Adaptable sensor configurations

Abstract

An adaptable sensor arrangement having a base unit configured to receive and hold a media probe vessel accommodated in an adapter is sued for monitoring one or more properties or conditions of a substance material contained or streamed through the media probe vessel. The media probe vessel is selected from a plurality of media probe vessels couplable to the base unit by the adapter for acquiring by the base unit measurement data / signals indicative of said one or more properties or conditions of the substance material. The adapter is selected from a plurality of different adapters, each one of the plurality of different adapters having different geometrical dimensions and / or coupling interfaces, and configured to accommodate at least one of the plurality of media probe vessels and facilitate the coupling of the base unit to the media probe vessel.

Description

[0001] ADAPTABLE SENSOR CONFIGURATIONS

[0002] TECHNOLOGICAL FIELD

[0003] The present invention is generally in the field of sensor design and implementations.

[0004] BACKGROUND

[0005] This section intends to provide background information concerning the present application, which is not necessarily prior art.

[0006] Sensor instrumentation is typically designed for specific mounting constellations and interface, which typically limits the use of the sensor to a narrow set of applications. This resilient sensor design approach so often encountered, imposes a need to design and manufacture specific sensor arrangements and interfaces for different applications, that often utilizes the exact same sensing elements, but different mounting and interfacing arrangements. This problem is even more severe when multiple properties and / or conditions are to be concurrently measured in the same inspection setup, which usually requires development of a respective set of sensor devices each adapted to the specific installation and interfacing conditions dictated by the specific application setup specifications.

[0007] Some sensing solutions known from the patent literature are briefly described hereinbelow.

[0008] US Patent Publication No. 2023 / 109612 discloses devices, compositions, and methods for surface disinfection and decontamination; the devices generally adapted to contain a single or multi-component indicator composition, and optionally a disinfectant composition, and to dispense the indicator composition and optional disinfectant composition to a disinfectant solution, a surface, or a disinfectant article upon actuation of the device; also provided is an article of manufacture in the form of a removable cartridge adapted to fit a device described here, which may be pre-filled with a single or multi-component indicator composition, and / or with a disinfectant composition, and one or more optional additives.

[0009] US Patent Publication No. 2010 / 0305499 discloses devices, systems, and methods for determining the composition of fluids, and particularly for describing the identity and concentration of one or more components of a medical fluid such as intravenous fluid. These devices, systems and methods take multiple complex admittance measurements from a fluid sample in order to identify the identity and the concentration of components of the fluid. The identity and concentration of all of the components of the solution may be simultaneously and rapidly determined. In some variations, additional measurement or sensing modalities may be used in addition to admittance spectroscopy, including optical, thermal, chemical, etc.

[0010] US Patent Publication No. 2005 / 228609 discloses a sensor component that may be used in conjunction with a filter module may include a plurality of sensor packages. The latter, in turn, may incorporate one or more micro-electromechanical systems (MEMS) sensors to measure various characteristics of fluid flow and filtration. A single sensor component may be adapted to measure the pressure, temperature, flow rate, differential pressure, conductivity, viscosity, pH level, etc. of the fluid at an upstream and a downstream location. Sensor measurements may be obtained continuously in order to monitor and indicate fluid conditions, including the use of a warning mechanism to indicate an out-of-range condition when the measurements fall outside of pre-set limits. Depending on the application and the fluid being filtered, data, including measurement data, may be transmitted through electrical connections or wirelessly. In wireless configurations, a sleep-mode may be included to maximize the life of local power supplies.

[0011] GENERAL DESCRIPTION

[0012] The multi-sensor configurations disclosed herein enable interfacing a sensor setup assembly to a variety of different media probe vessels having different geometrical dimensions and / or interfaces. This is achieved in some embodiments by a specially designed docking station / base (also referred to herein as base unit) configured for mechanical and / or electrical and / or optical coupling to a plurality of different media probe vessels by means of a respective adapter. The adapter is configured to receive and hold its respective media probe vessel, and couple and immobilize the media probe vessel thereby held to the docking station / base. The docking station / base is configured to measure one or more properties and / or conditions of a substance material contained or streamed through the media probe vessel.

[0013] The term media probe vessel is used herein to refer to a channel, conduit, or container, capable of holding and / or streaming therethrough a substance material. In embodiments disclosed herein the media probe vessel is configured to facilitate measurement of one or more properties and / or conditions of a substance material contained or stream thereinside. For example, the media probe vessel comprises in some embodiments one or more openings and / or optical windows for sensor elements to measure properties / conditions of the substance material in direct or indirect contact therewith. Accordingly, in possible embodiments, the docking station / base is provided as a kit having a plurality of media probe vessels and a respective plurality of adapters. Each of the media probe vessels is configured for probing a certain material, and / or a certain volume and / or cross-sectional area of the material, and / or for connection to tubing or ductwork of certain geometrical dimensions (e.g., diameter, cross-sectional shape). Each of the adapters is configured for coupling and / or interfacing between at least one of the plurality of media probe vessels and the docking station / base.

[0014] Based on specifications of a certain application a suitable media probe vessel can be selected from the plurality of media probe vessels for monitoring a substance material to be introduced thereinto, and a respective adapter is selected from the plurality of adapters for fitting and coupling the selected media probe vessel to the docking station / base. The substance material to be monitored can be then introduced into, or streamed through, the selected media probe vessel coupled to the docking station, which can be then thereby inspected. For example, in some embodiments the selected media probe vessel can be connected to a fluid reservoir for streaming the substance material therethrough e.g., to an applicator, such as a medicament dispenser, a reactor, container / bottles filler, beverage dispenser, or suchlike.

[0015] The multi-sensor configurations disclosed herein are thus interchangeably referred to herein as adaptable sensor arrangements or adaptable multi- sensor arrangements.

[0016] The one or more properties and / or conditions can be measured by one or more sensors installed inside the docking station / base, and / or by one or more sensors provided in a removable interface assembly configured to measure one or more properties and / or conditions of the substance material inside the selected media probe vessel, and communicate measurement data / signals indicative of the one or more properties and / or conditions to the docking station / base.

[0017] The removable sensors' interfacing assembly is configured in some embodiments to reversibly attach to each one of the plurality of media probe vessels couplable to the docking station / base, and thereby couple one or more sensors thereof to (e.g., in direct, or indirect, contact with) the substance material contained or streamed inside the selected media probe vessel. For example, one or more sensors of the removable sensors' interfacing assembly can be coupled (e.g., electrodes, strain gauges, electrochemical / pH sensor, chlorine sensor, and / or any other electrochemical sensor and / or optical) through bores / passages, and / or to optical windows, provided in the media probe vessels to directly or indirectly interact with the substance material and sense one or more properties and / or conditions of the substance material contained / streamed thereinside. In possible implementations the sensors' interfacing assembly is configured for measuring flow rate, pressure, temperature, electrical conductivity, and / or pH and / or chlorine and / or any other electrochemical sensor and / or optical property, of the substance material. Optionally, but in some embodiments preferably, the docking station / base is configured to measure optical properties of the substance material by measuring light signals transmitted through, and / or reflected through, the substance materials contained or streamed inside the selected media probe vessel.

[0018] Unless otherwise defined, technic al / scientific terms that are used herein have the same meaning as commonly understood by those of ordinary skill in the art of the present disclosure.

[0019] In a broad aspect there is provide an adaptable sensor arrangement comprising a base unit configured to receive a plurality of different adapters for coupling the base unit to a respective plurality of different media probe vessels e.g., having different geometrical dimensions and / or coupling interfaces. A measurement setup can be assembled by fitting a selected one of the plurality of media probe vessels in the base unit by means of one of the plurality adapters for measuring via the base unit one or more properties and / or conditions of a substance material contained or streamed through the selected media probe vessel. An interfacing assembly is used in some embodiments to facilitate mechanical and / or electrical and / or optical coupling between each one of the plurality of media probe vessels and the base unit, when fitted in the base unit with a suitable adapter. An optical measurement setup can be provided in the base unit for measuring optical properties of the substance material.

[0020] Optionally, but in some embodiments preferably, each one of the selected media probe vessels and the interfacing assembly, when connected one to the other, are configured to implement a flow sensing setup configured to measure flow rate of the substance material passing through the selected media probe vessel, and / or a pressure sensing setup configured to measure pressure of the substance material contained or streamed through the selected media probe vessel, and / or a temperature sensing setup configured to measure temperature of the substance material contained or streamed through the selected media probe vessel, and / or an electrochemical sensing setup configured to measure pH (and / or chlorine and / or of other electrochemical property) level of the substance material contained or streamed through the selected media probe vessel, and / or an electrical conductivity sensing setup configured to measure electrical conductivity of the substance material contained or streamed through the selected media probe vessel.

[0021] In some embodiments the adaptable sensor arrangement comprises a memory (e.g., in the interfacing assembly) for storing data related to the sensor elements. The memory can be used to store calibration data and / or other sensor parameters, that can be loaded into the base unit upon establishing electrical connectivity therewith (e.g., for pre-calibrated sensor elements). This way, recalibration steps of the adaptable sensor arrangement can be avoided, such that whenever the sensing arrangement of the adaptable sensor arrangement is replaced the new calibration parameters / values are immediately loaded into the base unit, thereby reducing costs and downtime intervals.

[0022] In one aspect there is provide an adaptable sensor arrangement comprising a base unit configured to receive and hold a media probe vessel accommodated in an adapter for monitoring one or more properties or conditions of a substance material contained or streamed through the media probe vessel, wherein the media probe vessel is selected from a plurality of media probe vessels couplable to the base unit by the adapter for acquiring by the base unit measurement data / signals indicative of the one or more properties or conditions of the substance material, and wherein the adapter is selected from a plurality of different adapters, each one of the plurality of different adapters having different geometrical dimensions and / or coupling interfaces, and configured to accommodate at least one of the plurality of media probe vessels and facilitate the coupling of the base unit to the media probe vessel.

[0023] An optical measurement setup is mounted in some embodiments in the base unit. The optical measurement setup is configured to measure optical signals transmitted through, and / or reflected from, the substance material contained or streamed through the selected media probe vessel. One or more of the media probe vessels can comprise optical transmitter and / or receiver elements configured for acquisition of the optical signals. The selected adapter can be configured to facilitate optical coupling between the optical measurement setup and one or more optical coupling elements of the selected media probe vessel for acquisition of optical signals from the substance material. At least one of the plurality of adapters may comprise a partition element configured to prevent entry of interfering light into the optical optical measurement setup.

[0024] The optical measurement setup can comprise a plurality of spaced apart optical measurement elements. The optical coupling elements can be situated at locations on the media probe vessels configured for optically coupling them with one of the plurality of spaced apart optical measurement elements of the media probe vessel. The light emission and / or detection elements can be configured to be located at lateral sides of the media probe vessel, when the media probe vessel is coupled to the base unit. The base unit is configured in some embodiments to identify the selected one of the plurality media probe vessels coupled thereto based on optical signals acquired by at least one of the plurality of spaced apart optical measurement elements.

[0025] The at least one of the plurality of media probe vessels can comprise a constriction configured to affect pressure conditions of the substance material contained or streamed in said constriction. The adaptable sensor arrangement can comprise an interfacing assembly configured to facilitate mechanical and / or electrical and / or optical coupling between the selected media probe vessel and the base unit. The selected adapter may have a generally U- shaped cross-section configured to receive and hold the selected media probe vessel therein between its arms, and to accommodate by end portion of the arms the interfacing assembly coupled to the media probe vessel.

[0026] The interfacing assembly can be configured to communicate pressure conditions that are affected by the constriction, and pressure conditions that are not been affected by said constriction, to opposite sides of at least one sensor element thereof. The adaptable sensor arrangement can be configured to measure flow rate of the substance material passing through the selected media probe vessel based on a differential pressure measurement of the pressure conditions communicated to the at least one sensor element.

[0027] The adaptable sensor can be configured to measure pressure of the substance material contained or streamed through the selected media probe vessel based on pressure conditions communicated by the interfacing assembly to at least another sensor element thereof. The adaptable sensor may have an electrochemical sensing element configured to measure electrochemical properties and / or conditions of the substance material.

[0028] The adaptable sensor can be configured to measure electrical conductivity of the substance material by a plurality of spaced apart electrodes provided in the interfacing assembly and configured to directly interact with the substance material via respective spaced apart openings provided in the selected media probe vessel. The adaptable sensor can be configured to measure temperature of the substance material by at least one sensor element thermally coupled by the interfacing assembly to the substance material. Optionally, but in some embodiments preferably, the at least one sensor element is thermally coupled by the interfacing assembly to the substance material via at least one of the spaced apart electrodes.

[0029] The interfacing assembly comprises in some embodiments an electrical interface component configured for electrically coupling between the base unit and the electrical components of the interfacing assembly. The interfacing assembly can comprise an electrical circuit component configured to carry the one or more sensing elements and electrically couple them to the base unit via the electrical interface component. The electrical circuit component comprises in possible embodiments circuitry configured to acquire measurement data / signals from sensing elements and communicate the same to the base unit.

[0030] The interfacing assembly comprises in some embodiments a mechanical interface component configured to couple the interfacing assembly to the media probe vessel and establish fluid communication with a lumen thereof. The mechanical interface component of the interfacing assembly can comprise a pressure sensing opening configured for fluid communication between a pass-through bore provided in the media probe vessel and at least one sensor element provided in the electrical circuit component. The mechanical interface component of the interfacing assembly can comprise at least two differential pressure sensing openings configured for fluid communication between respective at least two pass-through bores provided in the media probe vessel and at least one sensor element provided in the electrical circuit component for communicating two different pressure conditions thereto.

[0031] In some applications the mechanical interface component of the interfacing assembly comprises at least one pass-through bore configured to fluidly communicate between at least one of the at least two differential pressure sensing openings and a fluid channel formed in the electrical interface component in fluid communication with at least one sensor element of the electrical circuit component. The electrical interface component of the interfacing assembly may comprise at least one pass-through bore or cavity configured to fluidly communicate fluid channel and the at least one sensor element of the electrical circuit component.

[0032] The fluid channel can be formed in an anterior side of the electrical interface component with respect to the electrical circuit component to prevent contact of the substance material with certain portions of the electrical circuit component. The electrical interface component may comprise at least one opening configured to fluidly communicate between the fluid channel and at least one sensor of the electrical circuit component. The interfacing assembly can comprise a channel cover element configured to cover and seal the at least one pass-through bore, the fluid channel, and the at least one opening, of the electrical interface component.

[0033] The adaptable sensor comprises in some embodiments a housing structure formed in the mechanical interface component and configured to receive and hold an electrochemical sensor inside the interfacing assembly for coupling to the media probe vessel. Alternatively, the adaptable sensor comprises a mounting structure formed in the mechanical interface component and configured to receive and hold the electrochemical sensor external to the interfacing assembly for coupling to the media probe vessel.

[0034] The interfacing assembly may comprise at least one optical sensor configured to measure optical signals scattered from the substance material via an optical coupling region provided in the media probe vessel. The at least one optical sensor may be mounted on an electrical circuit component of the interfacing assembly. The mechanical interface component of the interfacing assembly can be configured to optically couple the at least one optical sensor and the optical coupling region of the media probe vessel. Alternatively, the at least one optical sensor is mounted in the base unit, in this case, the interfacing assembly can be configured to optically couple between the at least one optical sensor and the optical coupling region of the media probe vessel.

[0035] The adaptable sensor comprises in some embodiments a memory for storing data related to the sensing elements. The base unit can be configured to read the data upon establishing electrical connection therewith and acquire measurement data from the sensing elements based thereon (e.g., activate only the certain types of sensors included in the setup within their indicated rages of operation). The data stored in the memory can be indicative of at least one of the following: type of sensor elements used; measurement ranges and / or accuracies of the sensor elements, physical and / or geometrical and / or optical properties of the selected media probe vessel.

[0036] In another aspect there is provided a method for coupling a plurality of sensor elements to a fluid vessel. The method comprising selecting from a plurality of fluid vessels one fluid vessel suitable for monitoring by the plurality of sensor elements a specific substance material, and / or certain volume and / or cross-sectional area of the substance material, and / or for coupling the fluid vessel to a substance source and / or to conduits / tubes used to deliver the substance material to be monitored, selecting from a plurality of adapters an adapter couplable to the selected fluid vessel, connecting the selected fluid vessel to a substance source, coupling the selected fluid vessel and its selected adapter to a base unit, introducing the substance material into the fluid vessel, and acquiring measurement data / signals indicative of one or more properties and / or conditions of the substance material by the base unit from the plurality of sensor elements. The connecting of the selected fluid vessel to the substance source can be carried out after the coupling to the base unit.

[0037] The coupling of the fluid vessel and its respective adapter to the base unit may comprise optically coupling optical coupling elements of the fluid vessel to one or more light emitting and / or detecting elements of the base unit. The coupling to the base unit can comprise coupling the fluid vessel to an interfacing assembly configured to measure one or more of the properties and / or conditions of the substance material.

[0038] The coupling to the base unit can comprise reading from a memory data related to at least one of the plurality of sensor elements. The method can comprise adjusting measurement data / signal acquired from at least one of the plurality of sensor elements based on the data read from the memory.

[0039] In yet another aspect there is provided a multisensor kit comprising a plurality of fluid vessels, each configured for monitoring by a plurality of sensor elements a specific substance material, and / or certain volume and / or cross-sectional area of the substance material, and / or for coupling the fluid vessel to a substance source and / or to conduits / tubes used to deliver the substance material to be monitored, a plurality of adapters each of which being couplable to at least one of the plurality of fluid vessels, a base unit connectable to each one of the plurality fluid vessels via at least one of the plurality of adapters, wherein the base unit configured to a acquire measurement data / signals indicative of one or more properties and / or conditions of a substance material contained or streamed inside a selected one of the plurality of fluid vessels coupled thereto by one of the plurality of adapters.

[0040] The kit of can comprise an interfacing assembly configured for coupling each one of the plurality of fluid vessels to the based unit via a selected one of the plurality of adapters. The kit can comprise an electrochemical sensor. The interfacing assembly can be configured to hold said electrochemical sensor either internally or externally.

[0041] In yet another aspect there is provided a sensing setup comprising a media probe vessel selected from a plurality of media probe vessels and an interfacing assembly couplable to each one of said plurality of media probe vessels. The interfacing assembly can be configured to mechanical and / or electrical and / or optical couple the selected media probe vessel to an external device for acquisition of measurement data / signals generated by one or more sensing elements thereof. The interfacing assembly can be configured to communicate pressure conditions that are affected by a constriction formed in the media probe vessel, and pressure conditions that are not been affected by said constriction, to opposite sides of at least one sensor element thereof.

[0042] The sensor setup can be configured to measure pressure of the substance material contained or streamed through the selected media probe vessel based on pressure conditions communicated by the interfacing assembly to at least another sensor element thereof. The sensor setup can be configured to measure electrical conductivity of the substance material by a plurality of spaced apart electrodes provided in the interfacing assembly and configured to directly interact with the substance material via respective spaced apart openings provided in the selected media probe vessel. The sensor setup can be configured to measure temperature of the substance material by at least one sensor element thermally coupled by the interfacing assembly to said substance material. The interfacing assembly can comprise one or more of the following: an electrical interface component configured for electrically coupling between the base unit and the electrical components of said interfacing assembly; an electrical circuit component configured to carry the one or more sensing elements and electrically couple them to the base unit via the electrical interface component; a mechanical interface component configured to couple said interfacing assembly to the media probe vessel and establish fluid communication with a lumen thereof. The sensor setup can comprise either a housing structure formed in the mechanical interface component and configured to receive and hold an electrochemical sensor inside the interfacing assembly for coupling to the media probe vessel, or a mounting structure formed in the mechanical interface component and configured to receive and hold an electrochemical sensor external to the interfacing assembly for coupling to the media probe vessel.

[0043] BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to understand the invention and to see how it may be carried out in practice, embodiments will now be described, by way of non-limiting example only, with reference to the accompanying drawings. Features shown in the drawings are meant to be illustrative of only some embodiments of this disclosure, unless otherwise implicitly indicated. In the drawings like reference numerals are used to indicate corresponding parts, and in which:

[0045] Figs. 1A and IB schematically illustrate an adaptable sensor arrangement, wherein Fig. 1A shows a senor arrangement having a set of sensor units and a respective set of adapters for interfacing the sensor units to a base unit, and Fig. IB demonstrates fitting and interfacing a specific sensor unit to the base unit by its respective adapter;

[0046] Fig. 2 schematically illustrates a sensor arrangement according to possible embodiments;

[0047] Figs. 3A, 3B, 4A and 4C, schematically illustrate sensor units and their respective adapters according to possible embodiments, wherein Figs. 3A and Figs. 4A show sensors units and Figs. 3B to 3C and 4B to 4C respectively show bottom and upper views of the respective adapters;

[0048] Figs. 5A and 5B schematic illustrate a base unit of possible embodiments, wherein Fig. 5A shows a base unit without the sensor unit and its closing lid, and Fig. 5B shows the base unit with a sensor unit and its closing lid in an open state;

[0049] Fig. 6A to 6C and 7A to 7C schematically illustrate a sensors' interfacing assembly comprising according to possible embodiments a mechanical interface component, electrical circuit component, and an electrical interface component, wherein Figs. 6A to 6C and 7A to 7C respectively show bottom and top sides of these components;

[0050] Figs. 8A and 8B show perspective side views of an optical measurement component according to possible embodiments;

[0051] Figs. 9A and 9B respectively show a perspective sectional view and a side sectional view of the adaptable sensor arrangement according to possible embodiments;

[0052] Fig. 10 exemplify different multi-sensor setups implemented utilizing the adaptable sensor arrangement according to possible embodiments;

[0053] Figs. 11A to 11C schematically illustrate connectivity of a plurality of docking stations for communication of measurement data / signals thereby produced to one or more control units / centers according to some possible embodiments, wherein Fig. 11A exemplifies a wirebased connectivity scheme, Fig. 11B exemplifies wireless and wire -based combined connectivity scheme, and Fig. 11C exemplifies a wireless connectivity scheme;

[0054] Fig. 12 is a flowchart of a process of measuring one or more properties and / or conditions of a substance according to possible embodiments; and

[0055] Figs. 13A to 13D schematically illustrate an interfacing assembly according to possible embodiments, wherein Figs. 13A and 13B respectively show bottom and top exploded views, Fig. 13C shows a top view of a channel cover element, and Fig. 13D exemplifies external mounting of an electrochemical sensor.

[0056] DETAILED DESCRIPTION OF EMBODIMENTS

[0057] One or more specific and / or alternative embodiments of the present disclosure will be described below with reference to the drawings, which are to be considered in all aspects as illustrative only and not restrictive in any manner. It shall be apparent to one skilled in the art that these embodiments may be practiced without such specific details. In an effort to provide a concise description of these embodiments, not all features or details of an actual implementation are described at length in the specification. Elements illustrated in the drawings are not necessarily to scale, or in correct proportional relationships, which are not critical. Emphasis instead being placed upon clearly illustrating the principles of the invention such that persons skilled in the art will be able to make and implement it, once they understand the principles of the subject matter disclosed herein. This invention may be provided in other specific forms and embodiments without departing from the essential characteristics described herein. The present application provides adaptable sensor system designed to permit utilization of the same sensing setup in various different applications, each dictating specific different interfacing and / or measurements setups. The disclosed adaptable sensor system generally comprises a sensors' interface assembly, a base unit configured for electrical coupling with the sensors' interface assembly and for accommodating a plurality of different media probe vessels via a respective plurality of adapters. Each of the adapters is configured in possible embodiments for snugly fitting its respective media probe vessel in the base unit, facilitate mechanical coupling between the sensor's interface assembly and the media probe vessel, and facilitate electrical coupling between the base unit and the sensors' interface assembly.

[0058] For an overview of several example features, process stages, and principles of the invention, the examples of media probe vessels illustrated schematically and diagrammatically in the figures are intended for monitoring of fluidic substances. These adaptable sensor systems are shown as one example implementation that demonstrates a number of features, processes, and principles used to measure properties and / or conditions of a fluid (e.g., gas or liquid) substance, but they are also useful for other applications and can be made in different variations. Therefore, this description will proceed with reference to the shown examples, but with the understanding that the invention recited in the claims below can also be implemented in myriad other ways and for monitoring other substances, once the principles are understood from the descriptions, explanations, and drawings herein. All such variations, as well as any other modifications apparent to one of ordinary skill in the art and useful in substance measurement and / or monitoring applications may be suitably employed, and are intended to fall within the scope of this disclosure.

[0059] Fig. 1A schematically illustrates an adaptable sensor system 10 according to possible embodiments. The adaptable sensor system 10 generally comprises a base unit (also referred to docking station / base) 11, a plurality of media probe vessels VI, V2,...,Vn, and a respective plurality of adapters Al, A2,...,An. Each of the plurality of adapters Ai (wherein \ <i<n is an integer number), is configured to accommodate a respective one of the plurality of media probe vessels Vi and snugly fit it to the base unit 11, for thereby measuring one or more properties and / or conditions of a substance material contained in, or streamed through, the media probe vessels Vi. In some embodiments, each media probe vessels Vi is provided with respective one or more coupling / connector elements Ci, configured for introducing and / or streaming a substance material thereinto. In preferred embodiments the two connectors Ci are provided at extremities of the media probe vessels Vi for streaming therethrough a fluid material e.g., by connecting the same to a reservoir (not shown) via one of the connectors Ci and to a destination (e.g., applicator, another reservoir, desalination unit, medicament dispensing unit) via the other connector Ci.

[0060] Optionally, but in some embodiments preferably, the adaptable sensor system 10 further includes a sensors' interfacing assembly 17 configured for coupling to each of the plurality of the media probe vessels Vi and conducting one or more measurements of the substance material contained and / or streamed therein. In some embodiments, the base unit 11 comprises a multisensor set-up Hi having a set of interfaces I / F-l, I / F-2,. . I / F-n, each configured for coupling with a respective media probe vessel Vi when placed with its respective adapter Ai in the base unit. Fig. IB demonstrates an exemplary sensor system 10' constructed using the base unit 11 with the media probe vessel S2 and the sensors' interface assembly 17, fitted into the base unit 11 by the respective adapter A2.

[0061] Fig. 2 schematically illustrates coupling of a sensors' interfacing assembly 17 to a media probe vessel Vi according to some embodiments via an interface region 22r of the media probe vessel Vi. In this specific and non-limiting example the sensors' interfacing assembly 17 comprises a mechanical interface component 17b configured to couple an electrical circuit component 22a (and / or one or more sensor elements e.g., multilayered sensing foil structures disclosed in the international patent applications referenced herein) to the interface region 22r of the media probe vessel Vi for measuring one or more properties and / or conditions of a substance (e.g., fluid) contained or streams through a lumen 21n passing along the media probe vessel Vi. The electrical circuit component 22a comprises in some embodiments one or more spaced apart electrodes 22e configured to snugly and sealably pass-through respective electrode bores 35a formed in a wall portion of the media probe vessel Vi e.g., for measuring electrical conductivity. A temperature sensor 22t is also provided in some embodiments in a portion of the electrical circuit component 22a configured to communicate with a temperature sensing bore 42a formed in another wall portion of the media probe vessel Vi.

[0062] In some embodiments the electrical circuit component 22a comprises bottom and / or top attachment / welding areas 17e,17q for sealably connecting it to elastic / deformable sensing element(s) (e.g., multilayered sensing film or foil structures such as disclosed in the international patent publications referenced herein) having one or more sensor elements configured to communicate with respective bores formed in respective wall sections of the media probe vessel Vi. As seen, electrical circuit component 22a can further include a pressure sensor (e.g., strain gauge / transducer) 32s formed on or in a portion of the elastic / deformable element 17e configured to sealably cover a pressure sensing bore 32a formed in another wall portion of the media probe vessel Vi. The electrical circuit component 22a is configured in some embodiments to form a flow rate sensing structure / arrangement 31 comprising a flow sensor element (e.g., strain gauge / transducer) 31s formed on or in a portion of the elastic / deformable element 17e configured to sealably cover a first flow sensing bore 31a formed in another wall portion of the media probe vessel Vi, a fluid channel 17c formed on or in the mechanical interface component 17b at least partially over the flow sensor element 31s and configured to sealably communicated through a passage 17f formed in the mechanical interface component 17b with a second flow sensing bore 31a formed in another wall portion of the media probe vessel Vi. In some embodiments the media probe vessel Vi comprises a constriction 21c in fluid communication with the second flow sensing bore 31a for applying differential pressure conditions over the top and bottom sides of the elastic / deformable element 17e in / on which the flow sensor element 31s is formed.

[0063] The the sensors' interfacing assembly 17 also comprises an electrical interface component having one or more circuitries 22i electrically coupled to the sensor elements of the electrical circuit component 22a for activating them and acquiring therefrom measurement data / signals indicative of the one or more properties and / or conditions of the substance material contained or streamed through the media probe vessel Vi. The electrical interface component may further include contact pads 22p electrically couped to the circuitries 22i and / or the sensor elements of the electrical circuit component 22a for communicating the measurement data / signals to an external device e.g., the base unit (11) of the adaptable sensor system (10). Alternatively, or additionally, the circuitries 22i of the electrical circuit component 22a are configured to wirelessly transmit the measurement data / signals to the external device e.g., utilizing Bluetooth / Bluetooth low energy (BLE), WiFi, Zigbee, or suchlike.

[0064] As also seen in Fig. 2, each of the plurality media probe vessels Vi may have respective internal diameter (ID) of its internal lumen 21n, and a respective outer diameter (OD) adapted for the certain application specifications. Figs. 3A to 3C, and Figs. 4A to 4C, respectively exemplify different media probe vessels Vi,V£ having a generally cylindrical tube-shape with different internal and outer diameters ID,OD designed for specific adaptable sensor system 10 according to possible embodiments. In these non-limiting examples the media probe vessels Ni,Nk comprise a flow sensing structure / arrangement 31, pressure sensing structure / arrangement 32, optical sensing structure / arrangement 33, electrical conductivity sensing structure / arrangement 35, and pH sensing structure / arrangement 34.

[0065] Optionally, but in some embodiments preferably, a temperature sensing interface (not shown) is also provided. In possible embodiments a temperature sensing structure / arrangement is provided adjacent to the electrical conductivity sensing structure / arrangement 35, to thereby exploit thermal conductivity properties of the electrodes 22e for measuring temperature of the substance material contained inside the media probe vessel in direct contact with the electrodes 22e.

[0066] The flow sensing structure / arrangement 31 is comprised in some embodiments of two concentric cylindrical elements extending form the outer wall of the media probe vessels Ni,Nk having the pressure sensing bore 31a passing through the inner cylindrical element, and a sealer channel 31r defined by an annular gap / depression formed between the two concentric cylindrical elements. The pressure sensing structure / arrangement 32 can be similarly comprised of a pair of two concentric cylindrical elements, extending from the outer wall of the media probe vessels Ni,Nk with the flow sensing bore 31a passing through their inner cylindrical elements, and respective sealer channel 31r defined by the annular gap / depression formed between the two concentric cylindrical elements. The sealer channels 31r,32r are configured to snugly receive sealing elements configured to prevent leakage of the substance material out of the lumen (21n) through the sensing bores 31a, 32a.

[0067] The optical sensing structure / arrangement 33 can be comprised of one or more optical transmissive elements 33r,33t,33d projecting outwardly from different areas of the media probe vessels Ni,Nk e.g., circumferentially distributed within an annular region of the media probe vessels. The optical transmissive elements 33r,33t,33d configured to pass optical signals generated by a light source installed in the base unit (11) into the lumen (21n) of the media probe vessels Vi.Vk for it to interact with the substance material thereinside, and to pass optical signals transmitted through and / or reflected from the substance material inside the lumen (21n) out of the media vessels Vi.Vk for measurement by one or more sensor elements installed in the base unit (11). In this non-limiting example the optical sensing structure / arrangement 33 comprises one or more optical transmitter elements 33t for passing the optical signals into the lumen (21n) of the media probe vessels Vi.Vk and one or more optical receiver elements 33r for passing the optical signals out of the lumen (21n) after interacting with the substance material thereinside. The one or more optical transmitter elements 33t and optical receiver elements 33r can be located in opposite sides (diametrically opposite e.g., in an annular region) of the media probe vessels Vi.Vk for optimal transmittal and reception of the optical signals through the lumen (21n).

[0068] Optionally, but in some embodiments preferably, the optical sensing structure / arrangement 33 comprises three (e.g., cylindrical) optical transmitter elements 33t, each configured to pass optical signals having a certain color / range of wavelengths from a respective light source (e.g., LED) into the lumen (21n), and respective three (e.g., cylindrical) optical receiver elements 33r, each configured to pass the optical signals having of the respective color / range of wavelengths out of the lumen (21n) for measurement by respective optical detector (e.g., photodiodes). Additionally, or alternatively, in possible embodiments the optical sensing structure / arrangement 33 comprises a scattered (e.g., annular) light receiver element 33d protruding outwardly from a wall section of the media probe vessels ¥ / ,¥& (e.g., adjacent to the optical receiver elements 33r) for passing scattered light out of the lumen (21n) for measurement by respective optical detector (e.g., photodiodes).

[0069] It is noted that the number of the optical transmitter elements 33t, and / or of the optical receiver elements 33r, can be configured to include more, or less, than three elements for passage of a respective number of light colors / range of wavelengths, per application specification and design requirements. In addition, the optical transmitter elements 33t, and / or of the optical receiver elements 33r, can be of different cross-sectional shapes (e.g., circular, triangular, rectangular, polygonal, etc).

[0070] In this non-limiting example the scattered light receiver element 33d is substantially tangential to the wall of the media probe vessels Vi.VA: and its projects outwardly therefrom in a direction substantially perpendicular to the direction in which the optical transmitter and / or receiver elements 33t,33r laterally project from the wall of the media probe vessels Vi.VA: e.g., the optical transmitter and receiver elements 33t,33r are in a plane substantially coinciding with a diameter of the media probe vessel ¥ / ,¥& and an axis of projection of the scattered light receiver element 33d is substantially normal (90°) to the plane of the optical transmitter and receiver elements 33t,33r. The optical sensing structure / arrangement 33 is configured in some embodiments for measuring optical data / signals indicative of the turbidity, and / or transparency, and / or spectroscopy properties, of the substance material inside the lumen (21n).

[0071] In this non-limiting example the optical sensing structure / arrangement 33 is located between the first and second first flow sensing bore 31a, but it can be similarly located in other portions of the media probe vessels ¥ / ,¥£, per application design and requirements.

[0072] The electrical conductivity sensing structure / arrangement 35 comprises one or more spaced apart electrode bores 35a passing through a support 38 projecting outwardly from a wall section of the media prone vessels ¥ / ,¥£ and communicating with the lumen (21n), for the passage of spaced apart electrodes (22e) therethrough. In this non-limiting example four electrode bores 35a are provided in the media probe vessels ¥ / ,¥£ for placement of respective four electrodes (22e) therein, such that free ends of the electrodes (22e) contact the substance material inside the lumen (21n). With this configuration of the electrical conductivity sensing structure / arrangement 35 two electrodes can be used for passing a predefined electrical current through the substance materials inside the lumen (21n), and the other two electrodes can be used to concurrently measure a responsive electrical voltage over substance material located therebetween. In possible embodiments the number of electrodes (22e) can be smaller, or greater than three.

[0073] The pH (and / or chlorine and / or any other electrochemical) sensor structure / arrangement 34 comprises a pH sensing bore 34a passing through apportion of the support 38 spaced apart from the electrode bores 35a, for an electrochemical / pH sensor placed thereinside to contact the substance material inside the lumen (21n). In possible embodiments the support 38 comprises a circumferential sealer channel 34r configured to receive a sealing element thereinside for preventing leakage of substance material out of the lumen (21n) through the electrode bores 35a and / or the pH sensing bore 34a the circumferential sealer channel 34r is configured to seal both the electrode bores 35a and pH sensing bore 34a. In possible embodiments respective different sealer channels are formed for the electrode bores 35a and for the pH sensing bore 34a.

[0074] As seen in Figs. 3B, 3C, 4B and 4C, the adapters Ai,Ak can be generally "U"-shaped elongated elements defining a retaining channel 36 passing along their length and configured to accommodate an immobilize a portion of their respective media probe vessels ¥z’,¥k. The adapters Ai,Ak may comprise an optical inspection structure 37 having lateral optical windows 37w configured to receive and hold therein the transmitter and receiver elements 33t,33r laterally project from the wall of the media probe vessels ¥z’,¥k. Optionally, but in some embodiments preferably, each one of the lateral optical windows 37w is at least partially surrounded by a respective partition element 37n configured to prevent interfering (e.g., ambient) light from entering into the optical sensing structure / arrangement 33. The probe vessels ¥z’,¥k can be fabricated by injection molding, 3D printing, CNC, or any other suitable plastic manufacturing technique.

[0075] Fig. 5A shows a top view of a base unit 11 according to some possible embodiments comprising an interface region 22 having electrical connectors 11c configured to electrically contact respective contact pads (22p) of the sensors' interfacing assembly (17), a light transmitter assembly lit configured to be accommodated by a respective partition element 37n of the adapter Ai and transmit optical signals into the optical transmitter elements 33t of the media probe vessels ¥i held by the adapter Ai, and a light receiver assembly Hr configured to be accommodated by the respective other partition element 37n of the adapter Ai and receive the optical signals coming out of the receiver elements 33r of the media probe vessels ¥i held by the adapter Ai. Optionally, but in some embodiments preferably, the base unit 11 comprises a set of light indicators (e.g., LEDs) lie of different colors configured to provide an indication of the wavelength range of the optical signals being transmitted by the light transmitter assembly lit into the transmitter elements 33t of the media vessels Vi.

[0076] One or more push buttons lip can be further provided for setting functionality features of the base unit 11. Optionally, but in some embodiments preferably, the base unit 11 comprises one or more connecting ports llu usable to connect the base unit 11 to a power source (not shown), and / or for communicating measurement data either to another base unit 11 or to an external device.

[0077] Fig. 5B shows the base unit 11 with its lid element llq and lid fastener element Ilf thereof, and the media probe vessels Nk attached thereto by its respective adapter Ak. As seen, in operative states the partition elements 37n enclose portion of the light transmitter and receiver assemblies lit, Hr to prevent interfering (e.g., ambient) light from entering into the optical sensing structure / arrangement (33). A (e.g., flexible / elastic) clamp element lid is formed in some applications in an inner side of the lid element llq for pressing over the adapter Ak when the lid element llq is closed thereon and fastened by the fastener element Ilf, to thereby press the media probe vessels Nk onto the sensors' interfacing assembly (17), and further press the sensors' interfacing assembly (17) onto the electrical connectors (11c) of the base unit 11.

[0078] Fig. 6A to 6C and 7A to 7C show a sensors' interfacing assembly 17' comprising according to possible embodiments a mechanical interface component 43, an electrical circuit component 42, and an electrical interface component 41. The components 43,42,41 of the interfacing assembly 17' are configured for sealable attachment of the electrical interface component 41 to the mechanical interface component 43 with the electrical circuit component 42 sandwiched therebetween. In the assembled state (shown in Figs. 9A and 9B), the electrical circuit component 42 can be electrically coupled to the electrical connectors 11c of the base unit 11 via the contact pad apertures 41p of the electrical interface component 41, and the sensor elements of the electrical circuit component 42 can interact and / or contact substance materials contained in or streamed through a selected media probe vessels Nk via apertures (e.g., 35e, 32e, 31e) and / or windows (e.g., 43j) formed in the mechanical interface component 43.

[0079] The interfacing assembly 17' in its assembled state can be provided as an integrated unit detachably connectable to each and every one of the media probe vessels VI, V2,. . Nn, at one side thereof via the mechanical interface component 43, and electrically couplable to the base unit 11 at another side thereof via the electrical interface component 41, to thereby enable selection and use of a selected one of the media probe vessels VI, V2,. . Vn, per application requirements. The mechanical interface component 43 can be made of a flexible / elastic or rigid (e.g., plastic or polymeric) material, which can be attached / welded / bonded to the media probe vessels Nk, for providing it with mechanical interface and sealing properties.

[0080] In this non-limiting example the mechanical interface component 43 has a generally rectangular shape having one or more passages, sealer elements, and other structures for coupling between the electrical circuit component 42 and the media probe vessels Vi (VI, V2,...,Vn,). The mechanical interface component 43 is configured for coupling to each of the media probe vessels Vi (VI, V2,...,Vn,) and provide passages therethrough for one or more sensor elements of the electrical circuit component 42 to contact the substance material inside the media probe vessels Vi. In this example the mechanical interface component 43 comprises first and second flow sensing passages 31e configured to respectively communicated with the first and second flow sensing bores (31a) of the media probe vessels Vi. A pressure sensing passage 32e is similarly provided for communicating with the pressure sensing bore (32a) of the media probe vessels Vi. Optionally, the media probe vessels Vi further comprise a temperature sensing bore (not shown) for proving fluid communication to a temperature sensor (42t).

[0081] The mechanical interface component 43 can further provide one or more electrode passages 35e configured to communicate with the electrode bores 35a of the media probe vessels Vi. As seen, four electrode passages 35e are used in some embodiments of the mechanical interface component 43. In possible applications there is also provided an electrochemical / pH sensor enclosure (also referred to as housing structure) 34y in the mechanical interface component 43 configured to be received inside the pH sensing bore 34a of the media probe vessels Vi. The electrochemical / pH sensor and / or any electrochemical sensors enclosure 34y comprises in this example a pH sensing electrode aperture 34e, and a pH reference electrode aperture 34k.

[0082] As seen in Fig. 6A, the electrode passages 35e and the electrochemical / pH sensor enclosure 34y can be formed within an area of the mechanical interface component 43 surrounded by a sealer 35y at a top side of the mechanical interface component 43, wherein the sealer 35y is configured to snugly and sealably fit into the circumferential sealer channel (34r) of the media probe vessels Vi and prevent leakage of substance material out of the lumen (21n) of the media probe vessels Vi. Similarly, the pressure sensing passage 32e and each of the flow sensing passages 31e can be surrounded by a respective sealer element 32y,31y configured to snugly and sealably fit into the respective circumferential sealer channels 32r,31r of the media probe vessels Vi and prevent leakage of substance material out of the lumen (21n) of the media probe vessels Vi.

[0083] As seen in Fig. 7C, the top side of the mechanical interface component 41 may comprise a circumferential sealer 43y protruding downwardly and configured to sealably and snugly receive the electrical circuit component 42. In some embodiments the circumferential sealer 43y of the mechanical interface component 43 comprises one or more attachment grooves 43f configured to snugly receive and hold respective one of more fastening elements (41f) of the electrical interface component 41 in the assembled state wherein the electrical circuit component 42 is sandwiched between the electrical interface component 41 and the mechanical interface component 43. The mechanical interface component 41 may have cavities 31i,32i for enabling deformation of regions of the electrical circuit component 42 carrying the sensor elements 31s, 32s.

[0084] The top side of the mechanical interface component 43 can further comprise one or more circuitry indentations 43i configured to receive and optionally sealably enclose the one or more circuitries 22i of the electrical circuit component 42. Similarly, a temperature sensor indentation 44i can be formed in the bottom side of the mechanical interface component 43 configured to receive and sealably enclose a temperature sensor (42t) provided in possible embodiments in the electrical circuit component 42. Optionally, but in some embodiments preferably, the top side of the mechanical interface component 43 comprises an optical window (e.g., formed by a pass-through aperture or a transparent or semi-transparent region) 43j configured for optically coupling an optical (e.g., photodiode) detector (42d) of the electrical circuit component 42 to the diffusive light receiver element 33d of the media probe vessels Vi.

[0085] Optionally, but in some embodiments preferably, the one or more circuitries 22i comprises a memory 22m for storing data related to the sensor elements. The memory can be used to store calibration data and / or other sensor parameters, that can be loaded by the base unit (11) upon establishing electrical connectivity with interfacing assembly (17717"). This way, recalibration steps of the adaptable sensor arrangement can be avoided, such that whenever the interfacing assembly of the adaptable sensor arrangement is replaced the new calibration parameters / values of the new interfacing assembly (17717") are immediately loaded to the base unit (11), thereby reducing costs and downtime intervals.

[0086] In possible embodiments the data stored in the memory 22m is indicative of sensor configuration implemented in the device, and / or measurement ranges and / or accuracies of the sensors implemented in the device. For example, the data in the memory 22m can be indicative of the type of sensors included, or excluded, and / or of measurement rages and / or accuracies of these sensors each sensing setup can be configured to implement different set of sensors with different specifications. In possible embodiments the data in the data stores in the memory 22m can be indicative of physical properties (e.g., materials of made, volume, cross-sectional area, etc.), and / or geometrical properties (e.g., shape and / or length of constricted and nonconstricted portions), and / or optical properties of the media probe vessel being used (e.g., optical filters applied / coated to the optical transmissive elements 33r,33t,33d). The same base unit (11) can be accordingly adjusted to operate with different sensor setup configurations and specifications, per required application and specifications.

[0087] In possible embodiments the sensors' related data is stored in the base station (11) and / or in a remote storage (not shown e.g., network server), in addition to, or instead of, storing it in the memory 22m, or it may be distributed therebetween. For example, in possible embodiments each sensor setup of embodiments hereof comprises a unique identifier (e.g., stored in the memory 22m and / or marked thereon e.g., barcode or QR code) readable by the base unit, and the base unit (11) is configured to read the unique identifier when connection is established therewith, and based thereon access a repository of sensor setups data stored in the base unit and / or in the remote storage and fetch the sensors' related data for the specific sensor setup connected thereto. The electrical circuit component 42 can be a type of circuit board (e.g., printed circuit board - PCB), preferably a multilayer sensing foil having one or more integration layers, such as disclosed in the international patent publications incorporated herein by reference, and configured to be accommodated within the circumferential sealer 43y of the mechanical interface component 43. Optionally, but in some embodiments preferably, the electrical circuit component 42 is attached / welded to the mechanical interface component 43.

[0088] Referring now to Fig. 6B, a top side of the electrical circuit component 42 can comprise one or more electrodes 22e protruding upwardly therefrom and configured to pass through the one or more electrode passages (35e) of the mechanical interface component 43 and therefrom through the electrode bores (35a) of the media probe vessels Vi to contact the substance material inside its lumen (21n). In this non-limiting example, the electrochemical / pH sensor 42p can be mounted adjacent to the one or more electrodes 22e on the top side of the electrical circuit component 42, and configured to be snugly received and held inside the electrochemical / pH sensor enclosure 34y of the mechanical interface component 43 i.e., the electrochemical / pH sensor 42p is mounted on the electrical circuit component 42 (e.g., by electrically connecting it pins to sockets 34n) and introduced into the electrochemical / pH sensor enclosure 34y when the electrical circuit component 42is attached (e.g., fastened, welded, bonded) to the mechanical interface component 43.

[0089] As seen, the electrical circuit component 42 may comprise a flow sensing passage 17f configured to communicate with the second flow sensing bore (31a) of the media probe vessels Vi for providing fluid communication with a fluid channel (31c) formed in a top side of the electrical interface component 41. The electrical circuit component 42 may further comprise alignment / anchoring apertures 42m for aligning the electrical circuit component 42 to the mechanical interface component 43. The bottom side of the electrical circuit component 42 can further comprise a temperature sensor 42t configured to be snugly received and held in the temperature sensor indentation (44i) of the mechanical interface component 43, and / or an optical detector 42d configured to be optically coupled to the diffusive light receiver element 33d of the media probe vessels Vi via the optical window (43j) of the mechanical interface component 43.

[0090] As seen in Fig. 7B, the top side of the electrical circuit component 42 may comprise sensor elements 31s, 32s couplable to the flow and pressure sensing structure / arrangements (31,32) of the media probe vessels Vi, respectively. Particularly, the sensor element (e.g., a strain gauge) 31s can be formed in / on a deformable / elastic region of the electrical circuit component 42 and configured to be under the differential pressure conditions obtained between the following locations: (i) the pressure conditions at the non-constricted portions of the lumen (21n) of the media probe vessels Vi communicated to one (anterior) side of the sensor element 31s via the first flow sensing bore (31a) of the media probe vessels Vi and first flow sensing passages 31e of the mechanical interface component 43; and (ii) the pressure conditions at the constricted region (21c) of the media probe vessels Vi communicated to another (posterior) side of the sensor element 31s via the second flow sensing bore (31a) of the media probe vessels Vi, the second flow sensing passage 31e of the mechanical interface component 43, the flow sensing passage 17f of the electrical circuit component 42, and the fluid channel (31c) of the electrical interface component 41.

[0091] The sensor element 32s can be similarly formed in / on a deformable / elastic region of the electrical circuit component 42 configured to be under the pressure conditions at the nonconstricted portions of the lumen (21n) of the media probe vessels Vi communicated to sensor element 32s via the pressure sensing passage 32e of the mechanical interface component 43 and the pressure sensing bore 32a of the media probe vessels Vi.

[0092] The top side of the electrical circuit component 42 can further comprise electrical contact pads 42c electrically connected to the various sensing elements and electrodes of the electrical circuit component 42, and configured for electrical coupling the electrical circuit component 42 to the electrical connectors (11c) of the base unit (11) via respective contact pad apertures (41p) formed in the electrical interface component 41.

[0093] Referring now to Fig. 6C, the bottom side of the electrical interface component 41 may comprise the fluid channel 31c passing along a length thereof, and having a cavity 31v at one end and configured to communicate via its other end the pressure conditions at the nonconstricted portions of the lumen (21n) of the media probe vessels Vi communicated thereto via the second flow sensing bore 31a of the media probe vessels Vi and the flow sensing passage 17f of the electrical circuit component 42. The top side of the electrical interface component 41 can further comprise a cavity 32v configured to substantially enclose the pressure sensor element 32s formed on the top side of the electrical circuit component 42, so as to define a deflection zone for the elastic / deformable portion of the electrical circuit component 42 carrying the pressure sensor element 32s. In possible embodiments the cavity 32v may have an aperture 32z configured to communicate with the environment / atmosphere to provide the atmospheric pressure as a pressure measurement reference of the pressure measurement setup of the device.

[0094] Figs. 8A and 8B schematically illustrate an optical measurement circuitry 47 provided in the base unit for carrying out optical measurements via the optical sensing structure / arrangement 33. The optical measurement circuitry 47 is made in some embodiments of rectangular rigid piece of material (e.g., plastic or circuit board / PCB) comprising the one or more light indicators lie and the one or more connecting ports llu. Optical signal transmitter and receiver circuitries 47t,47r can be provided protruding upwardly from opposite regions of the optical measurement circuitry 47. Electrical connectors 47c can be also provided e.g., protruding upwardly from a central region of the optical measurement circuitry 47, for electrically coupling the optical measurement circuitry 47 to the electrical contact pads 42c of the electrical circuit component 42.

[0095] As seen, the optical signal transmitter circuitry 47t comprises one or more spaced apart light sources (e.g., LEDs) DI, D2,. . DM, configured to produce light signals illuminated into the optical transmitter elements 33t of the media probe vessels Vi, and the optical signal receiver circuitry 47r comprises one or more spaced apart light detectors (e.g., photodiodes) Tl, T2, . . . , Tn, configured to receive light signals from the optical receiver elements 33r of the media probe vessels Vi. In some embodiments the light sources DI, D2,. . Dn, and the light detectors Tl, T2,..., Tn, are provided at respective heights along the lengths of the optical signal transmitter and receiver circuitries 47t,47r, such that light detectors Ti will receive maximal light signals from the respective light source Di of the optical signal transmitter circuitry 47t when optical transmitter and receiver elements 33t,33r of a certain media probe vessel Vi are placed therebetween z.e., the transmitter elements 33t of each media probe vessel Vi are configured for optical coupling with a certain one of the light sources Di of the optical signal transmitter circuitry 47t and the receiver elements 33r of the media probe vessel Vi is configured for optical coupling with the respective light detector Di (z.e., located at the same height) of the receiver circuitry 47r.

[0096] This configuration enables the system (10) to identify which one of the media probe vessels Vi is placed in the base unit (11), by successively producing light signals via the light sources DI, D2,..., Dn, measuring the light signals received at the light detectors Tl, T2,..., Tn, for each successive light signal produced, and identifying which one of the media probe vessels Vi is placed in the base unit (11) upon determining that the maximal light signal is received at a certain light detector(s) Ti. The system can then proceed to use only the light source Di and its respective light detector(s) Ti, until identifying that the media probe vessel Vi been replaced e.g., by detecting opening of the lid element (llq) by a lid-state detector and / or detecting a disconnection of the electrical connectors (11c) of the base unit (11).

[0097] In some embodiments each light source Di, is configured to produce light signals at one or more predefined wavelength ranges e.g., in the ultraviolet (UV) and / or the infrared (IR) range and or visible range, so as to allow inspection of various different substance materials and / or various different properties associated with each of them. Each of the light detectors Ti, can accordingly have corresponding detectors for sensing transmittance of light signal in the respective wavelength ranges of the light sources Tl, T2,.. Tn. Figs. 8A and 8B exemplify a configuration utilizing three light emitters in light source Di, allowing each light source Di to selectively emit light signals of three different colors / wavelength ranges. In possible embodiments the number of light emitters in each light source Di can be greater or smaller than three, per application specification and requirements. In possible embodiments the light transmitter and / or receiver assemblies lit, Hr comprise optical filter(s) and / or lens(es) configured to improve the optical measurements carried out by the light sources Di and detectors Ti.

[0098] Figs. 9A and 9B show sectional views of the based unit 11 in a closed state of its lid element Ilf, accommodating a media probe vessel Vi held by a respective adapter Ai. As seen, the media probe vessel Vi is located between the optical signal transmitter and receiver circuitries 47t,47r such that its optical transmitter and receiver elements 33t,33r are optically coupled with respective light source and detector(s) Ti,Di thereof (i.e., the uppermost light source DI and the uppermost light detector T1 in this specific example). As also seen, in this operational state, the electrical connectors 47c of the optical measurement circuitry 47 are passed through the contact pad apertures 41p of the electrical interface component 41 to electrically connect with the electrical contact pads (42c) of the electrical circuit component (42).

[0099] Fig. 9B further exemplifies use of a (e.g., thin) indicator layer 33g of (e.g., luminophore) material, deposited in / on a surface area of the inner wall of the media probe vessel (Vi), and configured to change its optical properties when it contacts one or more types of materials introduced into the lumen (21n). One or more detectors Di (and / or 42d) can be configured to detect such change of optical properties of the indicator layer 33g and thereby identify presence of the one or more materials in the substance material introduced into the lumen (21n).

[0100] Fig. 10 shows various media probe vessels (Vi) held by their respective adapters (Ai) according to specific designs of possible embodiments, and the base unit (11) with the media probe vessel (Vi) and its adapter (Ai) placed thereinside in an operative state of the system.

[0101] Figs. 11A to 11C schematically illustrate connectivity of a plurality of docking stations 11 for power supply and / or communication of measurement data / signals thereby produced one to the other and / or to one or more control units / centers 49 according to some possible embodiments. Fig. 11A exemplifies a wire-based connectivity scheme wherein the plurality of docking stations 11 are concatenated by power and / or data / signals communication wires llw. As seen, the concatenation of docking stations 11 can be optionally electrically coupled to the one or more control units / centers 49 via an (optional) electrical adapter 49a. Accordingly, in this non-limiting example, each one of the docking stations 11 comprises a communication interface unit (I / F) configured for at least serial (e.g., USB, UART, RS485, CAN, Ethernet, or suchlike) or parallel (e.g., IDE, SQSI) bus-wire data / signal communication.

[0102] Fig. 11B exemplifies wireless and wire-based combined connectivity scheme, wherein the plurality of docking stations 11 are concatenated by power and / or data / signals communication wires llw, and the measurement data / signals from all of the docking stations 11 are wirelessly communicated to the one or more control units / centers 49 via a selected one of the plurality of docking stations 11. Accordingly, in this non-limiting example, the communication interface unit (I / F) of at least one of the docking stations 11 is further configured for wireless (e.g., WiFi, Bluetooth, ZeegBee, ISA100.1 la, or suchlike) data / signals communication. In possible embodiments the communication interface units (I / F) of some or all of the docking stations 11 can be configured for both bus-wire and wireless data / signals communication to also permit wireless data / signals communication between some or all of the docking stations 11, if so needed.

[0103] Fig. 11C exemplifies a wireless connectivity scheme wherein the plurality of docking stations 11 are concatenated by power and / or data / signals communication wires llw for connection to a power source (not shown), and the measurement data / signals from each one of the docking stations 11 is wirelessly communicated to the one or more control units / centers 49 from the respective docking station 11. Accordingly, in this specific example, the communication interface units (I / F) of all of the docking stations 11 are configured for at least wireless data / signals communication.

[0104] Fig.12 demonstrates a process 50 of measuring one or more properties and / or conditions of a substance according to possible embodiments. The process 50 can start is selection (si) of a suitable media probe vessel Vi from the plurality of media probe vessels VI, V2,..., Vn, and of its respective adapter Ai. The selection (si) of the media probe vessel Vi allows to monitor specific substance material, certain volume and / or cross-sectional area of the substance material, and / or coupling the media probe vessel Vi to a substance source and / or to conduits / tubes used to deliver the substance material to be monitored.

[0105] The selected media probe vessel Vi can be then fluidly connected (s2) to a substance source (e.g., reservoir, container, ductwork, or suchlike) e.g., by one or more conduits / tubes. The media probe vessel Vi can be then fit (s3) into its respective adapter Ai, which can be then coupled to / fastened in (s4) the base unit (11). Optionally, the connection of the selected media probe vessel Vi to the substance source is carried out after the coupling to / fastening in (s4) the base unit (11). In some embodiments the coupling / fastening (s4) of the media probe vessel Vi and its respective adapter Ai to the base unit (11) further comprise optically coupling optical transmitter and / or receiver elements (33t,33r) of the media probe vessel Vi to one or more light sources (Di) and / or light detectors Ti mounted inside the base unit (11).

[0106] Optionally, but in some embodiments preferably, the coupling to / fastening in (s4) the base unit (11) further comprises coupling (s34) to the interfacing assembly (17), which can be readily provided (e.g., removably or fixedly attached) in the base unit (11), or externally assembled and then attached to the media probe vessel Vi and thereafter fitted inside the base unit (11). Next, the substance material can be introduced (s5) into the media probe vessel Vi for its source and the one or more properties and / or conditions thereof can be measured (s6) by the sensors and circuitries provide in the base unit (11) and / or in the electrical circuit component 42 of the interfacing assemble. Figs. 13A to 13C schematically illustrate an interfacing assembly 17" according to possible embodiments. The interfacing assembly 17" is similar in many aspects to the interfacing assembly (17') shown in Figs. 6A to 6C and Figs. 7A to 7C. Similarly, the interfacing assembly 17" comprises a mechanical interface component 43", an electrical circuit component 42", and an electrical interface component 41", having several differences / modifications. A main difference between these interfacing assemblies is that in the interfacing assembly 17" the fluid channel 43c used to fluidly communicated the substance material from the lumen (21n) of the media probe vessel (Vi) to the posterior side of the flow rate sensing element 31s is formed in a portion of the electrical interface component 41" posterior to the electrical circuit component 42", to thereby isolate the fluid channel 43c from the electrical circuit component 42".

[0107] Particularly, in the interfacing assembly 17" the pressure conditions at the constricted region (21c) of the media probe vessels Vi are communicated to the other (posterior) side of the sensor element 31s via the second flow sensing bore (31a) of the media probe vessels Vi, the second flow sensing passage 31e of the mechanical interface component 43", the flow sensing passage 17f of the electrical circuit component 42", the flow sensing hole 41h of the electrical interface component 41", and the fluid channel 43c formed at the posterior side of the of the electrical interface component 41" in fluid communication with the flow sensing hole 41h. The electrical interface component 41" comprises apass-through bore 32j configured to be coaxially and sealably situated on top of the flow sensor element 31s.

[0108] A sealer element 41y can be formed on a surface of the electrical interface component 41" about the flow sensing hole 41h to provide sealed fluid communication therethrough to the flow sensing passage 31e, as the sealer element 41y is received in / passed through the passage 17f of the electrical circuit component 42" to provide sealed fluid communication between the electrical interface component 41" and the mechanical interface component 43", thereby preventing contact of the monitored substance material with the electrical circuit component 42".

[0109] The pass-through bore 32j can be formed in a circular depression 32c formed at the posterior side of electrical interface component 41", which may be substantially flush with a surface area of the fluid channel 43c. The fluid channel 43c can be sealed against a top surface of the base element (11). Optionally, but in some embodiments preferably, the fluid channel 43c is sealed by a channel cover element 48 configured to be snugly received in and cover the fluid channel 43c and the circular depression 32c. As seen in Fig. 13C, the channel cover element 48 comprises a channel cover portion 48c and an opening cover portion 48d radially extending from the channel cover portion 48c. The channel cover portion 48c and the opening cover portion 48d can have a circumscribing sealing lip 48y protruding from a posterior surface of the channel cover element 48, which may be configured to abut circumferential surface areas of the fluid channel 43c and of the circular depression 32c.

[0110] In possible embodiments the electrical circuit component 42" is implemented as a printed circuit formed on a flexible thin foil or film (e.g., made of a multilayered composite structure) using any of the techniques disclosed in the patent publications incorporated herein by reference. In some embodiments the electrical circuit component 42" is attached (e.g., welded or adhered) to the mechanical interface component 43", to thereby form one or more deformable portions (e.g., membranes) over the cavities 31v,32v with portions thereof carrying one or more sensing elements 31s, 32s. The electrical interface component 41" can be then attached (e.g., welded or adhered) to the mechanical interface component 43", and optionally also at least partially to the electrical circuit component 42". These steps can be similarly carried out to produce the interface assembly (17') shown in Figs. 6A to 6C and Figs. 7A to 7C. An additional step that may be required in the interface assembly 17" of Figs. Figs. 13A to 13C is the attachment (e.g., by welding or adhesives) of the channel cover element 48 to the electrical interface component 41", for sealing the fluid channel 43c, the flow sensing hole 41h, and the pass-through bore 32j.

[0111] In possible embodiments the mechanical interface component 43" comprises one or more alignment and / or attachment pins 43p projecting upwardly therefrom and configured to be received in respective sockets (not shown) formed in the base unit (11), to improve the repeatability of the positioning of the interfacing assembly 17" to the base unit (11). Optionally, but in some embodiments preferably, the electrical interface component 41" comprises one or more recesses 41r configured to provide access to trimming elements 42i of the electrical circuit component 42", to enable calibrating the sensing elements and / or compensate distortions that may be induced therein due to stresses possibly caused after attaching the electrical circuit component 42" to the to the mechanical interface component 43" and / or to the electrical interface component 41", and / or due to the attachment of the interfacing assembly 17" to the base unit (11).

[0112] As exemplifies in Fig. 13D, in some embodiments the electrochemical / pH sensor 42p is assembled (e.g., attached, welded or adhered) from an external side of the mechanical interface component (43") referenced in Fig. 13D as 43*. This way, if high pressure conditions evolve in the media probe vessel (Vi), the mechanical interface component 43" will externally support the electrochemical / pH sensor 42p, thereby reducing the stress on the attachment areas between the components of the interfacing assembly.

[0113] For example, the mechanical interface component 43* can be equipped with a mounting structure 34* configured to receive the electrochemical / pH sensor 42p, provide passages 34s for electrical connection pins pi of the electrochemical / pH sensor 42p for electrical connection in the sockets (34n in Figs. 6B and 13B) provided in the electrical interface component (41 / 41"). The mounting structure 34* can be configured to mount the electrochemical / pH sensor 42p at proper height for it to interact with the substance material, when interfacing assembly (17717") is attached to the media probe vessel (Vi), and to sealably couple the electrochemical / pH sensor 42p to the media probe vessel (Vi).

[0114] The mechanical interface component 43" can be equipped with one or more alignment and / or attachment pins 43t, configured to accurately position the electrical circuit component 42", via respective alignment / anchoring apertures 42m, when attached thereto, and to accurately position the electrical interface component 41", via respective alignment / anchoring sockets 41m, when attached thereto.

[0115] In possible embodiments the optical detector (42d) coupled to the scattered light receiver element (33d) is assembled in / on the base unit (11). In this configuration an optical window (e.g., light pipe, opening, lens and / or filter) 43k is formed in the mechanical interface component 43", a respective optical window 42k (e.g., light pipe, opening, lens and / or filter) is formed in the electrical circuit component 42", and a respective optical window 41k (e.g., light pipe, opening, lens and / or filter) is formed in the electrical interface component 41", for passage of optical signals from the substance material contained or streamed inside the media probe vessels Vi to the optical detector (42d) of the base unit (11). If the optical detector (42d) is mounted inside the base unit (11), a respective optical window (not shown e.g., light pipe, opening, lens and / or filter) can be provided in a wall portion of the base unit (11) for optically coupling the optical detector (42d) to the scattered light receiver element (33d).

[0116] A recess 41z can be formed in the electrical interface component 41" for deformations thereinto during operation of portions of the electrical circuit component 42" on which the pressure sensor 32s in situated. Optionally, a support element 41w, having a cavity configured to permit the deformations of the portions of the electrical circuit component 42", is attached in the recess 41z for engagement with sealing edge of the sealer element 32y and improved strength. A support component 41v is provided in some embodiments at allocation on the electrical interface component 41" located under the base sections of the electrodes 22e of the electrical circuit component 42" for supporting and stabilizing the electrodes 22e. The sensor elements disclosed herein can be implemented by any of the embodiments disclosed and illustrated in International Patent Publication Nos. WO 2015 / 114635, WO 2018 / 025264, WO 2019 / 171376, WO 2018 / 235087, WO 2020 / 095309, WO 2020 / 129069, of the same Applicant hereof, the disclosures of which is incorporated herein by reference.

[0117] Relative terms such as "lower," "upper," "horizontal," "vertical," "above," "below," "up," "down," "top" and "bottom", as well as derivatives thereof (e.g., "horizontally," "downwardly," "upwardly," etc.), and similar adjectives in relation to orientation of the described elements / components refer to the manner in which the illustrations are positioned on the paper, not as any limitation to the orientations in which these elements / components can be used in actual applications.

[0118] It should also be understood that throughout this disclosure, where a process or method is shown or described, the steps / acts of the method may be performed in any order and / or simultaneously, and / or with other steps / acts not-illustrated / described herein, unless it is clear from the context that one step depends on another being performed first. In possible embodiments not all of the illustrated / described steps / acts are required to carry out the method.

[0119] As described hereinabove and shown in the figures, the present invention provides adaptable sensor configurations and related methods. While particular embodiments of the invention have been described, it will be understood, however, that the invention is not limited thereto, since modifications may be made by those skilled in the art, particularly in light of the foregoing teachings. As will be appreciated by the skilled person, the invention can be carried out in a great variety of ways, employing more than one technique from those described above, all without exceeding the scope of the claims.

Claims

CLAIMS:

1. An adaptable sensor arrangement comprising: a base unit configured to receive and hold a media probe vessel accommodated in an adapter for monitoring one or more properties or conditions of a substance material contained or streamed through said media probe vessel; said media probe vessel selected from a plurality of media probe vessels couplable to said base unit by said adapter for acquiring by said base unit measurement data / signals indicative of said one or more properties or conditions of said substance material; said adapter selected from a plurality of different adapters, each one of said plurality of different adapters having different geometrical dimensions and / or coupling interfaces, and configured to accommodate at least one of the plurality of media probe vessels and facilitate the coupling of said base unit to said media probe vessel.

2. The adaptable sensor arrangement of claim 1 comprising an optical measurement setup mounted in the base unit and configured to measure optical signals transmitted through, and / or reflected from, the substance material contained or streamed through the selected media probe vessel.

3. The adaptable sensor arrangement of claim 2 wherein one or more of the media probe vessels comprises optical transmitter and / or receiver elements configured for acquisition of the optical signals.

4. The adaptable sensor arrangement of claim 3 wherein the selected adapter configured to facilitate optical coupling between the optical measurement setup and one or more optical coupling elements of the selected media probe vessel for acquisition of optical signals from the substance material.

5. The adaptable sensor arrangement of claim 3 or 4 wherein the optical measurement setup comprises plurality of spaced apart optical measurement elements, and wherein the optical coupling elements are situated at locations on the media probe vessels configured for optically coupling them with one of said plurality of spaced apart optical measurement elements of the media probe vessel.

6. The adaptable sensor arrangement of claim 5 wherein light emission and / or detection elements are configured at lateral sides of the media probe vessel, when said media probe vessel is coupled to the base unit.

7. The adaptable sensor arrangement of claim 6 wherein the base unit configured to identify the selected one of the plurality media probe vessel coupled thereto based on optical signals acquired by at least one of the plurality of spaced apart optical measurement elements.

8. The adaptable sensor arrangement of any one of claims 2 to 7 wherein at least one of the plurality of adapters comprises a partition element configured to prevent entry of interfering light into the optical optical measurement setup.

9. The adaptable sensor arrangement of any one of the preceding claims wherein at least one of said plurality of media probe vessels comprises a constriction configured to affect pressure conditions of the substance material contained or streamed in said constriction.

10. The adaptable sensor arrangement of any one of the preceding claims comprising an interfacing assembly configured to facilitate mechanical and / or electrical and / or optical coupling between the selected media probe vessel and the base unit.

11. The adaptable sensor arrangement of claim 10 wherein the adapter has a generally U- shaped cross-section configured to receive and hold the media probe vessel therein between its arms, and to accommodate by end portions of said arms the interfacing assembly coupled to said media probe vessel.

12. The adaptable sensor setup of any one of claims 9 to 11 wherein the interfacing assembly configured to communicate pressure conditions that are affected by the constriction, and pressure conditions that are not been affected by said constriction, to opposite sides of at least one sensor element thereof.

13. The adaptable sensor arrangement of claim 12 configured to measure flow rate of the substance material passing through the selected media probe vessel based on a differential pressure measurement of the pressure conditions communicated to the at least one sensor element.

14. The adaptable sensor of any one of claims 9 to 13 configured to measure pressure of the substance material contained or streamed through the selected media probe vessel based on pressure conditions communicated by the interfacing assembly to at least another sensor element thereof.

15. The adaptable sensor of any one of claims 9 to 14 comprising an electrochemical sensing element configured to measure electrochemical properties of the substance material..

16. The adaptable sensor of any one of claims 9 to 15 configured to measure electrical conductivity of the substance material by a plurality of spaced apart electrodes provided in the interfacing assembly and configured to directly interact with the substance material via respective spaced apart openings provided in the selected media probe vessel.

17. The adaptable sensor of any one of claims 9 to 16 configured to measure temperature of the substance material by at least one sensor element thermally coupled by the interfacing assembly to said substance material.

18. The adaptable sensor of claims 16 and 17 wherein the at least one sensor element is thermally coupled by the interfacing assembly to the substance material via at least one of the spaced apart electrodes.

19. The adaptable sensor of any one of claims 9 to 18 wherein the interfacing assembly comprises an electrical interface component configured for electrically coupling between the base unit and the electrical components of said interfacing assembly.

20. The adaptable sensor of claim 19 wherein the interfacing assembly comprises electrical circuit component configured to carry the one or more sensing elements and electrically couple them to the base unit via the electrical interface component.

21. The adaptable sensor of claim 20 wherein the electrical circuit component comprises circuitry configured to acquire measurement data / signals from sensing elements and communicate the same to the base unit.

22. The adaptable sensor of claim 19 or 21 wherein the interfacing assembly comprises a mechanical interface component configured to couple said interfacing assembly to the media probe vessel and establish fluid communication with a lumen thereof.

23. The adaptable sensor of claim 22 wherein the mechanical interface component of the interfacing assembly comprises a pressure sensing opening configured for fluid communication between a pass-through bore provided in the media probe vessel and at least one sensor element provide in the electrical circuit component.

24. The adaptable sensor of claim 22 or 23 wherein the mechanical interface component of the interfacing assembly comprises at least two differential pressure sensing openings configured for fluid communication between respective at least two pass-through bores provided in the media probe vessel and at least one sensor element provided in the electrical circuit component for communicating two different pressure conditions thereto.

25. The adaptable sensor of claim 24 wherein the mechanical interface component of the interfacing assembly comprises at least one pass-through bore configured to fluidly communicate between at least one of the at least two differential pressure sensing openings and a fluid channel formed in the electrical interface component in fluid communication with at least one sensor element of the electrical circuit component.

26. The adaptable sensor of claim 25 wherein the electrical interface component of the interfacing assembly comprises at least one pass-through bore or cavity configured to fluidlycommunicate fluid channel and the at least one sensor element of the electrical circuit component.

27. The adaptable sensor of claim 26 wherein fluid channel is formed in an anterior side of the electrical interface component with respect to the electrical circuit component to prevent contact of the substance material with certain portions of the electrical circuit component, and wherein the electrical interface component comprises at least one opening configured to fluidly communicate between the fluid channel and at least one sensor of the electrical circuit component.

28. The adaptable sensor of claim 27 wherein the interfacing assembly comprise a channel cover element configured to cover and seal the at least one pass-through bore, the fluid channel, and the at least one opening, of the electrical interface component.

29. The adaptable sensor of any one of claims 19 to 28 comprising a housing structure formed in the mechanical interface component and configured to receive and hold an electrochemical sensor inside the interfacing assembly for coupling to the media probe vessel.

30. The adaptable sensor of any one of claims 19 to 28 comprising a mounting structure formed in the mechanical interface component and configured to receive and hold an electrochemical sensor external to the interfacing assembly for coupling to the media probe vessel.

31. The adaptable sensor of any one of claims 9 to 30 wherein the interfacing assembly comprises at least one optical sensor configured to measure optical signals scattered from the substance material via an optical coupling region provided in the media probe vessel.

32. The adaptable sensor of claim 31 wherein the at least one optical sensor is mounted on an electrical circuit component of the interfacing assembly, and wherein a mechanical interface component of the interfacing assembly is configured to optically couple the at least one optical sensor and the optical coupling region of the media probe vessel.

33. The adaptable sensor of claim 31 wherein the at least one optical sensor is mounted in the base unit and wherein the interfacing assembly is configured to optically couple between said at least one optical sensor and the optical coupling region of the media probe vessel.

34. The adaptable sensor of any one of the preceding claims comprising a memory for storing data related to the sensing elements, and wherein the base unit is configured to read said data upon establishing electrical connection therewith and acquire measurement data from said sensing elements based thereon.

35. The adaptable sensor of claim 34 wherein the data stored in the memory is indicative of at least one of the following: type of sensor elements used; measurement ranges and / oraccuracies of said sensor elements, physical and / or geometrical and / or optical properties of the selected media probe vessel.

36. A method for coupling a plurality of sensor elements to a fluid vessel, the method comprising selecting from a plurality of fluid vessels one fluid vessel suitable for monitoring by said plurality of sensor elements a specific substance material, and / or certain volume and / or cross-sectional area of said substance material, and / or for coupling said fluid vessel to a substance source and / or to conduits / tubes used to deliver the substance material to be monitored, selecting from a plurality of adapters an adapter couplable to the selected fluid vessel, connecting the selected fluid vessel to a substance source, coupling the selected fluid vessel and its selected adapter to a base unit, introducing the substance material into the fluid vessel, and acquiring measurement data / signals indicative of one or more properties and / or conditions of said substance material by said base unit from said plurality of sensor elements.

37. The method of claim 36 wherein the connecting of the selected fluid vessel to the substance source is carried out after the coupling to the base unit.

38. The method of claim 36 or 37 wherein the coupling of the fluid vessel and its respective adapter to the base unit comprises optically coupling optical coupling elements of the fluid vessel to one or more light emitting and / or detecting elements of the base unit.

39. The method of any one of claims 36 to 38 wherein the coupling to the base unit comprises coupling the fluid vessel to an interfacing assembly configured to measure one or more of the properties and / or conditions of the substance material.

40. The method of any one of claims 36 to 38 wherein the coupling to the base unit comprises reading from a memory data related to at least one of the plurality of sensor elements.

41. The method of claim 40 comprising adjusting measurement data / signal acquired from at least one of the plurality of sensor elements based on the data read from the memory.

42. A multisensor kit comprising a plurality of fluid vessels each configured for monitoring by a plurality of sensor elements a specific substance material, and / or certain volume and / or cross-sectional area of said substance material, and / or for coupling said fluid vessel to a substance source and / or to conduits / tubes used to deliver the substance material to be monitored, a plurality of adapters each of which being couplable to at least one of the plurality of fluid vessels, a base unit connectable to each one of the plurality fluid vessels via at least one of the plurality of adapters, said base unit configured to a acquire measurement data / signals indicative of one or more properties and / or conditions of a substance material contained or streamed inside a selected one of said plurality of fluid vessels coupled thereto by one of the plurality of adapters.

43. The kit of claim 42 comprising an interfacing assembly configured for coupling each one of the plurality of fluid vessels to the based unit via a selected one of the plurality of adapters.

44. The kit of claim 42 or 43 comprising an electrochemical sensor, and wherein the interfacing assembly is configured to hold said electrochemical sensor either internally or externally.

45. A sensing setup comprising a media probe vessel selected from a plurality of media probe vessels and an interfacing assembly couplable to each one of said plurality of media probe vessels, said interfacing assembly configured to mechanical and / or electrical and / or optical couple the selected media probe vessel to an external device for acquisition of measurement data / signals generated by one or more sensing elements thereof.

46. The sensor setup of claims 45 wherein the interfacing assembly configured to communicate pressure conditions that are affected by a constriction formed in the media probe vessel, and pressure conditions that are not been affected by said constriction, to opposite sides of at least one sensor element thereof.

47. The sensor setup of claim 45 or 46 configured to measure pressure of the substance material contained or streamed through the selected media probe vessel based on pressure conditions communicated by the interfacing assembly to at least another sensor element thereof.

48. The sensor setup of any one of claims 45 to 47 configured to measure electrical conductivity of the substance material by a plurality of spaced apart electrodes provided in the interfacing assembly and configured to directly interact with the substance material via respective spaced apart openings provided in the selected media probe vessel.

49. The sensor setup of any one of claims 45 to 48 configured to measure temperature of the substance material by at least one sensor element thermally coupled by the interfacing assembly to said substance material.

50. The sensor setup of any one of claims 44 to 49 wherein the interfacing assembly comprises one or more of the following: an electrical interface component configured for electrically coupling between the base unit and the electrical components of said interfacing assembly; an electrical circuit component configured to carry the one or more sensing elements and electrically couple them to the base unit via the electrical interface component; a mechanical interface component configured to couple said interfacing assembly to the media probe vessel and establish fluid communication with a lumen thereof.

51. The sensor setup of claim 50 comprising either a housing structure formed in the mechanical interface component and configured to receive and hold an electrochemical sensor inside the interfacing assembly for coupling to the media probe vessel, or a mounting structure formed in the mechanical interface component and configured to receive and hold an electrochemical sensor external to the interfacing assembly for coupling to the media probe vessel.

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