Cooling and heat dissipation methods for heat-generating component and inside of device using optical technology

Abstract

To solve the problem in which control components (CPUs, etc.) such as those used in PCs and smartphones can overheat due to prolonged use, causing unstable operation and even breakdowns, and therefore require cooling and heat dissipation, which has conventionally been handled by cooling fans, heat dissipation fans, and heat sinks and to provide a method that differs from the conventional method, and, by using it in combination, contributes to improving cooling and heat dissipation efficiency.SOLUTION: By applying optical film technology (optical effects) to parts for controlling devices (semiconductor integrated circuits, printed circuit boards, etc.) and processing them, it is possible to control the heat generated by heat-generating parts and the heat inside devices, and by using this in conjunction with conventional methods, it is possible to solve problems.SELECTED DRAWING: None