Sealing resin used in compression molding, and method for forming the same

Abstract

To provide a sealing resin which can achieve a compression molding device and a compression molding method that can prevent occurrence of a molding failure, and a method for forming the same.SOLUTION: A sealing resin R is used in compression molding of workpiece W having such a structure that an electronic component Wb is mounted on a base material Wa, has a plate-like or block-like body part Ra and a leg part Rb erected on one surface of the body part Ra, and is formed so as not to be brought into contact with the electronic component Wb when being mounted on the base material Wa.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a sealing resin used in compression molding and a method for forming the same. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and a resin sealing method for sealing a workpiece having electronic components mounted on a substrate with a sealing resin and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technology in which a predetermined amount of sealing resin is supplied to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, a workpiece is placed in the sealing area, and the upper mold and lower mold are clamped to seal the workpiece with resin. As an example, when a sealing mold having a cavity in the upper mold is used, a technology is known in which the sealing resin is supplied all at once to the center position on the workpiece and molded. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technology is known in which a release film (hereinafter sometimes simply referred to as a "film") that covers the mold surface including the cavity and the sealing resin are supplied and molded (Patent Document 1: See JP 2019-145550 A). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-145550 A Summary of the Invention [Problem to be solved by the invention]

[0005] For example, when a strip-type wire-connected electronic component (semiconductor chip) is encapsulated with resin as a workpiece, the compression molding method in which a cavity is provided in the upper die has a problem that resin encapsulation is difficult because the wire portion of the workpiece held in the lower die comes into contact with the encapsulation resin previously supplied to the cavity or the encapsulation resin supplied onto the workpiece and deforms. Therefore, a compression molding method in which the workpiece is held in the upper die, a cavity is provided in the lower die, and encapsulation resin (granular resin, as an example) is supplied into the cavity has generally been adopted.

[0006] However, in a configuration in which a workpiece is held in the upper mold and a cavity is provided in the lower mold, when the workpiece is thin or large, there is a problem that it is difficult to hold the workpiece in the upper mold and it is likely to fall. In addition, although the sealing resin is usually supplied into the cavity of the lower mold through a film, when attempting to form a thick molded product with a thickness (here, the thickness of the resin part after molding) exceeding 1 mm, there is a problem that the molding stroke becomes large and the film is likely to be caught in the molded product, which is a molding defect. Furthermore, when granular resin is used as the sealing resin, in addition to the problem that the film is likely to be caught in the molded product, dust is generated, and handling is difficult, there is a problem that it is difficult to supply (spread) the sealing resin evenly to the entire area in the cavity provided in the lower mold, and winding unevenness is likely to occur. In addition, there is a problem that the air contained in the gaps between the particles when the sealing resin is spread is not released and remains in the molded product, which is a molding defect. In particular, in the case of a workpiece in which electronic components are mounted by wire connections, there is a risk of wire flow (deformation or breakage of the wire) due to the flow of resin within the cavity during resin sealing. [Means for solving the problem]

[0007] The present invention has been made in consideration of the above circumstances, and has an object to provide a sealing resin and a method for forming the same that can realize a compression molding apparatus and a compression molding method that can solve the above-mentioned problems in a configuration in which a cavity is provided in a lower mold by adopting a configuration in which a cavity is provided in an upper mold, prevent molding defects caused by resin flow, uneven winding, residual air, and dust generation, and form molded products with large thickness dimensions, which is an easy-to-handle sealing resin, and which can provide a compression molding apparatus and a compression molding method that can solve the above-mentioned problems in a configuration in which a cavity is provided in a lower mold by adopting a configuration in which a cavity is provided in an upper mold, prevent molding defects caused by resin flow, uneven winding, residual air, and dust generation, and form molded products with large thickness dimensions.

[0008] The present invention solves the above problems by the solution means described below as one embodiment.

[0009] The sealing resin according to one embodiment is used for compression molding of a workpiece having a configuration in which electronic components are mounted on a substrate, and is required to be formed in a shape that does not contact the electronic components when placed on the substrate. As an example, the sealing resin has a plate-shaped or block-shaped main body and a leg portion erected on one surface of the main body. Therefore, for example, even for a workpiece having a strip-type wire-connected electronic component (semiconductor chip), it is possible to resin seal it by a compression molding method in which a cavity is provided in the upper mold.

[0010] The legs are erected at a position where they do not come into contact with the electronic component when placed on the base material, and are formed at a height that ensures a distance at which the main body does not come into contact with the electronic component. Specifically, the legs are formed as convex bodies arranged in a dotted pattern, in whole or in part. Alternatively, the legs are formed as convex bodies arranged in a linear pattern, in whole or in part. Alternatively, the legs are formed as convex bodies arranged continuously or intermittently so as to surround the entire outer periphery.

[0011] Also, a linear groove is formed on the other surface of the main body to serve as a dicing position.

[0012] Moreover, a method for forming a sealing resin according to one embodiment is a method for forming a sealing resin used in compression molding of a workpiece having a configuration in which electronic components are mounted on a substrate, and includes a forming step of forming a shape having a plate-like or block-like main body and legs erected on the main body, the forming step including a step of setting the positions and heights of the legs so that neither the legs nor the main body come into contact with the electronic components when the sealing resin is placed on the substrate. Effect of the Invention

[0013] According to the sealing resin of the present invention, by adopting a configuration in which a cavity is provided in the upper mold, it is possible to realize a compression molding device and a compression molding method that can solve the above-mentioned problems in a configuration in which a cavity is provided in the lower mold, prevent molding defects caused by resin flow, uneven winding, residual air, and dust generation, and form a molded product with a large thickness. In addition, handling is easier than granular resin, especially when supplying and setting. [Brief description of the drawings]

[0014] [Figure 1] FIG. 2 is a plan view showing an example of a compression molding device in which a sealing resin according to an embodiment of the present invention is used. [Diagram 2] 2 is a side view showing an example of a press device of the compression molding apparatus of FIG. 1. [Diagram 3] 2 is a front cross-sectional view showing an example of a sealing mold of the compression molding apparatus of FIG. 1. [Figure 4] FIG. 2 is an explanatory diagram of a compression molding method using the compression molding apparatus of FIG. [Diagram 5] Fig. 5A is an enlarged view of a portion V in Fig. 4. Fig. 5B is an explanatory view following Fig. 5A. [Figure 6] FIG. 5B is an explanatory diagram following FIG. 5B. [Figure 7] FIG. 7 is an explanatory diagram following FIG. [Figure 8] FIG. 2 is a perspective view illustrating an example of a sealing resin according to an embodiment of the present invention. [Figure 9]FIG. 11 is a perspective view showing another example of a sealing resin according to an embodiment of the present invention. [Figure 10] FIG. 11 is a perspective view showing another example of a sealing resin according to an embodiment of the present invention. [Figure 11] FIG. 11 is a perspective view showing another example of a sealing resin according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] (Overall composition) Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view (schematic view) showing an example of a compression molding apparatus 1 in which the sealing resin R according to this embodiment is used. For convenience of explanation, arrows in the figure indicate the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction) in the compression molding apparatus 1. In addition, in all the drawings for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0016] The compression molding apparatus 1 is an apparatus that performs resin sealing (compression molding) of a workpiece (molded article) W using a sealing die 202 having an upper die 204 and a lower die 206. The lower die 206 is provided with one or more workpiece holding portions 205 that hold the workpiece W. The upper die 204 is provided with one or more cavities 208 depending on the shape and number of the workpieces W. A film F is adsorbed and held within this cavity 208. However, the present invention is not limited to this configuration.

[0017] First, the workpiece W to be molded has a configuration in which electronic components Wb are mounted on a substrate Wa. More specifically, examples of the substrate Wa include plate-shaped members such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer. Examples of the electronic components Wb include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, and a spacer. The shape of the substrate Wa is a rectangular shape (striped shape), a square shape, a circular shape, and the like. The number of electronic components Wb mounted on one substrate Wa is set to one or more (for example, in a matrix shape, etc.).

[0018] Examples of methods for mounting the electronic components Wb on the substrate Wa include wire bonding mounting, flip chip mounting, etc. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, there is also a method in which the electronic components Wb are attached using a thermally peelable adhesive tape or an ultraviolet-curable resin that is cured by exposure to ultraviolet light.

[0019] In this embodiment, the sealing resin R is a thermosetting resin (e.g., an epoxy resin containing a filler, but is not limited to this), and is a solid or semi-solid resin having a predetermined overall shape (details will be described later) that corresponds to the shape of the workpiece W. Usually, one piece constitutes the "whole" amount required for sealing (one application per workpiece W), but it may be configured so that several pieces (e.g., about two or three pieces) are divided to constitute the "whole" amount required for sealing. Also, the above "semi-solid" does not mean a completely solid state, but a state in which it has melted to the so-called B stage.

[0020] As examples of film F, film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride, are preferably used.

[0021] Next, an overview of the compression molding apparatus 1 using the sealing resin R according to this embodiment will be described. As shown in FIG. 1, the compression molding apparatus 1 mainly comprises a supply unit 100A for supplying the workpiece W, a press unit 100B for sealing the workpiece W with resin and processing it into a molded product Wp, and a storage unit 100C for storing the molded product Wp. As an example, the supply unit 100A, the press unit 100B, and the storage unit 100C are arranged in this order along the X direction in FIG. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units (particularly the number of press units), the arrangement order of the units, and the like can be changed. In addition, a configuration including units other than those described above (all not shown) is also possible.

[0022] The compression molding apparatus 1 also includes a resin supplying section 120 that supplies the sealing resin R. As an example, the resin supplying section 120 is disposed in the supplying unit 100A, but may be configured to be disposed in the storage unit 100C or the press unit 100B (not shown). Alternatively, as another example, the resin supplying section 120 may be disposed outside the compression molding apparatus 1 and transported into the apparatus using a transporting device such as a belt conveyor or a robot hand (not shown).

[0023] Furthermore, in the compression molding apparatus 1, a guide rail 300 is provided linearly across each unit, and a transport device (first loader) 302 for transporting the workpiece W and the sealing resin R, and a transport device (second loader) 304 for transporting the molded product Wp are provided so as to be movable between predetermined units along the guide rail 300. However, the configuration is not limited to the above, and a configuration including a common (single) transport device (loader) for transporting the workpiece W, the sealing resin R, and the molded product Wp (not shown) may also be used. Furthermore, the transport device may be configured to include a robot hand or the like instead of a loader.

[0024] Furthermore, in the compression molding apparatus 1, a control unit 150 that controls the operation of each mechanism in each unit is disposed in the supply unit 100A (it may be disposed in another unit).

[0025] (Supply unit) Next, the supply unit 100A included in the compression molding apparatus 1 will be described in detail.

[0026] The supply unit 100A includes a supply magazine 102 that stores a plurality of workpieces W. Here, as the supply magazine 102, a known stack magazine, slit magazine, or the like is used.

[0027] The supply unit 100A may be configured to include a work stage or the like (not shown) on which the work W taken out from the supply magazine 102 is placed. The supply unit 100A may also be configured to include a resin stage or the like (not shown) on which the sealing resin R supplied from the resin supply section 120 is placed.

[0028] The workpiece W and the sealing resin R are held by the first loader 302 and transported to the press unit 100B, and are set at a predetermined position in the sealing mold 202. In this embodiment, the workpiece W is held by the workpiece holding portion 205 of the lower mold 206, and the sealing resin R is placed on the workpiece W held by the workpiece holding portion 205 (details of the process will be described later). Note that a known holding mechanism (e.g., a clamping configuration with holding claws, a suction hole communicating with a suction device and a suction configuration, etc.) is used as a holding mechanism for the workpiece W and the sealing resin R in the first loader 302 (not shown).

[0029] As a modified example of the above-described conveying device, instead of the first loader 302 moving in the X and Y directions, a conveying device (loader) that moves in the X direction to convey between units and a conveying device (loader) that moves in the Y direction to carry in and set into the sealing mold 202 may be separately provided (not shown).

[0030] The supply unit 100A also includes a preheater (not shown) for preheating the workpiece W and the sealing resin R. As an example, a known heating mechanism (e.g., an electric wire heater, an infrared heater, etc.) is used for the preheater. This allows the workpiece W and the sealing resin R to be preheated before being carried into the sealing mold 202. Note that a configuration without a preheater is also possible. Also, instead of or in addition to the preheater, a configuration in which a heater for preheating (not shown) is provided in the first loader 302 may be used.

[0031] (Press unit) Next, a detailed description will be given of the press unit 100B provided in the compression molding apparatus 1. Here, a side view (schematic view) of a press device 250 provided in the press unit 100B is shown in Fig. 2, and a front cross-sectional view (schematic view) of the sealing die 202 is shown in Fig. 3.

[0032] The press unit 100B includes a sealing die 202 having a pair of dies (for example, a combination of a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel) that can be opened and closed. The press unit 100B also includes a press device 250 that opens and closes the sealing die 202 to resin seal the workpiece W. As an example, the press unit 100B is configured to include one press device 250, but may include a plurality of press devices (not shown).

[0033] Here, as shown in FIG. 2, the press machine 250 is configured to include a pair of platens 254, 256, a plurality of tie bars 252 on which the pair of platens 254, 256 are supported, and a drive device for moving (raising and lowering) the platen 256. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262 (however, the present invention is not limited to this). In this embodiment, the platen 254 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 252), and the platen 256 on the lower side is set as a movable platen (a platen slidably held by the tie bars 252 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0034] 3, the sealing mold 202 includes one mold (upper mold 204) on the upper side in the vertical direction and the other mold (lower mold 206) on the lower side as a pair of molds disposed between the pair of platens 254, 256 in the press device 250. That is, the upper mold 204 is assembled to the upper platen (in this embodiment, the fixed platen 254), and the lower mold 206 is assembled to the lower platen (in this embodiment, the movable platen 256). The upper mold 204 and the lower mold 206 approach and move away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction).

[0035] In the present embodiment, as an example, a film supply mechanism (not shown) is provided that transports (supplies) a roll-shaped film F to the inside of the sealing die 202. Depending on the configuration of the workpiece W, the film F may be in a strip shape instead of a roll shape.

[0036] Next, the upper mold 204 of the sealing mold 202 will be described in detail. As shown in Fig. 3, the upper mold 204 includes an upper mold chase 210, a cavity piece 226 held thereby, a clamper 228, etc. The upper mold chase 210 is fixed to the lower surface of a support plate 214 via a support pillar 212. A cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the lower mold 206 side).

[0037] The clamper 228 is configured in an annular shape so as to surround the cavity piece 226, and is assembled to be movable up and down while being spaced (floating) from the lower surface of the support plate 214 via a push pin 222 and a clamper spring (a biasing member exemplified by a coil spring, for example) 224 (however, the assembly structure is not limited to this). The cavity piece 226 constitutes the inner part (bottom part) of the cavity 208, and the clamper 228 constitutes the side part of the cavity 208. The shape and number of cavities 208 provided in one upper mold 204 are appropriately set according to the shape and number of workpieces W (one or multiple).

[0038] In addition, suction paths (holes, grooves, etc.) communicating with a suction device are provided (not shown) at the boundaries between the clamper 228 and the cavity piece 226. This allows the film F supplied from the film supply mechanism to be adsorbed and held on the mold surface 204a including the inner surface of the cavity 208. In addition, the cavity 208 can be degassed when the mold is closed and resin sealing is performed.

[0039] In this embodiment, an upper die heating mechanism (not shown) is provided to heat the upper die 204 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 150. As an example, the heater is built into the upper die chase 210 and configured to apply heat to the entire upper die 204 and the sealing resin R contained in the cavity 208. The heater heats the upper die 204 to a predetermined temperature (e.g., 100°C to 300°C).

[0040] Next, a detailed description will be given of the lower mold 206 of the sealing mold 202. As shown in Fig. 3, the lower mold 206 includes a lower mold chase 240, a lower plate 242 held thereby, and the like.

[0041] In this embodiment, a workpiece holding section 205 is provided to hold the workpiece W at a predetermined position on the upper surface of the lower plate 242. As an example, the workpiece holding section 205 has a workpiece guide pin (not shown) and a suction passage (hole, groove, etc.) that is arranged penetrating the lower plate 242 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the die surface 206a of the lower die 206, and the other end is connected to a suction device arranged outside the lower die 206. This makes it possible to suck the workpiece W from the suction passage by driving the suction device, and to hold the workpiece W by suction on the die surface 206a (here, the upper surface of the lower plate 242). Instead of the above-mentioned suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of the workpiece holding sections 205 provided on one lower die 206 are appropriately set according to the shape and number of the workpieces W (one or multiple).

[0042] In this embodiment, a lower die heating mechanism (not shown) is provided to heat the lower die 206 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 150. As an example, the heater is built into the lower die chase 240 and is configured to apply heat to the entire lower die 206 and the workpiece W held by the workpiece holding unit 205. The heater heats the lower die 206 to a predetermined temperature (e.g., 100°C to 300°C).

[0043] (Storage unit) Next, the storage unit 100C included in the compression molding apparatus 1 will be described in detail.

[0044] The molded product Wp is held by the second loader 304, removed from the sealing mold 202, and transported to the storage unit 100C. Note that the second loader 304 uses a known holding mechanism for the molded product Wp (for example, a clamping mechanism with holding claws, a suction hole communicating with a suction device for suction, etc.) (not shown).

[0045] As a modified example of the above-described conveying device, instead of the second loader 304 moving in the X and Y directions, a conveying device (loader) that moves in the X direction to convey between units and a conveying device (loader) that moves in the Y direction to unload from the sealing mold 202 may be separately provided (not shown).

[0046] The storage unit 100C includes a storage magazine 104 for storing a plurality of molded products Wp. The storage magazine 104 may be a known stack magazine, slit magazine, or the like.

[0047] The storage unit 100C may be configured to include a molded product stage (not shown) on which the molded product Wp transferred from the press unit 100B is placed.

[0048] (Resin sealing operation) Next, a description will be given of an operation (i.e., a compression molding method) for performing resin sealing (compression molding) using the above-mentioned compression molding apparatus 1. Here, Figs. 4 to 7 are explanatory views of each step and are illustrated as front sectional views in the same direction as Fig. 3.

[0049] First, as a preparation step, a heating step (upper die heating step) is performed in which the upper die 204 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the upper die heating mechanism (upper die heating step). Also, a heating step (lower die heating step) is performed in which the lower die 206 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the lower die heating mechanism (lower die heating step). Also, a film setting step is performed in which a film supply mechanism is operated to set a new film F in the sealing die 202.

[0050] Before, after, or in parallel with the above preparation process, a resin preparation process is carried out to prepare a solid or semi-solid resin having a predetermined shape (described below) whose overall shape corresponds to the shape of the workpiece W as the sealing resin R to be used for sealing.

[0051] Next, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 205 of the lower die 206. Specifically, the workpiece W supplied from the supply magazine 102 is held by the first loader 302 and carried into the sealing die 202, where it is held by the workpiece holding portion 205.

[0052] After the workpiece holding step, a resin placing step is performed in which the sealing resin R prepared in the resin preparation step is placed on the workpiece W held by the workpiece holding part 205 (see FIG. 4). Specifically, the sealing resin R supplied from the resin supply part 120 is held by the first loader 302 and carried into the sealing mold 202, and placed on the workpiece W held by the workpiece holding part 205.

[0053] Alternatively, as another example of the resin placing step, the sealing resin R prepared in the resin preparing step may be placed on the workpiece W before the above-mentioned workpiece holding step. In that case, the workpiece holding step is a step of holding the workpiece W with the sealing resin R placed thereon in the workpiece holding part 205. That is, the first loader 302 holds the workpiece W with the sealing resin R placed thereon, carries it into the sealing die 202, and holds it in the workpiece holding part 205. This has the advantage of performing the workpiece W and the sealing resin R in the sealing die 202 at once, rather than separately.

[0054] Next, a process is performed in which the workpiece W is sealed with sealing resin R and processed into a molded product Wp. First, the sealing mold 202 is closed, and the cavity piece 226 is lowered relatively within the cavity 208 to perform a mold closing process in which the sealing resin R is heated and pressurized against the workpiece W. This causes the sealing resin R to thermally harden, completing the resin sealing (compression molding) (see FIG. 6).

[0055] As described above, for example, in a conventional compression molding apparatus in which a cavity is provided in the upper die for a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, there is a problem that resin sealing is difficult because the wire portion of the workpiece held by the lower die comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied onto the workpiece during the mold closing process and is deformed. Therefore, a compression molding apparatus in which a cavity is provided in the lower die has generally been adopted for such a workpiece W. However, there are also problems (mentioned above) due to the configuration in which a cavity is provided in the lower die.

[0056] In response to the above-mentioned problems, the compression molding apparatus 1 is capable of solving the problems by adopting a configuration in which a cavity 208 is provided in the upper mold 204, and by adopting a configuration in which a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W is used as the sealing resin R.

[0057] The "predetermined shape" of the sealing resin R is a shape that does not come into contact with the electronic component Wb (including the wire in the case of the electronic component Wb having a wire) when placed on the base material Wa of the work W. As an example, as shown in FIG. 4, a plate-shaped or block-shaped main body Ra and legs Rb standing upright on one side of the main body Ra (the side facing the electronic component Wb of the work W) are provided (however, the shape is not limited to this). The main body Ra is a size that fits into the cavity 208 in a plan view, and considering the resin flow, it is preferable that the size is slightly smaller than the shape of the cavity 208 (particularly the cavity piece 226). In addition, the legs Rb need to have a height H (see FIG. 5A) that does not come into contact with the electronic component Wb, but this does not exclude contact to the extent that the wire does not undergo plastic deformation. The legs Rb are arranged at a position where they do not contact the electronic components Wb in a plan view of the main body Ra, and where the main body Wa does not tilt when placed on the workpiece W. Furthermore, it is preferable that the legs Rb are arranged between the electronic components Wa or at the outer periphery of the electronic components Wa so as not to damage the wiring (particularly the wires) of the workpiece Wa even slightly during molding. The total amount of resin of the plate-shaped or block-shaped main body Ra and the legs Rb may be just the right amount or may be a large amount of resin as long as it is sufficient for one compression molding. Details of specific configuration examples of the sealing resin R (FIGS. 8 to 11) will be described later.

[0058] According to the above configuration, during the mold closing process, the sealing resin R is softened and melted by heating, as shown in FIG. 5A to FIG. 5B (FIG. 5A and FIG. 5B are enlarged views of the V part in FIG. 4). At this time, the resin (specifically, the main body part Ra) is in uniform contact with all the wires (see FIG. 5B). As a result, the effect of suppressing wire sweep is obtained.

[0059] In fact, the inventors of the present application conducted experiments using the sealing resin R of this embodiment in the above-mentioned compression molding apparatus 1, and confirmed that wire flow was suppressed and molding quality was improved compared to the case of a conventional compression molding apparatus in which a workpiece is held in the upper mold, a cavity is provided in the lower mold, and sealing resin (specifically, granular resin) is supplied to the cavity.

[0060] Furthermore, by using a solid or semi-solid resin as the sealing resin R, it is possible to solve the problems of uneven winding, residual air, dust, and handling difficulties that were previously caused by granular resins. Also, even when forming a thick molded product with a thickness exceeding 1 mm, it is possible to prevent the film F from getting caught in the molded product Wp.

[0061] The steps following the mold closing step are the same as those in the conventional compression molding method. In summary, the mold opening step is performed by opening the sealing mold 202 and separating the molded product Wp from the used film F (see FIG. 7). Next, the molded product carrying-out step is performed by carrying out the molded product Wp from the sealing mold 202 by the second loader 304 and carrying it out to the storage unit 100C. Furthermore, after or in parallel with the molded product carrying-out step, the film supply mechanism is operated to send out the used film F from the sealing mold 202 and to feed a new film F into the sealing mold 202, thereby performing a film setting step.

[0062] The above are the main steps of the compression molding method performed using the compression molding apparatus 1. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

[0063] Next, specific configuration examples of the sealing resin R used in the compression molding method by the above-mentioned compression molding apparatus 1 are shown in Figs. 8 to 11, and the features of each will be described.

[0064] First, as a configuration common to each example shown in FIGS. 8 to 11, the main body Ra is formed in a plate shape (note that it may also be in a shape other than plate shape, such as a block shape having concave portions, convex portions, etc.). Further, the leg portion Rb is erected on the main body Ra so that when the encapsulating resin R is placed at a predetermined position (set position in design) on the base material Wa of the work W, it does not contact the electronic component Wb of the work W, and is formed to a height H (see FIG. 5A) that can ensure a distance at which the main body Ra does not contact the electronic component Wb.

[0065] In the example of the encapsulating resin R shown in FIG. 8, the leg portion Rb is formed as a convex body Rb1 that is arranged in a dot shape (or may be partially). As an example of the convex body Rb1, it is arranged at a plurality of positions and is formed in a shape such that the ratio t of the length L1 to the width W1 in a plan view is, for example, 0.5 ≦ t ≦ 2. According to this, the flow of the encapsulating resin R placed on the work W during compression molding can be suppressed by the configuration in which the leg portion Rb is columnar and arranged in a dot shape. Therefore, wire flow and the like can be suppressed, and the molding quality can be improved.

[0066] In the example of the encapsulating resin R shown in FIG. 9, the leg portion Rb is formed as a convex body Rb2 that is arranged in a linear shape (or may be partially). As an example of the convex body Rb2, it is arranged at one position (or may be at a plurality of positions) and is formed in a shape such that the ratio t of the length L2 to the width W2 in a plan view is, for example, t < 0.5 or 2 < t. According to this, resin flow can be intentionally generated from the leg portion Rb (in this case, the convex body Rb2) having a dike-like configuration of a predetermined length, and the filling of the encapsulating resin R into a narrow portion (for example, between the base material Wa and the electronic component Wb) in the work W can be promoted. Therefore, the remaining of air in the molded product Wp can be prevented, and the molding quality can be improved.

[0067] In the example of the sealing resin R shown in FIG. 10, the leg portion Rb is formed as a convex body Rb3 that is arranged so as to surround the entire periphery (referring to the outer edge region) of the main body portion Ra intermittently (or may be continuously). As an example of the convex body Rb3, convex bodies having the same configuration as the above Rb2 are formed in a continuous manner so as to form a periphery with gaps L3 at predetermined intervals. Generally, the outer peripheral position of the sealing resin R in the molded product Wp is a position that is cut by a dicer or the like when it is divided into individual pieces, and since there is no electronic component Wb, a larger amount of resin is required for sealing compared to the central position. Therefore, by providing the leg portion Rb (in this case, the convex body Rb3) that is arranged so as to surround the entire periphery as in this configuration, it is possible to supply a large amount of resin to the outer peripheral position while suppressing the resin flow during compression molding. Furthermore, by providing the gap L3, the discharge of air from the inside (center) to the outside is promoted.

[0068] On the other hand, the example of the sealing resin R shown in FIG. 11 is a configuration example for the other surface of the main body portion Ra (the surface on which the leg portion Rb is not provided, i.e., the surface on the side that does not face the electronic component Wb of the workpiece W). Specifically, the other surface of the main body portion Ra has linear groove portions Rg formed at the position where dicing for individualization is performed. This can reduce wear on the dicing blade and reduce dust generated during dicing. Note that, as an example of the groove portions Rg, they are provided in a lattice pattern in line with the dicing position, but are not limited to this.

[0069] 8 to 11 (i.e., the "method of forming sealing resin R" according to this embodiment) includes the following common steps. Specifically, the method includes a forming step of forming a shape having a plate-like or block-like main body portion Ra and legs Rb erected on the main body portion Ra, and in the forming step, the sealing resin R is formed by setting the position and height of the legs Rb so that neither the legs Rb nor the main body portion Ra come into contact with the electronic component Wb of the work W when the sealing resin R is placed in a predetermined position (a position set in design) on the base material Wa of the work W.

[0070] As described above, by using the sealing resin R according to this embodiment, it is possible to realize a compression molding device and a compression molding method that solve the above-mentioned problems in a configuration in which a cavity is provided in a lower mold by adopting a configuration in which a cavity is provided in an upper mold, prevent molding defects caused by resin flow, uneven winding, residual air, and dust generation, and form a molded product with a large thickness. In addition, handling is easier than granular resin, especially when supplying and setting.

[0071] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. [Explanation of symbols]

[0072] 1. Compression molding equipment R Sealing resin Ra Main unit Rb leg Rg groove Double work Wa base material Wb electronic components

Claims

1. A sealing resin used in compression molding of a workpiece, A plate-shaped or block-shaped main body; and a leg portion provided upright on one surface of the main body portion. The sealing resin is characterized by:

2. A sealing resin used in compression molding of a workpiece having a configuration in which an electronic component is mounted on a substrate, The electronic component is formed in such a shape that the electronic component does not come into contact with the electronic component when the electronic component is placed on the base material. The sealing resin is characterized by:

3. A plate-shaped or block-shaped main body; a leg portion provided on one surface of the main body portion and brought into contact with the base material; The leg portion is provided at a position where it does not come into contact with the electronic component when the base material is placed on the base material, and is formed at a height that ensures a distance where the main body portion does not come into contact with the electronic component. The sealing resin according to claim 2 .

4. The leg portion is formed as a convex body arranged in a dot shape in whole or in part. The sealing resin according to claim 1 or 3,

5. The leg portion is formed as a convex body that is entirely or partially arranged in a line. The sealing resin according to claim 1 or 3,

6. The leg portion is formed as a convex body that is disposed so as to surround the entire outer periphery continuously or intermittently. The sealing resin according to claim 1 or 3,

7. A linear groove is formed on the other surface of the main body to serve as a dicing position. The sealing resin according to claim 1 or 3,

8. A method for forming a sealing resin used in compression molding of a workpiece having a configuration in which an electronic component is mounted on a substrate, comprising the steps of: The method includes a forming step of forming a shape having a plate-like or block-like main body portion and a leg portion erected on the main body portion, The forming step includes a step of setting and forming the positions and heights of the legs so that neither the legs nor the main body contacts the electronic component when the sealing resin is placed on the base material. A method for forming a sealing resin comprising the steps of:

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