Wafer rotational member, wafer carrier, wafer processing device, and wafer processing method

JP2024175365APending Publication Date: 2024-12-18SHINDENGEN ELECTRIC MANUFACTURING CO LTD +1
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Patent Information

Application Number
JP2023093100
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-06-06
Publication Date
2024-12-18

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Abstract

To provide a wafer rotational member that makes a wafer to be rotated in a processing liquid tank in order to uniformly perform a processing of the wafer with a processing liquid.SOLUTION: The present invention provide a wafer rotational member including: a rotational shaft 11 that rotates a wafer in a wafer carrier for entering the wafer into a processing liquid tank; a resistance member 12 that is arranged to the rotational shaft 11, is positioned to an out side of the wafer carrier, and rotates the rotational shaft 11 so as to use a floating force and a resistance against the processing liquid in the processing liquid tank; and a groove 13 that is formed into the rotational shaft 11, and supports the wafer in the wafer carrier.SELECTED DRAWING: Figure 1
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