Substrate cleaning device and substrate cleaning method

Abstract

To provide a substrate cleaning device and a substrate cleaning method, capable of keeping a holding part for a substrate clean.SOLUTION: By contact of a cleaning tool with a lower surface center region of a substrate W held by a first holding part, the lower surface center region is cleaned. By contact of the cleaning tool with a lower surface outer side region of the substrate W rotated by a second holding part, the lower surface outer side region of the substrate W is cleaned. When cleaning the lower surface center region, the second holding part is rotated around a vertical axis in a state where the substrate W is not held. Alternatively, when cleaning the lower surface center region, air is jetted toward the substrate W from a first height which is separated from the substrate W by a predetermined distance by an air jetting part 53 arranged between the cleaning tool and the second holding part. When drying the lower surface center region, air is jetted toward the substrate W from a second height nearer the substrate W than the first height by the air jetting part 53.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate.

Background Art

[0002] In order to perform various processes on various substrates such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates, a substrate processing apparatus is used. To clean a substrate, a substrate cleaning apparatus is used.

[0003] For example, the substrate cleaning apparatus described in Patent Document 1 includes two suction pads that hold the peripheral portion of the back surface of a wafer, a spin chuck that holds the central portion of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move in the lateral direction. In this state, the central portion of the back surface of the wafer is cleaned with the brush. Then, the spin chuck receives the wafer from the suction pads and rotates while holding the central portion of the back surface of the wafer. In this state, the peripheral portion of the back surface of the wafer is cleaned with the brush.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the substrate cleaning apparatus described in Patent Document 1, the back surface of the wafer is dried by an air knife when the wafer is transferred to the spin chuck in order to bring the surface of the spin chuck and the back surface of the wafer into contact with each other in a dry state. However, it is not easy to sufficiently prevent the cleaning solution from adhering to the surface of the spin chuck. If contaminated cleaning solution adheres to the surface of the spin chuck, the cleanliness of the spin chuck decreases. Therefore, it is necessary to keep the spin chuck clean.

[0006] The object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method that can maintain the substrate holding portion in a clean state. [Means for solving the problem]

[0007] (1) The substrate cleaning apparatus according to the first invention comprises: a first holding part having a reference position and holding the substrate such that the center of the substrate is located at the reference position; a second holding part configured to be rotatable around a vertical axis and holding the central region of the lower surface of the substrate; a cleaning tool that cleans the central region of the lower surface of the substrate by contacting the central region of the lower surface of the substrate held by the first holding part, and cleans the outer region of the lower surface by contacting the outer region of the lower surface surrounding the central region of the lower surface of the substrate rotated by the second holding part; and a movable base provided with the second holding part and the cleaning tool, which moves in a horizontal plane such that, in a plan view, the second holding part aligns with the reference position of the first holding part when the substrate is transferred between the first holding part and the second holding part, and in a plan view when cleaning the central region of the lower surface, the cleaning tool aligns with the reference position of the first holding part when cleaning the central region of the lower surface, and the second holding part rotates without holding the substrate when cleaning the central region of the lower surface.

[0008] In the substrate cleaning apparatus according to this invention, when cleaning the central region of the lower surface of a substrate, the substrate is held by the first holding part so that its center is positioned at a reference position, and the cleaning tool is brought into contact with the central region of the lower surface of the substrate. In addition, the second holding part is rotated around the vertical axis without holding the substrate. When cleaning the outer region of the lower surface of a substrate, the central region of the lower surface of the substrate is held by the second holding part, and the substrate is rotated around the vertical axis, and the cleaning tool is brought into contact with the outer region of the lower surface of the substrate.

[0009] The second holding part and the cleaning tool are mounted on a movable base. When transferring the substrate between the first holding part and the second holding part, the movable base is moved in the horizontal plane so that, in a plan view, the second holding part aligns with the reference position of the first holding part. When cleaning the central region of the lower surface, the movable base is moved in the horizontal plane so that, in a plan view, the cleaning tool aligns with the reference position of the first holding part.

[0010] With this configuration, when cleaning the central area of ​​the underside of the substrate, the second retaining part is retracted to a position where it does not overlap with the substrate. Furthermore, even if liquid containing contaminants scattered from the substrate adheres to the second retaining part, the rotation of the second retaining part shakes the liquid off it. This allows the second retaining part to be kept clean.

[0011] (2) The substrate cleaning apparatus may further include a gas ejection unit positioned between the cleaning tool and the second holding unit, which ejects gas toward the substrate. In this case, when cleaning the central region of the lower surface, the gas ejected from the gas ejection unit can prevent liquid containing contaminants from splashing from the substrate toward the second holding unit. In addition, the gas ejected from the gas ejection unit can efficiently dry the central region of the lower surface. This prevents liquid from adhering to the second holding unit and keeps the second holding unit clean.

[0012] (3) The substrate cleaning apparatus may further include a linear guide extending in one direction in a horizontal plane, and the movable base may move linearly along the linear guide. In this case, the movable base can be moved in a horizontal plane with a simple configuration.

[0013] (4) The rotation speed of the second retaining part when cleaning the central area of ​​the lower surface may be 500 rpm or more. In this case, any liquid adhering to the second retaining part will be shaken off from the second retaining part in a short time. This makes it possible to keep the second retaining part cleaner more efficiently.

[0014] (5) The substrate cleaning apparatus according to the second invention comprises: a first holding part for holding a substrate; a second holding part for rotating the substrate around a vertical axis while holding the central lower surface region of the substrate; a cleaning tool for cleaning the central lower surface region of the substrate held by the first holding part by contacting it, and for cleaning the outer lower surface region for cleaning the outer lower surface region surrounding the central lower surface region of the substrate rotated by the second holding part by contacting it; and a gas ejection part arranged to move up and down between the cleaning tool and the second holding part, which ejects gas toward the substrate from a first height at a predetermined distance from the substrate when cleaning the central lower surface region, and ejects gas toward the substrate from a second height closer to the substrate than the first height when drying the central lower surface region.

[0015] In this substrate cleaning apparatus, when cleaning the central region of the lower surface of the substrate, the cleaning tool is brought into contact with the central region of the lower surface of the substrate while the substrate is held by the first holding part. The second holding part is rotated around a vertical axis when the substrate is not being held. When cleaning the central region of the lower surface, gas is ejected from a gas ejection part positioned between the cleaning tool and the second holding part from a first height, which is a predetermined distance from the substrate, toward the substrate. When drying the central region of the lower surface, gas is ejected from the gas ejection part from a second height, which is closer to the substrate than the first height, toward the substrate.

[0016] With this configuration, during cleaning of the central area of ​​the lower surface, the gas ejected from the gas ejection port prevents liquid containing contaminants from scattering from the substrate toward the second holding section. Furthermore, during drying of the central area of ​​the lower surface, the gas is ejected from the gas ejection port to the lower surface of the substrate while the lower surface of the substrate and the gas ejection port are in close proximity, so the central area of ​​the lower surface is dried efficiently. As a result, liquid is prevented from adhering to the second holding section. This allows the second holding section to be kept clean.

[0017] (6) The second holding part may rotate without holding the substrate when cleaning the central region of the lower surface. With this configuration, even if a liquid containing contaminants scattered from the substrate adheres to the second holding part, the rotation of the second holding part will shake the liquid off the second holding part. This makes it possible to more reliably keep the second holding part clean.

[0018] (7) The substrate cleaning apparatus may further include a common support for the cleaning tool and the gas ejection unit. In this case, the cleaning tool and the gas ejection unit move integrally according to the position of the substrate. Therefore, the underside of the substrate can be cleaned efficiently. In addition, since the gas ejection unit is provided to be vertically movable, even when the cleaning tool and the gas ejection unit are supported by a common support, the gas ejection unit can be brought closer to the substrate than when cleaning the central area of ​​the underside of the substrate when drying the central area of ​​the underside of the substrate. This allows the underside of the substrate to be dried efficiently.

[0019] (8) The substrate cleaning method according to the third invention includes: holding the substrate with the first holding part so that the center of the substrate is positioned at a reference position when cleaning the central region of the lower surface of the substrate; rotating the second holding part around a vertical axis without holding the substrate when cleaning the central region of the lower surface; bringing a cleaning tool into contact with the central region of the lower surface of the substrate held by the first holding part when cleaning the central region of the lower surface of the substrate; and holding the central region of the lower surface of the substrate with the second holding part when cleaning the outer region of the lower surface surrounding the central region of the lower surface of the substrate. The method includes rotating the substrate around a vertical axis, bringing a cleaning tool into contact with the lower outer region of the substrate rotated by the second holding part when cleaning the lower outer region, and moving the movable base on which the second holding part and the cleaning tool are provided in a horizontal plane such that, in a plan view, the second holding part aligns with the reference position of the first holding part when the substrate is transferred between the first holding part and the second holding part, and in a plan view, the cleaning tool aligns with the reference position of the first holding part when cleaning the lower central region.

[0020] According to this substrate cleaning method, when cleaning the central area of ​​the underside of the substrate, the second retaining part is retracted to a position where it does not overlap with the substrate. Furthermore, even if liquid containing contaminants scattered from the substrate adheres to the second retaining part, the rotation of the second retaining part shakes the liquid off. This allows the second retaining part to be kept clean.

[0021] (9) The substrate cleaning method may further include spraying gas toward the substrate from a gas ejection nozzle positioned between the cleaning tool and the second holding part. In this case, when cleaning the central region of the lower surface, the gas ejected from the gas ejection nozzle can prevent liquid containing contaminants from scattering from the substrate toward the second holding part. In addition, the gas ejected from the gas ejection nozzle can efficiently dry the central region of the lower surface. This prevents liquid from adhering to the second holding part and keeps the second holding part clean.

[0022] (10) Moving the movable pedestal in the horizontal plane may include linearly moving the movable pedestal along a linear guide extending in one direction in the horizontal plane. In this case, the movable pedestal can be moved in the horizontal plane with a simple configuration.

[0023] (11) Rotating the second holding part around the vertical axis in a state where the substrate is not held may include rotating the second holding part at a rotation speed of 500 rpm or more. In this case, the liquid adhering to the second holding part is shaken off from the second holding part in a short time. Thereby, the second holding part can be maintained cleaner more efficiently.

[0024] (12) The substrate cleaning method according to the fourth invention includes, when cleaning the central region of the lower surface of the substrate, holding the substrate by the first holding part; when cleaning the central region of the lower surface, bringing a cleaning tool into contact with the central region of the lower surface of the substrate held by the first holding part; when cleaning the outer region of the lower surface surrounding the central region of the lower surface of the substrate, rotating the substrate around the vertical axis while holding the central region of the lower surface of the substrate by the second holding part; when cleaning the outer region of the lower surface, bringing a cleaning tool into contact with the outer region of the lower surface of the substrate rotated by the second holding part; when cleaning the central region of the lower surface, jetting gas toward the substrate from a first height spaced a predetermined distance from the substrate by a gas jetting part disposed between the cleaning tool and the second holding part; and when drying the central region of the lower surface, jetting gas toward the substrate from a second height closer to the substrate than the first height by the gas jetting part.

[0025] According to this substrate cleaning method, when cleaning the central region of the lower surface, the gas jetted from the gas jetting part prevents the liquid containing contaminants from scattering toward the second holding part from the substrate. Also, when drying the central region of the lower surface, since the gas is jetted from the gas jetting part to the lower surface of the substrate in a state where the lower surface of the substrate and the gas jetting part are close to each other, the central region of the lower surface is efficiently dried. Therefore, the liquid is prevented from adhering to the second holding part. Thereby, the second holding part can be maintained clean.

[0026] (13) The substrate cleaning method may further include rotating the second holding portion around the vertical axis in a state where the substrate is not held during cleaning of the central region of the lower surface. According to this configuration, even when a liquid containing contaminants scattered from the substrate adheres to the second holding portion, the liquid is shaken off from the second holding portion by the rotation of the second holding portion. Thereby, the second holding portion can be more reliably maintained clean.

[0027] (14) The cleaning tool and the gas ejection portion may be supported by a common support portion. In this case, the cleaning tool and the gas ejection portion are moved integrally according to the position of the substrate. Therefore, the lower surface of the substrate can be efficiently cleaned. Further, since the gas ejection portion is provided so as to be movable up and down, even when the cleaning tool and the gas ejection portion are supported by a common support portion, the gas ejection portion can be brought closer to the substrate during drying of the central region of the lower surface of the substrate than during cleaning of the central region of the lower surface of the substrate. Thereby, the lower surface of the substrate can be efficiently dried.

Effects of the Invention

[0028] According to the present invention, the holding portion of the substrate can be maintained clean.

Brief Description of the Drawings

[0029] [Figure 1] It is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. [Figure 2] It is an external perspective view showing the internal configuration of the substrate cleaning apparatus of FIG. 1. [Figure 3] It is a block diagram showing the configuration of the control system of the substrate cleaning apparatus. [Figure 4] It is a schematic diagram for explaining the schematic operation of the substrate cleaning apparatus of FIG. 1. [Figure 5] It is a schematic diagram for explaining the schematic operation of the substrate cleaning apparatus of FIG. 1. [Figure 6] It is a schematic diagram for explaining the schematic operation of the substrate cleaning apparatus of FIG. 1. [Figure 7] It is a schematic diagram for explaining the schematic operation of the substrate cleaning apparatus of FIG. 1. [Figure 8] Figure 1 is a schematic diagram illustrating the general operation of the substrate cleaning apparatus. [Figure 9] Figure 1 is a schematic diagram illustrating the general operation of the substrate cleaning apparatus. [Figure 10] Figure 1 is a schematic diagram illustrating the general operation of the substrate cleaning apparatus. [Figure 11] Figure 1 is a schematic diagram illustrating the general operation of the substrate cleaning apparatus. [Figure 12] Figure 1 is a schematic diagram illustrating the general operation of the substrate cleaning apparatus. [Figure 13] Figure 1 is a schematic diagram illustrating the general operation of the substrate cleaning apparatus. [Figure 14] Figure 1 is a schematic diagram illustrating the general operation of the substrate cleaning apparatus. [Figure 15] Figure 1 is a schematic diagram illustrating the general operation of the substrate cleaning apparatus. [Figure 16] Figure 3 is a flowchart showing the substrate cleaning process using the control device. [Figure 17] Figure 3 is a flowchart showing the substrate cleaning process using the control device. [Modes for carrying out the invention]

[0030] Hereinafter, a substrate cleaning apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description, "substrate" refers to semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical discs, substrates for magnetic discs, substrates for magneto-optical discs, substrates for photomasks, ceramic substrates, or substrates for solar cells. Furthermore, the substrate used in this embodiment has at least a portion of its outer circumference that is circular. For example, the outer circumference, excluding the positioning notches, is circular.

[0031] (1) Configuration of substrate processing apparatus Figure 1 is a schematic plan view of a substrate cleaning apparatus according to one embodiment of the present invention. Figure 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of Figure 1. In the substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X, Y, and Z directions are defined to clarify the positional relationship. In Figure 1 and subsequent figures, the X, Y, and Z directions are indicated by arrows as appropriate. The X and Y directions are mutually orthogonal in the horizontal plane, and the Z direction corresponds to the vertical direction.

[0032] As shown in Figure 1, the substrate cleaning apparatus 1 comprises upper holding devices 10A, 10B, lower holding device 20, base device 30, transfer device 40, bottom surface cleaning device 50, cup device 60, top surface cleaning device 70, end surface cleaning device 80, and opening / closing device 90. These components are housed within the unit housing 2. In Figure 2, the unit housing 2 is shown by a dotted line.

[0033] The unit housing 2 has a rectangular bottom surface 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening is the loading / unloading port 2x for the substrate W and is used when loading and unloading the substrate W into and out of the unit housing 2. In Figure 2, the loading / unloading port 2x is shown by a thick dotted line. In the following description, the direction in the Y direction from inside the unit housing 2 through the loading / unloading port 2x toward the outside of the unit housing 2 (the direction from side wall 2c toward side wall 2b) will be called the front, and the opposite direction (the direction from side wall 2b toward side wall 2c) will be called the rear.

[0034] An opening / closing device 90 is provided in the area where the loading / unloading port 2x is formed on the side wall portion 2b and in the vicinity thereof. The opening / closing device 90 includes a shutter 91 configured to open and close the loading / unloading port 2x, and a shutter drive unit 92 that drives the shutter 91. In Figure 2, the shutter 91 is shown by a thick dashed line. The shutter drive unit 92 drives the shutter 91 to open the loading / unloading port 2x when a substrate W is loaded into and unloaded from the substrate cleaning device 1. The shutter drive unit 92 also drives the shutter 91 to close the loading / unloading port 2x when the substrate W is being cleaned in the substrate cleaning device 1.

[0035] A base device 30 is provided in the center of the bottom surface 2a. The base device 30 includes a linear guide 31, a movable base 32, and a base drive unit 33. The linear guide 31 includes two rails and is provided to extend in the Y direction from the vicinity of the side wall 2b to the vicinity of the side wall 2c in a plan view. The movable base 32 is provided to be movable in the Y direction on the two rails of the linear guide 31. The base drive unit 33 includes, for example, a pulse motor and moves the movable base 32 in the Y direction on the linear guide 31.

[0036] A lower holding device 20 and a lower surface cleaning device 50 are arranged on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes a suction holding unit 21 and a suction holding drive unit 22. The suction holding unit 21 is a so-called spin chuck and has a circular suction surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to be rotatable around an axis extending in the vertical direction (axis in the Z direction). In the following description, when the substrate W is adsorbed and held by the suction holding unit 21, the area of ​​the lower surface of the substrate W that the suction surface of the suction holding unit 21 should adsorb is called the lower central region. On the other hand, the area of ​​the lower surface of the substrate W that surrounds the lower central region is called the lower outer region.

[0037] The suction holding drive unit 22 includes a motor. The motor of the suction holding drive unit 22 is mounted on a movable base 32 such that its rotation shaft protrudes upward. The suction holding unit 21 is attached to the upper end of the rotation shaft of the suction holding drive unit 22. A suction path for adsorbing and holding the substrate W in the suction holding unit 21 is formed on the rotation shaft of the suction holding drive unit 22. This suction path is connected to an air intake device (not shown). The suction holding drive unit 22 rotates the suction holding unit 21 around the rotation shaft.

[0038] A transfer device 40 is provided on the movable base 32 near the lower holding device 20. The transfer device 40 includes a plurality of support pins 41 (three in this example), a pin connecting member 42, and a pin lifting drive unit 43. The pin connecting member 42 is formed to surround the suction holding unit 21 in a plan view and connects the plurality of support pins 41. The plurality of support pins 41 are connected to each other by the pin connecting member 42 and extend upward from the pin connecting member 42 for a certain length. The pin lifting drive unit 43 raises and lowers the pin connecting member 42 on the movable base 32. As a result, the plurality of support pins 41 move up and down relative to the suction holding unit 21.

[0039] The bottom cleaning device 50 includes a bottom brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a bottom brush rotation drive unit 55a, a bottom brush lifting drive unit 55b, a bottom brush movement drive unit 55c, and a gas lifting drive unit 55d. The moving support unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in Figure 2, the lifting support unit 54 is provided so as to be movable up and down on the moving support unit 55. The lifting support unit 54 has an upper surface 54u that is inclined diagonally downward in the direction away from the suction holding unit 21 (rearward in this example).

[0040] As shown in Figure 1, the lower brush 51 has a circular outer shape in plan view and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower brush 51 is larger than the diameter of the suction surface of the suction holding part 21, for example, 1.3 times the diameter of the suction surface of the suction holding part 21. Also, the diameter of the lower brush 51 is greater than 1 / 3 and less than 1 / 2 of the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0041] The lower brush 51 has a cleaning surface that can contact the lower surface of the substrate W. The lower brush 51 is attached to the upper surface 54u of the lifting support 54 such that the cleaning surface faces upward and the cleaning surface can rotate around an axis that passes through the center of the cleaning surface and extends vertically.

[0042] Each of the two liquid nozzles 52 is mounted on the upper surface 54u of the lifting support unit 54 so as to be located near the lower brush 51 and with the liquid discharge port facing upward. A lower cleaning liquid supply unit 56 (Figure 3) is connected to the liquid nozzles 52. The lower cleaning liquid supply unit 56 supplies cleaning liquid to the liquid nozzles 52. When the substrate W is being cleaned by the lower brush 51, the liquid nozzles 52 discharge the cleaning liquid supplied from the lower cleaning liquid supply unit 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzles 52.

[0043] The gas ejection unit 53 is a slit-shaped gas injection nozzle having a gas outlet extending in one direction. The gas ejection unit 53 is mounted on the upper surface 54u of the lifting support unit 54 such that, in a plan view, it is located between the lower brush 51 and the adsorption holding unit 21 and the gas injection port faces upward. A gas supply unit 57 (Figure 3) is connected to the gas ejection unit 53. The gas supply unit 57 supplies gas to the gas ejection unit 53.

[0044] In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas ejection unit 53. The gas supplied to the gas ejection unit 53 may be other gases such as clean dry air (CDA). The gas ejection unit 53 sprays the gas supplied from the ejection gas supply unit 57 onto the lower surface of the substrate W when the substrate W is being cleaned by the lower surface brush 51 and when the lower surface of the substrate W is being dried, as described later. In this case, a strip-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding unit 21.

[0045] The lower brush rotation drive unit 55a includes a motor and rotates the lower brush 51 when the lower brush 51 cleans the substrate W. The lower brush lifting drive unit 55b includes a stepping motor or air cylinder and raises and lowers the lifting support unit 54 relative to the moving support unit 55. The lower brush movement drive unit 55c includes a motor and moves the moving support unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the moving support unit 55 is moved in the Y direction by the lower brush movement drive unit 55c, the moving support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 will be called the approach position, and the position of the lower cleaning device 50 when it is furthest from the lower holding device 20 on the movable base 32 will be called the distance position. The gas lifting drive unit 55d includes a stepping motor or an air cylinder and moves the gas ejection unit 53 up and down on the lifting support unit 54.

[0046] A cup device 60 is further provided in the center of the bottom surface 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and so as to be able to move up and down. In Figure 2, the cup 61 is shown by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which part of the lower surface of the substrate W the lower brush 51 is cleaning. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W which is held by the suction holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the suction holding unit 21.

[0047] A pair of upper holding devices 10A and 10B are provided at a height above the cup 61, facing each other with the base device 30 in a plan view. The upper holding devices 10A and 10B have a reference position 10R. The upper holding devices 10A and 10B hold the substrate W such that the center of the substrate W is located at the reference position 10R. Specifically, the upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive unit 13A, and an upper chuck drive unit 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive unit 13B, and an upper chuck drive unit 14B.

[0048] The lower chucks 11A and 11B are arranged symmetrically with respect to a vertical plane that extends in the Y direction (front-to-back direction) through the center of the suction holding portion 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces that can support the lower peripheral edge of the substrate W from below the substrate W. The lower chuck drive units 13A and 13B move the lower chucks 11A and 11B so that they move closer to each other or so that they move away from each other.

[0049] The upper chucks 12A and 12B, like the lower chucks 11A and 11B, are symmetrically arranged with respect to a vertical plane that extends in the Y direction (front-to-back direction) through the center of the suction holding portion 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces configured to contact two portions of the outer peripheral edge of the substrate W and hold the outer peripheral edge of the substrate W. The upper chuck drive units 14A and 14B move the upper chucks 12A and 12B so that they move closer to each other, or so that they move away from each other.

[0050] As shown in Figure 1, a top surface cleaning device 70 is provided on one side of the cup 61, positioned in the vicinity of the upper holding device 10B in a plan view. The top surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and a top surface cleaning drive unit 74.

[0051] The rotating support shaft 71 is supported on the bottom surface 2a by the upper surface cleaning drive unit 74 so as to extend vertically, be able to move up and down, and be rotatable. As shown in Figure 2, the arm 72 is provided above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0052] A top surface cleaning fluid supply unit 75 (Figure 3) is connected to the spray nozzle 73. The top surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the top surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and gas supplied from the top surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downwards.

[0053] The top surface cleaning drive unit 74 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotating support shaft 71 and rotates the rotating support shaft 71. With the above configuration, the entire top surface of the substrate W can be cleaned by moving the spray nozzle 73 in an arc shape on the top surface of the substrate W which is held and rotated by the suction holding unit 21.

[0054] As shown in Figure 1, on the other side of the cup 61, an end cleaning device 80 is provided so as to be located near the upper holding device 10A in a plan view. The end cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush drive unit 84.

[0055] The rotating support shaft 81 is supported on the bottom surface 2a by a bevel brush drive unit 84 so as to extend vertically, be able to move up and down, and be rotatable. As shown in Figure 2, the arm 82 is provided above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and be able to rotate around a vertical axis.

[0056] The bevel brush 83 has an inverted truncated cone shape in its upper half and a truncated cone shape in its lower half. With this bevel brush 83, the outer edge of the substrate W can be cleaned by the central portion in the vertical direction of the outer surface.

[0057] The bevel brush drive unit 84 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotation support shaft 81 and rotates the rotation support shaft 81. With the above configuration, the entire outer edge of the substrate W can be cleaned by bringing the central portion of the outer surface of the bevel brush 83 into contact with the outer edge of the substrate W, which is held and rotated by the suction holding unit 21.

[0058] Here, the bevel brush drive unit 84 further includes a motor built into the arm 82. This motor rotates the bevel brush 83, which is provided at the tip of the arm 82, around a vertical axis. Therefore, when cleaning the outer edge of the substrate W, the rotation of the bevel brush 83 improves the cleaning power of the bevel brush 83 at the outer edge of the substrate W.

[0059] Figure 3 is a block diagram showing the configuration of the control system of the circuit board cleaning apparatus 1. The control device 9 in Figure 3 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read-Only Memory), and a storage device. The RAM is used as the CPU's workspace. The ROM stores the system program. The storage device stores the control program.

[0060] As shown in Figure 3, the control device 9 includes, as functional units, a chuck control unit 9A, a suction control unit 9B, a base control unit 9C, a transfer control unit 9D, a bottom surface cleaning control unit 9E, a cup control unit 9F, a top surface cleaning control unit 9G, a bevel cleaning control unit 9H, and a loading / unloading control unit 9I. The functional units of the control device 9 are realized by the CPU executing a substrate cleaning program stored in a memory device on the RAM. Some or all of the functional units of the control device 9 may be realized by hardware such as electronic circuits.

[0061] The chuck control unit 9A receives the substrate W being brought into the substrate cleaning device 1 and controls the lower chuck drive units 13A, 13B and the upper chuck drive units 14A, 14B to hold it in a position above the suction holding unit 21. The suction control unit 9B controls the suction holding drive unit 22 to hold the substrate W by suction and to rotate the held substrate W.

[0062] The base control unit 9C controls the base drive unit 33 to move the movable base 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holding unit 21.

[0063] The bottom surface cleaning control unit 9E controls the bottom surface brush rotation drive unit 55a, the bottom surface brush lifting drive unit 55b, the bottom surface brush movement drive unit 55c, the gas lifting drive unit 55d, the bottom surface cleaning liquid supply unit 56, and the ejected gas supply unit 57 in order to clean the bottom surface of the substrate W. The cup control unit 9F controls the cup drive unit 62 in order to receive the cleaning liquid that splashes from the substrate W when the substrate W, which is held by the adsorption holding unit 21, is being cleaned in the cup 61.

[0064] The top surface cleaning control unit 9G controls the top surface cleaning drive unit 74 and the top surface cleaning fluid supply unit 75 in order to clean the top surface of the substrate W held by the suction holding unit 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 in order to clean the outer peripheral edge of the substrate W held by the suction holding unit 21. The loading / unloading control unit 9I controls the shutter drive unit 92 in order to open and close the loading / unloading port 2x of the unit housing 2 when loading and unloading the substrate W in the substrate cleaning apparatus 1.

[0065] (2) General operation of the circuit board cleaning device Figures 4 to 15 are schematic diagrams illustrating the general operation of the substrate cleaning apparatus 1 shown in Figure 1. In each of Figures 4 to 15, the top section shows a plan view of the substrate cleaning apparatus 1. The middle section shows a side view of the lower holding device 20 and its surrounding area as seen along the Y direction, and the bottom section shows a side view of the lower holding device 20 and its surrounding area as seen along the X direction. The middle section's side view corresponds to the AA line side view in Figure 1, and the bottom section's side view corresponds to the BB line side view in Figure 1. Note that, in order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the scaling ratio of some components differs between the top section's plan view and the middle and bottom section's side views. Also, in Figures 4 to 15, the cup 61 is shown by a dashed line, and the outline of the substrate W is shown by a thick dashed line.

[0066] In the initial state before the substrate W is loaded into the substrate cleaning device 1, the shutter 91 of the opening / closing device 90 closes the loading / unloading port 2x. Also, as shown in Figure 1, the lower chucks 11A and 11B are maintained at a distance from each other that is sufficiently larger than the diameter of the substrate W. Similarly, the upper chucks 12A and 12B are maintained at a distance from each other that is sufficiently larger than the diameter of the substrate W. The movable base 32 of the base device 30 is positioned such that, in a plan view, the center of the suction holding part 21 is located at the center of the cup 61. The bottom cleaning device 50 is positioned in a close proximity on the movable base 32. The lifting support part 54 of the bottom cleaning device 50 is positioned so that the cleaning surface (upper end) of the bottom brush 51 is below the suction holding part 21.

[0067] Furthermore, in the transfer device 40, the multiple support pins 41 are positioned below the suction holding part 21. In addition, in the cup device 60, the cup 61 is in the lower cup position. In the following description, the center position of the cup 61 in a plan view is referred to as the planar reference position rp. Also, the position of the movable base 32 on the bottom surface 2a when the center of the suction holding part 21 is at the planar reference position rp in a plan view is referred to as the first horizontal position.

[0068] A substrate W is loaded into the unit housing 2 of the substrate cleaning device 1. Specifically, immediately before loading the substrate W, the shutter 91 opens the loading / unloading port 2x. Then, as shown by the thick solid arrow a1 in Figure 4, the hand (substrate holding part) RH of a substrate transport robot (not shown) loads the substrate W through the loading / unloading port 2x to a position approximately in the center of the unit housing 2. At this time, the substrate W held by the hand RH is positioned between the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B, as shown in Figure 4.

[0069] Next, as shown by the thick solid arrow a2 in Figure 5, the lower chucks 11A and 11B move closer to each other so that their multiple support pieces are positioned below the lower peripheral edge of the substrate W. In this state, the hand RH descends and exits through the loading / unloading port 2x. As a result, multiple portions of the lower peripheral edge of the substrate W held by the hand RH are supported by the multiple support pieces of the lower chucks 11A and 11B. After the hand RH exits, the shutter 91 closes the loading / unloading port 2x.

[0070] Next, as shown by the thick solid arrow a3 in Figure 6, the upper chucks 12A and 12B move closer to each other so that their multiple retaining pieces contact the outer peripheral edge of the substrate W. As the multiple retaining pieces of the upper chucks 12A and 12B contact multiple parts of the outer peripheral edge of the substrate W, the substrate W, which is supported by the lower chucks 11A and 11B, is further held by the upper chucks 12A and 12B.

[0071] Furthermore, as shown by the thick solid arrow a4 in Figure 6, the movable base 32 moves forward from the first horizontal position so that the suction holding part 21 is shifted by a predetermined distance from the planar reference position rp and the center of the lower brush 51 is located at the planar reference position rp. In this case, in a plan view, the lower brush 51 coincides with the reference position 10R of the upper holding devices 10A and 10B. At this time, the position of the movable base 32 located on the bottom surface 2a is called the second horizontal position.

[0072] Next, as shown by the thick solid arrow a5 in Figure 7, the lifting support unit 54 rises so that the cleaning surface of the lower brush 51 contacts the central region of the lower surface of the substrate W. Also, as shown by the thick solid arrow a6 in Figure 7, the lower brush 51 rotates (spins) around the central axis 51c. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically removed by the lower brush 51.

[0073] The lower part of Figure 7 shows an enlarged side view of the portion where the lower brush 51 contacts the lower surface of the substrate W, within the nozzle. As shown within the nozzle, with the lower brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection section 53 are held in a position close to the lower surface of the substrate W. At this time, the liquid nozzle 52 discharges cleaning liquid toward the lower surface of the substrate W at a position near the lower brush 51, as indicated by the white arrow a51. As a result, the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W is guided to the contact area between the lower brush 51 and the substrate W, and contaminants removed from the back surface of the substrate W by the lower brush 51 are washed away by the cleaning liquid. Thus, in the lower surface cleaning device 50, the liquid nozzle 52 is attached to the lifting support section 54 together with the lower brush 51. This allows for efficient supply of cleaning liquid to the cleaning portion of the lower surface of the substrate W by the lower brush 51. Therefore, the consumption of cleaning liquid is reduced and excessive splashing of cleaning liquid is suppressed.

[0074] Here, the upper surface 54u of the lifting support section 54 is inclined diagonally downward in the direction away from the suction holding section 21. In this case, when cleaning liquid containing contaminants falls onto the lifting support section 54 from the lower surface of the substrate W, the cleaning liquid received by the upper surface 54u is guided away from the suction holding section 21.

[0075] Furthermore, when the lower brush 51 cleans the central region of the lower surface of the substrate W, the height of the upper end of the gas ejection unit 53 is set at a predetermined distance from the substrate W. This height of the upper end of the gas ejection unit 53 is called the first height. As shown by the white arrow a52 in the ejection outlet in Figure 7, the gas ejection unit 53 ejects gas from the first height toward the lower surface of the substrate W at a position between the lower brush 51 and the adsorption holding unit 21.

[0076] In this embodiment, the gas ejection unit 53 is mounted on the lifting support unit 54 such that the gas nozzle extends in the X direction. In this case, when gas is ejected from the gas ejection unit 53 to the lower surface of the substrate W, a strip-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding unit 21. This prevents the cleaning liquid containing contaminants from scattering toward the adsorption holding unit 21 when the lower surface brush 51 is cleaning the lower surface of the substrate W. Therefore, when the lower surface brush 51 is cleaning the central region of the lower surface of the substrate W, the cleaning liquid containing contaminants is prevented from adhering to the adsorption holding unit 21, and the adsorption surface of the adsorption holding unit 21 is kept clean.

[0077] In the example shown in Figure 7, the gas ejection unit 53 ejects gas diagonally upward toward the lower brush 51, as indicated by the white arrow a52, but the present invention is not limited to this. The gas ejection unit 53 may also eject gas along the Z direction toward the lower surface of the substrate W.

[0078] Furthermore, as shown by the thick solid arrow a53 in Figure 7, when the lower surface brush 51 cleans the central area of ​​the lower surface of the substrate W, the suction holding unit 21 rotates without holding the substrate W. The rotation speed of the suction holding unit 21 at this time is, for example, 500 rpm or more. In this case, even if the cleaning liquid containing scattered contaminants adheres to the suction holding unit 21 when cleaning the central area of ​​the lower surface of the substrate W, the cleaning liquid is shaken off the suction holding unit 21. As a result, the suction surface of the suction holding unit 21 is kept clean.

[0079] Next, in the state shown in Figure 7, once cleaning of the central region of the lower surface of the substrate W is complete, the rotation of the lower brush 51 stops, and the lifting support unit 54 lowers so that the cleaning surface of the lower brush 51 is separated from the substrate W by a predetermined distance. Also, the discharge of cleaning liquid from the liquid nozzle 52 to the substrate W stops, and the rotation of the adsorption holding unit 21 stops. Meanwhile, as shown in Figure 8, the injection of gas from the gas ejection unit 53 to the substrate W continues.

[0080] At this time, as shown by the thick solid arrow a54 in Figure 8, the gas ejection unit 53 is raised by the gas lifting drive unit 55d in Figure 3. As a result, the upper end of the gas ejection unit 53 is closer to the bottom surface of the substrate W than when cleaning the central region of the bottom surface of the substrate W. The upper end of the gas ejection unit 53 may be located above the cleaning surface of the bottom brush 51. The height of the upper end of the gas ejection unit 53 at this time is called the second height. In this case, gas is ejected from the gas ejection unit 53 toward the substrate W from the second height, which is closer to the bottom surface of the substrate W than the first height. In this case, since the bottom surface of the substrate W and the upper end of the gas ejection unit 53 are in close proximity, the bottom surface of the substrate W is dried efficiently.

[0081] Subsequently, as shown by the thick solid arrow a7 in Figure 8, the movable base 32 moves backward so that the adsorption holding unit 21 is positioned at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. In this case, in a plan view, the adsorption holding unit 21 coincides with the reference position 10R of the upper holding devices 10A and 10B. At this time, the injection of gas from the gas ejection unit 53 onto the substrate W continues, and the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

[0082] Next, as shown by the thick solid arrow a8 in Figure 9, the lifting support unit 54 descends so that the cleaning surface of the lower brush 51 is positioned below the suction surface (upper end) of the suction holding unit 21. Also, as shown by the thick solid arrow a9 in Figure 9, the upper chucks 12A and 12B move away from each other so that the multiple holding pieces of the upper chucks 12A and 12B are separated from the outer edge of the substrate W. At this time, the substrate W is supported by the lower chucks 11A and 11B.

[0083] Subsequently, as shown by the thick solid arrow a10 in Figure 9, the pin connecting member 42 rises so that the upper ends of the multiple support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the multiple support pins 41.

[0084] Next, as shown by the thick solid arrow a11 in Figure 10, the lower chucks 11A and 11B move away from each other. At this time, the lower chucks 11A and 11B move to a position where they do not overlap with the substrate W supported by the multiple support pins 41 in a plan view. As a result, the upper holding devices 10A and 10B both return to their initial state.

[0085] Next, as shown by the thick solid arrow a12 in Figure 11, the pin connecting member 42 descends so that the upper ends of the multiple support pins 41 are positioned below the suction holding part 21. As a result, the substrate W supported on the multiple support pins 41 is received by the suction holding part 21. In this state, the suction holding part 21 holds the central region of the lower surface of the substrate W by suction. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 rises from the lower cup position to the upper cup position, as shown by the thick solid arrow a13 in Figure 11.

[0086] Next, as shown by the thick solid arrow a14 in Figure 12, the suction holding unit 21 rotates around the vertical axis (the axis of rotation of the suction holding drive unit 22). As a result, the substrate W held by the suction holding unit 21 rotates in a horizontal position.

[0087] Next, the rotating support shaft 71 of the top surface cleaning device 70 rotates and descends. As a result, as shown by the thick solid arrow a15 in Figure 12, the spray nozzle 73 moves to a position above the substrate W, and descends until the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of cleaning liquid and gas onto the top surface of the substrate W. The rotating support shaft 71 also rotates. As a result, as shown by the thick solid arrow a16 in Figure 12, the spray nozzle 73 moves to a position above the rotating substrate W. The mixed fluid is sprayed over the entire top surface of the substrate W, cleaning the entire top surface of the substrate W.

[0088] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotation support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer edge of the substrate W, as shown by the thick solid arrow a17 in Figure 12. The bevel brush 83 also descends so that the central part of its outer surface contacts the outer edge of the substrate W. In this state, the bevel brush 83 rotates (spins) around its vertical axis. As a result, contaminants adhering to the outer edge of the substrate W are physically removed by the bevel brush 83. The contaminants removed from the outer edge of the substrate W are washed away by the cleaning solution, which is a mixed fluid, sprayed onto the substrate W from the spray nozzle 73.

[0089] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support unit 54 rises so that the cleaning surface of the lower brush 51 contacts the outer lower surface area of ​​the substrate W. Also, as shown by the thick solid arrow a18 in Figure 12, the lower brush 51 rotates (spins) around the central axis 51c. In addition, the liquid nozzle 52 discharges cleaning liquid toward the lower surface of the substrate W, and the gas ejection unit 53 sprays gas toward the lower surface of the substrate W. As a result, the entire outer lower surface area of ​​the substrate W, which is held and rotated by the adsorption holding unit 21, can be cleaned by the lower brush 51.

[0090] If the lower brush 51 is not relatively large, the movable support unit 55 may move back and forth between an approaching position and a separated position on the movable base 32, as shown by the thick solid arrow a19 in Figure 12. Even in this case, the entire outer region of the lower surface of the substrate W, which is held and rotated by the suction holding unit 21, can be cleaned by the lower brush 51.

[0091] Next, once cleaning of the top surface, outer edge, and outer lower surface area of ​​the substrate W is complete, the spraying of the mixed fluid from the spray nozzle 73 to the substrate W is stopped. Also, as shown by the thick solid arrow a20 in Figure 13, the spray nozzle 73 moves to a position on one side of the cup 61 (initial position). Also, as shown by the thick solid arrow a21 in Figure 13, the bevel brush 83 moves to a position on the other side of the cup 61 (initial position). Furthermore, the rotation of the lower brush 51 is stopped, and the lifting support unit 54 lowers so that the cleaning surface of the lower brush 51 is a predetermined distance away from the substrate W. Also, the discharge of cleaning liquid from the liquid nozzle 52 to the substrate W and the spraying of gas from the gas ejection unit 53 to the substrate W are stopped. In this state, the adsorption holding unit 21 rotates at high speed, shaking off the cleaning liquid adhering to the substrate W, and the entire substrate W is dried.

[0092] Next, as shown by the thick solid arrow a22 in Figure 14, the cup 61 descends from the upper cup position to the lower cup position. Also, in preparation for the loading of a new substrate W into the unit housing 2, the lower chucks 11A and 11B move closer to each other to a position where they can support the new substrate W, as shown by the thick solid arrow a23 in Figure 14.

[0093] Finally, the substrate W is discharged from the unit housing 2 of the substrate cleaning device 1. Specifically, the shutter 91 opens the input / output port 2x immediately before the substrate W is discharged. Then, as shown by the thick solid arrow a24 in Figure 15, the hand (substrate holding part) RH of a substrate transport robot (not shown) enters the unit housing 2 through the input / output port 2x. Subsequently, the hand RH receives the substrate W on the suction holding part 21 and exits through the input / output port 2x. After the hand RH exits, the shutter 91 closes the input / output port 2x.

[0094] (3) Substrate cleaning process Figures 16 and 17 are flowcharts showing the substrate cleaning process performed by the control device 9 in Figure 3. The substrate cleaning process in Figures 16 and 17 is performed by the CPU of the control device 9 executing a substrate cleaning program stored in the memory device on the RAM. The substrate cleaning process will be explained below using the control device 9 in Figure 3 and the substrate cleaning apparatus 1 in Figures 4 to 15, along with the flowcharts in Figures 16 and 17.

[0095] First, the loading / unloading control unit 9I loads the substrate W into the unit housing 2 by controlling the shutter drive unit 92 (Figures 4 and 5 and step S1). Next, the chuck control unit 9A controls the lower chuck drive units 13A and 13B and the upper chuck drive units 14A and 14B to hold the substrate W with the upper holding devices 10A and 10B (Figures 5 and 6 and step S2).

[0096] Next, the base control unit 9C controls the base drive unit 33 to move the movable base 32 from the first horizontal position to the second horizontal position (Figure 6 and step S3). Subsequently, the suction control unit 9B controls the suction holding drive unit 22 to rotate the suction holding unit 21 around the axis of the rotation shaft of the suction holding drive unit 22 while the suction holding unit 21 is not holding the substrate W (Figure 7 and step S4).

[0097] Furthermore, the bottom surface cleaning control unit 9E controls the bottom surface brush rotation drive unit 55a, the bottom surface brush lifting drive unit 55b, the bottom surface brush movement drive unit 55c, the bottom surface cleaning liquid supply unit 56, and the ejected gas supply unit 57 to clean the entire central region of the bottom surface of the substrate W (Figure 7 and step S5). At this time, the upper end of the gas ejection unit 53 is at the first height.

[0098] Next, the bottom surface cleaning control unit 9E controls the gas lifting drive unit 55d to raise the gas ejection unit 53 (Figure 8 and step S6). In this case, the upper end of the gas ejection unit 53 is at the second height. The bottom surface cleaning control unit 9E also controls the ejected gas supply unit 57 to dry the substrate W (Figure 8 and step S7). Furthermore, the base control unit 9C controls the base drive unit 33 to move the movable base 32 from the second horizontal position to the first horizontal position (Figure 8 and step S8). In this example, steps S7 and S8 are executed almost simultaneously. As a result, the central region of the bottom surface of the substrate W is dried sequentially.

[0099] Next, the chuck control unit 9A controls the lower chuck drive units 13A, 13B and the upper chuck drive units 14A, 14B, while the transfer control unit 9D controls the pin lifting drive unit 43, thereby transferring the substrate W from the upper holding devices 10A, 10B to the lower holding device 20 (Figures 8 to 11 and step S9). In this state, the suction control unit 9B controls the suction holding drive unit 22 to suction the central region of the lower surface of the substrate W, thereby allowing the lower holding device 20 to hold the substrate W (Figure 11 and step S10).

[0100] Subsequently, the upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the entire upper surface of the substrate W (Figure 12 and step S11). In addition, the bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W (Figure 12 and step S12). Furthermore, the lower surface cleaning control unit 9E controls the lower brush rotation drive unit 55a, the lower brush lifting drive unit 55b, the lower brush moving drive unit 55c, the lower surface cleaning fluid supply unit 56, and the ejected gas supply unit 57 to clean the entire outer region of the lower surface of the substrate W (Figure 12 and step S13).

[0101] Steps S11 to S13 are executed almost simultaneously. During the execution of steps S11 to S13, the adsorption control unit 9B controls the adsorption holding drive unit 22 to rotate the substrate W around the axis of the rotation shaft of the adsorption holding drive unit 22. At the same time, the cup control unit 9F controls the cup drive unit 62 to raise the cup 61 from the lower cup position to the upper cup position.

[0102] After the cleaning is complete, the suction control unit 9B controls the suction holding drive unit 22 to rotate the suction holding unit 21 at high speed, thereby drying the entire substrate W (Figure 13 and step S14). After drying, the upper holding devices 10A, 10B and the cup 61, etc., are returned to their initial state (Figure 14). Finally, the loading / unloading control unit 9I controls the shutter drive unit 92 to unload the substrate W from inside the unit housing 2 (Figure 15 and step S15), thus ending the substrate cleaning process.

[0103] (4) Effects In the substrate cleaning apparatus 1 according to this embodiment, when cleaning the central region of the lower surface of the substrate W, the substrate W is held by the upper holding devices 10A and 10B so that the center of the substrate W is positioned at a reference position 10R. In this state, the lower brush 51 comes into contact with the central region of the lower surface of the substrate W. At this time, the suction holding unit 21 rotates around the vertical axis without holding the substrate W. In addition, gas is ejected toward the substrate W from a first height, which is a predetermined distance away from the substrate W, by a gas ejection unit 53 positioned between the lower brush 51 and the suction holding unit 21.

[0104] During drying of the central region of the lower surface of the substrate W, gas is ejected from the gas ejection unit 53 from a second height, which is closer to the substrate W than the first height, toward the substrate W. During cleaning of the outer region of the lower surface of the substrate W, the lower surface brush 51 comes into contact with the outer region of the lower surface of the substrate W while the substrate W is rotated around its vertical axis, with the substrate W being held in place by the suction holding unit 21. By moving the movable base 32 to the first horizontal position, the substrate W can be easily transferred between the upper holding devices 10A, 10B and the suction holding unit 21.

[0105] With this configuration, when cleaning the central region of the lower surface, the movable base 32 moves to a second horizontal position, thereby retracting the adsorption holding unit 21 to a position where it does not overlap with the substrate W. In addition, the gas ejection unit 53 forms a gas curtain between the lower surface brush 51 and the adsorption holding unit 21. In this case, it is prevented that the cleaning liquid containing contaminants from the substrate W will scatter toward the adsorption holding unit 21. Furthermore, when drying the central region of the lower surface, the gas ejection unit 53 is in close proximity to the lower surface of the substrate W, and gas is ejected from the gas ejection unit 53 onto the lower surface of the substrate W, so that the central region of the lower surface is dried efficiently. As a result, it is prevented that the cleaning liquid adheres to the adsorption holding unit 21.

[0106] Even if cleaning solution containing contaminants scattered from the substrate W adheres to the adsorption and holding unit 21, the rotation of the adsorption and holding unit 21 will shake off the cleaning solution. This allows the adsorption and holding unit 21 to be kept clean. Here, if the rotation speed of the adsorption and holding unit 21 is 500 rpm or higher, the cleaning solution adhering to the adsorption and holding unit 21 can be shaken off in a short time.

[0107] The lower brush 51 and the gas ejection unit 53 are supported by a common lifting support unit 54. In this case, the movement of the lower brush 51 and the gas ejection unit 53 is performed integrally according to the position of the substrate W. Therefore, the lower surface of the substrate W can be cleaned efficiently. Furthermore, since the gas ejection unit 53 is provided to be vertically movable, even when the lower brush 51 and the gas ejection unit 53 are supported by a common lifting support unit 54, the gas ejection unit 53 can be brought closer to the substrate W than when cleaning the central region of the lower surface of the substrate W during drying. Therefore, the lower surface of the substrate W can be dried efficiently.

[0108] (5) Other embodiments (a) In the above embodiment, the suction holding unit 21 is rotated without holding the substrate W when cleaning the central region of the lower surface of the substrate W. Also, gas is ejected toward the substrate W from the gas ejection unit 53 from different heights during cleaning and drying of the central region of the lower surface of the substrate W. However, the embodiment is not limited to this. If either of the above two operations is performed, the other does not need to be performed.

[0109] Specifically, if the suction holding unit 21 rotates without holding the substrate W during cleaning of the central region of the lower surface, the gas ejection unit 53 does not need to be raised and lowered during cleaning and drying of the central region of the lower surface. Alternatively, the substrate cleaning device 1 does not need to include the gas ejection unit 53. On the other hand, if the gas ejection unit 53 is raised and lowered during cleaning and drying of the central region of the lower surface, the suction holding unit 21 does not need to rotate without holding the substrate W during cleaning of the central region of the lower surface.

[0110] (b) In the above embodiment, the lower brush 51 may be cleaned using a brush or spray (not shown). The spray may be a two-fluid spray that supplies liquid and gas. Also, gas may be ejected from the gas ejection unit 53 while the lower brush 51 is being cleaned. In this case, it is prevented that the liquid containing contaminants will be scattered from the lower brush 51 toward the adsorption and holding unit 21.

[0111] Alternatively, the suction holding unit 21 may rotate even while the lower brush 51 is being cleaned, without holding the substrate W. In this case, even if liquid containing contaminants scattered from the lower brush 51 adheres to the suction holding unit 21, the rotation of the suction holding unit 21 will shake the liquid off the suction holding unit 21. This allows the suction holding unit 21 to be kept clean.

[0112] (c) In the above embodiment, the lower outer region of the substrate W is cleaned by the lower holding device 20 after the lower central region of the substrate W is cleaned by the upper holding devices 10A and 10B, but the embodiment is not limited thereto. The lower central region of the substrate W may be cleaned by the upper holding devices 10A and 10B after the lower outer region of the substrate W is cleaned by the lower holding device 20.

[0113] (d) In the above embodiment, the lower brush 51 and the gas ejection section 53 are supported by a common lifting support section 54, but the embodiment is not limited to this. The lower brush 51 and the gas ejection section 53 may be supported by separate support sections. Also, the suction holding section 21, the lower brush 51 and the gas ejection section 53 are provided on the movable base 32, but the embodiment is not limited to this. The suction holding section 21, the lower brush 51 and the gas ejection section 53 do not have to be provided on the movable base 32.

[0114] (e) In the above embodiment, the movable base 32 moves linearly in a horizontal plane, but the embodiment is not limited thereto. The movable base 32 may move curved in a horizontal plane.

[0115] (f) In the above embodiment, the substrate cleaning apparatus 1 includes a transfer device 40 for transferring the substrate W between the upper holding devices 10A, 10B and the lower holding device 20, but the embodiment is not limited thereto. If the upper holding devices 10A, 10B and the lower holding device 20 are configured to allow direct transfer of the substrate W, the substrate cleaning apparatus 1 does not need to include the transfer device 40.

[0116] (g) In the above embodiment, the top surface and outer edge of the substrate W are cleaned, but the embodiment is not limited thereto. The top surface of the substrate W does not need to be cleaned. In this case, the substrate cleaning device 1 does not include the top surface cleaning device 70. Similarly, the outer edge of the substrate W does not need to be cleaned. In this case, the substrate cleaning device 1 does not include the edge cleaning device 80.

[0117] (h) In the above embodiment, the substrate cleaning apparatus 1 includes a control device 9, but the embodiment is not limited thereto. If the substrate cleaning apparatus 1 is configured to be controllable by an external information processing device, the substrate cleaning apparatus 1 does not need to include a control device 9.

[0118] (6) Correspondence between each component of the claim and each part of the embodiment The following describes examples of the correspondence between each component of the claims and each element of the embodiments, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0119] In the above embodiment, the reference position 10R is an example of a reference position, the substrate W is an example of a substrate, the upper holding devices 10A, 10B and the suction holding part 21 are examples of the first and second holding parts, respectively, and the lower brush 51 is an example of a cleaning tool. The movable base 32 is an example of a movable base, the substrate cleaning device 1 is an example of a substrate cleaning device, the linear guide 31 is an example of a linear guide, the gas ejection part 53 is an example of a gas ejection part, and the lifting support part 54 is an example of a support part. [Explanation of Symbols]

[0120] 1...Substrate cleaning device, 2...Unit housing, 2a...Bottom section, 2b~2e...Side wall section, 9...Control device, 9A...Chuck control section, 9B...Suction control section, 9C...Base control section, 9D...Transfer control section, 9E...Bottom cleaning control section, 9F...Cup control section, 9G...Top cleaning control section, 9H...Bevel cleaning control section, 9I...Loading / unloading control section, 10A, 10B...Upper holding device, 10R...Reference position, 11A, 11B... Lower chuck, 12A, 12B... Upper chuck, 13A, 13A... Lower chuck drive unit, 14A, 14B... Upper chuck drive unit, 20... Lower holding device, 21... Suction holding unit, 22... Suction holding drive unit, 30... Base device, 31... Linear guide, 32... Movable base, 33... Base drive unit, 40... Transfer device, 41... Support pin, 42... Pin connecting member, 43... Pin lifting / lowering 50... Drive unit, 51... Bottom cleaning device, 52... Bottom brush, 53... Liquid nozzle, 54... Gas ejection unit, 54u... Lifting support unit, 55u... Top surface, 55... Moving support unit, 55a... Bottom brush rotation drive unit, 55b... Bottom brush lifting drive unit, 55c... Bottom brush moving drive unit, 55d... Gas lifting drive unit, 56... Bottom cleaning liquid supply unit, 57... Gas ejection supply unit, 60... Cup device, 61... Cup P, 62...Cup drive unit, 70...Top surface cleaning device, 71, 81...Rotating support shaft, 72, 82...Arm, 73...Spray nozzle, 74...Top surface cleaning drive unit, 75...Top surface cleaning fluid supply unit, 80...End cleaning device, 83...Bevel brush, 84...Bevel brush drive unit, 90...Opening / closing device, 91...Shutter, 92...Shutter drive unit, RH...Hand, rp...Plane reference position, W...Substrate

Claims

1. a first holder having a reference position and configured to hold the substrate so that the center of the substrate is positioned at the reference position; a second holding portion configured to be rotatable around a vertical axis and to hold a central region of a lower surface of the substrate; a cleaning tool that cleans the lower surface central region by contacting the lower surface central region of the substrate held by the first holding part, and cleans the lower surface outer region by contacting the lower surface outer region surrounding the lower surface central region of the substrate rotated by the second holding part; a movable base that is provided with the second holding part and the cleaning tool, and that moves within a horizontal plane so that, when the substrate is transferred between the first holding part and the second holding part, the second holding part overlaps the reference position of the first holding part in a plan view, and when the central region of the lower surface is cleaned, the cleaning tool overlaps the reference position of the first holding part in a plan view, The substrate cleaning apparatus, wherein the second holder rotates without holding the substrate when cleaning the central region of the lower surface.

2. The substrate cleaning apparatus according to claim 1 , further comprising a gas ejection unit disposed between the cleaning tool and the second holder and configured to eject gas toward the substrate.

3. Further provided is a linear guide extending in one direction within the horizontal plane, 3. The substrate cleaning apparatus according to claim 1, wherein the movable base moves linearly along the linear guide.

4. 4. The substrate cleaning apparatus according to claim 1, wherein the rotation speed of the second holder during cleaning of the central region of the lower surface is 500 rpm or more.

5. a first holder that holds the substrate; a second holding unit that holds a central region of a lower surface of the substrate and rotates the substrate around a vertical axis; a cleaning tool that cleans the lower surface central region by contacting the lower surface central region of the substrate held by the first holding part, and cleans the lower surface outer region by contacting the lower surface outer region surrounding the lower surface central region of the substrate rotated by the second holding part; a gas ejection unit that is arranged between the cleaning tool and the second holding unit so as to be movable up and down, and that ejects gas toward the substrate from a first height that is spaced a predetermined distance from the substrate when cleaning the central region of the lower surface, and that ejects gas toward the substrate from a second height that is closer to the substrate than the first height when drying the central region of the lower surface.

6. The substrate cleaning apparatus according to claim 5 , wherein the second holder rotates without holding the substrate when cleaning the central region of the lower surface.

7. The substrate cleaning apparatus according to claim 5 , further comprising a common support part for supporting the cleaning tool and the gas ejection part.

8. holding the substrate by a first holding part so that the center of the substrate is positioned at a reference position when cleaning the central region of the lower surface of the substrate; rotating the second holder around a vertical axis without holding the substrate when cleaning the central region of the lower surface; bringing a cleaning tool into contact with the central region of the lower surface of the substrate held by the first holding part when cleaning the central region of the lower surface; rotating the substrate around a vertical axis while holding the lower surface central region of the substrate with the second holding part when cleaning the lower surface outer region surrounding the lower surface central region of the substrate; When cleaning the outer lower surface region, bringing the cleaning tool into contact with the outer lower surface region of the substrate rotated by the second holding part; a movable base on which the second holding part and the cleaning tool are mounted, being moved within a horizontal plane so that, when the substrate is transferred between the first holding part and the second holding part, the second holding part overlaps the reference position of the first holding part in a planar view, and when the central region of the lower surface is cleaned, the cleaning tool overlaps the reference position of the first holding part in a planar view.

9. The substrate cleaning method according to claim 8 , further comprising: ejecting gas toward the substrate from a gas ejection part disposed between the cleaning tool and the second holder.

10. 10. The substrate cleaning method according to claim 8, wherein moving the movable base in a horizontal plane includes moving the movable base linearly along a linear guide extending in one direction in the horizontal plane.

11. 11. The substrate cleaning method according to claim 8, wherein rotating the second holder around a vertical axis in a state where the second holder does not hold the substrate comprises rotating the second holder at a rotational speed of 500 rpm or more.

12. holding the substrate with a first holding part when cleaning the central region of the lower surface of the substrate; bringing a cleaning tool into contact with the central region of the lower surface of the substrate held by the first holding part when cleaning the central region of the lower surface; rotating the substrate around a vertical axis while holding the lower surface central region of the substrate with a second holding part when cleaning the lower surface outer region surrounding the lower surface central region of the substrate; When cleaning the outer lower surface region, bringing the cleaning tool into contact with the outer lower surface region of the substrate rotated by the second holding part; a gas ejection unit disposed between the cleaning tool and the second holding unit ejecting gas toward the substrate from a first height spaced a predetermined distance from the substrate when cleaning the central region of the lower surface, and a gas ejection unit disposed between the cleaning tool and the second holding unit ejecting gas toward the substrate from a second height closer to the substrate than the first height when drying the central region of the lower surface.

13. The substrate cleaning method according to claim 12 , further comprising: rotating the second holder about a vertical axis in a state where the second holder does not hold the substrate when cleaning the central region of the lower surface.

14. 14. The substrate cleaning method according to claim 12, wherein the cleaning tool and the gas ejection part are supported by a common support part.

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