Method for producing a conductor arrangement

Abstract

The invention relates to a method for producing a conductor arrangement (30) by means of a printing arrangement (2), which is configured for use in a fusion-deposition system. In order to achieve improved thermal resilience and dielectric strength of the conductor arrangement (30), it is proposed that the printing arrangement (2) has a first printhead (4) and a second printhead (6), the method comprising the following steps: first extrusion (A) of an electrically insulating material (20) by means of the first printhead (4) to form an insulating layer (32) of the conductor arrangement (30); second extrusion (C) of a metallic material (22) by means of the second printhead (6) to form a conductor layer (36) of the conductor arrangement (30) on the insulating layer (32), wherein the electrically insulating material (20) and / or the metallic material (22) are melted, in particular completely, during the extrusion (A, C).

Description

[0001] Description

[0002] Method for producing a conductor arrangement

[0003] The invention relates to a method for producing a conductor arrangement by means of a printing arrangement which is configured for use in a fused deposition system.

[0004] Furthermore, the invention relates to a conductor arrangement which is produced by such a method.

[0005] Furthermore, the invention relates to a control unit with means for carrying out such a method.

[0006] Furthermore, the invention relates to a computer program for carrying out such a method when executed in a control unit.

[0007] Furthermore, the invention relates to a printing arrangement for producing a conductor arrangement which is configured for use in a fused deposition system.

[0008] Such conductor arrangements can, for example, be coils, which can be used, among other things, in an electrical rotating machine, in particular a motor or a generator. The thermal load capacity and also the dielectric strength of such conductor arrangements depend, among other things, on the insulator used. For example, coils are usually wound from copper-enamel-insulated wires, although the enamelled copper wire is limited, for example, with regard to thermal load capacity and breakdown voltage. Thus, alternative manufacturing processes for such conductor arrangements to increase the thermal load capacity and dielectric strength are of interest.

[0009] The additive manufacturing of three-dimensional printed objects offers improved flexibility in terms of geometry and materials. Additive manufacturing can be achieved, for example, using fused deposition modeling (FDM) or fused filament fabrication (FFF).

[0010] The patent specification US 10,828,698 B2 describes an additive manufacturing process in which a composite filament and a release material filament are fed from corresponding spools into a print head. Both the filament for the composite material and the filament for the release material contain a metal or ceramic powder and a binder. On the spools and above the take-off height, the filaments are heated to a temperature that bends the filaments but does not soften them to the point of fracture. The take-off height is similarly linear to the build plate. The materials are debound and sintered.

[0011] Publication WO 2022 / 269575 A1 describes a system for additive manufacturing comprising a frame and a CNC bed connected to the frame, and a metal dispensing mechanism connected to dispense metal droplets onto the CNC bed. The metal dispensing mechanism is configured to move controllably with respect to the CNC bed to produce the object. The metal dispensing mechanism includes a first nozzle operatively configured to dispense the metal droplets onto the CNC bed in a controllable manner, and the nozzle is fluidly connected to a reservoir containing the metal.

[0012] The published patent application US 2019 / 0134971 A1 describes a printing system with a coaxial extruder head that extrudes a core, a shell, and / or a shelled core to produce complex structures without retooling. The coaxial extruder head can comprise a distribution channel with an inlet and an outlet, as well as a suction chamber surrounding the distribution channel. The object of the invention is to provide a method for producing a conductor arrangement using an additive process, with which improved thermal load capacity and dielectric strength of the conductor arrangement is achieved.

[0013] The object is achieved according to the invention by a method for producing a conductor arrangement by means of a printing arrangement which is configured for use in a fused deposition system, wherein the printing arrangement has a first printing head and a second printing head, wherein the printing arrangement has a profiling device which is arranged between the first printing head and the second printing head, wherein the method comprises the following steps: first extrusion of an electrically insulating material by means of the first printing head to form an insulation layer of the conductor arrangement, profiling of the insulation layer to form a concave recess in the insulation layer after the first extrusion, second extrusion of a metallic material by means of the second printing head to form a conductor layer of the conductor arrangement on the insulation layer,wherein the electrically insulating material and / or the metallic material are melted during extrusion, in particular completely, wherein the second extrusion of the metallic material takes place in the concave recess of the insulating layer.

[0014] Furthermore, the object is achieved according to the invention by a conductor arrangement which is produced by such a method.

[0015] Furthermore, the object is achieved according to the invention by a control unit with means for carrying out such a method.

[0016] Moreover, the object is achieved according to the invention by a computer program for carrying out such a method when running in a control unit. Furthermore, the object is achieved according to the invention by a printing arrangement for producing a conductor arrangement, which is configured for use in a fused deposition system, comprising a first print head and a second print head, wherein the printing arrangement has a profiling device which is arranged between the first print head and the second print head, wherein the first print head is configured to extrude an electrically insulating material to form an insulation layer of the conductor arrangement, wherein the second print head is configured to extrude a metallic material to form a conductor layer of the conductor arrangement, wherein the first print head is configured to extrude the electrically insulating material and / or the second print head is configured,to melt the metallic material during extrusion, in particular completely, wherein the profiling device is configured to form a concave recess in the insulation layer after extrusion of the electrically insulating material.

[0017] The advantages and preferred embodiments listed below with regard to the method can be transferred analogously to the conductor arrangement, the control unit, the computer program and the printing arrangement.

[0018] The invention is based on the idea of ​​producing both a conductor layer and an insulation layer of a conductor arrangement by means of a molten deposition process, wherein the electrically insulating material of the insulator and / or the metallic material of the conductor are melted, in particular completely, during extrusion. The electrically insulating material of the insulator is extruded by means of a first print head to form the insulation layer, while the metallic material of the conductor is extruded by means of a second print head to form the conductor layer on the insulation layer. The metallic material can contain, inter alia, silver, tin, copper, aluminium or one of their alloys. In particular, an aluminium alloy or solder can be used as the metallic material.A high-temperature thermoplastic, to which additives can optionally be added, can be used as an electrically insulating material. The use of dedicated print heads for conductors and insulation enables the flexible printing of a conductor arrangement structure with increased thermal resilience and dielectric strength. In particular, multi-layer conductor arrangements can be flexibly implemented using a fused deposition process, in which the metallic material of the conductor is extruded onto the insulation layer to form the conductor layer, which has a positive effect on thermal resilience and dielectric strength. Additive manufacturing using fused deposition processes also enables a change in the cross-section of the conductor, which is particularly advantageous at the head of the coil, but also concave coil geometries.

[0019] A control unit enables dynamic adjustment of the print heads, allowing even complex conductor arrangements to be implemented quickly and cost-effectively using extrusion. The means for implementing the control unit's method include, for example, a digital logic module, in particular a microprocessor, a microcontroller, an FPGA (field programmable gate array), or an AS IC (application-specific integrated circuit), which is configured to operate the material extrusion arrangement.

[0020] The concave recess of the insulation layer can have, among other things, a semicircular, semi-elliptical or segment-shaped cross-section. For example, the metallic material, which can have a low viscosity during extrusion, is guided into the concave recess of the insulation layer or at least held there until it solidifies, thus facilitating extrusion. A further embodiment provides that the first extrusion and the second extrusion take place synchronously. Synchronous extrusion means that the extrusion takes place by means of the first print head and the second print head in one printing process, whereby an optimal connection can be produced between the conductor layer and the insulation layer, which has a positive effect on the thermal load capacity and dielectric strength of the conductor arrangement. Furthermore, synchronous extrusion saves production time.

[0021] A further embodiment provides that the method includes, as a further step, a first extrusion of the electrically insulating material by means of the first print head to form the insulation layer of the conductor arrangement on the conductor layer, wherein a lateral surface of the conductor layer is completely contacted with the electrically insulating material. Thus, the conductor layer is completely surrounded by the insulation layer in the area of ​​the lateral surface, so that high thermal load capacity and dielectric strength are achieved.

[0022] A further embodiment provides for the extrusion of the electrically insulating material and the metallic material in a spiral shape to form a spiral winding of a coil. Such a coil can be provided, among other things, for a winding, in particular a toothed coil winding, of an electrical rotating machine.

[0023] A further embodiment provides that during the first extrusion and / or the second extrusion, a protective gas is supplied to an extrusion area of ​​the respective layer. The protective gas contains, for example, argon or nitrogen to prevent oxidation of the extruded material. Furthermore, the extruded material can be cooled to a defined temperature range by targeted supply of protective gas. A further embodiment provides that the electrically insulating material contains a glass. For example, the electrically insulating material is quartz glass or borosilicate glass. Using such glasses, an optimized dielectric strength and partial discharge resistance of the conductor arrangement is achieved.

[0024] Another embodiment provides for the metallic material to contain copper, aluminum, silver, or one of their alloys. Such a metallic material exhibits low electrical resistance, resulting in very low heat loss and thus very low thermal stress.

[0025] A further embodiment provides for the first print head and / or the second print head to have a nozzle containing platinum and / or molybdenum. Such metals have a very high melting point and enable the extrusion of materials with a high melting point. Furthermore, such metals are advantageous due to the erosion of other metals, such as steel, via diffusion processes, for example, compared to molten glass.

[0026] Another embodiment involves heating a filament in the nozzle during extrusion using induction. Heating by induction in the nozzle is efficient and allows for precise adjustment of high extrusion temperatures.

[0027] A further embodiment provides that the insulation layer is cooled after the first extrusion such that the profiling takes place at a viscosity that is at least 10 times lower, in particular at least 100 times lower, and furthermore in particular at least 1000 times lower. For example, the viscosity of molten glass during extrusion is r|=102 dPa -s. Profiling takes place, for example, at a viscosity in the range of 103 dPa -s to 107 dPa -s, in particular 104 dPa -s to 106 dPa -s. The lower viscosity makes the glass more viscous, which enables a stable profiling result.

[0028] In the following, the invention is described and explained in more detail with reference to the exemplary embodiments shown in the figures.

[0029] It shows :

[0030] FIG 1 is a schematic representation of a printing arrangement,

[0031] FIG 2 is a schematic representation of a method for

[0032] Production of a conductor arrangement,

[0033] FIG 3 is an enlarged schematic representation of the process for the second extrusion of the conductor layer,

[0034] FIG 4 is an enlarged schematic representation of the process during the first extrusion of the insulation layer and

[0035] FIG 5 is an enlarged schematic representation of the process for profiling the insulation layer.

[0036] The exemplary embodiments explained below are preferred embodiments of the invention. In the exemplary embodiments, the described components of the embodiments each represent individual features of the invention that can be considered independently of one another. These features also further develop the invention independently of one another and are thus to be regarded as part of the invention, either individually or in a combination other than that shown. Furthermore, the described embodiments can also be supplemented by further features of the invention already described. The same reference numerals have the same meaning in the various figures.

[0037] FIG 1 shows a printing assembly 2 with a first print head 4, a second print head 6, and a profiling device 8 arranged between the first print head 4 and the second print head 6. The printing assembly 2 is configured for use in a fused deposition system. The print heads 4, 6 each have an extruder 10 and a nozzle 12. The nozzles 12 contain, for example, platinum and / or molybdenum and have an induction coil 14 configured to heat a filament 16 in the nozzle 12. The print heads 4, 6 are configured for synchronous extrusion in a printing direction 18.

[0038] For example, the first print head 4 is configured to extrude an electrically insulating material 20, which contains, for example, a glass, in particular quartz glass or borosilicate glass, while the second print head 6 is configured to extrude a metallic material 22, for example, copper, aluminum, silver, or an alloy thereof. Alternatively, the first print head 4 can be configured to extrude the metallic material 22, while the second print head 6 is configured to extrude the electrically insulating material 20. The print heads are configured to melt the respective materials 20, 22 during extrusion A, C, in particular completely.

[0039] The profiling device 8, which is arranged between the print heads 4, 6, has a profile template 24. The profile template 24 is configured to profile a layer extruded by the first print head 4. For example, the profile template 24 of the profiling device 8 is configured to insert a recess, in particular a concave recess, into the layer extruded by the first print head 4.

[0040] The printing arrangement 2 further comprises gas nozzles 26, each of which is assigned to one of the printing heads 4, 6 and is configured to supply protective gas into an extrusion area, whereby, for example, the extruded electrically insulating material 20 can be cooled by the supplied protective gas to a defined temperature range for profiling with the profiling device 8. The protective gas contains, for example, argon or nitrogen to prevent oxidation of the extruded material 20, 22.

[0041] The print heads 4, 6 are each rotatable relative to the profiling device 8 by an angle a1, a2 and are arranged to be movable at a distance dl, d2, so that even complex geometries can be produced. They are controlled by a control unit 28.

[0042] FIG 2 shows a schematic representation of a method for producing a conductor arrangement 30. The conductor arrangement 30 is produced, for example, using a printing arrangement 2 according to FIG 1. The method comprises a first extrusion A of an electrically insulating material 20 by means of the first printing head 4 to form an insulation layer 32 of the conductor arrangement 30, a profiling B of the insulation layer 32 to form a concave recess 34 in the insulation layer 32 and a second extrusion C of a metallic material 22 by means of the second printing head 6 to form a conductor layer 36 of the conductor arrangement 30 in the concave recess 34 of the insulation layer 32. During extrusion A, C, the electrically insulating material 20 and the metallic material 22 are completely melted. The first extrusion A, the profiling B and the second extrusion C take place synchronously in the printing direction 18 .The concave recess 34 of the insulation layer 32 has a semicircular, semi-elliptical or segmental cross-section.

[0043] The extrusion A, C of the electrically insulating material 20 and the metallic material 22 as well as the profiling B are carried out, for example, in a spiral shape to form a spiral winding of a coil 38. The electrically insulating material 20 can contain a glass, e.g. quartz glass or borosilicate glass. The metallic material 22 can contain copper, aluminum, silver or one of their alloys. In particular, a viscosity of the extruded glass is lower than a viscosity of the extruded metal, wherein the viscosity of the extruded glass is reduced, in particular by supplying protective gas, in order to enable stable profiling B. The concave recess 34 in the insulation layer 32 facilitates the extrusion of the metallic material 22 with the lower viscosity. By supplying protective gas, the metallic material 22 solidifies in the concave recess of the insulation layer 32.

[0044] FIG. 3 shows an enlarged schematic representation of the process during the second extrusion C of the conductor layer 36, wherein the metallic material 22 is extruded into the concave recess 34 of the insulation layer 32 to form the conductor layer 36. A protective gas is supplied to the conductor layer 36 in an extrusion region 40 for cooling and preventing oxidation of the metallic material 22, for example via a gas nozzle 26.

[0045] FIG 4 shows an enlarged schematic representation of the method during the first extrusion A of the insulation layer 32, in which electrically insulating material 20 is extruded by means of the first print head 4 to form the insulation layer 32 on the conductor layer 36. Shielding gas is supplied to the insulation layer 32 in an extrusion region 40 for cooling, for example via a gas nozzle 26. By means of an upper and a lower insulation layer 32, a lateral surface 42 of the conductor layer 36 is completely contacted with the electrically insulating material 20 or is completely surrounded by it.

[0046] FIG. 5 shows an enlarged schematic representation of the process for profiling B the insulation layer, wherein the profile template 24 forms a concave recess 34 in the insulation layer 32 with, for example, a semi-elliptical cross-section. Excess material of the extruded electrically insulating material 20 is stripped off via a lateral recess 44 of the profile template 24. The profile template 24 can contain, among other materials, tungsten or molybdenum.

[0047] In summary, the invention relates to a method for producing a conductor arrangement 30 by means of a printing arrangement 2 which is configured for use in a fused deposition system. In order to achieve improved thermal load capacity and dielectric strength of the conductor arrangement 30, it is proposed that the printing arrangement 2 has a first printing head 4 and a second printing head 6, the method comprising the following steps: first extrusion A of an electrically insulating material 20 by means of the first printing head 4 to form an insulation layer 32 of the conductor arrangement 30; second extrusion C of a metallic material 22 by means of the second printing head 6 to form a conductor layer 36 of the conductor arrangement 30 on the insulation layer 32, the electrically insulating material 20 and / or the metallic material 22 being melted, in particular completely, during extrusion A, C.

Claims

Patent claims 1. A method for producing a conductor arrangement (30) by means of a printing arrangement (2) which is configured for use in a fused deposition system, wherein the printing arrangement (2) has a first print head (4) and a second print head (6), wherein the printing arrangement (2) has a profiling device (8) which is arranged between the first print head (4) and the second print head (6), the method comprising the following steps: - first extrusion (A) of an electrically insulating material (20) by means of the first printing head (4) to form an insulating layer (32) of the conductor arrangement (30), - Profiling (B) the insulation layer (32) to form a concave recess (34) in the insulation layer (32) after the first extrusion (A), - second extrusion (C) of a metallic material (22) by means of the second print head (6) to form a conductor layer (36) of the conductor arrangement (30) on the insulation layer (32), wherein the electrically insulating material (20) and / or the metallic material (22) are melted, in particular completely, during the extrusion (A, C), wherein the second extrusion (C) of the metallic material (22) takes place in the concave recess (34) of the insulation layer (32).

2. The method according to claim 1, wherein the first extrusion (A) and the second extrusion (C) are carried out synchronously.

3. Method according to one of claims 1 to 2, comprising the following further step: - first extrusion (A) of the electrically insulating material (20) by means of the first print head (4) to form the insulation layer (32) of the conductor arrangement (30) on the conductor layer (36), wherein a lateral surface (42) of the conductor layer (36) is completely contacted with the electrically insulating material (20).

4. Method according to one of the preceding claims, wherein the extrusion (A, C) of the electrically insulating material (20) and the metallic material (22) is carried out spirally to form a spiral winding of a coil (38).

5. Method according to one of the preceding claims, wherein during the first extrusion (A) and / or during the second extrusion (C) a protective gas is used in an extrusion Area (40) of the respective layer (32, 36).

6. Method according to one of the preceding claims, wherein the electrically insulating material (20) contains a glass.

7. Method according to one of the preceding claims, wherein the metallic material (22) contains copper, aluminum, silver or an alloy thereof.

8. Method according to one of the preceding claims, wherein the first print head (4) and / or the second print head (6) have a nozzle (12) which contains platinum and / or molybdenum, wherein during extrusion (A, C) a filament (16) in the nozzle (12) is heated by induction.

9. Method according to one of the preceding claims, wherein the insulation layer (32) is cooled after the first extrusion (A) in such a way that the profiling (B) takes place at a viscosity which is at least 10 times, in particular at least 100 times, furthermore in particular at least 1000 times, lower.

10. Conductor arrangement (30) which is manufactured by a method according to one of the preceding claims.

11. Control unit (28) with means for carrying out a method according to one of claims 1 to 9.

12. Computer program for carrying out a method according to one of claims 1 to 9 when executed in a control unit (28) according to claim 11.

13. Printing arrangement (2) for producing a conductor arrangement (30), which is configured for use in a fused deposition system, comprising a first print head (4) and a second print head (6), wherein the printing arrangement (2) has a profiling device (8) which is arranged between the first print head (4) and the second print head (6), wherein the first print head (4) is configured to extrude an electrically insulating material (20) to form an insulation layer (32) of the conductor arrangement (30), wherein the second print head (6) is configured to extrude a metallic material (22) to form a conductor layer (36) of the conductor arrangement (30), wherein the first print head (4) is configured to extrude the electrically insulating material (20) and / or the second print head (6) is configured to extrude the metallic material to melt the material (22) during extrusion (A, C), in particular completely, wherein the profiling device (8) is configured to form a concave recess (34) in the insulation layer (32) after the extrusion of the electrically insulating material (20).

14. Printing arrangement (2) according to claim 13, wherein the print heads (4, 6) are configured for synchronous extrusion (A, C).

15. Printing arrangement (2) according to one of claims 13 or 14, comprising at least one gas nozzle (26) which is configured to supply protective gas in an extrusion region (40).

16. Printing arrangement (2) according to one of claims 13 to 15, wherein the first print head (4) and / or the second print head (6) have a nozzle (12) containing platinum and / or molybdenum, and an induction coil (14) configured to heat a filament (16) in the nozzle (12).

17. Printing arrangement (2) according to one of claims 13 to 16, wherein the first print head (4) is configured to extrude glass and / or the second print head (6) is configured to extrude copper, aluminum, silver or an alloy thereof.

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