Element substrate, liquid discharge head, and method for manufacturing the same
JP2024175448APending Publication Date: 2024-12-18CANON KK
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- JP2023093240
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-06
- Publication Date
- 2024-12-18
Smart Images

Figure 00000000_0000_ABST
Abstract
To provide an element substrate which enables suppression of damaging of plate-like members stacked on each other, their joining with high parallelism, and suppression of entry of an adhesive into a recess.SOLUTION: An element substrate 2 of a stacked structure have recesses 7 in plate-like members 3 and 4. An elastic structure 14 is provided at a position where the recess 7 of the plate-like member 3 is surrounded with a space from the inner peripheral edge of the recess 7. An adhesive 6 is provided on a side opposite to the recess 7 when seen from the elastic structure 14 of the plate-like member 3. Then, the plate-like members 3 and 4 are stacked on each other to be pressed such that the recess 7, the elastic structure 14, and the adhesive 6 are positioned on the opposing surfaces of the plate-like member 3. The adhesive 6 is expanded in a part opposite to the recess 7 when seen from the elastic structure 14 between the plate-like members 3 and 4, and the adhesive 6 is cured to join the pair of plate-like members 3 and 4. A relationship between an elastic modulus B of the elastic structure 14 and an elastic modulus A of the plate-like member 4 at a stage where the plate-like members 3 and 4 are stacked is A>B.SELECTED DRAWING: Figure 2
Need to check novelty before this filing date? Find Prior Art
