Electronic media for an image acquisition device, an assembly comprising such media, and an image acquisition device comprising such an assembly

Abstract

electronic support (20) comprising a body which has at least a first flap (30) and a second flap (30'), the first flap (30) and the second flap (30') each having an upper face (31, 31') and a lower face (32, 32'), the upper face (31) of the first flap (30) and the upper face (31') of the second flap (30') being configured to each support a sensor (55, 55') of image acquisition unit, the electronic support (20) further comprising at least one hinge (40), the at least one hinge (40) being configured to connect the first flap (30) and the second flap (30') together, the upper face (31) of the first flap (30) being inclined at an angle "a" with respect to the upper face (31') of the second flap (30'), the angle "a" being greater than 180°. Figure for the abridged version: Fig. 1

Description

Title of the invention: Electronic support for image acquisition device, assembly comprising such a support, and image acquisition device comprising such an assembly

[0001] The invention relates to an electronic medium.

[0002] It relates more particularly to an electronic support for at least two image acquisition units.

[0003] The invention applies, in particular, to technical fields such as image acquisition systems for security, for monitoring and recognizing information, in particular biometric information, such as irises, of an individual, or in particular for road monitoring, such as a radar for vehicles.

[0004] An image acquisition system for tracking and biometric recognition of an iris of an individual, whether stationary or moving, typically comprises a camera mounted parallel to a support along a viewing axis of the camera, a first motor configured to orient the camera along a rotation axis considered to be "vertical" allowing the camera to perform a horizontal rotation movement, called "panoramic", and a second motor configured to orient the camera along a rotation axis considered to be "horizontal" allowing the camera to perform a vertical rotation movement, thus orienting its inclination, also called "tilt" movement.

[0005] In this system, the two rotational movements of the camera (pan and tilt) relative to the support can be combined to obtain a capture field in the form of a cone with a rectangular base.

[0006] However, at least one drawback of such an image acquisition system is that it has a relatively large footprint in the plane of the support resulting from the arrangement of the camera parallel to the support.

[0007] Another image acquisition system for tracking and biometric recognition of an iris of an individual, whether stationary or moving, typically comprises a fixedly mounted camera arranged perpendicular to a support along the line of sight of the camera, a mirror positioned opposite the camera and transverse to the line of sight of the camera, the mirror being motorized along two axes of rotation relative to the line of sight of the camera, thus allowing the mirror to perform a horizontal rotation movement, called "panoramic" and a vertical rotation movement, called "tilt".

[0008] In such a system, the two rotational movements of the mirror can be combined to obtain a capture field in the form of a cone with a rectangular base.

[0009] In such a system, the camera typically comprises a lens and a sensor, onto which the lens sends an image.

[0010] Such an image acquisition system has the advantage of a relatively reduced footprint in the plane of the support compared to the image acquisition system previously presented.

[0011] Nevertheless, at least one disadvantage of such an image acquisition system is that it has a limited capture field, particularly in comparison with the previous image acquisition system presented.

[0012] Indeed, in particular the horizontal rotational movement, called “panning”, of the mirror relative to the line of sight of the camera causes a rotation of the image reflected by the mirror relative to the center of the camera sensor.

[0013] The image reflected by the mirror is then no longer on the same horizontal line of the camera sensor.

[0014] Thus, the greater the rotation angle during the panning movement of the mirror, the greater the risk of obtaining an image, in particular of the eyes and / or irises of an individual, partially or completely outside the camera sensor. This is notably due to the fact that a camera sensor is typically rectangular and not circular in format, and has a standardized dimensioning and is generally limited in size.

[0015] Consequently, such rotation of the image reflected by the mirror on the sensor during a panoramic movement results in a limitation of the capture field of the camera.

[0016] In addition, the image perceived by the sensor is then distorted. The rotation of the image reflected on the camera sensor then requires an additional step during the processing of the image provided by the image acquisition system.

[0017] To overcome at least in part these drawbacks, there is for example proposed an image acquisition system comprising an image acquisition device configured to acquire at least one image along a line of sight, in which the image acquisition device comprises at least two image acquisition units whose optical axes diverge from one another.

[0018] Such an arrangement makes it possible to widen a field of vision of the image acquisition system at least in one direction.

[0019] Such an arrangement has the particular advantage for the monitoring and recognition of biometric information of an individual of allowing simultaneous acquisition of both irises of the individual.

[0020] However, a difficulty is then to be able to maintain the image acquisition units in position relative to each other, while facilitating synchronization of the images captured by each of the image acquisition units.

[0021] The present invention aims to at least partially overcome these drawbacks, possibly leading to other advantages.

[0022] To this end, according to a first aspect, an electronic support is proposed comprising a body which comprises at least a first flap and a second flap, the first flap and the second flap each comprising an upper face and a lower face, the upper face of the first flap and the upper face of the second flap being configured to each support an image acquisition unit sensor, the electronic support further comprising at least one hinge, the at least one hinge being configured to connect the first flap and the second flap together, the upper face of the first flap being inclined at an angle “a” relative to the upper face of the second flap, the angle “a” being greater than 180°.

[0023] In an exemplary embodiment, the angle “a” is less than or equal to 220°.

[0024] In one embodiment, the electronic medium comprises more than two panels.

[0025] For example, the electronic support may comprise at least a third flap.

[0026] The third flap supports, for example, a third sensor.

[0027] For example, the electronic support may then include a second hinge by which the third flap is connected to the second flap.

[0028] An electronic support with three panels then forms a triptych. Such an electronic support, comprising at least three panels each supporting a sensor, is for example suitable for an application such as multi-channel monitoring of road radar.

[0029] In one embodiment, the at least one hinge is flexible.

[0030] The flexibility of the at least one hinge thus allows at least the first flap and the second flap to form an angle “a” between them.

[0031] For example, the at least one hinge may be flexed, or be curved, or be bent.

[0032] In one embodiment, the at least one hinge has a thinned thickness relative to a thickness of the at least one first flap and one second flap.

[0033] A thinned thickness at the at least one hinge relative to a thickness of the flaps makes it possible to locate a folding zone without requiring a third element to form the at least one hinge.

[0034] The support can for example be formed from a single plate.

[0035] For example, the thinned thickness of the at least one hinge is achieved by removing material, for example by machining, for example milling.

[0036] For example, the thinned thickness of the at least one hinge is produced by rolling.

[0037] In one embodiment, the at least one hinge, the first flap and the second flap are formed together in a single piece.

[0038] In one embodiment, the at least one hinge is further configured to electrically connect the first shutter and the second shutter together.

[0039] In one embodiment, at least one of the first flap and the second flap comprises a connector configured to electrically connect the electronic medium to an external unit.

[0040] In one embodiment, at least one of the first flap and the second flap comprises a multiplexer configured to multiplex video signals from the sensors of the first flap and the second flap and to transmit a single video signal to said connector.

[0041] In one embodiment, the electronic medium is a printed circuit board.

[0042] The invention also relates, according to a second aspect, to an assembly comprising an electronic medium, comprising all or part of the characteristics described above.

[0043] For example, the assembly includes a lens holder.

[0044] For example, the lens support is configured to support at least a first lens of a first image acquisition unit and a second lens of a second image acquisition unit.

[0045] For example, the lens support is configured to position at least the first lens of the first image acquisition unit opposite the first sensor of the first image acquisition unit and the second lens of the second image acquisition unit opposite the second sensor of the second image acquisition unit.

[0046] For example, the lens support is fixed to the first flap and the second flap by keeping the first flap inclined at the angle "a" relative to the second flap.

[0047] The invention also relates, according to a third aspect, to an image acquisition device configured to acquire at least one image along a line of sight.

[0048] For example, the image acquisition device comprises an assembly as described previously.

[0049] For example, the image acquisition device comprises at least a first image acquisition unit and a second image acquisition unit, the first image acquisition unit comprising a first objective and the first sensor, which together define a first optical axis, and the second image acquisition unit comprising a second objective and the second sensor, which together define a second optical axis, the first and second optical axes, respectively of the first and second image acquisition units, diverging from each other.

[0050] The invention, according to an exemplary embodiment, will be well understood and its advantages will appear better on reading the detailed description which follows, given for information purposes and in no way limiting, with reference to the appended drawings in which:

[0051] [Fig.l] represents a perspective top view of an electronic medium according to an exemplary embodiment of the invention;

[0052] [Fig.2] represents a perspective view from below of the electronic support according to the embodiment example of [Fig.l];

[0053] [Fig.3] represents a profile view of the electronic support according to the embodiment example of [Fig.l];

[0054] [Fig.4] represents a sectional view of a detail, including the hinge, of the electronic support according to the embodiment example of [Fig.1];

[0055] [Fig.5] represents an example of electronic architecture of the electronic support according to the embodiment example of [Fig.l];

[0056] [Fig.6] represents a perspective top view of an assembly comprising the electronic support according to the embodiment example of [Fig.1];

[0057] [Fig.7] represents a perspective view from below of the whole of [Fig.6];

[0058] [Fig.8] represents an exploded view of an example of an acquisition device image comprising the whole of [Fig.6]; and

[0059] [Fig.9] represents a perspective view of the image acquisition device of [Fig.8].

[0060] Identical elements shown in the above-mentioned figures are identified by identical numerical references.

[0061] Figures 1 to 3 show an electronic support 20 according to an exemplary embodiment of the invention.

[0062] The electronic support 20 is here a printed circuit board, called PCB for “printed circuit board”.

[0063] The electronic support 20 mainly comprises a body, which here comprises a first flap 30 and a second flap 30'.

[0064] The first flap 30 and the second flap 30' each have an upper face and a lower face.

[0065] The upper face and the lower face of each flap define between them a thickness of the electronic support 20.

[0066] In this case, the first flap 30 here comprises an upper face 31 and a lower face 32, and the second flap 30' here comprises an upper face 31' and a lower face 32'.

[0067] The upper face 31, 31' of each of the first flap 30 and the second flap 30' here designates the face of each flap which is configured to support an image acquisition unit sensor, described in connection with FIGS. 8 and 9 for example.

[0068] Thus, in the present exemplary embodiment, the upper face 31 of the first flap 30' comprises a first sensor 55 of a first image acquisition unit 50, and the upper face 31' of the second flap 30' comprises a second sensor 55' of a second 50' image acquisition unit.

[0069] The electronic support 20 further comprises at least one hinge 40.

[0070] The hinge connects the first flap 30 and the second flap 30' to each other.

[0071] In other words, the hinge 40 is located between the first flap 30 and the second 30' shutter.

[0072] The hinge here designates a part of the electronic support 20 which is configured to be flexed, or curved, or folded, so that the upper faces 31, 31' of the first flap and the second flap form between them an angle "a", better visible [Fig.3].

[0073] In particular, the angle “a” formed is greater than 180°.

[0074] Thus, when two image acquisition units 50, 50' are mounted on the electronic support 20, each image acquisition unit 50, 50' having a sensor 55, 55' mounted on one of the flaps 30, 30', then their optical axes diverge.

[0075] In other words, in a configuration where the electronic support 20 is not folded, the upper face 31 of the first flap 30 and the upper face 31' of the second flap 30' here form an angle of 180°, while in a configuration where the electronic support 20 is folded according to the invention, the upper face 31 of the first flap 30 and the upper face 31' of the second flap 30' here form an angle "a" greater than 180°.

[0076] For example, in the example illustrated, this angle “a” is here equal to 182.9°.

[0077] Furthermore, the angle “a” formed between the flaps is preferably less than or equal to 220°.

[0078] The hinge 40 is flexible here, in particular in comparison with the first flap 30 and the second flap 30'.

[0079] In the present exemplary embodiment, the hinge 40 is formed by a portion of the electronic support 20 having a thickness that is thinner than the thickness of the first flap 30 or the second flap 30'.

[0080] This allows a weakened zone to be created to orient one flap relative to the other.

[0081] The hinge is further configured to electrically connect electronic components of the first flap 30 and the second flap 30' to each other.

[0082] The electronic support 20 further comprises a connector 60.

[0083] The connector 60 is configured to allow an electrical connection between the electronic medium 20 and an environment external to the electronic medium 20.

[0084] The connector 60 in particular allows here a transmission of at least one signal, such as an electrical power supply and / or a video signal for example.

[0085] The connector 60 is here arranged on the first flap 30, in particular on its upper face 31.

[0086] Having a single connector 60 for the entire electronic support 20 makes it possible to reduce the size of the electronic support, in particular by reducing as much as possible the number of electrical connections between the electronic support 20 and its environment. outside.

[0087] By centralizing a transfer of signals, to or from the electronic medium, a synchronization of the signals can be processed within a component of the electronic medium 20.

[0088] The hinge 40 here allows at least one transfer of the signals from the second sensor 55' of the second flap 30' to the first flap 30 comprising the connector 60, and thus avoids having one connector per flap.

[0089] The electronic support 20 further comprises a multiplexer 70.

[0090] The multiplexer 70 is configured here to multiplex video signals from the respective sensors 55, 55' of the first flap 30 and the second flap 30'.

[0091] In this case, the multiplexer 70 is here arranged on the first flap 30, and in particular on its lower face 32.

[0092] The multiplexer 70 is in particular electronically connected to the connector 60, to the first sensor 55 and to the second sensor 55'.

[0093] Finally, the first flap 30 here comprises two fixing holes 80 and two centering holes 90. Similarly, the second flap 30' here also comprises two fixing holes 80' and two centering holes 90'.

[0094] [Fig.4] represents a sectional view of a detail of the electronic support 20 at the level of the hinge 40 according to the exemplary embodiment of [Fig.1].

[0095] The electronic support 20 comprises several layers.

[0096] These layers are traditionally superimposed and laminated, hot or cold, to form the body of the support.

[0097] By way of example, the body of the electronic support 20 is here formed of eleven superimposed layers, noted here C2 to C12.

[0098] Furthermore, a Cl layer and a C13 layer, arranged on either side, are here a solder mask, in particular a photochemical liquid mask.

[0099] In this case, the layers C2, C4, C6, C8, C10 and C12 are based on copper, in particular copper foils. The layers C2, C4, C6, C8, C10 and C12 are in particular etched here by a photochemical process.

[0100] In this case, layers C3, C5, C9 and C11 are based on dielectric, in particular pre-impregnated.

[0101] In this case, the C7 layer is typically based on an epoxy resin composite reinforced with FR4 standard glass fiber.

[0102] In this case, some of the layers C2 to C12 are here pierced to form at least one hole and the at least one hole formed is coated with copper to form a via allowing an electrical connection between components arranged on either side of the body.

[0103] In the present embodiment, the first flap 30, the second flap 30' and the hinge 40 are formed from a single electronic card body, i.e. from the same printed circuit board PCB.

[0104] Here, the hinge 40 is formed by a localized thinning of the body.

[0105] The thinned thickness of the hinge 40 is for example achieved by removing material, for example machining or milling.

[0106] This removal of material is here carried out from a lower face of the electronic support 20, i.e. a face from which the lower face of the first flap and the second flap are then formed.

[0107] This removal of material here corresponds to a removal of layers C1 to C8, so as to retain only layers C9 to C13 at the hinge 40.

[0108] As an alternative to removing material, the thinned thickness of the hinge 40 can be achieved by a rolling process. For example, during rolling of the body of the electronic support 20, the layers C9 to C12 are gripped between a first part and a second part, the first part corresponding to the layers C1 to C8 with an absence of material at a hinge zone and the second part corresponding to the thirteenth layer C13,

[0109] Producing the thinned thickness of the hinge 40 by a rolling process makes it possible to obtain a hinge 40 with a significantly cleaner appearance compared to a hinge 40 obtained by removing material, in particular by milling.

[0110] A locally thinned thickness thus makes it possible to create a privileged deformation zone in the body of the electronic support 20, forming the hinge 40.

[0111] [Fig.5] represents an electronic architecture of the electronic support 20 according to the exemplary embodiment of [Fig.l].

[0112] The electronic architecture of the electronic support 20 shows in particular an interaction between the sensors 55 and 55' and the multiplexer 70.

[0113] The sensors 55 and 55' here each transmit a video signal, denoted respectively SV 1 and SV 1', to the multiplexer 70.

[0114] The electronic architecture of the electronic support 20 shows in particular an interaction between the multiplexer 70 and the connector 60.

[0115] The multiplexer 70 processes the received signals SV 1 and SV 1 ', and in turn transmits a multiplexed video signal SV2 to the connector 60.

[0116] The electronic architecture of the electronic support 20 shows in particular that the connector 60 allows an internal distribution of an electricity supply, denoted DAEI, for the electronic support 20, by the transfer of an electrical supply, denoted AE, coming from an external environment, to each electronic component of the electronic support 20, including to the first sensor 55, the second sensor 55' and the multiplexer 60.

[0117] [Fig.6] and 7 represent a top and bottom view, in perspective, of a assembly comprising the electronic support 20 as described previously.

[0118] The assembly further comprises here a lens support 110.

[0119] The lens support 110 is configured here to support two lenses: a first lens 56 of the two lenses being that of a first image acquisition unit 50 and a second lens 56' of the two lenses being that of a second image acquisition unit 50'.

[0120] For these purposes, the objective support 110 here comprises a first sheath 115, configured to support the first objective 56, and a second sheath 115', configured to support the second objective 56'.

[0121] The lens holder 110 is also configured to position the first lens 56 and the second lens 56' relative to the corresponding image acquisition unit sensor 55, 55' so that a first image captured by the first image acquisition unit 50 and a second image captured by the second image acquisition unit 50' are focused onto the first sensor 55 and the second sensor 55', respectively.

[0122] The objective support 110 is here arranged on the upper face 31 of the first flap 30 and on the upper face 31' of the second flap 30', and spans the hinge 40.

[0123] The lens support 110 is further configured here to keep the hinge 40 folded so that the upper face 31 of the first flap 30 and the upper face 31' of the second flap 30' form the desired angle "a".

[0124] The angle “a” is notably chosen to prevent the field of the at least one first image acquisition unit from being separated from that of the at least one second image acquisition unit beyond a certain threshold value of the angle “a”, dependent on the characteristics of the objective and the sensor of each image acquisition unit, so as to prevent a dead zone from appearing and to guarantee an overlap of the two fields of vision.

[0125] For example, the first sheath 115 is fixed relative to the second sheath 115'.

[0126] The lens support 110 here further comprises two centering pins 116.

[0127] The two centering pins 116 are here configured to center the lens support 110 on the body of the electronic support 20.

[0128] The two centering pins 116 are arranged on a lower face of the lens support 110, intended to come onto the upper face of the body of the electronic support 20.

[0129] In the present exemplary embodiment, the two centering pins 116 are formed projecting from the lower face of the lens support 110, and in particular in a wall of the first sheath 115.

[0130] The two centering pins 116 are therefore configured here to center the lens support 110 on the electronic support 20 by being inserted into the two holes of centering 90 of the first shutter 30.

[0131] Of course, at least one of the two centering pins 116 could be formed projecting from the lower face of the lens support 110, in a wall of the second sheath 115', and come to be inserted into a centering hole 90' ​​provided for this purpose in the second flap 30'.

[0132] The assembly further comprises here four fixing screws 120, 120'.

[0133] The four fixing screws 120, 120' are here configured to hold the support from 110 lenses to 20 electronic support.

[0134] Two fixing screws 120 are here screwed through two fixing holes 80 of the first flap 30 to the lower face of the lens support 110, in particular by being aligned with the first sensor 55 to optimize the maintenance of the lens support 110 on the first flap 30.

[0135] Two other fixing screws 120' are here screwed through two fixing holes 80' of the second flap 30' to the lower face of the lens support 110, in particular by being aligned with the second sensor 55' to optimize the maintenance of the lens support 110 on the second flap 30'.

[0136] Figures 8 and 9 represent perspective views of an image acquisition device 130 comprising an assembly as described previously.

[0137] The image acquisition device 130 is configured to acquire at least one image along a line of sight DI (illustrated [Fig.9]).

[0138] The image acquisition device 130 here comprises the first image acquisition unit 50 and the second image acquisition unit 50'.

[0139] The first image acquisition unit 50 comprises the first objective 56 and the first sensor 55, which together define an optical axis D2.

[0140] The second image acquisition unit 50' comprises the second lens 56' and the second sensor 55', which together define an optical axis D3.

[0141] The optical axes D2, D3, respectively of the first and second image acquisition units 50, 50', diverge with respect to the line of sight DI of said image acquisition device 40 according to a separation angle of a predetermined value.

[0142] In other words, a separation distance, between each optical axis D2, D3 and the line of sight D1, increases when a distance, along each optical axis D2, D3, relative to each sensor 55, 55' increases.

[0143] Furthermore, an angle “b” (not shown) between the optical axis D2 and the optical axis D3 is substantially equal to: b = a - 180°.

[0144] In an exemplary embodiment considered here, the first image acquisition unit 50 and the second image acquisition unit 50' are here configured so that in the far field, i.e. at least 1 m, or even 1.2 m, an image resolution on the corresponding sensor makes it possible to recognize an iris of an individual, i.e. a 10.2 mm diameter iris is imaged by at least 150 pixels, or even at least 160 pixels.

[0145] Furthermore, the first image acquisition unit 50 and the second image acquisition unit 50' are here configured so that in the near field, that is to say at most 1 m, or even at most approximately 0.5 m, a lateral field of the two combined image acquisition units 50, 50' makes it possible to capture the two eyes of an individual, with a margin allowing for a pointing error.

[0146] The objectives 56, 56' of the first and second image acquisition units 50, 50' are chosen to have a focal length of between 35 mm and 60 mm, for example approximately 50 mm.

[0147] Thus, the electronic support 20 according to the invention makes it possible to incline, in particular to diverge, the optical axes D2, D3 of the at least two image acquisition units 50, 50' relative to a sighting axis DI of the image acquisition device 130.

[0148] The optical axes D2, D3 are for example symmetrical with respect to the line of sight D1, which can then be described as “median”.

[0149] In other words, such an electronic support 20 allows the at least two image acquisition units 50, 50' to cover a wider image capture field compared to a configuration where the at least two image acquisition units 50, 50' would not be inclined towards each other.

[0150] According to one option, the image acquisition device 130 further comprises a translation device (visible [Fig.9]).

[0151] The translation device is configured to focus an image onto the sensors.

[0152] The translation device is here configured to simultaneously translate the objective respective 56, 56' of each of the first and second image acquisition units 50, 50' by a single translational movement, parallel to the line of sight DL

[0153] In the embodiment shown here, the translation device comprises a slide, a worm screw and a stepper motor.

[0154] The stepper motor is configured to turn the worm screw, which drives the slide in translation along the DL axis.

Claims

Claims

1. Electronic support (20) comprising a body which comprises at least a first flap (30) and a second flap (30'), the first flap (30) and the second flap (30') each comprising an upper face (31, 31') and a lower face (32, 32'), the upper face (31) of the first flap (30) and the upper face (31') of the second flap (30') being configured to each support a sensor (55, 55') of an image acquisition unit (50, 50'), the electronic support (20) further comprising at least one hinge (40), the at least one hinge (40) being configured to connect the first flap (30) and the second flap (30') together, the upper face (31) of the first flap (30) being inclined at an angle "a" relative to the upper face (31') of the second flap (30'), the angle " a » being greater than 180°, the electronic support (20) being characterized in that the first flap (30) and the second flap (30') are formed together in a single piece.

2. An electronic medium according to claim 1, wherein the at least one hinge (40) is flexible.

3. Electronic support according to one of claims 1 or 2, in which the at least one hinge (40) has a thickness thinned relative to a thickness of the at least one first flap (30) and one second flap (30').

4. An electronic medium according to any one of claims 1 to 3, wherein the at least one hinge (40) is further configured to electrically connect the first flap (30) and the second flap (30') to each other.

5. Electronic medium according to any one of claims 1 to 4, wherein at least one of the first flap (30) and the second flap (30') comprises a connector (60) configured to electrically connect the electronic medium to an external unit.

6. An electronic medium according to claim 5, wherein at least one of the first flap (30) and the second flap (30') comprises a multiplexer (70) configured to multiplex video signals from the sensors (55, 55') of the first flap (30) and the second flap (30') and to transmit a single video signal to said connector (60).

7. An electronic medium according to any one of claims 1 to 6, wherein the electronic medium (20) is a printed circuit board.

8. Assembly comprising an electronic support (20) according to one any of claims 1 to 7, and comprising a lens support (110), the lens support (110) being configured to support at least a first lens (56) of a first image acquisition unit (50) and a second lens (56') of a second image acquisition unit (50'), and the lens support (110) being configured to position at least the first lens (56) of the first image acquisition unit (50) opposite the first sensor (55) of the first image acquisition unit (50) and the second lens (56') of the second image acquisition unit (50') opposite the second sensor (55') of the second image acquisition unit (50'), the lens support (110) being further fixed to the first flap (30) and the second flap (30') while keeping the first flap (30) inclined by the angle “a” relative to the second shutter (30').

9. Image acquisition device (130) configured to acquire at least one image along a line of sight (D1), the image acquisition device (130) comprising an assembly according to claim 8 and at least a first image acquisition unit (50) and a second image acquisition unit (50'), the first image acquisition unit (50) comprising a first objective (56) and the first sensor (55), which together define a first optical axis (D2), and the second image acquisition unit (50') comprising a second objective (56') and the second sensor (55'), which together define a second optical axis (D3), the first and second optical axes (D2), (D3), respectively of the first and second image acquisition units (50, 50'), diverging from each other.

Images