Substrate suction member, elastic seal assembly, top ring, and substrate treatment apparatus

Abstract

To surely suck a substrate regardless of flatness of a sucked surface of a substrate.SOLUTION: A substrate suction member 330 includes: a porous member 334 having a substrate suction surface 334a for sucking a substrate WF and a decompression part 334b communicating with decompression means; a shielding member 332 having a first shielding member 332-1 for shielding a surface 334c opposite to the substrate suction surface 334a of the porous member 334, and a frame-like second shielding member 332-2 for shielding at least a part of a side face 334d of the porous member 334; and a frame-like elastic seal member 336 mounted on the second shielding member 332-2 so as to surround the porous member 334, and having a contact surface 336a brought into contact with the substrate WF.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present application relates to a substrate suction member, an elastic seal assembly, a top ring, and a substrate processing apparatus. [Background technology]

[0002] Chemical mechanical polishing (CMP) equipment is used to planarize the surface of a substrate in the manufacture of semiconductor devices. The substrates used in semiconductor device manufacturing are often disk-shaped. In addition to semiconductor devices, there is also a growing demand for flatness when planarizing the surfaces of rectangular substrates such as copper clad laminate (CCL) substrates, printed circuit board (PCB) substrates, photomask substrates, and display panels. There is also a growing demand for planarizing the surfaces of package substrates on which electronic devices are mounted, such as PCB substrates.

[0003] Substrate processing apparatuses such as chemical mechanical polishing apparatuses include a top ring for holding a substrate. As described in Patent Document 1, for example, the top ring includes a rotating shaft, a flange connected to the rotating shaft, a porous suction plate fitted into an opening formed in the center of the lower surface of the flange, and a shield plate attached to the upper surface of the suction plate. The top ring is configured to suck the substrate by vacuum suction through the fine holes in the suction plate and to press the substrate against a polishing pad by applying pressure to the shield plate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 3668529 Summary of the Invention [Problem to be solved by the invention]

[0005] The top ring of the prior art as described in Patent Document 1 has room for improvement in terms of reliably attracting a substrate regardless of the flatness of the surface of the substrate to be attracted.

[0006] In other words, conventional top rings can adsorb a substrate to a suction plate by vacuum suction if the substrate surface is flat. However, if the surface is not flat, for example, if the periphery of the substrate surface is recessed, air leaks from the gaps created by the recess, weakening the suction force and making it impossible to adsorb the substrate to the suction plate.

[0007] Therefore, one object of the present invention is to reliably attract a substrate regardless of the flatness of the surface of the substrate to be attracted. [Means for solving the problem]

[0008] According to one embodiment, a substrate adsorption member is disclosed, comprising: a porous member having a substrate adsorption surface for adsorbing a plate and a pressure reduction section communicating with a pressure reduction means; a shielding member having a first shielding member that shields the surface of the porous member opposite the substrate adsorption surface and a frame-shaped second shielding member that shields at least a portion of the side of the porous member; and a frame-shaped elastic sealing member attached to the second shielding member so as to surround the porous member and having a contact surface that contacts the substrate. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to one embodiment; [Figure 2] FIG. 2 is a perspective view schematically illustrating a configuration of a polishing unit according to one embodiment. [Figure 3A] FIG. 1 is a cross-sectional view schematically illustrating a top ring according to an embodiment. [Figure 3B] FIG. 2 is a plan view schematically illustrating a top ring according to an embodiment. [Figure 4] FIG. 2 is a cross-sectional view schematically illustrating a top ring and a substrate according to an embodiment. [Figure 5] FIG. 1 is a cross-sectional view schematically illustrating a top ring according to an embodiment. [Figure 6] FIG. 2 is an enlarged cross-sectional view schematically illustrating a portion of a top ring according to an embodiment. [Figure 7] FIG. 2 is an enlarged cross-sectional view schematically illustrating a portion of a top ring according to an embodiment. [Figure 8] 1 is a perspective view schematically illustrating a configuration of an elastic seal assembly according to one embodiment. [Figure 9] 1 is a perspective view showing a schematic configuration of a substrate suction member including an elastic seal assembly according to an embodiment; [Figure 10] FIG. 1 is a cross-sectional view schematically illustrating a top ring according to an embodiment. [Figure 11] FIG. 1 is a cross-sectional view schematically illustrating a top ring according to an embodiment. [Figure 12] FIG. 2 is an enlarged cross-sectional view of a portion of a top ring according to an embodiment. [Figure 13] FIG. 2 is an enlarged perspective view of a portion of the elastic seal member according to the embodiment. [Figure 14] FIG. 2 is an enlarged cross-sectional view of a portion of a top ring according to an embodiment. [Figure 15] FIG. 2 is an enlarged cross-sectional view of a portion of a top ring according to an embodiment. [Figure 16] FIG. 2 is an enlarged perspective view showing a portion of the substrate attracting member according to the embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of a substrate suction member, an elastic seal assembly, a top ring, and a substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, identical or similar elements are designated by identical or similar reference numerals, and duplicate descriptions of identical or similar elements may be omitted in the description of each embodiment. Furthermore, features shown in each embodiment may also be applied to other embodiments as long as they are not mutually inconsistent.

[0011] FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus 1000 according to one embodiment. The substrate processing apparatus 1000 shown in FIG. 1 includes a load unit 100, a transfer unit 200, a polishing unit 300, a drying unit 500, and an unload unit 600. In the illustrated embodiment, the transfer unit 200 includes two transfer units 200A and 200B, and the polishing unit 300 includes two polishing units 300A and 300B. In one embodiment, each of these units can be formed independently. By forming these units independently, substrate processing apparatuses 1000 with different configurations can be easily formed by arbitrarily combining the number of each unit. The substrate processing apparatus 1000 also includes a control device 900, which controls each component of the substrate processing apparatus 1000. In one embodiment, the control device 900 can be configured as a general computer including an input / output device, a calculation device, a storage device, and the like.

[0012] <Load unit> The load unit 100 is a unit for introducing a substrate WF before processing such as polishing and cleaning into the substrate processing apparatus 1000. In one embodiment, the load unit 100 is configured to comply with the SMEMA (Surface Mount Equipment Manufacturers Association) Mechanical Device Interface Standard (IPC-SMEMA-9851).

[0013] In the illustrated embodiment, the transport mechanism of the load unit 100 has a plurality of transport rollers 202 and a plurality of roller shafts 204 to which the transport rollers 202 are attached. In the embodiment shown in FIG. 1, three transport rollers 202 are attached to each roller shaft 204. The substrate WF is placed on the transport rollers 202, and is transported by the rotation of the transport rollers 202. The transport rollers 202 may be attached at any position on the roller shaft 204 as long as the substrate WF can be transported stably. However, since the transport rollers 202 come into contact with the substrate WF, they should be positioned so that they come into contact with an area of ​​the substrate WF to be processed where there is no problem. In one embodiment, the transport rollers 202 of the load unit 100 can be made of a conductive polymer. In one embodiment, the transport rollers 202 are electrically grounded via the roller shaft 204 or the like. This is to prevent the substrate WF from becoming charged and damaging the substrate WF. In one embodiment, the load unit 100 may also be provided with an ionizer (not shown) to prevent the substrate WF from becoming charged.

[0014] <Transport unit> 1 includes two transport units 200A and 200B. The two transport units 200A and 200B can have the same configuration, and therefore will be collectively referred to as the transport unit 200 in the following description.

[0015] The transport unit 200 shown in the figure is equipped with a plurality of transport rollers 202 for transporting the substrate WF. By rotating the transport rollers 202, the substrate WF on the transport rollers 202 can be transported in a predetermined direction. The transport rollers 202 of the transport unit 200 may be formed from a conductive polymer or a non-conductive polymer. The transport rollers 202 are driven by a motor (not shown). The substrate WF is transported to a substrate transfer position by the transport rollers 202.

[0016] In one embodiment, the transport unit 200 includes a cleaning nozzle 284. The cleaning nozzle 284 is connected to a cleaning liquid supply source (not shown). The cleaning nozzle 284 is configured to supply the cleaning liquid to the substrate WF transported by the transport rollers 202.

[0017] <Polishing unit> Fig. 2 is a perspective view schematically illustrating the configuration of a polishing unit 300 according to one embodiment. The substrate processing apparatus 1000 shown in Fig. 1 includes two polishing units 300A and 300B. The two polishing units 300A and 300B can have the same configuration, and therefore will be collectively referred to as the polishing unit 300 below.

[0018] As shown in FIG. 2 , the polishing unit 300 includes a polishing table 350 and a top ring 302 constituting a polishing head that holds a substrate, which is a polishing target, and presses it against the polishing surface of the polishing table 350. The polishing table 350 is connected to a polishing table rotation motor (not shown) disposed below the table shaft 351 and is rotatable about the table shaft 351. A polishing pad 352 is attached to the upper surface of the polishing table 350, and a surface 352a of the polishing pad 352 forms the polishing surface that polishes the substrate. In one embodiment, the polishing pad 352 may be attached via a layer that facilitates removal from the polishing table 350. Such a layer may be, for example, a silicone layer or a fluorine-based resin layer, and those described in, for example, Japanese Patent Application Laid-Open No. 2014-176950 may be used.

[0019] A polishing liquid supply nozzle 354 is provided above the polishing table 350, and the polishing liquid is supplied onto the polishing pad 352 on the polishing table 350 by this polishing liquid supply nozzle 354. As shown in FIG. 2, the polishing table 350 and the table shaft 351 are provided with a passage 353 for supplying the polishing liquid. The passage 353 communicates with an opening 355 in the surface of the polishing table 350. A through-hole 357 is formed in the polishing pad 352 at a position corresponding to the opening 355 in the polishing table 350, and the polishing liquid passing through the passage 353 is supplied to the surface of the polishing pad 352 through the opening 355 in the polishing table 350 and the through-hole 357 in the polishing pad 352. The opening 355 in the polishing table 350 and the through-hole 357 in the polishing pad 352 may be one or more. The positions of the opening 355 in the polishing table 350 and the through-hole 357 in the polishing pad 352 are arbitrary, but in one embodiment, they are located near the center of the polishing table 350.

[0020] 2, in one embodiment, the polishing unit 300 includes an atomizer 358 (see FIG. 1) for spraying a liquid or a mixture of liquid and gas toward the polishing pad 352. The liquid sprayed from the atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen gas.

[0021] The top ring 302 is connected to a top ring shaft 18, which is movable up and down relative to a swing arm 360 by a vertical movement mechanism 319. The vertical movement of the top ring shaft 18 moves the entire top ring 302 up and down relative to the swing arm 360, thereby positioning it. The top ring shaft 18 is rotated by a top ring rotation motor (not shown). The rotation of the top ring shaft 18 causes the top ring 302 to rotate around the top ring shaft 18.

[0022] The top ring 302 is capable of holding a rectangular substrate on its underside. The swing arm 360 is rotatable about a support shaft 362. The swing arm 360 rotates to move the top ring 302 between the substrate transfer position of the transport unit 200 and above the polishing table 350. By lowering the top ring shaft 18, the top ring 302 can be lowered to press the substrate against the surface (polishing surface) 352a of the polishing pad 352. At this time, the top ring 302 and the polishing table 350 are rotated, and a polishing liquid is supplied onto the polishing pad 352 from a polishing liquid supply nozzle 354 provided above the polishing table 350 and / or from an opening 355 provided in the polishing table 350. In this manner, the surface of the substrate WF can be polished by pressing it against the polishing surface 352a of the polishing pad 352. During polishing of the substrate WF, the arm 360 may be fixed or swung so that the top ring 302 passes through the center of the polishing pad 352 (so as to cover the through-hole 357 of the polishing pad 352).

[0023] The up-and-down movement mechanism 319 that moves the top ring shaft 18 and the top ring 302 up and down includes a bridge 28 that rotatably supports the top ring shaft 18 via a bearing 321, a ball screw 32 attached to the bridge 28, a support base 29 supported by a support column 130, and an AC servo motor 38 provided on the support base 29. The support base 29 that supports the servo motor 38 is fixed to a swing arm 360 via the support column 130.

[0024] The ball screw 32 includes a screw shaft 32a connected to a servo motor 38 and a nut 32b onto which the screw shaft 32a is threaded. The top ring shaft 18 moves up and down integrally with the bridge 28. Therefore, when the servo motor 38 is driven, the bridge 28 moves up and down via the ball screw 32, which in turn moves the top ring shaft 18 and the top ring 302 up and down.

[0025] The polishing unit 300 according to one embodiment includes a dressing unit 356 that dresses the polishing surface 352a of the polishing pad 352. The dressing unit 356 includes a dresser 50 that slides against the polishing surface 352a, a dresser shaft 51 to which the dresser 50 is connected, an air cylinder 53 attached to the upper end of the dresser shaft 51, and a swing arm 55 that rotatably supports the dresser shaft 51. The lower portion of the dresser 50 is formed by a dressing member 50a, and needle-shaped diamond particles are attached to the underside of the dressing member 50a. The air cylinder 53 is disposed on a support base 57 supported by struts 56, and the struts 56 are fixed to the swing arm 55.

[0026] The swing arm 55 is driven by a motor (not shown) and configured to rotate around a support shaft 58. The dresser shaft 51 is rotated by the drive of the motor (not shown), and the rotation of the dresser shaft 51 causes the dresser 50 to rotate around the dresser shaft 51. The air cylinder 53 moves the dresser 50 up and down via the dresser shaft 51, and presses the dresser 50 against the polishing surface 352a of the polishing pad 352 with a predetermined pressing force.

[0027] The polishing surface 352a of the polishing pad 352 is dressed as follows. The dresser 50 is pressed against the polishing surface 352a by the air cylinder 53, and at the same time, pure water is supplied to the polishing surface 352a from a pure water supply nozzle (not shown). In this state, the dresser 50 rotates around the dresser shaft 51, causing the lower surface (diamond particles) of the dressing member 50a to slide against the polishing surface 352a. In this way, the dresser 50 scrapes off the polishing pad 352, and the polishing surface 352a is dressed.

[0028] <Drying unit> The drying unit 500 is an apparatus for drying the substrate WF. In the substrate processing apparatus 1000 shown in FIG. 1, the drying unit 500 dries the substrate WF that has been polished in the polishing unit 300 and then cleaned in the cleaning section of the transfer unit 200. As shown in FIG. 1, the drying unit 500 is disposed downstream of the transfer unit 200. The drying unit 500 has a nozzle 530 for spraying gas toward the substrate WF being transported on the transport rollers 202. The gas can be, for example, compressed air or nitrogen. The substrate WF can be dried by having the drying unit 500 blow away water droplets on the substrate WF being transported.

[0029] <Unload unit> The unload unit 600 is a unit for unloading the substrate WF after processing such as polishing and cleaning to the outside of the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in FIG. 1, the unload unit 600 receives the substrate after drying in the drying unit 500. As shown in FIG. 1, the unload unit 600 is disposed downstream of the drying unit 500. In one embodiment, the unload unit 600 is configured to comply with the Mechanical Device Interface Standard (IPC-SMEMA-9851) of the SMEMA (Surface Mount Equipment Manufacturers Association).

[0030] <Top ring> Next, a top ring 302 in a polishing unit 300 according to an embodiment will be described. FIG. 3A is a cross-sectional view schematically illustrating the top ring according to an embodiment. FIG. 3B is a plan view schematically illustrating the top ring according to an embodiment. As shown in FIGS. 3A and 3B, the top ring 302 includes a top ring shaft (rotating shaft) 18 and a base member 301 connected to the top ring shaft 18. Specifically, the base member 301 includes a flange 303 connected to the top ring shaft 18, a plate-shaped spacer 305 provided in a rectangular recess formed in the center of the lower surface of the flange 303, and a plate-shaped carrier 306 provided below the flange 303 and the spacer 305.

[0031] The top ring 302 also includes a substrate suction member 330 for suctioning the backside of the substrate WF with the surface to be polished facing downward. The substrate suction member 330 is attached to the lower surface of the carrier 306. The substrate suction member 330 includes a porous member 334. The porous member 334 may be any member that can vacuum-suck the substrate WF by vacuuming using the pressure reducing means (vacuum source) 31, and may be, for example, a porous member made of a resin such as PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), or PVC (polyvinyl chloride) with a large number of fine particles. The porous member 334 can be made of a resin porous material with holes formed therein. In this embodiment, the porous member 334 is formed in a plate shape, and has a substrate suction surface 334a for suctioning the substrate WF and a pressure reduction section 334b ​​that communicates with the pressure reduction means (vacuum source) 31.

[0032] The substrate adsorption member 330 also includes a shielding member 332. The shielding member 332 may be any airtight member capable of blocking the flow of gas, and may be formed, for example, from a relatively soft resin plate such as PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), or PVC (polyvinyl chloride). In this embodiment, the shielding member 332 includes a plate-shaped first shielding member 332-1 that shields the surface 334c of the porous member 334 opposite the substrate adsorption surface 334a, and a second shielding member 332-2 provided on the periphery of the lower surface of the first shielding member 332-1. In this embodiment, the second shielding member 332-2 is a frame-shaped member that shields a portion of the side surface 334d of the porous member 334, but is not limited thereto and may be a frame-shaped member that shields the entire side surface 334d of the porous member 334. The first shielding member 332-1 and the second shielding member 332-2 are formed as an integrated member. The first shielding member 332-1 has suction holes 335 formed therein so as to communicate with the porous member 334. The pressure reducing section 334b ​​is provided at a position corresponding to the suction holes 335 on a surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a.

[0033] In the top ring 302 in this embodiment, which holds the substrate WF by suction on the porous member 334, it is necessary to reliably suction the substrate WF regardless of the flatness of the attracting surface of the substrate WF. That is, if the attracting surface of the substrate WF is flat, the substrate WF can be easily attracted to the porous member 334 by vacuum suction. However, if the attracting surface is not flat, for example, if the attracting surface of the substrate WF is partially recessed at its outer periphery, air leaks from gaps created by the recesses, weakening the suction force, and as a result, the substrate WF may not be attracted to the porous member 334.

[0034] Therefore, as shown in FIGS. 3A and 3B , the substrate suction member 330 of this embodiment includes a frame-shaped elastic seal member 336 attached to the lower surface of the second shielding member 332-2 so as to surround the porous member 334. The elastic seal member 336 can be attached to the lower surface of the second shielding member 332-2 using any means, such as double-sided tape. The elastic seal member 336 may be any material that is elastic and capable of blocking the flow of gas. For example, the elastic seal member 336 may be made of a soft material that is chemical-resistant, has good elasticity, and has a skin-like surface. Generally, soft materials have numerous pores on their surface that allow gas to pass through, making them insufficient as sealing materials. For this reason, an extruded foam material may be used as the elastic seal member 336. This results in a skin-like surface on the elastic seal member 336 that can block the flow of gas and has good elasticity. The elastic seal member 336 also has a contact surface 336a that comes into contact with the substrate WF when the substrate WF is being sucked in. As shown in Fig. 3A, the contact surface 336a protrudes from the substrate sucking surface 334a of the porous member 334 when the substrate WF is not in contact with the contact surface 336a. Silicone sponge is the most preferable material for the elastic seal member 336, and silicone rubber is also preferable. Norseal, a soft polyvinyl chloride material, can also be used.

[0035] FIG. 4 is a cross-sectional view schematically illustrating a top ring and a substrate according to an embodiment. FIG. 4 shows a top ring holding a substrate by a transfer means (not shown) at the aforementioned substrate transfer position (not shown), positioned at a polishing position of a polishing pad 352 on a polishing table 350. As shown in FIG. 4, when the substrate attracting member 330 attracts the substrate WF, the substrate WF comes into contact with the contact surface 336a of the elastic seal member 336. Because the elastic seal member 336 has good elasticity, it contracts when pressed by the substrate WF to seal the gap between the atmosphere around the top ring 302 and the porous member 334. The elastic seal member 336 returns to its original shape when the substrate WF is released from the attraction and released. It is now restored to its original state.

[0036] 4, even if a portion of the outer periphery of the attracted surface of the substrate WF is recessed to form a step WFa, air leakage from a gap caused by the step WFa can be prevented by providing the elastic seal member 336. Therefore, according to this embodiment, the substrate WF can be reliably attracted to the substrate attracting member 330 regardless of the flatness of the attracted surface of the substrate WF.

[0037] Furthermore, according to this embodiment, when the porous member 334 is evacuated by the pressure reducing means (vacuum source) 31, air leakage from the gaps created by the steps WFa can be prevented, and negative pressure can be efficiently generated on the substrate attracting surface 334a. This allows the substrate WF to be reliably attracted to the substrate attracting member 330, preventing the substrate WF from slipping out during polishing without the need for a retainer member around the substrate WF. In particular, with the recent trend toward thinner substrates WF, even when a retainer member is provided, the substrate WF may slip out during polishing. Furthermore, if the substrate WF has a rectangular shape, the corners of the substrate WF may come into contact with the retainer member during polishing, potentially damaging the substrate WF or the top ring. In contrast, according to this embodiment, the substrate WF can be pressed against the polishing pad 352 while being vacuum-attracted by the substrate attracting member 330, preventing the substrate WF from slipping out during polishing and preventing damage to the substrate WF or the top ring during polishing.

[0038] 4 has been described with reference to an example in which the outer periphery of the attracted surface of the substrate WF is partially recessed. However, this is not limiting. According to this embodiment, the substrate WF can be reliably attracted to the substrate attracting member 330 even when the attracted surface of the substrate WF is flat. That is, in this embodiment, the second shielding member 332-2 is configured so that the substrate attracting surface 334a of the porous member 334 protrudes further than the attachment surface 332-2a of the elastic seal member 336 of the second shielding member 332-2. In other words, the attachment surface 332-2a of the elastic seal member 336 of the second shielding member 332-2 is recessed further than the substrate attracting surface 334a of the porous member 334. The elastic seal member 336 is disposed so as to surround the side surface of the porous member 334 that protrudes further than the attachment surface 332-2a of the second shielding member 332-2. Therefore, when a substrate WF with a flat adsorbed surface is adsorbed, the contact surface 336a of the elastic sealing member 336, which is pressed and contracted by the substrate WF, becomes flush with the substrate adsorption surface 334a of the porous member 334, so that the substrate WF can be reliably adsorbed to the substrate adsorption member 330.

[0039] Furthermore, when an elastic seal member 336 that contacts the substrate WF is employed as in this embodiment, there is a risk that the substrate WF will not peel off from the elastic seal member 336 even when the suction of the substrate WF is released. In this regard, the surface of the elastic seal member 336 is a skin surface, which makes it easy to release the substrate WF when the suction of the substrate WF is released. In addition, the contact surface 336a of the elastic seal member 336 may be coated with a fluororesin, such as Teflon (registered trademark) made of polytetrafluoroethylene, to prevent spontaneous adhesion to the substrate WF (to prevent blooming). The contact surface 336a of the elastic seal member 336 may also be coated by impregnation.

[0040] Furthermore, according to this embodiment, the provision of the elastic seal member 336 can seal the porous member 334 from the atmosphere surrounding the top ring 302. This prevents the polishing liquid from flowing onto the substrate attracting surface 334a of the porous member 334. As a result, it is possible to prevent abrasive grains contained in the polishing liquid from clogging the pores of the porous member 334, thereby reducing the attracting performance of the substrate attracting member 330 and adversely affecting the life of the substrate attracting member 330.

[0041] Furthermore, the top ring 302 of this embodiment is equipped with a device for dealing with abrasive grains entering the pores of the porous member 334. FIG. 5 is a schematic cross-sectional view of a top ring according to one embodiment. As shown in FIG. 5, the top ring 302 is equipped with an abrasive grain cleaning member 33. The abrasive grain cleaning member 33 is configured to supply a fluid, such as air or pure water, to the surface 334c of the porous member 334 opposite the substrate attracting surface 334a through a flow path 333 formed in the base member 301 and the shielding member 332. By supplying the fluid to the surface 334c of the porous member 334 opposite the substrate attracting surface 334a, abrasive grains SL clogging the pores of the porous member 334 can be flushed away. This cleaning process of the porous member 334 may be performed simultaneously with the process of releasing the substrate WF from the top ring 302 at a substrate transfer position (not shown) after the polishing process and releasing the substrate WF from the top ring 302 by a transfer device (not shown).

[0042] Next, a modified example of the top ring 302 will be described. FIG. 6 is a schematic enlarged cross-sectional view of a portion of a top ring according to one embodiment. The configuration other than the substrate suction member 330 is the same as that of the embodiment shown in FIGS. 3 to 5, and therefore a description thereof will be omitted. As shown in FIG. 6, the elastic seal member 336 can be configured to include a first elastic seal member 336-1 that surrounds the side surface of the porous member 334 that protrudes beyond the mounting surface 332-2a of the second shielding member 332-2, and a second elastic seal member 336-2 that is disposed outside the first elastic seal member 336-1 at a distance.

[0043] The first elastic seal member 336-1 may be any member capable of blocking the flow of gas, and has a contact surface 336-1a that comes into contact with the substrate WF. The second elastic seal member 336-2 may be any member capable of blocking the flow of polishing liquid, and has a contact surface 336-2a that comes into contact with the substrate WF. According to this embodiment, the inflow of polishing liquid and gas into the porous member 334 can be more reliably sealed. As a result, air leaks from the porous member 334 can be prevented, and the pores of the porous member 334 can be prevented from being blocked by abrasive grains, allowing the substrate WF to be reliably attracted to the substrate attracting member 330.

[0044] Next, another modification of the top ring 302 will be described. FIG. 7 is a schematic enlarged cross-sectional view of a portion of a top ring according to an embodiment. As shown in FIG. 7, the shielding member 332 further includes a frame-shaped third shielding member 332-3 provided on the lower outer periphery of the second shielding member 332-2. The third shielding member 332-3 is disposed outside the elastic seal member 336 with a gap therebetween. The third shielding member 332-3 is configured to form a gap 338 between the lower surface of the third shielding member 332-3 and the substrate WF. The first shielding member 332-1 and the second shielding member 332-2 each have a fluid flow path 332a for discharging a fluid into a space 337 between the elastic seal member 336 and the third shielding member 332-3. The top ring 302 includes a fluid supply member 34 configured to supply a fluid (e.g., air) to the space 337 via the fluid flow path 332a.

[0045] The fluid supplied from the fluid supply member 34 to the space 337 through the fluid flow path 332a is sprayed outward from a gap 338 between the lower surface of the third shielding member 332-3 and the substrate WF. This prevents air and polishing liquid from flowing into the porous member 334 from outside the top ring 302. As a result, air leakage into the porous member 334 can be prevented, and the pores of the porous member 334 can be prevented from being blocked by abrasive grains, allowing the substrate WF to be reliably attracted to the substrate attracting member 330.

[0046] Next, the elastic seal assembly of this embodiment will be described. In the above embodiment, an example was shown in which the elastic seal member 336 was attached to the second shielding member 332-2 using a means such as double-sided tape, but the present invention is not limited to this. The elastic seal assembly may be attached to the second shielding member 332-2 by any method. Fig. 8 is a perspective view schematically showing the configuration of an elastic seal assembly according to one embodiment. Fig. 9 is a perspective view schematically showing the configuration of a substrate suction member including an elastic seal assembly according to one embodiment.

[0047] 8 and 9 are rear perspective views of the elastic seal assembly and the substrate suction member. As shown in FIGS. 8 and 9, the elastic seal assembly 331 includes a frame-shaped fixed frame 339. The fixed frame 339 is a rigid member that is attached to the second shielding member 332-2 so as to surround the porous member 334. Specifically, the fixed frame 339 includes a rectangular frame 339a that surrounds the side surface 334d of the porous member 334 and multiple (12 in this embodiment) protrusions 339b that protrude outward from the frame 339a. The protrusions 339b are formed with bolt holes 339c for attaching the elastic seal assembly 331 to the second shielding member 332-2 with bolts B. The elastic seal assembly 331 also includes an elastic seal member 336 that is attached to the fixed frame 339. The elastic seal member 336 has a configuration similar to that described in the above embodiment, and therefore a detailed description thereof will be omitted. The elastic seal member 336 is attached by any means, such as adhesive or double-sided tape, to a surface 339d of the fixed frame 339 opposite the fixed surface attached to the second shielding member 332-2. In the embodiment of Fig. 9, a groove 332-2b having a shape corresponding to the elastic seal assembly 331 (fixed frame 339) is provided in the bottom surface of the second shielding member 332-2, and a mounting surface 332-2a is formed on the bottom surface of the groove 332-2b. The elastic seal assembly 331 is fitted into the groove 332-2b and fixed to the second shielding member 332-2 by bolts B.

[0048] According to this embodiment, when the elastic seal member 336 reaches the end of its life due to wear or the like, it can be easily replaced as a consumable part. That is, when the elastic seal member 336 is directly attached to the second shielding member 332-2 using double-sided tape or the like as in the above embodiment, the elastic seal member 336 is elastic and bends, making positioning difficult and installation difficult. In particular, at the installation site of the substrate processing apparatus 1000, there are often no installation jigs or skilled workers available, making it difficult to replace the elastic seal member 336. In contrast, according to this embodiment, the elastic seal assembly 331 is manufactured using a dedicated jig or by skilled workers at, for example, a manufacturing plant for the elastic seal assembly 331, and then delivered to the installation site of the substrate processing apparatus 1000. Since the elastic seal assembly 331 has the elastic seal member 336 already attached to the rigid fixed frame 339, at the installation site of the substrate processing apparatus 1000, an ordinary worker can easily attach the elastic seal assembly 331 to the second shielding member 332-2 with bolts.

[0049] In this embodiment, the elastic seal assembly 331 is fixed to the second shielding member 332-2 using bolts, but any fixing method can be used. For example, a magnet can be embedded in each of the frame 339a and the second shielding member 332-2, and the frame 339a and the second shielding member 332-2 can be fixed together by magnetic force. In this case, the protrusion 339b does not need to be provided.

[0050] Next, another embodiment of the top ring will be described. FIG. 10 is a cross-sectional view schematically showing a top ring according to one embodiment. As shown in FIG. 10, a top ring 1302 includes a base member 1301 connected to a top ring shaft (rotating shaft) 1018. Specifically, the base member 1301 includes a flange 1303 connected to the top ring shaft 1018, an upper guide member 1305 provided below the flange 1303, and a lower guide member 1306 provided below the upper guide member 1305. The upper guide member 1305 has a planar size smaller than that of the flange 1303 and protrudes downward from the lower surface of the flange 1303. The lower guide member 1306 is connected to the upper guide member 1303. The upper guide member 1305 is provided in a frame shape on the peripheral portion of the lower surface of the top ring shaft 1018. The planar size of the upper guide member 1305 or the flange 1303 refers to the size of the upper guide member 1305 or the flange 1303 when viewed in a plan view (viewed from the direction along the top ring shaft 1018).

[0051] The top ring 1302 also includes a substrate suction member 1330 for suctioning the backside of the substrate WF with its surface to be polished facing downward. The substrate suction member 1330 is disposed below the base member 1301. The substrate suction member 1330 includes a porous member 1334. The porous member 1334 is made of the same material as the porous member 334 of the above embodiment. The porous member 1334 has a substrate suction surface 1334a for suctioning the substrate WF and a pressure reduction section 1334b that communicates with the pressure reduction means (vacuum source) 1031.

[0052] The substrate adsorption member 1330 also includes a shielding member 1332. The shielding member 1332 is made of the same material as the shielding member 332 of the above embodiment. The shielding member 1332 includes a plate-shaped first shielding member 1332-1 that shields the surface 1334c of the porous member 1334 opposite the substrate adsorption surface 1334a, and a second shielding member 1332-2 that is provided around the periphery of the lower surface of the first shielding member 1332-1. The shielding member 1332 is formed to shield the surface 1334c of the porous member 1334 opposite the substrate adsorption surface 1334a and part of the side surface 1334d. The shielding member 1332 includes suction holes 1337 formed to communicate with the porous member 1334. The pressure reducing section 1334b is provided at the position where the suction holes 1337 are formed. In this embodiment, the suction hole 1337 is formed in the shielding member 1332 so as to communicate with the side surface 1334d of the porous member 1334, and the pressure reducing section 1334b is provided on the side surface 1334d. One end of the suction hole 1337 is connected to the side surface 1334d of the porous member 1334, and the other end is connected to the pressure reducing means 1031 via the suction path 1312.

[0053] In this embodiment, the pressure reducing unit 1334b is provided on the side surface 1334d of the porous member 1334, which makes it possible to uniformize the polishing profile of the substrate WF. That is, the area where the pressure reducing unit 1334b is provided is vacuumed by the pressure reducing means 1031, resulting in a localized negative pressure. If the pressure reducing unit 1334b were provided on the surface 1334c of the porous member 1334 opposite the substrate adsorption surface 1334a, the localized negative pressure would be generated in that area, making it more difficult for the pressing force to act on the substrate WF than in other areas, which could result in a non-uniform polishing profile. In contrast, in this embodiment, the pressure reducing unit 1334b is provided on the side surface 1334d of the porous member 1334, which makes it less likely for a localized negative pressure to be generated on the surface 1334c of the porous member 1334 opposite the substrate adsorption surface 1334a, thereby making it possible to uniformize the polishing profile of the substrate WF.

[0054] 10 , the substrate adsorption member 1330 includes a frame member 1344 provided on the shielding member 1332 so as to surround at least a portion of the base member 1301 (specifically, the upper guide member 1305 and the lower guide member 1306). The frame member 1344 includes a lower frame member 1343 provided in a frame shape around the periphery of the upper surface of the shielding member 1332, and a frame-like upper frame member 1342 provided on the lower frame member 1343. The lower frame member 1343 and the shielding member 1332 are connected via a sealant 1341. Note that in this embodiment, the sealant 1341 is formed in a film shape that covers the upper surface of the substrate adsorption member 1330, but is not limited thereto. The sealant 1341 may be in a frame shape having only a periphery for sealing the lower frame member 1343 and the shielding member 1332.

[0055] The upper frame member 1342 includes a frame member protrusion 1342a that protrudes toward the base member 1301 (specifically, the upper guide member 1305). The upper guide member 1305 also includes a guide member protrusion 1305a that protrudes toward the upper frame member 1342 at a height position different from that of the frame member protrusion 1342a. The frame member protrusion 1342a and the guide member protrusion 1305a are When viewed from above, the frame member protrusions 1342a and the guide member protrusions 1305a overlap each other in a predetermined area. Therefore, the movement of the substrate suction member 1330 in the height direction can be restricted by the contact between the frame member protrusions 1342a and the guide member protrusions 1305a.

[0056] The substrate suction member 1330 includes an elastic member 1340 that connects at least a portion of the base member 1301 surrounded by a frame member 1344 to the frame member 1344. Specifically, the elastic member 1340 is a frame-shaped plate member having an inner end 1340a that is sandwiched between the upper guide member 1305 and the lower guide member 1306, and an outer end 1340b that is sandwiched between the lower frame member 1343 and the upper frame member 1342. The elastic member 1340 can be made of a rubber material such as silicone rubber, EPDM (ethylene propylene diene rubber), or FKM (fluororubber), but is not limited to these.

[0057] 10 , the top ring 1302 includes an elastic membrane 1320 configured to form multiple pressure chambers for pressurizing the substrate WF between the base member 1301 and the substrate suction member 1330. Specifically, the elastic membrane 1320 includes a membrane-like sealing material 1341 and multiple elastic membranes 1320-1, 1320-2, and 1320-3 with different areas that are stacked one on top of the other. A pressure chamber for pressurizing the entire substrate WF is formed between the base member 1301 and the sealing material 1341. This pressure chamber communicates with the pressure adjustment unit 1030 via a pressure path 1313-4. Each of the elastic membranes 1320-1, 1320-2, and 1320-3 includes a central portion that contacts the upper surface of the shielding member 1332 and end portions that extend from the central portion and are fixed at different positions on the lower surface of the upper guide member 1305. The elastic membranes 1320-1, 1320-2, and 1320-3 form a plurality of concentric pressurizing chambers for pressurizing the substrate WF between the base member 1301 and the elastic membranes 1320-1, 1320-2, and 1320-3. The pressurizing chambers are connected to the pressure adjusting unit 1030 via the pressurizing paths 1313-1, 1313-2, and 1313-3, respectively. The pressure adjusting unit 1030 has a pressure adjusting function for adjusting the pressure of the pressurized fluid supplied to each pressurizing chamber. That is, the pressure adjusting unit 1030 adjusts the pressure of the pressurizing chamber for pressurizing the entire substrate WF by adjusting the pressure of the pressurized fluid supplied to the pressurizing path 1313-4, and can adjust the pressure of the concentric pressurizing chambers by adjusting the pressure of the pressurized fluid supplied to the pressurizing paths 1313-1, 1313-2, and 1313-3. By forming a plurality of pressure chambers in this manner, it is possible to control the pressing force of the substrate WF against the polishing pad 352 for each area via the substrate attracting member 1330. According to this embodiment, the substrate WF is attracted to the substrate attracting surface 1334a by applying a negative pressure to the porous member 1334 using the decompression means 1031, and the substrate WF can be pressed against the polishing pad 352 via the substrate attracting member 1330 by applying pressure to the pressure chambers using the pressure adjustment unit 1030.

[0058] 10, the top ring 1302 further includes a band 1345 that connects the outer side surface of the portion of the base member 1301 not surrounded by the frame member 1344 (specifically, the flange 1303) to the outer side surface of the frame member 1344. The band 1345 is attached from the outer side surface of the flange 1303 to the outer side surface of the upper frame member 1342. The band 1345 allows the substrate suction member 1330 to move relative to the base member 1301 and prevents the polishing liquid from entering the space between the substrate suction member 1330 and the base member 1301. Also, as shown in FIG. 10, the top ring 1302 includes an elastic seal member 1336 similar to the elastic seal member 336 of the above-described embodiment. The elastic seal member 1336 may be attached to the second shielding member 1332-2 with double-sided tape or the like, or may be attached to the second shielding member 1332-2 in the form of the above-described elastic seal assembly 331.

[0059] According to this embodiment, even if the top ring 1302 or the polishing table 1350 to which the polishing pad 352 is attached is tilted due to manufacturing tolerances of the components constituting the substrate processing apparatus 1000, the substrate WF can be uniformly pressed against the polishing pad 352. That is, according to this embodiment, the substrate attracting member 1330 is not fixed to the base member 1301 but is held by the elastic member 1340. Therefore, even if the top ring 1302 or the polishing table 1350 is tilted and the substrate WF makes uneven contact with the polishing pad 352, the elasticity of the elastic member 1340 allows the substrate attracting member 1330 to conform to the polishing surface of the polishing pad 352, and as a result, the substrate WF can be brought into parallel contact with the polishing pad 352. Therefore, according to this embodiment, the substrate WF can be pressed evenly against the polishing pad 352.

[0060] In addition, this embodiment allows for a compact top ring. Specifically, when the substrate suction member is supported on the base member via an elastic member, an opening can be formed in the center of the underside of the base member, the substrate suction member can be placed in the opening, and an elastic member can be used to connect the substrate suction member to a frame member around the periphery of the opening. However, in this configuration, if a suction path for vacuum suctioning from the porous member is routed through the frame member of the top ring, the planar size of the top ring would increase due to the space constraints of the frame member, potentially hindering the compactness of the top ring.

[0061] In contrast, in the top ring 1302 of this embodiment, the substrate suction member 1330 includes a frame member 1344 that surrounds at least a portion of the base member 1301, and the frame member 1344 and the base member 1301 are connected by the elastic member 1340. Therefore, even when the pressure reducing section 1334b is provided on the side surface 1334d of the porous member 1334 and the suction path 1312 is routed around the outer periphery of the top ring 1302 as in this embodiment, it is not necessary to increase the planar size of the frame member 1344, and as a result, it is possible to manufacture a compact top ring 1302. Note that the planar size of the top ring 1302 or the frame member 1344 refers to the size of the top ring 1302 or the frame member 1344 when viewed in plan (as viewed from the direction along the top ring shaft 1018).

[0062] Next, modifications of the top ring will be described. Fig. 11 is a schematic cross-sectional view of a top ring according to one embodiment. Fig. 12 is an enlarged cross-sectional view of a portion of the top ring according to one embodiment. Fig. 13 is an enlarged perspective view of a portion of the elastic seal member according to one embodiment. The top ring 2302 according to this embodiment has the same configuration as the top ring 302 according to the embodiment shown in Figs. 3 to 5, except for the elastic seal member 2336, and therefore a description of the similar configuration will be omitted.

[0063] 11, the substrate suction member 330 has an elastic seal member 2336 arranged to surround the porous member 334. In this embodiment, the elastic seal member 2336 is configured as a seal lip member having a generally U-shaped cross section. Specifically, as shown in FIG. 12, the elastic seal member 2336 has a base portion 2336-1, a lip portion 2336-2, and a connecting portion 2336-3.

[0064] The base portion 2336-1 is a frame-shaped member attached to the mounting surface 332-2a of the second shielding member 332-2 by any means, such as adhesive or double-sided tape. The lip portion 2336-2 is a frame-shaped member disposed below the base portion 2336-1 with a gap therebetween. The connecting portion (connecting wall) 2336-3 is a frame-shaped member connecting the end of the base portion 2336-1 to the end of the lip portion 2336-2. The elastic seal member 2336 is a rectangular frame-shaped member corresponding to the quadrangular substrate WF, with the base portion 2336-1, lip portion 2336-2, and connecting portion 2336-3 integrally formed. Although only a portion of the elastic seal member 2336 is shown in FIG. 13, the elastic seal member 2336 has four straight sides SI and four curved corners CO connecting the sides SI. The elastic seal member 2336 has a rectangular frame formed by connecting the sides SI and the corners CO. It is formed in a shape that leaves no gaps that could cause air leaks, ensuring good sealing performance.

[0065] As shown in FIG. 12, the elastic seal member 2336 is disposed around the porous member 334 so that an opening is formed facing outward. In other words, the connecting portion (connecting wall) 2336-3 connects the end of the base portion 2336-1 on the porous member 334 side to the end of the lip portion 2336-2 on the porous member 334 side. Therefore, the lip portion 2336-2 extends outward from the lower end of the connecting portion 2336-3. More specifically, when the substrate WF is not adsorbed to the porous member 334 (left side of FIG. 12), the lip portion 2336-2 extends obliquely downward from the lower end of the connecting portion 2336-3. As in the above embodiment, the elastic seal member 2336 can be formed from a material that has elasticity and can block the flow of gas, such as silicone sponge or silicone rubber. Alternatively, the elastic seal member 2336 can be formed from a soft material that is chemical-resistant, has good elasticity, and has a skin-like surface.

[0066] A contact surface 2336a with which the substrate WF comes into contact is formed on the lower surface of the lip portion 2336-2. That is, when the substrate WF is attracted to the porous member 334 (right side of FIG. 12), the substrate WF contacts the contact surface 2336a of the lip portion 2336-2 and pushes up the lip portion 2336-2. The elastic seal member 2336 is an elastic member, and because the attraction of the substrate WF creates a positive pressure on the outside of the elastic seal member 2336, the lip portion 2336-2 presses against the substrate WF. This creates a seal between the lip portion 2336-2 and the substrate WF. Note that the contact surface 2336a of the elastic seal member 2336 may be coated with a fluororesin, such as Teflon (registered trademark) made of polytetrafluoroethylene, to prevent spontaneous adhesion to the substrate WF (to prevent blooming). The contact surface 2336a of the elastic seal member 2336 may also be coated by impregnation.

[0067] 12, even if a portion of the outer periphery of the attracted surface of the substrate WF is recessed to form a step WFa, air leakage from a gap caused by the step WFa can be prevented by providing the elastic seal member 2336. Therefore, according to this embodiment, the substrate WF can be reliably attracted to the substrate attracting member 330 regardless of the flatness of the attracted surface of the substrate WF.

[0068] In addition, this embodiment can prevent damage to the substrate WF due to the reaction force of the elastic seal member. Specifically, when a fragile substrate (e.g., a thin glass substrate) is suction-held, the substrate may be damaged by the reaction force of the contracted elastic seal member. In contrast, the elastic seal member 2336 in this embodiment is configured as a seal lip member with a generally U-shaped cross section, ensuring sealing performance while minimizing the reaction force on the substrate. As a result, this embodiment can prevent damage to the substrate WF due to the reaction force of the elastic seal member and ensure reliable suction of the substrate WF to the substrate suction member 330. The elastic seal member 2336 can also be used in place of the elastic seal member 1336 in the top ring 1302 shown in FIG. 10.

[0069] Next, another modified example of the top ring 2302 will be described. FIG. 14 is a partially enlarged cross-sectional view of a top ring according to an embodiment. FIG. 15 is a partially enlarged cross-sectional view of a top ring according to an embodiment. FIG. 16 is a partially enlarged perspective view of a substrate suction member according to an embodiment. The top ring according to this embodiment is similar to the top ring 2302 according to the embodiment shown in FIGS. 11 to 13 except that a protrusion is formed on the second shielding member. Therefore, a description of the similar components will be omitted.

[0070] As shown in FIGS. 14 to 16, the second shielding member 332-2 is an elastic seal member 233 The second shielding member 332-2 has a frame-shaped protrusion 332-4 that surrounds the substrate suction surface 334a of the porous member 334. The protrusion 332-4 protrudes downward from the lower surface of the second shielding member 332-2. The protrusion 332-4 has a substrate pressing surface 332-4a that is formed to be flush with the substrate adsorption surface 334a of the porous member 334.

[0071] In this embodiment, by forming the protrusion 332-4 having the substrate pressing surface 332-4a on the second shielding member 332-2, it is possible to prevent cracks from occurring in the outermost peripheral portion of the substrate. In other words, if the substrate pressing surface 332-4a is not provided, when the top ring, which suction-holds the substrate WF, presses the substrate WF against the polishing pad 352, the outermost peripheral portion of the substrate WF (the portion outside the portion that contacts the elastic seal member 2336) may warp and crack due to a reaction force from the polishing pad 352. In contrast, in this embodiment, the substrate pressing surface 332-4a is formed on the protrusion 332-4 provided on the outside of the elastic seal member 2336, so that the warpage of the outermost peripheral portion of the substrate WF can be suppressed. As a result, this embodiment can prevent cracks from occurring in the outermost peripheral portion of the substrate.

[0072] Furthermore, the protrusion 332-4 is formed so as to protrude inward (toward the elastic seal member 2336) at an angle from the lower surface of the second shielding member 332-2. As a result, the second shielding member 332-2 has a groove 332-4b formed by the protrusion 332-4 and the mounting surface 332-2a. The groove 332-4b is a groove into which the elastic seal member 2336 is fitted. By fitting the outer thick portion of the base portion 2336-1 into the groove 332-4b, the elastic seal member 2336 is fitted and fixed to the second shielding member 332-2 around the entire periphery.

[0073] According to this embodiment, when the elastic seal member 2336 reaches the end of its life due to wear, for example, it is possible to easily replace the elastic seal member 2336, which is a consumable part. That is, since the second shielding member 332-2 is formed with the groove 332-4b into which the elastic seal member 2336 is fitted, an ordinary worker can easily attach the elastic seal member 2336 to the second shielding member 332-2 at the site where the substrate processing apparatus 1000 is installed.

[0074] Although several embodiments of the present invention have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects.

[0075] As one embodiment, the present application discloses a substrate adsorption member including: a porous member having a substrate adsorption surface for adsorbing a substrate and a pressure reduction section communicating with a pressure reduction means; a shielding member having a first shielding member that shields the surface of the porous member opposite the substrate adsorption surface and a frame-shaped second shielding member that shields at least a portion of the side surface of the porous member; and a frame-shaped elastic sealing member attached to the second shielding member so as to surround the porous member and having a contact surface that contacts the substrate.

[0076] Furthermore, as one embodiment, the present application discloses a substrate adsorption member in which the second shielding member is configured so that the substrate adsorption surface of the porous member protrudes beyond the mounting surface of the elastic sealing member of the second shielding member, and the elastic sealing member is arranged to surround the side of the porous member that protrudes beyond the mounting surface of the second shielding member.

[0077] Furthermore, in one embodiment, the present application provides a method for manufacturing a sealing member, the method comprising: A substrate adsorption member is disclosed, which includes a first elastic sealing member surrounding the side of the porous member that protrudes beyond the mounting surface, and a second elastic sealing member arranged outside the first elastic sealing member at a distance.

[0078] Furthermore, as one embodiment, the present application discloses a substrate adsorption member, wherein the shielding member further includes a frame-shaped third shielding member provided below the second shielding member and arranged outside the elastic sealing member at a distance, and the first shielding member and the second shielding member have fluid flow paths for discharging fluid into the space between the elastic sealing member and the third shielding member.

[0079] Furthermore, the present application discloses, as one embodiment, a substrate suction member, in which the elastic sealing member includes a base portion attached to the mounting surface of the second shielding member, a lip portion arranged below the base portion at a distance, and a connecting portion connecting the base portion and the lip portion, and the contact surface is formed on the underside of the lip portion.

[0080] Furthermore, as one embodiment, the present application discloses a substrate adsorption member in which the second shielding member has a frame-shaped protrusion that surrounds the elastic sealing member, and the protrusion has a substrate pressing surface that is formed to be flush with the substrate adsorption surface of the porous member.

[0081] Furthermore, as one embodiment, the present application discloses a substrate suction member in which the second shielding member has a groove formed by the protrusion and the mounting surface for fitting the elastic sealing member, and the elastic sealing member is attached to the second shielding member by fitting the base portion into the groove.

[0082] Furthermore, the present application discloses, as one embodiment, a substrate suction member, in which the elastic seal member is formed in the shape of a rectangular frame having four straight sides.

[0083] Furthermore, the present application discloses, as one embodiment, an elastic seal assembly to be attached to a substrate adsorption member including a porous member having a substrate adsorption surface for adsorbing a substrate and a pressure reduction section communicating with a pressure reduction means, and a shielding member having a first shielding member that shields the surface of the porous member opposite the substrate adsorption surface and a frame-shaped second shielding member that shields at least a portion of a side surface of the porous member, the elastic seal assembly including: a frame-shaped fixed frame attached to the second shielding member so as to surround the porous member; and a frame-shaped elastic seal member attached to the surface of the fixed frame opposite the fixed surface attached to the second shielding member, the frame having a contact surface that comes into contact with the substrate.

[0084] Furthermore, the present application discloses, as one embodiment, a top ring for holding a substrate, the top ring including: a rotating shaft; a base member connected to the rotating shaft; and any one of the above-described substrate suction members or a substrate suction member having the above-described elastic seal assembly attached thereto, the substrate suction member being attached to the base member.

[0085] Furthermore, as one embodiment, the present application discloses a top ring further including an abrasive cleaning member configured to supply fluid to a surface of the porous member opposite the substrate attracting surface through flow paths formed in the base member and the shielding member.

[0086] Furthermore, as one embodiment, the present application discloses a substrate processing apparatus including a polishing table to which a polishing pad having a polishing surface is attached, a top ring described above that is configured to hold a substrate and press it against the polishing surface, and a polishing liquid supply nozzle configured to supply a polishing liquid onto the polishing pad. [Explanation of symbols]

[0087] 18 Top ring shaft (rotating shaft) 31 Pressure reducing means (vacuum source) 33 Abrasive cleaning material 34 Fluid supply member 301 Base material 302 Top Ring 303 flange 305 Spacer 306 Career 330 Substrate suction member 332 Shielding material 332-1 First shielding member 332-2 Second shielding member 332-2a Mounting surface 332-3 Third shielding member 332-4 Protrusion 332-4a PCB holding surface 332-4b Groove 332a Fluid flow path 333 Flow path 334 Porous Materials 334a Board adsorption surface 334b Pressure reduction section 334c Opposite side 334d side 336, 1336, 2336 Elastic sealing member 336-1 First elastic sealing member 336-2 Second elastic sealing member 336a Contact surface 337 Space 1000 Substrate Processing Equipment 2336-1 Base 2336-2 Lip 2336-3 Connection part WF board WFa Step

Claims

1. A porous member having a substrate adsorption surface for adsorbing a substrate and a reduced-pressure portion communicating with a reduced-pressure means; A shielding member having a first shielding member that shields the surface of the porous member opposite to the substrate adsorption surface and a frame-shaped second shielding member that shields at least a part of the side surface of the porous member; A frame-shaped elastic seal member attached to the second shielding member so as to surround the porous member and having a contact surface that contacts the substrate; comprising; the second shielding member is configured such that the substrate adsorption surface of the porous member protrudes from the attachment surface of the elastic seal member of the second shielding member; the elastic seal member is disposed so as to surround the side surface of the porous member protruding from the attachment surface of the second shielding member; a substrate adsorption member.

2. The elastic seal member includes a first elastic seal member that surrounds the side surface of the porous member protruding from the attachment surface of the second shielding member, and a second elastic seal member disposed at an interval outside the first elastic seal member. The substrate adsorption member according to claim 1.

3. The shielding member further includes a frame-shaped third shielding member provided at a lower portion of the second shielding member and disposed at an interval outside the elastic seal member; the first shielding member and the second shielding member have a fluid flow path for discharging fluid into a space between the elastic seal member and the third shielding member; The substrate adsorption member according to claim 1.

4. The elastic seal member includes a base portion attached to the attachment surface of the second shielding member, a lip portion disposed at an interval below the base portion, and a connecting portion that connects the base portion and the lip portion. The contact surface is formed on the lower surface of the lip portion. The substrate adsorption member according to claim 1.

5. The second shielding member has a frame-shaped protruding portion that surrounds the elastic seal member, and the protruding portion has a substrate pressing surface formed to be flush with the substrate adsorption surface of the porous member. The substrate adsorption member according to claim 4.

6. The second shielding member has a groove for fitting the elastic seal member, formed by the protruding portion and the attachment surface; the elastic seal member is attached to the second shielding member by fitting the base portion into the groove. The substrate adsorption member according to claim 5.

7. ​ The elastic seal member is formed in a rectangular frame shape having four linear side portions. The substrate adsorption member according to any one of claims 1 to 6.

8. A porous member having a substrate adsorption surface for adsorbing a substrate and a decompression portion communicating with a decompression means, a first shielding member for shielding the surface of the porous member opposite to the substrate adsorption surface, and a frame-shaped second shielding member for shielding at least a part of the side surface of the porous member. An elastic seal assembly attached to a substrate adsorption member including: A frame-shaped fixing frame attached to the second shielding member so as to surround the porous member; A frame-shaped elastic seal member attached to a surface of the fixing frame opposite to the fixing surface attached to the second shielding member and having a contact surface that contacts the substrate; An elastic seal assembly including:

9. A top ring for holding a substrate, A rotating shaft, A base member connected to the rotating shaft, The substrate adsorption member according to any one of claims 1 to 7 attached to the base member or the substrate adsorption member to which the elastic seal assembly according to claim 8 is attached, A top ring including:

10. Further including an abrasive grain cleaning member configured to supply fluid to the surface of the porous member opposite to the substrate adsorption surface through flow paths formed in the base member and the shielding member. The top ring according to claim 9.

11. A polishing table to which a polishing pad having a polishing surface is attached, The top ring according to claim 9 or 10 configured to hold a substrate and press it against the polishing surface, A polishing liquid supply nozzle configured to supply a polishing liquid onto the polishing pad, A substrate processing apparatus including:

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