Holding device, alignment device, film forming device, film forming method, and manufacturing method

Abstract

To suppress impact on vibration characteristic from a weight member while adjusting a floating posture with the weight member.SOLUTION: A holding device includes: holding means for holding an object; support means for supporting the holding means in a floating state; and a first weight member installed to the holding means. The holding means has an outer shape that is a polygonal shape including a first side part. The first weight member is disposed along the first side part and disposed on a central side of the first side part relative to an end of the first side part.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a holding device, an alignment device, and a film forming device. [Background technology]

[0002] As a mechanism for holding an object, a mechanism for supporting an object in a floating state has been proposed. For example, Patent Document 1 discloses a semiconductor exposure apparatus that supports a stage that holds a substrate in a floating state. In this holding mechanism, the floating attitude of the stage is adjusted by a weight member so that the stage is maintained in, for example, a horizontal attitude. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2004-342987 A Summary of the Invention [Problem to be solved by the invention]

[0004] While providing a weight member is advantageous in terms of adjusting the levitation attitude, providing a weight member may affect the vibration characteristics of the member that holds the object. For example, providing a weight member may lower the natural frequency of the member that holds the object, thereby deteriorating the vibration characteristics.

[0005] An object of the present invention is to suppress the effect of the weight member on vibration characteristics while adjusting the floating attitude by the weight member. [Means for solving the problem]

[0006] According to the present invention, A holding means for holding an object; a support means for supporting the holding means in a floating state; A first weight member provided on the holding means; A holding device comprising: The outer shape of the holding means is a polygon including a first side portion, the first weight member is disposed along the first side portion and is disposed closer to the center of the first side portion than an end portion of the first side portion; A holding device characterized in that Effect of the Invention

[0007] According to the present invention, the floating attitude can be adjusted by the weight member, while the effect of the weight member on vibration characteristics can be suppressed. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic diagram showing a part of a configuration of a manufacturing line for electronic devices to which the present invention can be applied; [Diagram 2] 1 is a schematic diagram of a film forming apparatus according to an embodiment of the present invention. [Diagram 3] An enlarged portion of Figure 2. [Figure 4] 4A and 4B are schematic diagrams showing an example of the operation of a film forming apparatus. [Diagram 5] 4A and 4B are schematic diagrams showing an example of the operation of a film forming apparatus. [Figure 6] 4 is a plan view of the holding device as seen from the direction of the arrows A-A in FIG. 3 . [Figure 7] FIG. [Figure 8] 4A and 4B are explanatory views of the arrangement area of ​​the weight member. [Figure 9] FIG. 4 is a schematic diagram showing the first natural vibration mode of the main body. [Figure 10] 1A and 1B are schematic diagrams showing an example of an organic EL display device. [Figure 11] 5A to 5C are plan views showing examples of the arrangement of weight members. [Figure 12] FIG. 4 is a side view showing an example of an arrangement of weight members. [Figure 13] 13A and 13B are plan views showing the number of weight members arranged. [Figure 14] FIG. 4 is a plan view showing an example of the outer shape of a main body portion. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0010] First Embodiment <Electronic device manufacturing line> Fig. 1 is a schematic diagram showing a part of the configuration of a manufacturing line for electronic devices to which the present invention can be applied. The manufacturing line in Fig. 1 is used, for example, for manufacturing display panels for organic EL display devices for smartphones. Substrates 1 are sequentially transported to a film-forming block 401, and an organic EL film is formed on the substrates 1.

[0011] In the film formation block 401, a plurality of film formation chambers 403a to 403d in which film formation processing is performed on the substrate 1 and a mask storage chamber 405 in which masks before and after use are stored are arranged around a transfer chamber 402 having an octagonal shape in a plan view. A transfer robot 402a for transferring the substrate 1 is arranged in the transfer chamber 402. The transfer robot 402a includes a hand for holding the substrate 1 and an articulated arm for moving the hand in the horizontal direction. In other words, the film formation block 401 is a cluster-type film formation unit in which a plurality of film formation chambers 403a to 403d are arranged so as to surround the transfer robot 402a. When the film formation chambers 403a to 403d are collectively referred to or when they are not distinguished from one another, they are referred to as film formation chambers 403.

[0012] In the transport direction (arrow direction) of the substrate 1, a buffer chamber 406, a swirl chamber 407, and a delivery chamber 408 are disposed on the upstream side and downstream side of the film-forming block 401, respectively. In the manufacturing process, each chamber is maintained in a vacuum state. Although only one film-forming block 401 is illustrated in FIG. 1, the manufacturing line according to this embodiment has a plurality of film-forming blocks 401, and the plurality of film-forming blocks 401 are connected by a connection device constituted by the buffer chamber 406, the swirl chamber 407, and the delivery chamber 408. The configuration of the connection device is not limited to this, and may be constituted by, for example, only the buffer chamber 406 or the delivery chamber 408.

[0013] The transport robot 402a transports the substrate 1 from the upstream delivery chamber 408 to the transport chamber 402, transports the substrate 1 between the film formation chambers 403, transports the mask between the mask storage chamber 305 and the film formation chamber 303, and transports the substrate 1 from the transport chamber 402 to the downstream buffer chamber 406.

[0014] The buffer chamber 406 is a chamber for temporarily storing the substrates 1 depending on the operating status of the manufacturing line. The buffer chamber 406 is provided with a substrate storage shelf also called a cassette, and a lifting mechanism. The substrate storage shelf has a multi-stage structure capable of storing multiple substrates 1 while maintaining the substrates 1 in a horizontal state with their surfaces to be processed (surfaces to be film-formed) facing downward in the direction of gravity. The lifting mechanism raises and lowers the substrate storage shelf to match the stage where the substrates 1 are carried in or out with the transport position. This allows multiple substrates 1 to be temporarily stored and retained in the buffer chamber 406.

[0015] The swirl chamber 407 is equipped with a device for changing the orientation of the substrate 1. For example, in the swirl chamber 407, the orientation of the substrate 1 is rotated 180 degrees by a transport robot provided in the swirl chamber 407. The transport robot provided in the swirl chamber 407 rotates 180 degrees while supporting the substrate 1 received in the buffer chamber 406 and delivers it to the delivery chamber 408, so that the front end and the rear end of the substrate are swapped between the buffer chamber 406 and the delivery chamber 408. As a result, the orientation of the substrate 1 when it is carried into the film formation chamber 403 is the same in each film formation block 401, so that the scan direction of film formation on the substrate 1 and the orientation of the mask can be made consistent in each film formation block 401. With this configuration, the orientation of the mask installed in the mask storage chamber 405 in each film formation block 401 can be made consistent, simplifying mask management and improving usability.

[0016] The control system of the manufacturing line includes a host device 400 that controls the entire line as a host computer, and control devices 140a-140d, 409, 410 that control each component, and these can communicate with each other via a wired or wireless communication line 400a. The control devices 140a-140d are provided corresponding to the film formation chambers 403a-403d, and control the film formation apparatus 100 described below. When the control devices 140a-140d are collectively referred to or when there is no need to distinguish between them, they are referred to as the control device 140.

[0017] The control device 409 controls the transport robot 402a. The control device 410 controls the devices in the swirl chamber 307. The host device 400 transmits information about the substrate 1 and instructions such as transport timing to each of the control devices 140, 409, 410, and each of the control devices 140, 409, 410 controls each component based on the received instructions.

[0018] <Film forming equipment> FIG. 2 is a schematic diagram showing a film forming apparatus 100 according to an embodiment of the present invention. The film forming apparatus 100 is an apparatus for forming a film of a deposition material on a substrate 1, and forms a thin film of the deposition material in a predetermined pattern on the substrate 1 using a mask 2. The material of the substrate 1 on which a film is formed in the film forming apparatus 100 can be appropriately selected from materials such as glass, resin, and metal. The deposition material is an organic material or an inorganic material (metal, metal oxide, etc.). The film forming process is performed in a state in which the substrate 1 is placed on the mask 2 and the substrate 1 and the mask 2 are superimposed on each other.

[0019] The film forming apparatus 100 can be applied to manufacturing apparatuses for manufacturing electronic devices such as display devices (such as flat panel displays), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements), as well as optical components, and is particularly applicable to manufacturing apparatuses for manufacturing organic EL panels. In the following description, an example is assumed in which the film forming apparatus 100 forms a film on a substrate 1 by vacuum deposition, but the present invention is not limited to this, and various film forming methods such as sputtering and CVD can be applied. In each figure, arrow Z indicates the up-down direction (gravity direction), and arrows X and Y indicate horizontal directions that are perpendicular to each other.

[0020] The film forming apparatus 100 includes a box-shaped vacuum chamber 110 (sometimes simply referred to as the chamber 110) having a bottom 111, sides 112, and a top 113. An internal space 114 of the vacuum chamber 110 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 110 is connected to a vacuum pump (not shown). In this specification, "vacuum" refers to a state filled with gas at a pressure lower than atmospheric pressure, in other words, a reduced pressure state.

[0021] In the internal space 114 of the vacuum chamber 110, a holding device 300 that holds the substrate 1 in a horizontal position, a mask supporting unit 9 that supports the mask 2, a deposition unit 12, and a plate unit 11 are arranged.

[0022] The mask 2 has an opening pattern corresponding to the thin film pattern to be formed on the substrate 1, and is placed on a mask table 91. The mask table 91 can be replaced with other means for fixing the mask 2 at a predetermined position. The mask 2 may be a mask having a structure in which a mask foil having a thickness of about several μm to several tens of μm is welded to a frame-shaped mask frame. The material of the mask is not particularly limited, but it is preferable to use a metal having a small thermal expansion coefficient such as an Invar material. The film formation process is performed in a state in which the substrate 1 is placed on the mask 2 and the substrate 1 and the mask 2 are overlapped with each other.

[0023] The plate unit 11 includes a cooling plate 11a, a magnet plate 11b, and a plate movable part 11c. The cooling plate 11a is disposed under the magnet plate 11b, and the cooling plate 11a and the magnet plate 11b are suspended by the plate movable part 11c so as to be displaceable in the Z direction. The cooling plate 11a has a function of cooling the substrate 1 attracted to the holder 6 by approaching the holder 6 described later during film formation. The cooling plate 11a is not limited to a plate having a water cooling mechanism or the like to actively cool the substrate 1, and may be a plate-like member that does not have a water cooling mechanism or the like but removes heat from the substrate 1 by approaching the holder 6. The magnet plate 11b is a plate that attracts the mask 2 by magnetic force, and is placed on the upper surface of the substrate 1 to improve the adhesion between the substrate 1 and the mask 2 during film formation.

[0024] The cooling plate 11a and the magnet plate 11b may be omitted as appropriate. For example, when a cooling mechanism is provided in the holder 6, the cooling plate 11a may be omitted. In addition, the holder 6 may be configured to attract the mask 2 without the magnet plate 11b.

[0025] The deposition unit 12 is composed of a heater, a shutter, an evaporation source driving mechanism, an evaporation rate monitor, etc., and is an evaporation source that deposits an evaporation material onto the substrate 1. More specifically, in this embodiment, the deposition unit 12 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in the X direction, and an evaporation material is discharged from each nozzle. For example, the linear evaporation source is moved back and forth in the Y direction (depth direction of the device) by an evaporation source moving mechanism (not shown). In this embodiment, the deposition unit 12 is provided in a vacuum chamber 110 together with an alignment device 2 described later.

[0026] <Alignment device> The film forming apparatus 1 includes an alignment device 200 that aligns a substrate 1 and a mask 2. The alignment device 200 includes a holding device 300 that holds the substrate 1, a mask support unit 9, a position measurement unit 10, a measurement unit 13, and a vibration isolation unit 120. The holding device 300 also includes a holding unit 3 that holds the substrate 1, etc. Each component of the alignment device 200 will be described below.

[0027] The mask support unit 9 includes a mask table 91, mask support columns 92, a mask lifting mechanism 93, and an airtight member 94. The mask table 91 is fixed to the mask support columns 92. The mask support columns 92 are connected to the mask lifting mechanism 93 through an airtight member 94 provided between the support frame 130 and the ceiling 113. The mask lifting mechanism 93 is provided on the support frame 130, and lifts and lowers the mask support columns 92 in the Z direction. The airtight member 94 is, for example, a bellows, and has airtightness and elasticity. The airtight member 94 can prevent the degree of vacuum in the vacuum chamber 110 from being lost when the mask support columns 92 are lifted and lowered.

[0028] The position measuring unit 10 measures the position of the holding unit 3 which holds the substrate 1. A plurality of position measuring units 10 are arranged on the mask stage 91 so as to measure the positions of the holding unit 3 in the X, Y and Z directions (only one of them is shown in FIG. 2). Based on the position information of the holding unit 3 in each direction measured by the position measuring unit 10, the floating attitude (e.g., the inclination with respect to the XY plane) and the floating position (e.g., the position in the Z direction) of the holding unit 3 can be adjusted. The position measuring unit 10 may use, for example, a laser displacement meter which measures the distance to an object in a non-contact manner.

[0029] The measurement unit 13 measures the positional deviation between the substrate 1 and the mask 2 held by the holding unit 3. The measurement unit 13 is provided on the support frame 130, and can capture an image of the inside of the vacuum chamber 110 through windows 130a, 113a formed in the support frame 130 and the vacuum chamber top plate 113. Alignment marks (not shown) are formed on the substrate 1 and the mask 2, respectively. The measurement unit 13 captures the alignment marks of the substrate 1 and the mask 2. Based on the measurement results of the measurement unit 13, the control device 140, which will be described later, controls the holding device 300 so as to eliminate the positional deviation of each alignment mark, and adjusts the relative positions of the substrate 1 and the mask 2.

[0030] The measurement unit 13 can use multiple types of alignment cameras, such as a low-magnification CCD camera (rough camera) with a relatively wide field of view but low resolution, and a high-magnification CCD camera (fine camera) with a relatively narrow field of view but high resolution (for example, on the order of several μm). This makes it possible to measure the positional deviation between the substrate 1 and the mask 2 with high accuracy while measuring the rough positional deviation between the substrate 1 and the mask 2.

[0031] The vibration isolation unit 120 is composed of a vibration isolation table base 121, a vibration isolation table 122, etc. The vibration isolation unit 120 may be, for example, an active vibration isolation device or a passive vibration isolation device such as a vibration isolation rubber. The vibration isolation unit 120 is provided on the upper part of the vacuum chamber top plate 113, and when vibration occurs in the vacuum chamber 110, it suppresses the vibration from being transmitted to the support frame 130 side. This allows the alignment device 200 to perform highly accurate alignment even when vibration occurs in the vacuum chamber 110.

[0032] <Holding device> The holding device 300 will be described with reference to Fig. 3 in addition to Fig. 2. Fig. 3 is an enlarged view of the holding device 300 and its surroundings in Fig. 2. The holding device 300 includes a holding unit 3 that holds a substrate, a supporting unit 7 that supports the holding unit 3 in a floating state, and a position adjustment unit 8 that displaces the holding unit 3.

[0033] The holding unit 3 has a holding part 6 that holds the substrate 1, and a main body part 5 that is a plate member that supports the holding part 6. The holding part 6 is provided on a lower surface D of the main body part 5. The holding part 6 is, for example, an electrostatic chuck that attracts the substrate 1 by electrostatic force. The electrostatic chuck has a structure in which an electric circuit such as a metal electrode is embedded inside a matrix (also called a base) made of a ceramic material, for example. When a positive (+) and negative (-) voltage is applied to the metal electrode, a polarization charge is induced in the substrate 1 through the ceramic matrix, and the substrate 1 is fixed to the attracting surface (lower surface) of the holding part 6 by the electrostatic attraction (electrostatic force) between the substrate 1 and the holding part 6.

[0034] The support unit 7 of this embodiment supports the holding unit 3 in a levitated state by magnetic force. The support unit 7 includes a magnetic force generating unit 7a provided on the main body 5 and a magnetic force generating unit 7b provided on the fixed member 4. The fixed member 4 is fixed to the vacuum chamber 110 and supports the magnetic force generating unit 7b. The magnetic force generating units 7a and 7b are permanent magnets. The magnetic attraction force (or magnetic repulsion force) between the magnetic force generating units 7a and 7b allows the holding unit 3 to be magnetically levitated and supported without contact with the fixed member 4. The support unit 7 is capable of generating a levitation force equivalent to the weight of the holding unit 3 itself.

[0035] The position adjustment unit 8 of this embodiment is a unit that displaces the holding unit 3 by magnetic force, and is, for example, a linear motor. The position adjustment unit 8 has a magnetic force generating unit 8a provided in the main body unit 5 and a magnetic force generating unit 8b provided in the fixed member 4. One of the magnetic force generating units 8a and 8b is a permanent magnet, and the other is an electromagnet.

[0036] The position adjustment units 8 are provided in multiple sets (see Figure 6, etc., described later), and can displace the holding unit 3 in the translational directions in the X, Y, and Z directions, displace it in the rotational directions around the X, Y, and Z axes, and adjust its posture (tilt with respect to the horizontal direction).

[0037] <Control device> The control device 140 controls the entire film forming apparatus 100. The control device 140 includes a processing unit 140a, a storage unit 140b, an input / output interface (I / O) 140c, and a communication unit 140d. The processing unit 140a is a processor such as a CPU, and controls the film forming apparatus 100 by executing a program stored in the storage unit 140b. The storage unit 140b is a storage device such as a ROM, a RAM, or a HDD, and stores various control information in addition to the program executed by the processing unit 140a. The I / O 140c is an interface that transmits and receives signals between the processing unit 140a and an external device. The communication unit 140d is a communication device that communicates with the above-mentioned devices or other control devices via a communication line.

[0038] <Example of film formation device operation> An operation example of the film forming apparatus 100 will be described with reference to Figures 4(A) to 5(B). Figures 4(A) to 5(B) show an example of the state of the film forming apparatus 100 when the substrate 1 is carried into the inside 114 of the vacuum chamber, and a film of a deposition material is formed on the substrate 1 after the substrate 1 and the mask 2 are aligned.

[0039] 4(A) shows an example of a state of the film forming apparatus 100 before the substrate 1 is carried into the internal space 114 of the vacuum chamber 110 by the transfer robot 402a shown in FIG. 1. The mask stage 91 is lowered by the mask lifting mechanism 93. From the state of FIG. 4(A), the substrate 1 is carried into the internal space 114, and the substrate 1 is held by the holding portion 6 of the holding unit 3.

[0040] FIG. 4(B) shows the state of the film forming apparatus 100 during the alignment operation of the substrate 1 and the mask 2. The substrate 1 is held by the holder 6. The mask 2 is raised to the alignment position. The alignment of the substrate 1 and the mask 2 is performed in a state where the substrate 1 and the mask 2 are very slightly separated from each other. In FIGS. 4(A) to 5(A), the gap between the substrate 1 and the mask 2 is exaggerated to make the operation easier to understand.

[0041] In the alignment operation, first, the levitation position of the holding unit 3 is measured by the position measurement unit 10 provided on the mask stage 91. Based on the information measured by the position measurement unit 10, the control device 140 shown in FIG. 1 performs coordinate conversion, and calculates position information of the holding unit 3 with six degrees of freedom (X direction, Y direction, Z direction, θX direction, θY direction, and θZ direction). Based on the position information of the six degrees of freedom of the holding unit 3, the control device 140 controls the position adjustment unit 8 to adjust the levitation position of the holding unit 3. The position adjustment unit 8 maintains the levitation attitude of the holding unit 3 horizontally. In this way, the levitation attitude of the holding unit 3 is adjusted horizontally, thereby enabling a highly accurate alignment operation to be performed.

[0042] Next, the measurement unit 13 photographs the alignment marks provided on the substrate 1 and the mask 2, and measures the amount of misalignment between the substrate 1 and the mask 2. The "amount of misalignment" refers to the amount of relative misalignment between the substrate 1 and the mask 2 in the X direction, the Y direction, and the θ direction around the Z axis. The control device 104 controls the position adjustment unit 8 so as to reduce the amount of misalignment, and the position of the holding unit 3 is adjusted. The measurement and position adjustment are repeated until the amount of misalignment falls within the allowable range. This adjusts the relative position of the substrate 1 with respect to the mask 2.

[0043] When the alignment operation is completed, the substrate 1 is placed on the mask 2. As shown in FIG. 5(A), the cooling plate 11a and the magnet plate 11b of the plate unit 11 are lowered into the opening 50a of the main body 5. The plate unit 11 is lowered toward the opening 50a of the main body 5, and the cooling plate 11a approaches the holder 6 as shown in FIG. 5(B). The mask 2 is attracted by the magnetic force of the magnet plate 11b, and the mask 2 and the substrate 1 can be brought into close contact with each other as a whole. Then, a film formation process is performed in which a deposition material is discharged from the deposition unit 12 through the mask 2 onto the substrate 1. A thin film of the deposition material is formed on the substrate 1.

[0044] <Structure of holding unit> The structure of the holding unit 3 will be described in detail. As described above, the alignment operation for adjusting the positional deviation between the substrate 1 and the mask 2 is performed in a state in which the holding unit 3 is floating. By disposing a weight member on the main body 5, the weight balance of the holding unit 3 can be adjusted, and the floating attitude of the holding unit 3 can be easily made horizontal. On the other hand, depending on the arrangement of the weight member, the vibration characteristics of the holding unit 3 may be affected. In this embodiment, a structure is shown in which the floating attitude of the holding unit 3 is adjusted by the weight member, while the influence of the weight member on the vibration characteristics is suppressed by the arrangement of the weight member. FIG. 6 is a plan view of the holding unit 3, and corresponds to the view in the direction of the arrow A-A in FIG. 3. FIG. 7 is a perspective view of the holding unit 3. In the following description, for convenience, the Y direction may be called the front-rear direction and the X direction may be called the left-right direction.

[0045] The main body 5 forms the outer shape of the holding unit 3 in a plan view. The outer shape of the main body 5 is polygonal, particularly rectangular (square). Point P is the centroid of the outer shape of the main body 5. The main body 5 is a plate-like member having a circular opening 50a in the center. The opening 50a is large enough to allow the cooling plate 11a and magnet plate 11b of the plate unit 11 to pass through.

[0046] The main body 5 has a front side 5F and a rear side 5B that face each other in the Y direction, and a left side 5L and a right side 5R that face each other in the X direction between the front side 5F and the rear side 5B, and also has corners 5a to 5d. The corners 5a and 5b are corners at both ends of the front side 5F. The corners 5c and 5d are corners at both ends of the rear side 5B. The corners 5a and 5d are corners at both ends of the left side 5L. The corners 5b and 5c are corners at both ends of the right side 5R. The front side 5F and the rear side 5B are parallel, and the left side 5L and the right side 5R are parallel. The direction of the front side 5F and the rear side 5B is perpendicular to the direction of the left side 5L and the right side 5R.

[0047] A magnetic force generating unit 7b of the support unit 7, a magnetic force generating unit 8b of the position adjustment unit 8, and a weight member 15 are provided on an upper surface U of the main body 5. The surface U is the surface on the fixing member 4 side. A holding unit 6 is provided on a lower surface D of the main body. The lower surface D is the surface on the side to which the mask 2 is attracted.

[0048] The holding device 300 of this embodiment includes four support units 7 and four position adjustment units 8. Therefore, four magnetic force generating units 7b and four magnetic force generating units 8b are provided on the upper surface U of the main body 5. The four magnetic force generating units 7b and the four magnetic force generating units 8b are arranged at diagonal positions of the main body 5. Two of the four magnetic force generating units 8b are provided to extend in the Y direction, and the remaining two are provided to extend in the X direction.

[0049] In this embodiment, a total of four weight members 15 are provided on each of the sides 5F, 5B, 5L, and 5R. The floating attitude of the holding unit 3 can be adjusted by tuning the weight of each weight member 15. In this embodiment, the weight members 15 are detachably attached to the main body 5 by using a fastener 150. The fastener 150 is, for example, a bolt that screws into a screw hole formed in the main body 5. Weight members 15 of different weights can be easily replaced, and the floating attitude of the holding unit 3 can be adjusted more easily.

[0050] Each weight member 15 is provided along the corresponding side portion 5F, 5B, 5L or 5R. Each weight member 15 is disposed closer to the centers 51 to 54 than the end portion (corner portion 5a to 5d) of the corresponding side portion 5F to 5R.

[0051] For example, the weight member 15 arranged along the front side 5F is disposed closer to the center 51 of the front side 5F than the corners 5a and 5b. Similarly, the weight member 15 arranged along the rear side 5B is disposed closer to the center 53 of the rear side 5B than the corners 5c and 5d. The weight member 15 arranged along the left side 5L is disposed closer to the center 52 of the left side 5L than the corners 5b and 5c. The weight member 15 arranged along the right side 5R is disposed closer to the center 54 of the right side 5R than the corners 5a and 5d.

[0052] In this embodiment, the position of each weight member 15 along the corresponding side portions 5F, 5B, 5L and 5R is arranged so that its longitudinal center (in other words, the centroid in a planar view) is located at each center 51-54 of the corresponding side portions 5F, 5B, 5L and 5R, but the arrangement position of the weight members 15 is not limited to this.

[0053] The position of the weight member 15 will be described with reference to Fig. 8(A) and Fig. 8(B). Fig. 8(A) and Fig. 8(B) are explanatory diagrams and are schematic diagrams of the main body 5. Fig. 8(A) is a schematic diagram explaining the range of the weight member 15 along the side 5F of the main body 5. The range of the weight member 15 is, for example, range L12, which is 3 / 5 of the range centered on the center 51 of the length L1 of the side 5F divided into 5 equal parts. The length L1 is also the length (separation distance) between the side 5L and the side 5R.

[0054] The arrangement range may be a range L11 narrower than L12. Range L11 is 2 / 4 of the range centered on center 51 of the length L1 of side portion 5F divided into four equal parts. The arrangement range may be a range L10 narrower than L11. Range L10 is 1 / 3 of the range centered on center 51 of the length L1 of side portion 5F divided into three equal parts. In this embodiment, weight member 15 is arranged within range L10.

[0055] FIG. 8B is a diagram showing ranges similar to range L10 of side 5F for each of sides 5B, 5L, and 5R.

[0056] The range L20 is one-third of the length L2 of the side 5R, centered on the center 52, and in this embodiment, the corresponding weight member 15 is disposed within the range L20. The length L2 is also the length (separation distance) between the side 5F and the side 5B.

[0057] The range L30 is one-third of the length L3 of the side 5B, centered on the center 53, and in this embodiment, the corresponding weight member 15 is disposed within the range L30. The length L3 is also the length (separation distance) between the side 5L and the side 5R.

[0058] The range L40 is one-third of the length L4 of the side 5L, centered on the center 54, and in this embodiment, the corresponding weight member 15 is disposed within the range L40. The length L4 is also the length (separation distance) between the side 5F and the side 5B.

[0059] With the above-described configuration, in this embodiment, by arranging the weight member 15 closer to the centers 51-54 of each side portion 5F-5L than the corners 5a-5d of the main body portion 5, the effect of the weight member 15 on the vibration characteristics of the holding unit 3, particularly on the natural frequency, can be suppressed as described below.

[0060] The vibration characteristics of the main body 5 will be described with reference to FIG. 9. FIG. 9 is a schematic diagram showing the first natural vibration mode of the main body 5 without the weight member 15. When the holding unit 3 is displaced, the main body 5 generates micro-vibrations. In the first natural vibration mode, due to the member shape of the main body 5, the amplitude is large at the corners 5a to 5d and small at the centers 51 to 54 of each side 5F to 5L. Therefore, when the weight member 15 is disposed near the corners 5a to 5d, it acts in a direction to increase the amplitude of vibration. By disposing the weight member 15 on the center 51 to 54 side rather than the corners 5a to 5d of the main body 5, the increase in the amplitude of vibration can be reduced and the decrease in the natural frequency can be suppressed.

[0061] Furthermore, since the center (center of gravity) P of the main body 5 is closer to the centers 51-54 than to the corners 5a-5d, the moment of inertia acting on the weight member 15 is reduced by arranging the weight member 15 on the center 51-54 side. Therefore, as in this embodiment, the influence of the weight member 15 can be suppressed by arranging the weight member 15 on the center 51-54 side of each side 5F-5L than to the corners 5a-5d of the main body 5. In the example of Fig. 8(A), the influence of vibration characteristics can be reduced by arranging the weight member 15 in the range L11 rather than the range L12, and further, the influence of vibration characteristics can be reduced by arranging the weight member 15 in the range L10 rather than the range L11.

[0062] <Electronic device manufacturing method> Next, an example of a method for manufacturing an electronic device will be described. Below, as an example of an electronic device, the configuration and manufacturing method of an organic EL display device will be illustrated. In this example, the film formation block 401 illustrated in FIG. 1 is provided in, for example, three places on the manufacturing line.

[0063] First, the organic EL display device to be manufactured will be described. Fig. 10(A) is an overall view of an organic EL display device 500, and Fig. 10(B) is a diagram showing the cross-sectional structure of one pixel.

[0064] 10(A), a plurality of pixels 510, each including a plurality of light-emitting elements, are arranged in a matrix in a display region 501 of an organic EL display device 500. As will be described in detail later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

[0065] The pixel here refers to the smallest unit that allows a desired color to be displayed in the display region 501. In the case of a color organic EL display device, a pixel 510 is configured by a combination of a plurality of sub-pixels, a first light-emitting element 510R, a second light-emitting element 510G, and a third light-emitting element 510B, which emit light different from each other. The pixel 510 is often configured by a combination of three types of sub-pixels, a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 510 needs to include at least one type of sub-pixel, and preferably includes two or more types of sub-pixels, and more preferably includes three or more types of sub-pixels. The sub-pixels that configure the pixel 510 may be, for example, a combination of four types of sub-pixels, a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element.

[0066] Fig. 10(B) is a partial cross-sectional schematic diagram taken along the line AB in Fig. 10(A). The pixel 510 has a plurality of sub-pixels on a substrate 520, each of which is composed of an organic EL element having a first electrode (anode) 521, a hole transport layer 522, any one of a red layer 522R, a green layer 522G, and a blue layer 522B, an electron transport layer 523, and a second electrode (cathode) 528. Of these, the hole transport layer 522, the red layer 522R, the green layer 522G, the blue layer 522B, and the electron transport layer 523 correspond to organic layers. The red layer 522R, the green layer 522G, and the blue layer 522B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue colors, respectively.

[0067] In addition, the first electrode 521 is formed separately for each light-emitting element. The hole transport layer 522, the electron transport layer 523, and the second electrode 522 may be formed in common for a plurality of light-emitting elements 510R, 510G, and 510B, or may be formed for each light-emitting element. That is, as shown in FIG. 10B, the hole transport layer 522 may be formed as a common layer for a plurality of sub-pixel regions, and the red layer 522R, the green layer 522G, and the blue layer 522B may be formed separately for each sub-pixel region on top of the hole transport layer 522, and the electron transport layer 523 and the second electrode 522 may be formed as a common layer for a plurality of sub-pixel regions on top of the hole transport layer 522.

[0068] In order to prevent short circuits between adjacent first electrodes 521, an insulating layer 529 is provided between the first electrodes 521. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 530 is provided to protect the organic EL element from moisture and oxygen.

[0069] 10B, the hole transport layer 522 and the electron transport layer 523 are shown as one layer, but may be formed of multiple layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. In addition, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 521 to the hole transport layer 522 may be formed between the first electrode 521 and the hole transport layer 522. Similarly, an electron injection layer may be formed between the second electrode 528 and the electron transport layer 523.

[0070] Each of the red layer 522R, the green layer 522G, and the blue layer 522B may be formed of a single light-emitting layer, or may be formed by laminating a plurality of layers. For example, the red layer 522R may be configured of two layers, with the upper layer being formed of a red light-emitting layer, and the lower layer being formed of a hole transport layer or an electron block layer. Alternatively, the lower layer may be formed of a red light-emitting layer, and the upper layer may be formed of an electron transport layer or a hole block layer. By providing a layer below or above the light-emitting layer in this way, the light-emitting position in the light-emitting layer can be adjusted, and the optical path length can be adjusted, thereby improving the color purity of the light-emitting element.

[0071] Although an example of red layer 522R is shown here, a similar structure may be adopted for green layer 522G or blue layer 522B. The number of layers may be two or more. Furthermore, layers of different materials may be laminated, such as a light-emitting layer and an electron blocking layer, or layers of the same material may be laminated, such as two or more light-emitting layers.

[0072] Next, an example of a method for manufacturing an organic EL display device will be specifically described. Here, it is assumed that the red layer 522R is composed of two layers, a lower layer 522R1 and an upper layer 522R2, and the green layer 522G and the blue layer 522B are composed of a single light-emitting layer. Six film-forming chambers are assumed as the film-forming chambers 403.

[0073] First, a substrate 520 is prepared on which a circuit (not shown) for driving the organic EL display device 500 and a first electrode 521 are formed. The material of the substrate 520 is not particularly limited, and the substrate 520 may be made of glass, plastic, metal, etc. In this embodiment, a substrate in which a polyimide film is laminated on a glass substrate is used as the substrate 520.

[0074] A resin layer such as acrylic or polyimide is coated by bar coating or spin coating on the substrate 520 on which the first electrode 521 is formed, and the resin layer is patterned by lithography so that an opening is formed in the portion where the first electrode 521 is formed, to form an insulating layer 529. This opening corresponds to a light-emitting region where the light-emitting element actually emits light. In this embodiment, the large substrate is processed up to the formation of the insulating layer 529, and after the insulating layer 529 is formed, a division step is performed to divide the substrate 520.

[0075] The substrate 520 with the patterned insulating layer 529 is carried into the first film forming apparatus 100, and a hole transport layer 522 is formed as a common layer on the first electrodes 521 in the display regions. The hole transport layer 522 is formed using a mask having an opening for each display region 501 which will eventually become the panel portion of each organic EL display device.

[0076] Next, the substrate 520 on which the hole transport layer 522 has been formed is carried into the second film formation chamber 403. The substrate 520 and the mask are aligned, the substrate 520 is placed on the mask, and the red layer 56R is formed on the hole transport layer 522 in a portion of the substrate 520 where the elements emitting red light are arranged (regions where red subpixels are formed). Here, the mask used in the second film formation apparatus is a high-definition mask in which openings are formed only in a plurality of regions that will become red subpixels among a plurality of regions on the substrate 520 that will become subpixels of the organic EL display device 500. As a result, the red layer 522R including the red light emitting layer is formed only in a region that will become a red subpixel among a plurality of regions on the substrate 520 that will become subpixels. In other words, the red layer 522R is selectively formed in a region that will become a red subpixel, without being formed in a region that will become a blue subpixel or a green subpixel among a plurality of regions on the substrate 520 that will become subpixels.

[0077] Similar to the formation of the red layer 522R, the green layer 522G is formed in the third film formation chamber 503, and further the blue layer 522B is formed in the fourth film formation chamber 503. After the formation of the red layer 522R, the green layer 522G, and the blue layer 522B is completed, the electron transport layer 523 is formed over the entire display region 501 in the fifth film formation apparatus 100. The electron transport layer 523 is formed as a layer common to the three color layers 522R, 522G, and 522B.

[0078] The substrate on which the electron transport layer 523 has been formed is moved to the sixth film formation chamber 403, where the second electrode 528 is formed. In this embodiment, the first to sixth film formation chambers 403 to 403 form each layer by vacuum deposition. However, the present invention is not limited to this, and for example, the second electrode 528 may be formed by sputtering in the sixth film formation chamber 403. Thereafter, the substrate on which the second electrode 528 has been formed is moved to a sealing device, and the protective layer 530 is formed by plasma CVD (sealing process), completing the organic EL display device 500. Note that, although the protective layer 530 is formed by the CVD method here, the present invention is not limited to this, and the protective layer 530 may be formed by the ALD method or the inkjet method.

[0079] <Second embodiment> In the first embodiment, the weight member 15 is disposed on the upper surface U of the main body 5, but the location of the weight member 15 is not limited thereto. 11A to 11C and 12 show examples of the arrangement of the weight member 15.

[0080] Fig. 11(A) shows an example in which weight member 15 is disposed on the side surface of main body portion 5. Fig. 11(B) shows an example in which weight member 15 is disposed on the underside U of main body portion 5. In this manner, weight member 15 may be disposed on the side surface of main body portion 5 or on the underside U along the corresponding sides 5F, 5B, 5L and 5L.

[0081] As a mode of arranging the weight member 15 in the region L10, in addition to the mode in which the entire weight member 15 is arranged in the region L10 as in the first embodiment, a mode in which a part of the weight member 15 protrudes from the region L10 but the center of gravity is arranged in the region L10 may be used. Fig. 11(C) shows one example. The weight member 15 arranged along the side 5F has both ends in the longitudinal direction protruding slightly from the region L10, but the center of gravity P' is located within the region L10. The same applies to the weight members 15 along the other sides 5B, 5L, and 5R.

[0082] The weight member 15 may be entirely or partially embedded inside the main body 5. Fig. 12 shows an example in which the weight member 15 is disposed in a recess 50b provided on the upper surface U of the main body 5. By providing the weight member 15 so as to be embedded in the main body 5 in this manner, it is possible to prevent the center of gravity P' of the weight member 15 from becoming high. Therefore, it is possible to suppress the influence of the vibration characteristics of the holding unit 3 while increasing the stability of the levitation posture of the holding unit 3.

[0083] <Third embodiment> In the first embodiment, weight members 15 are provided on each of the sides 5F, 5B, 5L, and 5R, but there may be sides on which no weight members 15 are provided. Figures 13(A) and 13(B) show other arrangement examples of weight members 15. Figure 13(A) shows an example in which weight members 15 are arranged along sides 5L and 5R of the main body 5, with a total of two weight members 15 being provided. No weight members 15 are provided corresponding to sides 5F and 5B.

[0084] The weight member 15 may be composed of multiple weight portions. In the example of Fig. 13(B), the weight member 15 is composed of multiple weight portions 15'. By adjusting the number of weight portions 15', the weight of each weight member 15 can be easily adjusted.

[0085] <Fourth embodiment> The outer shape of the main body 5 can be various polygonal shapes. Fig. 14(A) shows a form in which chamfered portions 5g are provided at the corners 5a to 5d of the main body 5, and the shape is substantially quadrangular, more precisely, octagonal. The weight members 15 arranged along the side 5F are arranged closer to the center than both ends e1 of the side 5F, and are arranged within a range L10. As an example, the range L10 is 1 / 3 of the length L1 between the side 5L and the side 5R divided into three equal parts, with the center of the side 5F being the range.

[0086] The weight members 15 arranged along the side 5R are arranged closer to the center than both ends e2 of the side 5R and are arranged within a range L20. As an example, the range L20 is one-third of the length L2 between the side 5F and the side 5B, which is divided into three equal parts, and is centered on the center of the side 5R.

[0087] The weight members 15 arranged along the side 5B are arranged closer to the center than both ends e3 of the side 5B and are arranged within a range L30. As an example, the range L30 is one-third of the length L3 between the side 5L and the side 5R, centered on the center of the side 5B, when the length L3 is divided into three equal parts.

[0088] The weight members 15 arranged along the side 5L are arranged closer to the center than both ends e4 of the side 5L and are arranged within a range L40. As an example, the range L40 is one-third of the length L4 between the side 5F and the side 5B, which is divided into three equal parts, and is centered on the center of the side 5L.

[0089] 14(B) shows a form in which the corners 5a to 5d of the main body 5 are rounded (arc-shaped). In this example, the weight members 15 arranged along the side 5F are arranged closer to the center than both ends e1 of the side 5F and are arranged within a range L10. As an example, the range L10 is 1 / 3 of the length L1 between the side 5L and the side 5R divided into three equal parts, with the center of the side 5F being the range.

[0090] The weight members 15 arranged along the side 5R are arranged closer to the center than both ends e2 of the side 5R and are arranged within a range L20. As an example, the range L20 is one-third of the length L2 between the side 5F and the side 5B, which is divided into three equal parts, and is centered on the center of the side 5R.

[0091] The weight members 15 arranged along the side 5B are arranged closer to the center than both ends e3 of the side 5B and are arranged within a range L30. As an example, the range L30 is one-third of the length L3 between the side 5L and the side 5R, centered on the center of the side 5B, when the length L3 is divided into three equal parts.

[0092] The weight members 15 arranged along the side 5L are arranged closer to the center than both ends e4 of the side 5L and are arranged within a range L40. As an example, the range L40 is one-third of the length L4 between the side 5F and the side 5B, which is divided into three equal parts, and is centered on the center of the side 5L.

[0093] The outer shape of the main body 5 may be a triangle, a hexagon, or the like in addition to the above examples.

[0094] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0095] REFERENCE SIGNS LIST 1 substrate, 2 mask, 3 holding unit, 4 fixing member, 5 main body, 6 holding unit, 7 support unit, 8 position adjustment unit, 9 mask support unit, 10 position measurement unit, 11 plate unit, 12 deposition unit, 13 measurement unit, 15 weight member, 100 film forming device, 200 alignment device, 300 holding device

Claims

1. a holding means for holding an object; a support means for supporting the holding means in a floating state; a first weight member provided on the holding means; A holding device comprising: the outer shape of the holding means is a polygonal shape including a first side portion, the first weight member is disposed along the first side portion and is disposed closer to the center of the first side portion than the end portion of the first side portion; A holding device characterized by:

2. The first weight member is disposed in a central one-third portion of the length of the first side portion, the length being divided into three equal parts.

2. The holding device according to claim 1.

3. the first weight member is detachably disposed on the holding means; 2. The holding device according to claim 1.

4. Further provided is a position adjusting means for displacing the holding means.

2. The holding device according to claim 1.

5. Further comprising a second weight member provided on the holding means, The polygonal shape is a second side portion facing the first side portion, the second weight member is disposed along the second side portion and is disposed closer to the center of the second side portion than the end portion of the second side portion; 2. The holding device according to claim 1.

6. The device further includes a third weight member and a fourth weight member provided on the holding means, The polygonal shape is a third side portion and a fourth side portion between the first side portion and the second side portion, the third weight member is disposed along the third side portion and is disposed closer to the center of the third side portion than an end portion of the third side portion; the fourth weight member is disposed along the fourth side portion and is disposed closer to the center of the fourth side portion than to an end portion of the fourth side portion; 6. The holding device according to claim 5.

7. the third side portion and the fourth side portion are sides in a direction perpendicular to a direction of the first side portion and the second side portion, the first weight member is disposed in a central one-third portion of a length between the third side portion and the fourth side portion, the length being divided into three equal parts; the second weight member is disposed in a central one-third portion of a length between the third side portion and the fourth side portion, the length being divided into three equal parts; the third weight member is disposed in a central third of a length between the first side portion and the second side portion, the third weight member being equal to three; the fourth weight member is disposed in a central one-third portion of the length between the first side portion and the second side portion, the length being divided into three equal parts; 7. The holding device according to claim 6.

8. An alignment apparatus for adjusting the positions of a substrate and a mask, a holding means for holding the substrate; a support means for supporting the holding means in a floating state; a first weight member provided on the holding means; an adjustment means for adjusting the positions of the substrate and the mask by displacing the holding means, the outer shape of the holding means is a polygon including a first side and first corners on both sides of the first side, the first weight member is disposed along the first side portion and is disposed closer to the center of the first side portion than the first corner portion; An alignment device characterized by:

9. The alignment device according to claim 8 ; and a film forming means for forming a film of the deposition material on the substrate. A film forming apparatus characterized by:

10. A film forming method, comprising forming a film on a substrate through a mask using the film forming apparatus according to claim 9.

11. A manufacturing method for manufacturing an electronic device using the film formation method described in claim 10.

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