Abrasive device body

JP1800869SActive Publication Date: 2025-06-12NAGASE INTEGREX CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2025000968D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-01-20
Publication Date
2025-06-12
Estimated Expiration
2050-01-20

Smart Images

  • Figure 0001800869000001
    Figure 0001800869000001
  • Figure 0001800869000002
    Figure 0001800869000002
  • Figure 0001800869000003
    Figure 0001800869000003
Patent Text Reader

Abstract

The article according to this design is a polishing apparatus main body for polishing wafers in the manufacture of semiconductors and the like. A work (polishing object) and a dresser are held on the lower surface of the frame, and a work holding unit and the like in which the holding portions of the work and the dresser move up and down are fixed thereto.
Need to check novelty before this filing date? Find Prior Art