Polishing and grinding device

JP1799656SActive Publication Date: 2025-05-27HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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Patent Information

Application Number
JP2024502845D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Priority Date
2024-07-30
Filing Date
2024-08-29
Publication Date
2025-05-27
Estimated Expiration
2049-08-29

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Abstract

The design is used for polishing and grinding wafer substrates. The bottom of the product is not shown in the drawings because it is not easily visible or can not be seen during use. 2.1) Front view; 2.2) Rear view; 2.3) Left side view; 2.4) Right side view; 2.5) Plan view; 2.6) Perspective view; 2.7) Perspective view; 2.8) Perspective view
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