Cleaning method

Abstract

To provide a detergent composition which is excellent in resin mask removability while suppressing damage to a solder resist.SOLUTION: A detergent composition for resin mask peeling contains a quaternary ammonium hydroxide (component A), amino alcohol (component B), a solvent (component C), urea (component D) and water (component E), wherein a content of the component E is 50 mass% or more.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present disclosure relates to a cleaning method and a method for manufacturing electronic components using the same. [Background technology]

[0002] In recent years, personal computers and various electronic devices have become more energy efficient, faster, and smaller, and the wiring on package substrates mounted on these devices is becoming finer year by year. Until now, the metal mask method has been mainly used to form such fine wiring and connection terminals such as pillars and bumps, but due to its low versatility and the difficulty of responding to the miniaturization of wiring, etc., other new methods are being used.

[0003] One of the new methods is to use a dry film resist as a thick resin mask instead of a metal mask. This resin mask is finally peeled off and removed, and an alkaline stripping cleaner is used for this purpose.

[0004] As an alkaline stripping cleaner, for example, Patent Document 1 proposes a resist stripper containing 2-(N,N-dimethyl-2-aminoethoxy)ethanol, urea and water. Patent Document 2 proposes a stripper composition containing (a) urea or a urea derivative, (b) an anticorrosive agent containing a hydroxy aromatic compound as an essential component, (c) a hydroxylamine or an alkanolamine, and (d) water. Patent Document 3 proposes a cleaning agent consisting of an aqueous solution containing 0.01 to 15% by weight of a quaternary ammonium hydroxide, 0.1 to 20% by weight of a sugar or sugar alcohol, and 1 to 40% by weight of a urea compound. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2011-70057 A [Patent Document 2] JP 2001-209191 A [Patent Document 3] Japanese Patent Application Publication No. 7-247498 Summary of the Invention [Problem to be solved by the invention]

[0006] When forming fine wiring on printed circuit boards and the like, a cleaning composition is required to have high cleaning properties in order to reduce not only the residue of a resin mask but also the residue of auxiliary agents contained in solder, plating solution, and the like used in forming the fine wiring and bumps. However, as wiring becomes finer, it becomes more difficult to remove the resin mask from the fine gaps, and therefore cleaning compositions are required to have high resin mask removing properties. On the other hand, in order to miniaturize electronic devices, increase processing speed, and reduce power consumption, wiring is becoming finer. When the wiring width is narrowed, the electrical resistance increases, heat is generated, and the electronic device may have a deteriorated function. In order to reduce the electrical resistance without increasing the area of ​​the wiring board, measures are taken to increase the height of the wiring. Therefore, the resin mask used for wiring formation becomes thicker, the contact area with the wiring increases, and the wiring interval also becomes narrower due to the finer wiring, making the resin mask difficult to remove. In particular, high-energy, low-wavelength light is used to draw fine wiring, but the thick resin mask increases the distance from the resin mask surface to the substrate, and the reaction rate of photopolymerization by exposure differs between the surface and the contact surface of the substrate, causing the surface reaction to proceed excessively, and unless the penetration is strengthened, the cleaning agent composition does not penetrate from the resin mask surface, making the resin mask difficult to remove. Furthermore, there are cases where resins such as solder resists used in electronic circuit boards are damaged.

[0007] In view of this, the present disclosure provides a cleaning composition for stripping a resin mask that has excellent resin mask removability while suppressing damage to a solder resist. [Means for solving the problem]

[0008] In one aspect, the present disclosure relates to a cleaning composition for stripping a resin mask, comprising a quaternary ammonium hydroxide (component A), an amino alcohol (component B), a solvent (component C), urea (component D) and water (component E), in which the content of component E is 50 mass% or more.

[0009] In one aspect, the present disclosure relates to a cleaning method including a step of peeling off a resin mask from an object to be cleaned to which the resin mask is attached, using the cleaning composition of the present disclosure.

[0010] In one aspect, the present disclosure relates to a method for producing electronic components, comprising a step of cleaning an electronic circuit board having a resin mask with the cleaning composition of the present disclosure. Effect of the Invention

[0011] According to the present disclosure, a cleaning composition that suppresses damage to a solder resist and has excellent resin mask removability can be provided. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The present disclosure is based on the discovery that a cleaning composition containing specific alkaline agents (components A to B), a solvent (component C), urea (component D), and a specific amount of water can be used to efficiently remove a resin mask from a substrate surface while suppressing damage to the solder resist.

[0013] In one aspect, the present disclosure relates to a cleaning composition for stripping a resin mask (hereinafter also referred to as the "cleaning composition of the present disclosure") that contains a quaternary ammonium hydroxide (component A), an amino alcohol (component B), a solvent (component C), urea (component D), and water (component E), in which the content of component E is 50 mass% or more.

[0014] According to the present disclosure, a cleaning composition that suppresses damage to a solder resist and has excellent resin mask removability can be provided. By using the cleaning composition of the present disclosure for cleaning electronic components such as electronic circuit boards having a resin mask, high-quality electronic components can be obtained with high yield.

[0015] Although the details of the mechanism of action by which the effects of the present disclosure are expressed are unclear, it is presumed as follows. It is believed that the quaternary ammonium hydroxide (component A) and amino alcohol (component B) penetrate into the resin mask, promote the dissociation of the alkali-soluble resin contained in the resin mask, and further promote the peeling off of the resin mask by causing the repulsion of the electric charges generated by the dissociation. Since the quaternary ammonium hydroxide (component A) and the amino alcohol (component B) have different penetration rates into the resin mask, it is believed that the rapid dissociation of the alkali-soluble resin on the surface of the resin mask is suppressed, and the electric charge repulsion only on the surface of the resin mask, which inhibits penetration, is suppressed. In addition, it is believed that the solvent (component C) and urea (component D) penetrate the resin mask and soften it, thereby accelerating the penetration of each component into the resin mask. Furthermore, by adjusting the content of water (component D) to a predetermined amount, dissociation of the alkali-soluble resin in the resin mask is favored, while the penetration into the solder resist (hereinafter also referred to as "SR") is suppressed, which is thought to reduce damage to the SR. However, the present disclosure need not be construed as being limited to this mechanism.

[0016] In the present disclosure, a resin mask is a mask for protecting a material surface from treatments such as etching, plating, and heating, that is, a mask that functions as a protective film. In one or more embodiments, the resin mask may be a resist layer after exposure and development steps, a resist layer that has been subjected to at least one of exposure and development (hereinafter also referred to as "exposed and / or developed"), or a hardened resist layer. In one or more embodiments, the resin mask is formed using a resist whose physical properties, such as solubility in a developer, change due to light, electron beams, or the like. Resists are broadly divided into negative and positive types based on the reaction method with light or electron beams. A negative resist has a property that its solubility in a developer decreases when exposed to light, and the exposed portion of a layer containing a negative resist (hereinafter also referred to as a "negative resist layer") is used as a resin mask after exposure and development processing. A positive resist has a property that its solubility in a developer increases when exposed to light, and the exposed portion of a layer containing a positive resist (hereinafter also referred to as a "positive resist layer") is removed after exposure and development processing, and the unexposed portion is used as a resin mask. By using a resin mask having such properties, fine connections of a circuit board, such as metal wiring, metal pillars, and solder bumps, can be formed. In one or more embodiments, the resin material for forming the resin mask may be a film-like photosensitive resin, a resist film, or a photoresist. A general-purpose resist film may be used.

[0017] [Component A: Quaternary ammonium hydroxide] The quaternary ammonium hydroxide (hereinafter also referred to as "Component A") contained in the cleaning composition of the present disclosure may be, for example, a quaternary ammonium hydroxide represented by the following formula (I). Component A may be one type or a combination of two or more types. [ka]

[0018] In the above formula (I), R 1 , R 2 , R 3 and R 4 are each independently at least one selected from a methyl group, an ethyl group, a propyl group, a hydroxymethyl group, a hydroxyethyl group, and a hydroxypropyl group.

[0019] The quaternary ammonium hydroxide represented by formula (I) is a salt consisting of a quaternary ammonium cation and a hydroxide, and examples thereof include at least one selected from tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide, tetrapropylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide (choline), 2-hydroxyethyltriethylammonium hydroxide, 2-hydroxyethyltripropylammonium hydroxide, 2-hydroxypropyltrimethylammonium hydroxide, 2-hydroxypropyltriethylammonium hydroxide, 2-hydroxypropyltripropylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, diethylbis(2-hydroxyethyl)ammonium hydroxide, dipropylbis(2-hydroxyethyl)ammonium hydroxide, tris(2-hydroxyethyl)methylammonium hydroxide, tris(2-hydroxyethyl)ethylammonium hydroxide, tris(2-hydroxyethyl)propylammonium hydroxide, tetrakis(2-hydroxyethyl)ammonium hydroxide, and tetrakis(2-hydroxypropyl)ammonium hydroxide. Among these, tetramethylammonium hydroxide (TMAH) is more preferable from the viewpoint of improving the removability of the resin mask.

[0020] The content of component A when using the cleaning composition of the present disclosure is preferably 2% by mass or more, more preferably 2.5% by mass or more, from the viewpoint of improving the removability of the resin mask, and from the same viewpoint, it is preferably 5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less. From the same viewpoint, the content of component A when using the cleaning composition of the present disclosure is preferably 2% by mass or more and 5% by mass or less, more preferably 2% by mass or more and 4% by mass or less, and even more preferably 2% by mass or more and 3% by mass or less. When component A is a combination of two or more kinds, the content of component A refers to the total content thereof.

[0021] In the present disclosure, "the content of each component in the cleaning composition at the time of use" refers to the content of each component at the time of cleaning, i.e., at the time when the use of the cleaning composition for cleaning is started. In one or more embodiments, the content of each component in the cleaning composition of the present disclosure can be considered as the blending amount of each component in the cleaning composition of the present disclosure.

[0022] (Component B: Amino alcohol) The amino alcohol (alkanolamine) (hereinafter also referred to as "Component B") contained in the cleaning composition of the present disclosure includes, for example, a compound represented by the following formula (II). Component B may be one type or a combination of two or more types. [ka]

[0023] In the above formula (II), R 5 represents a hydrogen atom, a methyl group, an ethyl group, or an aminoethyl group; R 6 represents a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group, or an ethyl group; R 7 represents a hydroxyethyl group or a hydroxypropyl group.

[0024] Examples of component B include at least one selected from monoethanolamine (MEA), monoisopropanolamine, N-methylmonoethanolamine, N-methylisopropanolamine, N-ethylmonoethanolamine, N-ethylisopropanolamine, diethanolamine, diisopropanolamine, N-dimethylmonoethanolamine, N-dimethylmonoisopropanolamine, N-methyldiethanolamine, N-methyldiisopropanolamine, N-diethylmonoethanolamine, N-diethylmonoisopropanolamine, N-ethyldiethanolamine, N-ethyldiisopropanolamine, N-(β-aminoethyl)ethanolamine, N-(β-aminoethyl)isopropanolamine, N-(β-aminoethyl)diethanolamine, and N-(β-aminoethyl)diisopropanolamine. Among these, monoethanolamine (MEA) is preferred from the viewpoint of improving the removability of the resin mask.

[0025] The content of component B when using the cleaning composition of the present disclosure is preferably 5% by mass or more, more preferably 9% by mass or more, even more preferably 10% by mass or more, and even more preferably 11% by mass or more, from the viewpoint of improving the removability of the resin mask, and from the same viewpoint, it is preferably 15% by mass or less, more preferably 14% by mass or less, and even more preferably 13% by mass or less. From the same viewpoint, the content of component B when using the cleaning composition of the present disclosure is preferably 5% by mass or more and 15% by mass or less, more preferably 9% by mass or more and 15% by mass or less, even more preferably 10% by mass or more and 14% by mass or less, and even more preferably 11% by mass or more and 13% by mass or less. When component B is a combination of two or more kinds, the content of component B refers to the total content thereof.

[0026] From the viewpoint of improving the removability of the resin mask, the total content of component A and component B when using the cleaning composition of the present disclosure is preferably 6% by mass or more, more preferably 7% by mass or more, and even more preferably 8% by mass or more, and from the same viewpoint, it is preferably 20% by mass or less, more preferably 18% by mass or less, and even more preferably 16% by mass or less. From the same viewpoint, the total content of component A and component B when using the cleaning composition of the present disclosure is preferably 6% by mass or more and 20% by mass or less, more preferably 7% by mass or more and 18% by mass or less, and even more preferably 8% by mass or more and 16% by mass or less.

[0027] [Component C: Solvent] The solvent contained in the cleaning composition of the present disclosure (hereinafter, also referred to as "component C") may be, for example, at least one selected from aromatic alcohols, glycol ethers, and aromatic ketones. Among these, aromatic alcohols are preferred from the viewpoint of improving the removability of the resin mask. Component C may be one type or a combination of two or more types.

[0028] The aromatic alcohol may be a compound having an aromatic ring and a hydroxyl group. From the viewpoint of improving the removability of the resin mask, the aromatic alcohol preferably has 7 or more carbon atoms and 10 or less, more preferably 9 or less. The aromatic alcohol may be at least one selected from benzyl alcohol, phenethyl alcohol, 4-methylbenzyl alcohol, 4-ethylbenzyl alcohol, 2-phenyl-1-propanol, and 2-phenyl-2-propanol. From the viewpoint of improving the removability of the resin mask, benzyl alcohol is more preferable. From the viewpoint of improving the removability of the resin mask, the glycol ether may be a compound having a structure in which 1 to 3 moles of ethylene glycol are added to an alcohol having 1 to 8 carbon atoms. Specific examples of the glycol ether include at least one selected from diethylene glycol monobutyl ether (BDG), ethylene glycol monobenzyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, and diethylene glycol diethyl ether. From the viewpoint of improving the removability of the resin mask, examples of the aromatic ketone include acetophenone.

[0029] The content of component C during use of the cleaning composition of the present disclosure is preferably 1% by mass or more, more preferably 2% by mass or more, and even more preferably 4% by mass or more from the viewpoint of improving resin mask removability, and is preferably 35% by mass or less, more preferably 30% by mass or less, even more preferably 20% by mass or less, and even more preferably 10% by mass or less from the viewpoint of improving resin mask removability and reducing SR damage. More specifically, the content of component C in the cleaning composition of the present disclosure is preferably 1% by mass or more and 35% by mass or less, more preferably 1% by mass or more and 30% by mass or less, even more preferably 2% by mass or more and 20% by mass or less, and even more preferably 4% by mass or more and 10% by mass or less. When component C is a combination of two or more types, the content of component C refers to the total content thereof.

[0030] [Component D: Urea] The cleaning composition of the present disclosure contains urea (hereinafter also referred to as "component D"). The content of component D during use of the cleaning composition of the present disclosure is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 2% by mass or more from the viewpoint of improving resin mask removability, and is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less from the viewpoint of improving blendability. More specifically, the content of component D in the cleaning composition of the present disclosure is preferably 0.5% by mass or more and 10% by mass or less, more preferably 1% by mass or more and 5% by mass or less, and even more preferably 2% by mass or more and 3% by mass or less.

[0031] [Component E: Water] In one or a plurality of embodiments, examples of water contained in the cleaning agent composition of the present disclosure (hereinafter also referred to as "component E") include ion-exchanged water, RO water, distilled water, pure water, and ultrapure water.

[0032] The content of component E in the cleaning composition of the present disclosure can be the remainder excluding components A, B, C, D, and optional components described later. Specifically, the content of component E when using the cleaning composition of the present disclosure is 50% by mass or more, more preferably 55% by mass or more, more preferably 60% by mass or more, more preferably 65% ​​by mass or more, and even more preferably 70% by mass or more, from the viewpoint of improving mixability, improving resin mask removability, and reducing SR damage, and is preferably 96% by mass or less, more preferably 93% by mass or less, and even more preferably 90% by mass or less, from the viewpoint of improving resin mask removability. More specifically, the content of component E when using the cleaning composition of the present disclosure is preferably 50% by mass or more and 96% by mass or less, more preferably 55% by mass or more and 96% by mass or less, more preferably 60% by mass or more and 93% by mass or less, even more preferably 65% ​​by mass or more and 93% by mass or less, and even more preferably 70% by mass or more and 90% by mass or less.

[0033] [Other ingredients] The cleaning composition of the present disclosure may further contain other components as necessary, in addition to the above-described Components A to E. Examples of other components include components that can be used in ordinary cleaning agents, such as alkaline agents other than Components A and B, amines other than Component B, surfactants, chelating agents, thickening agents, dispersants, rust inhibitors, polymeric compounds, solubilizers, antioxidants, preservatives, antifoaming agents, and antibacterial agents.

[0034] In one or more embodiments, the cleaning composition of the present disclosure may be substantially free of an acid or an ammonium salt thereof. The content of the acid or the ammonium salt thereof during use of the cleaning composition of the present disclosure may be, for example, less than 0.3 mass%.

[0035] From the viewpoint of improving the removability of the resin mask, the pH of the cleaning composition of the present disclosure during use is preferably 12 or more, more preferably 12.5 or more, and even more preferably 13 or more. In the present disclosure, the "pH during use" refers to the pH at 25°C, which can be measured using a pH meter. Specifically, it can be measured by the method described in the Examples.

[0036] [Method of producing the cleaning composition] In one or more embodiments, the cleaning composition of the present disclosure can be produced by blending the components A to E and, if necessary, the optional components (other components) described above, by a known method. For example, the cleaning composition of the present disclosure can be produced by blending at least the components A to E. Thus, the present disclosure relates to a method for producing a cleaning composition, which includes a step of blending at least the components A to E. In the present disclosure, "blending" includes mixing the components A to E and, if necessary, the optional components described above, simultaneously or in any order. In the method for producing a cleaning composition of the present disclosure, the preferred blending amount of each component can be the same as the preferred content of each component of the cleaning composition of the present disclosure described above.

[0037] The cleaning composition of the present disclosure may be prepared as a concentrate in which the amount of water (component E) is reduced to the extent that separation, precipitation, etc. do not occur and storage stability is not impaired. The concentrate of the cleaning composition is preferably a concentrate having a dilution ratio of 3 times or more from the viewpoint of transportation and storage, and is preferably a concentrate having a dilution ratio of 30 times or less from the viewpoint of storage stability. The concentrate of the cleaning composition can be used by diluting with water (component E) so that the components A to E and optional components have the above-mentioned contents (i.e., contents at the time of cleaning) at the time of use. Furthermore, the concentrate of the cleaning composition can also be used by adding each component separately at the time of use. In the present disclosure, "at the time of use" or "at the time of cleaning" of the concentrated cleaning composition refers to a state in which the concentrate of the cleaning composition is diluted.

[0038] [Item to be cleaned] In one or more embodiments, the cleaning composition of the present disclosure can be used for cleaning an object to which a resin mask is attached. In one or more embodiments, the cleaning composition of the present disclosure can be used for removing the resin mask from an object to which the resin mask is attached. That is, in one aspect, the present disclosure relates to use of the cleaning composition of the present disclosure for removing the resin mask from an object to which the resin mask is attached. The object to be cleaned may be, for example, an electronic component or an intermediate product thereof. The electronic component may be, for example, at least one component selected from a printed circuit board, a wafer, and a metal plate such as a copper plate or an aluminum plate. The intermediate product may be an intermediate product in the manufacturing process of an electronic component, including an intermediate product after a resin mask treatment. In one or more embodiments, the object to be cleaned with the resin mask attached thereto may be an electronic circuit board having a cured resin mask. In one or more embodiments, the object to be cleaned with the resin mask attached thereto may be a substrate having a metal wiring with a line width of 5 μm or more and 35 μm or less and a thickness of 40 μm or more and 80 μm or less at its thickest part, and a cured resin mask on the surface of the substrate. The substrate may be, for example, a glass epoxy multilayer substrate. The metal wiring may be, for example, a metal foil such as copper foil. The metal foil may be formed by plating. In one or more embodiments, the substrate having the metal wiring is a glass epoxy multilayer substrate having a metal foil (for example, copper foil) on the surface. The line width of the thin line portion of the metal wiring is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of removability of the cured resin mask, and from the same viewpoint, is preferably 35 μm or less, more preferably 30 μm or less, and even more preferably 20 μm or less. The thickness of the thickest part of the metal wiring (thickness of the thin line part) is preferably 40 μm or more, more preferably 45 μm or more, from the viewpoint of removability of the cured resin mask, and from the same viewpoint, it is preferably 80 μm or less, more preferably 75 μm or less, even more preferably 70 μm or less, even more preferably 65 μm or less. In one or more embodiments, the object to be cleaned with a resin mask attached thereto may be an electronic component having wiring, connection terminals, etc. formed on the surface of the substrate by undergoing a process of soldering using a resin mask, plating (copper plating, aluminum plating, nickel plating, etc.), etc. Specifically, for example, a substrate may be exemplified in which a circuit pattern is formed by plating after performing at least one of a curing process of exposure and development on an uncured resin mask on the surface of a glass epoxy multilayer substrate and removing the uncured resin mask. A cured resin mask is present in the non-plated portion of the formed circuit pattern. In general, the width of the cured resin mask adjacent to the fine line portion of the circuit pattern is formed to be the same width as the line width of the fine line portion. From the viewpoint of removability of the cured resin mask, the width of the fine line portion formed by plating is preferably 5 μm or more, more preferably 10 μm or more, and is preferably 35 μm or less, more preferably 30 μm or less, and even more preferably 20 μm or less. The thickness of the thin line portion by plating (plating thickness) is preferably 40 μm or more, more preferably 45 μm or more, from the viewpoint of removability of the cured resin mask, and from the same viewpoint, it is preferably 80 μm or less, more preferably 75 μm or less, even more preferably 70 μm or less, even more preferably 65 μm or less. The width of the cured resin mask in the non-plated portion (between the circuit patterns) is preferably 5 μm or more, more preferably 10 μm or more, and preferably 35 μm or less, more preferably 30 μm or less, even more preferably 20 μm or less, from the viewpoint of removability of the cured resin mask. In addition, the electronic component may be a substrate having a resin on its surface, for example, a substrate having a solder resist, from the viewpoint of exerting an effect of suppressing damage to the substrate resin. Thus, in one aspect, the present disclosure relates to the use of the cleaning composition of the present disclosure as a cleaning agent in the manufacture of electronic components.

[0039] In one or more embodiments, the cleaning composition of the present disclosure can be suitably used for cleaning an object to which a resin mask or a resin mask that has been further plated and / or heated is attached, from the viewpoint of cleaning effect. The resin mask may be, for example, a negative resin mask or a positive resin mask, and a negative resin mask is preferable from the viewpoint of easily exerting the effects of the present disclosure. An example of a negative resin mask is a negative dry film resist that has been exposed and / or developed. In the present disclosure, a negative resin mask is formed using a negative resist, and an example of the negative resin mask is a negative resist layer that has been exposed and / or developed. In the present disclosure, a positive resin mask is formed using a positive resist, and an example of the positive resin mask is a positive resist layer that has been exposed and / or developed.

[0040] [Cleaning method] In one aspect, the present disclosure relates to a cleaning method (hereinafter also referred to as "the cleaning method of the present disclosure") including a step of peeling a resin mask from an object to be cleaned to which the resin mask is attached, using the cleaning composition of the present disclosure (hereinafter also simply referred to as "peeling step"). In one or more embodiments, the peeling step in the cleaning method of the present disclosure includes contacting the object to be cleaned to which the resin mask is attached, with the cleaning composition of the present disclosure. Examples of the object to be cleaned include the objects to be cleaned described above. According to the cleaning method of the present disclosure, the resin mask can be efficiently removed while suppressing damage to the solder resist.

[0041] Examples of the method of peeling off a resin mask from an object to be cleaned using the cleaning composition of the present disclosure, or the method of contacting the object to be cleaned with the cleaning composition of the present disclosure include a method of contacting the object by immersing the object in a cleaning bath containing the cleaning composition, a method of contacting the object by spraying the cleaning composition in a spray form (shower method), and an ultrasonic cleaning method of irradiating the object with ultrasonic waves during immersion. The cleaning composition of the present disclosure can be used for cleaning as is without dilution. Examples of the object to be cleaned include the above-mentioned objects to be cleaned. The immersion time can be, for example, 1 minute or more and 10 minutes or less, and further 3 minutes or more and 6 minutes or less. The spray time can be, for example, 1 minute or more and 10 minutes or less, and further 3 minutes or more and 6 minutes or less.

[0042] In one or more embodiments, the cleaning method of the present disclosure may include a step of contacting the object to be cleaned with the cleaning composition, rinsing with water, and drying. Examples of the rinsing method include rinsing with running water. Examples of the drying method include air blow drying. In one or more embodiments, the cleaning method of the present disclosure may include a step of rinsing the object to be cleaned with water after contacting the object with the cleaning composition.

[0043] In the cleaning method of the present disclosure, it is preferable to irradiate ultrasonic waves when the cleaning composition of the present disclosure comes into contact with the object to be cleaned, and it is more preferable that the ultrasonic waves have a relatively high frequency, from the viewpoint of making it easier for the cleaning power of the cleaning composition of the present disclosure to be exerted. From the same viewpoint, the ultrasonic irradiation conditions are, for example, preferably 26 to 72 kHz and 80 to 1500 W, and more preferably 36 to 72 kHz and 80 to 1500 W.

[0044] In the cleaning method of the present disclosure, the temperature of the cleaning composition is preferably 40° C. or higher, and more preferably 50° C. or higher, from the viewpoint of allowing the cleaning power of the cleaning composition of the present disclosure to be easily exerted, and is preferably 70° C. or lower, and more preferably 60° C. or lower, from the viewpoint of reducing the effect on the organic resin-containing substrate.

[0045] [Electronic component manufacturing method] In one aspect, the present disclosure relates to a method for producing electronic components, the method including a step of peeling off a resin mask from an object to be cleaned to which the resin mask is attached, using the cleaning method of the present disclosure. The object to be cleaned can be any of the above-mentioned objects to be cleaned. In another aspect, the present disclosure relates to a method for producing electronic components, comprising a step of cleaning an electronic circuit board having a resin mask with the cleaning composition of the present disclosure (hereinafter also referred to as a "cleaning step"). The cleaning method in the cleaning step may be the same as the cleaning method of the present disclosure described above. According to the manufacturing method of electronic components of the present disclosure, the resin mask attached to the electronic components can be effectively removed while suppressing damage to the solder resist, thereby enabling the manufacturing of highly reliable electronic components. Furthermore, by carrying out the cleaning method of the present disclosure, the resin mask attached to the electronic components can be easily peeled off, thereby shortening the cleaning time and improving the manufacturing efficiency of electronic components.

[0046] [kit] In one aspect, the present disclosure relates to a kit for use in either the cleaning method of the present disclosure or the method for producing electronic components of the present disclosure (hereinafter, also referred to as the "kit of the present disclosure"). In one or more embodiments, the kit of the present disclosure is a kit for producing the cleaning composition of the present disclosure. According to the kit of the present disclosure, a cleaning composition having excellent resin mask removability can be obtained while suppressing damage to a solder resist.

[0047] One embodiment of the kit of the present disclosure includes a kit (three-liquid type cleaning agent composition) that includes a solution (first liquid) containing component A, a solution (second liquid) containing component B, and a solution (third liquid) containing components C and D in a mutually unmixed state, and at least one selected from the first liquid, the second liquid, and the third liquid further contains a part or all of component E (water), and the first liquid, the second liquid, and the third liquid are mixed at the time of use. After the first liquid, the second liquid, and the third liquid are mixed, they may be diluted with water (component E) as necessary. Each of the first liquid, the second liquid, and the third liquid may contain the above-mentioned optional components as necessary. Other embodiments of the kit of the present disclosure include a kit (two-liquid type cleaning agent composition) that includes a solution (first liquid) containing component A and a solution (second liquid) containing components B, C, and D in a mutually unmixed state, at least one of the first liquid and the second liquid further contains a part or all of component E (water), and the first liquid and the second liquid are mixed at the time of use. After the first liquid and the second liquid are mixed, they may be diluted with component E (water) as necessary. Each of the first liquid and the second liquid may contain the above-mentioned optional components as necessary. EXAMPLES

[0048] The present disclosure will be specifically described below with reference to examples, but the present disclosure is not limited to these examples in any way.

[0049] 1. Preparation of cleaning compositions of Examples 1 to 8 and Comparative Examples 1 to 5 The cleaning compositions of Examples 1 to 8 and Comparative Examples 1 to 5 were prepared by mixing the components shown in Table 1 in the amounts (mass %, active content) shown in Table 1 and stirring to mix. The pH of each cleaning composition at 25°C shown in Table 1 was measured using a pH meter (Toa Dempa Kogyo Co., Ltd., HM-30G), and the value was measured one minute after the pH meter electrode was immersed in the cleaning composition.

[0050] The cleaning compositions of Examples 1 to 8 and Comparative Examples 1 to 5 were prepared using the following materials. (Component A) TMAH: Tetramethylammonium hydroxide [Showa Denko Co., Ltd., concentration 25%] (Component B) MEA: Monoethanolamine [FUJIFILM Wako Pure Chemical Industries, Ltd., special grade] (Component C) BDG: Butyl diglycol [Nihon Nyukazai Co., Ltd., diethylene glycol monobutyl ether] Acetophenone [FUJIFILM Wako Pure Chemical Industries, Ltd., special grade] Benzyl alcohol [FUJIFILM Wako Pure Chemical Industries, Ltd., special grade] (Component D) Urea [FUJIFILM Wako Pure Chemical Corporation, special grade] (Component E) Water [Pure water of 1μS / cm or less produced using the Organo Corporation pure water system G-10DSTSET]

[0051] 2. Evaluation of the cleaning compositions of Examples 1 to 8 and Comparative Examples 1 to 5 The prepared cleaning compositions of Examples 1 to 8 and Comparative Examples 1 to 5 were evaluated as follows.

[0052] [Test piece for evaluating peelability] The test piece for evaluating peelability was 120 mm x 120 mm in size, and had a fine-line circuit pattern (fine line portion) formed by copper plating on the surface of a glass epoxy multilayer substrate, and a resin mask which was a cured negative dry film resist between the fine-line circuit patterns. The fine-line circuit pattern (fine line portion) had a line width of 16 μm, and the thickness of the fine line portion (plating thickness) was 54 μm. [SR damage evaluation test piece] The test piece for evaluating SR damage was 50 mm x 50 mm in size, and had a solder resist (SR) around a fine-line circuit pattern formed by copper plating on the surface of a glass epoxy multilayer substrate.

[0053] [Evaluation of peelability] (Cleaning test method) Dipping and showering are performed consecutively as follows. 1 kg of each of the cleaning compositions of Examples 1 to 8 and Comparative Examples 1 to 5 is added to a 1 L glass beaker and heated to 50°C. The test piece is immersed in the beaker for 5 minutes while stirring the beaker at 300 rpm using a rotor (fluororesin (PTFE), φ8 mm×25 mm). A separately prepared 10 L stainless steel beaker is used as a storage tank, and 10 kg of the same cleaning composition as the 1 L glass beaker is added and heated to 50°C. The cleaning composition in the storage tank is sprayed onto the test piece for 3 minutes (pressure: 0.1 MPa, spray distance: 10 cm) using a box-type spray washer equipped with a one-fluid nozzle (fan-shaped) VVP9060 (manufactured by Ikeuchi Co., Ltd.) as a spray nozzle. The sprayed cleaning composition is collected in the storage tank and circulated for reuse. Next, the test piece is immersed in a rinsing tank containing 1 kg of water in a 1 L glass beaker, rinsed, and then dried by nitrogen blowing. Using an optical microscope "Digital Microscope VHX-2000" (manufactured by Keyence Corporation), the presence or absence of the resin mask remaining on the fine line portion of the test piece after the cleaning test is visually observed at 300 times magnification to check for the presence or absence of residue. The peelability (resin mask removability) was evaluated based on the following evaluation criteria, and the results are shown in Table 1. <Evaluation criteria> A: No residue in a 5cm square area B: 1 to 10 residues in a 5 cm square area C: 11 to 50 residues in a 5 cm square area D: There are 51 or more residues in a 5 cm square area, or the residues cover 20% or more of the surface area.

[0054] [Damage to SR] Perform the dip and shower consecutively as follows: 1 kg of each of the cleaning compositions of Examples 1 to 8 and Comparative Examples 1 to 5 is added to a 1 L glass beaker and heated to 50°C. The test piece is immersed in the beaker for 5 minutes while stirring the beaker at 300 rpm using a rotor (fluororesin (PTFE), φ8 mm×25 mm). A 10 L stainless steel beaker is used as a storage tank, and 10 kg of the same cleaning composition as the 1 L glass beaker is added and heated to 50°C. The cleaning composition in the storage tank is sprayed onto the test piece for 3 minutes (pressure: 0.1 MPa, spray distance: 10 cm) using a box-type spray washer equipped with a one-fluid nozzle (fan-shaped) VVP9060 (manufactured by Ikeuchi Co., Ltd.) as a spray nozzle. The sprayed cleaning composition is collected in the storage tank and circulated for reuse. The 1 L glass beaker is then immersed in a rinsing tank containing 1 kg of water to rinse the beaker, and then dried by nitrogen blowing. Using an optical microscope "Digital Microscope VHX-2000" (manufactured by Keyence Corporation), the presence or absence of the resin mask remaining on the fine line portion of the test piece after the cleaning test was visually observed at 20 to 300 times magnification. Damage to the SR was evaluated based on the following evaluation criteria regarding changes in the shape and color of the SR surface, and the results are shown in Table 1. A: No change in the shape or color of the SR surface B: There is no change in the shape of the SR surface, but there is a change in color, and the SR near the fine line circuit does not lift up. C: There is no change in the shape of the SR surface, but there is a change in color and the SR near the fine line circuit is raised. D: The shape and color of the SR surface have changed, and the SR near the fine line circuit has risen.

[0055] [Mixability] Each composition was stirred and mixed on a 100 g scale, and then allowed to stand for 2 minutes. Visual observation was performed and the mixing property was evaluated based on the following evaluation criteria. The results are shown in Table 1. A: Maintains a homogeneous state or less than 1% by volume of components separates B: 1% or more and less than 5% by volume of the component separates. C: 5% or more and less than 10% by volume of the component separates D: 10% or more by volume of the components separates.

[0056] [Table 1]

[0057] As shown in Table 1, the cleaning compositions of Examples 1 to 8 were found to be superior in resin mask removability while suppressing damage to the solder resist, compared to Comparative Example 1 not containing Component A, Comparative Example 2 not containing Component B, Comparative Example 3 not containing Component C, and Comparative Example 4 not containing Component D. Furthermore, the cleaning compositions of Examples 1 to 8 were superior in resin mask removability while suppressing damage to the solder resist, and also had excellent mixability, compared to Comparative Example 5 in which the content of Component E (water) was less than 50 mass %. [Industrial Applicability]

[0058] According to the present disclosure, a cleaning composition that is excellent in resin mask removability while suppressing damage to solder resist can be provided. Furthermore, by using the cleaning composition of the present disclosure, the performance and reliability of manufactured electronic components can be improved, and the productivity of semiconductor devices can be improved.

Claims

1. containing a quaternary ammonium hydroxide (component A), an amino alcohol (component B), a solvent (component C), urea (component D) and water (component E), A cleaning agent composition for resin mask stripping, wherein the content of component E is 50% by mass or more.

2. The cleaning agent composition according to claim 1, wherein component C is at least one selected from aromatic alcohols, glycol ethers and aromatic ketones.

3. The cleaning agent composition according to claim 1, wherein component C is benzyl alcohol.

4. The cleaning agent composition according to claim 1, wherein the content of component E in the cleaning agent composition is 65% by mass or more.

5. A cleaning method comprising a step of stripping a resin mask from an object to be cleaned to which the resin mask is attached, using the cleaning agent composition according to any one of claims 1 to 4.

6. A method for manufacturing an electronic component, comprising a step of cleaning an electronic circuit board having a resin mask, using the cleaning agent composition according to any one of claims 1 to 4.