Heater for microparticle generator and installation structure thereof

Abstract

A heater for a microparticle generator comprises: a cylindrical metal structure and a heating element 200 attached to an outer surface of the metal structure and having a heating layer in which a heat

Description

TECHNICAL FIELD The present disclosure relates to a heater for a microparticle generator and an installation structure thereof. BACKGROUND ART Inhalation of microparticles in the air, that is, aerosol, may be achieved by inhalation of preference materials such as smoking to use a common phrase. In the past, tobacco in the form of cigarettes was almost the only means of inhaling these preference materials, but recently, electronic cigarettes has also been settled as another means. Electronic cigarettes, which generate microparticles by vaporizing an inhalation material to steam by applying heat or ultrasonic waves to a cartridge in which an inhalation material is included in a liquid form, is completely different from conventional cigarette-type tobacco that generates smoke through combustion and has advantages, in particular, advantages of suppressing an occurrence of various harmful materials that may occur by combustion. In addition, according to demand of consumers who prefer conventional tobacco in the form of cigarette, an electronic cigarette having a filter unit of a the conventional cigarette and a shape having a cigarette portion has also been proposed, and the electronic cigarette is configured such that a user inhales through a filter unit having a configuration equivalent to that of the conventional cigarette, while an inhalation material included in the cigarette portion is vaporized with an electronic heater. When the electronic cigarette is inserted into a holder and a heater inside the holder is heated to vaporize the inhalation material inside the cigarette portion, the user may inhale the vaporized inhalation material through 25 11 22 filter unit. The user may inhale the vaporized inhalation material through the filter unit according to the same mechanism as that when the user smokes a normal cigarette, while having the advantage that no combustion occurs like the existing electronic cigarette, and thus, the user may feel as if he / she smokes a normal 5 cigarette. FIG. 1 is a view illustrating an example of a heater for a microparticle generator according to the related art. The heater of the microparticle generator according to the related art is a blade type, and the blade type heater is inserted into a microparticle generating substrate (A). The blade type heater is electrically 10 insulated, a plurality of electrically conductive tracks 13 are formed on a rigid substrate 11, and a connection 15 for applying power to the conductive track 13 is drawn out of the substrate 11. FIG. 2 is a view illustrating another example of the heater of the microparticle generator according to the related art. The heater of the microparticle generator 15 has a conductive track 23 formed on an electrically insulated substrate 21 and includes a first portion 29 including a connection 25 for applying power to the conductive track 23 and a second portion 31 in which a thermally insulating reflective honeycomb structure 27 is formed on the electrically insulated substrate 21. The heater is formed by winding such that the first portion 29 is located inside and the 20 second portion 31 is located outside. However, the heater of the microparticle generator according to the related art has a disadvantage in that an installation of a sensor for measuring a temperature of the heater is complicated and it is difficult to evenly transfer heat generated in the conductive track 23 to the microparticle generating substrate. 25 US2019124985 relates to the field of low-temperature baked smoking sets, and particularly, to a low-temperature baked vaporizer and a low-temperature baked 25 11 22 smoking set having same. WO2020030033 relates to the field of electronic cigarettes, in particular to a heating body of a flue-cured electronic cigarette. KR20190010215 and KR20190010214 relate to a heating heater for 5 electronic cigarette, and more particularly, to a cylindrical heating heater for cigarette type electronic cigarette which can be efficiently applied to a cigarette-type electronic cigarette. KR20200127240 relates to an aerosol delivery article and use thereof for producing tobacco components or other substances in an inhalable form. More 10 specifically, KR20200127240 provides heating of tobacco or tobacco-derived substances using electrically generated heat, preferably without significant combustion, in order to provide an inhalable substance in the form of an aerosol for human consumption. And aerosol delivery devices and systems such as smoking articles.W02020196181 relates to a coil winding device and a coil winding method. 15 DISCLOSURE OF THE INVENTION An aspect of the present disclosure provides a heater for a microparticle generator, in which a film type heating element is attached to a metal structure and heated to evenly heat a microparticle generating substrate to generate microparticles. Another aspect of the present disclosure provides a heater for a microparticle generator, in which an installation structure of a film-type heating element installed on a metal structure is improved. In an aspect, a heater for a microparticle generator includes: a cylindrical metal structure; and a heating element attached to an outer surface of the metal structure and having a heating layer in which a heating pattern is printed on an insulating film. Also, in another example of the present disclosure, the insulating film may be formed of any one of polyimide (PI) and a liquid crystal polymer (LCP) and the heating pattern may be formed of constantan. Also, in another example of the present disclosure, the heating element may have an extension portion formed as a portion of the heating element extends outwardly of the metal structure, and the extension portion may have a soldering pad for connecting the heating pattern to an external power source. Also, in another example of the present disclosure, the heating element may further include an intermediate layer attached to a surface of the heating pattern of the heating layer and formed of an insulating film and a sensor layer attached to the intermediate layer and formed by printing a sensor pattern for sensing a temperature on an insulating film. Also, in another example of the present disclosure, the sensor pattern may be printed with a Cu material. Also, in another example of the present disclosure, the sensor pattern may be printed on a surface in contact with the intermediate layer. Also, in another example of the present disclosure, the sensor layer may have an extension portion formed as a portion of the sensor layer extends outwardly of the metal structure, both end portions of the sensor pattern may extend along the extension portion, and a terminal may be provided at an end of the extension portion. Also, in another example of the present disclosure, the extension portion of the sensor layer may further include a reinforcing member attached to facilitate installation of a terminal at an end portion. Also, in another example of the present disclosure, the heating layer may further include an extension portion extending along the extension portion of the sensor layer, a soldering pad for connecting a resistance line and a signal line may be provided at the extension portion of the heating layer, and the extension portion of the sensor layer may have a hole exposing the soldering pad. Also, in another example of the present disclosure, the heating layer, the intermediate layer, and the sensor layer may be laminated to each other and then attached to the metal structure. Also, in another example of the present disclosure, the insulating film may be formed of polyimide, and the heating layer may be attached to the metal structure by deforming the insulating film by applying heat and pressure to the insulating film. Also, in another example of the present disclosure, when the insulating film is attached to the metal structure, heat of 300°C or higher and pressure of 1 kgf / cm2 or greater may be applied. Also, in another example of the present disclosure, the heating element may be attached to the metal structure using a liquid polyimide as an adhesive. Also, in another example of the present disclosure, the heater may further include: a metal bracket installed on an outer periphery of the heating member and having a tightening structure. Also, in another example of the present disclosure, the tightening structure of the metal bracket may include a bendable latch and a through hole allowing the latch to penetrate therethrough. Also, in another example of the present disclosure, the metal bracket may have a plurality of perforated holes to minimize heat transfer from a film heater. Also, in another example of the present disclosure, the heater may further include: a temperature sensor configured to measure a temperature of the heating element, wherein the metal bracket may have an accommodation portion accommodating the temperature sensor. Also, in another example of the present disclosure, the insulating film is formed of any one of polyimide (PI) and a liquid crystal polymer (LCP), and the heating pattern may be formed of constantan or copper. Also, in another example of the present disclosure, the heating element may have an extension portion formed as a portion of the heating element extends outwardly from the metal structure, and the extension portion of the heating element may have a terminal portion for connecting the heating pattern to an external power source. In another aspect, a heat installation structure for a microparticle generator includes: any one heater for a microparticle generator; a heater holder configured to support the heater and installed to surround the heater at an interval from an outer circumferential surface of the heater; and an insulating air layer formed between the outer circumferential surface of the heater and an inner circumferential surface of the heater holder. In the heater for a microparticle generator provided by the present disclosure, a heating pattern does not directly heat the microparticle generating substrate, but a heating pattern attached to a polyimide film having a high heat transfer rate is heated, heat of the heating pattern is transferred to a metal structure through the polyimide film, and the microparticle generating substrate is then heated by the metal structure, thereby evenly heating the substrate. In addition, in the present disclosure, a sensor layer may be formed on a heating layer and a sensor pattern measures a temperature in the entire heating area, thereby improving measurement accuracy. In addition, in the present disclosure, since a heating element is fixed to a metal structure using a metal bracket, rather than a shrink tube, release of toxic substances at high temperatures may be prevented. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view illustrating an example of a heater for a microparticle generator according to the related art; FIG. 2 is a view illustrating another example of a heater for a microparticle generator according to the related art; FIG. 3 is an exploded perspective view of a heater for a microparticle generator according to a first embodiment of the present disclosure; FIG. 4 is a perspective view of a heater for a microparticle generator according to the first embodiment of the present disclosure; FIG. 5 is a view illustrating a film structure of a heater for a microparticle generator according to the first embodiment of the present disclosure; FIG. 6 is a view illustrating an installation structure of a heater for a microparticle generator according to the first embodiment of the present disclosure; FIG. 7 is an exploded perspective view of a heater for a microparticle generator according to a second embodiment of the present disclosure; FIG. 8 is a perspective view of a bracket of a heater for a microparticle generator according to the second embodiment of the present disclosure; FIG. 9 is a perspective view illustrating coupling of a sensor and a bracket of a heater for a microparticle generator according to the second embodiment of the present disclosure; FIG. 10 is a perspective view of a heater for a microparticle generator according to the second embodiment of the present disclosure; FIG. 11 is a cross-sectional view of a heater for a microparticle generator according to the second embodiment of the present disclosure; and FIG. 12 is a cross-sectional view illustrating a state in which a heater for the microparticle generator according to the second embodiment of the present disclosure is installed in a microparticle generator. Hereinafter, the present disclosure is described in detail with reference to the accompanying drawings. FIG. 3 is an exploded view of a heater for a microparticle generator according to a first embodiment of the present disclosure, and FIG. 4 is a perspective view of a heater for a microparticle generator according to the first embodiment of the present disclosure. A heater for a microparticle generator according to the first embodiment of the present disclosure includes a cylindrical metal structure 100 and a heating element 200 attached to an outer circumferential surface of the metal structure 100. The heating element 200 includes a heating layer and a sensor layer to be described below and is manufactured by laminating a film in which a conductive pattern is formed on an insulating film. As the insulating film, a polyimide film or a liquid crystal polymer (LCP) film is appropriate, and the polyimide film has relatively high thermal conductivity and is suitable for transferring heat to the metal structure 100. The heating element 200 may be attached to the metal structure 100 using an adhesive having relatively strong heat resistance and having high thermal conductivity, such as epoxy or bond. In particular, when the insulating film is formed of a polyimide film, the heating element 200 may be attached to the metal structure 100 using the properties of the polyimide film deformed by heat and pressure. For example, an insulating film formed of polyimide may be deformed and attached to the metal structure 100 by applying heat of 300 °C or higher and pressure of 1 kgf / cm2 or more. Alternatively, the heating element 200 may also be attached to the metal structure 100 using liquid polyimide as an adhesive. As described above, polyimide has relatively high thermal conductivity, so it is easy to attach the heating element 200 to the metal structure 100, while transferring heat generated by the heating element 200 to the metal structure 100. FIG. 5 is a view illustrating a film structure of a heater for a microparticle generator according to the first embodiment of the present disclosure. The heating element 200 of the heater for a microparticle generator includes a heating layer formed by attaching a heating pattern 220 to an insulating film 210, an intermediate layer 230 attached to an outer surface of the heating layer, and a sensor layer formed by attaching a sensor pattern 250 on an inner surface of the insulation film 240. The insulating film 210 of the heating layer is formed of a polyimide material with a thickness of about 10 to 60 pm. For the heating pattern 220, Cu, Kanthal, Inconel, SUS, Cu alloy, Ru, Pt, and Ag / Pd may be used as a metal material, and CNT or CNT / binder may be used as a non-metal material. A thickness of the heating pattern 220 is preferably 10 to 60 pm, and resistance thereof is preferably 0.5 to 15 Q. The heating pattern 220 may be formed on the insulating film 210 by a method such as gravure coating, screen printing, etching, spray coating, or the like. In addition, a temperature coefficient of resistance (TCR) range of the heating pattern 220 material is preferably 100 to 4000 ppm / deg C. In particular, in the first embodiment of the present disclosure, in the heating layer, preferably, a constantan heating pattern 220 having a thickness of about 20 pm is attached to the insulating film 210 of about 20 pm. In this case, resistance of the heating pattern 220 preferably has a value of 0.7 ± 0.035 Q. The intermediate layer 230 serves to insulate between the heating pattern 220 and the sensor pattern 250, is formed of a polyimide film, and has a thickness of about 20 pm. The sensor layer is manufactured by attaching the sensor pattern 250 formed of Cu and having a thickness of about 6 pm to the insulating film 240 having a thickness of about 9 pm. Resistance of the sensor pattern 250 preferably has a value of 10 ± 1.0 Q. The sensor pattern 250 is preferably formed on the inner surface of the insulating film 240 of the sensor layer to face the heating pattern 220, that is, to contact the intermediate layer 230. The sensor pattern 250 allows a temperature to be measured over the entire area of the heating element 200 attached to the outer circumferential surface of the metal structure 100, thereby improving measurement precision. Meanwhile, the heating element 200 includes an extension portion 202 extending outwardly of the metal structure 100 in addition to a portion attached to the outer circumferential surface of the metal structure 100. The extension portion 202 preferably extends downward of the metal structure 100. Similar to the portions attached to the metal structure 100, the extension portion 202 includes an extension portion of the heating layer, an extension portion of the sensor layer, and an extension portion of the intermediate layer insulating between the extension portion of the heating layer and the extension portion of the sensor layer. Preferably, a soldering pad 222 for connecting the heating pattern 220 to an external power source is provided in the extension portion of the heating layer. The extension portion 242 of the sensor layer extends a slightly longer than the extension portion of the heating layer, and a terminal 254 for connecting to an external circuit board may be provided at an end of the extension portion 252 of the sensor pattern 250. Here, a reinforcing member 260 may be provided so as to be more easily connected to the circuit board. The reinforcing member 260 should be installed on a rear surface of the terminal 254 so as not to interfere with the contact of the terminal 254 with the circuit board. The sensor pattern 250 is formed on the inner surface of the insulating film 240 of the sensor layer, and since this structure extends to the extension portion 242, the terminal 254 is formed on an inner surface of the extension portion 242 and reinforcing member 260 is installed on an outer surface of the extension portion 242. The reinforcing member 260 may be formed of the same type of polyimide material to facilitate bonding with the heating element 200. The reinforcing member preferably has a thickness of about 200 pm. Meanwhile, since the heating pattern 220 is formed on an outer surface of the insulating film 210 of the heating layer, the soldering pad 222 is also located on an outer surface of the insulating film 210 in the extension portion of the heating layer. To facilitate soldering, the extension portion 242 of the sensor layer preferably may have a hole through which the soldering pad 222 is exposed. FIG. 6 is a diagram illustrating an installation structure of a heater for a microparticle generator according to the first embodiment of the present disclosure. The installation structure of the heater for a microparticle generator according to the first embodiment of the present disclosure includes a heater in which the heating element 200 is attached to the outer circumferential surface of the cylindrical metal structure 100 as described above. In addition, the installation structure of the heater for a microparticle generator according to the first embodiment of the present disclosure includes further includes a heater holder 300 supporting the metal structure 100 and surrounding the heater at an interval without contacting the outer circumferential surface of the heating element 200. That is, an air layer 320 formed between the heater holder 300 and the outer circumferential surface of the heater serves as an insulator to block heat transfer to an outer case (not shown) of the microparticle generator. Replacement of a heat insulating member with the air layer 320 advantageously reduces costs as well as weight. FIG. 7 is an exploded perspective view of a heater for a microparticle generator according to a second embodiment of the present disclosure. The heater for a microparticle generator according to the second embodiment of the present disclosure includes a cylindrical metal structure 100a and a film-type heating element 200a attached to an outer circumferential surface of the metal structure 100a. The heating element 200a is manufactured by laminating a film in which a conductive pattern is formed on an insulating film. The heating element 200a includes a heating portion 210a surrounding the metal structure 100a and having a heating pattern formed thereon and an extension portion 220a from which a signal pattern for transmitting power is drawn out from the heating portion 210a, and a terminal portion 230a for connecting the heating pattern and external power source is provided at the extension portion 220a. As the insulating film, a polyimide film or an LCP film is appropriate, and the polyimide film has relatively high thermal conductivity and is suitable for transferring heat to the metal structure 100a. The insulating film of the heating element is formed of a polyimide material with a thickness of about 10 to 60 pm. For the heating pattern, metal material, and CNT or CNT / binder may be used as a non-metal material. A thickness of the heating pattern 220a is preferably 10 to 60 pm, and resistance thereof is preferably 0.5 to 15 Q. The heating pattern 220a may be formed on the insulating film by a method such as gravure coating, screen printing, etching, spray coating, or the like. In addition, a temperature coefficient of resistance (TCR) range of the heating pattern 220 material is preferably 100 to 4000 ppm / deg C. In particular, in the second embodiment of the present disclosure, in the heating element, a heating pattern formed of constantan or copper formed to have a thickness of about 20 pm is preferably attached to the insulating film. Here, resistance of the heating pattern preferably has a value of 0.7 + 0.035 Q. A temperature sensor 310a for measuring a temperature of the heating element 200a is installed on an outer surface of the heating element 200a. A signal line 320a transmitting a signal of the temperature sensor 310a from the temperature sensor 310a is drawn out downward. In addition, in order to fix the heating element 200a and the temperature sensor 310a to the metal structure 100a, a metal bracket 400a is installed on an outer periphery of the heating element 200a. In the second embodiment of the present disclosure, the temperature sensor 310a is separately manufactured and installed on the heating element 200a, but a sensor pattern may be formed on an insulating film and integrally formed with the heating element 200a. FIG. 8 is a perspective view of a bracket of a heater for a microparticle generator according to the second embodiment of the present disclosure, FIG. 9 is a perspective view illustrating coupling of a sensor and a bracket of a heater for a microparticle generator according to the second embodiment of the present disclosure, FIG. 10 is a perspective view of a heater for a microparticle generator according to the second embodiment of the present disclosure, and FIG. 11 is a cross-sectional view of a heater for a microparticle generator according to the second embodiment of the present disclosure. The metal bracket 400a is formed of a SUS or titanium-based metal material, and preferably has a thickness of about 0.05 to about 0.15 mm. Therefore, although the metal bracket 400a is formed of metal, it has slight elasticity because of its thin thickness. The metal bracket 400a may have a plurality of perforated holes 420a to reduce a contact surface 410a with the heating element 200a so that the amount of heat transfer from the heating element 200a is small. Meanwhile, a sensor accommodation portion 430a is formed so that the temperature sensor 310a may be fixed therein. The sensor accommodation portion 430a is installed on an outer surface of the heating element 200a surrounding the metal structure 100a in a state in which the temperature sensor 310a is fixed to the metal bracket 400a. The metal bracket 400a has a structure for fastening and tightening from the outside of the heating element 200a and a plurality of bendable latches 440a are formed at one end portion of the metal bracket 400a in a circumferential direction. The metal bracket 400a has a through-hole 422a formed at the other end of the latches 440a to allow the latches 440a to penetrate therethrough. After the latches 440a penetrate through and inserted into the through-hole 422a, the latches 440a may be pulled and bent, so that the contact surface 410a of the metal bracket 400a may be tightened to fix the heating element and in close contact with the metal structure 100a. FIG. 12 is a cross-sectional view illustrating a state in which a heater for a microparticle generator according to the second embodiment of the present disclosure is installed in a microparticle generator. The installation structure of the heater for a microparticle generator according to the second embodiment of the present disclosure includes a heater in which the film-type heating element 200a is fixed to the outer circumferential surface of the cylindrical metal structure 100 by the metal bracket 400a as described above. In addition, the installation structure of the heater for a microparticle generator according to the first embodiment of the present disclosure includes further includes a heater holder 500a supporting the metal structure 100a and surrounding the heater at an interval without contacting the outer circumferential surface of the heating element 200a. That is, an air layer 520a formed between the heater holder 500a and the outer circumferential surface of the heater serves as an insulator to block heat transfer to an outer case 1000a of the microparticle generator. Replacement of a heat insulating member with the air layer 520a advantageously reduces costs as well as weight. 16 05 25

Claims

1. A heater for a microparticle generator, the heater comprising:a cylindrical metal structure (100); anda heating element (200) attached to an outer circumferential surface of the cylindrical metal structure,characterized in thatthe heating element includes a heating layer in which a heating pattern (220) is printed on a first insulating film (210), an intermediate layer attached to a surface of the heating pattern (220) of the heating layer and formed of a second insulating film (230), and a sensor layer attached to the intermediate layer by printing a sensor pattern (250) on a third insulating film (240) for sensing a temperature,wherein the sensor pattern (250) is in contact with the intermediate layer,wherein the first insulating film is configured to electrically insulate between the cylindrical metal structure (100) and the heating pattern (220) and to transfer heat from the heating pattern (220) to the cylindrical metal structure (100),wherein the intermediate layer formed of the second insulating film (230) electrically insulates between the heating pattern (220) and the sensor pattern (250), wherein the third insulating film (240) is configured to electrically insulate between the sensor pattern (250) and an outside surrounding the third insulating film (240),wherein the sensor pattern (250) allows a temperature to be measured over the entire area of the heating element,wherein the heating element (200), formed by laminating the heating layer, intermediate layer and the sensor layer, is attached to the cylindrical metal structure (100) by using an adhesive,wherein the heating layer of the heating element has a first extension portion (202) formed as a portion of the heating element extends outwardly of the cylindrical metal structure (100), and the first extension portion has a soldering pad (222) for connecting the heating pattern (220) to an external power source, andwherein the sensor layer of the heating element has a second extension portion (242) formed as a portion of the sensor layer extends outwardly of the cylindrical metal structure (100), both end portions of the sensor pattern (250) extend along the second extension portion (242) outwardly of the cylindrical metal structure (100), and a terminal (254) is provided at an end of the second extension portion (242), wherein the first extension portion (202) extends along the second extension portion of the second layer and the second extension portion (242) of the sensor layer has a hole exposing the soldering pad (222).

2. The heater of claim 1, whereinthe first insulating film (210) is formed of any one of polyimide (PI) and a liquid crystal polymer (LCP) and the heating pattern (220) is formed of constantan.

3. The heater of claim 1, wherein the sensor pattern (250) is printed with a Cu material.

4. The heater of claim 1, wherein the second extension portion (242) of the sensor layer further includes a reinforcing member (260) attached to facilitate installation of a terminal (254) at an end portion.16 05 255. The heater of claim 1, wherein a soldering pad (222) for connecting a resistance line and a signal line is provided at the first extension portion (202) of the heating layer.

6. The heater of claim 1, wherein the insulating film (210, 230, 240) is formed of polyimide.

7. The heater of claim 1, wherein, when the insulating film (210, 230, 240) is attached to the cylindrical metal structure (100), heat of 300°C or higher and pressure of 1 kgf / cm2 or greater are applied.

8. The heater of claim 1, wherein the heating element is attached to the cylindrical metal structure (100) using a liquid polyimide as an adhesive.

9. The heater of claim 1, wherein resistance value of the heating pattern (220) is smaller than resistance value of the sensor pattern (250).

10. A heater installation structure for a microparticle generator, the heater installation structure comprising:a heater for a microparticle generator according to any one of claims 1 to 9;a heater holder (300) configured to support the heater and installed to surround the heater at an interval from an outer circumferential surface of the heater; andan insulating air layer (320) formed between the outer circumferential surface of the heater and an inner circumferential surface of the heater holder.

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