Liquid cooling negative pressure distribution system

Abstract

A data center cooling system for cooling at least one rack system of a data center includes a cooling circuit having a cooling fluid circulating therethrough. The cooling circuit includes a cooling distribution unit and a heat recovery component associated with the at least one rack system. The heat recovery component is fluidly coupled to the cooling distribution unit. The cooling circuit has a negative pressure at the heat recovery component.

Description

LIQUID COOLING NEGATIVE PRESSURE DISTRIBUTION SYSTEMCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of US provisional patent application number 63 / 518,670 filed August 10, 2023, the entire contents of which are incorporated herein by reference.BACKGROUND

[0002] Exemplary embodiments pertain to the art of thermal management, and more particularly, relate to thermal management of a server within a data center.

[0003] A “data center” refers to the physical location of one or more servers. A data center and the servers housed within a data center typically consume a significant amount of electrical power. Existing servers are designed to be cooled at least partially by a flow of air. Such servers usually include one or more printed circuit boards having a plurality of operable heat-generating devices mounted thereto. The printed circuit boards are commonly housed in an enclosure having vents configured to direct external air from the data center into, through and out of the enclosure. The air absorbs heat dissipated by the components and after being exhausting from the enclosure, mixes with the ambient air. An air conditioner is then used to cool the heated air of the data center and to recirculate it, repeating the cooling process.

[0004] Higher performance server components typically dissipate more power. However, the amount of heat that conventional cooling system can remove from a server is in part limited by the extent of the air conditioning available from the data center. In general, a lower air temperature in a data center allows each server component cooled by an air flow to dissipate a higher power, and thus allows each server to operate at a correspondingly higher level of performance.BRIEF DESCRIPTION

[0005] According to an embodiment, a data center cooling system for cooling at least one rack system of a data center includes a cooling circuit having a cooling fluidcirculating therethrough. The cooling circuit includes a cooling distribution unit and a heat recovery component associated with the at least one rack system. The heat recovery component is fluidly coupled to the cooling distribution unit. The cooling circuit has a negative pressure at the heat recovery component.

[0006] In addition to one or more of the features described above, or as an alternative, in further embodiments the cooling circuit includes a pump for moving the cooling fluid within the cooling circuit. The pump is arranged downstream from the heat recovery component and upstream from the cooling distribution unit relative to a flow of the cooling fluid.

[0007] In addition to one or more of the features described above, or as an alternative, in further embodiments the pump is located directly downstream from an outlet of the heat recovery component and operation of the pump creates the negative pressure at the heat recovery component.

[0008] In addition to one or more of the features described above, or as an alternative, in further embodiments the pump is a positive pressure pump.

[0009] In addition to one or more of the features described above, or as an alternative, in further embodiments the cooling circuit includes a pump for moving the cooling fluid within the cooling circuit. The pump is arranged downstream from the cooling distribution unit and upstream from the heat recovery component relative to a flow of the cooling fluid.

[0010] In addition to one or more of the features described above, or as an alternative, in further embodiments the cooling circuit includes an eductor located upstream from an inlet of the heat recovery component.

[0011] In addition to one or more of the features described above, or as an alternative, in further embodiments the eductor has a first inlet and a second inlet. An outlet of the heat recovery component is fluidly connected to the second inlet.

[0012] In addition to one or more of the features described above, or as an alternative, in further embodiments the eductor is arranged in parallel with the heat recovery component relative to a flow of the cooling fluid.

[0013] In addition to one or more of the features described above, or as an alternative, in further embodiments including an inlet valve arranged directly upstream from the heat recovery component.

[0014] In addition to one or more of the features described above, or as an alternative, in further embodiments including an outlet valve arranged directly downstream from the heat recovery component.

[0015] In addition to one or more of the features described above, or as an alternative, in further embodiments including at least one manifold. The cooling distribution unit is fluidly coupled to the heat recovery component by the at least one manifold.

[0016] In addition to one or more of the features described above, or as an alternative, in further embodiments the heat recovery component is positioned vertically below the cooling distribution unit.

[0017] In addition to one or more of the features described above, or as an alternative, in further embodiments the heat recovery component is positioned vertically above the cooling distribution unit.

[0018] In addition to one or more of the features described above, or as an alternative, in further embodiments the cooling circuit includes a plurality of fluid loops arranged in parallel. Each of the plurality of fluid loops includes a separate cooling distribution unit and a separate heat recovery component associated with the at least one rack system.

[0019] In addition to one or more of the features described above, or as an alternative, in further embodiments the plurality of fluid loops are fluidly coupled by at least one manifold.

[0020] In addition to one or more of the features described above, or as an alternative, in further embodiments the cooling distribution unit is a heat exchanger fluidly coupled to a cooling system, wherein a heat transfer fluid is configured to absorb heat from the cooling fluid at the cooling distribution unit.

[0021] According to an embodiment, a method of cooling at least one rack system of a data center includes circulating a cooling fluid through a cooling circuit, transferring heat from the cooling fluid at a cooling distribution unit, and transferring heat to the cooling fluid at a heat recovery component associated with the rack system. The cooling circuit has a negative pressure at the heat recover}' component.

[0022] In addition to one or more of the features described above, or as an alternative, further embodiments include operating a pump to generate the negative pressure at the heat recovery component. The pump is positioned directly downstream from an outlet of the heat recovery component.

[0023] In addition to one or more of the features described above, or as an alternative, further embodiments include providing a first portion of the cooling fluid to the heat recovery component and second portion of the cooling fluid to a first inlet of an eductor in parallel. A flow of the second portion of the cooling fluid within the eductor generates the negative pressure at the heat recovery component.

[0024] In addition to one or more of the features described above, or as an alternative, further embodiments include adjusting a position of at least one of an inlet valve and an outlet valve associated with the heat recovery component in response to a condition at the at least one rack system.BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:

[0026] FIG. 1 is a schematic diagram of an example of a cooling system according to an embodiment;

[0027] FIG. 2 is a schematic diagram of a cooling system integrated into a building according to an embodiment;

[0028] FIG. 3 is a schematic diagram of a cooling system integrated into a building according to another embodiment;

[0029] FIG. 4 is a schematic diagram of a cooling system integrated into a building according to an embodiment;

[0030] FIG. 5 is a schematic diagram of a cooling system integrated into a building according to an embodiment;

[0031] FIG. 6 is a schematic diagram of a cooling system integrated into a building according to an embodiment; and

[0032] FIG. 7 is a schematic diagram of a cooling system according to another embodiment.DETAILED DESCRIPTION

[0033] A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.

[0034] Referring to FIG. 1, an example of a cooling system 20 is illustrated. As shown, the cooling system 20 includes a cooling distribution system 30 and a plurality of loads thermally coupled to the cooling distribution system 30. As used herein, the term “load” is intended to apply to any secondary system or component that is thermally coupled to the cooling distribution system 30, regardless of whether the secondary system or component is configured to transfer heat to the cooling distribution system 30 or remove heat from the cooling distribution system 30. In the illustrated, nonlimiting embodiment, the plurality of loads of the cooling distribution system 20 includes a first load 32 and a second load 34.. However, it should be appreciated that embodiments having any number of loads connected to the cooling distribution system 30, such as three loads, four loads, or five loads for example, are within the disclosure.Examples of suitable loads include but are not limited to a data center cooling system, an air conditioning system such as an air handling unit, a chiller system, a heat pump, and a sanitary or potable water system.

[0035] As shown, the cooling distribution system 30 includes a cooling distribution circuit through which a primary heat transfer fluid F circulates. Examples of suitable heat transfer fluids F include but are not limited to water, propylene glycol, dielectric fluid, and refrigerant. The cooling distribution system 30 may include a pump or other movement device 36 for moving the heat transfer fluid F through the cooling distribution circuit. In some embodiments, the cooling distribution circuit may include one or more valves (not shown), such as to allow the heat transfer fluid F to selectively bypass one or more of the loads. Although the cooling distribution circuit is illustrated as having a closed loop configuration, embodiments where the cooling distribution circuit is not a closed loop are also contemplated herein.

[0036] The cooling distribution system 30 is configured to transfer heat between the plurality of loads. In the simplified cooling distribution system 30 illustrated in the embodiment of FIG. 1, the heat transfer fluid F is configured to absorb heat from the first load 32 and transfer heat to the second load 34. Although the cooling distribution circuit is illustrated as being thermally coupled to the one or more loads via heat exchangers, such as a first heat exchanger 38 and a second heat exchanger 40, respectively, it should be appreciated that embodiments where the cooling distribution circuit is thermally coupled to the at least one load in another suitable manner are within the scope of the disclosure. The first heat exchanger 38 may also be referred to herein as a cooling distribution unit.

[0037] In the illustrated, non-limiting embodiment, the first load 32 is a data center cooling system including a secondary cooling circuit through which a coolant or secondary cooling fluid C is configured to circulate. In some embodiments, the cooling fluid C is a liquid, such as water, propylene glycol, or dielectric fluid for example. The data center cooling system 32 is associated with one or more data centers 50, each having at least one rack system 52 containing at least one server or assembly having heat-generating electronic devices 54 (referred to herein as “servers”) therein (see FIG.2). Localized cooling at the one or more servers 54 may be performed via a separate server cooling system having a separate fluid, not described herein. As shown, the rack system 52 includes at least one heat recovery component 56 configured to receive a flow of the cooling fluid C. In the illustrated, non-limiting embodiment, the heat recovery component 56 is a heat exchanger. However, in other embodiments the heat recovery component 56 may be a cold plate or other suitable heat transfer device. Within each heat recovery component 56, heat is transferred from the rack system 52, such as from the one or more components of the at least one server 54 arranged therein, to the cooling fluid C. In embodiments where a data center 50 includes a plurality of rack systems 52, as shown in FIG. 1, the cooling fluid C is provided to the heat recovery component 56 associated with each rack system 54 in parallel. The flows of cooling fluid C output from each heat recovery component 56 are then rejoined at a location upstream from the cooling distribution unit 38 or other thermal coupling with the cooling distribution system 30. It should be appreciated that in embodiments wherein the data center cooling system 32 alternatively or additionally includes a plurality of data centers 50, the cooling fluid C may be provided to each data center 50 in parallel, and further may be provided to the heat recovery component 56 of each rack system 54 of the plurality of data centers in parallel.

[0038] With reference now to FIGS. 2-6, various implementations of the cooling system 20 within a building are illustrated. Implementation of the cooling system 20, specifically the distribution of the cooling fluid C and the heat transfer fluid F between the various loads can be challenging. Further, external leakage of the cooling fluid C, such as within a rack system 52 for example, could potentially cause significant damage to the rack system 52. To minimize the risk of such a leak from occurring, in an embodiment, the secondary cooling circuit has a negative pressure (relative to atmospheric pressure) or zero pressure at least one heat recovery component 56.

[0039] With reference now to FIGS. 2 and 3, in the illustrated, non-limiting embodiment, data center cooling system 32 has a secondary cooling circuit including a tank or accumulator 60 filled at least partially with cooling fluid C. The tank 60 may be open to the atmosphere, as shown, or may be sealed and pressurized by the secondary cooling circuit. Accordingly, in some embodiments, such as when the tank 60 is opento the atmosphere, the secondary cooling circuit has an open-loop configuration. An outlet 62 of the tank 60 is fluidly connected to an inlet valve 64 via a first conduit 66 and the inlet valve 64 is fluidly connected to an inlet 68 of the at least one heat recovery component 56 via a second conduit 70. A third conduit 76 couples the outlet 72 of the heat recovery component 56 to an inlet 74 of the cooling distribution unit 38 and a fourth conduit 78 couples an outlet 80 of the cooling distribution unit 38 to an inlet 82 of the tank 60.

[0040] A first pump 84 is configured to circulate the cooling fluid C within at least a portion of the secondary cooling circuit. As shown, the first pump 84 may be positioned between the outlet 62 of the tank 60 and the inlet valve 64. A second pump 86 may be located downstream from the heat recovery component 56 relative to the flow of cooling fluid C, such as at a location upstream from the cooling distribution unit 38 for example. In an embodiment, the second pump 86 is a positive displacement pump. A controller may be operably coupled to at least one of the first pump 84, the second pump 86, and the inlet valve 64. Operation of one or more of the first pump 84, the second pump 86, and inlet valve 64 may be controlled in response to a status or condition at the data center.

[0041] In operation, the first pump 84 moves a flow of cooling fluid C through the first conduit 66 to the inlet valve 64. Further, operation of the second pump 86 located downstream from the at least one heat recovery component 56 creates a negative pressure or zero pressure within the heat recovery component 56, and in some embodiments, within the conduit 70 connected to the inlet valve 64. The position of the inlet valve 64 may be adjusted to control the flow of the cooling fluid C towards the at least one heat recovery component 56. In the event of a leak or failure, the inlet valve 64 may be closed to stop the flow of cooling fluid C to the rack system 52 to minimize damage thereto.

[0042] In the illustrated, non- limiting embodiments of FIGS. 2 and 3, the various component of the cooling system 20 are arranged at different levels (relative to the ground floor) of a building. For example, the at least one rack system 52 of a data center 50 and the inlet valve 64 associated therewith may both located verticallybeneath the second pump 86 and / or the thermal interface between the cooling distribution system and the data center cooling system, such as the cooling distribution unit 38. The inlet valve 64 may be positioned vertically above the inlet 68 of the at least one heat recovery component 56, and the tank 60 and the first pump 84 may be disposed vertically beneath the at least one heat recovery component 56. However, it should be understood that regardless of the configuration of the data center cooling system 32, embodiments where the at least one heat recovery component 56 is positioned vertically above (FIGS. 4 and 6) or at the same level (FIG. 5) as the thermal interface between the cooling distribution system 30 and the data center cooling system 32 are also within the scope of the disclosure.

[0043] In some embodiments, the data center cooling system 32 is fluidly and thermally coupled to a plurality of data centers 50, such as located at different floors of a building for example. In such embodiments, each of the plurality of data centers 50 includes at least one rack system 52 containing one or more servers 54 therein. When used to cool a plurality of data centers 50, the data center cooling system 32 may include a plurality of parallel fluid loops, each associated with a respective data center 50. With reference to the non- limiting embodiment of FIG. 3, each fluid loop includes an inlet valve 64, a second pump 86, and its own thermal interface with the cooling distribution system 30 via a cooling distribution unit 38. Although a single cooling distribution system 30 is illustrated, in some embodiments, the cooling distribution units 38 thermally coupled to the plurality of parallel loops of the data center cooling system 32 may be from different cooling distribution systems, respectively. The flows of cooling fluid C output from each cooling distribution unit 38 are then rejoined at a location upstream from the tank 60. Although the data center cooling system 32 is described as having multiple data centers 50 arranged in parallel, it should be appreciated that the same configuration of the data center cooling system 32 may be applied to a data center 50 having multiple rack systems 52 arranged in parallel relative to a flow of cooling fluid C within the secondary cooling circuit.

[0044] In other embodiments, a building may have a separate data center cooling system 32 for each data center 50. In such embodiments, such as shown in FIG.4, the cooling distribution unit 38 of each data center cooling system 32 may beconnected to the same cooling distribution system 30 or to different cooling distribution systems.

[0045] With continued reference now to FIGS. 4-6, another embodiment of a data center cooling system 32 is illustrated. The data center cooling system 32 is similar to the data center cooling system of FIGS. 2 and 3; however, unlike the embodiments in FIGS. 2 and 3, the secondary cooling circuit of the data center cooling system 32 has a closed-loop configuration. Accordingly, the data center cooling system 32 need not include a tank as previously described herein. In such embodiments, the outlet 72 of the heat recovery component 56 may be directly coupled to the inlet 74 of the cooling distribution unit 38. As shown, an inlet valve 64 may be arranged upstream, for example directly upstream, from the inlet 74 of the cooling distribution unit 38. In embodiments including a plurality of data centers 50 and / or a plurality of rack systems 52 arranged in parallel relative to the flow of the cooling fluid C within the secondary cooling circuit, an inlet valve 64 may be located upstream from each of the plurality of data centers 50 or rack systems 52 within a data center.

[0046] A single pump 88, in place of the first and second pumps 84, 86 previously described herein, may be located directly upstream from the inlet 74 of the cooling distribution unit 38 and directly downstream from an outlet 72 of the heat recovery component 56. In the illustrated, non-limiting embodiment, the data center 50 is located vertically above the cooling distribution unit 38.

[0047] In operation, cold cooling fluid C is circulated through the secondary cooling circuit via the pump 88. The cooling fluid C is heated as it passes through the heat recovery component 56. From the outlet 72 of the at least one heat recovery component 56, the cooling fluid C is provided to the inlet 74 of the cooling distribution unit 38 where the heat is transferred to the heat transfer fluid of the cooling distribution system 20. From the outlet 80 of the cooling distribution unit 38, the cooling fluid C is returned to the inlet of the heat recovery component 56 via inlet valve 64. Operation of the pump 88 located directly downstream from the at least one heat recovery component 56 creates a negative pressure or zero pressure within the heat recovery component 56, thereby drawing the cooling fluid C through heat recovery component 56. The one ormore inlet valves 64 may be operable to control the flow of the cooling fluid C provided to the heat recovery component 56.

[0048] With reference now to FIGS. 5 and 6, similar closed loop configurations of a data center cooling system 32 are provided. As shown, the secondary cooling circuit may include an at least one manifold, such as an inlet manifold 89 fluidly connected to data center 50 or rack system 52 via a respective inlet branch and an outlet manifold 91 fluidly connected to the outlet of each data center 50 or rack system 52 via a respective outlet branch. Further, as shown in FIG. 5, the data center cooling system 32 may include not only an inlet valve 64 associated with each inlet branch, such as arranged directly upstream from an inlet 68 of a heat recovery component 56, but also an outlet valve 65 associated with each outlet branch, for example arranged directly downstream from the outlet 72 of a heat recovery component 56. As previously described, a position of at least one of an inlet valve 64 and an outlet valve 65 associated with a heat recovery component 56 may be adjusted for example closed, by a controller in response to detection of a condition at the at least one rack system, such as a failure for example.

[0049] In some embodiments, the data center cooling system 32 may additionally include a vent 90 and / or an expansion tank 92 and corresponding control valve 94. Inclusion of a vent 90 may be used to remove any gas, such as air for example, which has accumulated within the cooling fluid C. Although the vent 90 is illustrated as being located directly downstream from the pump 88 in FIG. 5, it should be appreciated that one or more vents 90 may be located at any position relative to the secondary cooling circuit. For example, a vent 90 may be associated with each inlet branch connected to a respective heat recovery component 56, such as between the inlet valve 64 and the inlet 68. The expansion tank 92 and corresponding control valve 94 may be used to maintain a constant pressure of the cooling fluid C downstream from the pump 88. As shown, the expansion tank 92 and control valve 94 may be directly upstream from the cooling distribution unit 38 (FIG. 5) or may be located downstream from the cooling distribution unit 38, such as at a location upstream from the one or more inlet valves 64 (FIG. 6). In the illustrated, non-limiting embodiment of FIG. 6, the expansion tank 92 and control valve 94 are directly connected to manifold, howeverany location downstream from the cooling distribution unit 38 and upstream from a heat recovery component 56 is within the scope of the disclosure.

[0050] With reference now to FIG. 7, another example of a data center cooling system 32 is illustrated. In the illustrated, non-limiting embodiment, the data center cooling system 32 includes a plurality of fluid loops arranged in parallel. Each fluid loop includes a cooling distribution unit 38 of a cooling distribution system 30 as previously described and at least one data center 50 having one or more rack systems 52. A pump 100 may be arranged downstream from the cooling distribution unit 38 and upstream from a rack system 52 of a data center 50 relative to a direction of flow of cooling fluid C. In the illustrated, non-limiting embodiment, an eductor or ejector 102 is arranged at or upstream from the inlet of the one or more rack systems 52. The eductor 102 may be a typical eductor having a first or primary inlet 104, a second or secondary inlet 106, and an outlet 108. Arranged within the interior of the eductor 102 is a nozzle, such as a convergent-divergent nozzle for example, and a diffuser as is known.

[0051] The eductor 102 is positioned such that the flow of cooling fluid C at the inlet of the rack system 52 is separated into two portions Cl and C2. The first portion Cl of the cooling fluid is configured to flow through a heat recovery component of the rack system 52 and / or across one or more servers 54 or other heat generating components within the rack system 52. The second portion C2 of the cooling fluid is provided to the first inlet 104 of the eductor 102. As the second portion C2 of the cooling fluid passes through the nozzle of the eductor 102, the flow is accelerated and the pressure is reduced, thereby creating a negative pressure at the second inlet 106. This pressure reduction draws the first portion Cl of the cooling fluid C through the rack system 52, where it absorbs heat and into the secondary inlet 106 of the eductor 102. The first portion Cl and the second portion C2 of the cooling fluid are then mixed and expelled from the outlet 108 of the eductor 102. The heated cooling fluid C is then provided to the inlet of a cooling distribution unit 38 where the heat is released to the heat transfer fluid F.

[0052] An inlet valve 110 may be arranged downstream from the pump 100 and directly upstream from an inlet of one or more rack systems 52 of a data center 50.Similarly, an outlet valve 112 may be located downstream from the outlet of the one or more rack systems 52 of a data center 50 and upstream from an inlet of the cooling distribution unit 38.

[0053] An outlet of the cooling distribution unit 38 may be fluidly coupled to an inlet of one or more rack systems 52 of one or more data centers 50, such as via an inlet manifold 114. Similarly, an outlet of the rack system 52 may be fluidly coupled to an inlet of a cooling distribution unit 38, such as via an outlet manifold 116. In embodiments where the secondary cooling circuit of the data center cooling system 32 includes a plurality of fluid loops, the plurality of fluid loops may be operably coupled via the inlet and outlet manifolds 114, 116. Via such a connection, in the event that cooling of one or more or the rack systems is not required, such as due to being off or a failure, the rack system can be isolated from the fluid loop by closing the inlet and outlet valves 110, 112 associated therewith. In the illustrated, non-limiting embodiment, no components are shared between multiple fluid loops. Each fluid loop has its own cooling distribution unit 38, pump 100, eductor 102, and inlet and outlet valves 110, 112. However, embodiments where one or more components, such as the pump 100 or cooling distribution unit 38 are shared between multiple fluid loops are also within the scope of the disclosure.

[0054] The use of a liquid cooling fluid to cool a data center is more effective than existing cooling methods using an air flow. Further, by applying a negative pressure to a portion of a secondary cooling circuit associated with a data center 50 or a rack system 52, the potential for leakage within the data center or rack system 52 is limited.

[0055] The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application.

[0056] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural formsas well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and / or groups thereof.

[0057] While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.

Claims

What is claimed is:

1. A data center cooling system for cooling at least one rack system of a data center, the data center cooling system comprising: a cooling circuit having a cooling fluid circulating therethrough, the cooling circuit including: a cooling distribution unit; and a heat recovery component associated with the at least one rack system, the heat recovery component being fluidly coupled to the cooling distribution unit; wherein the cooling circuit has a negative pressure at the heat recovery component.

2. The data center cooling system of claim 1, wherein the cooling circuit further comprises a pump for moving the cooling fluid within the cooling circuit, the pump being arranged downstream from the heat recovery component and upstream from the cooling distribution unit relative to a flow of the cooling fluid.

3. The data center cooling system of claim 2, wherein the pump is located directly downstream from an outlet of the heat recovery component, and operation of the pump creates the negative pressure at the heat recovery component.

4. The data center cooling system of claim 2 or claim 3, wherein the pump is a positive pressure pump.

5. The data center cooling system of claim 1, wherein the cooling circuit further comprises a pump for moving the cooling fluid within the cooling circuit, the pump being arranged downstream from the cooling distribution unit and upstream from the heat recovery component relative to a flow of the cooling fluid.

6. The data center cooling system of claim 1, wherein the cooling circuit further comprises an eductor located upstream from an inlet of the heat recovery component.

7. The data center cooling system of claim 6, wherein the eductor has a first inlet and a second inlet, wherein an outlet of the heat recovery component is fluidly connected to the second inlet.

8. The data center cooling system of claim 6 or claim 7, wherein the eductor is arranged in parallel with the heat recovery component relative to a flow of the cooling fluid.

9. The data center cooling system of claim any of the preceding claims, further comprising an inlet valve arranged directly upstream from the heat recovery component.

10. The data center cooling system of claim 9, further comprising an outlet valve arranged directly downstream from the heat recovery component.

11. The data center cooling system of any of the preceding claims, further comprising at least one manifold, the cooling distribution unit being fluidly coupled to the heat recovery component by the at least one manifold.

12. The data center cooling system of any of the preceding claims, wherein the heat recovery component is positioned vertically below the cooling distribution unit.

13. The data center cooling system of any of claims 1-11, wherein the heat recovery component is positioned vertically above the cooling distribution unit.

14. The data center cooling system of any of the preceding claims, wherein the cooling circuit includes a plurality of fluid loops arranged in parallel, each of the plurality of fluid loops including a separate cooling distribution unit and a separate heat recovery component associated with the at least one rack system.

15. The data center cooling system of claim 14, wherein the plurality of fluid loops are fluidly coupled by at least one manifold.

16. The data center cooling system of claim 14, wherein the cooling distribution unit is a heat exchanger fluidly coupled to a cooling system, wherein a heattransfer fluid is configured to absorb heat from the cooling fluid at the cooling distribution unit.

17. A method of cooling at least one rack system of a data center comprising: circulating a cooling fluid through a cooling circuit; transferring heat from the cooling fluid at a cooling distribution unit; and transferring heat to the cooling fluid at a heat recovery component associated with the rack system, wherein the cooling circuit has a negative pressure at the heat recovery component.

18. The method of claim 17, further comprising operating a pump to generate the negative pressure at the heat recover}' component, the pump being positioned directly downstream from an outlet of the heat recover}' component.

19. The method of claim 17, further comprising providing a first portion of the cooling fluid to the heat recovery component and second portion of the cooling fluid to a first inlet of an eductor in parallel, wherein a flow of the second portion of the cooling fluid within the eductor generates the negative pressure at the heat recovery component.

20. The method of any of claims 17-19 further comprising adjusting a position of at least one of an inlet valve and an outlet valve associated with the heat recovery component in response to a condition at the at least one rack system.

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