Substrate processing device and substrate processing method

Abstract

To reduce an occupied floor area of a substrate processing device.SOLUTION: A substrate processing device includes a carrier block on which a carrier for storing a substrate is placed, one processing block in which the substrate is conveyed from the carrier block, an elevating transfer mechanism that overlaps with the one processing block, is provided with another processing block for transporting the substrate to the carrier block, a shaft extending in the lateral direction, and a support surface for supporting the substrate facing the substrate, and raises and lowers the shaft and the support portion between a position where the substrate is delivered to a first processing block transport mechanism and a position where the substrate is delivered to a second processing block, and a rotation mechanism that rotates the support portion around the shaft such that the support surface is in a first direction when an elevating transfer portion is located in a first region and a second region, and the support surface is in a second direction having a larger inclination with respect to the horizontal plane than the first direction when the elevating transfer portion is moved up and down between the first region and the second region.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] In the manufacturing process of semiconductor devices, a semiconductor wafer (hereinafter, referred to as a wafer) is transported between various processing modules to perform various processes such as liquid processing and heat processing. Patent Document 1 describes a coating apparatus including processing blocks each of which includes a plurality of unit blocks each of which is provided with a plurality of processing modules and stacked on top of one another, and a main arm provided for each unit block to transport the wafer between the processing modules. In this example, unit blocks for forming an SOC film, an anti-reflective film, and a resist film are stacked in two layers starting from the bottom layer side. It is described that the wafer is transported from the bottom layer to the top layer in the order of the unit block for forming the SOC film, the unit block for forming the anti-reflective film, and the unit block for forming the resist film, and three types of films are stacked to form the films. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-208004 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique capable of reducing the floor area occupied by a substrate processing apparatus. [Means for solving the problem]

[0005] The substrate processing apparatus according to the present disclosure includes a carrier block on which a carrier for storing a substrate is placed; a processing block including a plurality of first processing modules each processing the substrate, and a first transport mechanism shared by the plurality of first processing modules and transporting the substrate, the processing block to which the substrate is transported from the carrier block; a second transport mechanism shared by the second processing modules and configured to transport the substrate; and another processing block that overlaps the first processing block and transports the substrate to the carrier block; a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part having a support surface that faces and supports the substrate and that extends from the shaft in a direction intersecting the extension direction of the shaft, the lifting and transferring mechanism lifting and lowering the shaft and the support part between a first position for transferring the substrate to the first transport mechanism and a second position for transferring the substrate to the second transport mechanism; a rotation mechanism that rotates the support unit around the axis so that an orientation of the support unit changes between a first orientation for transferring the substrate at each of the first position and the second position, and a second orientation in which the inclination of the support surface with respect to a horizontal plane is larger than that of the first orientation for moving between the first position and the second position; Equipped with. Effect of the Invention

[0006] The present disclosure can reduce the floor area occupied by a substrate processing apparatus. [Brief description of the drawings]

[0007] [Figure 1] 1 is a cross-sectional plan view of a substrate processing apparatus according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a vertical sectional front view of the substrate processing apparatus. [Diagram 3] FIG. 2 is a vertical sectional front view of the substrate processing apparatus. [Figure 4] FIG. 2 is a left side view of the substrate processing apparatus. [Diagram 5] 2 is a vertical sectional side view of the substrate processing apparatus; FIG. [Figure 6] 2 is a vertical sectional side view of the substrate processing apparatus; FIG. [Figure 7] 4 is a side view showing a lifting and transferring mechanism provided in the substrate processing apparatus. FIG. [Figure 8] FIG. [Figure 9] 5A to 5C are explanatory views showing the operation of the lifting and transferring mechanism. [Figure 10] 5A to 5C are explanatory views showing the operation of the lifting and transferring mechanism. [Figure 11] 5A to 5C are explanatory views showing the operation of the lifting and transferring mechanism. [Figure 12] 5A to 5C are explanatory views showing the operation of the lifting and transferring mechanism. [Figure 13] 5A to 5C are explanatory views showing the operation of the lifting and transferring mechanism. [Figure 14] 5A to 5C are explanatory views showing the operation of the lifting and transferring mechanism. [Figure 15] 3 is a schematic view of a transfer path in the substrate processing apparatus; [Figure 16] 13 is a cross-sectional plan view of a substrate processing apparatus according to another embodiment of the present disclosure. [Figure 17] FIG. 2 is a vertical sectional front view of the substrate processing apparatus. [Figure 18] FIG. 11 is an explanatory diagram showing another example of the arrangement of the lifting and transferring mechanism; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] An example of a substrate processing apparatus 1 according to an embodiment of the present disclosure will be described with reference to the cross-sectional plan view of Fig. 1 and the longitudinal front views of Fig. 2 and Fig. 3. Figs. 2 and 3 show cross sections at different positions of the apparatus. In the substrate processing apparatus 1, a carrier block D1, a first processing block D2, and a second processing block D3 are arranged in a horizontal line in this order, with adjacent blocks connected to each other. These blocks (the carrier block, the first and second processing blocks) D1 to D3 are each provided with a housing and are separated from each other, and a transfer area for a wafer W, which is a substrate, is formed inside each housing.

[0009] In the following description, the arrangement direction of these blocks D1 to D3 is the left-right direction, with the carrier block D1 side being the left side and the second processing block D3 being the right side. In addition, in the front-rear direction of the device, when looking at the carrier block D1 from the left, the front is the front and the back is the rear.

[0010] Before describing each of the blocks D1 to D3 in detail, a general configuration of the substrate processing apparatus 1 will be described. A wafer W is transported to the substrate processing apparatus 1 while being stored in a carrier C called a FOUP (Front Opening Unify Pod). The substrate processing apparatus 1 includes processing modules that perform various processes such as forming a coating film by coating the wafer W with various coating liquids as a liquid process, and heating the wafer W after the coating film is formed.

[0011] The first processing block D2 and the second processing block D3 are each partitioned so as to be divided into two in the vertical direction. The lower and upper sides of the first processing block D2 partitioned from each other in this way are respectively referred to as the first lower processing block D21 and the first upper processing block D22. The lower and upper sides of the second processing block D3 partitioned from each other are respectively referred to as the second lower processing block D31 and the second upper processing block D32. Therefore, the first lower processing block D21 and the first upper processing block D22 are stacked on each other, and the second lower processing block D31 and the second upper processing block D32 are stacked on each other. The first lower processing block D21 and the first upper processing block D22 are adjacent to each other, and the second lower processing block D31 and the second upper processing block D32 are adjacent to each other.

[0012] Wafers W are transferred in the following order: carrier block D1 → first lower processing block D21 → second lower processing block D31 → second upper processing block D32 → first upper processing block D22 → carrier block D1. Therefore, with respect to carrier block D1 as a reference, the first lower processing block D21 and the second lower processing block D31 form the outgoing path for wafers W, and the first upper processing block D22 and the second upper processing block D32 form the returning path for wafers W. The lower processing blocks forming the outgoing path may be collectively referred to as lower processing block G1, and the upper processing blocks forming the returning path may be collectively referred to as upper processing block G2.

[0013] As the wafer W is transported on the outbound and return routes in this manner, three types of coating films are sequentially formed on the wafer W and stacked on top of each other. Of these coating films, the topmost film is a resist film, the film below that is described as an intermediate film, and the film below that is described as a lower layer film. The lower layer film is formed in a processing module on the outbound route, while the intermediate film and resist film are formed in processing modules on the return route. Note that a module is a location on which the wafer W is placed other than the transport mechanism. A module that performs processing on the wafer W is described as a processing module as described above, but this processing also includes obtaining images for inspection.

[0014] The carrier block D1 will be described below with reference to the side view of Fig. 4. A carrier C is loaded and unloaded into the carrier block D1 by a carrier transport mechanism (external transport mechanism) (not shown) provided in a clean room in which the substrate processing apparatus 1 is installed. The carrier block D1 is a block that loads and unloads wafers W into and from the carrier C.

[0015] The aforementioned housing constituting carrier block D1 is designated as 11. Housing 11 is formed in a rectangular shape, and its lower side protrudes to the left to form support stand 12. Furthermore, on the left side surface of housing 11 above support stand 12, two points spaced apart from each other in the vertical direction protrude to the left to form support stands 13 and 14. The lower support stand and the upper support stand are designated as 13 and 14, respectively.

[0016] The carriers C can be placed on each of the support tables 12 to 14, for example, four at a time, spaced apart in the front-rear direction, and each of the support tables 12 to 14 is provided with a stage for placing the carriers C thereon, and the stages are arranged, for example, in a 3×4 matrix as viewed from the left. The left end of the support table 12 protrudes leftward beyond the support tables 13 and 14, and the stage of the support table 12 is provided on the right side of the support table 12, below the support tables 13 and 14. The inside of the support table 12 is an area for storing bottles containing processing liquid for liquid processing in the first processing block D2 and the second processing block D3, as described above.

[0017] The carrier C can be transferred between the stages by a carrier transfer mechanism 21, which will be described later. Regarding the stages, the two front stages of the support bases 12 and 13 are configured as moving stages 15 on which the carrier C is placed to carry the wafer W into and out of the apparatus. Therefore, the moving stages 15 are arranged in a 2×2 matrix as viewed from the left. The moving stages 15 move between a load position on the right side for carrying the wafer W into and out of the apparatus, and an unload position on the left side for transferring the carrier C to and from the carrier transfer mechanism 21. In this example, the moving stage 15 of the support base 12 is used as a stage (loader) on which the carrier C is placed to eject the unprocessed wafer W into the apparatus, and the moving stage 15 of the support base 13 is used as a stage (unloader) on which the carrier C is placed to store the processed wafer W in the apparatus. However, one moving stage 15 may serve as both a loader and an unloader.

[0018] Regarding the other stages, the two rear stages on the support bases 12 and 13 and the two stages on the support base 14 are configured as temporary placement stages 16. The other two stages on the support base 14 are configured as a carry-in stage 17 and an unloading stage 18. For example, the stage on the rear end side and the stage on the front end side of the support base 14 are the carry-in stage 17 and the unloading stage 18, respectively. These carry-in stage 17 and unloading stage 18 are stages on which the carrier C is placed so that the external transport mechanism described above can carry the carrier C into and out of the substrate processing apparatus 1, respectively.

[0019] The carrier C is transferred in the following order: carry-in stage 17 → movable stage 15 of support base 12 → movable stage 15 of support base 13 → carry-out stage 18. When transferring the carrier C between stages in this manner, if the destination stage is not available (if it is occupied by another carrier C), the carrier C is placed on the temporary placement stage 16 and waits until the destination stage becomes available.

[0020] A carrier transfer mechanism 21 is provided above the left side of the support base 12. The carrier transfer mechanism 21 includes an articulated arm 22 capable of holding a held portion provided on the upper part of the carrier C, and a moving mechanism 23 capable of moving the articulated arm 22 up and down and back and forth, and is capable of transferring the carrier C between stages as described above.

[0021] A transfer opening 24 for loading and unloading the wafer W is formed in the left side wall of the housing 11, and is formed in a 2×2 matrix to match the arrangement of the movable stages 15. A door 25 is provided at each transfer opening 24. The door 25 is capable of holding a lid of the carrier C on the movable stage 15 at the load position, and is capable of opening and closing the transfer opening 24 by moving while holding the lid.

[0022] The transfer opening 24 faces a transfer area 31 for the wafer W formed in the housing 11, and the transfer area 31 is formed in a long straight line in a plan view. A transfer mechanism 32 is provided on the front side of the transfer area 31. The transfer mechanism 32 includes a base that is movable back and forth, vertically movable, and rotatable about a vertical axis, and a holder for the wafer W that can move forward and backward on the base. The transfer mechanism 32 can access the carrier C on the moving stage 15 at the load position described above, and the module stack T1 and pre-processing inspection module 41 described below to transfer the wafer W.

[0023] A pre-processing inspection module 41 is provided in the carrier block D1, and the pre-processing inspection module 41 images the surface of the wafer W before it is processed by the substrate processing apparatus 1. Image data obtained by the imaging is transmitted to the control unit 10 described below, and the control unit 10 determines the presence or absence of an abnormality in the wafer W based on the image data. The pre-processing inspection module 41 is configured in a horizontally elongated and flattened rectangular parallelepiped shape, with its right side located in the front-to-rear center of the transfer region 31 and its left side penetrating the left wall of the housing 11 and protruding outside the housing 11.

[0024] The pre-processing inspection module 41 includes a stage 42 that is movable left and right within the module, a half mirror 43 provided above the moving path of the stage 42, an illumination unit 44 that irradiates light downward via the half mirror 43, and a camera 45 provided to the left of the half mirror 43 (see FIG. 3). The wafer W is delivered to the stage 42 located on the right side within the module by the transport mechanism 32. While the stage 42 to which the wafer W has been delivered moves leftward and passes below the half mirror 43, light is emitted by the illumination unit 44 and an image of the wafer W reflected in the half mirror 43 is captured by the camera 45, and the above image data is acquired.

[0025] 1, in the transfer region 31, a transfer mechanism 33 is provided so as to be located behind the pre-processing inspection module 41 in a plan view. The transfer mechanism 33 includes a base that can be raised and lowered and rotated about a vertical axis, and a holder for the wafer W that can move forward and backward on the base, and can deliver the wafer W to and from a module stack T1 described below.

[0026] Next, the module stack T1 will be described. This module stack T1 is configured by vertically stacking a transfer module TRS on which a wafer W is temporarily placed and a temperature adjustment module SCPL, and is provided in the center between the front and rear of the transfer area 31. Therefore, in a plan view, the module stack T1 is sandwiched in the front-rear direction by the transfer mechanisms 32 and 33, and is arranged overlapping on the right side of the pre-processing inspection module 41. The transfer module TRS includes, for example, a plurality of pins arranged in the horizontal direction, and the wafer W is transferred to the pins by the lifting and lowering operation of the transfer mechanism. The SCPL is configured to cool the placed wafer W by, for example, connecting a coolant flow path to a plate on which the wafer W is placed, and the wafer W is transferred to the plate by the lifting and lowering operation of the transfer mechanism.

[0027] In addition, SCPLs are also provided in blocks other than carrier block D1, and the SCPLs in blocks other than D1 have the same configuration as the SCPL in carrier block D1, for example. TRSs are also provided in blocks other than D1. Hereinafter, in order to distinguish the SCPLs and TRSs in each location, numbers are added after the SCPLs and TRSs. In addition, the TRSs and SCPLs in each location are provided, for example, in a stacked manner. In other words, multiple TRSs and SCPLs with the same numbers are provided, but only one is shown for convenience of illustration. In this specification, a stack of modules means modules that are provided overlapping each other in a plan view, and the modules may be separated from each other or may be in contact with each other.

[0028] Some of the modules constituting the module stack T1 are provided below the pre-processing inspection module 41, and the other parts are provided above the pre-processing inspection module 41. For example, they are provided from bottom to top in the order of TRS1, TRS2, SCPL1, and TRS3, with the pre-processing inspection module 41 located between SCPL1 and TRS3 (see FIG. 3). For example, TRS1, TRS2, and SCPL1 are each located at the height of the first lower processing block D21, and TRS3 is each located at the height of the first upper processing block D22. The transport mechanism 33 can access each of the modules constituting the module stack T1, and the transport mechanism 32 can access TRS1 and TRS2.

[0029] TRS1 and TRS2 are used for transferring wafers W between the transfer mechanisms 32 and 33. SCPL1 is used for transferring wafers W between the first lower processing block D21 and the carrier block D1. Therefore, a transfer mechanism 6A of the first lower processing block D21, which will be described later, can also access SCPL1. Furthermore, TRS3 is used for transferring wafers W between the first upper processing block D22 and the carrier block D1. Therefore, a transfer mechanism 6B of the first upper processing block D22, which will be described later, can also access TRS3.

[0030] A hydrophobization processing module 30 is provided behind the transfer mechanism 33, which performs a hydrophobization processing by supplying a processing gas to the wafer W before the formation of a coating film. For example, the hydrophobization processing module 30 is provided at the height of the second upper processing block D32, for example, stacked, and the transfer mechanism 33 transfers the wafer W to the hydrophobization processing module 30. The hydrophobization processing module 30 includes a hot plate on which the wafer W is placed, similar to a hot plate 55 provided in a heating module 54 described later, and a cover that can be raised and lowered to cover the hot plate, and the wafer W is subjected to a hydrophobization processing by supplying a processing gas to an enclosed space formed by the cover on the hot plate.

[0031] Next, the first processing block D2 will be described with reference to Fig. 5, which is a vertical cross-sectional side view. The front side of the first processing block D2 is vertically partitioned to form eight stories, which are numbered E1 to E8 from bottom to top. The lower stories E1 to E4 are included in the first lower processing block D21, and the upper stories E5 to E8 are included in the first upper processing block D22. Each story forms an area in which a liquid processing module can be installed.

[0032] First, the first upper processing block D22 will be described. Each of stories E5 to E8 is provided with a resist coating module 51 as a liquid processing module. The resist coating module 51 includes two cups 52 arranged side by side and each of which accommodates a wafer W, and a nozzle (not shown), and supplies resist liquid supplied from the bottle by a pump (not shown) to the surface of the wafer W for processing.

[0033] A transfer area 53 for wafers W is provided at the rear of the stories E5 to E8, and is formed linearly in a plan view from the left end to the right end of the upper processing block D22. Therefore, the extension direction of the transfer area 53 is perpendicular to the extension direction of the transfer area 31 of the carrier block D1. The transfer area 53 is formed from the height of story E5 to the height of story E8. In other words, the transfer area 53 is not divided into stories E5 to E8.

[0034] And, behind the transport area 53, the processing modules are stacked, for example, in seven stages in the vertical direction, and two stacks of the processing modules are arranged side by side on the left and right. That is, the stacks of the processing modules and the cups 52 are each provided along the extension direction of the transport area 53.

[0035] The stack of the processing modules arranged side by side is the rear processing unit 50. The processing modules constituting the rear processing unit 50 include a plurality of heating modules 54. The heating module 54 in the first upper processing block D22 is a module for removing a solvent in a coating film, and includes a hot plate 55 on which the wafer W is placed and heated, and a cooling plate 56 for adjusting the temperature of the wafer W. The cooling plate 56 can move between a front position where the wafer W is transferred by the lifting and lowering operation of the transfer mechanism 6B described later, and a rear position where the cooling plate 56 overlaps with the front position. The lifting and lowering operation of the pins (not shown) of the hot plate 55 cooperates with the movement of the cooling plate 56 to transfer the wafer W between the hot plate 55 and the cooling plate 56.

[0036] The transfer area 53, which is the main transfer path, is provided with the transfer mechanism 6B, which is the main transfer mechanism described above, and the transfer mechanism 6B includes a base 61 that is movable left and right, vertically movable, and rotatable about a vertical axis, and a holder 62 for the wafer W that can move forward and backward on the base 61. Note that each of the transfer mechanisms in the substrate processing apparatus 1, including the transfer mechanism 6B, is provided with two holders, which can move forward and backward independently of each other on the base.

[0037] A moving mechanism 63 for moving a base 61 of the transfer mechanism 6B left and right is provided below the rear processing unit 50. The transfer mechanism 6B can transfer wafers W to and from each processing module in the first upper processing block D22, the TRS3 of the carrier block D1, and the SCPL of the second upper processing block D32 (to be described later). Therefore, the transfer mechanism 6B is shared by these modules.

[0038] Next, the first lower processing block D21 will be described. The first lower processing block D21 has a configuration generally similar to that of the first upper processing block D22 described above, and the following description will focus on the differences from the first upper processing block D22. No liquid processing module is provided on level E1, and levels E2 to E4 are provided with a chemical liquid coating module 47 that applies a chemical liquid for forming an underlayer film as a liquid processing module. The chemical liquid coating module 47 has a configuration similar to that of the resist coating module 51, except that instead of supplying a resist liquid from a nozzle, the chemical liquid coating module 47 supplies the above-mentioned chemical liquid for forming an underlayer film.

[0039] The main transport mechanism provided in the transfer region 53 is shown as a transport mechanism 6A, and has a configuration similar to that of the above-described transport mechanism 6B. The transport mechanism 6A delivers wafers W to and from each processing module in the first lower processing block D21, the SCPL1 of the module stack T1 described above, and an SCPL in a second lower processing block D31 described below.

[0040] Next, the second processing block D3 will be described. The second processing block D3 has a configuration substantially similar to that of the first processing block D2, and the following description will focus on the differences between the first processing block D2 and the second processing block D3. First, in the second upper processing block D32, no processing module is provided on the story E5, and a chemical liquid coating module 48 for forming an intermediate film is provided as a liquid processing module on stories E6 to E8. The chemical liquid coating module 48 has a configuration similar to that of the resist coating module 51, except that a nozzle is provided to supply a chemical liquid for forming an intermediate film instead of supplying a resist liquid from a nozzle. The main transport mechanism in the second upper processing block D32 is a transport mechanism 6D. The transport mechanism 6D can transfer the wafer W to and from each module provided in the second upper processing block D32, including the SCPL and TRS described below.

[0041] Next, the second lower processing block D31 will be described. The second lower processing block D31 does not have a liquid processing module. The rear processing unit 50 including the heating module 54 is provided in the same manner as the other processing blocks D21, D22, and D32. The heating module 54 in the second lower processing block D31 is a module for gradually heating the underlayer film together with the heating module 54 in the first lower processing block D21 to harden the underlayer film. The main transport mechanism in the second lower processing block D31 is a transport mechanism 6C. The transport mechanism 6C delivers the wafer W to and from each module provided in the second lower processing block D31 including the SCPL and TRS described below.

[0042] Incidentally, the left side of each liquid treatment module in each of the first lower processing block D21, the first upper processing block D22, the second lower processing block D31, and the second upper processing block D32 described above is configured as an auxiliary equipment installation area 91 for the liquid treatment module. This auxiliary equipment installation area 91 is located forward of the transport area 53 of each processing block D21, D22, D31, and D32, and is provided from the lower part of the lower processing block G1 to the upper part of the upper processing block G2. Therefore, the auxiliary equipment installation area 91 is provided in each of the first processing block D2 and the second processing block D3, and the vertical side view of FIG. 6 shows the auxiliary equipment installation area 91 in the second processing block D3. In the auxiliary equipment installation area 91 of the first processing block D2 and the auxiliary equipment installation area 91 of the second processing block D3, an exhaust path, a drainage path, a power supply cable, and the like connected to the liquid treatment module in each processing block are installed.

[0043] The left side of the rear processing section 50 and the rear side of the transport area 53 in each of the processing blocks D21, D22, D31, and D32 are configured as ancillary equipment installation areas 92. Thus, the ancillary equipment installation areas 92 are also provided in each of the first processing block D2 and the second processing block D3, similar to the ancillary equipment installation areas 91, and extend from the lower part of the lower processing block G1 to the upper part of the upper processing block G2. The upper side of the ancillary equipment installation area 92 forms an area in which various electrical equipment (electrical devices) for operating each processing module in the processing block in which the ancillary equipment installation area 92 is provided are installed. The lower side of the ancillary equipment installation area 92 forms an installation area for bottles for liquid processing, similar to the support base 12 of the carrier block D1, and the coating liquid is supplied from the bottles to each liquid processing module in the processing block in which the ancillary equipment installation area 92 is provided.

[0044] The layouts of the liquid treatment modules, rear processing section 50, and auxiliary equipment installation areas 91, 92 are the same among the processing blocks D21, D22, D31, and D32, except that there is no liquid treatment module in the second lower processing block D31. As shown in Figures 3 and 6, SCPL3 and SCPL4 are provided at a position toward the upper left end of the transfer area 53 of the second upper processing block D32. SCPL2 is provided at a position toward the lower left end of the transfer area 53 of the second lower processing block D31.

[0045] TRS11 and TRS12 are provided between SPCL2 and SCPL3 and 4, with TRS11 as a first substrate placement part located in second lower processing block D31 and TRS12 as a second substrate placement part located in second upper processing block D32. These SCPL2 to SCPL4, TRS11, and TRS12 overlap each other in a plan view to form a stack, and the stack is located between ancillary equipment installation areas 91 and 92 from the front and rear.

[0046] A lifting and transferring mechanism 7 for transferring a wafer W from TRS11 to TRS12, i.e., from the second lower processing block D31 to the second upper processing block D32, is provided on the front side of the ancillary equipment installation area 92. The lifting and transferring mechanism 7 will be described below with reference to the side view of Fig. 7 and the plan view of Fig. 8. The lifting and transferring mechanism 7 includes, for example, two support columns 72, a rotating shaft 73, a support portion 74, and a rotating mechanism 75. The two support columns 72 are arranged side by side on the left and right in front of and close to the ancillary equipment installation area 92 (i.e., at the rear end of the transfer area 53), and each extends in the vertical direction.

[0047] A rotating shaft 73 extends horizontally, i.e., laterally, from one support column 72 to the other support column 72, and a rotating mechanism 75 is connected to one end of the rotating shaft 73. The rotating mechanism 75 is equipped with a motor or the like, and rotates the rotating shaft 73 around its axis. The other end of the rotating shaft 73 is connected to, for example, a bearing 76. The rotating mechanism 75 and the bearing 76 are each provided, for example, inside the support column 72, and the support column 72 is configured as an elevating mechanism that vertically raises and lowers both the rotating mechanism 75 and the bearing 76.

[0048] 7, a plate-shaped support portion 74 is formed so as to extend horizontally forward (either front or rear) from the rotation shaft 73. Therefore, the support portion 74 is provided so as to extend in a direction intersecting the axial direction of the rotation shaft 73. As it extends, the support portion 74 branches into two, forming a symmetrical fork shape. The tip portion of the support portion 74 is indicated as 77, and the base portion closer to the rotation shaft 73 than the tip portion 77 is indicated as 76. The upper surface of the support portion 74 forms a support surface 74A that faces and supports the lower surface (rear surface) of the wafer W.

[0049] If the orientation of the support portion 74 described above is a first orientation, in the first orientation, the support surface 74A is horizontal, and the wafer W is supported horizontally. The support portion 74 is rotated around the rotation shaft 73 by the above-mentioned rotation mechanism 75, and as shown by the chain line in FIG. 7, the tip side of the support portion 74 is in a second orientation in which it stands upward. Therefore, the base end side (the rotation shaft 73 side) of the support surface 74A is located lower than the tip side. In this way, the orientation of the support portion 74 switches between the first orientation and the second orientation. When the support portion 74 is in this second orientation, the support surface 74A is inclined so that its tip side is located slightly forward of the base end side. Therefore, the support surface 74A is inclined with respect to a vertical plane (shown by a two-dot chain line in FIG. 7), and the inclination θ of the support surface 74A with respect to the vertical plane is, for example, 30° or less in order to transport the wafer W as described later.

[0050] In the above-mentioned support surface 74A, suction holes 81 for sucking the peripheral portion of the back surface of the wafer W are opened in each of the tip portions 77 and the base portion 76, so that the wafer W can be sucked and held on the support surface 74A even when the support portion 74 is in the second orientation described above. Each suction hole 81 is connected to a suction path 82 formed inside the support portion 74 as shown in FIG. 7, and the downstream side of the suction path 82 is drawn out to the outside of the support portion 74 and connected to a suction portion 83 for exhausting the suction path 82. Outside the support portion 74, a valve V82 is interposed in the suction path 82. The suction state and the non-suction state from the suction hole 81 are switched to each other by opening and closing the valve V82. When the back surface of the wafer W is supported by the support portion 74, the suction state is set, and the wafer W is sucked to the support surface 74A.

[0051] Furthermore, a pressure detection unit 84 is provided in the suction path 82, and transmits a detection signal corresponding to the pressure in the suction path 82 to the control unit 10 described below. Based on the detection signal, the control unit 10, which is a holding abnormality detection unit, determines whether or not there is an abnormality in the holding of the wafer W. More specifically, when the valve V82 is opened to enter the suction state as described above, if the wafer W is not supported properly, for example by falling off the support part 74, the detected pressure will be relatively high due to the suction of gas from the suction hole 81. Therefore, the presence or absence of the above-mentioned abnormality can be determined by comparing the detected pressure value with a preset threshold value.

[0052] Further, a drop prevention portion 85 is formed on the base portion 76 of the support portion 74. This drop prevention portion 85 is formed by raising an outer region of the support surface 74A of the support portion 74 relative to the support surface 74A, and when the support portion 74 is in the second orientation, the drop prevention portion 85 is located below the wafer W. By providing this drop prevention portion 85 and by having the support surface 74A tilted with respect to the vertical plane when the support portion 74 is in the second orientation as described above, even if a problem occurs in suction through the suction hole 81, the wafer W is prevented from sliding toward the base end side of the support portion 74 and falling from the support portion 74 and being damaged.

[0053] The TRS11 and TRS12 for the lifting / transferring mechanism 7 will be further described with reference to Fig. 8. These TRS11 and TRS12 are configured to fit into a recess surrounded by two tip portions 77 and a base portion 76 in a plan view when the support portion 74 of the lifting / transferring mechanism 7 is in the horizontal first orientation described above, and support the center portion of the wafer W. Note that Fig. 8 shows only the TRS11 as a representative. With such a configuration, the TRS11 and TRS12 can transfer the wafer W to the support portion 74 that is lifted and lowered in the first orientation without interference from each of them.

[0054] Next, the transportation of the wafer W by the lifting and transferring mechanism 7 will be described step by step with reference to FIGS. 9 to 14. The support part 74, which is in the second orientation with its tip pointing upward, moves from above the TRS 11 on which the wafer W is placed to below the TRS. Being in the second orientation, the support part 74 does not interfere with the wafer W (FIG. 9). Then, the support part 74 assumes a horizontal first orientation (FIG. 10). Note that, due to this change in orientation, the support part 74 is lowered to a position where it does not interfere with the wafer W. Next, the support part 74 is moved from below the TRS 11 on which the wafer W is placed to above, and the wafer W is transferred from the TRS 11 to the support part 74 (FIG. 11).

[0055] Next, the support part 74 is oriented in the second direction and moved above the TRS12. At this time, since the support part 74 is oriented in the second direction, the wafer W held by the support part 74 does not interfere with the TRS12 (FIG. 12). Thereafter, the support part 74 is oriented in the first direction (FIG. 13), the support part 74 is moved from above the TRS12 to below, and the wafer W is transferred from the support part 74 to the TRS12. Thereafter, the support part 74 is oriented in the second direction and moved below (FIG. 14). Note that, by changing the direction, the support part 74 is lowered to a position where it does not interfere with the wafer W placed on the TRS12, and the change in direction is performed above the TRS11 so that it does not interfere with the subsequent wafer W placed on the TRS11. Note that the height position of the TRS11 corresponds to the first position, and the height position of the TRS12 corresponds to the second position.

[0056] 9 to 14, and sequentially transports the wafer W transported to the TRS 11 to the TRS 12. Note that the above-described suction from the suction hole 81 of the support part 74 and detection of the pressure in the suction path 82 are performed during the period from when the support part 74 receives the wafer W from the TRS 11 to when the support part 74 delivers the wafer W to the TRS 12.

[0057] The substrate processing apparatus 1 also includes a control unit 10 (see FIG. 1). The control unit 10 is configured by a computer, and includes a program, a memory, and a CPU. The program includes a set of steps so that a series of operations can be performed in the substrate processing apparatus 1. The control unit 10 detects whether or not there is an abnormality in holding the wafer W. The control unit 10 outputs a control signal to each part of the substrate processing apparatus 1 by the program, and controls the operation of each part. Specifically, the control unit 10 controls the operation of the transport mechanisms 6A-6D, the lifting and transferring mechanism 7, and each processing module. This allows the wafer W to be transported and processed, as described below. The program also detects whether or not there is an abnormality in holding the wafer W based on the pressure of the suction path 82, as described above, and detects an abnormality based on an image of the wafer W obtained. The above program is stored in a storage medium, such as a compact disc, a hard disk, or a DVD, and installed in the control unit 10.

[0058] Each processing module of the first lower processing block D21 (one left processing block) and the second lower processing block D31 (one right processing block) is a first processing module, and the chemical coating module 47 that forms the underlayer film (first coating film) is a first coating film forming module. The heating module 54 of the processing blocks D21 and D31 that heats the wafer W on which the underlayer film is formed is a first heating module. The transfer mechanisms 6A and 6C of these processing blocks D21 and D31 are first transfer mechanisms, and the transfer area 53 of these processing blocks D21 and D31 is a first transfer area. Each processing module of the first upper processing block D22 (another right processing block) and the second upper processing block D32 (another right processing block) is a second processing module. The chemical coating module 48 and resist coating module 51 which form the intermediate film and resist film (second coating film) are second coating film forming modules, and the heating modules 54 in the processing blocks D22 and D32 which heat the wafers W on which the intermediate film and resist film are formed are second heating modules. The transfer mechanisms 6B and 6D in the processing blocks D22 and D32 are second transfer mechanisms, and the transfer area 53 in the processing blocks D22 and D32 is a second transfer area.

[0059] The first lower processing block D21 and the first upper processing block D22 constituting the first processing block D2 are one set of processing blocks, and the second lower processing block D31 and the second upper processing block D32 constituting the second processing block D3 are another set of processing blocks. As described above, the carrier block D1 is provided along the line of these sets, and the above-mentioned lifting and transferring mechanism 7 is provided in the other set (the second lower processing block D31 and the second upper processing block D32) that is farther away from the carrier block D1. In the second lower processing block D31 and the second upper processing block D32, the forward side of the position where the rotation shaft 73 of the lifting and transferring mechanism 7 is provided is the transport area 53, and this transport area extends to the right (one of the left and right sides). Processing modules are provided along the extension direction of this transport area.

[0060] Next, the processing and transportation of the wafer W in the substrate processing apparatus 1 will be described with reference to FIG. 15 showing an outline of the transport path. In FIG. 15, a transport mechanism used for the transport is shown on or near some of the arrows showing the transport of the wafer W between modules. First, the wafer W is transported by the transport mechanism 32 from the carrier C placed on the moving stage 15 of the support table 12, and the wafer W is transported to the pre-processing inspection module 41, where image data is acquired and the presence or absence of abnormality is determined, and then the wafer W is transported to the TRS1. Thereafter, the wafer W is transported by the transport mechanism 33 to the hydrophobization processing module 30, where it is subjected to hydrophobization processing, and then transported to the SCPL1. Next, the wafer W is taken into the first lower processing block D21 by the transport mechanism 6A, and transported in the order of the chemical solution coating module 47 and the heating module 54, and transported to the SPCL2 of the second lower processing block D31 with the lower layer film formed thereon.

[0061] Thereafter, the wafer W is transferred by the transfer mechanism 6C to the heating module 54 in the second lower processing block D31, where it is subjected to a heat treatment, and then transferred to the TRS 11, and then transferred to the TRS 12 in the second upper processing block D32 by the lifting and transferring mechanism 7 as described with reference to Figures 9 to 14. The wafer W is then transferred by the transfer mechanism 6D in the second upper processing block D32 in the order of SCPL 3 →chemical liquid coating module 48 →heating module 54, and transferred to the SCPL 4 with an intermediate film formed thereon.

[0062] The wafer W is then loaded into the first upper processing block D22 by the transfer mechanism 6B, and transferred in this order from the resist coating module 51 to the heating module 54, and in this state where a resist film is formed, the wafer W is transferred to the TRS3 of the carrier block D1. Thereafter, the wafer W is transferred in the order of the transfer mechanism 33, TRS2, and transfer mechanism 32, and stored in the carrier C on the moving stage 15 of the support table 13.

[0063] As described above, the substrate processing apparatus 1 is provided with the lifting and transferring mechanism 7 for transferring the wafer W from the second lower processing block D31 to the second upper processing block D32. The support portion 74 of the lifting and transferring mechanism 7 for holding the wafer W rotates so that its posture is switched between a horizontal first orientation and an upright second orientation. Suppose that instead of the lifting and transferring mechanism 7, a transfer mechanism (i.e., a transfer mechanism similar to the transfer mechanisms 6A to 6D, etc.) is provided in which the holder for the wafer W can move forward and backward relative to a base and the base can be raised and lowered, to transfer the wafer W between TRS11 and TRS12. However, in that case, it is necessary to provide a lifting and transferring space for the transfer mechanism on the front or rear side of TRS11 and TRS12, and the front-to-back width of the lifting and transferring space is a size equivalent to the front-to-back width of the transfer mechanism. Therefore, in order to secure the lifting space, the rear processing unit 50 and the auxiliary equipment installation area 92 or the chemical coating module 48 and the auxiliary equipment installation area 91 are shifted to the right by the left-right width of the lifting space from the above-mentioned positions, which increases the left-right length of the second processing block D3, and increases the floor area (footprint) occupied by the substrate processing apparatus 1.

[0064] However, since the lifting / lowering transfer mechanism 7 has a configuration in which the support portion 74 rotates as described above, the front-rear width required to avoid interference with the wafers W placed on each of the TRSs 11 is suppressed, and the lifting / lowering transfer mechanism 7 can be installed using the space on the front side of the ancillary equipment installation area 92. Therefore, according to the substrate processing apparatus 1, the left-right length of the second processing block D3 in which the lifting / lowering transfer mechanism 7 is provided is suppressed, so that the floor area occupied by the substrate processing apparatus 1 can be reduced. Note that when the substrate processing apparatus 1 is installed in a limited space, the fact that the floor area occupied is suppressed in this way means that the substrate processing apparatus 1 can be installed in the space without reducing the number of processing modules mounted on the substrate processing apparatus 1. Therefore, the substrate processing apparatus 1 also has the effect of ensuring a sufficient number of processing modules and preventing a decrease in throughput.

[0065] Furthermore, by providing the lifting and transferring mechanism 7 as a dedicated transfer mechanism between the lower processing block (one processing block) G1 and the upper processing block G2 (the other processing block), the load on the transfer mechanisms 6A-6D of each processing block is reduced. Therefore, the transfer mechanisms 6A-6D can quickly transfer the wafers W to the processing modules provided in each processing block, and from this viewpoint as well, the substrate processing apparatus 1 can achieve a high throughput.

[0066] As described above, the lifting and transferring mechanism 7 is provided in the transport area 53, in front of the ancillary equipment installation area 92. In other words, it is provided so as to face an area where no processing modules are provided. Due to such an arrangement, the provision of the lifting and transferring mechanism 7 does not reduce the number of processing modules installed, and therefore a reduction in throughput is more reliably prevented.

[0067] Furthermore, since the lifting / transfer mechanism 7 only performs lifting and rotating operations, the drive mechanism is simpler than when a transport mechanism having a configuration such as the transport mechanisms 6A to 6D is provided instead of the lifting / transfer mechanism 7, as described above. This allows for a reduction in the manufacturing cost of the device.

[0068] The second orientation is not limited to the tip of the support 74 facing upward, and may be facing downward. However, if the tip of the support 74 faces upward, even if a problem occurs in the suction through the suction hole 81, the wafer W will slide down toward the rear support 72 and will be supported by the support 72. This prevents the wafer W from falling to the floor of the processing block and being damaged. As described above, in this example, the drop prevention part 85 is provided, so that the wafer W is more reliably prevented from being damaged by falling.

[0069] Incidentally, when the wafer W is transported from the second lower processing block D31 to the second upper processing block D32 as described above, a liquid processing module may also be disposed in the second lower processing block D31, and the wafer W may be transported to the second upper processing block D32 after being processed in the liquid processing module. Alternatively, the heating module 54 may be provided in only one of the first lower processing block D21 and the second lower processing block D31. In that case, after the underlayer film is formed in the chemical liquid coating module 47 of the first lower processing block D21, the wafer W may be processed only once in the heating module 54, and then transported to the upper processing block G2 by the lifting and transferring mechanism 7. In addition, when the heating module 54 is provided only in the first lower processing block D21, the area in the second lower processing block D31 where the heating module 54 is provided may be used as an area in which ancillary equipment is installed.

[0070] Furthermore, the substrate processing apparatus may be configured so that each module described as being provided in the lower processing block G1 is provided in the upper processing block G2 and the lower processing block G1 described as being provided in the upper processing block G2. That is, in the substrate processing apparatus, the wafer W is transported through the upper processing block G2 as the outward route and through the lower processing block G1 as the return route, and the lifting and transferring mechanism 7 transfers the wafer W from the TRS12 to the TRS11. Therefore, the lifting and transferring mechanism 7 may be configured to transfer the wafer W from above to below. Note that the module to which the lifting and transferring mechanism 7 transfers the wafer W is not limited to the TRS, and may be configured to transfer the wafer W to, for example, the SCPL. Furthermore, the lifting and transferring mechanism 7 is not limited to being configured to transfer the wafer W to the module, and may transfer the wafer W directly to, for example, the transfer mechanisms 6B and 6D. However, performing such a transfer would likely result in a long wait time for the transport mechanisms 6B and 6D to be unable to transport the wafer W. Therefore, as described above, it is preferable that the lifting and transferring mechanism 7 performs the transfer to the module.

[0071] The substrate processing apparatus may be configured to include only the first processing block D2 without including the second processing block D3. A substrate processing apparatus 8 configured in this manner will be described with reference to the plan view of Fig. 16 and the front view of Fig. 17. In this substrate processing apparatus 8, the first processing block D2 forms an anti-reflective film and a resist film in this order on the wafer W, and the chemical coating module 48 of the first lower processing block D21 supplies the wafer W with a chemical for forming an anti-reflective film instead of a chemical for forming an underlayer film.

[0072] In this substrate processing apparatus 8, the lifting and transferring mechanism 7 and the TRS11 and TRS12 are located to the right of the rear processing section 50 so as not to interfere with the transfer of the wafer W between the module stack T1 and the transfer mechanisms 6A and 6B. In accordance with this arrangement, the ancillary equipment installation areas 91 and 92 are also provided at the right end of the first processing block D2.

[0073] In the substrate processing apparatus 8, the wafer W is transferred from the carrier block D1 to the first lower processing block D21 through the SCPL1 of the module stack T1 in the same manner as in the substrate processing apparatus 1, and then transferred in the order of the chemical coating module 48 and the heating module 54 to form an anti-reflection film. The wafer W is then transferred to the first upper processing block D22 through the TRS11, the lifting and transferring mechanism 7, and the TRS12 in order, and then transferred in the order of the SCPL provided at the height of the first upper processing block D22 in the module stack T1, the resist coating module 51, and the heating module 54 to form a resist film. Thereafter, the wafer W is returned from the carrier block D1 to the carrier C in the same manner as in the substrate processing apparatus 1. In this manner, the number of processing blocks connected to the left and right is not limited to two in the configuration of the apparatus. The positions of the lifting and transferring mechanism 7 and the TRS11 and TRS12 for the lifting and transferring mechanism 7 may be appropriately set according to the configuration of the processing blocks.

[0074] The lifting / transferring mechanism 7 is not limited to the configuration in which the support part 74 extends forward from the pivot shaft 73 as in the example described above. As shown in Fig. 18, a configuration may be adopted in which a support pillar 72 is provided near the auxiliary equipment installation area 91 on the front side of the transport area 53, a pivot shaft 73 extends in the left-right direction from the support pillar 72, and the support part 74 extends from the pivot shaft 73 toward the rear of the transport area 53. Also, in the substrate processing apparatus 8 described in Fig. 17, a configuration may be adopted in which a support pillar 72 is provided at the right end of the transport area 53, a pivot shaft 73 extends from the support pillar 72 in the front-rear direction in the transport area 53, and the support part 74 extends from the pivot shaft 73 toward the left.

[0075] 9 to 14, the support portion 74 is shown to have a first orientation in a height region (first region) near the TRS11 and a height region near the TRS12, and to have a second orientation in a region between the first region and the second region. The support portion 74 may also be oriented in the first orientation in this intermediate region as long as the wafer W is not impeded from being transported. That is, the support portion 74 is not limited to being oriented in the second orientation while ascending and descending between the TRS11 and the TRS12. In addition, if the inclination of the support surface 74A with respect to the horizontal plane in the second orientation is relatively small, the wafer W can be held by utilizing the frictional force between the support surface 74A and the back surface of the wafer W without providing the suction hole 81. In addition, a plurality of pressing mechanisms are provided in the support portion 74. Each pressing mechanism may be configured to press the wafer W from the outside of the wafer W toward the center of the wafer W, and the wafer W may be held by the support portion 74 by the action of each pressing mechanism. Therefore, the support portion 74 is not limited to a configuration in which the suction holes 81 are provided.

[0076] Although the first orientation of the support portion 74 has been described as being horizontal, it may be inclined with respect to the horizontal plane as long as it can support the wafer W. In addition, a configuration has been shown in which the wafer W is supported by contacting the upper surface of the plate-shaped support portion 74, but a member for supporting the wafer W may be provided on the upper surface of the support portion 74, and this member may face and contact the lower surface of the wafer W to support the wafer W. In that case, the member forms the support surface for the wafer W.

[0077] The liquid processing performed by the apparatus is not limited to the above-mentioned examples, and may include the formation of a coating film other than the coating film described above by coating a chemical liquid, the coating process of an adhesive for bonding wafers W together, and the cleaning process of supplying a cleaning liquid to the front or back surface of the wafer W for cleaning. In addition, a development process may be included. For example, a post-exposure cleaning process may be performed in the lower processing block G1, and then a development process may be performed in the upper processing block G2. In addition, the above-mentioned coating film may be specifically formed, for example, an insulating film or a protective film laminated on a resist film. In addition, a module other than a heating module may be disposed as a processing module provided in the rear processing unit 50. For example, a peripheral exposure module for exposing the peripheral portion of the resist film may be provided, and an inspection module having a configuration similar to that of the pre-processing inspection module 41 may be provided to inspect the surface of the wafer W after the film is formed.

[0078] The arrangement of the carrier block D1 and the processing block may be reversed, and the layout of the components of each block may be reversed. The embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The above embodiments may be omitted, substituted, modified, and combined in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0079] 7 Lifting and transferring mechanism 73 Rotating shaft 74 Support part 75 Rotating mechanism C Career D1 Carrier Block D2 First processing block D21 First lower processing block D22 First upper processing block D3 Second processing block D31 Second lower processing block D32 Second upper processing block E1~E8 layer W wafer 6A, 6B, 6C, 6D Transport mechanism

Claims

1. a processing block including a plurality of first processing modules each for processing a substrate, and a first transport mechanism shared by the plurality of first processing modules for transporting the substrate; a second transport mechanism shared by the second processing modules and configured to transport the substrate; and another processing block overlapping the first processing block; a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support portion having a support surface that faces and supports the substrate and that extends from the shaft in a direction intersecting the extension direction of the shaft, the lifting and transferring mechanism lifting and lowering the shaft and the support portion between a first position for transferring the substrate to the first transport mechanism and a second position for transferring the substrate to the second transport mechanism; a rotation mechanism that rotates the support unit around the axis so that an orientation of the support unit changes between a first orientation for transferring the substrate at each of the first position and the second position, and a second orientation in which the inclination of the support surface with respect to a horizontal plane is larger than that of the first orientation for moving between the first position and the second position; A substrate processing apparatus comprising:

2. the one processing block includes a first substrate placement part on which the substrate is placed so as to transfer the substrate to the first transport mechanism; the other processing block includes a second substrate placement part on which the substrate is placed so as to transfer the substrate to the second transport mechanism; 2. The substrate processing apparatus according to claim 1, wherein the first position and the second position are positions where the substrate is transferred to the first substrate placement part and the second substrate placement part, respectively.

3. 3 . The substrate processing apparatus according to claim 1 , wherein the second orientation is such that a base end side of the support surface, which is on the shaft side, is positioned lower than a tip end side of the support surface and is inclined with respect to a vertical plane.

4. 4. The substrate processing apparatus according to claim 3, wherein a base end side of the support portion relative to the support surface rises above the support surface to form a drop prevention portion that prevents the substrate from dropping from the base end side of the support surface.

5. 5. The substrate processing apparatus according to claim 1, wherein the support surface is provided with suction holes for sucking and holding the substrate.

6. 6. The substrate processing apparatus of claim 5, further comprising: a suction path connected to the suction hole; a pressure detection unit that detects the pressure in the suction path; and a holding abnormality detection unit that detects whether or not there is an abnormality in holding the substrate based on the detected pressure.

7. The support portion extends from the shaft to one side, either forward or backward, a first transport region in which the substrate is transported by the first transport mechanism is located on one side of the axis, i.e., forward or backward, and extends on one side of the axis, i.e., left or right, and the first processing modules are provided along a direction in which the first transport region extends; A substrate processing apparatus as described in any one of claims 1 to 6, wherein a second transport area in which the substrate is transported by the second transport mechanism is located on one side of the axis, either forward or backward, and extends to one side of the axis, and the plurality of second processing modules are each arranged along the extension direction of the second transport area.

8. 8. The substrate processing apparatus according to claim 7, wherein ancillary equipment for the first processing module or the second processing module is provided on the other side, front or rear, of the axis.

9. the one processing block is configured by one left processing block and one right processing block, each of which is provided with the plurality of first processing modules and the first transport mechanism, and which are arranged to the left and right so as to be able to transfer the substrate between the left and right processing blocks; the other processing block is configured by another left processing block and another right processing block, each of which is provided with the plurality of second processing modules and the second transport mechanism, and which are arranged to the left and right so as to be able to transfer the substrate between each other; 9. The substrate processing apparatus according to claim 1, wherein one left processing block and another left processing block overlap each other, and one right processing block and another right processing block overlap each other.

10. the plurality of first processing modules include a first coating film forming module that supplies a coating liquid to the substrate to form a first coating film, and a first heating module that heats the substrate on which the first coating film has been formed; 10. The substrate processing apparatus according to claim 1, wherein the plurality of second processing modules include a second coating film forming module that supplies a coating liquid to the substrate to form a second coating film to be laminated on the first coating film, and a second heating module that heats the substrate on which the second coating film has been formed.

11. a processing block including a plurality of first processing modules each for processing a substrate, and a first transport mechanism shared by the plurality of first processing modules for transporting the substrate; a second processing block including a second processing module that processes the substrate, the second processing module including a second transport mechanism that is shared by the second processing modules and transports the substrate, the second processing block being overlapped with the first processing block; a step of raising and lowering an elevation transfer mechanism including a shaft extending in a horizontal direction and a support portion including a support surface that faces and supports the substrate and that extends from the shaft in a direction intersecting the extension direction of the shaft, between a first position for transferring the substrate to the first transport mechanism and a second position for transferring the substrate to the second transport mechanism; rotating the support portion around the axis by a rotation mechanism; changing an orientation of the support between a first orientation for transferring the substrate at each of the first position and the second position and a second orientation having a larger inclination with respect to a horizontal plane of the support surface than the first orientation for moving between the first position and the second position; A substrate processing method comprising:

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