Grinding method of chip

Abstract

To provide a grinding method of a chip, which can be easily handled even if reducing a thickness of a chip.SOLUTION: A grinding method of a chip is constructed by: an adhesive step 101 of adhering a thickness measurement member in a center region of a tape adhered so as to block an open part of a ring frame, and adhering the chip to a circumference of the thickness measurement member; a holding step 102 that is held to a holding surface of a chuck table that can rotate the ring frame that is integrated with the thickness measurement member and the chip; a grinding step 103 of rotating the chuck table, and grinding them so as to be contacted to the thickness measurement member and the chip while rotating a grinding wheel having an outer diameter that is smaller than an inner diameter of the ring frame; and a thickness management step 104 that indirectly manages a thickness of the chip by measuring the thickness of the thickness measurement member.SELECTED DRAWING: Figure 2

Images