Bonding method, bonding module, bonding device, and bonding facility

Abstract

To provide a bonding method for bonding an adhesion component to a base component.SOLUTION: In a bonding method, a carrier tape A3 having an adhesion component A is carriably wound around a pressing assembly 344 of a first pressing mechanism of a bonding module. The carrier tape A3 is bent via a bending component 3443 of the pressing assembly 344. By driving a roller 3442 of the pressing assembly 344, the roller 3442 indirectly comes into contact with and presses a front end of the adhesion component A via the carrier tape A3. The adhesion component A is brought into contact with a bonding start point of a bonding area B21 of a base component B, and the bending component 3443 and the roller 3442 are moved together, thereby the roller 3442 presses the carrier tape A3 while rotating on the carrier tape A3, to paste the adhesion component A onto a bonding area B21 of the base component B. During the rotation of the roller 3442, the bending component 3443 indirectly scrubs off the adhesion component A from the carrier tape A3 via the carrier tape A3.SELECTED DRAWING: Figure 12

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