Method for manufacturing electronic components with wettable flanks

Abstract

Method for manufacturing electronic components with wettable flanks. This description relates to a method comprising the following steps: a) providing a substrate (300) in which chips (100) are formed, with connection pads (107) arranged on the substrate (300), and conductive pads (117) that can cover the connection pads (107); b) forming cavities (307) between the chips (100); c) depositing a layer of insulating material (121) on the substrate (300) and in the cavities (307); d) making the connection pads (107) or the conductive pads (117) accessible; e) depositing a layer of conductive material (122) to connect the connection pads of two adjacent chips; f) depositing an additional layer of insulating material (123); g) thinning the additional layer (123) until the conductive material (122) is accessible; h) separating the electronic components (1000). through the cavities (307),whereby the conductive material (122) forms the wettable flanks of the electronic components (1000). Figure for the abbreviation: Fig. 1H,

Description

Title of the invention: Method for manufacturing electronic components with wettable flanks. Technical field

[0001] This description relates to the manufacture of electronic components with wettable sides. It focuses more particularly on the manufacture of so-called surface-mount, or "leadless," components, meaning those with no visible connections once assembled on the electronic board. These components have, on at least one side, one or more metallized connection pads intended to be soldered to corresponding connection pads of an external device, for example, a printed circuit board or another component. Previous technique

[0002] In certain applications, there is a need for surface-mount components in which metallizations for connections intended to be soldered to an external device extend to the component flanks. These are referred to as wettable flank components. When the component is mounted in its environment (for example, on a printed circuit board), the metallizations for connections (also called electrical contacts) are soldered or brazed to corresponding metallic tracks or elements on the printed circuit board side. Some of the solder material then extends up the component flanks, allowing for visual inspection of the connection quality.

[0003] This need exists for example in the automotive or medical fields and, more generally, in fields where it is necessary to ensure the correct assembly of components whose connections are not visible (the connections are under the component) and to guarantee the reliability of electrical connections, once the circuits are mounted in their environment (so-called 'flip-chip' technology). Summary of the invention

[0004] There is a need to improve at least in part certain aspects of known processes for manufacturing electronic components with wettable flanks.

[0005] This goal is achieved by a method for manufacturing electronic components with wettable flanks including the following steps: a) provide a substrate in which chips are formed, with chip connection pads arranged on an upper face of the substrate, and conductive pads that can cover the connection pads, b) form cavities or trenches between the chips from the upper surface of the substrate, c) form a first layer of insulating material on the substrate, the first layer of insulating material filling the cavities or trenches and covering the upper surface of the substrate, d) make the connection areas or conductive pads accessible, e) deposit a layer of conductive material so as to cover the cavities or trenches and to connect the connection pads of two adjacent chips, f) deposit a second layer of insulating material on the conductive material and the top surface of the substrate, (g) Thin the second layer of insulating material until the conductive material is accessible, h) separate the chips by cutting through the layer of conductive material and through the cavities or trenches, thereby obtaining electronic components with wettable sides.

[0006] According to one embodiment, in step a), the connection areas are covered by conductive pads, and in the process: - Step c) is carried out by depositing the first layer of insulating material on the upper surface of the substrate and on the conductive pads, - step d) is carried out by thinning the first layer of insulating material until the conductive pads are accessible, and - during step e), the layer of conductive material is deposited on the conductive pads.

[0007] According to one embodiment, in step a), the connection areas are not covered by conductive pads and in the process: - Step c) is carried out by depositing the first layer of insulating material on the upper surface of the substrate and on the connection pads, - step d) is carried out by engraving, and possibly thinning, the first layer of insulating material, to make the connection areas accessible, and - during step e), the layer of conductive material is deposited on the connection areas.

[0008] According to one embodiment, before step g), a step in which a lower face of the substrate is thinned and covered with an additional layer of insulating material.

[0009] According to one embodiment, the first layer of insulating material and / or the second layer of insulating material and / or the additional layer of insulating material are layers of insulating resin, for example layers of epoxy resin.

[0010] This goal is also achieved by an electronic component with wettable flanks comprising a chip formed in a substrate, the chip comprising connection areas arranged on a top face of the substrate, a first layer of insulating material covering the flanks of the substrate and the top face of the substrate between the connection areas, a second layer of insulating material covering the first layer of insulating material on the top face of the substrate, a layer of conductive material being arranged on each connection area and extending, on the one hand, to a top face of the electronic component, and, on the other hand, to a flank of the electronic component.

[0011] According to one embodiment, an additional layer of insulating material covers an underside of the substrate.

[0012] According to one embodiment, the first layer of insulating material, the second layer of insulating material and / or the additional layer of insulating material is a layer of epoxy or phenolic resin in which electrically insulating charges are dispersed, for example particles of alumina or silica.

[0013] According to one embodiment, the conductive material layer is a brazable material layer, for example a tin-based brazable material, such as SnAgCu.

[0014] This goal is also achieved by a method of assembling an electronic component as defined above with an external device, such as a printed circuit board, the method comprising the following steps: - Position a soldering material between the conductive material positioned on the top face of the electronic component and the connection elements of the external device, - braze the brazing material, whereby the brazing material spreads onto the connecting elements of the external device and onto the wettable sides of the electronic component.

[0015] This goal is also achieved by the use of such an electronic component with wettable sides in an automobile, for example in an advanced driver assistance system, in personal electronics, in communication equipment, such as a computer, a mobile phone ('smartphone'), a connected object (LoT) or one of their peripherals.

[0016] This goal is also achieved by an automobile, a communication device, such as a computer, a mobile phone ('smartphone'), a connected object (loT) or one of their peripherals comprising such an electronic component with wettable sides. Brief description of the drawings

[0017] These features and advantages, as well as others, will be described in detail in the following description of particular embodiments, given by way of non-limiting example, in relation to the accompanying figures, among which:

[0018] [Fig.1A], [Fig.1B], [Fig.1C], [Fig.1D], [Fig.1E], [Fig.1F], [Fig.1G], [Fig.1H] and [Fig. II] represent cross-sectional views illustrating steps in a manufacturing process for an electronic component with wettable flanks according to a particular embodiment;

[0019] [Fig.2A], [Fig.2B], [Fig.2C], [Fig.2D], [Fig.2E], [Fig.2F], [Fig.2G], [Fig.2H] and [Fig.2I] represent cross-sectional views illustrating steps in a manufacturing process for an electronic component with wettable sides according to another particular embodiment;

[0020] Fig. 3A and Fig. 3B represent cross-sectional views illustrating steps of a process for assembling an electronic component with wettable flanks with an external device according to a particular embodiment. Description of the implementation methods

[0021] The same elements have been designated by the same reference numerals in the different figures. In particular, the structural and / or functional elements common to the different embodiments may have the same reference numerals and may have identical structural, dimensional and material properties.

[0022] For the sake of clarity, only the steps and elements useful for understanding the described embodiments have been represented and are detailed.

[0023] Unless otherwise specified, when referring to two elements connected together, this means directly connected without intermediate elements other than conductors, and when referring to two elements connected (in English "coupled") together, this means that these two elements can be connected or linked through one or more other elements.

[0024] In the following description, when reference is made to absolute position qualifiers, such as the terms "front", "back", "top", "bottom", "left", "right", etc., or relative position qualifiers, such as the terms "above", "below", "superior", "inferior", etc., or to orientation qualifiers, such as the terms "horizontal", "vertical", etc., reference is made, unless otherwise specified, to the orientation of the figures.

[0025] Unless otherwise specified, the expressions "approximately", "roughly", and "in the order of" mean within 10%, preferably within 5%.

[0026] We will now describe in more detail the manufacturing process of an electronic component 1000 with wettable flanks by referring to figures IA to II and 2A to 21.

[0027] The process comprises at least the following steps: a) provide a substrate 300 in which chips 100 are formed, the chips 100 having connection areas 107 arranged on an upper face 305 of the substrate 300, conductive pads 117 able to cover the connection areas 107 (figure 1 A, 2A), b) form cavities 307 or trenches between the chips 100 (Figures IC, 2B), c) form a first layer of insulating material 121 so as to fill the cavities 307 or the trenches with insulating material and cover the upper face 305 of the substrate 300 between the connection areas 107 (Figures 1D, 2C), d) make accessible the connection areas 107 or the conductive pads 117 (figure 1E, 2D), e) deposit a layer of conductive material 122 so as to cover the cavities 307 or the trenches, and in particular so as to cover the insulating material filling the cavities 307 or the trenches, and to connect the connection areas 107 of two adjacent chips 100 (figures 1F, 2F), f) deposit a second layer of insulating material 123 on the conductive material 122 and on the upper face 305 of the substrate 300 (figures IG, 2G), g) thin the second layer of insulating material 123 until the conductive material 122 is accessible (figures 1H, 2H), h) separate the chips 100 to form the electronic components 1000, by cutting through the layer of conductive material 122 and through the cavity 307 or the trench, whereby the conductive material 122 forms the wettable flanks of the electronic components 1000 (figures II, 21).

[0028] The layer of conductive material 122 deposited in step d) forms a conductive material bridge between two adjacent chips. This bridge connects two connection areas 107 of two adjacent chips 100.

[0029] When this bridge is cut during step e), the material forms part of the flanks of the electronic components 1000. This gives rise to components 1000 with wettable flanks.

[0030] With such a process, the portion forming the wettable side has a height that can be easily adapted according to the thickness of the deposited conductive material 122. It is possible to have wettable portions with a height of at least 100 µm.

[0031] The presence of the first layer of insulating material 121 between the conductive material 122 and the chip 100 prevents the risk of short circuits. Furthermore, the presence of this material in the cavities prevents the conductive material from sagging during cutting. The resulting device exhibits good mechanical strength.

[0032] The process may further include, before step h), a step in which the rear face of the substrate 300 is thinned and covered with an additional layer of insulating material 124.

[0033] In step c), the first layer of insulating material 121 is preferably deposited as a full sheet on the upper surface 305 of the substrate 300 and then structured. The insulating material fills the cavities 307 and covers the upper surface 305 of the substrate 300 between the connection areas 107.

[0034] According to a first embodiment, the substrate 300 supplied in step a) includes conductive pads 117 covering the connection areas 107.

[0035] According to this first embodiment, for example shown in Figures IA to II, the process may comprise at least the following steps: a) supplying the substrate 300 in which the chips 100 are formed, the connection pads 107 being arranged on the upper surface of the substrate 300 ([Fig. 1A]), - covering the connection pads 107 with conductive pads 117 ('wafer bumping') ([Fig. 1B]), b) forming the cavities 307 or the trenches between the chips 100 ([Fig. 1C]), c) filling the cavities 307 or the trenches with the first layer of insulating material 121, the first layer of insulating material 121 covering the upper surface of the substrate 300 and the conductive pads 117 ([Fig. 1D]), d) thinning the first layer of insulating material 121 until a portion of the conductive pads 117 is accessible ([Fig.(lE]), e) deposit the layer of conductive material 122 so as to cover the cavities 307 or the trenches and to connect the connection pads 107 of two adjacent chips 100, the layer of conductive material 122 being in contact with the conductive pads 117 ([Fig.1F]), f) deposit a second layer of insulating material 123 on the conductive material 122 ([Fig.1G]), g) thin the second layer of insulating material 132, from the front face, until the conductive material 122 is accessible ([Fig.1H]), h) separate the chips 100 by cutting through the layer of conductive material 122 and through the cavities 307 or the trenches, thereby the conductive material 122 forming the wettable flanks of the electronic components 1000 ([Fig.II]).

[0036] According to a second embodiment, during step a), the connection areas 107 are not covered by conductive pads.

[0037] According to this second embodiment, the process may comprise the following steps: a) provide the substrate 300 in which the chips 100 are formed, the connection areas 107 being arranged on the upper face 305 of the substrate 300 ([Fig.1A]), b) form the cavities 307 or the trenches between the chips 100 ([Fig.2B]), c) fill the cavities 307 or the trenches with the first layer of insulating material 121, the first layer of insulating material 121 covering the upper face of the substrate 300 and the connection areas 107 ([Fig.2C]), d) make the connection areas 107 accessible, for example by laser engraving, and possibly by thinning the front face ([Fig.2E]), e) deposit the layer of conductive material 122 so as to cover the cavities 307 and to connect the connection areas 107 of two adjacent chips 100 ([Fig. 2F]), f) deposit a second layer of insulating material 123 on the conductive material 122 (Figure 2G), (g) thin the second layer of insulating material 123, from the front face, until the conductive material 122 is accessible (Figure 2H), h) separate the chips 100 by cutting through the layer of conductive material 122 and through the cavities 307 or trenches, whereby the conductive material 122 forms the wettable flanks of the electronic components 1000 ([Fig.2I]).

[0038] We will now describe in more detail the different elements and steps of the different variants of the manufacturing process of the 1000 electronic component with wettable sides.

[0039] The basic structure provided in step a) comprises an electronic chip 100 formed from a semiconductor substrate 300, for example silicon. It may also be SiC, glass, GaN, or sapphire.

[0040] The substrate 300 has, for example, a thickness between 300 and 900 pm, for example a thickness of about 725 pm.

[0041] The substrate 300 comprises a first face 305 (upper face or front face) and a second face 303 (rear face or lower face).

[0042] The chip 100 is formed on the front side 305 of the substrate 300.

[0043] The chip 100 may comprise one discrete component or several components Discrete. The discrete component(s) are chosen, for example, from transistors, diodes, filters, etc. The 100 chip can include one or more electronic circuits. The 100 chip allows for the implementation of various electronic functions.

[0044] In step a), the fabrication of the discrete component(s) and / or integrated circuit(s) forming the components 1000 is completed. The chips 100 are formed in the same substrate 300, and have not yet been individualized.

[0045] One or more connection areas 107 are formed on the upper face 305 of the substrate 300 to connect the chip 100 to external elements / devices 400 (chips or electronic devices).

[0046] The electrical connection pads 107 are also called "UBM" (from the Anglo-Saxon expression "Under Bump Metallization") or "bumping pads". The electrical connection pads 107 are made of a specifically conductive material adapted to receive conductive pads 117, and exhibiting in particular good adhesion with the conductive pads 117. The electrical connection areas 107 comprise at least one of the following elements: gold, titanium, nickel, or copper. Preferably, they comprise gold.

[0047] The electrical connection pads 107 are, for example, at a distance of 10 to 30 pm from the side wall of the chip. The electrical connection pads 107 can be positioned on the upper face 305 of the substrate 300 or be flush with the upper face 305 of the substrate 300 (i.e., reach the level of the upper face 305).

[0048] During step a), the connection areas 107 may have a free upper surface (i.e. not covered, as shown in [Fig.2A]) or they may be covered by conductive pads 117 (as shown in [Fig.1B]).

[0049] The conductive studs 117 may in particular have the shape of a ball (or "bump" in Anglo-Saxon terms). Alternatively, they may be a conductive element having another shape, such as a pillar or a cube.

[0050] The conductive pads 117 are formed from an electrically conductive and "wettable" (i.e. brazable or weldable) material, that is to say, a material on which it is possible to carry out brazing.

[0051] The conductive pads 117 are advantageously brazed onto the electrical connection areas 107. For example, the conductive pads are made of a brazable material generally based on tin, typically SnAgCu.

[0052] At this stage, the chip 100 is not yet protected by a housing made of insulating material.

[0053] During step b), cavities 307 or trenches (not shown) are formed, in the substrate 300, so as to separate the adjacent chips 100. The cavities 307 or trenches delimit the sides 304 of the substrate 300 for each component 1000.

[0054] The cavities 307 defining the lateral contours of the chips 100 of the components 100 are formed in the substrate 300. The cavities 307 extend from the upper face 305 of the substrate 300. For example, the depth of the cavities 307 corresponds to the desired thickness of the chips of the components 100. For example, the depth of the cavities 307 is on the order of 100 or 300 µm. The depth can be modified according to the desired application. The cavities 307 formed in step b) preferably have a thickness between 50 and 80 µm. The thickness can be modified according to the desired application.

[0055] The trenches pass completely through the substrate. The trenches 120 define the lateral contours of the chips 100. The width of the trenches is, for example, between 20 and 80 µm.

[0056] Step b) can be carried out by means of a partial or total cutting / engraving step of the substrate. This step can be carried out using a cutting or engraving device. The cutting device is, for example, an engraving tool. Mechanical cutting tools such as saws, or laser or plasma engraving tools. Cutting can be done with one or two blades.

[0057] According to another embodiment, this may involve laser cutting ('laser grooving' or 'laser dicing') or plasma cutting ('plasma dicing'). These different cutting processes can also be used in combination.

[0058] The formation of the space 307 between the chips 100 can also be achieved by a laser dislocation cutting step (the so-called 'stealth dicking' step) followed by an expansion step. The 'stealth dicking' step consists of using a specific laser to generate dislocations within the substrate, in the cutting paths. These dislocations are defects present in the thickness of the substrate which, under the effect of mechanical stress, will allow the chips to be separated. It is then simply a matter of stretching the adhesive backing to separate the chips and proceed with the deposition of the material.

[0059] In the present case, the substrate 300 can be brought to the final thickness of the product before the 'stealth dicing' operation.

[0060] During step c), the cavities 307 or the trenches are filled with a first layer of insulating material 121.

[0061] The first layer of insulating material 121 can also cover the upper face of the substrate 300.

[0062] To this end, a layer 121 of insulating material is deposited in the cavities 307 on the first face 305 of the substrate 300. The first layer of insulating material 121 covers the connection pads 107 and, where applicable, the conductive pads 117. These latter elements are, at the end of step c), arranged within the insulating material. The first layer 121 forms a first part of the component housing 1000. This first part of the housing thus protects the upper face of the components 1000.

[0063] The insulating material can be deposited using a press or by vacuum molding.

[0064] The insulating material may include an electrically insulating resin. This may be a thermosetting resin or a thermoplastic resin. The material will be chosen so as not to be fusible within the operating temperature range of the electronic components. The resin may be chosen from the group comprising: epoxy resins, phenolic resins, and acrylic resins.

[0065] The insulating material may also include electrically insulating particles. The particles are, for example, oxide particles, and in particular alumina or silica particles.

[0066] Polymerization is, for example, a UV polymerization step or a thermal activation polymerization.

[0067] Annealing can be carried out after step c).

[0068] During step d), according to the first embodiment, part of the first layer of insulating material 121 is removed so as to make the conductive pads 117 accessible. This step can be carried out by means of a thinning step of the insulating material 121 on the front face.

[0069] In step d), according to the second embodiment, a portion of the first layer of insulating material 121 is removed to make the connection areas 107 accessible. This step can be carried out by means of a laser engraving step and optionally by means of a thinning step of the insulating material 121 on the front face. The two steps (thinning and engraving) can be carried out in that order or in reverse order.

[0070] Laser engraving leads to the formation of openings in the first layer of insulating material 121 in the form of truncated cones ([Fig.2D]).

[0071] The thinning on the front face, implemented during step d), can be carried out by polishing ('grinding').

[0072] In step e), a layer of conductive material 122 is deposited on the layer of insulating material 121. The layer of conductive material 122 is deposited so as to connect the connection areas 107 of two adjacent chips 100. The conductive material 122 forms a bridge (or junction) between the chips.

[0073] The conductive material 122 can be in direct contact with the connection areas 107 or connected to the connection areas 107 via the conductive pads 117.

[0074] The conductive material 122 is, for example, a brazable (or solderable) material. In particular, it is tin or a tin-based alloy, such as SnAgCu. It may also be a lead alloy or an antimony alloy.

[0075] The conductive material 122 can be used with a soldering flux.

[0076] This material can be deposited by spreading a paste, for example by screen printing through a stencil whose openings are positioned opposite the connection areas and the joint to be made. The stencil is, for example, a sheet of stainless steel or nickel provided with openings.

[0077] The brazable conductive material can be welded onto the connection ranges 107 or, where appropriate, onto the conductive pads 117.

[0078] During step f), a second layer of insulating material 123 is deposited on the conductive material 122 and on the front face of the chips 100.

[0079] The first layer of insulating material 121 and the second layer of insulating material 123 may be made of the same material. For example, it may be an insulating resin, such as one of those described previously.

[0080] A thinning step on the front face is then carried out to make the conductive material 122 accessible (step g)). This material 122 forms, on the front face, the electrical contacts (also called connection metallizations) of the housing of the 1000 components. The electrical contacts on the front panel allow the chip to be connected to external elements 400.

[0081] Thinning can be carried out until the desired height of conductive material is reached.

[0082] The thinning step on the front face can be carried out by polishing ('grinding').

[0083] The process may also include a step of thinning the substrate 300 on its rear face 303. For this, the structure is turned over and fixed by its front face 305 to a support. The support is, for example, a strip of adhesive tape. The structure is then thinned from its rear face 303 so that the substrate 300 has its final thickness. In one example, the structure 301 is thinned until it reaches the bottom of the cavities 307.

[0084] The method may advantageously include an additional step in which an additional insulating layer 124 is deposited on the rear face 303 of the structure to form the rear portion of the component housing 1000. Thus, all faces of the substrate 300 are protected. The first insulating layer 121 forms the sides of the housing and at least part of the front face of the housing. The additional layer 124 forms the rear portion of the housing. The second insulating layer 123 forms another portion of the front face of the housing.

[0085] The additional insulating layer 124 is a layer made of an electrically insulating material. The insulating material of the additional layer 124 may be identical to the insulating material of the first layer 121 and / or the insulating material of the second layer 123. In another example, the materials of the insulating layers 121, 123, and 124 are different. The additional insulating layer 124 is, for example, a resin layer.

[0086] During step h), the electronic components 1000 are individualized by making a cut through the conductive material 122 and the first layer of insulating resin 121. The cut is made in the cavities 307 or in the trenches.

[0087] The components 1000 are thus separated from each other.

[0088] The conductive material 122 is then exposed, ensuring the wettability function of the flanks of the electronic components 1000.

[0089] The conductive material 122 also allows for direct resumption of contact on the front face of the housing, as it is connected to the electrical connection areas 107 of the chip 100.

[0090] During the steps described above, and in particular during the cutting steps, the structure can be positioned on an adhesive. The adhesive used can be an ultraviolet (UV) sensitive adhesive for cutting applications ('UV cutting tape').

[0091] Figures II, 21 and 3A illustrate, by a partial and schematic cross-sectional view, an electronic component 1000 with wettable flanks obtained by such a process.

[0092] The electronic component 1000 comprises an electronic chip 100, formed in a substrate 300, and a housing made of insulating material protecting the chip 100.

[0093] The housing includes at least a first layer 121 of insulating material covering the sides of the substrate 300 and part of the upper face 305 of the substrate 300. It may further include a second layer 123 of insulating material covering the part of the first layer 121 positioned on the upper face 305 of the substrate 300 and / or an additional layer 124 of insulating material covering the rear face 303 of the substrate 300.

[0094] The conductive material forms, on the one hand, the wettable sides of the housing and, on the other hand, the metallizations on the front face of the housing. The conductive material is, for example, embedded in the housing. It is connected or attached either directly to the connection pads 107 or to the metal studs 117 positioned on the connection pads 107. It extends through the first insulating layer 121, and where applicable through the second insulating layer 123, to the top face of the housing (to allow connection of the chip 100 to an external element / device 400) and, on the other hand, to the sides of the housing to form the wettable sides of the housing.

[0095] The conductive material layer 122 is not in direct contact with the substrate 300. The first insulating material layer 121 is positioned between the substrate 300 and the conductive material layer 122.

[0096] Component 1000 is a so-called integrated component.

[0097] The components 1000 obtained are surface mount components (or SMD for "surface mounting device") of the "flip-chip" type, that is to say that they can be fixed on an external element / device 400, for example, a printed circuit board, by their upper face, that is to say the face on which the contacts of the housing are arranged.

[0098] Such components 1000 are particularly useful for ensuring the reliability of electrical connections once the circuits are mounted in their environment. They allow for easy visualization of whether the soldering of component 1000 to another device 400 has been carried out correctly.

[0099] Figures 3A and 3B represent steps in a process for assembling a component 1000 onto an external device 400, for example a printed circuit board (or PCB) or another component.

[0100] The external device 400 comprises a substrate 401 covered by tracks 402. The tracks 402 are, for example, made of copper. In particular, the tracks 402 are arranged so as to extend beyond the area to which the component 1000 is attached. In other words, When observing the assembly (component 1000 and external device 400, such as a PCB), in top view, the 402 traces are visible.

[0101] A soldering material 500 is positioned between the component 1000 and the tracks 402 of the external device 400 ([Fig.3A]). During soldering, the soldering material 500 rises not only along the material 122 forming the wettable flanks of the components 1000, but also onto the tracks 402 of the external device 400 ([Fig.3B]), which allows verification that the soldering has been carried out correctly.

[0102] The weld joint is visible in top view by automated optical inspection (AOI for 'Automated Optical inspection').

[0103] The use of components with wettable sides avoids the need to perform X-ray inspections to check so-called "double-sided" PCBs, i.e., those with components soldered on both sides.

[0104] Such electronic components find applications in many industrial fields, and in particular, in the automotive field, for personal electronics, especially in the field of communication equipment, computers and peripherals.

[0105] This could, for example, refer to 5G connection devices or more generally connected devices.

[0106] It may also be an advanced driver-assistance system (ADAS for 'advanced driver-assistance Systems').

[0107] The electronic chip can be used in a smartphone or for the Internet of Things (IoT). The device is, for example, connected via 5G, Wi-Fi or Ultra-Wide Band (UWB).

[0108] The chip may also be of interest for other fields, such as for the industrial field, in particular for green energy.

[0109] Such applications are given by way of illustration and are not limiting.

[0110] Various embodiments and variations have been described. A person skilled in the art will understand that certain features of these various embodiments and variations could be combined, and other variations will become apparent to a person skilled in the art.

[0111] Finally, the practical implementation of the embodiments and variants described is within the reach of a person skilled in the art, based on the functional indications given above.

Claims

Demands

1. A method for manufacturing wettable-sided electronic components (1000) comprising the following steps: a) providing a substrate (300) in which chips (100) are formed, with connection pads (107) of the chips (100) arranged on an upper surface (305) of the substrate (300), and conductive pads (117) covering the connection pads (107); b) forming cavities (307) or trenches between the chips (100) from the upper surface (305) of the substrate (300); c) forming a first layer of insulating material (121) on the substrate (300), the first layer of insulating material filling the cavities (307) or trenches and covering the upper surface (305) of the substrate (300); d) making the connection pads (107) or conductive pads (117) accessible; e) depositing a layer of conductive material (122) so as to cover the cavities (307) or trenches and to connect the connection areas (107) of two adjacent chips,f) deposit a second layer of insulating material (123) onto the conductive material (122) and the upper surface (305) of the substrate (300), g) thin the second layer of insulating material (123) until the conductive material (122) is accessible, h) separate the chips (100) by cutting through the layer of conductive material (122) and through the cavities (307) or trenches, thereby obtaining electronic components (1000) with wettable sides.

2. A method according to claim 1, wherein, in step a), the connection pads (107) are covered by conductive pads (117) and wherein: - step c) is carried out by depositing the first layer of insulating material (121) on the upper face (305) of the substrate (300) and on the conductive pads (117), - step d) is carried out by thinning the first layer of insulating material (121) until the conductive pads (117) are accessible, and - during step e), the layer of conductive material (122) is deposited on the conductive pads (117).

3. A method according to claim 1, wherein: - step c) is carried out by depositing the first layer of insulating material (121) on the upper face (305) of the substrate (300) and on the connection areas (107), - step d) is carried out by engraving, and optionally thinning, the first layer of insulating material (121), to make the connection areas (107) accessible, and - during step e), the layer of conductive material (122) is deposited on the connection areas (107).

4. A method according to any one of claims 1 to 3, the method comprising, before step g), a step in which a lower face (303) of the substrate (300) is thinned and covered with an additional layer of insulating material (124).

5. A method according to any one of claims 1 to 4, wherein the first layer of insulating material (121) and / or the second layer of insulating material (123) and / or the additional layer of insulating material (124) are layers of insulating resin, for example layers of epoxy resin.

6. Electronic component (1000) with wettable flanks comprising a chip (100) formed in a substrate (300), the chip (100) comprising connection pads (107) disposed on an upper face (305) of the substrate (300), a first layer of insulating material (121) covering the flanks (304) of the substrate (300) and the upper face (305) of the substrate between the connection pads (107), a second layer of insulating material (123) covering the first layer of insulating material (121) on the upper face (305) of the substrate (300), a layer of conductive material (122) being disposed on each connection pad (107) and extending, on the one hand, to an upper face of the electronic component (1000), and, on the other hand, to a flank of the electronic component (1000).

7. Electronic component (1000) according to claim 6, wherein an additional layer of insulating material (124) covers a lower face (303) of the substrate (300).

8. Electronic component according to any one of claims 6 and 7, wherein the first layer of insulating material (121), the second layer of insulating material (123) and / or the additional layer of insulating material (124) is a layer of epoxy or phenolic resin in which electrically insulating charges are dispersed, for example particles of alumina or silica.

9. Electronic component according to any one of the claims 6 to 8, wherein the conductive material layer (122) is a brazeable material layer, for example a tin-based brazeable material, such as SnAgCu.

10. A method for assembling an electronic component (1000) according to any one of claims 6 to 9, with an external device (400), such as a printed circuit board, the method comprising the following steps: - position a soldering material (500) between the conductive material (122) positioned on the upper face of the electronic component (1000) and the connection elements (402) of the external device (400), - braze the brazing material (500), whereby the brazing material (500) spreads over the connecting elements (401) of the external device (400) and over the wettable sides of the electronic component (1000).

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