Integrated circuit enclosure with heat dissipation

Abstract

According to one aspect, an integrated circuit package (ICF) is proposed comprising: - a substrate (SUB) having a mounting face (FM), - an electronic chip (CHP) having a rear face (FS1) and a front face (FL1), the chip (CHP) being mounted on the mounting face (FM) such that the front face (FL1) is electrically connected to the mounting face (FM) of the substrate (SUB), and - a deformable thermally conductive film (FLM) configured to cover at least a portion of the rear face (FS1) of the chip (CHP) such that the film (FLM) is in contact with the rear face (FS1). Figure for the abstract: Fig 1

Description

Title of the invention: Housing for integrated circuit with heat dissipation

[0001] Implementation and embodiment methods relate to the field of microelectronics, in particular the field of packaging of integrated circuits, and more particularly the means of heat dissipation in integrated circuit packages.

[0002] Thermal dissipation means are typically intended to dissipate the heat generated by one face of the electronic chip containing integrated circuits present in a package.

[0003] These means of heat dissipation classically include a heat sink, for example a copper plate, fixed to this face of the electronic chip by means of a layer of thermal interface material, for example a mixture of silicone and copper, well known to those skilled in the art (usually referred to by the Anglo-Saxon terms "Thermal Interface Material").

[0004] In particular, the thermal interface material layer enables heat transfer between the chip and the heat sink so that the heat sink can dissipate heat to the outside of the housing and so that the temperature of the integrated circuits does not reach a value leading to their degradation.

[0005] That being said, the thermal interface material is a weak point in the thermal chain since it has a lower thermal conductivity than the heat sink.

[0006] In this regard, it is advisable to reduce the thickness of the thermal interface material layer to improve the heat dissipation of the package. However, the adhesive strength of the thermal interface material layer is known to be limited, and reducing the thickness of the thermal interface material layer may impair the mechanical adhesion of the heatsink to the chip.

[0007] In addition, the thermal material layer may deteriorate over the life of the housing and may have imperfections such as hollows that can affect the mechanical strength of the heat sink and degrade the thermal performance of the housing.

[0008] There is therefore a need to improve the thermal performance of the integrated circuit package.

[0009] According to one aspect, an integrated circuit package is proposed comprising: - a support plate having a mounting face, - an electronic chip having a rear face and a front face, the chip being mounted on the mounting face such that the front face is electrically connected to the mounting face of the support plate, - a thermally conductive, deformable film, for example made of metal, configured to cover and be in contact with at least part of the back face of the chip.

[0010] The thermally conductive film is deformable and adapts to the shape of the chip or other components mounted on the support plate.

[0011] Such a film therefore does not require a thermal interface material to be attached to the chip and thus improves heat dissipation within the package. The film also ensures mechanical strength throughout the package's lifespan, thereby preventing the risk of degradation in the package's thermal performance.

[0012] Furthermore, in the case of total chip coverage, the film can act as a prior art heat sink while advantageously being thinner. Thus, the film is less expensive to manufacture than a heat sink and allows for a more compact package in this case.

[0013] Consequently, the housing according to this aspect benefits from improved thermal performance throughout its entire life.

[0014] According to one embodiment, the thermally conductive film is welded to at least a part of the rear face of the chip.

[0015] The film is held on the back face of the chip and allows heat to be dissipated directly without intermediaries between the film and the chip such as the thermal interface material layer.

[0016] According to one embodiment, the thermally conductive film is fixed to at least a part of the rear face of the chip by an adhesive.

[0017] The adhesive is typically a glue or double-sided adhesive tape allowing the film to be fixed to the back face of the chip while exhibiting better thermal conductivity than the thermal interface material for a given thickness.

[0018] According to one embodiment, the support plate includes an opening through the thickness of the support plate to open onto the mounting face, the thermally conductive film further covering the mounting face and sealing said opening.

[0019] The opening forms a passage in the support plate, allowing vacuum lamination to be performed during the manufacturing of the package. Vacuum lamination is a suitable technique for fixing the film to the chip in such a way as to avoid the presence of air between the adhesive and the back surface of the chip, and consequently improves the film's adhesion to the chip.

[0020] According to one embodiment, the housing includes a molding resin disposed on the mounting face of the support plate such that the resin encases the chip and exposes the rear face of the chip, the thermally conductive film also being configured to cover a top face of the molding resin.

[0021] The film is also compatible with packages including a molding resin allowing the electronic chip to be protected by leaving the back face of the chip exposed so that it is in contact with the thermally conductive film.

[0022] According to one embodiment, the chip is configured to have hot spots that emit heat during operation, the thermally conductive film being configured to cover the hot spots of the chip.

[0023] Thermal simulation tools or, alternatively, thermal sensors are used to detect hot spots, i.e., areas of the chip that may experience temperature spikes during operation. Once identified, the positions of these hot spots can be used to define the shape of the film. Thus, identifying the chip's hot spots allows the film to be shaped so that it covers these hot spots while minimizing the amount of material used to manufacture the film.

[0024] According to one embodiment, the film has a thickness between 5 µm and 0.5 mm.

[0025] This range of film thickness typically makes it possible to make the casing more compact and can be defined according to the choice of material used for the film so as to make it deformable.

[0026] According to one embodiment, the modulus of elasticity of the thermally conductive film is between 105 and 100 GPa.

[0027] Therefore, a film exhibiting these elastic modulus values ​​is sufficiently deformable to adapt to the morphology of the chip without risk of detachment.

[0028] According to one embodiment, the thermally conductive film also covers the mounting face of the support plate and is connected to thermally conductive elements of the support plate.

[0029] Thermally conductive elements such as welding balls, the interconnection network and the electrical contacts of the plate can advantageously serve to form an additional passage with the film for the evacuation of heat under the housing.

[0030] According to one embodiment, the housing includes a component mounted on the mounting face of the support plate, in which the thermally conductive film also covers the mounting face of the support plate and includes an opening suitable for containing the component.

[0031] Openings can be made in the thermally conductive film according to the design constraints of the package, for example, those related to the presence of surface-mount components. Such openings thus allow the film to be applied to the chip and the mounting face of the board without covering these components and without hindering their subsequent operation.

[0032] According to one embodiment, the thermally conductive film also covers at least part of the lateral face of the electronic chip.

[0033] The film can, for example, cover at least part of the back face of the chip and extend to the edges of the chip to optimize heat dissipation.

[0034] According to another aspect, a method for manufacturing an integrated circuit package comprising a support plate having a mounting face is proposed, the method comprising: -a mounting on the mounting face of the support plate of an electronic chip having a rear face and a front face such that the front face is electrically connected to the mounting face, - a covering of part of the rear face of the chip by a thermally conductive, deformable film so that the film is in contact with the rear face.

[0035] According to one embodiment, covering a part of the rear face with the thermally conductive film includes fixing the film to at least a part of the rear face of the chip by an adhesive.

[0036] According to one embodiment, the method comprises forming an opening through the thickness of the support plate until it reaches the mounting face, wherein the film is fixed to at least a part of the back face by using the opening to create a gap between the film and the support plate so that the film covers the mounting face and closes said opening.

[0037] According to one embodiment, the film has a thickness between 5 pm and 0.5 mm.

[0038] According to one embodiment, the thermally conductive film is a metal.

[0039] According to one embodiment, the modulus of elasticity of the thermally The driver is between 105 and 100 GPa.

[0040] According to one embodiment, the covering of a part of the back face by the thermally conductive film includes a chemical vapor deposition of the wire on at least a part of the back face of the chip.

[0041] According to one embodiment, the method includes forming a molding resin on the mounting face of the support plate so that the molding resin coats the chip and exposes the back face, the thermally conductive film covering an upper face of the molding resin.

[0042] According to one embodiment, includes identification of hot spots of the chip by thermal simulation of the chip in operation, wherein the covering of a portion of the back face by the thermally conductive film is carried out so that the film covers the hot spots of the chip.

[0043] According to one embodiment, the method further comprises a connection of the film to thermally conductive elements of the support plate.

[0044] According to one embodiment, the method comprises mounting a component on the mounting face of the support plate and forming an opening in the thermally conductive film such that said opening contains the component after said covering of a part of the rear face by the thermally conductive film.

[0045] According to one embodiment, the method comprises covering a part of the side face of the electronic chip with the thermally conductive film at the same time as covering a part of the back face with the film.

[0046] Other advantages and features of the invention will become apparent upon examination of the detailed description of embodiments and implementations, which are by no means limiting, and the accompanying drawings in which:

[0047] [Fig.l],

[0048] [Fig.2],

[0049] [Fig.3],

[0050] [Fig.4],

[0051] [Fig.5],

[0052] [Fig.6],

[0053] [Fig.7],

[0054] [Fig. 8],

[0055] [Fig.9],

[0056] [Fig. 10],

[0057] [Fig. 11],

[0058] [Fig. 12] and

[0059] [Fig. 13] schematically illustrate embodiments of the invention.

[0060] Fig. 1 schematically illustrates a cross-sectional view of a BT integrated circuit package according to a first embodiment of the invention.

[0061] The BT package includes a CHP electronic chip containing one or more integrated circuits and a SUB support plate having an FM mounting face. The SUB support plate may be a substrate, for example. Such a SUB support plate may include an INTCNX interconnection network and PAD electrical contacts located on the FM mounting face and electrically connected to the INTCNX interconnection network.

[0062] The CHP chip includes a rear face FS1 and a front face FL1 comprising integrated circuit components such as transistors for example.

[0063] The CHP chip is mounted on the FM mounting face of the SUB support plate in a "flip chop" type mounting.

[0064] More specifically, the front face FL1 of the CHP chip can be electrically connected to the electrical contacts PAD of the SUB support plate by via SLD1 solder balls embedded in an UNDFLL underfilling material known to those skilled in the art (designated by the Anglo-Saxon term "underfill").

[0065] In addition, the SUB support plate can be provided with SLD2 solder balls fixed to one face of the SUB support plate opposite the FM mounting face, allowing the BT housing to be connected to a printed circuit board (not shown in the figure), for example. The INTCNX interconnection network of the SUB support plate is typically configured to electrically couple the PAD electrical contacts to the SLD2 solder balls and transmit signals between the CHP electronic chip and circuits on the printed circuit board.

[0066] However, the integrated circuits of the CHP chip generate heat that can be dissipated through the rear face FS1, and also onto the side faces EDG of the CHP chip during operation. The heat emitted by the CHP chip contributes to the temperature increase within the BT package and is likely to degrade the integrated circuits if it exceeds a certain value.

[0067] In this respect, the BT housing advantageously comprises a deformable thermally conductive FLM film, for example made of a metal such as copper (Cu) or aluminum (Al). The FLM film may also be a copper film having a face coated with nickel (Ni), a nickel-platinum alloy (NiPd), or aluminum.

[0068] The FLM film is configured to cover and be in contact with the rear face FS1 of the CHP chip, for example by being fixed to this part of the rear face FS1 by a GL adhesive as illustrated in [Fig.1].

[0069] The thermally conductive film FLM adapts to the shape of the chip or other components mounted on the SUB support board and can be fixed to the CHP chip by a GL adhesive whose thermal conductivity can be

[0070] The thermal performance of the housing is thus improved. The film also guarantees mechanical strength throughout the housing's lifespan, which prevents the risk of degradation in the housing's thermal performance.

[0071] The FLM film here completely covers the rear face FS1 of the CHP chip and acts as a conventional heat sink by protecting the chip and dissipating heat to the outside of the BT package while being thinner and less expensive than the prior art heat sink.

[0072] Furthermore, the FLM film also covers at least part of the EDG side faces of the CHP chip through which heat can also diffuse and thus optimizes thermal dissipation.

[0073] Furthermore, the FLM film has a thickness ranging from 5 µm to 0.5 mm. This film thickness range can be defined according to the choice of material used for The film is designed to be deformable and, if used instead of a heat sink, allows for a more compact BT enclosure. A skilled professional will know how to adjust the film thickness according to the material used to ensure the film is deformable.

[0074] The thermally conductive FLM film also has a modulus of elasticity between 105 and 100 GPa.

[0075] Consequently, a film exhibiting these elastic modulus values ​​is sufficiently deformable to adapt to the morphology of the chip without risk of film detachment, particularly in the case where the film is fixed via the GL adhesive.

[0076] The GL adhesive may be a glue such as the non-conductive EA6900 adhesive marketed by DOW or the electrically conductive 2100A adhesive marketed by Henkel. The GL adhesive may also be a double-sided adhesive tape such as the PC07 adhesive tape marketed by Boyd. The GL adhesive is preferably thermally conductive and typically offers better adhesion than the thermal interface material.

[0077] Figure 2 schematically illustrates a cross-sectional view of a BT enclosure according to a second embodiment. The elements common to the enclosure of Figure 1 bear the same reference numerals and will not all be detailed again.

[0078] The thermally conductive film FLM is welded to the rear face FS1 of the CHP chip and completely covers the rear face FS1, for example. Alternatively, the thermally conductive film FLM may also have been formed on the rear face FS1 by chemical vapor deposition of a thin metallic film by sputtering.

[0079] The rear face FS1 and the side faces EDG of the chip are therefore directly covered by the FLM film without intermediate layers, thus reducing the thermal chain between the CHP chip and the outside of the BT package. Consequently, heat dissipation is improved.

[0080] The thermally conductive film FLM is also welded or formed on the FM mounting face of the SUB support plate. The FLM film is connected to thermally conductive elements of the SUB support plate, for example to non-functional PAD electrical contacts, i.e., those not used to transmit electrical signals, which are coupled to the SLD2 solder balls by the INTCNX interconnection network.

[0081] The SLD2 solder balls, the INTCNX interconnection network and the PAD electrical contacts can advantageously be used to form an additional passage with the FLM film for heat dissipation under the BT housing and thus contribute to improving the thermal dissipation of the BT housing.

[0082] Figure 3 schematically illustrates a cross-sectional view of a BT enclosure according to a third embodiment. The elements common to the enclosure of Figure 1 bear the same reference numerals and will not all be detailed again.

[0083] The SUB support plate includes an opening FNT1 through the thickness of the SUB plate until it opens onto the FM mounting face.

[0084] The FLM film is also fixed to the SUB support plate by the GL adhesive so as to cover the SUB plate and to close the FNT1 opening.

[0085] The FNT1 opening forms a passage in the SUB support plate allowing the FLM film to be fixed by means of a vacuum lamination carried out during the manufacture of the BT case.

[0086] Thus, the presence of air between the GL adhesive and the rear face FS1 and the side faces EDG of the CHP chip is reduced, and consequently the retention of the FLM film on the CHP chip and the heat dissipation are improved.

[0087] Figure 4 schematically illustrates a cross-sectional view of a BT enclosure according to a fourth embodiment. The elements common to the enclosure of Figure 1 bear the same reference numerals and will not all be detailed again.

[0088] The CHP chip may in some cases exhibit hot spots during operation emitting heat in a more localized manner on the rear face FS1 or the side faces EDG of the CHP chip.

[0089] The thermally conductive film FLM is fixed to the rear face FS1 of the CHP chip and covers a part of the rear face FS1, in particular the hot spots of the CHP chip located on this part of the rear face FS1.

[0090] The BT package also includes a heat sink, for example made of copper, fixed to the SUB support plate by a GL2 adhesive, for example analogous to the GL adhesive described previously, and fixed to the rear face FS1 of the CHP chip and to the FLM film by a layer of TIM thermal interface material.

[0091] In particular, a first layer of the thermal interface material layer TIM covers the part of the rear face FS1 which is not covered by the FLM film and a second layer, less than the first layer, of the thermal interface material layer TIM covers the FLM film.

[0092] The BT package then benefits from more efficient heat dissipation on the part of the CHP chip generating the most heat thanks to the FLM film.

[0093] Figure 5 schematically illustrates a top view of a BT housing according to a fifth embodiment. The elements common to the housing of Figure 1 are referred to by the same reference numerals and will not all be detailed again. The BT housing includes a CPT heat sink, and the thermal interface material layer is not shown in Figure 5.

[0094] The PC hot spots of the CHP chip shown in [Fig.5] can for example be detected using thermal simulation tools, such as the Simcenter Flotherm software from Siemens, or thermal sensors (not shown).

[0095] The positions of these PC hot spots, once identified, can be taken into account to define the shape of the FLM film. The FLM film can, for example, be manufactured or formed by chemical vapor deposition so as to cover the PC hot spots while limiting the amount of FLM film material.

[0096] Furthermore, the BT housing also includes a COMP component, such as a passive electronic component or an antenna, on the FM mounting face of the SUB plate and the FLM film includes an FNT2 opening suitable for containing the COMP component.

[0097] Openings can indeed be made in the thermally conductive film according to the design constraints of the BT package, for example, those related to the presence of surface-mount components. Such openings thus allow the film to be applied to the chip and the mounting face of the board without covering these components and without hindering their subsequent operation.

[0098] Figure 6 schematically illustrates a cross-sectional view of a BT housing according to a sixth embodiment. The elements common to the housing of Figure 1 bear the same reference numerals and will not all be detailed again.

[0099] The BT package includes an MLD molding resin disposed on the FM mounting face of the SUB support plate such that the MLD resin encapsulates the CHP chip and exposes the rear face FS1. The MLD resin is typically an epoxy resin mixed with vitreous silica or metal oxides such as alumina.

[0100] The thermally conductive film FLM is fixed to the rear face FS1 of the CHP chip by the adhesive GL as described previously in relation to [Fig.1] and is also fixed to a top face FS2 of the molding resin MLD by the adhesive GL.

[0101] The FLM film is also compatible with molded packaging packages including a molding resin allowing the electronic chip to be protected by leaving the back face of the chip exposed so that it is in contact with the thermally conductive film.

[0102] The MDL resin can also be heat conductive, particularly when the resin contains metal oxides and allows the heat generated by the EDG side faces of the CHP chip to be transferred to the FLM film.

[0103] Figures 7 to 13 illustrate steps in a process for manufacturing integrated circuit packages described above in relation to Figures 1 to 6.

[0104] [Fig. 1] illustrates step 100 of obtaining a SUB support plate comprising an FM mounting face. The SUB support plate includes a network INTCNX interconnects and PAD electrical contacts formed on the FM mounting face and electrically connected to the INTCNX interconnect network.

[0105] Additional electrical contacts PAD can be formed on the FM mounting face to allow connection of the thermally conductive film as described previously in relation to [Fig. 2]. These electrical contacts PAD are non-functional electrical contacts that are not used to transmit electrical signals.

[0106] [Fig.8] illustrates a step 101 of fixing a CHP electronic chip to the FM mounting face of the SUB board. The CHP chip comprises a rear face FS1 and a front face FL1 connected to the electrical contacts PAD by solder balls SLD1 embedded in an underfill material UNDFLL.

[0107] Fig. 9 illustrates a step 102 of fixing a thermally conductive deformable FLM film to the rear face FS 1 and the side faces EDG of the CHP chip by an adhesive GL.

[0108] The FLM film can be coated with glue or can be attached to double-sided adhesive tape, for example.

[0109] In particular, the FLM film can be plated onto the CHP chip by applying pressure to the film so that it deforms to cover the rear face FS1 and the side faces EDG of the CHP chip.

[0110] Step 102 of fixing the FLM film can be followed by a step of fixing SLD2 solder balls on a face FL2 of the SUB plate opposite the FM mounting face to obtain the BT housing shown in [Fig.1].

[0111] [Fig. 10] illustrates a step 103 of welding the thermally conductive film FLM as an alternative to step 102 described previously in relation to [Fig. 9].

[0112] The FLM film soldering includes more particularly soldering the FLM film onto the rear face FS1 and onto the side faces EDG of the CHP chip.

[0113] Furthermore, the FLM film is soldered onto the SUB plate so as to be connected to the additional PAD electrical contacts.

[0114] Step 103 can be followed by a step of fixing SLD2 solder balls (not shown) on an FL2 face of the SUB plate opposite the FM mounting face to obtain the BT housing shown in [Fig.2].

[0115] In particular, the SLD2 solder balls and the additional electrical contacts PAD are coupled together by the INTCNX interconnection network of the SUB plate in order to form an additional passage with the FLM film for heat dissipation under the BT housing.

[0116] Fig. 11 illustrates a step 104 of forming an opening FNT1 and fixing the thermally conductive film FLM as an alternative to steps 102 and 103 described previously in relation to Figures 9 and 10.

[0117] The thermally conductive film FLM can be the same as that described previously in relation to [Fig.9] and can be coated with glue or attached to double-sided adhesive tape, for example.

[0118] The FNT1 opening passes through the thickness of the SUB support plate until it opens onto the FM mounting face. The FNT1 opening is used to create a vacuum, for example by means of a vacuum lamination technique known to those skilled in the art, between the FLM film and the SUB support plate so that the FLM film covers the FM mounting face and closes the FNT1 opening.

[0119] Vacuum lamination is a technique for fixing the FLM film to the CHP chip in such a way as to avoid the presence of air between the GL adhesive and the FS1 back face of the chip and consequently improves the retention of the FLM film on the CHP chip.

[0120] Step 104 can be followed by a step of fixing SLD2 solder balls (not shown) on an FL2 face of the SUB plate opposite the FM mounting face to obtain the BT housing shown in [Fig.3].

[0121] Fig. 12 illustrates a step 105 of fixing the FLM film onto a part of the rear face FS1 of the CHP chip.

[0122] Step 105 is preferably carried out after a hot spot identification step (not shown) of the CHP chip and a FLM film fabrication step. The hot spot identification step of the CHP chip can be carried out by thermal simulation of the CHP chip in operation or by thermal sensors.

[0123] The FLM film fabrication step enables the design of an FLM film and its shaping to allow the FLM film to cover the hot spots of the CHP chip during the FLM film fixation step 105. The FLM film fixation can be carried out in a manner analogous to the fixation step 102 as described in relation to [Fig. 9].

[0124] Step 105 can be followed by a step of fixing SLD2 solder balls (not shown) on an FL2 face of the SUB plate opposite the FM mounting face and a step of fixing a heat sink (not shown) on the FLM film and the SUB plate to obtain the BT housing shown in [Fig.4].

[0125] Fig. 13 illustrates a step 106 of chemical vapor deposition of the FLM film as an alternative to steps 102 to 105 described previously in relation to Figures 9 to 12.

[0126] In particular, chemical vapor deposition makes it possible to form the FLM film, typically by sputtering, on the rear face FS1 and on the side faces EDG of the CHP chip.

[0127] Step 106 can also be carried out using a temporary MSK mask on the rear face FS1 and on the side faces EDG of the CHP chip.

[0128] In this way, the FLM film can be formed only on the part of the rear face FS1 and on the side faces EDG of the CHP chip which are not covered by the MSK mask.

[0129] Step 106 can be followed by a removal of the MSK mask, a step of fixing SLD2 solder balls (not shown) on an FL2 face of the SUB plate opposite the FM mounting face and a step of fixing a heat sink (not shown) on the FLM film and the SUB plate.

Claims

Demands

1. Integrated circuit package (BT) comprising: - a support plate (SUB) having a mounting face (FM), - an electronic chip (CHP) having a rear face (FS1) and a front face (FL1), the chip (CHP) being mounted on the mounting face (FM) such that the front face (FL1) is electrically connected to the mounting face (FM) of the support plate (SUB), and - a deformable thermally conductive film (FLM) configured to cover and be in contact with at least a portion of the rear face (FS1) of the chip (CHP), wherein the thermally conductive film (FLM) also covers at least a portion of the side face (EDG) of the electronic chip (CHP).

2. Housing according to claim 1, in which the thermally conductive film (FLM) is welded to at least a portion of the back face (FS1) of the chip (CHP).

3. Housing according to claim 1, in which the thermally conductive film (FLM) is fixed to at least a part of the rear face (FS1) of the chip (CHP) by an adhesive (GL).

4. Housing according to claim 3, wherein the support plate (SUB) includes an opening (FNT1) through the thickness of the support plate (SUB) to open onto the mounting face (FM), the thermally conductive film (FLM) further covering the mounting face (FM) and closing said opening (FNT1).

5. Housing according to any one of claims 1 to 4, comprising a molding resin (MLD) disposed on the mounting face (FM) of the support plate (SUB) such that the resin (MLD) encapsulates the chip (CHP) and uncovers the rear face (FS1) of the chip (CHP), the thermally conductive film (FLM) also being configured to cover a top face (FS2) of the molding resin (MLD).

6. Housing according to any one of the preceding claims, wherein the chip (CHP) is configured to exhibit hot spots (PC) emitting heat in operation, the thermally conductive film (FLM) being configured to cover the hot spots (PC) of the chip (CHP).

7. Housing according to any one of the preceding claims, wherein the film (FLM) has a thickness between 5 pm and 0.5 mm.

8. Housing according to any one of the preceding claims, wherein the thermally conductive film (LMF) is a metal.

9. Housing according to any one of the preceding claims, wherein the modulus of elasticity of the thermally conductive film (LMF) is between 105 and 100 GPa

10. Housing according to any one of the preceding claims, wherein the thermally conductive film (FLM) also covers the mounting face (FM) of the support plate (SUB) and is connected to thermally conductive elements (PAD, INTCNX, SLD2) of the support plate (SUB).

11. Housing according to any one of the preceding claims, comprising a component (COMP) mounted on the mounting face (FM) of the support plate (SUB), in which the thermally conductive film (FLM) also covers the mounting face (FM) of the support plate (SUB) and includes an opening (FNT2) suitable for containing the component (COMP).

12. Method of manufacturing an integrated circuit package (IC) comprising a support plate (SUB) having a mounting face (FM), the method comprising: - mounting on the mounting face (FM) of the support plate (SUB) an electronic chip (CHP) having a rear face (FS1) and a front face (FL1) such that the front face (FL1) is electrically connected to the mounting face (FM), - covering a portion of the rear face (FS1) of the chip (CHP) with a deformable thermally conductive film (FLM) such that the film (FLM) is in contact with the rear face (FS1) - covering a portion of the side face (EDG) of the electronic chip (CHP) with the thermally conductive film (FLM) at the same time as covering a portion of the rear face (FS1) with the film (FLM).

13. Method according to claim 12, wherein the covering of a portion of the back face (FS1) by the thermally conductive film (FLM) comprises a welding of the film (FLM) onto said portion of the back face (FS1) of the chip (CHP).

14. Method according to claim 12, wherein the covering of a part of the back face (FS1) by the thermally conductive film (FLM) comprises fixing the film (FLM) to at least a part of the back face (FS1) of the chip (CHP) by an adhesive (GL).

15. A method according to claim 14, comprising forming an opening (FNT1) through the thickness of the support plate (SUB) to open onto the mounting face (FM), wherein the fixing of the film (FLM) to at least a part of the rear face (FS1) is carried out by using the opening (FNT1) to create a gap between the film (FLM) and the support plate (SUB) so that the film (FLM) covers the mounting face (FM) and closes said opening (FNT1).

16. A method according to any one of claims 12 to 15, wherein the film (FLM) has a thickness between 5 pm and 0.5 mm.

17. A method according to any one of claims 12 to 16, wherein the thermally conductive film (LMF) is a metal.

18. A method according to any one of claims 12 to 17, wherein the modulus of elasticity of the thermally conductive film (FLM) is between 105 and 100 GPa.

19. A method according to claim 12, wherein the coating of a portion of the back face (FS1) by the thermally conductive film (FLM) comprises a chemical vapor deposition of the film (FLM) on at least a portion of the back face (FS1) of the chip (CHP).

20. A method according to any one of claims 12 to 18, comprising forming a molding resin (MLD) on the mounting face (FM) of the support plate (SUB) such that the molding resin (MLD) coats the chip (CHP) and exposes the back face (FS1), the thermally conductive film (FLM) covering a top face (FS2) of the molding resin (MLD).

21. A method according to any one of claims 12 to 20, comprising identification of hot spots (PC) of the chip (CHP) by thermal simulation of the chip (CHP) in operation, wherein the covering of a portion of the back face (FS1) by the thermally conductive film (FLM) is carried out such that the film (FLM) covers the hot spots (PC) of the chip (CHP).

22. A method according to any one of claims 12 to 21, further comprising a connection of the film (FLM) to thermally conductive elements (PAD, INTCNX, SLD2) of the support plate (SUB).

23. A method according to any one of claims 12 to 22, comprising mounting a component (COMP) on the mounting face (FM) of the support plate (SUB) and forming an opening (FNT2) in the thermally conductive film (FLM) so as that said opening (FNT2) contains the component (COMP) after said covering of a part of the rear face (FS1) by the thermally conductive film (FLM).

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