Thermal management system for a modular platform of an electric vehicle chassis

Abstract

Thermal management device for a modular platform (A) of an electric motor vehicle chassis, the thermal management device comprising: - a first module (M1), comprising a compressor (41), a first expansion device (43) and a multi-fluid heat exchanger (1) of a first heat transfer fluid circuit (X), said first module (M1) being intended to be integrated within the modular platform (A), - a cooling module (C) comprising at least a first heat exchanger (62, 42'), said cooling module (C) being intended to be integrated within the modular platform (A), - a heating, ventilation and air conditioning device (D) comprising a chiller (66, 46), a second heat exchanger (65, 47) and a ventilation means (D1) configured to generate said internal airflow (400), - a second module (M2) comprising at least a first pump (61) of a second heat transfer fluid circuit (Y),and a heat exchange interface (BAT) with the batteries (B), the various modules (M1, M2), the cooling module (C), the heating, ventilation and air conditioning unit (D), and the heat exchange interface (BAT) with the batteries (B) being connected to each other to form interconnected heat transfer fluid circuits (X, YZ). (See abbreviated figure, Figure 4.)

Description

Title of the invention: Thermal management device for modular platform of an electric motor vehicle chassis

[0001] The present invention relates to the field of thermal management devices for electric vehicles and more particularly to thermal management devices for a modular platform of an electric motor vehicle chassis.

[0002] In the automotive sector, and particularly in the field of electric vehicles, modular chassis platforms for electric vehicles are sometimes used for reasons of standardization and economies of scale. Such modular platforms include, in particular, the batteries, the electric powertrain, and the chassis components, including the wheels, braking system, and suspension. The electric powertrain of the vehicle refers more specifically to the power unit and the electric motor(s). Such a modular platform is used to create a single platform that integrates most of the propulsion, power supply, and electrical storage components, onto which various passenger compartments and bodywork are installed, corresponding to different vehicle models.

[0003] However, in order to improve the electric vehicle's range, a large portion of the space within this modular platform is reserved for the batteries. This leaves little room for integrating a thermal management system that would allow for the thermal management of both the batteries and the passenger compartment. Conventional thermal management systems are generally bulky and require significant space to be integrated into a motor vehicle. These thermal management systems are therefore not well suited for integration within such a modular platform.

[0004] One of the aims of the present invention is therefore to remedy at least partially the disadvantages of the prior art and to propose an improved thermal management device that can be integrated within such a modular platform.

[0005] The present invention therefore relates to a thermal management device for a modular platform of an electric motor vehicle chassis, said modular platform comprising the batteries and the electric powertrain of the electric motor vehicle, the thermal management device comprising: - a first module, comprising a compressor, a first expansion device and a multi-fluid heat exchanger of a first heat transfer fluid circuit within which a first heat transfer fluid is intended, said first module being intended to be integrated within the modular platform, - a cooling module comprising at least one first heat exchanger intended to be traversed by the external airflow, said cooling module being intended to be integrated within the modular platform, - a heating, ventilation and air conditioning system intended to be traversed by an internal airflow destined for a passenger compartment, said heating, ventilation and air conditioning system comprising a chiller, intended to cool the internal airflow, a second heat exchanger, intended to heat the internal airflow, and a ventilation means configured to generate said internal airflow, - a second module comprising at least a first pump of a second heat transfer fluid circuit in which a second heat transfer fluid is intended, and - a heat exchange interface with the batteries, the various modules, the cooling module, the heating, ventilation and air conditioning system and the heat exchange interface with the batteries being connected to each other so as to form interconnected heat transfer fluid circuits.

[0006] According to one aspect of the invention, the heating, ventilation and air conditioning device is intended to be disposed outside the modular platform, said thermal management device comprising a connection interface intended to allow the fluidic connection of the heating, ventilation and air conditioning device to the first and / or second heat transfer fluid circuit.

[0007] According to another aspect of the invention, the first module further comprises a first heat exchanger acting as a condenser for the first heat transfer fluid circuit, the first heat exchanger of the cooling module being the first heat exchanger of the second heat transfer fluid circuit the second module comprising a second pump of the second heat transfer fluid circuit supplying the first heat exchanger of the first module acting as a condenser of the first heat transfer fluid circuit.

[0008] According to another aspect of the invention, the second module is arranged side by side with the first module, said first module and second module being intended to be arranged within the modular platform.

[0009] According to another aspect of the invention, the second module is offset from the first module, said second module being intended to be disposed outside the modular platform between the connection interface and the heating, ventilation and air conditioning device.

[0010] According to another aspect of the invention, the cooler of the heating, ventilation and air conditioning device is a cooler of the second fluid circuit ca- carrier.

[0011] According to another aspect of the invention, the cooler of the heating, ventilation and air conditioning device is an evaporator of the first heat transfer fluid circuit.

[0012] According to another aspect of the invention, the second heat exchanger of the heating, ventilation and air conditioning device is a second heat exchanger of the second heat transfer fluid circuit.

[0013] According to another aspect of the invention, the first heat exchanger of the cooling module is a first heat exchanger of the first heat transfer fluid circuit.

[0014] According to another aspect of the invention, the second module is arranged side by side with the first module, said first module and second module being intended to be arranged within the modular platform.

[0015] According to another aspect of the invention, the second heat exchanger of the heating, ventilation and air conditioning device is an internal condenser of the first heat transfer fluid circuit.

[0016] According to another aspect of the invention, the first heat transfer fluid circuit comprises an expansion valve disposed upstream of the first heat exchanger of the cooling module and flow management devices for the first heat transfer fluid, said expansion valve and said management devices being grouped within the same circulation and management block for the first heat transfer fluid.

[0017] The present invention also relates to a modular platform of an electric motor vehicle chassis, said modular platform comprising the batteries as well as the electric power train of the electric motor vehicle, said modular platform comprising a thermal management device as described above.

[0018] Other features and advantages of the present invention will become more apparent upon reading the following description, provided by way of illustration and not limitation, and the accompanying drawings in which:

[0019] [Fig-1] The [Fig.1] is a schematic representation in semi-transparency of a modular platform according to a first embodiment,

[0020] [Fig.2] [Fig.2] is a schematic perspective representation of a module of cooling,

[0021] [Fig.3] [Fig.3] is a schematic perspective representation of a device heating, ventilation and air conditioning,

[0022] [Fig.4] [Fig.4] is a schematic representation of a management device thermal according to a first variant of a first embodiment,

[0023] [Fig.5] [Fig.5] is a schematic representation of a management device thermal according to a second variant of the first embodiment,

[0024] [Fig.6] The [Fig.6] is a schematic semi-transparent representation of a modular platform according to a second embodiment,

[0025] [Fig.7] [Fig.7] is a schematic representation of a thermal management device according to a second embodiment,

[0026] [Fig.8] [Fig.8] is a schematic representation of a thermal management device according to a variant of [Fig.4],

[0027] [Fig.9] [Fig.9] is a schematic representation of a thermal management device according to a variant of [Fig.7].

[0028] In the different figures, the identical elements bear the same reference numbers.

[0029] The following embodiments are examples. Although the description refers to one or more embodiments, this does not necessarily mean that each reference relates to the same embodiment, or that the features apply only to a single embodiment. Simple features from different embodiments can also be combined and / or interchanged to provide other embodiments.

[0030] In this description, certain elements or parameters can be indexed, such as first element or second element, first parameter and second parameter, first criterion and second criterion, etc. In this case, it is simply a matter of indexing to differentiate and name similar but not identical elements, parameters, or criteria. This indexing does not imply any priority of one element, parameter, or criterion over another, and such designations can easily be interchanged without departing from the scope of this description. Nor does this indexing imply any order in time, for example, for evaluating one criterion or another.

[0031] In this description, "placed upstream" means that an element is positioned before another with respect to the direction of fluid flow. Conversely, "placed downstream" means that an element is positioned after another with respect to the direction of fluid flow.

[0032] Figure 1 shows a modular chassis platform A for an electric motor vehicle. This modular platform A includes, in particular, the batteries B, the electric powertrain, and the vehicle's chassis components, such as the wheels, braking system, and suspension. The electric powertrain of the motor vehicle refers more specifically to the power supply and the electric motor(s) of the motor vehicle. Such a modular platform A is used, in particular, to provide a platform on which various passenger compartments and bodywork can be installed.

[0033] To enable thermal management of the batteries B and the passenger compartment, the modular platform A includes a thermal management device comprising at least two heat transfer fluid circuits X, Y (visible in Figures 4, 5 and 7 to 9). The thermal management device more specifically comprises various modules fluidically connected to each other to form the different heat transfer fluid circuits X, Y.

[0034] The thermal management system thus comprises a first module ML. This first module ML includes, in particular, a compressor 41, a first expansion device 43, and a multi-fluid heat exchanger 1 of a first heat transfer fluid circuit X (see [Fig. 4]). The first heat transfer fluid circuit X will be described in more detail later in this description. The first module ML is specifically designed to be integrated within the modular platform A. The components of the first module ML can be grouped together, for example, within a housing, in order to minimize their size within the modular platform A.

[0035] The thermal management device also includes a cooling module C intended to be traversed by an external airflow 500. The cooling module C includes in particular at least one first heat exchanger 62, 42' (see [Fig.2]) also intended to be traversed by the external airflow 500. This cooling module C is intended to be integrated within the modular platform A, preferably in the front part of the modular platform.

[0036] An example of such a cooling module C is illustrated in particular in [Fig. 2]. The cooling module C may thus comprise a heat exchanger 62, 42' and a first manifold housing C41 attached to said heat exchanger 62, 42'. The first manifold housing C41 preferably forms a volute with a first open end C41a positioned opposite the heat exchanger 62, 42' and a second open end C41b at the opposite end of the volute.

[0037] The cooling module C may also include at least one tangential fan, also called a tangential turbomachine C30, configured to generate the external airflow 500, for example, when the motor vehicle is stopped or when it is at low speed. The tangential turbomachine C30 includes a rotor or turbine (or tangential propeller) C28. The turbine C28 has a substantially cylindrical shape. The turbine C28 advantageously has several stages of blades (or vanes). The turbine C28 is mounted to rotate about an axis of rotation Cy, for example, parallel to the plane formed by the heat exchanger 62, 42' and extending across its width. The turbine C28 is more particularly arranged within the volute formed by the first collector housing. The tangential turbomachine C30 is thus compact. The use of such a tangential turbomachine C30 allows, in particular, that the flow external air 500 is equal over the entire width of at least one heat exchanger 62, 42'. In addition, such a tangential turbomachine C30 allows a space saving compared to conventional fans.

[0038] The tangential turbomachine C30 may also include a motor C31 configured to rotate the turbine. The motor C31 is, for example, adapted to drive the turbine in rotation at a speed between 200 rpm and 14,000 rpm. Such rotational speeds notably help to limit the noise generated by the tangential turbomachine C30.

[0039] In the example illustrated in [Fig. 2], the tangential turbomachine C30 is configured to operate in suction mode, i.e., it draws in ambient air so that it passes through the heat exchanger 62, 42 and is discharged through the second open end C41b of the volute. Alternatively, the tangential turbomachine C30 can operate in discharge mode, i.e., blowing air from the second open end C41b of the volute towards the heat exchanger 62, 42'.

[0040] The cooling module C may also include a second manifold housing (not shown) attached to the heat exchanger 62, 42' on its face opposite to that of the first manifold housing C41. This second manifold housing may have an opening to allow the passage of the external airflow 500. This opening may include a shutter device (not shown) movable between a first position, referred to as open, and a second position, referred to as closed. This shutter device is configured, in particular, to allow the external airflow 500 to pass through said opening in its open position and to close said opening in its closed position. The shutter device may take various forms, such as, for example, a plurality of hinged flaps mounted between an open position and a closed position.These flaps are preferably mounted parallel to the width of the cooling module C. However, other configurations are entirely possible, such as flaps mounted parallel to the height of the cooling module. The flaps can be flag-type, but other types, such as butterfly flaps, are also perfectly feasible.

[0041] The thermal management device also includes a heating, ventilation, and air conditioning device D intended to be traversed by an internal airflow 400 destined for a passenger compartment. Such a heating, ventilation, and air conditioning device D is illustrated in [Fig. 3]. The heating, ventilation, and air conditioning device D includes, in particular, within a housing, a cooler 66, 46, intended to cool the internal airflow 400, a second heat exchanger 65, intended to heat the internal airflow 400, and a ventilation means DI configured to generate the internal airflow 400.

[0042] The heating, ventilation and air conditioning system D can in particular be located outside the modular platform A, for example within a cabin installed on said modular platform A. In this case, the thermal management system includes a connection interface I intended to allow the fluid connection of the heating, ventilation and air conditioning system D to heat transfer fluid circuits X, Y and to the elements of the thermal management system located within the modular platform A.

[0043] Figures 4 to 5 and 7 to 9 show different architectures of heat transfer fluid circuits X, Y, Z.

[0044] Figures 4 to 5 and 7 show various examples of thermal management devices comprising three circulation circuits, each connected to a multi-fluid heat exchanger 1, here a three-fluid heat exchanger. The thermal management device thus comprises a first heat transfer fluid circuit X, a second heat transfer fluid circuit X, and a third heat transfer fluid circuit Z.

[0045] Within the first heat transfer fluid circuit X, a first heat transfer fluid, in particular a refrigerant, for example CO2, R134a or R1234y, is intended to circulate. The first heat transfer fluid circuit X more particularly comprises a main loop XI including, in the direction of refrigerant circulation, a compressor 41, a first heat exchanger 42, 42', a first expansion device 43 and the three-fluid heat exchanger 1.

[0046] Within the second heat transfer fluid circuit Y, a second heat transfer fluid, for example water or glycol water, is intended to circulate. The second heat transfer fluid circuit Y includes, in particular, a main loop Y1 comprising a first pump 61 and a first heat exchanger 62. The three-fluid heat exchanger 1 is also connected to said main loop Y1 of the second heat transfer fluid circuit Y.

[0047] In the architectures of Figures 4, 5, and 7, the heat exchange interface BAT with the batteries B is located within the third heat transfer fluid circuit Z, in which a third heat transfer fluid, in particular a dielectric fluid, is intended to circulate. This third heat transfer fluid circuit Z is connected to the three-fluid heat exchanger 1, and the heat exchange interface BAT is a container in which the batteries are at least partially immersed and / or subjected to vaporization of the dielectric fluid. The third heat transfer fluid circuit Z may also include a pump (not shown) to circulate the dielectric fluid within the heat exchange interface BAT and the circuit itself. This pump may, in particular, be integrated directly into the heat exchange interface BAT to save space.

[0048] The three-fluid heat exchanger 1 is more particularly configured for This allows for heat exchange between the second and third heat transfer fluids and the first heat transfer fluid. The use of such a three-fluid heat exchanger 1 enables, within a single heat exchanger, heat exchange both between the first and second heat transfer fluids and between the first and third heat transfer fluids. Thus, it is possible to thermally couple three separate circulation circuits with three different types of heat transfer fluids using a single heat exchanger.Combining these heat exchanges within a single three-fluid heat exchanger 1 also saves space within the vehicle compared to a thermal management system with three circulation circuits, with a first heat exchanger dedicated to heat exchange between the first and second heat transfer fluids and a second heat exchanger dedicated to heat exchange between the first and third heat transfer fluids.

[0049] According to a first embodiment illustrated in Figures 4 and 5, the first heat exchanger 42 of the first heat transfer fluid circuit X can be a condenser configured to allow heat exchange between the first heat transfer fluid of the first heat transfer fluid circuit X and the second heat transfer fluid of the second heat transfer fluid circuit Y. The first heat exchanger 42 is then integrated within the first module ML. Also according to this first embodiment, the first heat exchanger 62 of the second heat transfer fluid circuit Y can be a radiator intended to be traversed by an external airflow 500. The first heat exchanger 62 is then integrated within the cooling module C.

[0050] In this first embodiment, the second heat transfer fluid circuit Y is configured to allow the absorption of heat from the first heat transfer fluid circuit X via the first heat exchanger 42 of the first heat transfer fluid circuit X. The second heat transfer fluid circuit Y is also configured to allow the release of said heat into the external airflow 500 via the first heat exchanger 62 of the second heat transfer fluid circuit Y and / or into an internal airflow 400 destined for the passenger compartment of the motor vehicle. In order to allow this heat release into the internal airflow 400, the second heat transfer fluid circuit Y includes the second heat exchanger 65 intended to be traversed by the internal airflow 400. This second heat exchanger 65 is notably integrated within the heating, ventilation, and air conditioning system D.

[0051] According to the first embodiment illustrated in Figures 4 and 5, the second heat transfer fluid circuit Y comprises a first branch Y2 connected to the main loop Y1 in parallel with the first heat exchanger 62 of said second heat transfer fluid circuit Y. More specifically, the first Branch branch Y2 connects a first connection point 81 to a second connection point 82. The first connection point 81 is located on the main loop Y1 downstream of the first heat exchanger 62, between said first heat exchanger 62 and the first pump 61. The second connection point 82 is located on the main loop Y1 upstream of the first heat exchanger 62, between the three-fluid heat exchanger 1 and said first heat exchanger 62. Said first branch branch Y2 may include, in particular, a second pump 63 as well as the first heat exchanger 42 of the first heat transfer fluid circuit X. This second pump 63 is more specifically integrated into the second module M2.

[0052] The first branch Y2 may also include an electric heater 64 for the second heat transfer fluid located downstream of the first heat exchanger 42 of the first heat transfer fluid circuit X. This electric heater 64 may itself be integrated within the first module ML

[0053] According to the first embodiment illustrated in Figures 4 and 5, the second heat transfer fluid circuit Y comprises a second branch Y3 connected to the first branch Y2 in parallel with the first heat exchanger 42 of the first heat transfer fluid circuit X and the second pump 63. More specifically, this second branch Y3 connects a third connection point 83 to a fourth connection point 84. The third connection point 83 is located on the first branch Y2 downstream of the first heat exchanger 42 of the first heat transfer fluid circuit X and the second pump 63, upstream of the second connection point 82.The fourth connection point 84 is located on the first branch Y2 upstream of the first heat exchanger 42 of the first heat transfer fluid circuit X and of the second pump 63, downstream of the first connection point 81. The second branch Y3 includes the second heat exchanger 65 of the second heat transfer fluid circuit Y.

[0054] In order to control the flow of the second heat transfer fluid, the second heat transfer fluid circuit Y may include redirection means such as three-way valves arranged for example: - on the second connection point 82 so as to redirect the second heat transfer fluid from the three-fluid heat exchanger 1 towards the first heat exchanger 62 or the second heat exchanger 62 or so as to redirect the second heat transfer fluid from the third connection point 83 towards the first heat exchanger 62, - on the third connection point 83 so as to redirect the second heat transfer fluid from the second connection point 82 towards the second heat exchanger heat 65 or so as to redirect the second heat transfer fluid from the first heat exchanger 42 of the first heat transfer fluid circuit X to the second connection point 82 or to the second heat exchanger 65, - on the third connection point 83 so as to redirect the second heat transfer fluid from the first heat exchanger 62 or the second heat transfer fluid from the second heat exchanger 65 to the first heat exchanger 42 of the first heat transfer fluid circuit X. Other means of redirection such as shut-off valves can also be considered.

[0055] The means for redirecting the second heat transfer fluid from the second 82 and third 83 connection points can advantageously be arranged within the cooling module C, for example respectively at the inlet and outlet of the second heat transfer fluid from the first heat exchanger 62. The means for redirecting the second heat transfer fluid from the fourth connection point 84 can, for its part, be arranged within the first module ML

[0056] According to a first variant of the first embodiment illustrated in [Fig. 4], the second heat transfer fluid circuit Y may further include a third branch Y4 connected to the main loop Y1 in parallel with the first pump 61 and the three-fluid heat exchanger 1. More specifically, this third branch Y4 connects a fifth connection point 85 to a sixth connection point 86. The fifth connection point 85 is located on the main loop Y1 downstream of the three-fluid heat exchanger 1 and the first pump 61 and upstream of the second connection point 82. The sixth connection point 86 is located on the main loop Y1 upstream of the three-fluid heat exchanger 1 and the first pump 61 and downstream of the first connection point 81.The third branch Y4 includes a cooler 66 intended to be traversed by the internal airflow 400 destined for the passenger compartment. This cooler 66 is notably integrated within a heating, ventilation and air conditioning system D, preferably upstream of the second heat exchanger 65 in the direction of circulation of the internal airflow.

[0057] In order to control the second refrigerant, the second heat transfer fluid circuit Y may include three-way valves arranged respectively: - on the sixth connection point 86 to redirect the second heat transfer fluid from the first heat exchanger 62 or from the cooler 66 to the three-fluid heat exchanger 1, - on the fifth connection point 85 to redirect the second heat transfer fluid from the three-fluid heat exchanger 1 to the cooler 66 or to the second connection point 82. Other redirection methods, such as shut-off valves, can also be considered. The means for redirecting the second heat transfer fluid from the fifth (85) and sixth (86) connection points can, in particular, be located within the first module (Ml).

[0058] According to this first variant, the first heat transfer fluid circuit X can also include a desiccant bottle 44 located downstream of the first heat exchanger 42. This desiccant bottle 44 can in particular be attached to the outlet of the first heat transfer fluid of the first heat exchanger 42. This desiccant bottle 44 is thus integrated into the first module Ml.

[0059] According to a second variant of the first embodiment illustrated in [Fig. 5], the second heat transfer fluid circuit Y does not include a third branch Y4 with a cooler 66. In this second variant, the first heat transfer fluid circuit X includes a first branch X2 connected to the main loop XI in parallel with the first expansion device 43 and the three-fluid heat exchanger 1. This first branch XI of the first heat transfer fluid circuit X connects, more specifically, a first connection point 91 to a second connection point 92. The first connection point 91 is located on the main loop XI upstream of the first expansion device 43, between the first heat exchanger 42 of the first heat transfer fluid circuit X and said first expansion device 43.The second connection point 92 is located on the main loop XI downstream of the three-fluid heat exchanger 1, between said three-fluid heat exchanger 1 and the compressor 4L. This first branch X2 includes a second expansion device 45 and an evaporator 46 intended to carry an internal airflow 400 destined for the passenger compartment. This evaporator 46 and the second expansion device 45 are integrated within a heating, ventilation, and air conditioning system D. Preferably, the evaporator 46 is located upstream of the second heat exchanger 65 in the direction of the internal airflow 400.

[0060] In order to control the first heat transfer fluid and allow or prevent it from passing through the first branch X2, the first 43 and second 45 pressure-reducing devices can be electronic expansion valves with a shut-off function. Other redirection means such as shut-off valves or three-way valves can also be considered.

[0061] According to this second variant, the first heat transfer fluid circuit X may also include an accumulator 44' located upstream of the compressor 4L. This accumulator 44' may, in particular, be located more specifically downstream of the second connection point 92. This accumulator 44' is thus integrated into the first module ML

[0062] According to this first embodiment, the second module M2 can be arranged side by side with the first module M1 within the modular platform A, as illustrated in [Fig. 1]. According to a variant, illustrated in particular in [Fig. 6], the second module M2 is offset from the first module M1. The second module M2 can then be intended to be arranged outside the modular platform A between the connection interface I and the heating, ventilation and air conditioning unit D, for example within a passenger compartment mounted on the modular platform A.

[0063] Figure 7 shows a thermal management device according to a second embodiment. In this second embodiment, the first heat exchanger 42' of the first heat transfer fluid circuit X is designed to be traversed by the external airflow 500. The first heat exchanger 62 of the second heat transfer fluid circuit Y is, for its part, a heat exchange interface with an electrical power train of the motor vehicle. By electrical power train of the motor vehicle, we mean more precisely the electrical power supply as well as the electric motor(s) of the motor vehicle. The second module M2 here comprises a single pump, the first pump 61, and is preferably arranged side by side with the first module M1 within the modular platform A.

[0064] In this second embodiment, the first heat transfer fluid circuit X is reversible. It thus comprises an internal condenser 47 and a third expansion device 48 located upstream of the first heat exchanger 42. The internal condenser 47 is located within the heating, ventilation, and air conditioning unit D. The third expansion device 48 can be located in the cooling module C. By reversible, it is understood more specifically that the first heat transfer fluid circuit X is configured to operate in at least one cooling mode and one heat pump mode.

[0065] The first heat transfer fluid circuit X may also include a first branch branch X2 connected to the main loop XI in parallel with the first expansion device 43 and the three-fluid heat exchanger 1. This first branch branch XI of the first heat transfer fluid circuit X connects, more specifically, a first connection point 91 to a second connection point 92. The first connection point 91 is located on the main loop XI upstream of the first expansion device 43, between the first heat exchanger 42 of the first heat transfer fluid circuit X and said first expansion device 43.The second connection point 92 is located on the main loop XI downstream of the three-fluid heat exchanger 1, between said three-fluid heat exchanger 1 and the compressor 4L. This first branch X2 includes a second expansion device 45 and an evaporator 46 intended to be traversed by an internal airflow 400 destined for the passenger compartment. This evaporator 46 as well as the . The second expansion device 45 is integrated within the heating, ventilation and air conditioning device D. Preferably, the evaporator 46 is arranged upstream of the internal condenser 47 in the direction of circulation of the internal airflow 400.

[0066] When the internal condenser 47 is designed to be traversed by the internal airflow 400, as in the example in [Fig. 7], this is referred to as a direct heat pump. The internal condenser 47 directly heats the internal airflow 400. However, it is entirely possible to imagine a case (not shown) in which the internal condenser 47 is not directly traversed by the internal airflow 400 but is connected to an auxiliary thermal management circuit to exchange heat with another heat transfer fluid. This auxiliary thermal management circuit includes a heat exchanger designed to be traversed by the internal airflow 400. This is then referred to as an indirect heat pump. The internal condenser 47 indirectly heats the internal airflow 400.

[0067] According to the example illustrated in [Fig.7], the internal condenser 47 is more particularly arranged on the main branch XI of the first heat transfer fluid circuit X downstream of the compressor 41, between said compressor 41 and the third expansion device 48. The first heat transfer fluid circuit X further comprises a second X3 and a third branch X4.

[0068] The second branch X3 is connected to the main loop XI so as to link the outlet of the first heat transfer fluid from the first heat exchanger 42 to the inlet of the first heat transfer fluid from the compressor 4L. More specifically, this second branch connects a third connection point 93 to a fourth connection point 94. The third connection point is located on the main loop XI downstream of the first heat exchanger 42, between said first heat exchanger 42 and the first expansion device 43. The fourth connection point 94 is located on the main loop XI upstream of the compressor 41, between the second connection point 92 and said compressor 4L. This second branch X3 may, in particular, include a first shut-off valve 51 to allow or prevent the first heat transfer fluid from the first heat exchanger 42 from passing through it.

[0069] The third branch X4 is connected to the main loop XI so as to bypass the third expansion device 48 and the first heat exchanger 42. More specifically, the third branch X4 connects a fifth connection point 95 to a sixth connection point 96. The fifth connection point 95 is located on the main branch XI upstream of the third expansion device 48, between the internal condenser 47 and said third expansion device 48. The sixth connection point 96 is located on the main loop XI downstream of the third connection point 93, between the third connection point 93 and the first connection point 91. This third branch of Bypass X4 may include a second shut-off valve 52 to allow or prevent the first heat transfer fluid from the internal condenser 47 from passing through it.

[0070] The first heat transfer fluid circuit X may also include a non-return valve 53 disposed on the main branch XI between the third connection point 93 and the sixth connection point 96 so as to prevent the reflux of the first heat transfer fluid from the third branch X4 to the first heat exchanger 42 or to the second branch X3.

[0071] The first 51 and second shut-off valves 52, as well as the non-return valve 53, are more specifically devices for managing the flow of the first heat transfer fluid. The expansion valve 48 and these management devices can, in particular, be grouped within a single hydraulic block for circulating and managing the first heat transfer fluid. This hydraulic management block thus combines various functions for managing the flow of the first heat transfer fluid and can be located, for example, on the side of the cooling module C.

[0072] The first heat transfer fluid circuit X may also include a fourth pressure equalization expansion device 48 located on the first branch of the bypass X2 downstream of the evaporator 46. This fourth expansion device 49 may in particular be located within the heating, ventilation and air conditioning system D.

[0073] According to the second embodiment of [Fig. 7], the first heat transfer fluid circuit X may also include an accumulator 44' located upstream of the compressor 4L. This accumulator 44' may, in particular, be located more specifically downstream of the second connection point 92. This accumulator 44' is thus integrated into the first module ML

[0074] Whether in variants of the first embodiment or in the second embodiment, the thermal management device may also include an electric heater 67 disposed in the internal airflow 400 to the passenger compartment to assist in its heating. This electric heater 67 may be integrated within the heating, ventilation and air conditioning system D, preferably as far downstream as possible in the direction of internal airflow relative to the other heat exchangers of said heating, ventilation and air conditioning system D.

[0075] Figures 8 and 9 show another embodiment in which the heat exchange interface BAT is, for example, a cold plate connected to the second heat transfer fluid circuit X. More specifically, the heat exchange interface BAT is arranged within a fourth branch Y5 of the second heat transfer fluid circuit Y connected in parallel with the first heat exchanger 62 of the second heat transfer fluid circuit Y. The multi-fluid heat exchanger 1 is therefore no longer tri-fluid but simply bi-fluid.

[0076] In the example of [Fig. 8], which is a variant of [Fig. 4], the fourth branch Y5 connects a seventh connection point 87 to an eighth connection point 88. The seventh connection point 87 is located downstream of the multi-fluid heat exchanger 1, which here coincides with the fifth connection point 85. The eighth connection point 88 is located downstream of the first heat exchanger 62, here on the third branch Y4, downstream of the cooler 66. The flow of the second heat transfer fluid is redirected to the fourth branch Y5 by a redirection means, here a four-way valve located on the fifth 85 and seventh 87 connection points. Other redirection means can also be used, such as a set of shut-off valves. This redirection means can, in particular, be integrated within the first ML module.

[0077] In the example of [Fig. 9], which is a variant of [Fig. 7], the fourth branch Y5 connects a seventh connection point 87 to an eighth connection point 88. The seventh connection point 87 is located downstream of the first pump 61, between said first pump and the first heat exchanger 62. The eighth connection point 88 is located downstream of the first heat exchanger 62, between the first heat exchanger 62 and the multi-fluid heat exchanger 1. The flow of the second heat transfer fluid is redirected to the fourth branch Y5 by a redirection means, here a three-way valve located at the seventh connection point 87. Other redirection means can also be used, such as a set of shut-off valves. This redirection means can, in particular, be integrated within the second module M2.

[0078] Thus, it is clear that the use of a first module M1, a second module M2, a cooling module C, and a heating, ventilation, and air conditioning (HVAC) unit D allows for a compact thermal management system that can be easily integrated into the modular platform A. Furthermore, the integration of several components of the first heat transfer fluid circuit X within the first module M1, and the integration of other components of the second heat transfer fluid circuit Y within the second module M2, facilitates the installation of the thermal management system within the modular platform. Indeed, these modules M1, M2, and the cooling module C can be installed and directly connected to one another to form, at least in part, the thermal management system.

Claims

Claims

1. Thermal management device for a modular platform (A) of an electric motor vehicle chassis, said modular platform (A) comprising the batteries (B) as well as the electric power train of the electric motor vehicle, characterized in that the thermal management device comprises: - a first module (Ml), comprising a compressor (41), a first expansion device (43) and a multi-fluid heat exchanger (1) of a first heat transfer fluid circuit (X) within which a first heat transfer fluid is intended, said first module (Ml) being intended to be integrated within the modular platform (A), - a cooling module (C) intended to be integrated within the modular platform (A) and comprising at least a first heat exchanger (62, 42') intended to be crossed by the external air flow (500) and a first collector housing (C41) attached to said heat exchanger (62, 42'), said first collector (C41) forming a volute with a first open end (C41a) arranged opposite the exchanger (62, 42') and a second open end (C41b) at the opposite end of said volute, which cooling module (C) comprises at least one tangential turbomachine (C30) configured so as to generate the external air flow (500), - a heating, ventilation and air conditioning device (D) intended to be crossed by an internal air flow (400) intended for a passenger compartment, said heating, ventilation and air conditioning device (D) comprising a cooler (66, 46), intended to cool the internal air flow (400), a second heat exchanger (65, 47), intended to heat the internal air flow (400), and a ventilation means (Dl) configured to generate said internal air flow (400), - a second module (M2) comprising at least a first pump (61) of a second heat transfer fluid circuit (Y) within which a second heat transfer fluid is intended, and - a heat exchange interface (BAT) with the batteries (B), the different modules (Ml, M2), the cooling module (C), the heating, ventilation and air conditioning device (D) and the heat exchange interface (BAT) with the batteries (B) being connected to each other so as to form interconnected heat transfer fluid circuits (X, YZ).

2. Thermal management device according to the preceding claim, characterized in that the heating, ventilation and air conditioning device (D) is intended to be arranged outside the modular platform (A), said thermal management device comprising a connection interface (I) intended to allow the fluid connection of the heating, ventilation and air conditioning device (D) to the first (X) and / or second (Y) heat transfer fluid circuit.

3. Thermal management device according to any one of claims 1 to 2, characterized in that the first module (Ml) further comprises a first heat exchanger (42) acting as a condenser of the first heat transfer fluid circuit (X), the first heat exchanger (62) of the cooling module (C) being a first heat exchanger (62) of the second heat transfer fluid circuit (Y), the second module M2 comprising a second pump (63) of the second heat transfer fluid circuit (Y) supplying the first heat exchanger (42) of the first module (Ml) acting as a condenser of the first heat transfer fluid circuit (X).

4. Thermal management device according to claim 3, characterized in that the second module (M2) is arranged side by side with the first module (M1), said first module (M1) and second module (M2) being intended to be arranged within the modular platform (A).

5. Thermal management device according to claim 3, characterized in that the second module (M2) is offset relative to the first module (M1), said second module (M2) being intended to be arranged outside the modular platform (A) between the connection interface (I) and the heating, ventilation and air conditioning device (D).

6. Thermal management device according to any one of claims 3 to 5, characterized in that the cooler (66) of the heating, ventilation and air conditioning device (D) is a cooler (66) of the second heat transfer fluid circuit (Y).

7. Thermal management device according to any one of claims 3 to 5, characterized in that the cooler (46) of the heating, ventilation and air conditioning device (D) is an evaporator (46) of the first heat transfer fluid circuit (X).

8. Thermal management device according to any one of claims 3 to 7, characterized in that the second heat exchanger (65) of the heating, ventilation and air conditioning device (D) is a second heat exchanger (65) of the second heat transfer fluid circuit (Y).

9. Thermal management device according to any one of claims 1 or 2, characterized in that the first heat exchanger (42') of the cooling module (C) is a first heat exchanger (42') of the first heat transfer fluid circuit (Y).

10. Thermal management device according to claim 9, characterized in that the second module (M2) is arranged side by side with the first module (M1), said first module (M1) and second module (M2) being intended to be arranged within the modular platform (A).

11. Thermal management device according to any one of claims 9 or 10, characterized in that the second heat exchanger (47) of the heating, ventilation and air conditioning device (D) is an internal condenser (45) of the first heat transfer fluid circuit (X).

12. Thermal management device according to any one of claims 9 to 11, characterized in that the first heat transfer fluid circuit (X) comprises an expansion valve (48) arranged upstream of the first heat exchanger (42') of the cooling module (C) as well as devices for managing the flow of the first heat transfer fluid, said expansion valve (48) as well as said management devices being grouped within the same block for circulating and managing the first heat transfer fluid.

13. Modular platform (A) of an electric motor vehicle chassis, said modular platform (A) comprising the batteries (B) as well as the electric power train of the electric motor vehicle, characterized in that said modular platform (A) comprises a thermal management device according to any one of claims 1 to 12.

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