Electronic power supply circuit

Abstract

Electronic circuit The present description relates to an electronic circuit comprising a first grid (104A), configured to be polarized with a potential different from ground, comprising conductive tracks (110A) arranged in a first level of the electronic circuit and conductive tracks (112A) arranged in a second level of the electronic circuit, the first grid being arranged to supply a first circuit (108); the conductive tracks arranged in the first level being separated from each other by spacings (102A);a conductive rail (120) connecting a first node (134) and a second circuit (150) by crossing the first grid, the conductive rail being insulated from the first grid and configured to be polarized with a potential different from ground, and comprising conductive tracks (121) arranged in the first level in the first direction and in said spacings of the tracks of the first grid arranged in the first level. Figure for abstract: Fig. 1;

Description

Title of the invention: Electronic power supply circuit Technical field

[0001] The present description relates generally to electronic circuits. Prior art

[0002] Current electronic circuits may comprise arrangements of conductive tracks to connect, for example, one or more power supplies to analog or digital circuits of the electronic circuit, while minimizing ohmic losses.

[0003] When the electronic circuit comprises several isolated power supplies, there is a technical difficulty in introducing additional power supply rails without increasing the occupied surface area of ​​the circuit. Summary of the invention

[0004] There is a need to obtain electronic circuits where the overall footprint of the conductive track arrangements extends over smaller areas.

[0005] One embodiment overcomes all or part of the drawbacks of known electronic circuits.

[0006] One embodiment provides an electronic circuit comprising: - a first grid, configured to be polarized with a potential different from ground, comprising conductive tracks arranged in a first level of the electronic circuit and conductive tracks arranged in a second level of the electronic circuit, the first grid being arranged to power a first circuit implemented at least partially in a level arranged under the first and second levels; the conductive tracks arranged in the first level extending in a first direction and being separated from each other by spaces; and - a conductive rail connecting a first node and a second circuit by crossing the first grid, the conductive rail being insulated from the first grid and configured to be polarized with a potential different from ground, and comprising conductive tracks arranged in the first level of the electronic circuit in the first direction and in said spacings of the tracks of the first grid arranged in the first level.

[0007] One embodiment provides a method of manufacturing an electronic circuit comprising: - the formation of a first grid configured to be polarized with a potential different from the ground, and comprising conductive tracks arranged in a first level of the electronic circuit and conductive tracks arranged in a second level of the electronic circuit, the first grid being arranged to power a first circuit implemented at least partially in a level arranged below the first and second levels, the conductive tracks arranged in the first level extending in a first direction and being separated from each other by spacings; and - the formation of a conductive rail connected between a first node and a second circuit by crossing the first grid, insulated from the first grid and configured to be polarized with a potential different from the ground, and comprising conductive tracks arranged in the first level of the electronic circuit in the first direction and in said spacings of the tracks of the first grid arranged in the first level.

[0008] One embodiment provides an electronic circuit comprising: - a first grid, configured to be grounded, comprising conductive tracks arranged in a first level of the electronic circuit and conductive tracks arranged in a second level of the electronic circuit, the first grid being arranged to power a first circuit implemented at least partially in a level arranged below the first and second levels; the conductive tracks arranged in the first level extending in a first direction and being separated from each other by spaces; and - a conductive rail connecting a first node and a second circuit by crossing the first grid, the conductive rail being insulated from the first grid and configured to be grounded, and comprising conductive tracks arranged in the first level of the electronic circuit in the first direction and in said spacings of the conductive tracks of the first grid arranged in the first level.

[0009] In one embodiment, the second circuit is an analog circuit of the electronic circuit.

[0010] In one embodiment, the conductive rail is connected to the analog circuit via one or more switches configured to control the flow of current between the conductive rail and the analog circuit.

[0011] In one embodiment, the analog circuit is connected to a terminal of the switch(es) formed in another level of the electronic circuit different from the first level and the second level; another terminal of the switch(es) being connected to the tracks of the conductive rail.

[0012] In one embodiment, the conductive tracks of the first grid, arranged in the first level, are connected via one or more vias to the conductive tracks of the first grid arranged in the second level; and the conductive tracks of the conductor rail arranged in the first level are connected via one or more vias to conductive tracks of the rail driver arranged in the second level.

[0013] In one embodiment, the conductive tracks of the first grid arranged in the second level extend in a second direction, transverse to the first direction, and are connected by means of one or more vias to the conductive tracks of the first conductive grid arranged in the first level.

[0014] In one embodiment, the electronic circuit comprises a second grid, configured to be grounded when the first grid is biased with a potential different from ground or configured to be biased at a potential different from ground when the first grid is grounded, the second grid comprising conductive tracks arranged in the first level, which extend in the first direction in the spacings between the conductive tracks of the first grid arranged in the first level in the first direction, the second grid comprising conductive tracks arranged in the second level of the electronic circuit which extend in the second direction; the conductive tracks of the second grid arranged in the first level being connected to the conductive tracks of the second grid arranged in the second level by vias.

[0015] In one embodiment, the conductive tracks of the first and second grids and of the conductive rail, arranged in the first level, have a thickness greater than the conductive tracks of the first and second grids and of the conductive rail arranged in the second level.

[0016] In one embodiment, the conductive tracks of the first and second grids and of the conductive rail are made of copper.

[0017] In one embodiment, one of the conductive tracks of the conductive rail closest to the analog circuit is connected to a power supply configured to provide said potential different from ground via a power supply pad.

[0018] In one embodiment, one of the conductive tracks of the conductive rail furthest from the analog circuit is connected to a power supply configured to provide said potential different from ground via the node.

[0019] In one embodiment, the resistance of the conductive rail is between 0.4 and 1.5 ohms.

[0020] One embodiment provides a microcontroller comprising such a circuit. Brief description of the drawings

[0021] These characteristics and advantages, as well as others, will be explained in detail in the following description of particular embodiments given without limitation in relation to the attached figures among which:

[0022] [Fig.l] is a schematic view from below of an electronic circuit according to an embodiment of the present description;

[0023] [Fig.2] is a schematic view from below of an electronic circuit according to another embodiment of the present description;

[0024] [Fig. 3] is a schematic view from below of an electronic circuit according to yet another embodiment of the present description;

[0025] [Fig.4] is a schematic sectional view of a portion of the electronic circuit comprising a switch according to an example of the present description; and

[0026] [Fig.5] represents a microcontroller according to an example of the present description. Description of the embodiments

[0027] The same elements have been designated by the same references in the different figures. In particular, the structural and / or functional elements common to the different embodiments may have the same references and may have identical structural, dimensional and material properties.

[0028] For the sake of clarity, only the steps and elements useful for understanding the described embodiments have been shown and are detailed.

[0029] Unless otherwise specified, when referring to two elements connected to each other, this means directly connected without intermediate elements other than conductors, and when referring to two elements connected (in English "coupled") to each other, this means that these two elements can be connected or be connected by means of one or more other elements.

[0030] In the following description, when reference is made to absolute position qualifiers, such as the terms "front", "back", "top", "bottom", "left", "right", etc., or relative position qualifiers, such as the terms "above", "below", "upper", "lower", etc., or to orientation qualifiers, such as the terms "horizontal", "vertical", etc., reference is made unless otherwise specified to the orientation of the figures.

[0031] Unless otherwise specified, the expressions "about", "approximately", "substantially", and "of the order of" mean to within 10%, preferably to within 5%.

[0032] [Fig.l] is a schematic bottom view of an electronic circuit 100 according to an embodiment of the present description.

[0033] The electronic circuit 100 of [Fig.l] comprises a first grid 104A, configured to be biased with a potential different from ground or in another example to ground. The first grid 104A comprises conductive tracks 110A arranged in at least a first level of the electronic circuit 100 and conductive tracks 112A arranged in at least a second level of the electronic circuit 100. The levels of the electronic circuit 100 correspond to levels of stacked metal tracks separated from each other by an insulator, for example a dielectric low electrical permittivity or silicon dioxide. The tracks 110A, 112A of the different levels are for example connected to each other by vias 130A which pass through the insulator. The vias 130A are for example arranged at the level where the tracks 110A and 112A are opposite each other. In the example of [Fig.l], only the metal conductive tracks are shown, without the insulator. In the example of [Fig.l], two conductive tracks 110A of the first level are arranged in a vertical direction and four conductive tracks 112A of the second level are arranged in a horizontal direction. These numbers are only examples, and the numbers of tracks can be, in practice, greater than for example several hundreds or thousands. In another example, the conductive tracks 110A are arranged in the first direction 180 which is vertical and the conductive tracks 112A are arranged in the second direction 190 which is horizontal.In one example, the tracks of the first level and the second level are arranged in perpendicular directions. In another example, the tracks of the first level and the second level are arranged in non-perpendicular directions.

[0034] The first gate 104A is arranged, for example, to supply, through several vias, a circuit 108 implemented at least partially in a level arranged under the first and second levels, the circuit 108 being for example a digital circuit.

[0035] The electronic circuit 100 of [Fig. 1] may optionally comprise a second gate 104B insulated from the first gate 104A. The second gate 104B is, for example, configured to be biased with a potential different from ground if the first gate 104A is grounded or, in another example, grounded if the first gate is biased with a potential different from ground. These different polarizations are, for example, obtained with a power supply (not shown), belonging to the circuit 100 or external to the circuit 100. The second grid 104B comprises conductive tracks 110B arranged, for example, in the first level of the electronic circuit 100 and conductive tracks 112B arranged, for example, in the second level of the electronic circuit 100. The tracks 110B, 112B of the different levels are for example connected to each other by vias 130B which pass through the insulator.The vias 130B are for example arranged at the level where the tracks 110B and 112B are opposite each other. In the example of [Fig.l], two conductive tracks 110B of the first level are arranged in a vertical direction and three conductive tracks 112B of the second level are arranged in a horizontal direction. These numbers are only examples, and the numbers of tracks may be, in practice, greater than for example several hundreds or thousands. In another example, the conductive tracks 110B are arranged in the first direction 180 which is vertical and the conductive tracks 112B are arranged in the second direction 190 which is horizontal. In the example of [Fig.l], the tracks 112B of the second grid 104B. are arranged in the second level between the tracks 112A of the first grid 104A, which are also arranged in the second level. In one example, the conductive tracks 110A of the first grid 104A, arranged in the first level, are separated from each other by gaps 102A. In one example, the vertical tracks 110B of the second grid 104B are arranged in the gaps 102A. In other words, the vertical tracks 104B of the second grid are arranged between two vertical tracks 110A of the first grid 104A. The gaps 102A comprise, for example, the insulator in addition to other conductive tracks. Similarly, the conductive tracks 110B of the second grid 104B, arranged in the first level, are separated from each other by gaps 102B. In one example, the vertical tracks 110A of the first grid 104A are arranged in the spacings 102B.In other words, the vertical tracks 104A of the first grid are arranged between two vertical tracks 110B of the second grid 104B. The spacings 102B comprise, for example, the insulator in addition to other conductive tracks. In one example, the spacings 102A are equal to the spacings 102B.

[0036] In one example, the tracks of the second grid 104B of the first level and the second level are arranged in perpendicular directions. In another example, not shown, the tracks of the first level and the second level are arranged in non-perpendicular directions.

[0037] In an alternative example not shown, the levels in which the tracks of the first and second grids are arranged are reversed compared to the example of [Fig.l].

[0038] In one example, the second grid 104B is connected to the digital circuit 108 to power it.

[0039] The electronic circuit 100 of [Fig.l] also comprises a conductive rail 120 connecting a first node 134, which is for example a power supply pad, and a circuit 150, for example analog and / or belonging for example to the electronic circuit, by crossing the first grid 104A and optionally, if the second grid 104B is present, by also crossing the second grid 104B. The fact that the conductive rail 120 crosses one or more grids implies for example that this rail crosses an area delimited by the periphery of the grids. The conductive rail 120 is insulated from the first grid 104A and from the second grid 104B, for example by an insulator. The conductive rail 120 is for example polarized with a power supply (not shown), belonging to the circuit 100 or external to the circuit 100, and connected for example to the node 134, with a potential different from ground or, in another example, to ground.

[0040] In certain cases, the electronic circuit 100 also comprises a second node 132, which is for example a power supply pad, connected to the circuit 150 by a part of the conductive rail 120. Indeed, the power supply pad 132 is for example intended to be arranged as close as possible to the analog circuit 150 so that the electrical path is low resistive. However, providing a power supply pad, such as pad 132, close to the circuit 150 to be powered is not always possible, and in certain cases, even if pad 132 is present, it is not accessible or usable. The conductive rail 120 is therefore provided to allow the circuit 150 to be connected to the power supply pad 134, which is relatively far from the circuit 150, in a relatively low resistive and low surface consumption manner.

[0041] The conductive rail 120 comprises conductive tracks 121, 121A arranged in the first level of the electronic circuit 100 in the first vertical direction 180 and in the spacings 102A and / or 102B. In another example not illustrated in [Fig.l], the conductive tracks 110A of the first grid 104A are arranged, for example, on each side of the vertical tracks 121 of the conductive rail 120. Two adjacent vertical tracks 110A of the first grid 104A are thus separated, in the corresponding spacing 102A, by at least one of the tracks 121 of the conductive rail 120.

[0042] In the example of [Fig. 1], two vertical tracks 121 of the conductor rail 120 are arranged in each spacing 102A. In this example, an assembly 160 comprising two first vertical tracks 121 of the conductor rail 120 separated by a vertical track 110B of the second grid 104B, is arranged in at least one spacing 102A. In the example of [Fig. 1], the number of tracks 110A is equal to 2, and there is therefore only one spacing 102A. In another example not illustrated where the number of tracks 110A is equal to or greater than 3, an assembly 160 is arranged in each spacing 102A.

[0043] In another example, where the second grid 104B is not present, the assembly 160 then comprises one or more vertical tracks 121 arranged in each spacing 102A. In particular, the assembly may comprise only one vertical track 121, or more than two vertical tracks.

[0044] In the example of [Fig.l], four vertical tracks 121 are shown, although in other embodiments there could be two or three vertical tracks 121, or more than four vertical tracks 121. The tracks 121 extend, for example, in the first direction 180. The conductive rail 120 comprises, in the example of [Fig.l], conductive tracks 122A, 122B arranged in the second level of the electronic circuit 100 in the horizontal direction. The conductive tracks 122A, 122B are, for example, connected to the tracks 121 by vertical vias 114 and located at the intersections between the tracks of the first level and the tracks of the second level. In another example, the tracks of the conductive rail 120 arranged in the first level and in the second level are oriented non-perpendicularly between each level. In another example not shown, the levels in which the tracks 121, 122A, 122B of the conductor rail 120 are arranged are reversed with respect to the illustrated example. In yet another example not shown, the power supply pad 134 is connected to any one of the conductor tracks 121, or to the track 122B.

[0045] In the example of [Fig.l], the conductive tracks 122A, 122B of the conductive rail 120 are arranged in the second direction 190 and parallel to the tracks 112A of the first grid 104A and, if present, to the tracks 112B of the second grid 104B. In another example, the conductive tracks 122A, 122B of the conductive rail 120 are arranged in a direction different from that of the tracks 112 of the first grid 104A and / or of the second grid 104B if present. In another example not shown, the conductive tracks 122A, 122B of the conductive rail 120 are arranged on either side of an area where the tracks 112A, and possibly 122B, are present. In another non-illustrated example, the conductive tracks 122A, 122B of the conductive rail 120 are arranged in spaces located between the tracks 112A and / or 112B.

[0046] In the example of [Fig.l], the conductive track 122A is for example positioned at one end of the conductive tracks 121 which is closest to the analog circuit 150. The conductive track 122A is for example connected to the node 132. This node is configured to be optionally connected to a power source via a power pad to provide the potential different from ground for example.

[0047] In the example of [Fig.l], the conductive track 122B is for example positioned at the other end of the conductive tracks 121 which is the furthest from the analog circuit 150. The conductive track 122B is connected to the power supply pad 134. This power supply pad 134 is configured to be optionally connected to a power source to provide the potential different from ground for example.

[0048] In one example, the conductive tracks 110A, 110B, 112A, 112B of the first and second grids 104A, 104B and / or the tracks 121, 122A, 122B of the conductive rail comprise copper or aluminum or a metal alloy.

[0049] In one example, the conductive tracks of the first grid 104A and / or the second grid 104B and the conductive rail 120, arranged in the first level, have a thickness greater than the conductive tracks of the first grid and / or the second grid 104B and the conductive rail 120 arranged in the second level. Forming the conductive tracks 121 of the conductive rail 120 in layers of metal of significant thickness has the effect of reducing the resistance of these tracks. In another example, the thicknesses of the tracks of the first and second levels are similar.

[0050] The number of conductive tracks 110A, 110B, 112A, 112B, 121, 122A, 122B can be from several tens to several thousands.

[0051] In the example of [Fig.l], the conductor rail 120 is connected to the analog circuit 150 via one or more switches 140, for example arranged in parallel, optional, configured to control the flow of current between the conductive rail 120 and the analog circuit 150. For example, one or more switches 140 are controlled by a control circuit (not shown) of the electronic circuit 100. When the switch(es) are controlled to prevent the flow of current, this makes it possible to limit the energy consumption. In the example of [Fig.l], the conductive track 121A of the conductive rail 120 which is closest to the power pad 132, and which is connected to the power pad 134, is connected to the switch 140. In an example not shown, the switch 140 is connected to any one of the conductive tracks 121. In one example, the switch(es) 140 are transistors arranged in the electronic circuit 100.

[0052] The vertical conductive tracks 121 of the conductive rail 120 are electrically connected in parallel, for example by means of the conductive tracks 122A, 122B and the vias 114. This makes it possible to reduce the overall resistance of the conductive rail 120 between the power supply pad 134 and the analog circuit 150. In one example, the resistance of the conductive rail 120 is between 0.4 and 1.5 ohms.

[0053] The example of [Fig.l] makes it possible to reduce the surface area of ​​the conductor rail 120 by interlacing the conductor rail 120 with the first grid 104A, in particular using the spacings 102A of the first grid 104.

[0054] [Fig.2] is a schematic view from below of an electronic circuit 200 according to another embodiment of the present description.

[0055] The electronic circuit 200 of the example of [Fig.2] is similar to that of [Fig.l] with the exception of the switch 140, which is replaced, in the example of [Fig.2], by one or more switches 242, 244, 246 and 248 each arranged between the analog circuit 150 and a conductive track 121 different from the conductive rail 120. In one example, at least two conductive tracks 121 different from the conductive rail 120 are each connected to a different switch. In another example, at least two switches are connected to the same conductive track 121. The switches 242, 244, 246 and 248 are configured, for example, to control the flow of current between the conductive rail 120 and the analog circuit 150. The switches 242, 244, 246 and 248 are controlled, for example, by a control circuit not shown.Switches 242, 244, 246 and 248 allow the current output from the conductor rail 120 to be distributed and a relatively low resistance switchable electrical connection to be made between the conductor rail 120 and the analog circuit 150.

[0056] [Fig. 3] is a schematic bottom view of an electronic circuit 300 according to yet another embodiment of the present description.

[0057] The electronic circuit 300 of [Fig. 3] includes the first grid 104A and the second grid 104B, which are similar to those of [Fig. 1], except that only one of the vertical tracks 121 of the conductor rail 120 is arranged in each spacing 102A separating the tracks 110A. In the example of [Fig.3], one of the vertical tracks 121 of the conductor rail 120 is also arranged in each spacing 102A.

[0058] [Fig. 4] is a schematic sectional view of a portion of the electronic circuit 100, 200, 300 comprising one of the switches 140, 242, 244, 246 or 248 according to an example of the present description. The switch 140, 242, 244, 246 or 248 is arranged, for example, on several levels of the electronic circuit 100, 200, 300 lower than the first and second levels, for example on transistor levels.

[0059] In the example of [Fig. 4], a terminal 430 of the switch is connected to one of the conductive tracks 121, 121A of the conductive rail 120 via a series of vias 416, 412, 408, 114 and their respective conductive tracks 414, 410, 122A or 122B, which are stacked. In the example of [Fig. 4], the switches 140, 242, 244, 246, 248 occupy lower levels of the stacked metal tracks of the circuit, such as for example the three lower levels. The switches 140, 242, 244, 246, 248 also comprise, for example, MOS transistors made in and on a semiconductor substrate of the circuit (not shown in the figures).

[0060] Terminal 430 is connected to conductive track 414 via via 416. Conductive track 414 is connected to conductive track 410 of the upper level via via 412. Conductive track 410 is connected to conductive track 122A or 122B of the second level via via 410. Conductive track 122A or 122B is connected to conductive track 121A or 121 of the first level via via 114.

[0061] In the example of [Fig. 4], the analog circuit 150 extends over the five lower levels of the stacked metal tracks of the circuit. The other terminal 432 of the switch is connected to the conductive track 422 of the upper level via the via 420. The conductive track 422 is connected to the conductive track 426 of the level higher than that of track 422 via the via 424. The conductive track 426 is connected to a terminal of the analog circuit 150 located, for example, on an upper face of the analog circuit 150.

[0062] In one example, the analog circuit 150 extends from the lower levels of the stacked metal traces to the fourth or one of the upper levels of the stacked metal traces of the circuit, or extends from the lower levels of the stacked metal traces to the second or first level of the stacked metal traces of the circuit. In these cases, the person skilled in the art will adjust the number of vias and conductive traces required.

[0063] [Fig. 5] shows an integrated circuit 520, such as a microcontroller, according to an example of the present disclosure. The integrated circuit 520 includes the electronic circuit electronics 100, 200 or 300 as well as one or more power supply circuits 510 configured to apply the potential different from ground for example at the node 134. The node 134 is for example connected to the electronic circuit 100, 200 or 300 by a conductive track 512. In another example not illustrated, the power supply circuit 510 is located outside the integrated circuit 520, that is to say that another integrated circuit, not shown, comprises the power supply circuit 510 and provides the polarization potential.

[0064] Embodiments of the invention also relate to a method of manufacturing the electronic circuit 100, 200 or 300 of FIGS. 1, 2 and 3, the method comprising: forming the first gate 104A configured to be biased with a potential different from ground, and comprising the conductive tracks 110A arranged in at least a first level of the electronic circuit and conductive tracks 112A arranged in at least a second level of the electronic circuit, the conductive tracks 110A arranged in the first level extending in a first direction 180 and being separated from each other by spacings 102A;and the formation of a conductive rail 120 connected between a first node and a second circuit by crossing the first grid 104A, insulated from the first grid and configured to be polarized with a potential different from the ground, and comprising the conductive tracks 121, 121A arranged in the first level of the electronic circuit in the first direction 180 and in the spacings 102A of the tracks of the first grid arranged in the first level.;

[0065] Various embodiments and variations have been described. Those skilled in the art will understand that certain features of these various embodiments and variations could be combined, and other variations will occur to those skilled in the art. In particular, the example of [Fig. 2] is combinable with the example of [Fig. 3], for example, by using the switches 242, 244, 246 and 248 of [Fig. 2] and connecting them to the vertical tracks of the conductive rail 120 of [Fig. 3]. Those skilled in the art may consider implementing additional gates to the first and second gates and isolated from the other gates to, for example, supply the digital circuit with potentials or currents different from those of the other gates.

[0066] One or more additional grids may be implemented in a similar manner to the example in [Fig.l]. For example, in the case of an additional grid, there could be an alternation, in the same level, of sets composed of a vertical track 110A of the first grid, a vertical track of the conductor rail 121, a track 110B of the second grid, another vertical track 121 of the conductor rail, a vertical track of the additional grid and yet another vertical track 121 of the conductor rail. In this case, additional horizontal tracks additional grid elements will be added, for example, in a different level and connected by vias to the vertical tracks of the additional grid.

[0067] In another example, one or more additional grids may be implemented in a similar manner to the example of [Fig. 3]. For example, in the case of an additional grid, there could be an alternation, in the same level, of sets composed of a vertical track 110A of the first grid, a track 110B of the second grid, a vertical track of the additional grid and a vertical track 121 of the conductive rail. In this case, additional horizontal tracks will, for example, be added in a different level and connected by vias to the vertical tracks of the additional grid.

[0068] Finally, the practical implementation of the embodiments and variants described is within the reach of those skilled in the art from the functional indications given above. In particular, the switches can be implemented by MOS transistors or by other types of transistors.

Claims

Claims

1. Electronic circuit comprising: - a first grid (104A), configured to be polarized with a first potential, comprising conductive tracks (110A) arranged in a first level of the electronic circuit and conductive tracks (112A) arranged in a second level of the electronic circuit, the first grid being arranged to power a first circuit (108) implemented at least partially in a level arranged below the first and second levels; the conductive tracks (110A) arranged in the first level extending in a first direction (180) and being separated from each other by spaces (102A); and - a conductive rail (120) connecting a first node (134) and a second circuit (150) by crossing the first grid (104A), the conductive rail (120) being insulated from the first grid and configured to be polarized with a second potential, and comprising conductive tracks (121, 121 A) arranged in the first level of the electronic circuit in the first direction (180) and in said spacings (102A) of the tracks (110A) of the first grid (104A) arranged in the first level, the first and second potentials being either both at ground, or both at potentials different from ground.

2. A method of manufacturing an electronic circuit comprising: - forming a first gate (104A) configured to be biased with a first potential, and comprising conductive tracks (110A) arranged in a first level of the electronic circuit and conductive tracks (112A) arranged in a second level of the electronic circuit, the first gate (104A) being arranged to power a first circuit (108) implemented at least partially in a level arranged below the first and second levels, the conductive tracks (110A) arranged in the first level extending in a first direction (180) and being separated from each other by spacings (102A); and - forming a conductive rail (120) connected between a first node and a second circuit (150) crossing the first grid (104A), insulated from the first grid and configured to be polarized with a second potential, and comprising conductive tracks (121, 121A) arranged in the first level of the electronic circuit according to the first direction (180) and in said spacings (102A) of the tracks of the first grid arranged in the first level, the first and second potentials being either both at ground, or both at potentials different from ground.

3. The circuit of claim 1, wherein the second circuit (150) is an analog circuit of the electronic circuit.

4. The circuit of claim 3, wherein the conductive rail (120) is connected to the analog circuit (150) via one or more switches (140) configured to control the flow of current between the conductive rail (120) and the analog circuit.

5. Circuit according to claim 4, in which the analog circuit (150) is connected to a terminal (432) of the switch(es) (140) formed in another level of the electronic circuit different from the first level and the second level; another terminal (430) of the switch(es) being connected to the tracks (121) of the conductive rail (120).

6. A circuit according to any one of claims 1 or 3 to 5, wherein the conductive tracks (110A) of the first grid (104A), arranged in the first level, are connected via one or more vias (130A) to the conductive tracks (112A) of the first grid (104A) arranged in the second level; and the conductive tracks (121, 121A) of the conductive rail (120) arranged in the first level are connected via one or more vias (114) to conductive tracks (122A, 122B) of the conductive rail arranged in the second level.

7. Circuit according to any one of claims 1 or 3 to 6, in which the conductive tracks (112A) of the first grid (104A) arranged in the second level extend in a second direction (190), transverse to the first direction (180), and are connected by means of one or more vias to the conductive tracks (110A) of the first conductive grid (104A) arranged in the first level.

8. A circuit according to claim 7, wherein the electronic circuit comprises a second gate (104B), configured to be grounded when the first potential is different from ground or configured to be biased to a potential different from ground when the first potential is grounded, the second gate comprising conductive tracks (110B) arranged in the first level, which extend in the first direction (180) in the spaces (102A) between the conductive tracks (110A) of the first grid (104A) arranged in the first level in the first direction (180), the second grid (104B) comprising conductive tracks (112B) arranged in the second level of the electronic circuit which extend in the second direction (190); the conductive tracks (110B) of the second grid arranged in the first level being connected to the conductive tracks (112B) of the second grid arranged in the second level by means of one or more vias (130B).

9. The circuit of claim 8, wherein the conductive tracks (110A, 110B, 121, 121 A) of the first and second grids (104A, 104B) and the conductive rail (120), arranged in the first level, have a thickness greater than the conductive tracks (112A, 112B, 122A, 122B) of the first and second grids and the conductive rail arranged in the second level.

10. A circuit according to claim 8 or 9, wherein the conductive tracks of the first and second grids (104A, 104B) and the conductive rail are made of copper.

11. A circuit according to claim 3 or any one of claims 4 to 10 as dependent on claim 3, wherein one of the conductive tracks (122A) of the conductive rail (120) closest to the analog circuit (150) is connected to a power supply configured to provide said second potential via a power supply pad (132).

12. A circuit according to claim 11, wherein one of the conductive tracks (122B) of the conductive rail (120) furthest from the analog circuit (150) is connected to a power supply configured to provide said second potential via the node (134).

13. A circuit according to any one of claims 1 or 3 to 12, wherein the resistance of the conductive rail (120) is between 0.4 and 1.5 ohms.

14. A microcontroller comprising the circuit of any one of claims 1 or 3 to 13.

Images