Heat exchanger plate and method for producing heat exchanger plate

Abstract

To provide a heat exchanger plate enabling low-cost bonding assurance and a method for producing the same.SOLUTION: A cooling plate for a vehicle battery of a motor vehicle is provided, comprising: a plate body 2 comprising two plate elements 3, 4; and a connecting pipe 6 for a cooling fluid. The connecting pipe 6 has a connection section which is joined in a receiving section 8 of the plate body 2 formed between the plate elements 3, 4. The connection section has two arcuate wall sections 16, 17 in cross section and two opposing, outwardly directed longitudinal webs 9. The receiving section 8 has longitudinal grooves 10 extending between the plate elements 3, 4 in the area of the joining plane FE. The longitudinal webs 9 extend in the longitudinal grooves 10. A solder material 20 is melted into between the plate elements 3, 4 and between the connection section and the receiving section 8, and they are joined by soldering.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a heat transfer plate and a method for manufacturing the heat transfer plate.

Background Art

[0002] Heat transfer plates are used for different applications. The type of heat transfer plate in question here is, in particular, a cooling plate for cooling an automobile battery.

[0003] Increasing requirements for electric vehicles with respect to driving range, driving performance and charging time mean that the thermal load on the battery increases due to overheating or aging. To reduce these harmful effects, the operating temperature of the battery is limited by a temperature control element through which a medium flows. The temperature control element is a heat transfer plate in the form of a cooling plate arranged above, beside and / or below the battery module.

[0004] Conventional types of heat transfer plates usually consist of joined aluminum sheets or extruded aluminum profiles that allow the heat transfer plate to be traversed by a temperature control medium or a cooling fluid via connecting pipes. Generally, the connecting pipes are manufactured by forming or machining and are joined to the plate body of the cooling plate. The connecting pipes are considered to enable rapid assembly of the cooling fluid lines.

[0005] According to EP 2372761, a cooling plate having a plate body composed of two plate elements is part of the prior art. In the case of this cooling plate, however, the fluid connection member or connecting pipe for the cooling fluid is arranged on the flat surface of the plate element parallel to the surface of the plate element.

[0006] In the case of the cooling plate known from EP 2607832 A1, the supply and discharge of the cooling fluid are effected via a connecting member that can be inserted into the receiving portion of the plate element by means of a connecting portion.

[0007] In the case of the battery cooling plate described in European Patent Application Publication No. 3741876, the plate body is composed of two plate elements, is provided with a connecting pipe for the cooling fluid, and the connecting pipe is oriented parallel to the plane of the plate element and is joined to the connecting portion within the accommodating portion of the plate body.

[0008] German Patent No. 102010051106 discloses a cooling plate having at least one cooling channel for guiding a coolant, the cooling channel having at least one inlet and at least one outlet. The cooling plate includes plate elements that abut against each other on at least two surfaces, and bulges that form the cooling channels with each other are formed within these plate elements. The inlet and the outlet each include a connecting pipe for connecting the cooling channel to a coolant connection unit.

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0010] Based on the prior art, the problem underlying the present invention is to provide a heat transfer plate that is improved functionally and in manufacturing technology, is easy to assemble the connecting pipe to the plate body of the heat transfer plate, has process reliability, and shows a method for manufacturing a heat transfer plate that ensures inexpensive joining.

Means for Solving the Problems

[0011] The solution to the object part lies in the heat transfer plate according to the features of claim 1.

[0012] The method part of the object is solved by the method according to claim 11.

[0013] Advantageous formations and developments of the invention are the subject of the dependent claims.

[0014] The heat transfer plate comprises a plate body composed of two plate elements and connecting pipes for the supply and discharge of the cooling fluid. The plate elements are, in particular, channel plates and base plates which are integrated into a plate stack and joined to each other to form the plate body. The connecting pipes are joined to the plate body. At least one connecting pipe has a connecting portion which is joined within a receiving portion of the plate body formed between the plate elements. The orientation of the connecting portion of the connecting pipe is parallel to the plane of the plate element. On the outside of the plate body, the connecting pipe can comprise arches and / or curved portions. The portion of the connecting pipe extending outside the plate body is configured as a connecting portion for connecting a connecting line for the cooling fluid.

[0015] The plate elements are made of light metal or a light metal alloy, in particular an aluminum alloy.

[0016] At least one plate element of the plate body of the cooling plate has a channel structure for guiding the cooling fluid.

[0017] According to the invention, the connecting portion has two outwardly directed longitudinal webs, the receiving portion has a longitudinal groove extending within the region of the joint plane between the plate elements, and the longitudinal webs extend within the longitudinal groove.

[0018] The plate elements are in a state in which the connecting portion of the connecting pipe is incorporated into the receiving portion of the plate body. solderThey are joined by attachment. The longitudinal webs and longitudinal grooves complement each other. The contour or configuration of the longitudinal webs and longitudinal grooves ensures the technically necessary joining gap. The joining surface is optimized. The joining gap, especially the width of the joining gap, is equalized without a sudden change in thickness over the perimeter or path between the connecting part and the receiving part. The gap width is small. A high-strength and tight material joining is achieved by the connecting part of the connecting pipe in the receiving part of the plate body.

[0019] The connecting part comprises two convexly curved wall parts which extend between the longitudinal webs. In particular, the wall parts are curved in an elliptical or elliptical part shape.

[0020] The two curved wall parts extend mirror-symmetrically with respect to the transverse axis, in particular the central longitudinal axis, of the connecting part and each terminate at the end side and transition to the longitudinal web. The wall parts are curved convexly towards the center point or the central longitudinal axis of the connecting part. In the web part, the side surfaces are curved concavely.

[0021] The formation of the connecting part contemplates that the connecting part of the connecting pipe has an elliptical or elliptical outer contour with outward longitudinal webs facing each other on the transverse axis in cross-section.

[0022] It is possible for the connecting part to comprise flat upper and lower wall parts, in particular a central wall part, in cross-section, and for these wall parts to each terminate at the end side and transition to the longitudinal web via the convexly curved wall part.

[0023] The receiving part of the plate body constitutes an insertion or joining area for the connecting part of the connecting pipe.

[0024] The connecting pipe comprises longitudinal webs extending on both sides in the longitudinal direction of the connecting pipe within the connecting part. These longitudinal webs have a cross-section configured as a triangle with a concave web wall and rounded tips. The contour of the longitudinal webs ensures a smooth transition from the elliptical outer contour to the longitudinal webs with a rounded surface without steps or sharp curvatures or corners.

[0025] The longitudinal groove in the receiving part is configured in a funnel shape having a cross section with a groove side wall concave with respect to the center point or central longitudinal axis of the connecting pipe and the receiving part and a wedge-shaped groove bottom. The inner contour within the region of the inner corner of the receiving part formed by the groove side wall is rounded along the groove side wall. The groove bottom at the transition of the receiving part to the plate elements in contact with each other is an acute angle.

[0026] The configurations of the longitudinal web and the longitudinal groove are formed complementarily to each other. The contours of the longitudinal web and the longitudinal groove complement each other such that the longitudinal web entering the longitudinal groove cooperates in the form of a positive engagement and a joining gap is formed between the contours.

[0027] The connecting part comprises two wall parts that extend in a convexly curved manner. These wall parts each extend between the longitudinal webs facing each other and transition to a concave web wall.

[0028] The receiving part comprises inner wall parts that extend in a convexly curved manner, to which the concave groove side walls are connected.

[0029] The descriptions of "convex" and "concave" are each related to the center point or longitudinal axis of the connecting pipe. A convex surface, convex wall or convex wall part is a surface or part that bulges outward from the center point or central longitudinal axis of the connecting pipe.

[0030] A concave surface, concave wall part or concave groove side wall is a surface, part or side surface that bulges inward or extends in a curved manner with respect to the center point or central longitudinal axis of the connecting part.

[0031] The connecting part of the connecting pipe has a cross section that is formed mirror-symmetrically with respect to a horizontal central transverse axis and a vertical central transverse axis, similar to the receiving part.

[0032] The cross-sectional contour of the connection part can be described as lemon-shaped or lemon-like, and the description of the cross-section is related to the longitudinal section passing through the lemon. This means that the connection part is configured elliptically and has a major axis and a minor axis in the cross-section. The major axis and the minor axis are perpendicular to each other and intersect at a central point along the central axis of the connecting pipe. The major axis represents the maximum dimension of the connecting pipe within the connection part, while the minor axis represents the minimum dimension of the connection part in the outward radial direction. With respect to the joining plane of the plate elements of the plate body, the major axis extends within the joining plane and coincides with the horizontal central transverse axis. The minor axis coincides with the vertical central transverse axis.

[0033] The cross-section of the connecting pipe within the connection part is symmetric with respect to the major axis and the minor axis.

[0034] The longitudinal webs face each other on the major axis and are formed outward from the wall of the connecting pipe.

[0035] As described, the longitudinal webs form the cross-section, in particular, into a triangle with rounded concave web walls and rounded tips. The rounded tips constitute the overlap of the lateral webs.

[0036] A joining gap is formed between the connection part of the connecting pipe and the receiving part of the plate body. By the formation up to the vicinity of the tubular contours of the connecting pipe and the receiving part and their mutual adjustment, a technically necessary and advantageous joining gap is ensured. Particularly advantageous is that the joining gap has a small or narrow width within its circumferential path in the cross-section, and this width is uniformly small over most of the circumferential length of the joining gap. Also within the region between the tip of the longitudinal web and the wedge-shaped groove bottom of the longitudinal groove, solder the attachment gap is small.

[0037] Between the connection part and the receiving part, solder material is applied. The upper and lower plate elements, and the plate elements and the connecting pipe are solder joined by attachment. This can be realized technically, in terms of process reliability, and inexpensively. The parts solderBonding by attachment is molding solder performed in an attachment mold, and this molding solder in the attachment mold, plate elements are pressed against each other at the joint surface, the accommodation portion of the plate body composed of both plate elements is finally molded, channels are formed in the plate body, and parts are solder heated to the attachment temperature, solder and joined to each other by attachment.

[0038] In the molding die, a combination of molding and solder attachment is performed. In the attachment solder mold, channels and channel structures are formed in the plate body, the connection portion of the plate body is finally molded, and the joining portions of the upper and lower plate elements, the plate element or the accommodation portion and the connecting pipe are joined to each other solder by attachment. solder During the attachment process, the parts are clamped solder in the attachment mold and pressed against each other.

[0039] Aspects of the present invention utilize the ductile of solder material molding characteristics to seal the connecting pipe within the accommodation portion. The connecting portion of the connecting pipe is preformed at least near the final contour. Here, the connecting portion has a cross-sectional configuration having two longitudinal webs that are outwardly directed on the horizontal axis and a wall portion that extends in an arcuate shape between the longitudinal webs. The molding of the connecting pipe is performed technically using an inner mandrel.

[0040] is applied to the connecting portion of the connecting pipe. solder material within the region between the connecting portion and the accommodation portion solder material can be pre-applied to both molded portions of the plate element and the connecting contour. Advantageous formations and methods solder material are contemplated where solder material is applied in the form of a layer or solder material a sleeve, for example, within the connecting contour or on the connecting portion. As already mentioned, for this purpose, it can be pre-applied to the molded portion of the plate element and the connecting contour in an appropriate amount. solder material is, for example, of low melting point solder material, particularly made of aluminum-based solder material consisting of solder strips or solder applied to the connection part in the form of a sleeve.

[0041] The plate element is transferred to a heatable forming solder attachment mold equipped with an upper mold and a lower mold. For this reason, outside the forming solder attachment mold, a plate laminate composed of both plate elements can be formed, and the connecting pipe can be positioned within the cell family contour between the forming parts of the plate elements at its connection part. Then, this plate laminate is transferred into the forming solder attachment mold.

[0042] The plate laminate with the connecting pipe incorporated can also be formed within the forming solder attachment mold. For this reason, the plate element is positioned within the forming solder attachment mold with the connecting pipe incorporated. Within the forming solder attachment mold, the connection part is positioned between the forming part of the plate element and the connection contour provided therein. The forming part can be formed on the board part of the plate element protruding from the base body of the plate element.

[0043] During the closing of the forming solder attachment mold, the plate laminate composed of both plate elements is clamped within the forming solder attachment mold together with the connection part of the incorporated connecting pipe. Here, the connection contour is finally formed within the forming part of the plate element around the connection part of the connecting pipe. The forming part of the plate element is finally formed and constitutes a receiving part. The outer contour of the connection part sets the inner contour of the receiving part. The formed forming parts complement each other to form the receiving part. The receiving part has an inner wall part that extends convexly and curvedly. In the region of the joining plane between the plate elements, a longitudinal groove extending in the longitudinal direction of the receiving part is formed. The longitudinal groove is configured with a funnel-shaped cross-section and has a concave groove side wall and a wedge-shaped groove bottom. The groove side wall connects to the inner wall part of the receiving part that extends curvedly.

[0044] Forming process and forming solder When forming the contour of the receiving part in the attachment mold, applied around the connecting pipe solder material is compressed radially and ductile solder material is pressed so as to flow into the joining gap that occurs between the connecting part and the receiving part.

[0045] Forming solder The intermediate space between the plate elements of the plate laminate in the attachment mold is subjected to the action of internal pressure. This is done by introducing the working medium through the connecting pipe. By forming with internal pressure, at least one channel is formed in at least one of the plate elements.

[0046] Plate element or forming solder For the plate laminate clamped in the attachment mold solder material is melted between the plate elements and between the connecting part and the receiving part to join the parts materially.

[0047] An advantageous formation contemplates that the connecting pipe is provided with a stopper. In particular, the stopper is formed in the form of an annular bead. The stopper or the annular bead abuts against the connecting pipe at the end face. The stopper abutting against the connecting pipe at the end face determines the position of the connecting pipe in the axial introduction direction relative to the plate body. Further, at the opening of the connecting pipe, axial sealing is performed by the stopper or the annular bead.

[0048] Another advantageous embodiment of the heat transfer plate according to the present invention is solder When forming the attachment joint solder Flow restricting solder It is contemplated that stop means are provided. solder The stop means is disposed between the connecting pipe and the receiving part, and in particular solder The stop means is disposed between the connecting part of the connecting pipe and the receiving part.

[0049] One embodiment contemplates that the stop means is disposed on the opening side of the receiving part. solder The opening side meanssolder The stop means means that it is applied inside the accommodation part within the area of the opening of the accommodation part or outside on the end face around the opening of the accommodation part.

[0050] A particularly advantageous formation in practice contemplates solder that the stop means is formed by a cross-sectional change at the connection part of the connecting pipe and the accommodation part. solder The stop means is formed by a cross-sectional change in the joint area between the accommodation part formed in the forming part of the plate element and the connecting pipe. Both the connection part and the accommodation part comprise two length parts with different cross-sections. The length part of the connection part and the length part of the accommodation part transition into each other via a tapered part.

[0051] The cross-sectional changes at the connection part and the accommodation part complement each other, resulting in a reduction in the cross-section of the annular space between the connection part and the accommodation part. solder during the attachment process, the melted solder material is retained at the cross-sectional change part between the connection part and the accommodation part. Thereby, solder during the formation of the attachment joint solder the flow is restricted.

[0052] An optional or alternative embodiment contemplates solder that the stop means is composed of a sealing metal. The sealing metal softens and becomes viscous under the action of temperature in the forming solder attachment mold. As a result, under the pressure in the forming solder attachment mold, a homogeneous sealant with fluidity is obtained that prevents the melted solder attachment material from flowing into undesirable or technically disadvantageous areas. The sealing metal has a melting temperature higher than that of the solder used in the attachment process solder material .

[0053] solder The stop means solder is equipped and set to restrict the flow solder during the formation of the attachment joint. Also, solderThe stop means is equipped, set, and positioned to prevent the blowing out of solder material that is still molten during the internal pressure reforming of the plate element for forming the channel.

[0054] solder The stop means can also be composed of solder material . As a result, two solder material with different material properties are applied. The first type of solder material is applied to or around the connection part of the connecting pipe. solder material The second type of solder material has a melting temperature higher than that of the first type of solder material and constitutes the stop means. The second type of solder melts later when heating the connecting pipe and the accommodating part in the hot forming die, and is harder than the first type of solder material under the temperature action of the hot forming die, thereby having a high viscosity or being highly viscous. In this way, the second type of solder material constitutes the stop means for the first type of solder material . solder material solder

[0055] solder The stop means can be realized differently, for example, in the form of a mechanical solder stop barrier, especially solder in the form of a stop ring. The outer annular bead that abuts against the accommodating part at the end face can also be closed to seal the opening solder material .

[0056] Two different solder stop means or two different types of solder stop means can also be used in combination. In this way, solder the stop means can be provided in the form of a cross-sectional change at the connection part of the connecting pipe and a cross-sectional change at the accommodating part formed complementarily thereto. Furthermore, solder the stop means is a mechanical solder stop barrier, especially solderA separate ring body made of a stop material, or integrally formed of the same material on a connecting pipe solder can be provided in the form of a stop ring.

[0057] The connecting pipe has a connecting portion, and through this connecting portion, joining is performed within the accommodating portion of the plate body. On the inlet side, the connecting pipe has a connecting portion. The connecting portion is used to connect the cooling fluid line. Within the connecting portion, the connecting pipe has a circular cross-section. From the circular cross-section of the connecting portion, the connecting pipe transitions to the connecting portion through a transition portion.

[0058] An embodiment for further improving the practical formation contemplates that the connecting pipe has a connecting portion with an abutment. The abutment functions to connect the connecting line for the cooling fluid. The abutment body is preferably formed in the form of an annular bead within the rear connecting portion. The annular bead is an integral component of the same material as the connecting portion.

[0059] Upstream and / or downstream of the connecting portion, a pipe portion having a cross-section different from that of the connecting portion, for example, a circular or elliptical cross-section without a longitudinal web, can be provided.

[0060] An embodiment advantageous in practice contemplates that the connecting portion of the connecting pipe has two length portions, and both length portions have cross-sections different from each other. The first or front length portion of the connecting portion has a larger cross-sectional area than the second or rear length portion. The front or first length portion has a cross-sectional configuration with a horizontal longitudinal web. The first length portion and the second length portion are connected to each other through a transition portion or a coupling portion.

[0061] Complementary to the formation of the length portion of the connection portion, a receiving portion is formed. The receiving portion also includes a length portion on the side of the front plate body. This length portion has a cross-sectional configuration different from that of the second rear length portion of the main portion connected via the transition portion. The cross-sectional area of the first length portion in the front of the receiving portion is larger than the cross-sectional area of the second length portion in the rear of the receiving portion.

[0062] The present invention provides an advantageous, rapid, easily assembled and highly process-reliable joint between one or more connecting pipes and a plate body of a heat transfer plate, particularly a cooling plate. High process stability is guaranteed. The joint is efficient and has the airtightness required for the components.

[0063] The connection portion of the connecting pipe is oriented parallel to the plate element within the joining plane of the plate element. This contributes to reducing the flow resistance by means of parallel cooling fluid inlets or cooling fluid outlets. By adjusting the position of the connecting pipe parallel to the surface plane of the plate element and the plate body, a laminar flow of the cooling fluid without sudden deflection, vortices or turbulence is generated.

[0064] Furthermore, it is advantageous that the formation of the connecting pipe and the receiving portion according to the present invention realizes a larger bonding area of the connecting pipe to the heat transfer plate. Thereby, an improvement in durability as a whole is achieved and voltage peaks are reduced.

[0065] Finally, the heat transfer plate according to the present invention and its manufacture contribute to reducing the scrap rate, because the downstream joining operation is abolished or at least reduced.

[0066] A method for manufacturing a heat transfer plate having a connecting pipe is · providing a connecting pipe having a connection portion with two outward longitudinal webs; · providing a first plate element and a second plate element, wherein the first plate element and the second plate element have a receiving contour for the connection portion · bottom mold and top a heated forming with a moldsolder transferring a first plate element and a second plate element to a caulking die, wherein a connection portion of a connecting pipe is positioned between molding portions of the plate elements, and a solder material is disposed between the connection portion and the plate element; · molding solder closing the caulking die, bottom the mold and top clamping a plate laminate between the molds, wherein a receiving contour within a molding portion of the plate element is finally formed around the connection portion of the connecting pipe, and a receiving portion having a longitudinal groove extending within a region of a joining plane between the plate elements is configured; · heating the plate laminate; · applying an internal pressure to an intermediate space between plate elements of the plate laminate by introducing a working medium into the intermediate space via the connecting pipe, to form channels in at least one of the plate elements; · between the plate elements and between the connection portion and the receiving portion solder material is melted, solder and joined by caulking; · molding solder opening the caulking die, and removing a cooling plate from the caulking die solder and comprises.

[0067] The method according to the present invention enables the production of high-quality heat transfer plates with optimized connection of connecting pipes in a process-technologically improved and efficient manner.

[0068] The heat transfer plate comprises a plurality of connecting pipes. In particular, the plate body comprises a connecting pipe for supplying a cooling fluid and a connecting pipe for discharging the cooling fluid. Preferably, the fixing of all the connecting pipes of the plate body on or within the plate body between the plate elements is carried out according to the present invention.

[0069] formed solder The caulking die is heatable and is heated to a mold temperature required for caulking to manufacture the heat transfer plate. solder ​

[0070] The plate laminate is composed of at least two plate elements made of a metallic material, in particular a light metal material. Between the plate elements, solder material is applied.

[0071] The connection contour is dish-shaped or channel-shaped and is configured such that a connecting pipe can be positioned or can be positioned between the receiving contours at its connection part.

[0072] Within the scope of the method according to the invention, preferably and effectively, solder material plate elements provided with solder material are used, solder which is applied in the form of a plated solder material layer to at least one of the plate elements. As a result, at least one plate element is

[0073] The plate laminate is composed of both plate elements. When the plate laminate is configured, the connecting pipe is positioned between the plate elements at its connection part. For this purpose, the connection part is arranged between the forming part of the plate element and the connection contour preformed there.

[0074] The plate laminate is inserted into a hot forming die, and the hot forming die is closed. The plate laminate can be configured outside the hot forming die and introduced into the hot forming die. The plate laminate can also be configured for the first time within the hot forming die.

[0075] Forming solder The caulking die comprises a lower die and an upper die. These dies are moved relative to each other during the closing movement of the caulking die, in particular the upper die is lowered onto the lower die. During the closing movement, the plate laminate is received and clamped between the lower die and the upper die. In this case, the plate laminate makes surface contact between the lower die and the upper die and is heated within the caulking die. The caulking die is for the forming process and solder is heated within the caulking die. The caulking die is for the forming process and solder is heated within the caulking die. The caulking die is for the forming process and solder the caulking die is for the forming process and solderIt is heated to a mold temperature at which both joining processes by brazing are carried out. In particular, the mold temperature is 540 °C to 670 °C. Particularly preferably, the mold temperature is, particularly preferably, 550 °C to 640 °C.

[0076] Forming solder When the brazing mold is closed, the forming part of the plate element is finally formed around the connecting part of the connecting pipe, and a receiving part having a longitudinal groove extending in the joining plane between the plate elements is formed. The longitudinal web of the connecting part extends in the longitudinal direction of the connecting pipe. In the longitudinal groove, along the longitudinal sides of the connecting pipe respectively, the longitudinal web of the connecting part extends into the longitudinal groove of the receiving part.

[0077] The intermediate space between the plate elements of the plate stack is subjected to the action of internal pressure. The intermediate space is the region between adjacent plate elements, and it is not necessary that there is a gap between the plate elements in the region of the intermediate space. The action of the internal pressure on the intermediate space is carried out by introducing a working medium, particularly nitrogen, into the intermediate space. Here, the channel is for forming solder It is formed by shaping at least one plate element region into the channel cavity in the contact surface of one or both of the brazing molds by internal pressure. The supply of the working medium is carried out through one of the connecting pipes of the plate stack.

[0078] The working medium for forming a channel or a channel structure in the plate body is introduced through one of the connecting parts or connecting pipes.

[0079] Between the plate elements and between the plate elements and the connecting pipe solder material is for forming solder is melted for the mold temperature of the brazing mold. The plate elements and the plate elements and the connecting pipe in the region of the receiving part solder are joined by brazing.

[0080] Forming solder The brazing mold is for forming solderIt is released after the end of the attaching process, and the lower mold and the upper mold are moved relative to each other and separated. The joined high-temperature plate body or heat transfer plate is formed solder After the release of the attaching mold, this formed solder can be taken out from the attaching mold. Before taking out, the heat transfer plate is formed solder can be held in the attaching mold and cooled. The cooling is preferably solder material performed until it is below the melting temperature of.

[0081] The plate element, especially its joint surface, solder material is provided with. Before the configuration of the plate laminate and the positioning of the connecting pipe, the connecting part of the connecting pipe is of the first type solder material is provided with. Further, the connecting pipe solder can be provided with stop means. solder The stop means can also be, for example, of the first type solder material of a second type having a melting temperature higher than that of solder material and is positioned on the connecting pipe.

[0082] To position the connecting pipe, a stopper in the form of an annular bead can be provided on this connecting pipe. In that case, the connecting pipe, together with the annular bead, is positioned on the end face of the plate laminate composed of plate elements and the forming part provided therein.

[0083] The plate laminate is clamped between a lower mold and an upper mold during the manufacture of the heat transfer plate. During molding and formation by the internal pressure of the channel, the plate laminate is sealed annularly along the adjacent peripheral regions and / or adjacent to the channel cavity. The sealing can be induced or assisted by a pressurizing element provided in the lower mold and / or the upper mold. Such a pressurizing element is optional and can also be provided in the region of the connecting pipe. The pressurizing element can be formed, for example, by a sealing bead by corresponding contour formation within the molding part of the lower mold and / or the upper mold. The sealing element can be provided annularly along the adjacent peripheral regions of the upper mold and / or the lower mold. The sealing element further has a receiving portion with the connecting portion of the connecting pipe disposed therein, which is clamped and sealed, or is arranged to be clamped and sealed during the expansion process and solder the attachment process. The sealing element can also be provided adjacent to the channel cavity. The sealing element ensures a particularly advantageous molding process, especially when the molding process is carried out within the region of the channel cavity and within the connecting contour region of the connecting pipe. In this way, high dimensional accuracy and molding accuracy are ensured.

[0084] The cooling device for a vehicle battery comprises a heat transfer plate according to the invention, which is manufactured according to the method according to the invention. The cooling device includes peripheral components and device components necessary for cooling the vehicle battery, such as a cooling fluid line, a storage and compensation container for the cooling fluid, a supply unit and / or a pump unit and / or a recooler for the cooling fluid.

[0085] The present invention will be described in detail below with reference to the drawings.

Brief Description of the Drawings

[0086]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Mode for Carrying Out the Invention

[0087] With reference to Figs. 1 to 14, the heat transfer plate 1 according to the present invention, its manufacture, and variations of the connection portion of the cooling fluid line to the heat transfer plate 1 are described. In the figures, the same reference numerals are used for the same and functionally equivalent parts or components, even when repeated description is omitted for the sake of simplicity.

[0088] Figs. 1 to 6 are used to explain the first embodiment of the heat transfer plate 1.

[0089] With reference to Figs. 6 to 10, the second embodiment of the cooling plate 1 is described. The cross-sectional view in Fig. 6 is applicable to both embodiments of the cooling plate 1. The same applies to the plate body 2 of the cooling plate 1 and the plate elements 3, 4 constituting the plate body 2.

[0090] Figures 11 to 13 show variations of the connection part of the cooling fluid line.

[0091] Figure 14 is used to explain another embodiment of the heat transfer plate 1 and the configuration of the connection part of the cooling fluid line.

[0092] The heat transfer plate 1 is, in particular, a cooling plate for battery cooling, especially for a vehicle battery of an automobile.

[0093] The heat transfer plate 1 includes a plate body 2 composed of two plate elements 3 and 4. The plate element 3 is a channel plate having a channel structure composed of at least one channel 5 (see FIGS. 1, 5 and 11 in particular). The plate element 4 is a completely or substantially flat base plate (see FIG. 2).

[0094] Both plate elements 3 and 4 are positioned so as to overlap flatly to form a plate laminate. The adjacent surfaces of the plate elements 3 and 4 are completely or partially solder material are provided with. In particular, the solder in the form of a plated solder material layer is pre-applied to one of the plate elements 3 and 4.

[0095] The adjacent surfaces of the plate elements 3 and 4 are joined to each other completely or regionally. A connecting pipe 6 for cooling fluid is connected to the plate body 2. The connecting pipe 6 is used to supply or discharge the cooling fluid. Usually, the connecting pipe 6 is provided to supply the cooling fluid, while the discharge of the cooling fluid is performed through another connecting pipe 6.

[0096] The connecting pipe 6 includes a connecting portion 7 joined within a receiving portion 8 of the plate body 2 formed between the plate elements 3 and 4.

[0097] The connecting portion 7 has an outer contour that is elliptical in cross section.

[0098] The connecting portion 7 of the connecting pipe 6 has, in cross section, a main axis H and a secondary axis N perpendicular thereto. The main axis H coincides with the central transverse axis and represents the maximum dimension of the connecting portion 7. The main axis H extends within the joining plane FE of the plate elements 3, 4. The secondary axis N is the minimum dimension in the radially outward direction of the connecting portion 7.

[0099] The connecting portion 7 has two outward longitudinal webs 9. The longitudinal webs 9 face each other on the main axis H of the connecting pipe 6. The longitudinal webs 9 are integral components of the same material of the connecting portion 7 and are oriented outward from the inside of the connecting pipe 6.

[0100] The connecting portion 7 of the connecting pipe 6 is located within the receiving portion 8 of the plate body 2 and is joined to the receiving body. The receiving portion 8 has a longitudinal groove 10 extending within the region of the joining plane FE between the plate elements 3, 4. The longitudinal webs 9 of the connecting portion 7 extend in the longitudinal direction L of the receiving portion 8 within the longitudinal groove 10.

[0101] The longitudinal web 9 and the longitudinal groove 10 are formed complementarily to each other. This means that the contour of the longitudinal groove 10 and the contour of the longitudinal web 9 complement each other while forming a joining gap 11. The longitudinal web and the longitudinal groove cooperate in a positive manner.

[0102] The longitudinal web 9 has a web wall 12 configured with a triangular cross section, extending in a concave curve and ending with a rounded tip 13 (see particularly FIG. 6).

[0103] The longitudinal groove 10 is configured in a funnel shape in cross section, having a concave groove side wall 14 and a wedge-shaped groove bottom 15. Also in this regard, reference should be made particularly to the figure in FIG. 6.

[0104] The information about the convex and the concave is related to the center point M of the connecting pipe 6 respectively.

[0105] The connecting portion 7 includes an upper wall portion 16 that extends in a convexly curved manner and a lower wall portion 17 that extends in a convexly curved manner. On both sides respectively, vertical webs 9 are connected to the wall portions 16, 17. The wall portions 16, 17 transition to the web walls 12 of the vertical webs 9.

[0106] The accommodating portion 8 includes accommodating wall portions 18, 19 that extend in a convexly curved manner, and these accommodating wall portions transition to the groove side walls 14 respectively.

[0107] The connecting portion 7 is, within the accommodating portion 8, materially joined by solder material 20. For this reason, solder material is disposed around the connecting portion 7 of the connecting pipe 6. FIG. 3 shows solder material the connecting pipe 6 to which 20 is not applied, and FIG. 4 shows solder material the connecting pipe 6 to which 20 is applied. When the plate elements 3, 4 and the connecting portion 7 are joined by solder molding, solder material 20 is melted, the joining gap 11 is wetted and filled over the entire surface with solder material 20, and the components are materially joined.

[0108] The cross-sectional contour of the connecting portion 7 can be described as lemon-shaped, and the cross-sectional information is related to the longitudinal section passing through the lemon.

[0109] The outer contour of the connecting portion 7 and the inner contour of the accommodating portion 8 are formed complementarily to each other while forming the joining gap 11.

[0110] The embodiment of the cooling plate 1 as illustrated by FIGS. 6 to 10 differs in terms of the formation of the connecting pipe 6. In the case of the connecting pipe 6 as recognized in FIGS. 7 to 10, a stopper is provided. The stopper is formed in the form of an annular bead 21. The annular bead 21 is formed from the wall of the connecting pipe 6 by upsetting and bulging processes. For this reason, the connecting pipe 6 is narrowed in a constricted region 22 where the annular bead 21 is folded back outward. In the direction of the opening 23 on the plate body side of the connecting pipe 6, a connecting portion 7 is connected to the tubular bead 21. The connecting portion 7 is configured as described above and is particularly illustrated in FIG. 6.

[0111] The free end portion of the connecting pipe 6 protruding with respect to the plate body 2 is formed as a connecting portion 24 and is used to connect a cooling fluid line that can be fixed to the connecting portion 24.

[0112] In the case of the embodiment of the connecting pipe 6 as recognized in FIG. 11, an abutment body formed in the form of an annular bead 25 is provided on the connecting portion 24. The annular bead 25 is formed from the wall of the connecting portion 24. A cooling fluid line, particularly a cooling fluid hose, can be mounted on the connecting section 24 and the abutment body in the form of the annular bead 25 integrated therewith and fixed by appropriate fixing means, such as a spring clamp.

[0113] The connecting portion 24 of the connecting pipe 6 has a circular cross-section. In the case of the embodiment of the connecting pipe 6 as shown in FIGS. 3 and 4, the circular cross-section of the connecting portion 24 continuously transitions to the connecting portion 7 and its cross-sectional configuration via a transition portion 26.

[0114] For the material joining of the connecting portion 7 within the receiving portion 8, solder a sleeve or solder in the form of a strip solder material 20 is applied to the connecting portion 7. The connecting pipe 6 is positioned within the receiving portion 7 of the plate body 2 with the connecting portion 7 and is joined to the receiving portion by molding solder attachment.

[0115] To manufacture a cooling plate 1 having at least one connecting pipe 6, a connecting pipe 6 is provided, and a connecting portion 7 having two outward longitudinal webs 9 and wall portions 16, 17 that are arched and extend is formed on this connecting pipe. Further, first and second plate elements 3, 4 are provided. Both plate elements 3, 4 are flat. At least one of the plate elements 3, 4 solder material is provided with. Each plate element 3, 4 is provided with a protruding molding portion 27. One receiving contour for the connecting portion 7 of the connecting pipe 6 is formed on each of these molding portions 27. A plate laminate is formed from both plate elements 3, 4, and the connecting portion 7 of the connecting pipe 6 is arranged between the molding portion 27 and the receiving contour provided therein. On the connecting portion 7, solder material 20 is applied.

[0116] The plate elements 3, 4 are transferred to a heated molding solder attaching die. For this reason, outside the molding solder attaching die, a plate laminate composed of both plate elements with the connecting pipe 6 incorporated therebetween can be formed. The plate laminate can also be formed within the molding solder attaching die.

[0117] The plate laminate or the plate elements 3, 4 and the connecting pipe 6 with the connecting portion 7 positioned are inserted into a heated molding solder attaching die. The connecting portion 7 of the connecting pipe 6 is arranged within a receiving contour that complements to form a receiving portion 8 between the plate elements 3, 4. The molding solder attaching die includes a lower die and an upper die. By closing the molding solder attaching die, the plate laminate is clamped and heated between the upper die and the lower die. The plate laminate is in surface contact with the lower die at its lower side and in surface contact with the upper die at its upper side.

[0118] When the molding solder attaching die is closed, the molding portion 27 is finally formed in the region of the receiving contour of the plate elements 3, 4 and is formed toward the outer contour of the connecting portion 7. Here, a joining gap 11 is formed, and into this joining gap,solder material 20 is pushed in. The formed molded part 27 complements to form a receiving part 8 having a longitudinal groove 10 extending in the region of the joining plane FE between the plate elements 3, 4.

[0119] Forming solder When the attachment mold is closed, the plate stack clamped between the lower mold and the upper mold is heated. The intermediate space between the plate elements 3, 4 is subjected to the action of internal pressure. This is done by introducing a working medium, usually nitrogen, into the intermediate space between the plate elements 3, 4. Thereby, the channel 5 is formed by forming with internal pressure. During channel forming, the plate element region of the upper plate element 3 constituting the channel plate is formed to enter the channel cavity in the upper mold. The channel portions of the channel 5 loop into each other and communicate between the connecting pipe 6 shown here and another connecting pipe not shown.

[0120] Forming solder During forming by internal pressure in the attachment mold, the plate stack can be sealed by one or more pressurizing elements along the adjacent peripheral region and / or adjacent to the channel cavity, particularly in the region of the receiving parts of the plate elements 3, 4. The pressurizing elements can be provided in the upper mold and / or the lower mold as sealing strips, which are contemplated for this purpose and are determined to seal the plate stack or both plate elements 3, 4 annularly along the outer edge region and adjacent to the receiving part 8 accommodating the channel cavity and the connecting part 7 of the connecting pipe 6. The pressurizing elements can be realized, for example, in the form of beaded objects.

[0121] Applied between the plate elements 3, 4 solder material and applied between the receiving part 8 and the connecting part 7 solder material 20 melts or is molten when the plate elements 3, 4 are heated. Material joining is performed between the joining partners. A channel structure having the channel 5 is formed, solder After the attachment process is completed, forming solder The attachment mold is opened, and the cooling plate 1 is formed solderIt is taken out from the attachment mold.

[0122] The cooling plate 1 is for molding solder After the attachment mold is opened and before taking out, it can be held and cooled in the attachment mold. Therefore, the channel plate 1 can be removed from the lower mold by the manipulator element when or after the attachment mold is opened, so the contact between the lower mold and the still hot channel plate is released. The upper mold is open and similarly no longer in contact with the cooling plate. After the holding time or cooling time, the cooling plate 1 is then solder held and cooled in the attachment mold. For this reason, the channel plate 1 can be removed from the lower mold by the manipulator element when or after the attachment mold is opened, so the contact between the lower mold and the still hot channel plate is released. The upper mold is open and similarly no longer in contact with the cooling plate. After the holding time or cooling time, the cooling plate 1 is then solder taken out from the attachment mold. solder taken out from the attachment mold.

[0123] solder To improve the attachment process, especially solder material for wetting or solder material outflow of solder stop means 28 can be integrated into the arrangement of the connecting pipe 6 and the accommodating part 8. solder The stop means 28 can be constituted by an annular bead 21 that abuts against the opening 29 of the accommodating part 8 at the end face.

[0124] In particular, solder the stop means 28 is constituted by a layer, ring or sleeve made of a sealing metal material 30. Such a formation is shown in the diagrams of FIGS. 12 and 13. solder The stop means 28 is formed from a sealing metal 30 having a melting temperature higher than that of the first type of solder material 20. solder The stop means 28 is solder material arranged in the region of the opening 29 of the connecting part 8 inside the accommodating part 8 before 20.

[0125] In the case of the embodiment illustrated in FIG. 13, solder the stop means 28 is solder material arranged in the region of the opening 29 between the annular bead 21 and

[0126] The sealing metal 30 is of the first typesolder material a second type having a melting temperature higher than 20 solder material may also be. Based on the high melting temperature of the first type of solder material this first type of solder material has viscosity under the temperature action in the molding solder die and becomes plastically deformable, so that in a predetermined region of the joining by molding between the connecting pipe 6, the connecting portion 7 and the accommodating portion 8, an overall sealing action is achieved. solder

[0127] FIG. 14 shows a view of a part of the plate body 2, the plate element 3, and the accommodating portion 8 formed in the molding portion 27. The connecting portion 7 of the connecting pipe 8 is positioned within the accommodating portion.

[0128] The connecting portion 7 is configured as described with reference to FIG. 6 in terms of cross-section.

[0129] The connecting portion 7 tapers to the length portion 32 via the transition portion 31. Within the length portion 32, the connecting piece 6 is circular.

[0130] The accommodating portion also includes two length portions 33, 34 having different cross-sections. The length portion 33 on the plate body side is configured as described with reference to FIG. 6. Via the transition portion 35, the length portion 33 located inside on the plate body side transitions to the length portion 34 on the opening side that conforms to the circular contour of the length portion 32.

[0131] To the connecting portion 7, solder material 20 is applied. The cross-sectional changes at the connecting portion 7 and the accommodating portion solder constitute the stop means 28. The cross-sectional changes at the transition from the connecting portion 7 to the length portion 32 and accommodation at the transition from the length portion 33 to the length portion 34 of the portion 8 form solder the stop means 28 that restricts soldering the flow during the formation of the joint between the connecting pipe 6 or the connecting portion 7 and the accommodating portion 8 solder ​​Note that although this application relates to the invention described in the claims, the following may also be included as other aspects. 1. A heat transfer plate comprising a plate body (2) composed of at least two plate elements (3, 4) and a connecting pipe (6) for a cooling fluid, the connecting pipe (6) having a connecting portion (7), and this connecting portion being joined within a receiving portion (8) of the plate body (2) formed between the plate elements (3, 4). The heat transfer plate is characterized in that the connecting portion (7) has two outwardly directed longitudinal webs (9), the receiving portion (8) has a longitudinal groove (10) extending within the region of the joining plane (FE) between the plate elements (3, 4), and the longitudinal web (9) extends within the longitudinal groove (10). 2. The heat transfer plate according to 1 above, characterized in that the longitudinal web (9) has a cross-section configured as a triangle having a concave web wall (12) and a rounded tip (13). 3. The heat transfer plate according to 1 or 2 above, characterized in that the longitudinal groove (10) has a cross-section configured as a funnel shape having a concave groove side surface (14) and a wedge-shaped groove bottom (15). 4. The heat transfer plate according to any one of 1 to 3 above, characterized in that the longitudinal web (9) and the longitudinal groove (10) are formed complementarily to each other. 5. The heat transfer plate according to any one of 1 to 4 above, characterized in that the connecting portion (7) has two convexly curved wall portions (16, 17), and these wall portions extend between the longitudinal webs (9). 6. The heat transfer plate according to any one of 1 to 5 above, characterized in that the receiving portion (8) has convexly curved receiving wall portions (18, 19), and the groove side surface (14) connects to these receiving wall portions. 7. The connecting portion (7) comprises wall portions extending parallel to the joining plane (FE), and these wall portions each terminate with a curved wall portion that transitions to a longitudinal web. The heat transfer plate according to any one of the above 1 to 6, characterized in that. 8. The connecting pipe (6) is provided with a stopper, in particular in the form of an annular bead (21), which abuts against the receiving portion (8) at the end face. The heat transfer plate according to any one of the above 1 to 7, characterized in that. 9. Between the connecting pipe (6), in particular the connecting portion (7) of the connecting pipe (6), and the receiving portion (8), solder Stop means (28) are provided. The heat transfer plate according to any one of the above 1 to 8, characterized in that. 10. The connecting pipe (6) is provided with a connecting portion (24) having an abutment body, in particular in the form of an annular bead (25). The heat transfer plate according to any one of the above 1 to 9, characterized in that. 11. In a method for manufacturing a heat transfer plate having a connecting pipe (6), · Providing a connecting pipe (6) having a connecting portion (7) with two outward longitudinal webs (9); · Providing a first plate element (3) and a second plate element (4), the first plate element (3) and the second plate element (4) having a receiving contour for the connecting portion (7); · bottom Mold and top A heated forming mold having a mold, solder Transferring the first plate element (3) and the second plate element (4) to the heated forming mold, the connecting portion (7) of the connecting pipe (6) being positioned between the forming portions (27) of the plate elements (3, 4), and between the connecting portion (7) and the plate elements (3, 4), solder material (20) is arranged; · Closing the forming solder Heated forming mold, bottom Mold and topA step of clamping the plate laminate between the molds, wherein the receiving contour in the molding part (27) of the plate elements (3, 4) is finally formed around the connecting part (7) of the connecting pipe (6), and a receiving part (8) having a longitudinal groove (10) extending in the region of the joining plane (FE) between the plate elements (3, 4) is formed. · A step of heating the plate laminate. · A step of applying an internal pressure to the intermediate space between the plate elements (3, 4) of the plate laminate by introducing a working medium into the intermediate space through the connecting pipe (6) to form a channel in at least one of the plate elements (3, 4). · Between the plate elements (3, 4) and between the connecting part (7) and the receiving part (8) solder material (20) is melted, solder and joined by caulking. · Molding solder The caulking mold is opened, and the cooling plate (1) is taken out from the caulking mold. solder A step of taking out the cooling plate (1) from the caulking mold characterized by having. 12. The cooling plate (1) is held and cooled in the caulking mold after the caulking mold is opened and before taking out. solder The method according to item 11 above, characterized in that solder it is held and cooled in the caulking mold.

Explanation of reference numerals

[0132] 1 Heat transfer plate 2 Plate body 3 Plate element 4 Plate element 5 Channel 6 Connecting pipe 7 Connecting part 8 Receiving part 9 Longitudinal web 10 Longitudinal groove 11 Joining gap 12 Web wall 13 Tip 14 Groove side wall 15 Groove bottom 16 Wall part 17 Wall part 18 Receiving wall part 19 Receiving wall part 20 First type of solder material 21 Annular bead 22 Narrow region 23 Opening 24 Connecting part 25 Annular bead 26 Transition region 27 Forming part 28 solder Stop means 29 Opening 30 Second type of solder material 31 Transition part 32 Length part 33 Length part 34 Length part 35 Transition part H Main axis N Sub-axis FE Joining plane M Center point L Longitudinal direction

Claims

1. A heat transfer plate comprising a plate body (2) composed of at least two plate elements (3, 4) and a connecting pipe (6) for a cooling fluid, the connecting pipe (6) having a connecting portion (7), and the connecting portion being joined within a receiving portion (8) of the plate body (2) formed between the plate elements (3, 4). The heat transfer plate is characterized in that the connecting portion (7) has two outwardly extending longitudinal webs (9), the receiving portion (8) has a longitudinal groove (10) extending within the region of the joining plane (FE) between the plate elements (3, 4), and the longitudinal webs (9) extend within the longitudinal groove (10).

2. The heat transfer plate according to claim 1, characterized in that the longitudinal webs (9) and the longitudinal grooves (10) are formed complementarily to each other.

3. The heat transfer plate according to claim 2, characterized in that the longitudinal web (9) has a cross-section configured as a triangle having a concave web wall (12) and a rounded tip (13).

4. The heat transfer plate according to claim 2, characterized in that the longitudinal groove (10) has a cross-section configured as a funnel shape having a concave groove side surface (14) and a wedge-shaped groove bottom (15).

5. The heat transfer plate according to claim 3, characterized in that the connecting portion (7) has two convexly curved wall portions (16, 17) extending between the longitudinal webs (9).

6. The heat transfer plate according to claim 4, characterized in that the receiving portion (8) has convexly curved receiving wall portions (18, 19), and the groove side surface (14) is connected to these receiving wall portions.

7. The heat transfer plate according to claim 5, characterized in that the connecting portion (7) has wall portions extending parallel to the joining plane (FE), and these wall portions respectively transition to the longitudinal webs via convexly curved wall portions at their terminal sides.

8. The heat transfer plate according to claim 1, characterized in that the connecting pipe (6) has a stopper, in particular in the form of an annular bead (21), which abuts against the receiving portion (8) at the end face.

9. The heat transfer plate according to claim 1, characterized in that brazing stop means (28) are provided between the connecting pipe (6), in particular the connecting portion (7) of the connecting pipe (6), and the receiving portion (8).

10. The heat transfer plate according to claim 1, characterized in that the connecting pipe (6) comprises a connecting portion (24) having an abutment body, in particular in the form of an annular bead (25).

11. In a method for manufacturing a heat transfer plate having a connecting pipe (6), - providing a connecting pipe (6) comprising a connecting portion (7) having two outwardly directed longitudinal webs (9); - providing a first plate element (3) and a second plate element (4), the first plate element (3) and the second plate element (4) having a receiving contour for the connecting portion (7); - transferring the first plate element (3) and the second plate element (4) to a heated forming brazing mold having a lower mold and an upper mold, the connecting portion (7) of the connecting pipe (6) being positioned between the forming portions (27) of the plate elements (3, 4), and a brazing material (20) being arranged between the connecting portion (7) and the plate elements (3, 4); - closing the forming brazing mold and clamping the plate stack between the lower and upper molds, the receiving contour in the forming portions (27) of the plate elements (3, 4) being finally formed around the connecting portion (7) of the connecting pipe (6), and a receiving portion (8) having a longitudinal groove (10) extending in the region of the joining plane (FE) between the plate elements (3, 4) being formed; - heating the plate stack; - applying an internal pressure to the intermediate space between the plate elements (3, 4) of the plate stack by introducing a working medium into the intermediate space via the connecting pipe (6), and forming channels in at least one of the plate elements (3, 4); - melting the brazing material (20) between the plate elements (3, 4) and between the connecting portion (7) and the receiving portion (8) and joining by brazing; - opening the forming brazing mold and removing the cooling plate (1) from the forming brazing mold characterized by comprising the above steps.

12. The method according to claim 11, characterized in that the cooling plate (1) is held and cooled in the forming brazing mold after the forming brazing mold is opened and before removal.

Images