Microcircuit module intended to be mounted in a microcircuit board

Abstract

The present invention relates to a microcircuit module intended to be mounted in a microcircuit board, the module comprising a substrate, contact areas carried on the outer face of the substrate, the contact areas being arranged in two parallel series in a first direction of several contact areas, separated by a central zone, the contact areas being separated by gaps, a microcircuit carried on the inner face of the substrate, and electrically connected to the contact areas through the substrate, at least one electroluminescent component carried on the inner face of the substrate, characterized in that at least one portion of the gap has a width L greater than the reference width, this enlarged portion being positioned outside the theoretical bands, the electroluminescent component being positioned in the vicinity of the image zone of the portion of the gap,beyond the reference width applied to the portion of the gap. Abbreviated figure: [Fig. 2],

Description

Title of the invention: Microcircuit module for mounting in a microcircuit board

[0001] The present invention relates to a microcircuit module for mounting in a microcircuit card, as well as to a card comprising such a module. It relates more particularly to microcircuit cards used for so-called contact or contactless payments, the latter being carried out via communication between a bank reader terminal and an antenna of the microcircuit card.

[0002] To implement a contact transaction, the card includes a module comprising contact pads connected to a microcircuit on the card. The contact pads make contact with terminal pins to perform data exchange between the terminal and the card's microcircuit. To implement a contactless transaction between a card with a microcircuit and a bank terminal, it is known to position the card near the terminal so that the card and the terminal can communicate and exchange secure data to establish the payment protocol.

[0003] During a contact mode communication, i.e. by physical connection, in which the electronic document is inserted into the terminal's card reader, a user is generally notified, by a message displayed on a terminal screen, that the transaction has been completed and that the electronic document can be retrieved.

[0004] During contactless communication, in which the electronic document is only brought near the terminal, the document is generally positioned above the terminal screen and thus obscures the warning message. As a result, the user is no longer notified when the transaction is complete and may prematurely remove the electronic document.

[0005] The risk of removing the electronic document from the terminal prematurely before the end of the transaction is then high and results in a failure of the transaction.

[0006] To overcome this drawback, a card comprising at least one light source indicating a communication status between the terminal and the card is known from document EP2426627. For this purpose, the card includes a microcircuit module suitable for mounting in a cavity in the card body. This module includes a light source carried on an inner face of a module support. The light source is powered by an antenna located in the card body. Light is emitted when a current of predefined intensity flows through the antenna, i.e., when Near-field communication is established with an external contactless card reader. Thus, when a contactless transaction is in progress, the light source emits radiation indicating that the transaction is underway.

[0007] A card comprising a light-based means for indicating the status of a transaction is also known from document EP4033408. This means consists of an LED mounted inside the electronic module. The module is unique in that it has an opening on its upper surface, and more specifically on one of the module's contact areas, through which the light emitted by the light source is visible.

[0008] However, integrating the light source onto the module, particularly according to the arrangement described in patent EP4033408, can pose several problems. First, creating an opening on the top face of a module can lead to a risk of damage to the module's surface near the opening. Indeed, when the card is inserted into a reader, the terminal pins rub against the module's contact pads and deform the module's top face. In particular, the repeated passage of the pins over the opening, first in the direction of card insertion and then in the opposite direction during card removal, causes premature wear at the opening, with a risk of enlargement or deformation of its outline.

[0009] Furthermore, the arrangements of the external faces of the modules must meet constraints specified in the ISO 7810 standards, in particular to guarantee sufficient rigidity to support the passage of the reader pins, while exhibiting sufficient deformation properties to withstand torsion tests without risking sudden removal of the module mounted in the cavity of the card.

[0010] The invention aims to overcome these drawbacks by proposing a microcircuit module intended to be mounted in a microcircuit board, the module comprising a substrate of substantially rectangular shape having an outer face and an inner face, contact areas carried on the outer face of the substrate, the contact areas being formed by metal deposition on the substrate, the contact areas being arranged in two series parallel to a first direction of several contact areas, separated by a central zone, each contact area covering at least one theoretical contact area, the theoretical contact areas being arranged in two series parallel to the first direction of several theoretical contact areas, the theoretical contact areas being substantially identical and positioned symmetrically with respect to the first direction,two theoretical contact zones symmetrical with respect to the first direction defining a theoretical passage band for the pins of a terminal, the contact areas being separated by gaps extending substantially along the first direction and along a second, direction perpendicular to the first direction, the gaps having an initial reference width 1 devoid of metal, a microcircuit carried on the inner face of the substrate, and electrically connected with the contact areas through the substrate, at least one electroluminescent component carried on the inner face of the substrate, characterized in that at least one portion of gap has a width L greater than the reference width, this enlarged portion being positioned outside the theoretical bands, the electroluminescent component being positioned in the vicinity of the image area of ​​the portion of gap, beyond the reference width applied to the enlarged portion of gap.

[0011] Thanks to these provisions, it is possible to add electroluminescent components to the inner face of a module without increasing the fragility of this module or risking damage to the electroluminescent component.

[0012] Particularly simple, convenient and economical preferred features of the device according to the invention are presented below: The enlarged portion is formed on a gap created in the central zone and connecting two gaps delimiting two contact areas located substantially symmetrically with respect to the first direction. The electroluminescent component has an element emitting light radiation directed towards the enlarged portion of the gap, the element emitting the radiation is positioned partially under the enlarged portion of the gap, outside the reference width 1, in which the element emitting the radiation consists of a light source of a transparent hood diffusing the light, that the electroluminescent component is powered by the antenna, the ignition is controlled by the microcircuit.

[0013] The invention, according to an exemplary embodiment, will be better understood and its advantages will become more apparent upon reading the following detailed description, given by way of example and in no way limiting, with reference to the accompanying drawings in which:

[0014] Figure 1 shows a view of a card comprising a module according to the invention

[0015] Fig. 2 represents a view of the outer face of the module according to a first embodiment

[0016] Figure 3 shows a view similar to that of the claim of a second embodiment of the module

[0017] Figure 4 illustrates a detailed view of the module,

[0018] Fig. 5 illustrates a similar view of Fig. 4 according to a variant of realization,

[0019] Fig. 6 is a schematic cross-sectional view along direction AA of the [Fig.2],

[0020] The invention relates to ID-1 format cards conforming to the dimensional specifications provided for in particular by ISO 7810, as illustrated in [Fig. 1]. This standard defines the dimensions and tolerances that a card must meet, depending on its format, in order to cooperate properly by contact with all reading terminals designed for this purpose. Failure to comply with this standardized format can lead to significant problems during the interaction of the card with the reading terminal. Typically, a card that does not conform to ISO 7810 may not be detected by the reading terminal, may degrade its operation, or may not be read at all. The ID-1 format corresponds to a card delimited by a rectangular shape measuring 85.6 mm x 54 mm x 0.76 mm thick.

[0021] In addition, the constraints imposed by the ISO 7810 standard also limit the size and arrangement of the electronic components that are likely to be integrated on a card 10. In particular, this standard specifies the positioning constraints of a microcircuit module 12 mounted in the card body 10 and carrying a microcircuit 36, shown schematically in [Fig.6] and enabling contact mode communication between the microcircuit 36 ​​and the reader.

[0022] In addition to the constraints related to the physical structure of the card 10, there are also constraints related to the resistance of the card 10. For this purpose, the card 10 must remain compliant with the ISO7810 standards specifying the various torsion and elastic deformation tests which the card 10 must withstand.

[0023] The present invention proposes a new module 12 adapted to meet the requirements specified in the standards. The module 12 according to the invention will be described initially with reference to Figures 2 to 3. For clarity of the drawings, not all reference numerals shown in one of the figures are shown in the other, although Figures 2 and 3 illustrate two identical modules 12, except for a gap which will be described in more detail later. Except for this difference, the reference numerals in [Fig. 2] apply equally to [Fig. 3] and vice versa.

[0024] As shown in Figures 2 to 3, the module 12 comprises a dielectric substrate 16, generally rectangular in shape, having an outer face flush with a surface of the board 10 and an inner face. For better illustration, the substrate 16 in Figures 2 and 3 is shown larger than the contact areas 14. In reality, the substrate 16 and the contact areas 14 have a similar outline. The module 12 further comprises individual contact areas 14 or surfaces connected to a microcircuit 36 ​​mounted on the inner face of the module 12. The inner face of the module may also include capacitors 38 for managing the power supply of the microcircuit 36 ​​or other microcircuits, as illustrated in [Fig. 6]. The contact pads 14, located on the outer face of the substrate 16, are formed by depositing metal onto the substrate 16 using chemical etching techniques known to those skilled in the art. These contact pads 14 are designed to provide the electrical connection between the microcircuit 36 ​​and an external terminal, such as a bank terminal.

[0025] The microcircuit 36 ​​is carried on the inner face of the substrate 16, and is electrically connected with the contact areas 14 through the substrate 16 for example by gold wires not shown in the figures.

[0026] As can be seen in Figures 2 and 3, the contact areas 14 are arranged in two parallel series along a first direction 18 of several contact areas 14. Figures 2 and 3 illustrate two series of three contact areas 14. Other modules, not shown, comprise two series of four contact areas 14. The six or eight contact areas 14 are commonly designated by the names C1 to C6 (or C8). In Figures 1 to 3, a first series 14a, 14b, 14c, forming a first column, comprises the contact areas 14 C1 to C3, and a second series 14d, 14e, 14f, forming a second column parallel to the first column, comprises the contact areas 14 C4 to C6. The two sets of contact area are separated by a central area 20 which is also covered with metal and separated from part of the contact areas 14 by gaps 22.

[0027] For information purposes, contact areas 14 Cl and C5 are used for the power supply: C1 VCC (Supply Voltage) and C5 GND (Ground); contact area C2, also called RST, is used for resetting the chip; contact area C3, also called CLK, is used for the chip clock; contact area C7, also called I / O, is used for the chip information inputs and outputs.

[0028] Contact surfaces C4, C6, and C8 are intended for so-called "reserved" contacts, which have no particular functions. Today, these contacts C4 and C8 can be used for USB ports, and contact C6 for the SWP ("Single Wire Protocol") communication protocol.

[0029] ISO 7816 defines theoretical contact areas 24, namely the dimensions of the minimum areas of these pads 14, i.e., 2 mm wide and 1.7 mm high. ISO 7816 also defines their relative locations with respect to the edges of the card 10.

[0030] The theoretical contact zones 24 are arranged in two series parallel to the first direction 18. The two series of theoretical zones 24 are substantially identical and positioned symmetrically with respect to the first direction 18.

[0031] Since these theoretical areas 24 are minimal, it is necessary that each contact area cover a theoretical contact area as defined in ISO 7816. Indeed, two theoretical contact areas 24 symmetrical with respect to the first direction 18 define a theoretical band 26 for the passage of the pins of a terminal.

[0032] The contact areas 14 are separated by gaps 22 extending substantially along the first direction 18 and along a second direction perpendicular to the first. The gaps 22 have an initial reference width 1 free of metal. The gaps 22 correspond to very thin areas of the dielectric substrate 16 of the module 12 free of metal. The gaps 22 thus allow for the electrical isolation of two contact areas 14.

[0033] As mentioned in the preamble, microcircuit boards must meet certain standards regarding their elastic deformation properties and must be able to withstand torsional or deformational stresses, the parameters of which are specified in said standards. The modules integrated into these boards are therefore subjected simultaneously to these torsional stresses applied in both directions of the board 10. The module 12 absorbs a portion of the applied stresses thanks to the gaps 22 formed by non-metallized lines, which are therefore less rigid than metallized surfaces. This makes it possible to prevent the module 12 from being pulled out of the cavity in which it is mounted when the board 10 is deformed.

[0034] The card 10 according to the invention further comprises an antenna for establishing contactless communication with the reader, at a predefined communication frequency, such as 13.56 MHz as defined by ISO14443. The antenna and the microcircuit 36 ​​of the module 12 are traditionally electrically connected by means of metallic parts and a conductive adhesive, or conductive paste, during the insertion of the module 12.

[0035] The card 10 according to the invention also includes an electroluminescent component 28. This electroluminescent component 28 is a light source, such as a light-emitting diode (LED). The electroluminescent component 28 is located on the inner surface of the substrate 16 of the module 12 and allows the module 12 to be backlit when it is powered via the antenna. Thus, when the card 10 is used in contactless mode, the electroluminescent component 28 is activated and emits light through the substrate 16 of the module 12.

[0036] The electroluminescent component 28 is a rigid or semi-rigid component that is liable to break or disconnect when subjected to mechanical deformation. It is therefore important that the electroluminescent component 28 not be positioned at the gaps 22 forming the deformation lines of the module 12. However, the light emitted by the component is diffused through these interstices 22 are devoid of metal since the metal is completely opaque and does not allow light rays to pass through, whereas the dielectric substrate 16 of the module 12 allows the radiation from the electroluminescent component 28 to pass through. It is therefore necessary to optimize the positioning of the electroluminescent component 28 relative to the interstices 22 to meet the two conditions stated above.

[0037] In order to meet these two conditions, the present invention proposes to provide at least one portion of the gap 30 with a width L greater than the reference width 1 and that this enlarged portion 30 be positioned outside the theoretical strips 26 for the passage of the reader pins. This arrangement is visible in [Fig. 2].

[0038] According to one variant, illustrated by [Fig.3], module 12 comprises two enlarged portions 30.

[0039] Thanks to these arrangements, the module 12 has an enlarged gap portion 30 through which light is diffused. The enlarged portion 30 is then formed of a part of reference width 1 and a secondary part called enlargement e, so that l+e=L.

[0040] Furthermore, according to the invention, the electroluminescent component 28 is positioned in the vicinity of the image area of ​​the enlarged interstice portion 30, that is to say in the vicinity of the projection of the enlarged interstice portion 30 onto the inner face of the module 12. The proximity of the electroluminescent component 28 with the enlarged interstice portion 30 ensures that a large part of the radiation is emitted in the vicinity of the enlarged interstice portion 30 and thus diffused through said enlarged interstice portion 30.

[0041] In order to protect the electroluminescent component 28, the latter is positioned in the vicinity of the enlarged portion 30 of the gap, but outside the part of the reference width 1. This prevents the component from being positioned on the deformation lines of the module 12 and being subjected to strong mechanical stresses.

[0042] According to an embodiment illustrated in [Fig. 4], the electroluminescent component 28 is positioned so that the light source diffusing the light is positioned opposite the enlargement e, beyond the reference width 1 applied to the enlarged portion 30 L of the gap. According to another embodiment, illustrated in [Fig. 5], the electroluminescent component 28 is positioned below the contact area delimiting the enlargement e, the component then being protected from deformation by the rigid metallic contact area.

[0043] Thanks to these arrangements, there is no creation of new areas devoid of metal in the theoretical bands 26 of passage of the metal pins and the solution allows the light emitted by the electroluminescent component 28 to be diffused without increasing the fragility of the module 12.

[0044] The enlarged portion 30 of the gap advantageously has a width equal to twice the reference width 1.

[0045] Advantageously, the enlarged gap portion 30 is formed in the central zone 20 connecting two gaps 22 delimiting two contact areas 14 located substantially symmetrically with respect to the first direction 18. This is illustrated in Figures 2 and 3. The enlarged gap portion 30 is thus positioned in the central zone 20 separating the two sets of contact areas. This central zone 20 is mostly covered with metal and is therefore more rigid and less subject to deformation. The electroluminescent component 28 positioned near the enlarged gap portion 30 can therefore be positioned under this central zone 20 and thus protected from deformations applied to the board 10.

[0046] The electroluminescent component 28 comprises a light-emitting element 32 and a connection means 34 for the microcircuit 36 ​​or the antenna that powers the component when a current flows through the antenna. According to the invention, the light-emitting element 32 is oriented towards the enlarged portion 30 of the gap. Thus, the radiation is directed directly towards the enlarged portion 30 of the gap to optimize the illumination of said enlarged portion 30. These arrangements are visible in Figures 2 and 3, in which the light-emitting element 32 is positioned laterally by means of the connection 34.

[0047] According to one embodiment, the light-emitting element 32 is positioned partially under the enlarged portion 30 of the gap to maximize the radiation projected under the enlarged portion 30 of the gap. According to the invention, the light-emitting element 32 of the electroluminescent component 28 is positioned outside the portion of the gap with reference width 1.

[0048] The element 32 emitting the light radiation consists of a light source covered with a transparent hood diffusing the light towards a determined direction, namely the enlarged portion 30 of the gap.

[0049] As indicated in the preamble to the description, the module 12 according to the invention is integrated into a microcircuit board 10. This microcircuit board 10 includes an antenna adapted to power the electroluminescent component 28. For this purpose, the component is electrically connected to the antenna. Light is emitted when a current of predefined intensity flows through the antenna, that is, when near-field communication is established with an external contactless card reader 10. Thus, when a contactless transaction is in progress, the light source emits radiation indicating that the transaction is in progress. According to an embodiment, the electroluminescent component 28 is connected to the microcircuit 36 ​​of the module 12 so that the component's illumination electroluminescent 28 is controlled by the microcircuit 36 ​​according to a scenario pre-recorded in the microcircuit.

Claims

1. Demands 1. A microcircuit module (12) intended to be mounted in a microcircuit board, the module (12) comprising a substrate (16) of substantially rectangular shape having an outer face and an inner face, contact areas (14) carried on the outer face of the substrate (16), the contact areas (14) being formed by metal deposition on the substrate (16), the contact areas (14) being arranged in two series parallel to a first direction (18) of several contact areas (14), separated by a central area (20), Each contact area covering at least one theoretical contact area, the theoretical contact areas (24) being arranged in two series parallel to the first direction (18) of several theoretical contact areas (24), the theoretical contact areas (24) being substantially identical and positioned symmetrically with respect to the first direction (18), two theoretical contact areas (24) symmetrical with respect to the first direction (18) defining a theoretical strip (26) for the passage of the pins of a terminal, the contact areas (14) being separated by gaps (22) extending substantially along the first direction (18) and along a second direction perpendicular to the first direction, the gaps (22) having an initial reference width 1 free of metal, a microcircuit carried on the inner face of the substrate (16), and electrically connected with the contact areas (14) through the substrate (16),at least one electroluminescent component (28) carried on the inner face of the substrate (16), characterized in that, at least one portion (30) of gap has a width L greater than the reference width 1, this enlarged portion (30) of gap being positioned outside the theoretical bands (26), the electroluminescent component (28) being positioned in the vicinity of the image area of ​​the enlarged portion (30) of gap, beyond the reference width 1 applied to the enlarged portion (30) of gap.

2. Microcircuit module (12) according to claim 1, wherein the enlarged portion (30) is formed on a gap formed in the central area (20) and connecting two gaps (22) delimiting two contact areas (14) situated substantially symmetrically with respect to the first direction (18).

3. Microcircuit module (12) according to claim 1 or 2, wherein the electroluminescent component (28) has an element (32) emitting light radiation directed towards the enlarged portion (30) of gap.

4. Microcircuit module (12) according to claim 3, wherein the radiation-emitting element (32) is positioned partially under the enlarged portion (30) of gap, outside the reference width 1.

5. Microcircuit module 12 according to any one of the preceding claims, wherein the radiation-emitting element (32) consists of a light source and a transparent hood diffusing the light.

6. Microcircuit card comprising an antenna and a microcircuit module (12) according to the invention, characterized in that the electroluminescent component (28) is powered by the antenna.

7. Microcircuit board according to the preceding claim, wherein the ignition is controlled by the microcircuit.

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