Abrasive device body

Abstract

The article related to this design is a polishing apparatus main body for polishing wafers in the manufacture of semiconductors and the like. A work (polishing object) and a dresser are held on the lower surface of the frame, and a work holding unit in which the holding portions of the work and the dresser move up and down is fixed. The portion for which a design registration is sought is the hole portion provided on the front view side of the base member and its periphery. By providing such a hole portion between the legs of the base member, the force applied to the work holding unit can be efficiently transmitted to the legs.

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