Apparatus and method for forming sealing resin used in compression molding

Abstract

To provide a compression molding apparatus and a compression molding method capable of preventing the occurrence of molding defects, and a forming apparatus and a forming method capable of accurately forming an appropriate amount of sealing resin.SOLUTION: A sealing resin forming apparatus 100 according to the present invention tablets a base resin Rm to form a sealing resin R to be used for compression molding of a workpiece W, and includes a tableting die 102 that accommodates the base resin Rm and tablets the sealing resin R having a predetermined shape corresponding to the shape of the workpiece W, and the tableting die 102 has a shape setting portion 101 that variably sets the shape of the sealing resin R formed by tableting.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to an apparatus and method for forming a sealing resin used in compression molding. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and a resin sealing method for sealing a workpiece having electronic components mounted on a substrate with a sealing resin and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technology in which a predetermined amount of sealing resin is supplied to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, a workpiece is placed in the sealing area, and the upper mold and lower mold are clamped to seal the workpiece with resin. As an example, when a sealing mold having a cavity in the upper mold is used, a technology is known in which the sealing resin is supplied all at once to the center position on the workpiece and molded. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technology is known in which a release film (hereinafter sometimes simply referred to as a "film") that covers the mold surface including the cavity and the sealing resin are supplied and molded (Patent Document 1: See JP 2019-145550 A). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-145550 A Summary of the Invention [Problem to be solved by the invention]

[0005] For example, when a strip-type wire-connected electronic component (semiconductor chip) is encapsulated with resin as a workpiece, the compression molding method in which a cavity is provided in the upper die has a problem that encapsulation is difficult because the wire portion of the workpiece held in the lower die comes into contact with the encapsulation resin previously supplied to the cavity or the encapsulation resin supplied onto the workpiece and deforms. Therefore, a compression molding method in which the workpiece is held in the upper die, a cavity is provided in the lower die, and encapsulation resin (granular resin, as an example) is supplied into the cavity has generally been adopted.

[0006] However, in a configuration in which a workpiece is held in the upper mold and a cavity is provided in the lower mold, when the workpiece is thin or large, there is a problem that it is difficult to hold it in the upper mold and it is easy to fall. In addition, although the sealing resin is usually supplied into the cavity of the lower mold through a film, when a thick molded product with a thickness (here, the thickness of the resin part after molding) exceeding 1 mm is attempted to be formed, the molding stroke becomes large, and there is a problem that the film is likely to be caught in the molded product, which is a molding defect. Furthermore, when a granular resin is used as the sealing resin, in addition to the problem that the film is likely to be caught in the molded product, the problem that dust is generated during molding, and the problem that handling is difficult, there is a problem that it is difficult to supply (spray) the sealing resin evenly to the entire area in the cavity provided in the lower mold, and winding unevenness is likely to occur. In addition, there is a problem that the air contained in the gaps between the particles when the sealing resin is sprayed and the gas components due to degassing from the sealing resin when melted are not released and remain in the molded product, which is a molding defect. In particular, in the case of a workpiece in which electronic components are mounted by wire connections, there is a risk of wire flow (deformation or breakage of the wire) due to the flow of resin within the cavity during resin sealing.

[0007] On the other hand, regardless of the cavity arrangement, if the workpiece to be encapsulated is missing electronic components (for example, not being mounted due to thinning out, or being lost after mounting, etc.), the total amount of resin required for encapsulation increases, which causes a shortage of resin and leads to molding defects. Conversely, if more resin than necessary is supplied, the amount of overflow increases, causing a lot of waste. Therefore, it is important to accurately form the appropriate amount of encapsulating resin for each workpiece. [Means for solving the problem]

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a molding apparatus and a molding method that accurately forms an appropriate amount of sealing resin, which is easy to handle, and can realize a compression molding apparatus and a compression molding method that solves the problems of a configuration in which a cavity is provided in an upper mold and a configuration in which a cavity is provided in a lower mold, prevents molding defects caused by resin flow, uneven winding, residual gas, and dust generation during molding, and forms molded products with large thickness dimensions.

[0009] The present invention solves the above problems by the solution means described below as one embodiment.

[0010] An apparatus for forming a sealing resin according to one embodiment is an apparatus for tableting a base resin to form a sealing resin to be used in compression molding of a workpiece, and is provided with a tableting die that accommodates the base resin and tablets the base resin to form the sealing resin having a predetermined shape corresponding to the shape of the workpiece, and the tableting die has a shape setting section that variably sets the shape of the sealing resin formed by tableting.

[0011] For example, the workpiece may be a workpiece having a configuration in which an electronic component is mounted on a substrate. Also, it is preferable that the predetermined shape of the workpiece is a shape that does not contact the electronic component when the sealing resin is placed on the substrate.

[0012] It is also preferable to provide a control calculation unit that controls the operation of the shape setting unit, and the control calculation unit calculates the required amount of resin based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the works, calculates the pressurized volume when compressing the base resin based on the calculated amount of resin and a preset compression rate, and controls the setting of the shape setting unit so as to achieve the pressurized volume.

[0013] Furthermore, it is preferable that the tableting mold has a lower mold provided with a cavity configured as a recess, and an upper mold provided with a tableting plate that tablets the base resin contained in the cavity of the lower mold, and the shape setting section has at least one of a configuration having, in the upper mold, an upper mold movable block that forms part or all of the surface that faces the bottom of the cavity on the tableting plate, and an upper mold movable mechanism that moves the upper mold movable block up and down, or a configuration having, in the lower mold, a lower mold movable block that forms part or all of the surface that faces the tableting plate at the bottom of the cavity, and a lower mold movable mechanism that moves the lower mold movable block up and down.

[0014] Furthermore, when the shape setting portion is provided in the upper mold, the upper mold movable mechanism has a first block having a first tapered surface inclined at a predetermined angle and arranged to be movable in the mold opening and closing direction, and a second block having a second tapered surface arranged to be able to abut against the first tapered surface and arranged to be movable in a direction intersecting the mold opening and closing direction, and is configured to move the second block toward and away from the first block to move the first block up and down, and it is preferable that the first block is formed integrally with the upper mold movable block, or is formed separately and connected to it.

[0015] Furthermore, when the shape setting portion is provided in the lower mold, the lower mold movable mechanism has a third block having a third tapered surface inclined at a predetermined angle and arranged to be movable in the mold opening and closing direction, and a fourth block having a fourth tapered surface arranged to be able to abut against the third tapered surface and arranged to be movable in a direction intersecting the mold opening and closing direction, and is configured to move the fourth block toward and away from the third block to move the third block up and down, and it is preferable that the third block is formed integrally with the lower mold movable block, or is formed separately and connected to it.

[0016] It is also preferable that a powder resin is used as the base resin.

[0017] Moreover, a method for forming a sealing resin according to one embodiment is a method for forming a sealing resin by tableting a base resin to form a sealing resin to be used in compression molding of a workpiece, and includes a tableting step in which the base resin is placed in a tableting die and tableted to form the sealing resin having a predetermined shape corresponding to the shape of the workpiece, and the tableting step includes a shape setting step in which the shape of the sealing resin formed by tableting is variably set.

[0018] In addition, the tableting step is preferably carried out at a temperature at which the base resin does not harden by heat, so that the formed encapsulating resin can be hardened by heat in the subsequent compression molding step. Effect of the Invention

[0019] According to the molding apparatus and the molding method of the present invention, the amount of the sealing resin to be formed can be appropriately changed and finely adjusted, so that the appropriate amount of sealing resin can be accurately formed for each workpiece. In addition, by using the sealing resin formed by the molding apparatus and the molding method, it is possible to realize a compression molding apparatus and a compression molding method that can solve the problems of a configuration in which a cavity is provided in an upper mold and a configuration in which a cavity is provided in a lower mold, prevent molding defects caused by resin flow, uneven winding, residual gas, and dust generation during molding, and form a molded product with a large thickness. In addition, handling is easier than granular resin, especially when supplying or setting. Furthermore, as another effect, when the workpiece has a protruding portion, the shape of the sealing resin can be controlled so that the position corresponding to the portion becomes a space. [Brief description of the drawings]

[0020] [Figure 1] 1 is a plan view showing an example of a compression molding apparatus in which a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention is used. [Diagram 2] 1A to 1C are explanatory diagrams illustrating an example of a compression molding method in which a sealing resin formed by the forming apparatus and forming method according to an embodiment of the present invention is used. [Diagram 3] Fig. 3A is an enlarged view of part III in Fig. 2. Fig. 3B is an explanatory view following Fig. 3A. [Figure 4] FIG. 3B is an explanatory diagram following FIG. 3B. [Diagram 5] FIG. 5 is an explanatory diagram following FIG. [Figure 6] 11A to 11C are explanatory diagrams illustrating another example of a compression molding method in which a sealing resin formed by the forming apparatus and forming method according to an embodiment of the present invention is used. [Figure 7] FIG. 7 is an explanatory diagram following FIG. [Figure 8] FIG. 8 is an explanatory diagram following FIG. [Figure 9] 1 is a side view illustrating an example of an apparatus for forming a sealing resin according to an embodiment of the present invention. [Figure 10]FIG. 10 is a front cross-sectional view showing an example of a tableting die of the forming apparatus shown in FIG. [Figure 11] FIG. 10 is a front cross-sectional view showing an example of a tableting die of the forming apparatus shown in FIG. [Figure 12] FIG. 11 is a front cross-sectional view showing an example of a sealing resin formed by the tableting die shown in FIG. [Figure 13] FIG. 12 is a front cross-sectional view showing an example of a sealing resin formed by the tableting die shown in FIG. [Figure 14] FIG. 10 is a front sectional view showing another example of the tableting die of the forming apparatus shown in FIG. [Figure 15] FIG. 10 is a front sectional view showing another example of the tableting die of the forming apparatus shown in FIG. [Figure 16] FIG. 10 is a front sectional view showing another example of the tableting die of the forming apparatus shown in FIG. [Figure 17] FIG. 15 is a front cross-sectional view showing an example of a sealing resin formed by the tableting die shown in FIG. [Figure 18] FIG. 16 is a front cross-sectional view showing an example of a sealing resin formed by the tableting die shown in FIG. [Figure 19] FIG. 17 is a front cross-sectional view showing an example of a sealing resin formed by the tableting die shown in FIG. [Figure 20] FIG. 10 is a front sectional view showing another example of the tableting die of the forming apparatus shown in FIG. [Figure 21] FIG. 10 is a front sectional view showing another example of the tableting die of the forming apparatus shown in FIG. [Figure 22] 5A to 5C are explanatory diagrams of a method for forming a sealing resin according to an embodiment of the present invention. [Figure 23] FIG. 23 is an explanatory diagram following FIG. 22. [Figure 24] FIG. 24 is an explanatory diagram following FIG. 23. [Diagram 25] 1 is a perspective view showing an example of a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention; [Figure 26] 11 is a perspective view showing another example of a sealing resin formed by the forming apparatus and forming method according to the embodiment of the present invention. FIG. [Figure 27]11 is a perspective view showing another example of a sealing resin formed by the forming apparatus and forming method according to the embodiment of the present invention. FIG. [Figure 28] 11 is a perspective view showing another example of a sealing resin formed by the forming apparatus and forming method according to the embodiment of the present invention. FIG. [Figure 29] FIG. 1 is an explanatory diagram of a conventional compression molding method. [Diagram 30] FIG. 1 is an explanatory diagram of a conventional compression molding method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] (Compression molding device and compression molding method) The sealing resin forming apparatus 100 and forming method according to the embodiment of the present invention are an apparatus and method for forming sealing resin R used in compression molding of a workpiece W. First, an outline of a compression molding apparatus 1 and a compression molding method for resin sealing (compression molding) a workpiece W using the sealing resin R will be described. Here, FIG. 1 is a plan view (schematic diagram) showing an example of a compression molding apparatus 1. For convenience of explanation, arrows may be used in the figure to indicate the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction). In addition, in all the figures for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0022] The workpiece W to be sealed has a configuration in which electronic components Wb are mounted on a substrate Wa. More specifically, examples of the substrate Wa include plate-shaped members such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer. Examples of the electronic components Wb include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, and a spacer. The shape of the substrate Wa is a rectangular shape (striped shape), a square shape, a circular shape, and the like. The number of electronic components Wb mounted on one substrate Wa is set to one or more (for example, in a matrix shape, etc.).

[0023] Examples of methods for mounting the electronic components Wb on the substrate Wa include wire bonding mounting, flip chip mounting, etc. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, there is also a method in which the electronic components Wb are attached using a thermally peelable adhesive tape or an ultraviolet-curable resin that is cured by exposure to ultraviolet light.

[0024] As examples of the film F, a film material having excellent heat resistance, peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, etc. are preferably used. The film F is also used when forming the sealing resin R in the forming device 100 described later.

[0025] As shown in Fig. 1, the compression molding apparatus 1 mainly comprises a supply unit 10A for supplying the workpiece W, a press unit 10B for sealing the workpiece W with resin and processing it into a molded product Wp, and a storage unit 10C for storing the molded product Wp. As an example, the supply unit 10A, the press unit 10B, and the storage unit 10C are arranged in this order along the X direction in Fig. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units (particularly the number of press units), the arrangement order of the units, and the like can be changed. Also, a configuration including units other than those described above (all not shown) is possible.

[0026] In addition, in the compression molding apparatus 1, a guide rail 20 is provided linearly across each unit, and a transport device (first loader) 22 for transporting the workpiece W and the sealing resin R, and a transport device (second loader) 24 for transporting the molded product Wp (which may be used to transport the sealing resin R) are provided so as to be movable between predetermined units along the guide rail 20. However, the configuration is not limited to the above, and a configuration may be provided with a common (single) transport device (loader) for transporting the workpiece W, the sealing resin R, and the molded product Wp (not shown). Also, the transport device may be configured to include a robot hand or the like instead of a loader.

[0027] In addition, in the compression molding apparatus 1, a control unit 30 that controls the operation of each mechanism in each unit is disposed in the supply unit 10A (it may be disposed in another unit).

[0028] The press unit 10B includes a pair of sealing dies that are opened and closed by a press device 250. As one example, the sealing dies may have a configuration in which a cavity is provided in an upper die (sealing die 202), and as another example, may have a configuration in which a cavity is provided in a lower die (sealing die 302).

[0029] As an example, steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing mold 202 will be described with reference to Fig. 2 to Fig. 5. In this case, the press device 250 is provided with a film supply unit 211 that supplies a film F for covering a mold surface 204a (predetermined area) including the inner surface of the cavity 208 in the upper mold 204. Incidentally, as an example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0030] First, a preparation step (sealing preparation step) is performed. Specifically, a step of adjusting and heating the upper mold 204 and the lower mold 206 to a predetermined temperature (for example, 100°C to 300°C) is performed. Also, a step of operating the film supply unit 211 to supply new film F and adsorb it to cover a predetermined area of ​​the mold surface 204a including the inner surface of the cavity 208 in the upper mold 204 is performed.

[0031] After the preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 205 of the lower die 206. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and carried into the sealing die 202, and is held by the workpiece holding portion 205 of the lower plate 242 (die surface 206a).

[0032] After the workpiece holding step, a resin placing step is performed in which the sealing resin R is placed on the workpiece W held by the workpiece holding part 205 (see FIG. 2). Specifically, the sealing resin R formed in a sealing resin forming device (which may simply be referred to as a "forming device") 100 described below is held by a first loader 22 (or another conveying device) and carried into the sealing die 202, and placed on the workpiece W held by the workpiece holding part 205.

[0033] Alternatively, as another example of the resin placing step, the sealing resin R formed in the forming apparatus 100 may be placed on the workpiece W before the above-described workpiece holding step. In this case, the workpiece holding step is a step of holding the workpiece W with the sealing resin R placed thereon in the workpiece holding section 205. That is, the first loader 22 holds the workpiece W with the sealing resin R placed thereon, carries it into the sealing die 202, and holds it in the workpiece holding section 205. This has the advantage of performing the workpiece W and the sealing resin R in the sealing die 202 at once, rather than separately.

[0034] Next, a resin sealing step is performed in which the workpiece W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is relatively lowered in the cavity 208 surrounded by the clamper 228 to perform the mold closing step in which the sealing resin R is heated and pressurized against the workpiece W. Note that Fig. 3A is an enlarged view of part III in Fig. 2, and in the mold closing step, the sealing resin R softens and melts to change from the state in Fig. 3A to the state in Fig. 3B.

[0035] This causes the sealing resin R to thermally harden, completing the resin sealing (compression molding) (see FIG. 4).

[0036] The steps following the above mold closing step are the same as those in the conventional compression molding method. In summary, a mold opening step is performed in which the sealing mold 202 is opened and the molded product Wp and the used film F are separated so that the molded product Wp can be removed (see FIG. 5). Next, a molded product carrying-out step is performed in which the second loader 24 carries the molded product Wp out of the sealing mold 202 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product carrying-out step, a step is performed in which the film supply unit 211 is operated to send out the used film F from the sealing mold 202 and send a new film F into the sealing mold 202 and set it therein.

[0037] The above are the main steps of the compression molding method performed using the compression molding apparatus 1 when the sealing mold 202 is provided. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0038] As another example, steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing mold 302 will be described with reference to Figs. 6 to 8. In this case, the press device 250 is provided with a film supply unit 311 that supplies a film F for covering a mold surface 306a (predetermined area) including the inner surface of a cavity 308 in a lower mold 306. Note that, as one example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0039] First, a preparation step (sealing preparation step) is performed. Specifically, a step of adjusting and heating upper mold 304 and lower mold 306 to a predetermined temperature (for example, 100°C to 300°C) is performed. Also, a step of operating film supply unit 311 to supply new film F and adsorb it to cover a predetermined area of ​​mold surface 306a including the inner surface of cavity 308 in lower mold 306 is performed.

[0040] After the preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 305 of the upper die 304. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and carried into the sealing die 302, and is held by the workpiece holding portion 305 of the upper plate 342 (die surface 304a).

[0041] After the workpiece holding step, a resin holding step is performed (it may be performed before the workpiece holding step or in parallel). The resin holding step includes the following steps: The sealing resin R is held in the cavity 308 of the lower die 306 (see FIG. 6). Specifically, the sealing resin R formed in the forming device 100 is held by the first loader 22 (or another conveying device) and carried into the sealing die 302, and is housed in the cavity 308 (specifically, it is placed on the upper surface of the cavity piece 326).

[0042] Next, a resin sealing process is performed in which the workpiece W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is relatively raised in the cavity 308 surrounded by the clamper 328 to perform the mold closing process in which the sealing resin R is heated and pressurized against the workpiece W. This thermally hardens the sealing resin R, completing the resin sealing (compression molding) (see FIG. 7).

[0043] The steps following the above mold closing step are the same as those in the conventional compression molding method. In summary, a mold opening step is performed in which the sealing mold 302 is opened and the molded product Wp and the used film F are separated so that the molded product Wp can be removed (see FIG. 8). Next, a molded product carrying-out step is performed in which the second loader 24 carries the molded product Wp out of the sealing mold 302 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product carrying-out step, a step is performed in which the film supply unit 311 is operated to send out the used film F from the sealing mold 302 and send a new film F into the sealing mold 302 and set it therein.

[0044] The above are the main steps of the compression molding method performed using the compression molding apparatus 1 when the sealing mold 302 is provided. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

[0045] (Sealing resin forming device) Next, the forming apparatus 100 for forming the sealing resin R used in the compression molding apparatus 1 and the compression molding method will be described with reference to Figs. 9 to 11. The forming apparatus 100 processes the base resin Rm to form the sealing resin R. Here, Fig. 9 is a side view (schematic view) showing an example of the forming apparatus 100. The forming apparatus 100 may be provided either inside or outside the compression molding apparatus 1.

[0046] In this embodiment, a thermosetting resin (for example, an epoxy resin containing a filler, but not limited thereto) is used as the base resin Rm and the sealing resin R formed from the base resin Rm. The sealing resin R is formed as a solid or semi-solid resin having a predetermined shape (details will be described later) that corresponds to the shape of the workpiece W. Usually, one piece constitutes the "whole" of the required amount of sealing (one time per workpiece W), but it may be configured so that several pieces (for example, about two or three pieces) are divided to constitute the "whole" of the required amount of sealing. In addition, the above-mentioned "semi-solid" does not mean a completely solid state, but a state melted to the so-called B stage. In addition, a powder resin (form) that is a thermosetting resin (property) is preferably used as the base resin Rm. However, it is not limited thereto, and a granular resin, a crushed resin, a solid resin, a liquid resin, or a resin that is a combination of a plurality of them may be used.

[0047] As shown in FIG. 9, the forming apparatus 100 is provided with a tableting die 102 having a pair of dies (for example, a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel are assembled) that are opened and closed. The forming apparatus 100 is also provided with a press device 150 that drives the tableting die 102 to open and close. The forming apparatus 100 is also provided with a control calculation unit 170 that performs operation control of each mechanism. Here, FIG. 10 (and FIG. 11 for explaining the operation) is a front cross-sectional view (schematic view) showing an example of the tableting die 102. Also, FIG. 14 (and FIG. 15 and FIG. 16 for explaining the operation) is a front cross-sectional view (schematic view) showing another example of the tableting die 102. Also, FIG. 20 (and FIG. 21 for explaining the operation) is a front cross-sectional view (schematic view) showing another example of the tableting die 102.

[0048] As shown in FIG. 9, the press machine 150 includes a pair of platens 154, 156, a plurality of tie bars 152 on which the pair of platens 154, 156 are supported, and a drive device for moving (raising and lowering) the platen 156. Specifically, the drive device includes a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 162 (however, the present invention is not limited to this). In this embodiment, the platen 154 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 152), and the platen 156 on the lower side is set as a movable platen (a platen slidably held by the tie bars 152 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, i.e., the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0049] On the other hand, as shown in Figs. 10 and 11, the tableting die 102 includes an upper die 104 on the upper side in the vertical direction and a lower die 106 on the lower side as a pair of dies disposed between the pair of platens 154, 156 in the press device 150. The upper die 104 is assembled to the upper platen (in this embodiment, the fixed platen 154), and the lower die 106 is assembled to the lower platen (in this embodiment, the movable platen 156). The upper die 104 and the lower die 106 approach and move away from each other to close and open the die (the vertical direction (up and down direction) is the die opening and closing direction). In the tableting die 102 according to this embodiment, the upper die 104 constitutes a so-called "punch die", and the lower die 106 constitutes a so-called "mortar die".

[0050] Next, the basic configuration of the lower die 106 of the tableting die 102 will be described. As shown in Figures 10 and 11, the lower die 106 is equipped with a lower die chase 110, a cavity piece 126 held thereby, a clamper 128, etc. The lower die chase 110 is fixed to the upper surface of a support plate 114 via a support pillar 112. A cavity 108 is provided on the upper surface of the lower die 106 (the surface on the upper die 104 side). A predetermined amount of base resin Rm is accommodated in this cavity 108.

[0051] The clamper 128 is configured in an annular shape so as to surround the cavity piece 126, and is assembled to be movable up and down while being spaced apart (floating) from the upper surface of the support plate 114 via the pushing pin 122 and the clamper spring 124 (a biasing member exemplified by a coil spring, for example) (however, the assembly structure is not limited to this). The cavity piece 126 constitutes the inner part (bottom part) of the cavity 108, and the clamper 128 constitutes the side part of the cavity 108. The shape and number of cavities 108 provided in one lower mold 106 are set appropriately (one or multiple).

[0052] Here, the press device 150 is provided with a lower die film supplying section 111 that supplies a film F for covering the die surface 106a (predetermined area) including the inner surface of the cavity 108 in the lower die 106. Note that, as an example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0053] Furthermore, the lower mold 106 is provided with suction paths (holes, grooves, etc.) (not shown) communicating with a suction device on the upper surface of the clamper 128, on the boundary between the clamper 128 and the cavity piece 126, etc. This allows the film F supplied from the lower mold film supply unit 111 to be adsorbed and held on the mold surface 106a including the inner surface of the cavity 108.

[0054] In this embodiment, a lower die heating mechanism (not shown) is provided for heating the lower die 106 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control and calculation unit 170. As an example, the heater is built into the lower die chase 110 and configured to apply heat to the entire lower die 106 and the base resin Rm contained in the cavity 108. At this time, the lower die 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the base resin Rm does not thermally cure (mainly cure).

[0055] Incidentally, the lower mold 106 described above has a structure including a movable clamper (clamper 128) as an example, but may have a structure not including a movable clamper as another example (not shown).

[0056] Next, the basic configuration of the upper die 104 of the tableting die 102 will be described. As shown in Fig. 10 and Fig. 11, the upper die 104 is equipped with a tableting plate 142 that presses a predetermined amount of base resin Rm contained in a cavity 108 of the lower die 106 to form (compress) the sealing resin R having a predetermined shape corresponding to the shape of the workpiece W (details of the forming method will be described later). The tableting plate 142 is held (fixed) by an upper die chase 140. As an example, a leg forming groove (including a recess) 143 for forming the leg Rb of the sealing resin R is provided on the lower surface (surface on the lower die 106 side) of the tableting plate 142.

[0057] Here, the press device 150 is provided with an upper die film supplying section 113 that supplies a film F for covering the die surface 104a (predetermined area) of the upper die 104. Note that, as an example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0058] Furthermore, the upper die 104 is provided with suction paths (holes, grooves, etc.) (not shown) communicating with a suction device on the tableting plate 142, etc. This allows the film F supplied from the upper die film supply unit 113 to be adsorbed and held on the die surface 104a.

[0059] In this embodiment, an upper die heating mechanism (not shown) is provided for heating the upper die 104 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control calculation unit 170. As an example, the heater is built into the upper die chase 140 and configured to apply heat to the entire upper die 104. At this time, the upper die 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the base resin Rm held (contained) in the lower die 106 is not thermally cured (mainly cured).

[0060] Next, the tableting die 102 according to this embodiment is characterized by having a shape setting unit 101 that variably sets the shape of the sealing resin R formed by tableting. The shape setting unit 101 is provided in at least one of the upper die 104 and the lower die 106. The operation of the shape setting unit 101 is controlled by a control calculation unit 170.

[0061] An example of the configuration in the case where the shape setting section 101 is provided in the upper mold 104 is shown below (however, the present invention is not limited to this configuration). As an example, as shown in Fig. 10 and Fig. 11, the shape setting section 101 is provided with an upper mold movable block 115 that forms part or all of the lower surface of the tabletting plate 142 and faces the bottom (cavity piece 126 in this embodiment) of the cavity 108 of the lower mold 106 (facing the bottom with both the upper film F and the lower film F interposed therebetween). Furthermore, it is provided with an upper mold movable mechanism 116 that moves the upper mold movable block 115 up and down.

[0062] The upper mold movable mechanism 116 includes a first block 131 having a first tapered surface 131a inclined at a predetermined angle (approximately greater than 0° and less than 30° with respect to a horizontal plane) and provided so as to be movable in the mold opening / closing direction, and a second block 132 having a second tapered surface 132a arranged to be able to abut (slide) against the first tapered surface 131a and provided so as to be movable in a direction intersecting the mold opening / closing direction. The upper mold movable mechanism 116 also includes a biasing member (e.g., a coil spring) 135 for constantly abutting them. As an example, a known linear motion mechanism provided with a servo motor, a ball screw, or the like is used for the moving mechanism of the second block 132. However, the present invention is not limited to the above configuration.

[0063] As one example, the upper die movable mechanism 116 is configured by forming the first block 131 and the upper die movable block 115 separately and connecting them to each other. As another example, the first block 131 and the upper die movable block 115 may be configured by being integrally formed (an integrated shape machined from a single member).

[0064] According to this configuration, by operating the shape setting unit 101 and moving the second block 132 toward or away from the first block 131 (moving in the X direction), the first block 131 can be moved up and down (moving in the Z direction). Therefore, the upper mold movable block 115 connected to (or formed integrally with) the first block 131 can be moved up and down (moving in the Z direction).

[0065] As an example, the tableting die 102 shown in Figs. 10 and 11 is an example in which the upper die movable block 115 constitutes the bottom surface of the leg forming groove 143 as a part of the lower surface of the tableting plate 142. In this example, the first block 131 and the upper die movable block 115 are formed separately and connected. As shown in Fig. 10, when the second block 132 is moved forward in a direction approaching the first block 131, the first block 131 and the upper die movable block 115 are lowered (in this configuration, the shape of the sealing resin R formed by tableting is shown in Fig. 12). Also, as shown in Fig. 11, when the second block 132 is moved backward in a direction away from the first block 131, the first block 131 and the upper die movable block 115 are raised (in this configuration, the shape of the sealing resin R formed by tableting is shown in Fig. 13). In this way, the position of the bottom surface of the leg forming groove 143 (i.e., the depth) can be changed by moving the upper die movable block 115 up and down. This allows the height shape of the sealing resin R (legs Rb in this example) to be changed. In other words, even if the height of only the electronic component Wb differs, this can be accommodated by changing the height of the legs Rb, and by changing the amount of resin supplied to the cavity 108, sealing resin R set to a different resin amount (total amount) can be formed. Note that details of the operation control of the shape setting unit 101 performed by the control calculation unit 170 when setting the shape of the sealing resin R will be described later. Furthermore, the leg forming grooves 143 may be actively moved in a pushing direction after resin sealing to be used for demolding after resin sealing.

[0066] As a modified example, the tableting die 102 shown in Figs. 14 to 16 is an example in which the upper die movable block 115 constitutes a part of the lower surface of the tableting plate 142 that is not the bottom surface of the leg forming groove 143 (for example, the center part of the lower surface of the tableting plate 142). In this example, the first block 131 and the upper die movable block 115 are integrally formed. As shown in Fig. 14, when the second block 132 is in a neutral position (an intermediate position between approach and separation) with respect to the first block 131, the lower surface of the tableting plate 142 becomes flat without unevenness (the shape of the sealing resin R formed by tableting in this configuration is shown in Fig. 17). Also, as shown in Fig. 15, when the second block 132 is moved forward from the neutral position in a direction approaching the first block 131, the first block 131 and the upper die movable block 115 descend (the shape of the sealing resin R formed by tableting in this configuration is shown in Fig. 18). Also, as shown in FIG. 16, when the second block 132 is moved backward from the neutral position in a direction away from the first block 131, the first block 131 and the upper die movable block 115 rise (the shape of the sealing resin R formed by tableting in this configuration is shown in FIG. 19). In this way, by moving the upper die movable block 115 up and down, the position of the center of the lower surface of the tableting plate 142 (i.e., the height of the convex part or the depth of the concave part) can be changed. This makes it possible to change the shape of the sealing resin R (in this example, the main body part Ra). This may be provided only at the location of the electronic component Wb that has a partially different height. In other words, it is possible to form sealing resin R set to a different resin amount (total amount).

[0067] Next, a configuration example in which the shape setting unit 101 is provided in the lower mold 106 will be described below (however, the present invention is not limited to this configuration). As an example, as shown in Fig. 20 and Fig. 21, the shape setting unit 101 is provided with a lower mold movable block 117 that faces the lower surface of the tabletting plate 142 of the upper mold 104 (facing the lower surface with both the upper film F and the lower film F interposed therebetween) and forms a part or the entire upper surface of the bottom of the cavity 108 (cavity piece 126 in this embodiment). Furthermore, it is provided with a lower mold movable mechanism 118 that moves the lower mold movable block 117 up and down.

[0068] The lower die movable mechanism 118 includes a third block 133 having a third tapered surface 133a inclined at a predetermined angle (approximately greater than 0° and less than 30° with respect to the horizontal plane) and provided so as to be movable in the die opening / closing direction, and a fourth block 134 having a fourth tapered surface 134a arranged to be able to abut (slide) against the third tapered surface 133a and provided so as to be movable in a direction intersecting the die opening / closing direction. The lower die movable mechanism 118 also includes a biasing member (e.g., a coil spring) 136 for constantly abutting them. As an example, a known linear motion mechanism including a servo motor, a ball screw, etc. is used as the moving mechanism of the fourth block 134. However, the above configuration is not limited to the above. Although the cavity piece 126 appears to be floating in FIG. 20, it is actually fixed to the lower die chase 110.

[0069] As one example, the lower die movable mechanism 118 is configured by forming the third block 133 and the lower die movable block 117 separately and connecting them to each other. As another example, the third block 133 and the lower die movable block 117 may be configured by being integrally formed (an integrated shape machined from a single member).

[0070] According to this configuration, by operating the shape setting unit 101 and moving the fourth block 134 toward or away from the third block 133 (moving in the X direction), it is possible to move the third block 133 up and down (moving in the Z direction). Therefore, it is possible to move the lower mold movable block 117 connected to (or formed integrally with) the third block 133 up and down (moving in the Z direction).

[0071] As an example, the tableting mold 102 shown in FIG. 20 and FIG. 21 is an example in which the lower die movable block 117 constitutes the bottom surface of the leg forming groove 143 as a part of the upper surface of the bottom of the cavity 108. In this example, the third block 133 and the lower die movable block 117 are formed separately and connected. As shown in FIG. 20, when the fourth block 134 is moved forward in a direction approaching the third block 133, the third block 133 and the lower die movable block 117 rise (in this configuration, the shape of the sealing resin R formed by tableting is the same as the above example (FIG. 12), so it is omitted from the illustration). On the other hand, as shown in FIG. 21, when the fourth block 134 is moved backward in a direction away from the third block 133, the third block 133 and the lower die movable block 117 descend (in this configuration, the shape of the sealing resin R formed by tableting is the same as the above example (FIG. 13), so it is omitted from the illustration). In this way, by moving the lower die movable block 117 up and down, the position of the bottom surface of the leg forming groove 143 (i.e., the depth) can be changed. This makes it possible to change the shape of the sealing resin R (the leg Rb in this example). In other words, it is possible to form sealing resin R with different resin amounts (total amounts).

[0072] As a modified example, the lower mold movable block 117 may form a portion of the upper surface of the bottom of the cavity 108 that is not the bottom surface of the leg forming groove 143 (for example, the center of the upper surface of the bottom of the cavity 108). In this case, the configuration of the shape setting portion 101 is the same as in the above-mentioned example (FIGS. 14 to 16) (the up-down direction is reversed), and the shape of the formed sealing resin R is the same as in the above-mentioned example (FIGS. 17 to 19), so illustration is omitted.

[0073] (Method of forming sealing resin) Next, steps of the method for forming the sealing resin according to this embodiment, which is carried out using the above-mentioned forming apparatus 100, will be described. Here, Fig. 22 to Fig. 24 are explanatory views of each step, and are illustrated as front cross-sectional views in the same direction as Fig. 10. Note that, although the case where the tableting die 102 shown in Fig. 10 is used will be described as a representative example, the same applies when the tableting die 102 shown in Fig. 14, Fig. 20, etc. is used.

[0074] First, a preparation step (tabletting preparation step) is performed. The preparation step includes the following steps. A lower mold heating step is performed in which the lower mold 106 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) and heated by the lower mold heating mechanism. In addition, an upper mold heating step is performed in which the upper mold 104 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) and heated by the upper mold heating mechanism. In addition, a lower mold film supplying step is performed in which the lower mold film supplying unit 111 is operated to supply a new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 106a including the inner surface of the cavity 108 in the lower mold 106. In addition, an upper mold film supplying step is performed in which the upper mold film supplying unit 113 is operated to supply a new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 104a of the upper mold 104.

[0075] After the preparation step, a tableting step is carried out in which the base resin Rm is tableted to form a solid or semi-solid resin having a "predetermined shape" (details will be described later) as the encapsulating resin R, the entire shape of which corresponds to the shape of the workpiece W. Specifically, the tableting step is a step of variably setting the shape of the encapsulating resin formed by tableting (shape setting step) (details will be described later). Next, a step of storing the amount of base resin Rm supplied corresponding to the setting in the shape setting step in the cavity 108 of the lower die 106 by a dispenser, a conveying device, etc. (not shown) is carried out (see FIG. 22). Next, a step of closing the tableting die 102 heated to the above-mentioned predetermined temperature by operating the press device 150 is carried out (die closing step) (see FIG. 23). At this time, the cavity piece 126 rises relatively in the cavity 108, and the base resin Rm is tableted (sandwiched and pressurized) between the cavity piece 126 and the tableting plate 142. This forms a solid or semi-solid sealing resin R having a predetermined shape and not yet thermally cured (mainly cured). At this time, the base resin Rm entering the leg forming groove 143 of the tabletting plate 142 through the film F becomes the leg Rb of the sealing resin R, and the other (remaining) base resin Rm becomes the main body Ra of the sealing resin R (the detailed configuration of the sealing resin R will be described later). As a modified example of the tabletting process, a part of the base resin Rm may be held (welded, gripped, etc.) by the upper die 104 (not shown).

[0076] In the shape setting process, the control calculation unit 170 acquires data on the number of electronic components Wb mounted on one base material Wa (the number of mounted components or the number of missing components, which may further include measuring the height of each electronic component Wb and measuring the thickness of the base material Wa and the weight of the workpiece W) measured by a measuring mechanism or the like (not shown) for each workpiece W to be sealed. Next, the control calculation unit 170 calculates the amount of resin (in grams) required for resin sealing (compression molding) for each workpiece W based on the measurement data. Next, the control calculation unit 170 calculates the pressurized volume when pressurizing the base resin Rm based on the calculated amount of resin and the compression rate set in advance according to the type of workpiece W and base resin Rm. Next, the control calculation unit 170 determines the supply amount of base resin Rm and sets the shape setting unit 101 to achieve the pressurized volume.

[0077] The above-mentioned measuring mechanism and the like (not shown) may be configured to be disposed inside the present apparatus (sealing resin forming apparatus 100), or may be configured to be disposed outside the present apparatus and transmit the above-mentioned measurement data to the control and calculation unit 170 of the present apparatus. The measurement method is also not particularly limited, and as an example, the weight of the workpiece W is measured to calculate the number of electronic components Wb present or absent. As another example, the electronic component mounting surface of the substrate Wa may be imaged, and the number of electronic components Wb present or absent may be calculated by image processing.

[0078] The method in which the control calculation unit 170 sets the shape setting unit 101 is as described above. That is, when the shape setting unit 101 is provided in the upper mold 104, the drive source (a servo motor, for example) of the upper mold movable mechanism 116 is driven to move the second block 132 to vertically move the first block 131 in sliding contact therewith and the upper mold movable block 115 connected to or integral with the first block 131. This changes (sets) the pressurized volume in the cavity 108, i.e., the pressurized volume of the base resin Rm accommodated and pressurized in the cavity 108.

[0079] Specifically, as described above, by moving the second block 132 forward in a direction approaching the first block 131, the first block 131 and the upper die movable block 115 descend, so that the pressurized volume of the cavity 108 (the pressurized volume of the base resin Rm contained and pressurized) can be reduced (see FIG. 10). Conversely, by moving the second block 132 backward in a direction away from the first block 131, the first block 131 and the upper die movable block 115 rise, so that the pressurized volume of the cavity 108 (the pressurized volume of the base resin Rm contained and pressurized) can be increased (see FIG. 11).

[0080] On the other hand, when the shape setting part 101 is provided in the lower mold 106, the drive source (a servo motor, for example) of the lower mold movable mechanism 118 is driven to move the fourth block 134 to vertically move the third block 133 in sliding contact therewith and the lower mold movable block 117 connected to or integral with the third block 133. This changes (sets) the pressurized volume in the cavity 108, i.e., the pressurized volume of the base resin Rm contained in the cavity 108 and pressurized.

[0081] Specifically, as described above, by moving the fourth block 134 forward in a direction approaching the third block 133, the third block 133 and the lower die movable block 117 rise, so that the pressurized volume of the cavity 108 (the pressurized volume of the base resin Rm contained and pressurized) can be reduced (see FIG. 20). Conversely, by moving the fourth block 134 backward in a direction away from the third block 133, the third block 133 and the lower die movable block 117 descend, so that the pressurized volume of the cavity 108 (the pressurized volume of the base resin Rm contained and pressurized) can be increased (see FIG. 21).

[0082] Through the above steps, an appropriate amount of base resin Rm can be supplied to the workpiece W. Therefore, in particular, molding defects caused by a shortage of the amount of resin required during resin sealing can be prevented. Furthermore, waste caused by supplying an excessive amount of resin can be prevented.

[0083] It is important that the mold closing step is performed at a temperature at which the base resin Rm does not thermally harden (mainly harden) (the lower mold 106 and the upper mold 104 are heated to a temperature at which the base resin Rm does not thermally harden (mainly harden)) so that the formed sealing resin R can be thermally hardened (mainly hardened) in the subsequent resin sealing step (a step of the compression molding method). As described above, the "temperature at which the base resin Rm does not thermally harden (mainly harden)" depends on the material of the base resin Rm, but specifically, it is about 50°C to 80°C (about 70°C in this embodiment).

[0084] Here, the "predetermined shape" of the sealing resin R will be described. As an example, in the case of the sealing resin R used in the compression molding apparatus 1 when the sealing mold 202 is provided, the "predetermined shape" is a shape that does not come into contact with the electronic component Wb (including the wire in the case of the electronic component Wb having a wire) when placed on the base material Wa of the work W. As an example, as shown in FIG. 2, the sealing resin R is preferably provided with a plate-shaped or block-shaped main body Ra and legs Rb that are intermittently (or continuously) erected on one surface of the main body Ra (the surface facing the electronic component Wb of the work W) (however, the shape is not limited to this). The main body Ra is a size that fits into the cavity 208 in a plan view, and considering the resin flow, a size that is slightly smaller than the shape of the cavity 208 (particularly the cavity piece 226) is preferable. In addition, the legs Rb need to have a height H (see FIG. 3A) that does not come into contact with the electronic component Wb, but this does not exclude contact to the extent that the wire does not undergo plastic deformation. The legs Rb are arranged at a position where they do not contact the electronic components Wb in a plan view of the main body Ra, and where the main body Ra will not tilt when placed on the base material Wa of the work W. Furthermore, it is preferable that the legs Rb are arranged between the electronic components Wb or at the outer periphery of the electronic components Wb so as not to damage the wiring (particularly the wires) of the work W even a little during molding. The total amount of resin of the plate-shaped or block-shaped main body Ra and the legs Rb may be just the right amount or may be a large amount of resin as long as it is sufficient for one compression molding. Details of specific configuration examples of the sealing resin R (FIGS. 25 to 28) will be described later.

[0085] As another example, in the case of the sealing resin R used in the compression molding apparatus 1 when the sealing die 302 is provided, the "predetermined shape" is a shape in which, when the upper die 304 is gradually approached to the lower die 306 during the closing of the sealing die 302, the tip (upper end) of the leg Rb of the sealing resin R contained in the cavity 308 comes into contact with the base material Wa of the work W held by the work holding part 305, and the main body Ra of the sealing resin R does not come into contact with the electronic component Wb of the work W (the electronic component Wb having a wire includes the wire). Note that the specific shape of the sealing resin R is the same as that of the sealing resin R used in the compression molding apparatus 1 when the sealing die 202 is provided (see Figs. 25 to 28), and therefore repeated explanation will be omitted. However, the sealing resin R is not limited to the configuration shown in Figs. 25 to 28, and may have a configuration in which the upper surface is formed flat without providing the leg Rb on the upper surface (not shown).

[0086] In addition, it is preferable to use a powder resin as the base resin Rm. This allows the amount of resin to be supplied to be adjusted very accurately compared to when a granular resin or a crushed resin is used. However, the base resin Rm is not limited to a powder resin.

[0087] After the tableting step, a mold opening step is performed in which the tableting mold 102 is opened and the sealing resin R and the used film F are separated to enable removal of the sealing resin R (see FIG. 24). In this embodiment, by providing the lower mold film supplying step and upper mold film supplying step described above, the film F is disposed on both the mold surface 106a of the lower mold 106 and the mold surface 104a of the upper mold 104, so that the sealing resin R formed by tableting can be easily released and damage due to adhesion of the resin to the mold can be prevented.

[0088] After or in parallel with the mold opening process, the lower mold film supply unit 111 and the upper mold film supply unit 113 are operated to send out the used film F from within the tableting mold 102 and to send and set a new film F into the tableting mold 102, thereby carrying out a film supply process (lower mold film supply process, upper mold film supply process).

[0089] (Sealing resin) Next, specific configuration examples of the sealing resin R formed by the above-mentioned forming apparatus 100 and forming method are shown in Figs. 25 to 28, and the features of each will be described.

[0090] First, as a configuration common to each example shown in FIG. 25 to FIG. 28, the main body part Ra is formed in a plate shape (it may be a shape other than a plate shape, for example, a block shape having a concave part or a convex part). In addition, the leg part Rb is erected on the main body part Ra so that it is in a position that does not abut against the electronic component Wb of the work W when the sealing resin R is placed at a predetermined position (a design set position) on the substrate Wa of the work W, and is formed at a height H (see FIG. 3A, etc.) that ensures a distance at which the main body part Ra does not abut against the electronic component Wb. As described above, in the tableting process, the base resin Rm that enters the leg part forming groove 143 of the tableting plate 142 through the film F becomes the leg part Rb of the sealing resin R, and the other (remaining) base resin Rm becomes the main body part Ra of the sealing resin R.

[0091] In the example of the sealing resin R shown in Fig. 25, the legs Rb are all (or part of) formed as convex bodies Rb1 arranged in a dot shape. As an example of the convex bodies Rb1, they are arranged at a plurality of positions, and are formed in a shape in which the ratio t of the length L1 to the width W1 in a plan view satisfies, for example, 0.5≦t≦2. According to this, the configuration in which the legs Rb are columnar and arranged in a dot shape can suppress the sealing resin R placed on the work W from flowing during compression molding. Therefore, wire sweep and the like can be prevented, and molding quality can be improved.

[0092] In the example of the encapsulating resin R shown in FIG. 26, the leg portion Rb is formed as a convex body Rb2, a part of which (or all of it may be) is arranged linearly. As an example of the convex body Rb2, it is arranged at one position (or it may be at a plurality of positions), and the ratio t of the length L2 to the width W2 in a plan view is formed into a shape such that, as an example, t < 0.5 or 2 < t. According to this, resin flow is intentionally generated from the leg portion Rb (in this case, the convex body Rb2) having a dike-like configuration of a predetermined length, and filling of the encapsulating resin R into a narrow portion in the workpiece W (for example, between the substrate Wa connected by flip chip and the electronic component Wb, etc.) can be promoted. Therefore, it is possible to prevent gas from remaining in the molded product Wp and improve the molding quality.

[0093] In the example of the encapsulating resin R shown in FIG. 27, the leg portion Rb is formed as a convex body Rb3 that is arranged to intermittently (or continuously) surround the entire outer periphery (referring to the outer edge region) of the main body portion Ra. As an example of the convex body Rb3, a convex body having the same configuration as the above Rb2 is formed continuously in a circumferential shape while providing a gap L3 at a predetermined interval. Generally, the outer peripheral position of the encapsulating resin R in the molded product Wp is the position where it is cut by a dicing machine or the like when it is separated into individual pieces, and since there is no electronic component Wb, a larger amount of resin for encapsulation is required compared to the central position. Therefore, by providing a leg portion Rb (in this case, the convex body Rb3) arranged to surround the entire outer periphery in this configuration, it is possible to supply a large amount of resin to the outer peripheral position while suppressing the resin flow during compression molding. Furthermore, by providing the gap L3, the discharge of gas components such as air from the inside (central portion) to the outside is promoted.

[0094] On the other hand, the example of the sealing resin R shown in FIG. 28 is a configuration example regarding the other surface of the main body part Ra (the surface on the side on which the leg part Rb is not provided, i.e., the surface on the side that does not face the electronic component Wb of the workpiece W). Specifically, the main body part Ra has linear grooves Rg formed on the other surface at the position where dicing for individualization is performed. This can reduce wear of the dicing blade and reduce dust generated during dicing. As an example, the grooves Rg are provided in a lattice shape in accordance with the dicing position, but are not limited to this. In order to form the grooves Rg, the tableting process may be performed using the cavity piece 126 (in the cases of FIGS. 10 and 14) or the tableting plate 142 (in the case of FIG. 20) provided with a protrusion part (not shown) of a corresponding shape.

[0095] As described above, according to the forming apparatus 100 and forming method of the present invention, the amount of the sealing resin R to be formed can be appropriately changed and finely adjusted, so that the appropriate amount of sealing resin R can be accurately formed for each workpiece W. Furthermore, in cases where the workpiece W has a protruding portion, the shape of the sealing resin R can also be controlled so that the position corresponding to that portion becomes a space.

[0096] Furthermore, by making the molding apparatus 100 for sealing resin R and the compression molding apparatus 1 separate devices, the compression molding apparatus 1 can be made unaffected by dust generated when the powder resin in the molding apparatus 100 is tableted, and the compression molding apparatus 1 can be easily placed in a clean room.

[0097] Furthermore, by using the sealing resin R formed by the forming device 100 and the forming method, it is possible to realize a compression molding device 1 and a compression molding method that have the following effects. Specifically, the compression molding device 1 and the compression molding method can prevent molding defects caused by resin flow, uneven winding, residual gas, and dust generation during molding. In addition, it is possible to form not only thin molded products Wp (thickness dimension less than 1 mm) but also thick molded products Wp (thickness dimension 1 mm or more). Although the upper limit of the thickness dimension depends on various setting conditions, it is considered that it is possible to form a thickness of up to about 10 mm. In addition, handling during supply and setting is made easier.

[0098] Furthermore, the compression molding apparatus 1 and compression molding method can solve the problem that occurs when a cavity is provided in the upper mold. That is, in a conventional compression molding apparatus in which a cavity is provided in the upper mold, when a mold closing process is performed on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, the wire portion of the workpiece held by the lower mold comes into contact with the sealing resin previously supplied to the cavity or the sealing resin previously supplied onto the workpiece, and is deformed or cut, making resin sealing difficult. This problem can be solved by adopting a configuration that uses the sealing resin R formed by the apparatus and method according to the present embodiment, that is, a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W.

[0099] Specifically, during the mold closing process, the sealing resin R is heated and softened and melted, as shown in the transition from Fig. 3A to Fig. 3B. At this time, the resin (specifically, the main body portion Ra) comes into uniform contact with all the wires (see Fig. 3B). This makes it possible to prevent the wires from being deformed or cut.

[0100] In addition, when the inventors of the present application actually conducted experiments in the above-mentioned compression molding apparatus 1 using sealing resin R formed by the apparatus and method of this embodiment, it was confirmed that deformation and breakage of the wire was prevented and molding quality was improved compared to a conventional compression molding apparatus having a configuration in which a workpiece W is held in the upper die, a cavity is provided in the lower die, and sealing resin (specifically, granular resin) is supplied to the cavity.

[0101] On the other hand, the compression molding apparatus 1 and the compression molding method can also solve the problem that occurs when a cavity is provided in the lower mold. That is, in a conventional compression molding apparatus in which a cavity is provided in the lower mold, especially when a granular resin is used as the sealing resin, the particle size and height (lamination thickness) of the sealing resin (granular resin) accommodated in the cavity are not uniform. Therefore, for example, depending on the type and melting state of the granular resin, it may not be completely liquid (low viscosity state), and when a mold closing process is performed on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, as shown in FIG. 29, depending on the position, there is a problem that the wire portion of the workpiece held by the upper mold comes into strong (large) contact with the sealing resin (granular resin) and is deformed or cut. Furthermore, as shown in FIG. 30, there is a problem that a large resin flow occurs in the cavity, and the wire portion is deformed or cut. This problem can be solved by adopting a configuration that uses the sealing resin R formed by the apparatus and method according to this embodiment, that is, a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W.

[0102] 3A and 3B, the heating of the sealing resin R causes it to soften and melt, and the resin (specifically, the main body portion Ra) comes into uniform contact with all the wires during the mold closing process. From this perspective, the sealing resin R is not limited to the configurations shown in Figs. 25 to 28, and may have a configuration (not shown) in which the upper surface is formed flat without providing legs Rb on the upper surface. This configuration also makes it possible to solve the problems caused by non-uniformity in particle size and height (lamination thickness) compared to the conventional technology that uses granular resin.

[0103] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. [Explanation of symbols]

[0104] 1. Compression molding equipment 100 Sealing resin forming device 102 Tablet pressing mold 202, 302 Sealing mold F Release Film Rm Base Resin R Sealing resin Ra Main unit Rb leg W work Wa base material Wb electronic components

Claims

1. A forming apparatus for tableting a base resin to form an encapsulating resin to be used in compression molding of a workpiece, comprising: A tableting die is provided which accommodates the base resin and tablets the sealing resin having a predetermined shape corresponding to the shape of the workpiece, The tableting die has a shape setting part that variably sets the shape of the sealing resin formed by tableting. The sealing resin forming apparatus is characterized by the above.

2. As the workpiece, a workpiece having a configuration in which an electronic component is mounted on a substrate is used, The predetermined shape is a shape that does not contact the electronic component when the sealing resin is placed on the base material.

2. The sealing resin forming apparatus according to claim 1,

3. A control and calculation unit for controlling the operation of the shape setting unit, The control and calculation unit calculates a required amount of resin based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the workpieces, calculates a pressurized volume when compressing the base resin based on the calculated amount of resin and a preset compression rate, and controls the shape setting unit to set the pressurized volume.

3. The sealing resin forming apparatus according to claim 2, further comprising:

4. The tableting die has a lower die provided with a cavity formed as a recess, and an upper die provided with a tableting plate for tableting the base resin accommodated in the cavity of the lower die, The shape setting unit is A configuration including an upper die movable block forming a part or the whole of a surface facing the bottom of the cavity in the tableting plate in the upper die, and an upper die movable mechanism for moving the upper die movable block up and down, or a lower die movable block forming a part or the whole of a surface facing the tableting plate at the bottom of the cavity, and a lower die movable mechanism for moving the lower die movable block up and down; At least one of the following must be provided:

3. The sealing resin forming apparatus according to claim 1, further comprising:

5. When the shape setting portion is provided on the upper mold, The upper mold movable mechanism has a first block having a first tapered surface inclined at a predetermined angle and provided so as to be movable in the mold opening / closing direction, and a second block having a second tapered surface arranged so as to be able to abut against the first tapered surface and provided so as to be movable in a direction intersecting the mold opening / closing direction, and is configured to move the second block toward and away from the first block to move the first block up and down, and the first block is formed integrally with the upper mold movable block, or is formed separately and connected thereto.

5. The sealing resin forming apparatus according to claim 4,

6. When the shape setting portion is provided on the lower mold, The lower mold movable mechanism has a third block having a third tapered surface inclined at a predetermined angle and provided so as to be movable in the mold opening / closing direction, and a fourth block having a fourth tapered surface arranged to be able to abut against the third tapered surface and provided so as to be movable in a direction intersecting the mold opening / closing direction, and is configured to move the fourth block toward and away from the third block to move the third block up and down, and the third block is formed integrally with the lower mold movable block, or is formed separately and connected thereto.

5. The sealing resin forming apparatus according to claim 4,

7. A powder resin is used as the base resin.

3. The sealing resin forming apparatus according to claim 1, further comprising:

8. A method for forming an encapsulating resin for use in compression molding of a workpiece, comprising tableting a base resin, the method comprising: A tableting process is provided in which the base resin is placed in a tableting die and tableted to form the sealing resin having a predetermined shape corresponding to the shape of the workpiece. The tableting step includes a shape setting step for variably setting the shape of the sealing resin formed by tableting. A method for forming a sealing resin comprising the steps of:

9. As the workpiece, a workpiece having a configuration in which an electronic component is mounted on a substrate is used, The predetermined shape is a shape that does not contact the electronic component when the sealing resin is placed on the base material.

9. The method for forming a sealing resin according to claim 8,

10. The shape setting step includes a step of calculating a required amount of resin based on data obtained by measuring the number of electronic components mounted on one of the substrates for each of the workpieces, calculating a pressurized volume when pressurizing the base resin based on the calculated amount of resin and a preset compression rate, and setting a shape setting unit so as to obtain the pressurized volume. The method for forming a sealing resin according to claim 9 ,

11. The shape setting step includes: A step of vertically moving an upper die movable block having a part or all of a surface facing the bottom of the cavity in the tableting plate of the tableting die; or A step of vertically moving a lower die movable block having a part or all of a surface facing a tableting plate at the bottom of the cavity of the tableting die; At least one of the following:

10. The method for forming a sealing resin according to claim 8 or 9,

12. A powder resin is used as the base resin.

10. The method for forming a sealing resin according to claim 8 or 9,

13. The tableting step is carried out at a temperature at which the base resin does not harden by heat so that the encapsulating resin formed can be hardened by heat in a subsequent compression molding step.

10. The method for forming a sealing resin according to claim 8 or 9,

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