Inlay for electronic document, method of manufacturing an electronic document comprising such an inlay, and electronic document obtained

Abstract

Inlay (40) comprising a substrate (41) and a first zigzag portion (42) formed of a metal wire (421) embedded in an upper face (43) of the substrate (41), the zigzag portion (42) alternately comprising rectilinear segments (422) and detours (423), at least one of the rectilinear segments (422) of the zigzag portion (42) being arranged, at least in part, in an area (45) of the upper face (43) of the substrate (41) configured to form a counterbore of a cavity of an electronic document, and the inlay (40) comprising a connection wire (47) configured to connect together at least the rectilinear segments (422) of the first zigzag portion (42). Method for manufacturing an electronic document (1) comprising such an inlay (40) and electronic document (1). Figure for abstract: Fig. 3

Description

Title of the invention: Inlay for electronic document, method of manufacturing an electronic document comprising such an inlay, and electronic document obtained

[0001] The invention relates to an inlay, for an electronic document, which comprises at least one substrate and a zigzag metal wire embedded in an upper face of the substrate.

[0002] An “inlay” means a layer configured to be inserted into a thickness of an electronic document body.

[0003] The invention also relates to a method of manufacturing an electronic document comprising such an inlay, for example such as a card, such as a smart card, or an identity document.

[0004] More particularly, the invention relates to a method for manufacturing an electronic document comprising a body, in a thickness of which an inlay is inserted, comprising a cavity open on one face of the body, and a module inserted in the cavity.

[0005] In such a document, the body generally comprises an inlay having a wire, for example forming an antenna, two ends of which open into the cavity, and the module traditionally comprises a microprocessor and two connection terminals which are electronically connected on the one hand to the microprocessor and on the other hand to the ends of the wire.

[0006] Such an inlay comprises for example a substrate and the wire, forming for example the antenna, which is embedded in the substrate. Such an inlay is for example manufactured by extending the conductive metal wire on the substrate by means of a tool, such as a sonotrode, moving above the substrate and distributing the wire. The wire is embedded in the substrate by means of ultrasonic vibrations transmitted to the wire from the tool. The vibrations are transmitted perpendicular to the substrate to embed the wire in the thickness of the substrate. The wire is for example surrounded by an insulating sheath which is heated, for example for a very short time, to improve the adhesion of the sheath to the substrate. The tool is controlled to define the path for depositing the wire.It is thus possible to wind the wire in several turns and / or to lay it along lines of various shapes, for example a sinuous line, such as a zigzag, which alternately comprises straight segments and detours.

[0007] Within an electronic document, the inlay is interposed between at least two layers, which are therefore arranged on either side of the inlay, thus forming the body of the document. These at least two layers and the inlay are for example assembled together by rolling.

[0008] Then, the cavity is formed by machining, for example by milling; at least one of the layers is then machined, and in such a way that the ends of the wire open into a bottom of the cavity, in particular on a counterbore of the cavity, also called a step.

[0009] However, when machining the cavity, inserting the module and making the electrical connection between the module and the ends of the inlay wire, several problems may arise.

[0010] For example, if the machining is not deep enough, poor contact may be established between the ends of the wire and the module because a thickness of material, generally plastic, may remain on the wire of the inlay.

[0011] Or for example, if the machining is too deep, the machining tool, for example the milling cutter, may tear off part of the wire from the inlay. As a result, a portion of the wire may present a significant risk of being dislodged from the substrate in which it was initially embedded. When this portion of wire is dislodged, it positions itself randomly in the cavity. This creates a risk of malfunction of the electronic document. In particular, when the detached portion of wire is located in the cavity, it may come into contact with conductive portions located on an internal face of the module, such as current leads, thus creating a significant risk of short circuit. Similarly, when the portion of dislodged wire is found on a contact area with the connection terminals connected to the microprocessor, this results in excess wire thickness, and therefore a reduced contact area.

[0012] Furthermore, during mechanical testing of such an electronic document, for example torsion tests, or during the life of the electronic document, poor connectivity generally results in malfunction of the electronic document.

[0013] These problems are therefore due to various tolerances linked, for example, to the machining depth, to the thickness of the inlay wire, to the thickness of the different layers of materials constituting the electronic document, or even to the position of the inlay in the thickness of the body of the electronic document.

[0014] To reduce the risk of the wire being pulled out, the patent application published under number FR3026530 describes an electronic document in which the ends of an antenna which open into the cavity are arranged in a zigzag shape, the rectilinear segments of which are inclined by approximately 6° relative to an edge of the cavity.

[0015] Furthermore, document FR3015733 describes a document in which a contact means is made up of a wire electrically connected to one end of an antenna, and arranged so that the wire develops from the end of the antenna by drawing a loop defining consecutive lines directed alternately in opposite directions, and being further from the end of the antenna than the line preceding it and being connected to it by a detour, the contact means being made flush with the bottom of the cavity and comprising at least one first detour arranged outside the cavity. Thus, whatever the direction of arrival of a cutter, it will first machine peripheral lines furthest from the end of the antenna, thus reducing the risk of tearing off lines located near the end of the antenna.

[0016] It was also considered to optimize the machining depth, so that it is deep enough to have good contact between the connection terminals of the module and the contact pads of the inlay, for example by removing a maximum of plastic on the wires of the inlay, but also shallow enough not to tear the wires of the inlay.

[0017] An objective of the present invention is thus to at least partially mitigate the aforementioned drawbacks, which may also lead to other advantages.

[0018] For this purpose, there is proposed according to a first aspect, an inlay comprising at least one substrate and at least one first zigzag portion formed of a metal wire embedded in an upper face of the substrate.

[0019] In the context of the present description, qualifiers “first” or “second” are only indicative to distinguish elements that they qualify, but do not imply an order between them.

[0020] Said zigzag portion is arranged at least partly in an area of the upper face of the substrate configured to form a counterbore of a cavity.

[0021] A zigzag wire here designates a wire which is for example deposited by forming successive back and forths, thus forming rectilinear segments connected to each other by detours forming loops. The rectilinear segments are for example parallel to each other, and two adjacent rectilinear segments are for example connected to each other by a portion which is most often curved, for example in an arc of a circle.

[0022] A zigzag wire makes it possible in particular to cover a larger surface area to establish electrical contact with relatively little material.

[0023] The zigzag wire is for example made of copper.

[0024] Thus, here, the zigzag portion alternately comprises straight segments and detours, a detour connecting two successive straight segments.

[0025] According to an interesting characteristic of the invention, at least one of the rectilinear segments of the zigzag portion is arranged, at least in part, in an area of the upper face of the substrate configured to form a counterbore of a cavity of an electronic document.

[0026] And according to another interesting characteristic of the invention, the inlay comprises a connecting wire configured to connect together at least the rectilinear segments of the first zigzag portion.

[0027] The connecting wire is for example a wire separate from the embedded metal wire.

[0028] Such an inlay is for example configured to be used in a method as described below.

[0029] Such an inlay is thus configured to provide more reliable electrical contact between an embedded module and the wires of the inlay when they are assembled in an electronic document.

[0030] Such an arrangement improves resistance to tearing of the inlay wire during machining of the cavity.

[0031] In addition, such an arrangement of the wires also provides better resistance of the inlay, or even of the electronic document around the module during the life of the electronic document.

[0032] It is thus possible to have a reduction in the manufacturing constraints of the electronic document by reducing the impact of the different manufacturing tolerances.

[0033] In an exemplary embodiment, the connecting wire comprises a portion which intersects at least the first zigzag portion outside an area of the upper face of the substrate configured to form a deep portion of the cavity.

[0034] The area of the upper face of the substrate configured to form the deep part of the cavity is for example surrounded by the area of the upper face of the substrate configured to form the counterbore of the cavity.

[0035] In an exemplary embodiment, the connecting wire comprises a portion which intersects at least the first zigzag portion in an area of the upper face of the substrate configured to be outside the cavity.

[0036] This is for example an area of the substrate configured to remain covered by at least one layer when the inlay is assembled between layers to form an electronic document body.

[0037] In an exemplary embodiment, the connecting wire comprises at least one part arranged next to the first zigzag portion.

[0038] For example, the portion of the connecting wire, which is arranged next to the first zigzag portion, comprises at least one end arranged in the area of the upper face of the substrate configured to form the deep portion of the cavity.

[0039] This part is thus configured to be cut during the machining of the cavity.

[0040] In an exemplary embodiment, at least one of the rectilinear segments of the first zigzag portion forms an angle of between 80° and 100° relative to a boundary between the area of the upper face of the substrate configured to form the counterbore of the cavity and the area of the upper face of the substrate configured to form the deep part of the cavity.

[0041] In an exemplary embodiment, at least one of the rectilinear segments of the first zigzag portion comprises at least one end, called the first end, which extends into the area of the upper face of the substrate configured to be in outside the cavity.

[0042] In an exemplary embodiment, at least one of the rectilinear segments of the first zigzag portion comprises an end, called the second end, which extends into the area of the upper face of the substrate configured to form the deep part of the cavity.

[0043] In an exemplary embodiment, the inlay further comprises at least one second zigzag portion, formed of metal wire, arranged, at least in part, in the area of the upper face of the substrate configured to form the counterbore of the cavity.

[0044] The second zigzag portion comprises, for example, all or part of the characteristics of the first zigzag portion described previously.

[0045] The first zigzag portion and at least the second zigzag portion may be formed from the same metal wire, or each from a separate metal wire.

[0046] In other words, in an exemplary embodiment, the inlay comprises a metal wire comprising at least the first zigzag portion and the second zigzag portion.

[0047] For example, the metal wire of the inlay is then configured to produce all the connections of an electronic document on its own; i.e. a single metal wire can, for example, comprise all the zigzag portions of the inlay.

[0048] In another exemplary embodiment, the inlay comprises at least two metal wires, each of the at least two metal wires comprising at least one zigzag portion, or even a single zigzag portion.

[0049] In an exemplary embodiment, the connecting wire is further configured to connect together at least the first zigzag portion and the second zigzag portion.

[0050] Thus, a single test can verify all connections.

[0051] Also provided, according to another aspect, is a method of manufacturing an electronic document comprising: - A step of providing a body of the electronic document, the body comprising at least: • an inlay, as described above; and • at least one upper layer which covers the upper face of the inlay substrate, and a lower layer, the inlay substrate being disposed between the upper layer and the lower layer; - A step of forming a cavity in the body, comprising at least one step of machining at least the upper layer of the body by means of a machining tool, in which the machining tool has a cutting direction forming an angle of between 80° and 100° relative to a rectilinear segment of the zigzag portion.

[0052] To limit the risk of the wire being torn from the inlay, it is preferable for the machining tool, for example a milling cutter, to possibly encounter a wire depending on its width, that is, its diameter. In this case, a cut may occur.

[0053] An angle formed between the wire and the tool preferably remains within a value range to limit a risk of the wire being pulled out.

[0054] Thanks to the presence of the connecting wire, the number of cut(s) is not important, the zigzag portions being connected to each other by this connecting wire.

[0055] Thus, according to an example of implementation of the method, the angle between the tool and a rectilinear segment of a zigzag portion is approximately 90 degrees, + / -10°.

[0056] In an exemplary implementation, the step of forming the cavity in the body comprises a step of forming a deep portion of the cavity in which the area of the upper face of the substrate configured to form the deep portion of the cavity is machined.

[0057] According to one example, the second end of at least one of the rectilinear segments of the first zigzag portion is then cut by the machining tool.

[0058] According to another example, the end of the part of the connecting wire, which is arranged next to the first zigzag portion, is then cut by the machining tool.

[0059] In parallel, the straight segments that have been cut remain connected by the connection wire. It is thus possible to increase the contact surface between the zigzag portion of the inlay and a connection terminal of a module that will be inserted into the cavity according to the different tolerances.

[0060] In an exemplary embodiment, the rectilinear segments of the zigzag portion are arranged orthogonally to an edge between the counterbore and the deep part of the cavity, i.e. forming an angle of between 80° and 100° relative to the edge (i.e. 90° + / -10°).

[0061] Also provided, according to another aspect, is an electronic document comprising: - A body, which includes: - a cavity dug in a part of a thickness of the body, the cavity comprising a deep central part and a peripheral part formed by a counterbore, less deep than the deep part, and surrounding the deep part, and - an inlay comprising at least a first zigzag portion, forming a connection area, exposed on the counterbore, and comprising at least one connection wire connecting together the rectilinear segments of the first zigzag portion, - A module, inserted into the cavity, and comprising at least one connection terminal in electrical contact with the first zigzag portion of the inlay.

[0062] Such an electronic document is for example a card, for example a smart card, with and / or without contact (for example a dual card).

[0063] The body of the electronic document is for example compliant with the standards in force, in particular ISO 7810 and ISO 7816.

[0064] According to the ISO 7816 standard, the body can have several formats, also standardized. Four standardized formats, known under the following designations (see in particular the ETSI TS 102 221 standard and the ISO 7816 standard), are mainly used: - ID-1 having a length of 85.6 mm, a width of 54 mm, and a thickness of 0.76 mm; this format is sometimes referred to as 1FF (for “first form factor”); - ID-000 (also called UICC Plug-in, or GSM SIM card) having a length 25 mm, a width of 15 mm, and the same thickness of 0.76 mm; this format is sometimes referred to as 2FF (for “second form factor”); - Mini-UICC (sometimes also called SIM card), with a length of 15 mm, a width of 12 mm and the same thickness of 0.76 mm; this format is sometimes referred to as 3FF (for “third form factor”); - A fourth, even smaller format, called nano-SIM or 4FF (for “fourth form factor”), the body then measuring 12.3 mm x 8.8 mm x 0.67 mm.

[0065] The notions of length and width are defined here with reference to the orientation of the microcircuit.

[0066] The tolerances of all the bodies described here are of the order of 0.1 mm, or even 0.05 mm.

[0067] In an exemplary embodiment, the cavity has an apparent surface with dimensions approximately equal to 13.2 mm * 12 mm (+ / - 0.05 mm) for a cavity for receiving a secure element, for example a secure element configured to implement a payment transaction according to the EMV standard (“Europay, MasterCard and Visa, for example in its version 4.3”), or 16.3 mm x 16.3 mm (+ / - 0.05 mm) for a cavity configured to receive a biometric sensor. Any other cavity dimensions may also be suitable.

[0068] The electronic document module comprises, for example, at least one support, also called a carrier film, or, depending on the case, an insulating substrate, or sticker, or flexible plate.

[0069] The film comprises a face, called the external face, because it is intended to be accessible from the outside of the electronic document equipped with this module, and a face, called the internal face, opposite the external face, and intended to be oriented towards the inside of the cavity provided in the body to receive the module.

[0070] The external face of the module comprises, for example, an external interface.

[0071] The external interface comprises, for example, external contact interfaces according to a well-defined configuration, for example by the ISO 7816 standard.

[0072] The external interface may also include a sensor, such as a biometric sensor.

[0073] The internal face carries, for example, connection terminals electrically connected to at least part of the external interface of the external face.

[0074] Furthermore, at least one connection terminal is configured to be in contact with a zigzag portion, forming a connection pad, of the inlay of the electronic document body.

[0075] The module also generally includes a microprocessor, fixed on the internal face of the support.

[0076] The module is for example compliant with the ISO 7816 standard.

[0077] Thus, when the module is inserted into the cavity, while the connection terminals are in contact on the counterbore, the microprocessor is located in the deep part of the cavity.

[0078] The invention, according to an exemplary embodiment, will be well understood and its advantages will appear better on reading the detailed description which follows, given for information purposes and in no way limiting, with reference to the appended drawings in which:

[0079] [Fig.l] [Fig.l] schematically represents a traditional electronic document;

[0080] [Fig.2] [Fig.2] schematizes a movement of a machining tool relative to a portion of wire in different configurations;

[0081] [Fig.3] [Fig.3] shows a first example of embodiment of the invention;

[0082] [Fig.4] [Fig.4] shows a second exemplary embodiment of the invention; and

[0083] [Fig.5] [Fig.5] shows an example of an embodiment option of the invention.

[0084] Identical elements shown in the above-mentioned figures are identified by identical numerical references.

[0085] [Fig.l] schematically illustrates an electronic document 1.

[0086] The electronic document 1 comprises for example a body 10.

[0087] The body 10 here comprises a cavity 11 hollowed out in a part of a thickness of the body.

[0088] The cavity 11 comprises a deep, central part 12, and a counterbore 13, less deep, and surrounding the deep part 12.

[0089] The body 10 traditionally comprises at least one connection pad 14, arranged on the counterbore 13, configured to come into electrical contact with a connection terminal 21 of a module 20 inserted in the cavity 11; a microprocessor of the module 20 then being arranged in the deep part 12 of the cavity.

[0090] For this, the connection area 14 is generally formed in an inlay 30, laminated in the body.

[0091] An “inlay” means a layer configured to be inserted into a thickness of electronic document body, and incidentally, where appropriate, an intermediate layer which is inserted into the thickness of the electronic document body.

[0092] This cavity therefore makes it possible, for example, to position the module in the electronic document, and to access the wires of the inlay which is located in the body, and therefore to electrically connect the module to the body of the document.

[0093] In such an electronic document, the cavity is generally manufactured by machining, for example by milling.

[0094] However, during the manufacture of such an electronic document, several problems may appear, such as in particular the wires of the inlay being torn off when the machining tool passes over them, or poor contact being established between the inlay and the module if the machining is not deep enough.

[0095] To limit tearing problems, as illustrated in [Fig.2] A), it appeared preferable for the machining tool 16 to approach a wire 15 according to its diameter d, as shown diagrammatically by the arrow 17.

[0096] However, as illustrated in [Fig.2] B), in practice, a zigzag wire 18 forming a connection area is arranged with its rectilinear segments arranged parallel to an edge 19 of the counterbore 13, or with a small angle α, so that the machining tool 16 is more likely to travel along the rectilinear segments according to their length.

[0097] [Fig.2] C) thus illustrates a trajectory T of a machining tool 16 having a small angle a, of a few degrees, for example equal to or less than 6° with a rectilinear segment, while [Fig.2] D) thus illustrates a trajectory T' of a machining tool 16 having a large angle a, for example greater than 6°; for example approximately 35° with a rectilinear segment. In the latter case, more wires 18 can be torn off, which results in a connection gap, and a reduction in the useful surface area of the connection area.

[0098] [Fig.3] shows a detail of inlay 40 according to a first exemplary embodiment of the invention.

[0099] The inlay 40 comprises at least one 4L substrate

[0100] The substrate 41 is for example formed from a sheet configured to be laminated with at least one other layer to form a card body.

[0101] It mainly comprises an upper face 43, in which at least one metal wire is embedded. The upper face 43 is initially considered to be flat.

[0102] The upper face 43 of the substrate 41 comprises several zones delimited here by dotted lines for illustrative purposes: - a central zone 44, configured to form a deep part of the cavity; - a peripheral zone 45, configured to form a counterbore of a cavity of an electronic document, which surrounds the central zone 44; and - a zone 46 configured to be outside the cavity, which, here, surrounds the peripheral zone 45 and the central zone 44.

[0103] In order to establish connections with a module, the inlay 40 also comprises here at least a first zigzag portion 42 formed of a metal wire embedded in the upper face 43 of the substrate 41.

[0104] Said zigzag portion 42 is arranged at least partly in the zone 45 of the upper face 43 of the substrate 41 configured to form a counterbore of a cavity.

[0105] Said zigzag portion 42 comprises a wire 421 which is deposited by forming successive back and forth movements: it thus comprises rectilinear segments 422 connected to each other by detours 423 forming loops. The rectilinear segments 422 are here parallel to each other.

[0106] In the present exemplary embodiment, at least one of the rectilinear segments 422 comprises a portion 424 arranged in the zone 45 configured to form the counterbore of a cavity, as well as a first end 425 which extends into the zone 46 configured to be outside the cavity, and a second end 426 which extends into the zone 44 configured to form the deep portion of the cavity.

[0107] Here, the rectilinear segments 422 are arranged at an angle of between 80° and 100° (i.e. 90° + / -10°; i.e. substantially orthogonally) relative to a limit 441 between the zone 44 and the zone 45, as well as to a limit 442 between the zone 45 and the zone 46.

[0108] Boundary 441 represents a future edge 19 between the counterbore and the deep portion of the cavity and boundary 442 represents a future edge between the counterbore and a portion outside the cavity when the inlay is rolled into a body and machined to form the cavity.

[0109] In the present embodiment, the inlay comprises a total of eight zigzag portions which all have the same characteristics as the first zigzag portion 42.

[0110] The eight zigzag portions are arranged regularly at least partly in the zone 45 configured to form the counterbore of the cavity.

[0111] Here, the eight zigzag portions are arranged two by two along four sides of a rectangle in order to form a rectangular cavity.

[0112] In [Fig.3], the inlay 40 further comprises a connecting wire 47.

[0113] The connecting wire 47 is configured to connect together at least the straight segments 422 of the first zigzag portion 42.

[0114] For this, the connecting wire 47 comprises a part 471 which intersects at least the first zigzag portion 42 outside the zone 44 configured to form a deep part of the cavity.

[0115] This makes it possible to limit, or even eliminate, the risks of cutting the part 471 when the inlay is machined to form the deep part of the cavity.

[0116] In the present exemplary embodiment, the part 471 which intersects the first zigzag portion 42 is even located in the zone 46 configured to be outside the cavity.

[0117] It is thus located in an area which is theoretically not machined.

[0118] This is for example an area of the substrate configured to remain covered by at least one layer when the inlay is assembled between layers to form an electronic document body.

[0119] The connecting wire also comprises here at least one part 472 arranged next to the zigzag portion 42, and which comprises at least one end 473 arranged in the zone 44 configured to form the deep part of the cavity.

[0120] This part is thus configured to be cut during the machining of the cavity.

[0121] Further, in the present embodiment, all eight zigzag portions are connected by the connecting wire 47.

[0122] Thus, the connecting wire 47 comprises eight parts 471, and eight parts 472, so that once their end 473 is cut, the eight zigzag portions are isolated from each other, but the connections of their rectilinear segments between them remain ensured by the parts 471.

[0123] The embodiment of [Fig.4] differs from that of [Fig.3] by an arrangement of certain parts 471 of the connecting wire 47 which each intersect one of the zigzag portions, and by an arrangement of certain parts 472 which nevertheless comprise at least one end 473 arranged in the zone 44 configured to form the deep part of the cavity.

[0124] The path of the connection wire 47 is for example optimized here to obtain a maximum number of connections.

[0125] Thus, for example, parts 472a and 472b form fewer meanders here than in [Fig.3].

[0126] For example, part 471a, part 471c and part 471d are here arranged in zone 45 configured to form a counterbore, and no longer in zone 46 like part 471b.

[0127] In addition, the part 471a and the part 471b here comprise a zigzag whose rectilinear segments are arranged orthogonally to the rectilinear segments of the corresponding zigzag portion 42a or 42b.

[0128] For part 471a, the rectilinear segments are then configured to be arranged parallel to a path of a machining tool.

[0129] Furthermore, part 471a and part 471c are further located so as to come into contact with connection terminals 21 of a module when the corresponding electronic document is manufactured, while part 471d is configured to bypass a future corresponding connection terminal 21.

[0130] Thus, from such an inlay 40, for example as represented [Fig.3] or [Fig.4], an electronic document 1 is manufactured according to a method comprising for example the following steps: - A step of providing a body 10 of the electronic document, the body comprising at least: • an inlay 40, as described above; and • at least one upper layer which covers the upper face of the inlay substrate, and a lower layer, the inlay substrate being disposed between the upper layer and the lower layer; - A step of forming a cavity 11 in the body 10, comprising at least one step of machining at least the upper layer of the body by means of a machining tool 16, in which the machining tool 16 has a cutting direction forming an angle α of between 80° and 100° relative to a rectilinear segment 422 of the zigzag portion 42.

[0131] The step of forming the cavity further comprises here a step of forming the deep part of the cavity in which the zone 44 of the substrate is machined.

[0132] Thus during this step, the second ends 426 of the rectilinear segments 422 of the zigzag portions 42 are cut, as well as the ends 473 of the parts 472 of the connecting wire 47.

[0133] However, the rectilinear segments remain connected by the connecting wire 47 thanks to the corresponding parts 471.

[0134] As illustrated in [Fig.5], it is thus possible to increase the contact surface between a zigzag portion 420 of the inlay and a connection terminal 21 of a module which will be inserted into the cavity according to the different tolerances.

[0135] As illustrated in this figure, the zigzag portion can thus extend wider than where the connection terminal 21 is located.

[0136] This figure also shows that the rectilinear segments of the zigzag portion 420 are arranged orthogonally to an edge 19 between the counterbore 13 and the deep part 12 of the cavity 11, that is to say forming an angle of between 80° and 100° relative to the edge (i.e. 90° + / -10°).

[0137] Finally, this figure presents for illustrative purposes the zigzag portion 420 according to another exemplary embodiment.

[0138] For example, the path of the wire of the zigzag portions is optimized to obtain a maximum connection. Its design will thus take into account the various tolerances, for example the location of the zigzag portions, the milling, the arrangement of the module, the different wires, etc.

[0139] Such a method thus makes it possible to produce an electronic document comprising: - A body 10, which includes: - a cavity 11 hollowed out in a part of a thickness of the body, the cavity comprising a deep central part 12 and a peripheral part formed by a counterbore 13, less deep than the deep part, and surrounding the deep part, and - an inlay 40 comprising at least a first zigzag portion 42, forming a connection area, exposed on the counterbore 13, and comprising at least one connection wire 47 connecting together the rectilinear segments 422 of the first zigzag portion, and - A module 20, inserted into the cavity 11, and comprising at least one connection terminal 21 in electrical contact with the first zigzag portion 42 of the inlay 40.

[0140] Such an electronic document is for example a card, for example a smart card, with and / or without contact (for example a dual card).

[0141] The electronic document module comprises, for example, at least one support, also called a carrier film, or, depending on the case, an insulating substrate, or sticker, or flexible plate, etc.

[0142] The film comprises a face, called the external face, because it is intended to be accessible from the outside of the electronic document equipped with this module, and a face, called the internal face, opposite the external face, and intended to be oriented towards the inside of the cavity provided in the body to receive the module.

[0143] The external face of the module comprises, for example, an external interface.

[0144] The external interface comprises, for example, external contact interfaces according to a well-defined configuration, for example by the ISO 7816 standard.

[0145] The external interface may also include a sensor, such as a biometric sensor.

[0146] The module also generally includes a microprocessor, fixed on the internal face of the support then arranged in the deep part of the cavity.

Claims

Claims

1. Inlay (40) comprising at least one substrate (41) and at least one first zigzag portion (42) formed of a metal wire (421) embedded in an upper face (43) of the substrate (41), the first zigzag portion (42) alternately comprises rectilinear segments (422) and detours (423), a detour (423) connecting two successive rectilinear segments (422), at least one of the rectilinear segments (422) of the first zigzag portion (42) being arranged, at least in part, in an area (45) of the upper face (43) of the substrate (41) configured to form a counterbore (13) of a cavity (11) of an electronic document (1), and the inlay (40) comprising a connection wire (47) configured to connect together at least the rectilinear segments (422) of the first zigzag portion (42).

2. Inlay (40) according to claim 1, characterized in that the connecting wire (47) comprises a part (471) which intersects at least the first zigzag portion (42) outside an area (44) of the upper face (43) of the substrate (41) configured to form a deep part of the cavity.

3. Inlay (40) according to claim 2, characterized in that the connecting wire (47) comprises at least one part arranged next to the first zigzag portion (42), and the part of the connecting wire (47), which is arranged next to the first zigzag portion (42), comprises at least one end arranged in the area (44) of the upper face (43) of the substrate (41) configured to form the deep part of the cavity.

4. Inlay (40) according to any one of claims 2 or 3, characterized in that at least one of the rectilinear segments (422) of the first zigzag portion (42) forms an angle of between 80° and 100° relative to a limit between the zone (45) of the upper face (43) of the substrate (41) configured to form the counterbore (13) of the cavity (11) and the zone (44) of the upper face (43) of the substrate (41) configured to form the deep part of the cavity.

5. Inlay (40) according to any one of claims 2 to 4, characterized in that at least one of the rectilinear segments (422) of the first zigzag portion (42) comprises an end, called the second end, which extends into the zone (44) of the upper face (43) of the substrate (41) configured to form the deep part of the cavity.

6. Inlay (40) according to any one of claims 1 to 5, characterized in that the connecting wire (47) comprises a portion (471) which intersects at least the first zigzag portion (42) in an area (46) of the upper face (43) of the substrate (41) configured to be outside the cavity.

7. Inlay (40) according to claim 6, characterized in that at least one of the rectilinear segments (422) of the first zigzag portion (42) comprises at least one end, called the first end, which extends in the area of the upper face (43) of the substrate (41) configured to be outside the cavity.

8. Inlay (40) any one of claims 1 to 7, characterized in that the inlay (40) further comprises at least one second zigzag portion arranged, at least in part, in the zone (45) of the upper face (43) of the substrate (41) configured to form the counterbore (13) of the cavity (1).

9. An inlay (40) according to claim 8, characterized in that the connecting wire (47) is further configured to connect together at least the first zigzag portion (42) and the second zigzag portion.

10. A method of manufacturing an electronic document (1) comprising: - A step of providing a body (10) of the electronic document (1), the body comprising at least: - an inlay (40), according to any one of claims 1 to 9; and - at least one upper layer which covers the upper face (43) of the substrate (41) of the inlay (40), and a lower layer, the substrate (41) of the inlay (40) being arranged between the upper layer and the lower layer; - A step of forming a cavity (11) in the body (10), comprising at least one step of machining at least the upper layer of the body by means of a machining tool, in which the machining tool has a cutting direction forming an angle of between 80° and 100° relative to a rectilinear segment of the first zigzag portion (42).

11. Method according to claim 10, characterized in that the step of forming the cavity (11) in the body (10) comprises a step of forming a deep portion of the cavity in which the area (44) of the upper face (43) of the substrate (41) configured to form the deep portion of the cavity is machined.

12. Method according to claim 11, characterized in that the second end of at least one of the rectilinear segments (422) of the first zigzag portion (42) is then cut by the machining tool.

13. Method according to any one of claims 11 or 12, characterized in that the end of the part of the connecting wire (47), which is arranged next to the first zigzag portion (42), is then cut by the machining tool.

14. Electronic document (1) comprising: - A body (10), which comprises: - a cavity (11) hollowed out in a part of a thickness of the body, the cavity comprising a deep central part (12) and a peripheral part formed by a counterbore (13), less deep than the deep part, and surrounding the deep part (12), and - an inlay (40) comprising at least one substrate (41) and at least one first zigzag portion (42) formed by a metal wire (421) embedded in an upper face (43) of the substrate (41), the first zigzag portion (42) comprising alternately rectilinear segments (422) and detours (423), a detour (423) connecting two successive rectilinear segments (422), the first zigzag portion (42) forming a connection pad, exposed on the counterbore (13), and the inlay comprising at least at least one connecting wire (47) connecting together the rectilinear segments of the first zigzag portion (42), - A module (20),inserted into the cavity (11), and comprising at least one connection terminal (21) in electrical contact with the first zigzag portion (42) of the inlay (40).,

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