Frame for grinding device

Abstract

The article related to this design is a frame used in a polishing apparatus for polishing wafers in the manufacture of semiconductors and the like. As shown in the reference figures 1 to 3 showing the usage state, a work (polishing object) and a dresser are held on the lower surface of the frame, and a work holding unit and the like in which the holding portions of the work and the dresser move up and down are fixed. By adjusting the swing adjustment unit fixed to the frame, the work and the dresser can be adjusted to be horizontal. The portion to be registered for the design is the mounting surface of the swing adjustment unit.

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