred TG - 20 K < T T .

[0070] 21. Method according to one of aspects 18 to 20, wherein the method is carried out in a lock chamber according to one of aspects 1 to 15.

[0071] 22. The method according to any one of aspects 18 to 21, wherein in step iii. the aeration gas is at ambient temperature and / or wherein the aeration gas is not preheated.

[0072] 23. The method according to any one of aspects 18 to 22, wherein the first glass substrate temperature corresponds to a temperature between 300 °C and 650 °C, preferably between 450 °C and 650 °C and particularly preferably between 500 °C and 600 °C and / or a temperature above the softening point of the glass substrate.

[0073] 24. A method according to any one of aspects 18 to 23, wherein T G - 10 K < T P < T G + 30 K, preferably TG - 5 K < T P < TG + 10 K

[0074] 25. Method according to one of aspects 18 to 24, wherein the glass substrate has a substrate thickness of at most 10 mm, preferably of at most 5 mm and particularly preferably of at most 3 mm.

[0075] 26. Method according to aspect 25, wherein the inner surfaces of the two shielding plates have a maximum distance of less than ten, preferably less than five and particularly preferably less than two substrate thicknesses from the glass substrate surface and / or wherein the inner surfaces of the two shielding plates have a maximum distance of less than 20 mm, preferably less than 10 mm and particularly preferably less than 5 mm from the corresponding glass substrate surface.

[0076] A preferred embodiment of the invention is described below with reference to the following figures. The figures show:

[0077] Figure 1 shows a 3D view of a lock chamber in an exemplary embodiment with a partial section; and Figure 2 shows a sectional view of the lock chamber from Figure 1, cut in a plane parallel to the xz plane.

[0078] Figure 1 shows a 3D view of an exemplary lock chamber according to the present invention. The lock chamber 1 extends in a longitudinal direction along the x-coordinate and in a transverse direction along the y-coordinate. To better illustrate the individual components inside the lock chamber, the illustrated 3D view includes a partially sectioned area. The lock chamber 1 has a chamber wall 11, as well as an inlet lock flap 3 and an outlet lock flap 4. The inlet lock flap 3 and the outlet lock flap 4 are suitable for both hermetically sealing (closed state) and opening (open state) an inlet or outlet opening of the lock chamber 1. Ventilation gas can be supplied to the lock chamber via ventilation connections 2 to flood the lock.Preferably, the venting gas can be nitrogen, which is stored under high pressure and supplied to the lock chamber under pressure. Alternatively, ambient air at ambient pressure can be supplied to the lock chamber. The lock chamber can also be vacuumed via venting ports 12 (see Figure 2), which can be connected to a vacuum pump. The lock chamber can therefore be used to switch between a region with negative pressure and a region with ambient pressure. In other words, a vacuum can be created in the lock chamber by means of the venting ports 12, and air or gas can be supplied to the lock chamber via the venting ports 2 in order to achieve ambient pressure in the lock chamber.

[0079] Inside, the lock chamber 1 has two reflection shields 5a, 5b, which serve as a lining and reduce heat flow from the chamber interior toward the chamber wall. Between the reflection shields 5a, 5b is a generous area through which a glass substrate 10 can be transferred from the lock entrance flap 3 to the lock exit flap 4. According to the invention, however, this area is further minimized upwards and downwards, i.e., in the Z direction. The area is delimited by two shielding plates 8a, 8b that are semi-transparent in the infrared range.

[0080] According to the present invention, the two shielding plates 8a, 8b should be preheated so that a temperature as constant as possible can be maintained in the space between the two shielding plates or so that the temperature of the glass substrate 10, which is moved through the space between the two shielding plates 8a, 8b, can be kept constant. The lock chamber therefore has plate heating devices 6a, 6b mounted outside the space between the shielding plates. The plate heating devices 6a, 6b are suitable and configured to heat the shielding plates 8a, 8b, on the one hand, and to heat an object between the shielding plates, on the other hand. In the present embodiment, the plate heating devices 6a, 6b are implemented by several short-wave IR radiators arranged along the longitudinal direction of the lock chamber 1. Each IR radiator extends in the transverse direction, i.e., in the y-direction.The individual IR emitters are spaced apart from each other in the longitudinal direction, i.e. in the X-direction.

[0081] As can be seen in the cutout in Figure 1, there are recesses in the lower shielding plate 8b through which so-called transport rollers 9 protrude, by means of which the glass substrate 10 can be transported through the lock chamber 1. In the embodiment shown, the transport rollers are realized such that a shaft running in the transverse direction has individual shaft shoulders, each of which represents a transport roller. Rotation of the shaft or the shaft shoulders causes the glass substrate 10 to be transported through the lock chamber 1. Alternatively, individually controlled rollers mounted on an axle can also be used as transport rollers. The precise structure of the lock chamber 1 and the mode of operation of the lock chamber is explained below with reference to Figure 2.

[0082] Figure 2 shows the lock chamber 1 from Figure 1, sectioned along an XZ plane. A glass substrate 10 can be seen, which is located between the two shielding plates 8a, 8b and is transported through the lock chamber 1. In addition to the plate heaters 6a, 6b, which are arranged above and below the shielding plates, further roller heaters 7 can be seen. These are medium-wave infrared heaters that can heat the transport rollers to a predetermined temperature. The two shielding plates 8a, 8b are made of an optically semi-transparent material. This allows the plate heaters 6a, 6b, in this case the short-wave IR radiators, to heat both the shielding plates 8a, 8b and the intermediate space or the glass substrate 10 directly. The choice of a suitable material for the shielding plates depends on the wavelengths emitted by the plate heaters 6a, 6b.The material should be semi-transparent at least in a partial range of the emitted wavelength range of the plate heaters 6a, 6b so that the plate heaters 6a, 6b can directly heat both the shielding plates and any gas or glass substrate located therebetween. The semi-transparent material property of the shielding plates is particularly advantageous as long as the lock chamber 1 is not ventilated, since in a vacuum, only radiant energy can be used for heat transfer. As soon as the lock chamber is filled with gas or air, the gas or air in the space between the shielding plates 8a, 8b heats up quickly, primarily via convection. Therefore, the size of the space and thus the gas volume directly around the glass substrate and the thickness of the shielding plates are particularly relevant for regulating or maintaining a constant temperature in the glass substrate.The aim of the lock chamber should be to introduce a glass substrate from an upstream area, in which the glass substrate was heated to a first glass substrate temperature above the strain point, into the lock chamber, then to change the pressure in the lock chamber, and in doing so to ensure that the temperature of the glass substrate remains as unchanged as possible. It is preferred that the temperature of the glass substrate changes by a maximum of 50 K, preferably by a maximum of 20 K, more preferably by a maximum of 10 K, and particularly preferably by a maximum of 5 K. In other words, the first glass substrate temperature in the lock chamber 1 should not fluctuate by more than 50 K during the locking process, i.e. during flooding of the lock, preferably by no more than 20 K, preferably by no more than 10 K, preferably by no more than 5 K, and particularly preferably be kept as constant as possible.

[0083] Preferably, the semi-transparent shielding plates 8a, 8b can already be heated to a predetermined temperature, here, for example, the first glass substrate temperature, before one or more glass substrates 10 are introduced into the space between the shielding plates 8a, 8b. Likewise, in the illustrated configuration, it is possible for the transport rollers to be heated to a predetermined temperature by means of the roller heating device, so that no temperature differences occur on the rollers. This ensures that temperature fluctuations in the glass substrate during introduction into the lock chamber and during flooding of the lock chamber can be kept as low as possible.

[0084] In the illustrated setup, it is not absolutely necessary to preheat the incoming ventilation gas. This is primarily because the ventilation connections are located outside the reflection shields 5a, 5b, and especially outside the semi-transparent shielding plates 8a, 8b. The glass substrate 10 located between the shielding plates 8a, 8b is not exposed to any direct air flow. Air or gas flowing into the space between the shielding plates 8a, 8b can be heated quickly, preferably because the plate surface and substrate surface are large relative to the gas volume in the space.

[0085] The lock chamber 1 according to the invention is designed to transfer a glass substrate from a vacuum region to a region with atmospheric pressure using a method that differs significantly from the methods generally used to date and the lock chambers developed for this purpose. As described in the introduction, known systems generally pursue the approach of cooling the lock chamber using the ventilation gas during ventilation. This initially appears advantageous, since the ventilation gas allows for faster heat exchange via convection than is possible with infrared heating devices using radiant energy in a vacuum. However, cooling using the ventilation gas results in a number of disadvantages for which no satisfactory solution has yet been found.As mentioned at the beginning, particular attention must be paid to deformation of the glass substrate, as well as to a complex preheating and temperature control system for the aeration gas. In addition, the time required to completely flood a lock according to the state of the art depends on the desired cooling curve for a specific glass substrate located in the lock, and in particular on the thickness of the substrate. This dependency arises because the flooding of the lock and the cooling of the substrate are coupled, particularly because the aeration gas introduced to flood the lock is also directly used to cool the substrate. Flooding the lock therefore cannot necessarily be carried out solely under the condition of a short flooding time.There is a conflict of objectives between flooding the lock as quickly as possible and targeted cooling of the substrate, whereby the cooling time depends in particular on the type and thickness of the glass substrate.

[0086] The present invention resolves this conflict of objectives by using a lock chamber, by means of which the substrate temperature can preferably be kept approximately constant during the flooding process. Cooling thus does not occur in a suppression or lock area, but only downstream in an area in which the glass substrate is ventilated. This makes the glass substrate easier to handle, and convection energy can be used to cool the glass substrate. The lock process itself, i.e., flooding the lock, can occur in a short and preferably constant time interval, preferably independent of the type and thickness of the glass substrate. The independence of the flooding time from the type and thickness of the glass substrate can preferably be achieved by not cooling the glass substrate during flooding.

[0087] The design of the lock chamber 1 shown therefore primarily serves to keep the glass substrate temperature as constant as possible during flooding of the lock. Therefore, the semi-transparent shielding plates 8a, 8b are used in particular. It is advantageous to keep the shielding plates 8a, 8b as close to one another as possible, i.e., to keep the gap between the shielding plates 8a, 8b as small as possible. In the embodiment shown, the distance between the two semi-transparent shielding plates 8a, 8b corresponds to just twice to three times the thickness of the substrate 10. Additionally, it is preferred that the shielding plates 8a, 8b have a thickness such that thermal energy can be stored in the shielding plates. In the embodiment shown, the thickness of a shielding plate 8a or 8b corresponds approximately to the thickness of the glass substrate 10.The semi-transparent nature of the shielding plates 8a, 8b means that the shielding plates 8a, 8b can be preheated by means of the plate heating devices 6a, 6b, while the plate heating devices 6a, 6b also transfer radiant energy directly to the glass substrate 10. By combining preheating the shielding plates 8a, 8b to a target temperature with targeted heating of the glass substrate 10 itself by means of the plate heating devices 6a, 6b, it can be ensured that the temperature of the glass substrate 10 can be kept constant in a vacuum using the radiant energy of the infrared heaters. Due to the extremely small gap, only small amounts of gas penetrate into the immediate vicinity of the glass substrate when the lock is ventilated, so that these gas quantities can be quickly heated by the preheated shielding plates 8a, 8b as well as by the glass substrate 10 and the plate heating devices 6a, 6b.This allows the glass substrate temperature to be kept approximately constant, even if the inflowing gas itself is not preheated. Furthermore, the transport rollers 9 can preferably be heated by means of the roller heating devices 7 in order to ensure the most constant temperature possible in the glass substrate 10, even in the area of ​​the support points or support lines on which the glass substrate rests on the transport rollers or is moved over the transport rollers.

[0088] Preferably, additional temperature sensors installed in the lock chamber 1 can measure the temperature of the glass substrate 10 during the entire lock process or during the lock venting process. Difficulties can arise when controlling the plate heating devices 6a, 6b and the roller heating devices 7. Experience has shown that the edges of the glass substrates are particularly susceptible to temperature fluctuations. If, for example, several glass substrates are introduced into the lock chamber one after the other in an inline system, it is almost impossible to determine the substrate temperature at the transverse edges of the glass substrate 10, i.e., at the edges extending in the Y direction. Only at the longitudinal edges, i.e., at the edges extending in the X direction, can the plate temperature be determined with sufficiently high accuracy using suitable sensors.Based on the plate temperature measured there, conclusions can be drawn about the temperatures of the glass substrate in the various areas. For this purpose, empirical values, particularly those dependent on the substrate type and thickness, can be used as scaling factors. By monitoring the glass substrate edges, a uniform temperature distribution can be ensured within the glass substrate. This ensures that no additional stresses are introduced into the glass substrate during the transfer process. This effectively prevents warping or cracks in the glass substrate, especially with large-area glass substrates.

[0089] It may be expedient to heat the edge regions of the glass substrate 10 and a central region of the glass substrate 10 to different intensities. Segmented infrared heaters can preferably be used for this purpose. Thus, in the embodiment shown, the individual IR heaters of the plate heating devices 6a, 6b extending in the Y direction are preferably segmented such that they can be controlled differently in individual segments spaced apart in the Y direction.

[0090] With the invention shown, it is possible to ensure that the lock time remains approximately constant regardless of the plate thickness, since only the pressure within the lock is changed, not the glass substrate temperature. The glass substrate temperature can be changed quickly and preferably easily in a downstream process at ambient pressure by means of convection. Various approaches exist in the prior art for controlling the stresses in the glass during cooling under ambient conditions. Thus, the lock chamber shown can also be advantageously used in inline systems with strict time constraints. In particular, the lock chamber shown can achieve the ability to lock a glass substrate within one minute.In other words, the lock chamber according to the invention is suitable and configured to change a lock pressure by 0.9 bar, preferably by 0.99 bar, within 60 seconds, preferably within 50 seconds. Preferably, the lock chamber according to the invention is furthermore suitable and configured to change the temperature between the two shielding plates 8a, 8b by a maximum of 50 K, preferably by a maximum of 20 K, more preferably by a maximum of 10 K, more preferably by a maximum of 5 K.

[0091] In the lock chamber 1 according to the invention, a vacuum or negative pressure can be generated when the lock is closed by means of a pump connected to the vent connections 12. The negative pressure generated in the lock chamber preferably corresponds to the pressure in an upstream region, preferably a maximum of 0.1 bar, more preferably a maximum of 0.01 bar. The interior of the lock chamber, in particular the semi-transparent shielding plates 8a, 8b, can be preheated to a first temperature TI by means of radiant heat from the plate heating devices 6a, 6b, which preferably corresponds to the temperature in an upstream region or the temperature of a glass substrate 10 in an upstream region. Likewise, the transport rollers 9 can preferably be preheated by means of the roller heating device 7.Subsequently, the inlet lock flap 3 can be opened, and a glass substrate 10 can be introduced from the upstream area into the lock chamber. The inlet lock flap 3 can then be closed. The glass substrate 10 can be transferred from the inlet lock flap through the space between the shielding plates 8a, 8b to the outlet lock by means of the transport rollers 9. Meanwhile, aeration gas can preferably be introduced into the lock chamber via the aeration ports 2, and the pressure in the lock chamber can be brought to the pressure level of a downstream area, preferably to ambient pressure, preferably within one minute or less. While the aeration gas flows in, the temperature of the glass substrate 10 can be kept constant due to the special design of the lock chamber—as described in detail above.The lock process can be terminated by opening the exit lock chamber 4 and introducing the glass substrate 10 - still at the temperature TI - into a downstream area in which a controlled cooling of the glass substrate can then take place.

[0092] Thus, the entire locking process can preferably be carried out independently of the substrate type, the substrate thickness and in particular in an extremely short time, more preferably within one minute or less.

[0093] The above description deals with the use of lock chamber 1 as an exit lock, i.e., for transferring a glass substrate from a negative pressure area to an ambient pressure area. Likewise, lock chamber 1 can also be used as an entry lock chamber—as will naturally be understood by those skilled in the art. The lock chamber is then used to transfer a glass substrate from an ambient pressure area to a negative pressure area. The temperature control of the glass substrate can preferably be carried out analogously to the ventilation described above.

Claims

Claims 1. Lock chamber for a substrate treatment system with an inlet lock flap and an outlet lock flap, wherein the lock chamber has thermal insulation and a pump system and wherein the lock chamber is suitable and configured to introduce a ventilation gas into the interior of the lock chamber, wherein the lock chamber further has in its interior at least two parallel shielding plates, a transport device for transporting a substrate from the inlet lock flap between the shielding plates to the outlet lock flap and a heating device, wherein the shielding plates have a material that is at least partially transparent at least in the infrared range.

2. Lock chamber according to claim 1, wherein the lock chamber is suitable and designed to move a large-area glass substrate from the inlet lock flap to the outlet lock flap, wherein the large-area glass substrate has an area of ​​at least 0.1 m 2 , preferably at least 0.3 m 2 and particularly preferably at least 0.5 m 2 has.

3. Lock chamber according to one of claims 1 or 2, wherein a gap can be defined between the two parallel shielding plates and wherein the heating device is located outside the gap.

4. Lock chamber according to one of the preceding claims, wherein inner surfaces of the two parallel shielding plates have a maximum distance of less than 70 mm, preferably less than 40 mm and particularly preferably less than 15 mm from each other.

5. Lock chamber according to one of the preceding claims, wherein the optical transmission of the shielding plates at at least one wavelength in the spectral range from 0.5 pm to 5 pm is greater than 30%, preferably greater than 60%, and / or wherein the shielding plates comprise at least one of the following materials: quartz glass, glass ceramic, Schott NEXTREMA 712-3, Schott NEXTREMA 724-8, Schott NEXTREMA 724-3.

6. Lock chamber according to one of the preceding claims, wherein at least one shielding plate has a thickness of at least 2 mm, preferably of at least 4 mm and / or wherein at least one shielding plate has a thickness of at most 20 mm, more preferably of at most 10 mm and particularly preferably of at most 5 mm.

7. Lock chamber according to one of the preceding claims, wherein the heating device comprises one or more infrared sources, preferably wherein the heating device comprises at least two types of infrared sources which differ in their emitted wavelength spectra.

8. Lock chamber according to one of the preceding claims, wherein the heating device is suitable and configured to heat the parallel shielding plates to a defined plate temperature, preferably to specifically control the plate temperature.

9. Lock chamber according to one of the preceding claims, wherein the parallel shielding plates extend horizontally along a lock longitudinal axis, preferably wherein the parallel shielding plates have two edge regions and a central region lying between the edge regions in the transverse direction.

10. Lock chamber according to one of the preceding claims, wherein the transport unit has one or more transport rollers, and wherein a lower shielding plate preferably has openings through which the transport rollers can at least partially protrude.

11. Lock chamber according to claim 10, wherein the heating device is suitable and configured to heat the transport rollers to a defined transport roller temperature, preferably to specifically regulate the transport roller temperature.

12. Lock chamber according to one of claims 10 or 11, wherein the transport rollers have a thermal conductivity of less than 2 W / mK, preferably less than 1 W / mK and particularly preferably less than 0.5 W / mK.

13. Lock chamber according to one of claims 10 to 12, wherein a support surface of a single transport roller has a maximum of 25 mm 2 , preferably maximum 9 mm 2 and particularly preferably a maximum of 4 mm 2 is large.

14. Lock chamber according to one of the preceding claims, wherein the thermal insulation of the lock chamber has a lining with non-transparent and / or partially transparent sheets, preferably wherein the lining reduces a heat flow from the chamber interior towards the chamber wall by a factor greater than 1.5, more preferably greater than 2.5 and particularly preferably greater than 3.

5.

15. Lock chamber according to one of the preceding claims, wherein the pump system is suitable for generating a pressure inside the lock chamber of less than 0.1 bar, preferably less than 0.01 bar and / or wherein the aeration gas can be introduced at atmospheric pressure, preferably wherein the aeration gas is not preheated, further preferably wherein the aeration gas can be introduced at ambient temperature.

16. Substrate treatment system with a lock chamber according to one of the preceding claims, wherein the substrate treatment system is preferably an in-line system and has an upstream region coupled to the lock chamber, preferably a negative pressure region, and a downstream region coupled to the lock chamber, preferably a region with atmospheric pressure.

17. Substrate treatment plant according to claim 16, wherein a temperature of at least 300 °C, preferably at least 450 °C and particularly preferably at least 600 °C prevails in the upstream region and / or wherein ambient temperature prevails in the downstream region.

18. A method for transferring a glass substrate from a negative pressure region to a region with higher pressure by means of a lock chamber, wherein the lock chamber has at least two parallel shielding plates with a material that is at least partially transparent in the infrared range, the method comprising: i. Heating the two parallel shielding plates to a defined plate temperature; ii. Inserting a glass substrate from the negative pressure region into a space between the two parallel shielding plates of the lock chamber; iii. Ventilating the lock with ventilation gas; and iv. Control of the temperature in the intermediate space so that the temperature change of the glass substrate is a maximum of 50 K, preferably a maximum of 30 K.

19. The method according to claim 18, wherein the glass substrate has a first glass substrate temperature TG upon introduction into the lock chamber, and wherein the parallel shielding plates in step i. are heated to a plate temperature T P be heated, for which the following applies: T G - 20 K < T P < T G + 50 K 20. The method according to claim 18 or 19, further comprising: vi. Heating a transport device for introducing the glass substrate into the intermediate space to a defined transport device temperature T T , for which: T G - 100 K < T T , preferably T G - 50 K < T T and especially preferred TG - 20 K < T T .

21. A method according to any one of claims 18 to 20, wherein the method is carried out in a lock chamber according to any one of claims 1 to 15.

22. The method according to any one of claims 18 to 21, wherein in step iii. the aeration gas is at ambient temperature and / or wherein the aeration gas is not preheated.

23. The method according to any one of claims 18 to 22, wherein the first glass substrate temperature corresponds to a temperature between 300 °C and 650 °C, preferably between 450 °C and 650 °C and particularly preferably between 500 °C and 600 °C and / or a temperature above the softening point of the glass substrate.

24. The method according to any one of claims 18 to 23, wherein T G - 10 K < T P < T G + 30 K, preferably T G - 5 K < T P < T G + 10 K 25. The method according to any one of claims 18 to 24, wherein the glass substrate has a substrate thickness of at most 10 mm, preferably of at most 5 mm and particularly preferably of at most 3 mm.

6. The method according to claim 25, wherein the inner surfaces of the two shielding plates have a maximum distance of less than 10, preferably less than 5 and particularly preferably less than 2 substrate thicknesses from the glass substrate surface and / or wherein the inner surfaces of the two shielding plates have a maximum distance of less than 20 mm, preferably less than 10 mm and particularly preferably less than 5 mm from the corresponding glass substrate surface.

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