Superstrate and method for using the same

Abstract

To provide a superstrate for forming a planarization layer on a substrate.SOLUTION: A superstrate 108 may include a body having a first surface 112, a second surface 202 on the opposite side of the first surface, and a chamfered edge between the first surface and the second surface. An opaque layer may cover the chamfered edge. The opaque layer may cover the chamfered edge and part of the second surface. The superstrate may be used for more planarization or other processing sequences without causing extrusion defects.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a superstrate used when forming a planarization layer on a substrate.

Background Art

[0002] An inkjet adaptive planarization (IAP) process provides a surface having desired shape characteristics (e.g., planar). Generally, the topography of the first surface is mapped to provide a density map. The density map is evaluated to provide a droplet pattern for dispensing a polymeric material onto the first surface. A plate (or superstrate) is contacted with the polymeric material. The polymeric material is solidified to have the desired shape characteristics. However, there may be a tendency to form an "overhang" defined as a formable material that extends beyond (or protrudes beyond) the edge of the superstrate. Such overhanging material can accumulate on the edge of the superstrate. During separation of the superstrate from the substrate after curing of the formable material, the overhanging and cured material may remain on the superstrate. The accumulated material may eventually flake off and cause defects when processing subsequent substrates.

[0003] Therefore, there is a need for a new superstrate to prevent overhang defects.

Summary of the Invention

[0004] In one embodiment, a superstrate for forming a planarization layer on a substrate is disclosed. The superstrate may include a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface, and the chamfered edge is covered by a layer.

[0005] In other embodiments, the chamfered edge may include a first surface and one or more inclined surfaces, and the layer covers the first inclined surface.

[0006] In yet another embodiment, the first inclined surface may be located between the first surface of the main body and the first surface of the chamfered edge.

[0007] In a further embodiment, the layer may cover the first inclined surface and a portion of the second surface of the main body.

[0008] In another further embodiment, the layer may cover the entire chamfered edge and a portion of the second surface of the body.

[0009] In another embodiment, the portion of the second surface of the main body may have a length between 10% and 30% of the total length of the second surface.

[0010] Furthermore, in other embodiments, the layer may contain a chromium alloy, chromium, molybdenum, tantalum, silicon, tungsten, titanium, aluminum, iron oxide, or silver halide emulsion.

[0011] Furthermore, in yet another embodiment, the body may contain soda-lime glass, quartz, borosilicate glass, alkali-barium silicate glass, aluminosilicate glass, or synthetic fused silica.

[0012] Furthermore, in other further embodiments, the layer may have one or more optical properties, including a visible light reflectance of more than 30% and a UV light absorbance of more than 70%.

[0013] Furthermore, in other embodiments, the layer may have optical properties of both a visible light reflectance of more than 30% and a UV light absorbance of more than 70%.

[0014] A method for manufacturing an article is disclosed. The method may include depositing a moldable material onto a substrate, bringing a superstraight into contact with the moldable material on the substrate to form a body having a first face, a planar layer, wherein the superstraight may include a body having a first face, a second face opposite the first face, and a chamfered edge between the first face and the second face, the chamfered edge being covered by the layer. The method may include curing the moldable material on the substrate to form the planar layer, separating the superstraight from the planar layer on the substrate, processing the substrate on which the planar layer is formed, and manufacturing an article from the processed substrate.

[0015] In a particular embodiment, the method for manufacturing the article may include registering the position of the superstraight by detecting the reflection of visible light from the layer covering the chamfered edge, and handling the superstraight based on the registered position of the superstraight in order to load the superstraight into a superstraight chuck used to hold the superstraight.

[0016] In another embodiment, the first surface of the body of the superstraight may be in contact with the moldable material on the substrate.

[0017] In a further embodiment, the area of ​​the superstraight may be larger than the area of ​​the substrate.

[0018] A method for manufacturing a superstraight is disclosed. The method may include forming a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface, covering the first surface and the chamfered edge with an opaque material, and removing the opaque material from the first surface.

[0019] In other embodiments, the chamfered edge includes a first surface and one or more inclined surfaces, and coating the chamfered edge with the opaque material may include coating a first inclined surface of the chamfered edge.

[0020] In a further embodiment, the first inclined surface may be a plane that is mirror symmetric with respect to the second inclined surface.

[0021] In a particular embodiment, the first inclined surface may have a length that is smaller than that of the second inclined surface.

[0022] In other embodiments, the second inclined surface is between the second surface of the body and the first inclined surface of the chamfered edge.

[0023] In still other embodiments, removing the formable material from the first surface may be performed by polishing the first surface.

Brief Description of the Drawings

[0024] The embodiments are shown by way of example and are not limited to the accompanying drawings. [Figure 1] Including a side view of an exemplary device. [Figure 2A] Including an illustration of a cross-sectional view and a plan view of a super straight in the device of FIG. 1. [Figure 2B] Including an illustration of a cross-sectional view and a plan view of a super straight in the device of FIG. 1. [Figure 3] Including a cross-sectional view of a super straight of one embodiment. [Figure 4A] Including a diagram of a cross-sectional view of a super straight of one embodiment. [Figure 4B] Including a diagram of a cross-sectional view of a super straight of one embodiment. [Figure 4C] Including a diagram of a cross-sectional view of a super straight of one embodiment. [Figure 5A] Including a diagram of a cross-sectional view of a super straight and a substrate during a planarization process of one embodiment. [Figure 5B] The diagram includes a cross-sectional view of the superstraight and substrate during the planarization process of one embodiment. [Figure 5C] The diagram includes a cross-sectional view of the superstraight and substrate during the planarization process of one embodiment. [Figure 6] Includes a diagram illustrating a method for manufacturing an article using a superstraight as described herein, according to one embodiment. [Figure 7A] Includes a diagram of a cross-section of a super straight bar under manufacture according to one embodiment. [Figure 7B] Includes a diagram of a cross-section of a super straight bar under manufacture according to one embodiment. [Figure 7C] The diagram includes a cross-sectional view of a superstraight bar during manufacturing, according to one embodiment. Those skilled in the art will understand that the elements in the diagram are shown for simplification and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the diagram may be exaggerated relative to others to aid in understanding embodiments of the present invention. [Modes for carrying out the invention]

[0025] The following description, combined with the drawings, is provided to aid in understanding the teachings disclosed herein. The following discussion focuses on specific implementations and embodiments of the teachings. This focus is provided to aid in illustrating the teachings and should not be construed as a limitation on the scope or applicability of the teachings.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this invention pertains. Materials, methods, and examples are illustrative and not intended to limit the scope of this invention. Many details relating to specific materials and processing procedures, beyond what is described herein, are conventional and can be found in textbooks and other sources within the field of imprint and lithography.

[0027] A superstraight can include a body with chamfered edges and a layer on the chamfered edges. A superstraight can be used for planarization or other processing sequences.

[0028] Details regarding Superstraight and how to use Superstraight will be better understood after reading this specification in conjunction with the drawings. The following description is intended to illustrate embodiments and is not intended to limit the scope of the invention as defined in the appended claims.

[0029] Referring to Figure 1, the apparatus 100 according to the embodiment described herein can be used to help form a layer containing a liquid precursor 124 on a substrate 102. The substrate 102 may be, for example, a semiconductor wafer or a blank nanoimprint lithography superstrat. The substrate 102 may be coupled to a substrate chuck 104. As shown in the figure, the substrate chuck 104 is a vacuum chuck, but in other embodiments, the substrate chuck 104 may be any chuck, including vacuum, pin type, groove type, electrostatic, electromagnetic, etc. An exemplary chuck is described in U.S. Patent No. 6,873,087, which is incorporated herein by reference.

[0030] The substrate 102 and substrate chuck 104 may be further supported by a substrate positioning stage 106. The stage 16 can provide translational or rotational motion along the X, Y, or Z directions. The substrate positioning stage 106 can provide translational and / or rotational motion along one or more of the x, y, z, θ, ψ, and φ axes. The substrate positioning stage 106, substrate 102, and substrate chuck 104 may also be positioned on a base (not shown). The substrate positioning stage may be part of a positioning system.

[0031] Separated from the substrate 102 is a superstraight 108 used when performing adaptive planarization on the substrate 102. The superstraight 108 has a work surface 112 facing the substrate 102. Further details regarding the superstraight 18 are described later in this specification. The superstraight 108 can be formed from materials including, but are not limited to, fused silica, quartz, silicon, organic polymers, siloxane polymers, borosilicate glass, fluorocarbon polymers, metals, and hardened sapphire. In one embodiment, the superstraight 108 is readily transparent to chemical rays, such as UV light.

[0032] The superstraight 108 may be coupled to or held by a superstraight chuck 118. The superstraight chuck 118 may be, but is not limited to, a vacuum chuck, a pin chuck, a groove chuck, an electrostatic chuck, an electromagnetic chuck, and / or other similar chuck types. The superstraight chuck 118 may be configured to apply varying stress, pressure, and / or strain to the superstraight 108. In one embodiment, the superstraight chuck 118 is also readily transparent to UV light. The superstraight chuck 118 may include a system such as a zone-based vacuum chuck, actuator array, or pressure bladder that can apply a pressure difference to the back of the superstraight 108 to bend or deform the superstraight 108. In one embodiment, the superstraight chuck 118 includes a zone-based vacuum chuck that can apply a pressure difference to the back of the superstraight, thereby bending or deforming the superstraight.

[0033] The superstraight chuck 118 may be coupled to a head 120, which is part of a positioning system. The head 120 may be movably coupled to a bridge. The head 120 may include one or more actuators such as a voice coil motor, a piezoelectric motor, a linear motor, a nut and screw motor, which are configured to move the superstraight chuck 118 relative to the substrate 102 at least in the z-axis direction and potentially in other directions (e.g., x-axis, y-axis, θ-axis, ψ-axis, and φ-axis). Either or both of the head 120, the substrate positioning stage 106 can vary the distance between the superstraight 108 and the substrate 102 to define a desired volume to be filled by the moldable material 124.

[0034] The apparatus 100 may further comprise a fluid dispenser 122. The fluid dispenser 122 may also be movably coupled to a bridge. In one embodiment, the fluid dispenser 122 and the head 120 share one or more of all positioning components. In an alternative embodiment, the fluid dispenser 122 and the head 120 move independently of each other. The fluid dispenser 122 may be used to deposit droplets of liquid, formable material 124 (e.g., a photocurable polymerizable material) onto a substrate 102, the volume of material deposited varying on the substrate 102 based at least partially on the substrate's topographic profile. Different fluid dispensers 122 may use different techniques to dispense the formable material 124. If the formable material 124 is jettable, an inkjet-type dispenser may be used to eject the formable material. For example, thermal inkjet, microelectromechanical system (MEMS) based inkjet, valve jet, and piezoelectric inkjet are common techniques for dispensing jettable liquids. The dispenser 122 can distribute the moldable material 124 onto the substrate before the superstraight 108 comes into contact with the moldable material 124.

[0035] The apparatus 100 may further include a curing system that includes a radiation source 126 that directs chemical energy, such as UV radiation, along the exposure path 128. The head 120 and substrate positioning stage 106 may be configured to position the superstraight 108 and substrate 102 so as to overlap the exposure path 128. The radiation source 126 delivers chemical energy along the exposure path 128 after the superstraight 108 has come into contact with the moldable material 128. Figure 1 shows the exposure path 128 when the superstraight 108 is not in contact with the moldable material 124. This is done for illustrative purposes so that the relative positions of the individual components can be easily identified. Those skilled in the art will understand that the exposure path 128 does not substantially change when the superstraight 108 comes into contact with the moldable material 124.

[0036] The apparatus 100 may further include a camera 136 positioned to observe the spreading of the formable material 124 as the superstraight 108 comes into contact with the formable material 124 during the planarization process. Figure 1 shows the optical axis 138 of the image field of the field camera. As shown in Figure 1, the apparatus 100 may also include one or more optical components (such as a dichroic mirror, beam combiner, prism, lens, mirror, etc.) that combine chemical rays with light detected by the camera 136. The camera 136 may include one or more of a CCD, sensor array, line camera, and photodetector, which are configured to collect light of wavelengths that show contrast between the region located below the superstraight 108 and in contact with the formable material 124 and the region located below the superstraight 108 and not in contact with the formable material 124. The camera 136 may be configured to provide an image of the spreading of the formable material 124 below the superstraight 108 and / or an image of the superstraight 108 separated from the cured formable material 124. The camera 136 may also be configured to measure interference fringes that change as the moldable material 124 spreads between the work surface 112 and the substrate surface.

[0037] The apparatus 100 may be coordinated, controlled, and / or directed by one or more processors 140 (controllers) that communicate with one or more components and / or subsystems such as a substrate chuck 104, a substrate positioning stage 106, a superstraight chuck 118, a head 120, a fluid dispenser 122, a radiation source 126, and / or a camera 136. The processors 140 may operate based on instructions in a computer-readable program stored in non-temporary computer memory 142. The processors 140 may be one or more of a CPU, MPU, GPU, ASIC, FPGA, DSP, and a general-purpose computer, or may include them. The processors 140 may be a dedicated controller or a general-purpose computing device adapted to be a controller. Examples of non-temporary computer-readable memory include, but are not limited to, RAM, ROM, CD, DVD, Blu-ray, hard drives, network-attached storage (NAS), intranet-attached non-temporary computer-readable storage devices, and internet-attached non-temporary computer-readable storage devices.

[0038] During operation, either or both of the head 120 and the substrate positioning stage 106 change the distance between the superstraight 108 and the substrate 102 to define a desired space (a three-dimensional, bounded physical area) to be filled with the moldable material 124. For example, the head 120 may be moved toward the substrate and force applied to the superstraight 108 so that the superstraight 108 comes into contact with droplets of the moldable material 124 and the droplets spread across the substrate 102.

[0039] Details relating to the Super Straight 108 will be described with reference to Figures 2A and 2B. Figure 2A is a partial cross-sectional view of the Super Straight 108 in the apparatus of Figure 1 according to one embodiment. Figure 2B is a bottom view of the Super Straight 108 according to one embodiment. The Super Straight 108 may include a body 220 having a first surface 112 and a second surface 202 parallel to the first surface 112. The first surface 112 may face the substrate 102 during operation. In one embodiment, the first surface 112 may be planar. The first surface 112 may have no indentations or protrusions and may be called a blank. The first surface 112 may have an area that is at least 90% of the area of ​​the substrate 102 and may have an area that is the same as or larger than the area of ​​the substrate 102. In one embodiment, its surface area is at least 280 cm². 2 , at least 700cm 2 at least 1100cm 2 In another embodiment, the surface area is up to 31,500 cm². 2The first surface 112 may have a two-dimensional shape such as a circle, ellipse, rectangle (including squared rectangle), or hexagon. The first surface 112 may have a surface roughness that can be determined using atomic force microscopy, an optical profiler, a profiler, etc. Since readings too close to the periphery may impair the surface roughness measurement, a 3 mm edge exclusion can be used. The surface roughness may be the median of the readings. In one embodiment, a representative amount of the region including the center may be used for reading. For example, in the case of a substrate 102 with a diameter of 300 mm, the reading of the first surface 112 may be taken at any position between the center and the edge exclusion region, but in the case of a substrate 102 with a diameter of 450 mm, the reading of the superstraight 108 may be taken within 150 mm of the center of the superstraight 108 if the superstraight 108 is used only on 300 mm wafers. In one embodiment, the surface roughness may be for the contact area of ​​the surface 112, which is the area in which the superstraight 108 contacts the planarization precursor material 124 during the contact operation. In one embodiment, the surface roughness of the surface 112 of the body 220 is at most 1 nm, at most 0.5 nm, or at most 0.2 nm, and in another embodiment, the threshold is at least 0.1 nm.

[0040] The body 220 has a transmittance of at least 70%, at least 80%, at least 85%, or at least 90% to radiation used to cure the planarization precursor material. The body 220 may include glass-based materials, silicon, organic polymers, siloxane polymers, fluorocarbon polymers, sapphire, spinel, other similar materials, or any combination thereof. Glass-based materials may include soda-lime glass, borosilicate glass, alkali-barium silicate glass, aluminosilicate glass, quartz, synthetic fused silica, etc. The body 220 may have a thickness in the range of 30 micrometers to 2000 micrometers.

[0041] The main body 220 may also include a chamfered edge 210. In one embodiment, as seen in Figure 2A, the chamfered edge 210 may include a surface 214 perpendicular to the first surface 112 and an inclined surface 216 connecting surface 214 and the first surface 112. In one embodiment, surface 214 may be perpendicular to the second surface 202, and the second surface 202 may be connected to the inclined surface 216. In another embodiment, the chamfered edge 210 may include two or more inclined surfaces, as seen in Figure 3. In one embodiment, the chamfered edge 210 may include a first inclined surface 216, a second inclined surface 318, and a surface 214 between the first inclined surface 216 and the second inclined surface 318. In one embodiment, the first inclined surface 216 may be a surface that is mirror-symmetric with respect to the second inclined surface 214. In one embodiment, the chamfered edge 210 is a curved surface that connects the first surface 112 to the second surface 202. In one embodiment, the chamfered edge 210 includes one or more curved and / or inclined surfaces connecting the first surface 112 to the second surface 202.

[0042] However, when such a superstraight 108 is used under certain high-throughput conditions, it may tend to form "overflow," which is defined as moldable material that extends (or spills over) beyond the boundary of the first surface 112. Such overflow material can accumulate on the chamfered edge and subsequently solidify upon exposure to chemical radiation. While separating the superstraight from the substrate after the curing of the moldable material 124, the overflowed and cured material may remain on the chamfered edge of the superstraight 108. The accumulated material can eventually peel off, potentially causing defects on the subsequent substrate 102, which negatively impacts subsequent processing. Therefore, to address the overflow defect, we have discovered a novel design, which is described in detail below.

[0043] Figures 4A to 4C are cross-sectional views of a portion of a superstraight having a chamfered edge according to one embodiment. The body 220 may include layers, as will be further described with respect to the embodiments of Figures 4A to 4C. In one embodiment, the layer is translucent and blocks chemical rays sufficiently to prevent hardening or gelling of the accumulated material and to allow evaporation of the accumulated material on the chamfered edge. In one embodiment, the layer is an opaque layer. In one embodiment, the layer has a visible light reflectance greater than 30% and less than or equal to 100%. In another embodiment, the layer has both a visible light reflectance greater than 30% and less than or equal to 100% and a UV light absorbance greater than 70% and less than or equal to 100%. In another embodiment, the layer has a visible light reflectance of at least 30%, for example, at least 35%, or at least 40%. In another embodiment, the layer has a visible light reflectance of 100% or less, for example, 75% or less, or 60% or less. In one embodiment, the layer has an absorbance of UV light of at least 70%, for example, at least 75%, or at least 80%. In another embodiment, the layer has an absorbance of UV light of 100% or less, for example, at least 95%, or at least 90%.

[0044] In another embodiment, the layer has a thickness between 5 nm and 200 nm. In one embodiment, its thickness is at least 5 nm, for example, at least 20 nm, or at least 100 nm. In one embodiment, its thickness is 200 nm or less, for example, 180 nm or less, or 150 nm or less. In one embodiment, the superstraight 408 may include a chamfered edge 210 having an opaque layer 422. In another embodiment, the superstraight 408 may include a chamfered edge 210 and a portion of a second side portion 202 having a layer. In one embodiment, the portion of the second side portion of the body has a length between 10% and 30% of the total length of the second side portion.

[0045] The opaque layer 422 may include one or more of the following: chromium alloy, chromium, molybdenum, tantalum, silicon, tungsten, titanium, aluminum, iron oxide, or silver halide emulsion. In one embodiment, the chamfered edge 210 may include the opaque layer 422. In one embodiment, two or more surfaces of the chamfered edge 210 may include the opaque layer 422. In one embodiment, as seen in Figure 4A, the first inclined side surface 216 of the chamfered edge 210 may include the opaque layer 422. In another embodiment, the chamfered edge 210 and a portion of the second surface 202 may include the opaque layer 422. As seen in Figure 4B, the second inclined surface 318 and a portion 203 of the second surface 202 of the chamfered edge 210 may include the opaque layer 422. In yet another embodiment, the first inclined surface 216, the second inclined surface 318, surface 214, and a portion 203 of the second surface 202 may include the opaque layer 422, as seen in Figure 4C. As indicated by the arrows in Figures 4A to 4C, the opaque layer 422 can prevent visible and UV light from being transmitted through the Superstraight during exposure or detection by an optical sensor. Therefore, any moldable material reaching the chamfered edge of the Superstraight during planarization does not receive curable light and, consequently, does not cure or fix the Superstraight 108. The embodiments described herein are useful for extending the lifespan of the Superstraight.

[0046] Method 600 in Figures 5A-5C and Figure 6 illustrates a process by which an adaptive planarization layer can be formed on a substrate 102 using SuperStraight 408. Features in Figures 5A-5C are exaggerated for ease of understanding. Method 600 for forming a planarization layer on a substrate can be initiated in step 610 by distributing a formable material 124 onto the substrate 102. In one embodiment, the formable material 124 to be distributed may be in the form of droplets. In one embodiment, the substrate 102 may have a non-uniform surface topography. In another embodiment, the surface of the substrate 102 may be uniform. In yet another embodiment, the surface of the substrate 102 may have a repeating pattern or a periodic pattern. The formable material 124 may include a polymerizable material such as a resist. The formable material 124 may be disposed on the substrate 102 in the form of one or more layers using techniques such as droplet distribution, spin coating, immersion coating, chemical vapor deposition (CVD), physical vapor deposition (PVD), thin film deposition, thick film deposition, or a combination thereof. Figure 5A includes a cross-sectional view of a substrate 102, such as a semiconductor wafer, having a surface 503, and one or more droplets of a formable material 124 covering the surface 503 of the substrate 102. By understanding the boundary formed from the transition from the flat surface to the chamfered region, the superstraight 408 can assist in droplet pattern mapping and minimize the formation of undesirable thickness variations or overflows near the edges of the flattened region. In addition, the opaque layer 422 can prevent visible and UV light from transmitting through the superstraight, allowing the edges of the superstraight to be detected by an optical sensor. Thus, the superstraight 408 can advantageously assist in substrate registration or positioning, substrate processing to prevent collision or placement errors, and droplet pattern mapping.

[0047] In the contact step 620, the superstraight 408, for example, the superstraight described above, can come into contact with the moldable material 124. In one embodiment, the first surface of the superstraight body comes into contact with the moldable material on the substrate. When the superstraight 408 comes into contact with the moldable material 124, the trapped gas particles can dissipate through the cured layer, the substrate, or the superstraight 408. In one embodiment, the superstraight 408 can bend during the contact operation 620 to release the gas trapped during the contact operation 620. In one embodiment, the superstraight 408 can come into contact with the moldable material 124 as shown in Figure 5B to form a film on the substrate 102. In the curing step 630, the moldable material 124 can be cured to form a layer on the substrate 102. In one embodiment, curing occurs while the superstraight 408 is in contact with the moldable material 124. In one embodiment, after the moldable material 124 has been distributed onto the substrate 102, one or more light sources are placed on the superstraight 408 to cure the moldable material 124. The moldable material 124 may include monomer or oligomer mixtures that can be cured using ultraviolet light, violet light, blue light, heat, etc. In one embodiment, an opaque layer 422 may be included for directing light rays, as indicated by the arrow in Figure 5B, so that the chamfered edge 210 is away from any moldable material 124 beneath the chamfered edge 210. In another embodiment, the moldable material 124 in contact with the work surface 112 of the superstraight 408 is cured, while the moldable material 124 in contact with or directly beneath the chamfered edge 210 remains in a liquid state.

[0048] This method can be continued with a separation operation 640, and as shown in Figure 5C, the superstraight 408 can be separated from the newly formed cured planarized layer 524 formed on the substrate 102. As the superstraight 408 separates, the formable material 124 that was on the superstraight 408, particularly the formable material on the chamfered edge 210, evaporates, thereby preventing "overflow" defects that would have occurred if the method were not followed. The substrate is further processed to form an article. This method may be useful in manufacturing articles including substrates, such as electronic components including a portion of a semiconductor wafer. In one embodiment, the method for manufacturing an article may include depositing formable material 124 on the substrate 102 and bringing the superstraight 408 into contact with the formable material 124 on the substrate 102. In one embodiment, the superstraight 408 may include a body having a first face, a second face opposite the first face, and a chamfered edge between the first and second faces, with an opaque layer covering the chamfered edge. A method for manufacturing an article may further include curing a moldable material 124 to form a planar layer, separating a superstraight 408 from the planar layer on a substrate 102, processing the substrate 102 on which the planar layer is formed, and manufacturing an article from the processed substrate 102.

[0049] The manufacturing process for superstraights, such as the superstraight described above, may include the following steps, as shown in Figures 7A-7C. This method can begin by registering the position of the superstraight by detecting the reflection of visible light from the coating. In one embodiment, this coating may be the coating described above. This method can continue by handling the superstraight based on its registered position in order to load the superstraight onto a superstraight chuck for holding the superstraight. In one embodiment, a robot may handle the superstraight from a front opening integrated pod (foup) or from one or more superstraights located in the same place. In another embodiment, manual handling of the superstraight may be performed. In other words, the coating layer on the inclined surface of the superstraight, as further described below, can help identify a particular superstraight when it is within a group of superstraights.

[0050] This method can proceed to the receiving step by providing a superstraight 720, as shown in Figure 7A. The superstraight may be a blank superstraight having a first face 712, a second face 702 substantially parallel to the first face 712, and a chamfered edge 710 connecting the first face 712 to the second face 702. In one embodiment, the chamfered edge 710 may include one or more inclined and / or curved surfaces. This method can proceed to the first deposition step by depositing a coating, such as an opaque layer 722, on the first face 712 of the superstraight 720 and the first inclined surface 716 of the chamfered edge 710, as shown in Figure 7B. In one embodiment, the opaque layer 722 may include one or more of chromium alloys, chromium, molybdenum, tantalum, silicon, tungsten, titanium, aluminum, iron oxide, or silver halide emulsions. The first deposition step can be carried out using known methods such as sputtering and vapor deposition. The subsequent etching step can remove the opaque layer 722 from the first surface 712 of the superstraight 720 while leaving the opaque layer 722 on the first inclined surface 716 of the chamfered edge 710, as shown in Figure 7C. In an alternative embodiment, the subsequent polishing step can remove the opaque layer 722 from the first surface 712 of the superstraight 720, leaving the opaque layer 722 on the first inclined surface 716 of the chamfered edge 710.

[0051] It should be noted that not all of the activities described above are required in the general description or examples, some of the specific activities may be omitted, and one or more additional activities may be performed in addition to those described. Furthermore, the order in which the activities are listed does not necessarily indicate the order in which they are performed.

[0052] The advantages, other merits, and solutions to problems relating to specific embodiments have been described above. However, these advantages, merits, solutions to problems, and any features that may give rise to or make more pronounce any advantage, merit, or solution are not to be construed as essential, necessary, or intrinsic features of any or all of the claims.

[0053] The description and examples of embodiments described herein are intended to provide a general understanding of the structures of various embodiments. This specification and examples do not exhaustively or comprehensively describe all elements and features of apparatus and systems that use the structures or methods described herein. Different embodiments may also be provided in combination in a single embodiment, and conversely, for the sake of brevity, various features described in the context of a single embodiment may be provided separately or in any subcombination. Furthermore, references to values ​​described in ranges include each and all values ​​within that range. Many other embodiments may be apparent to those skilled in the art only after reading this specification. Other embodiments may be used and derived from this disclosure so that structural substitutions, logical substitutions, or other modifications may be made without departing from the scope of this disclosure. Therefore, this disclosure should be considered illustrative rather than restrictive.

Claims

1. A superstrate for forming a planarization layer on a substrate, comprising a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface, wherein the edge includes a first inclined surface adjacent to the first surface and a second inclined surface adjacent to the second surface, and a layer covering the first inclined surface and the second inclined surface. A superstrate characterized by the above.

2. The edge has a surface perpendicular to the first surface between the first inclined surface and the second inclined surface. The superstrate according to claim 1, characterized by the above.

3. The layer covers the first inclined surface and a part of the second surface of the body. The superstrate according to claim 1, characterized by the above.

4. The layer covers the entire edge and a part of the second surface of the body. The superstrate according to claim 1, characterized by the above.

5. The part of the second surface of the body has a length between 10% and 30% of the total length of the second surface. The superstrate according to claim 4, characterized by the above.

6. The layer includes a chromium alloy, chromium, molybdenum, tantalum, silicon, tungsten, titanium, aluminum, iron oxide, or silver halide emulsion. The superstrate according to claim 1, characterized by the above.

7. The body includes soda-lime glass, quartz, borosilicate glass, alkali barium silicate glass, aluminosilicate glass, or synthetic fused silica. The superstrate according to claim 1, characterized by the above.

8. The layer has one or more optical properties of a reflectance of visible light exceeding 30% and an absorbance of UV light exceeding 70%. The superstrate according to claim 1, characterized by the above.

9. The layer has both optical properties of a reflectance of visible light exceeding 30% and an absorbance of UV light exceeding 70%. The superstrate according to claim 1, characterized by the above.

10. A method for manufacturing an article, comprising the steps of depositing a formable material on a substrate, and bringing a superstrate including a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface into contact with the formable material on the substrate to form a planar layer. curing the moldable material on the substrate to form the planar layer; separating the superstrate from the planar layer over the substrate; treating the substrate on which the planar layer is formed; and manufacturing an article from the processed substrate, the edge includes a first inclined surface adjacent to the first surface and a second inclined surface adjacent to the second surface; a layer covering the first inclined surface and the second inclined surface; A method for manufacturing an article.

11. registering the position of the superstrate by detecting reflection of visible light from the layer covering the edge; and handling the superstrate based on the registered position of the superstrate to load the superstrate into a superstrate chuck used to hold the superstrate; The method of claim 10 further comprising:

12. the first surface of the body of the superstrate contacts the moldable material on the substrate; The method for manufacturing an article according to claim 10.

13. The area of the superstrate is greater than the area of the substrate. The method for manufacturing an article according to claim 10.

14. A method for manufacturing a superstrate, comprising: forming a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface; coating the first surface and the edge with an opaque material; removing the opaque material from the first surface; Including, the edge includes a first inclined surface adjacent to the first surface and a second inclined surface adjacent to the second surface; A method for manufacturing a superstrate, wherein after the removing step, the first inclined surface and the second inclined surface are covered with the opaque material.

15. The coating step includes coating the first inclined surface.

15. The method of claim 14, wherein the superstrate is made of a tungsten ore-based material.

16. the first inclined surface is a surface that is mirror-symmetric with respect to the second inclined surface; 16. The method of claim 15, wherein the superstrate is a metal.

17. The first inclined surface has a length smaller than that of the second inclined surface. The method for manufacturing a super straight according to claim 15, characterized by the above.

18. The edge has a surface perpendicular to the first surface between the first surface and the second inclined surface. The method for manufacturing a super straight according to claim 14, characterized by the above.

19. The removal step includes a process of polishing the first surface. The method for manufacturing a super straight according to claim 14, characterized by the above.

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