Device comprising an exposed conductive layer and method of manufacturing the device

FR3165546A1Inactive Publication Date: 2026-02-13STMICROELECTRONICS INT NV
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Patent Information

Application Number
FR2024008751
Authority / Receiving Office
FR · FR
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-07
Publication Date
2026-02-13
Estimated Expiration
Not applicable · inactive patent

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Abstract

Device comprising an exposed conductive layer and method of manufacturing the device. This description relates to an electronic system comprising a first device (100) comprising: - a semiconductor substrate (130) having an aperture (135); - a stack (140) comprising a plurality of metallic layers (158, 159) and conductive vias; and - a conductive layer (120) comprising aluminum having a first face in contact with the stack (140) and a second face, opposite the first face, partially exposed in the aperture (135), wherein the metallic layers (158, 159) and the conductive vias of the stack (140) are made of a conductive material other than aluminum. Figure for the abstract: Fig. 1A
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Citation Information

Patent Citations

  • Contact forming method for lighted image sensing device, involves etching external surface of thin semiconductor substrate, etching insulating region by stopping insulating region on conductive region, and filling etched opening with metal

    FR2930840A1

  • Semiconductor structure and manufacturing method thereof

    US20220344305A1