Power source module

Abstract

To provide a power source module which enables electric power to be input efficiently from an input port of a battery.SOLUTION: A power source module includes: a plurality of drive substrates 30, 21 which separately drive electronic circuits 32, 23 each comprising a plurality of electronic components: and a housing which houses the drive substrates 30, 21. The drive substrates 30, 21 which separately drive an inverter 32 and a DC-DC converter 23 included in the electronic circuits 32, 23 are arranged adjacent to each other on the same plane V. An input port 45 which inputs electric power of a battery into the inverter 32 and the DC-DC converter 23 is provided between the inverter 32 and the DC-DC converter 23.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a power supply module. [Background technology]

[0002] Conventionally, power supply modules equipped with electronic circuits such as inverters and converters are known (see, for example, Patent Document 1). For example, this power supply module converts power supplied from a commercial power source and charges a battery with the converted power, or converts power supplied from a battery mounted on a vehicle such as an automobile and supplies the converted power to electronic devices such as a motor.

[0003] In the power supply module described in Patent Document 1, the case is divided into an upper space and a lower space, a converter is disposed in the upper space, and an inverter is disposed in the lower space, and the converter and the inverter are each supplied with power from a battery. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 11-121690 Summary of the Invention [Problem to be solved by the invention]

[0005] The power supply module described in Patent Document 1 has a converter and an inverter arranged above and below, so the external dimensions tend to be large. In addition, in the power supply module, the power supplied from the battery is distributed by wiring from the input port of the battery to the converter in the upper space and the inverter in the lower space. For this reason, the wiring between the input port of the battery and the converter and inverter in the power supply module may become complicated.

[0006] Therefore, there is a demand for a power supply module that has a compact external shape and simple wiring. [Means for solving the problem]

[0007] A characteristic configuration of the power supply module of the present invention is that it comprises a plurality of drive boards which separately drive respective electronic circuits constituted by a plurality of electronic components, and a housing which accommodates the plurality of drive boards, the plurality of drive boards which separately drive the inverter and DC-DC converter included in the electronic circuits are arranged adjacent to each other on the same plane, and an input port for inputting battery power to the inverter and the DC-DC converter is provided between the inverter and the DC-DC converter.

[0008] In this configuration, in the power supply module, a plurality of drive boards that drive the inverter and the DC-DC converter separately are arranged side by side on the same plane. This allows the power supply module to be made compact with a small bulk. Also, if an input port for inputting battery power is provided between the inverter and the DC-DC converter, the input port can be placed close to both the inverter and the DC-DC converter, so that the wiring from the input port to the inverter and the DC-DC converter can be shortened. This allows the power supply module to have simplified wiring. [Brief description of the drawings]

[0009] [Figure 1] 1 is a circuit configuration diagram of a cooling system including a power supply module according to a first embodiment. [Diagram 2] FIG. 2 is an exploded perspective view of the power supply module. [Diagram 3] FIG. 2 is a vertical cross-sectional view of the power supply module. [Figure 4] FIG. 2 is a perspective view of a power supply module. [Diagram 5] FIG. 2 is a plan view of the power supply module. [Figure 6] FIG. 2 is a partial perspective view of the power supply module. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the power supply module will be described with reference to the drawings. However, the present invention is not limited to the following embodiment, and various modifications are possible without departing from the spirit of the present invention.

[0011] [Configuration of the cooling circuit] As shown in Fig. 1, a cooling circuit A including a power supply module 100 cools the power supply module 100 with a cooling fluid. The cooling fluid is a cooling water such as long-life coolant (LLC), insulating oil such as paraffin, or a refrigerant such as hydrofluorocarbon (HFC) or hydrofluoroolefin (HFO). In this embodiment, it is preferable to use a cooling water such as long-life coolant (LLC) or a liquid with high electrical insulation such as a fluorine-based inert liquid, and a cooling liquid composed of insulating oil may also be used. The cooling circuit A is mounted on a vehicle that charges a battery (not shown) with external power.

[0012] The cooling circuit A is composed of a power supply module 100, a water-cooled condenser 1, an oil cooler 2, a water pump 3, a three-way valve 4, and a radiator 5. The cooling fluid, which has been heated by cooling the power supply module 100, flows out of the power supply module 100, is heated by heat exchange with the refrigerant in the water-cooled condenser 1, and then is further heated by heat exchange with the lubricant in the oil cooler 2. The cooling fluid is then pumped by the water pump 3, and the three-way valve 4 switches between sending the cooling fluid to the radiator 5 and not sending the cooling fluid to the radiator 5. When the cooling fluid is sent to the radiator 5, the cooling fluid is cooled in the radiator 5 and flows back into the power supply module 100. When the cooling fluid is not sent to the radiator 5, the cooling fluid flows back into the power supply module 100 in a heated state without being cooled.

[0013] [First embodiment] [Power supply module configuration] As shown in FIG. 2, the power supply module 100 is configured by accommodating at least a drive board 20 for an OBC (On Board Charger), a drive board 30 for driving a motor, and a control board 40 for controlling the drive board 20 and the drive board 30 in a housing 10. The power supply module 100 has a first space 11. The drive board 20, the drive board 30, and the control board 40 are separate boards, and are accommodated in the first space 11 in a parallel posture to each other. In the following figures, for example, as shown in FIG. 1, the traveling direction of the vehicle (front-rear direction of the vehicle) is the X direction, the width direction of the vehicle (left-right direction of the vehicle) is the Y direction, and the height direction of the vehicle is the Z direction. In addition, the front side of the traveling direction of the vehicle is the X1 side, the rear side of the traveling direction is the X2 side, the left side of the vehicle width direction is the Y1 side, and the right side of the vehicle width direction is the Y2 side.

[0014] 3 shows cross sections cut in a direction perpendicular to the plate surfaces of the drive substrate 20, the drive substrate 30, and the control substrate 40. Hereinafter, the direction perpendicular to the plate surface of the drive substrate 20 will be referred to as the "vertical direction." In addition, in FIG. 3, the direction in which the control substrate 40 is viewed from the drive substrate 20 and the drive substrate 30 along the vertical direction will be referred to as the "upper side" and the like, and the direction in which the drive substrate 20 and the drive substrate 30 are viewed from the control substrate 40 will be referred to as the "lower side" and the like.

[0015] The housing 10 has a second space 12 and a third space 13 partitioned from the first space 11. The second space 12 and the third space 13 are located below the first space 11. The second space 12 accommodates a motor 6 driven by a drive board 30, and the third space 13 accommodates a gear mechanism 7 that reduces the rotation of the motor 6 and outputs it. The housing 10 has an opening 10a above the first space 11, and the drive board 20, the drive board 30, the control board 40, and the cooling plate 50 are accommodated in the first space 11 through the opening 10a. The opening 10a is closed by a lid 14 (see FIG. 2), and the first space 11 is a closed space. The second space 12 accommodates the motor 6 from the side, and is closed by a motor cover 15 fastened with a bolt (not shown) to form a closed space. A motor shaft 6a extends from the motor 6 on both sides along the rotation axis, and one of the motor shafts 6a penetrates the motor cover 15 and is exposed to the outside of the housing 10. The other motor shaft 6a penetrates to the third space 13. The third space 13 accommodates the gear mechanism 7 from the side and is closed by a gear cover 16 fastened with a bolt (not shown) to form a closed space. The other motor shaft 6a extending from the second space 12 is connected to the gear mechanism 7, and the rotation of the motor 6 is input via the motor shaft 6a. The gear mechanism 7 reduces the rotation of the motor 6 and outputs it from the gear shaft 7a. The gear shaft 7a penetrates the gear cover 16 and is exposed to the outside of the housing 10.

[0016] [Cooling plate] As shown in Fig. 2 and Fig. 3, the first space 11 of the housing 10 accommodates a cooling plate 50 for cooling the heat generating components 23a of the power converter 23, the heat generating components 24a of the power converter 24, and the heat generating components 32a of the power converter 32. The cooling plate 50 is made of a metal with high thermal conductivity such as aluminum, and is integrally formed by joining a plate-shaped lower plate 50a and an upper plate 50b by a method such as welding. A space is formed inside the cooling plate 50 (between the lower plate 50a and the upper plate 50b), and a cooling fluid flows through the space. The heat generating components 23a, 24a are mounted on the lower surface of the drive board 20, and the heat generating component 32a is mounted on the lower surface of the drive board 30. The heat generating components 23a, 24a and the heat generating component 32a are all disposed so as to abut against the cooling plate 50, and heat exchange is performed between the heat generating components 23a, 24a and 32a and the cooling fluid, thereby lowering the temperatures of the heat generating components 23a, 24a and 32a and raising the temperature of the cooling fluid. The heat generating components 23a, 24a and the heat generating component 32a may all be fixed to the cooling plate 50.

[0017] 2 to 6, the drive substrate 20 is configured by connecting a first drive substrate 21 and a second drive substrate 22. A power converter 23 (an example of an electronic circuit) is mounted on the first drive substrate 21, and the power converter 23 is driven by the first drive substrate 21. A power converter 24 (an example of an electronic circuit) is mounted on the second drive substrate 22, and the power converter 24 is driven by the second drive substrate 22.

[0018] Power converter 23 is a DC-DC converter that converts a DC voltage into a DC voltage suitable for charging a battery (not shown). Power converter 24 is an AC-DC converter (an example of an AC-DC conversion circuit) that converts an AC input from outside into a DC. Power converter 24 (AC-DC converter) is configured to input a DC current to power converter 23 (DC-DC converter), for example. The configurations of DC-DC converters and AC-DC converters are well known, so detailed description thereof will be omitted.

[0019] A power converter 32 (an example of an electronic circuit) is mounted on the drive board 30. The power converter 32 includes at least an inverter that controls a drive current that drives the motor 6. The configuration of the inverter is well known, so a detailed description will be omitted. In addition, a control circuit 41 that controls the power converters 23, 24 and the power converter 32 is mounted on the control board 40. In this manner, the power supply module 100 includes a plurality of drive boards 21, 22, 30 that individually drive the power converters 23, 24, 32 that are each made up of a plurality of electronic components, and a housing 10 that accommodates the plurality of drive boards 21, 22, 30.

[0020] As shown in FIG. 2, FIG. 3, and FIG. 5, the drive substrate 20 and the drive substrate 30 are all arranged on a virtual plane V (one example of the same plane), and the first drive substrate 21 of the drive substrate 20 and the drive substrate 30 are adjacent to each other. That is, a plurality of drive substrates 30, 21 that separately drive the power converter 32 (inverter) and the power converter 23 (DC-DC converter) included in the electronic circuit are arranged adjacent to each other on the same plane (virtual plane V). Although the virtual plane V in this embodiment is a plane along the X direction and the Y direction, the virtual plane V may be a plane that does not follow one or both of the X direction and the Y direction. The second drive substrate 22 is arranged on the opposite side of the drive substrate 30 with respect to the first drive substrate 21. That is, the second drive substrate 22 is arranged on the opposite side of the power converter 32 (inverter) of the first drive substrate 21 on the virtual plane V (the same plane). The above-mentioned "same plane" does not only mean that the drive substrates 30, 21, 22 are on the same plane, but also means that the drive substrates 30, 21, 22 are slightly offset from each other in the vertical direction (for example, about 1 cm).

[0021] The power converter 23 (DC-DC converter) includes a heat-generating component 23a (an example of an electronic component), and the power converter 24 (AC-DC converter) includes a heat-generating component 24a (an example of an electronic component). The power converter 32 (inverter) includes a heat-generating component 32a (an example of an electronic component). The power converters 23 and 24 include, as the heat-generating components 23a and 24a, a reactor (an example of an electronic component), a transformer (an example of an electronic component), a diode (an example of an electronic component), a switching element (an example of an electronic component), and the like. The power converter 32 includes, as the heat-generating component 32a, a diode (an example of an electronic component), a switching element (an example of an electronic component), and the like. These electronic components have different heights.

[0022] In this embodiment, as described above, the drive substrate 20 and the drive substrate 30 are located at the same height in the vertical direction. The control substrate 40 is arranged so as to overlap the drive substrate 20 and the drive substrate 30 when viewed in the vertical direction (vertical view). A first connector 42 is used to connect the drive substrate 20 and the control substrate 40 and to connect the drive substrate 30 and the control substrate 40. In this embodiment, since the drive substrate 20 and the drive substrate 30 are located at the same height in the vertical direction, it is possible to connect the drive substrate 20 and the control substrate 40 and to connect the drive substrate 30 and the control substrate 40 using two first connectors 42 of the same type. With this configuration, the assembly of the control substrate 40 to the drive substrate 20 and the drive substrate 30 is easy, and since there is no need to use different types of connectors, the assembly is also excellent.

[0023] [Smoothing capacitor] As described above, the drive board 20 and the drive board 30 are separate boards. In this embodiment, as shown in Fig. 2, a smoothing capacitor 26 (an example of an electronic component) is disposed between the drive board 20 and the drive board 30. The smoothing capacitor 26 is used both for smoothing the power converter 32 (inverter) and for smoothing the secondary side of the power converter 23 (DC-DC converter). That is, the smoothing capacitor 26 serves two different smoothing purposes.

[0024] The smoothing capacitor 26 has a height in the vertical direction extending from the vicinity of the upper plate 50b of the cooling plate 50 to the vicinity of the control board 40. That is, the vertical height of the smoothing capacitor 26 is greater than the vertical height of the electronic components including the heat generating components 23a and 24a mounted on the drive board 20 and the electronic components including the heat generating component 32a mounted on the drive board 30. Therefore, the periphery of the drive board 30 is surrounded by the control board 40, the smoothing capacitor 26, and the wall surface of the housing 10, and is separated from the periphery of the drive board 20. Therefore, it is possible to suppress the heat generated in the power converter 32 of the drive board 30 from being transferred to the drive board 20 side.

[0025] As shown in FIG. 3, a metal base substrate 27 is disposed on the upper plate 50b. A smoothing capacitor 26 and a first input port 45 (one example of a battery input port, see FIG. 4) to which a DC voltage is input from a battery (not shown) are attached to the metal base substrate 27. The first input port 45 is connected to a battery and inputs battery power to the power converter (inverter) 32 and the power converter (DC-DC converter) 23. As shown in FIGS. 4 to 6, the first input port 45 is disposed on the X2 side and provided between the power converter 23 and the power converter 32. In the power supply module 100 shown in FIGS. 5 and 6, the control substrate 40 is omitted, and the connection between the first output port 46 and the first drive substrate 21 described later and the connection between the third input port 49 and the drive substrate 30 described later are omitted.

[0026] 4 to 6, the power supply module 100 includes a first output port 46 of, for example, 12 V DC, a second output port 47 of, for example, 100 V AC, a second input port 48 of, for example, 200 V AC, and a third input port 49 for a control signal, on the same X2 side as the first input port 45. The first output port 46 is connected to, for example, a battery (not shown) for an auxiliary device. The second input port 48 can be connected to an external AC power source, etc., and the power converter 24 can be configured as an AC charger capable of charging with AC supplied from the second input port 48. The second output port 47 is used to connect a device that can be operated by an AC power source and to supply power to the device.

[0027] 4, the third input port 49 is connected to the control board 40. A second connector 43 is used to connect the third input port 49 and the control board 40. Various types of information related to the vehicle are input to the third input port 49 as control signals via an in-vehicle network such as a controller area network (CAN), and the control signals are transmitted to the control board 40.

[0028] The drive board 30 is provided, for example, at the end on the Y2 side, with a three-phase AC power supply terminal 35 for driving the motor 6. The power supply terminal 35 is connected to a coil built into the motor 6 by an electric wire (not shown).

[0029] The first input port 45 and the power converter 23 are connected by a pair of bus bars 28a, 28b, and the first input port 45 and the power converter 32 are connected by a pair of bus bars 38a, 38b. The same poles of the pair of bus bars 38a, 38b and the pair of bus bars 28a, 28b are fastened together to a pair of terminals 45a, 45b of the first input port 45. The pair of bus bars 28a, 28b are screwed to the terminals 29b, 29b of the first drive board 21. One end of the pair of bus bars 28a, 28b and one end of the pair of bus bars 38a, 38b are fixed to the pair of terminals 45a, 45b of the first input port 45 by a screw member 61 such as a bolt. The other end of the pair of bus bars 28a, 28b is fixed to the pair of terminals 29a, 29b provided on the power converter 23 by a screw member 62 such as a bolt. The other ends of the pair of bus bars 38a, 38b are fixed to a pair of terminals (not shown) provided on the power converter 32 by screw members (not shown) such as bolts (see FIG. 5).

[0030] As described above, the drive substrate 20 and the drive substrate 30 are located at the same height (on the virtual plane V) in the vertical direction (see FIG. 3). In order to achieve this, the power supply module 100 of this embodiment is provided with a height adjustment mechanism. Specifically, the vertical flow path height H1 at the location facing the drive substrate 20 (the location overlapping with the drive substrate 20 in the vertical view) is made different from the vertical flow path height H2 at the location facing the drive substrate 30 (the location overlapping with the drive substrate 30 in the vertical view). In this embodiment, the flow path height H2 is greater than the flow path height H1. That is, the height adjustment mechanism of this embodiment is to make the flow path heights H1 and H2 of the cooling plate 50 different depending on the opposing substrate.

[0031] In this embodiment, the lower plate 50a and the upper plate 50b constituting the cooling plate 50 have a flat plate shape, but the upper plate 50b has different heights at a portion corresponding to the drive substrate 20 and a portion corresponding to the drive substrate 30. Specifically, the height of the portion of the upper plate 50b corresponding to the drive substrate 30 is higher than the height of the portion corresponding to the drive substrate 20 relative to the lower plate 50a. As described above, the heat generating components 23a, 24a used in the power converters 23, 24 of the drive substrate 20 and the heat generating component 32a used in the power converter 32 of the drive substrate 30 are both cooled by being brought into contact with the upper plate 50b of the cooling plate 50. That is, the heat generating components 23a, 24a of the power converters 23, 24 have a high mounting height, and the heat generating component 32a of the power converter 32 of the drive substrate 30 has a low mounting height.

[0032] For this reason, in the upper plate 50b of this embodiment, the flow path height H2 is made higher than the flow path height H1 by an amount corresponding to the difference between the mounting height of the heat generating components 23a, 24a and the mounting height of the heat generating component 32a. This makes it possible to align the vertical heights of the drive substrate 20 and the drive substrate 30 with both the tall heat generating components 23a, 24a and the short heat generating component 32a in contact with the upper plate 50b.

[0033] In addition, the amount of heat generated by the heat generating component 32a of the power converter 32 of the drive board 30 is generally greater than the amount of heat generated by the heat generating components 23a, 24a of the power converters 23, 24 of the drive board 20. Therefore, by making the flow path height H2 where the heat generating component 32a contacts higher than the flow path height H1 where the heat generating components 23a, 24a contact, the flow path cross-sectional area of ​​the cooling fluid at the location where the heat generating component 32a contacts can be made larger than the flow path cross-sectional area of ​​the cooling fluid at the location where the heat generating components 23a, 24a contact. This allows the heat generating component 32a to be cooled efficiently.

[0034] [Layout of high-profile electronic components] As shown in FIG. 3, the first space 11 is divided by the cooling plate 50 into a first region 11a located below the cooling plate 50 and a second region 11b located above the cooling plate 50. In this embodiment, the volume of the first region 11a is smaller than the volume of the second region 11b. In the first space 11, the multiple electronic components (including the heat generating components 23a, 24a) constituting the power converters 23, 24 and the multiple electronic components (including the heat generating component 32a) constituting the power converter 32 are all arranged separately in the first region 11a and the second region 11b. The drive board 20, the drive board 30, and the control board 40 are arranged in the second region 11b.

[0035] In this embodiment, the reactors and transformers of the power converters 23 and 24, and the oil cooler 2 are arranged in the first region 11a. The diodes, switching elements, and the like of the power converters 23 and 24 and the power converter 32 are arranged in the second region 11b. The reactors, transformers, and oil cooler 2 arranged in the first region 11a abut against the lower plate 50a of the cooling plate 50, and the diodes and switching elements arranged in the second region 11b abut against the upper plate 50b. Of the electronic components, electronic components with a relatively large height are accommodated and arranged in the first region 11a, and electronic components with a relatively small height are accommodated and arranged in the second region 11b.

[0036] The first region 11a is adjacent to the second space 12 in which the motor 6 is disposed and the third space 13 in which the gear mechanism 7 is disposed, via the wall of the housing 10. That is, the first region 11a faces the motor 6 and the gear mechanism 7 via the wall of the housing 10. The first region 11a has a recess 11c recessed toward the third space 13 at a location facing the gear mechanism 7. As a result, the location of the first region 11a where the recess 11c is formed has a greater height (depth) on the lower side (the side facing the gear mechanism 7) from the virtual reference plane (the lower plate 50a of the cooling plate 50).

[0037] Between the electronic component (reactor) 23a and the electronic component (transformer) 24a arranged in the first region 11a, the electronic component (reactor) 23a is relatively bulkier. Therefore, in this embodiment, as shown in FIG. 3, the electronic component (reactor) 23a is arranged in a position not facing the recess 11c, and the electronic component (transformer) 24a is arranged in a position facing the recess 11c. The electronic component (transformer) 24a is arranged in such a manner that a part of it enters the recess 11c. By arranging the electronic component (reactor) 23a and the electronic component (transformer) 24a in this manner, the recess 11c in the first region 11a can be effectively utilized to reduce the size of the power supply module 100.

[0038] Other embodiments (1) In the above embodiment, smoothing capacitor 26 is configured to be used for smoothing both the inverter of power converter 32 and the secondary side of the DC-DC converter of power converter 23. However, the smoothing capacitor of the inverter of power converter 32 and the smoothing capacitor of the secondary side of the DC-DC converter of power converter 23 may be separate, and at least one of them may be used as a heat-shielding electronic component.

[0039] (2) In the above embodiment, an example was shown in which the drive board 20 has a second drive board 22 that drives an AC / DC conversion circuit that inputs direct current to the DC-DC converter, but the drive board 20 may not have the second drive board 22 and may only have a first drive board 21 on which a power converter 23 is mounted.

[0040] (3) In the above embodiment, the heat-generating components 23a, 24a, 32a arranged in the second region 11b of the first space 11 are all lower than the smoothing capacitor 26, but this is not limited to the example. If the smoothing capacitor 26 is higher than the heat-generating component 32a of the drive board 30, it can block the heat from the heat-generating component 32a. Therefore, the heat-generating components 23a, 24a may be higher than the smoothing capacitor 26.

[0041] [Summary of the above embodiment] Hereinafter, in the above-described embodiment, the following configurations are envisioned. <1> One embodiment of the power supply module (100) includes a plurality of drive boards (21)(30) that separately drive electronic circuits (23)(32) configured with a plurality of electronic components (23a)(32a), respectively, and a housing (10) that accommodates the plurality of drive boards (21)(30). The plurality of drive boards (21)(30) that separately drive the inverters (32) and DC-DC converters (23) included in the electronic circuits (23)(32) are arranged adjacent to each other on the same plane (V), and an input port (45) that inputs battery power to the inverter (32) and the DC-DC converter (23) is provided between the inverter (32) and the DC-DC converter (23).

[0042] In this configuration, in the power supply module (100), a plurality of drive boards (21) and (30) for separately driving the inverter (32) and the DC-DC converter (23) are arranged adjacent to each other on the same plane (V). This allows the power supply module (100) to have a small bulk and a compact outer shape. In addition, if the input port (45) for inputting battery power is provided between the inverter (32) and the DC-DC converter (23), the input port (45) can be placed close to both the inverter (32) and the DC-DC converter (23), so that the wiring from the input port to the inverter and the DC-DC converter can be shortened. This allows the power supply module (100) to have simplified wiring.

[0043] <2> The electric module (100) preferably includes a smoothing capacitor (26) disposed between the inverter (32) and the DC-DC converter (23) and facing the input port (45).

[0044] As in the present configuration, if the smoothing capacitor (26) is disposed between the inverter (32) and the DC-DC converter (23) at a position facing the input port (45), the inverter (32) and the DC-DC converter (23) can share the smoothing capacitor (26). This makes it possible to reduce the number of parts in the power supply module (100) and to configure the power supply module (100) with a more compact external shape.

[0045] <3> In the power supply module (100), it is preferable that the drive board (22), which drives the AC / DC conversion circuit (24) that inputs direct current to the DC-DC converter, is arranged on the same plane (V) on the opposite side of the inverter (32) with respect to the DC-DC converter (23).

[0046] In this configuration, if the drive board (22) that drives the AC / DC conversion circuit (24) that inputs direct current to the DC-DC converter (23) is arranged on the same plane as the drive board (21) that drives the DC-DC converter (23) and the drive board (30) that drives the inverter (32), a new drive board can be easily added to the power supply module (100). In addition, since the drive board (21) is arranged on the opposite side (Y1 side) of the inverter (32) with respect to the DC-DC converter (23), there is no change in the distance between the input port (45) and the DC-DC converter (23) and the inverter (32) in the power supply module (100). Therefore, in this configuration, the wiring between the input port (45) and the inverter (32) and the DC-DC converter (23) can be shortened.

[0047] <4> The inverter (32) and the DC-DC converter (23) are connected to the input port (45) by a pair of bus bars (38a, 38b) and (28a, 28b), respectively. It is preferable that the same poles of the pair of bus bars (38a, 38b) of the inverter (32) and the pair of bus bars (28a, 28b) of the DC-DC converter (23) are co-fastened to a pair of terminals (45a, 45b) of the input port (45).

[0048] According to this configuration, it is not necessary to separately fix the pair of bus bars (38a, 38b) of the inverter (32) and the pair of bus bars (28a, 28b) of the DC-DC converter (23) to the battery input port (45), but they can be fixed together to the battery input port (45). This enables the power supply module (100) to easily connect multiple electronic components to the battery input port (45) and reduces the number of components. [Industrial Applicability]

[0049] The present invention is widely applicable to power supply modules. [Explanation of symbols]

[0050] 10: housing, 20: drive board, 21: first drive board, 22: second drive board, 23: power converter (electronic circuit, DC-DC converter), 23a: heat generating component (electronic component), 24: power converter (electronic circuit, AC-DC conversion circuit), 24a: heat generating component (electronic component), 26: smoothing capacitor (electronic component), 28a, 28b, 38a, 38b: bus bar, 30: drive board, 32: power converter (electronic circuit, inverter), 32a: heat generating component (electronic component), 40: control board, 100: power supply module, V: virtual plane (same plane)

Claims

1. A plurality of drive boards for separately driving respective electronic circuits each of which is constituted by a plurality of electronic components; a housing that accommodates a plurality of the drive boards; A plurality of the drive substrates for separately driving the inverter and the DC-DC converter included in the electronic circuit are arranged adjacent to each other on the same plane, a power supply module, the input port for inputting battery power to the inverter and the DC-DC converter being provided between the inverter and the DC-DC converter;

2. 2. The power supply module according to claim 1, further comprising a smoothing capacitor disposed between the inverter and the DC-DC converter at a position facing the input port.

3. The power supply module according to claim 1, wherein the drive substrate, which drives an AC / DC conversion circuit that inputs direct current to the DC-DC converter, is arranged on the same plane on the opposite side of the inverter with respect to the DC-DC converter.

4. the inverter and the DC-DC converter are connected to the input port by a pair of bus bars, The power supply module according to any one of claims 1 to 3, wherein the same poles of the pair of bus bars of the inverter and the pair of bus bars of the DC-DC converter are respectively fastened together to a pair of terminals of the input port.

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