Abrasive device body

JP1800868SActive Publication Date: 2025-06-12NAGASE INTEGREX CO LTD
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Patent Information

Application Number
JP2025000967D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-01-20
Publication Date
2025-06-12
Estimated Expiration
2050-01-20

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Abstract

The article related to this design is a polishing apparatus main body for polishing wafers in the manufacture of semiconductors and the like. A work (polishing object) and a dresser are held on the lower surface of the frame, and a work holding unit or the like in which the holding portions of the work and the dresser move up and down is fixed. By adjusting the swing adjustment unit, the work and the dresser can be adjusted to be horizontal.
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