Exposure apparatus, and method for manufacturing article

Abstract

To provide an exposure apparatus that can suppress reduction of through-put while suppressing variation of an exposure quantity in a stitching region.SOLUTION: In an exposure apparatus according to the present invention, an image of a pattern of an original plate is projected on a substrate surface of a substrate while scanning the original plate and the substrate in a scanning direction to expose the substrate. The apparatus comprises a control part which determines whether or not a first exposure region including a first non-stitching region and a stitching region arrayed in a non-scanning direction and a second exposure region including a stitching region and a second non-stitching region arrayed in a non-scanning direction are exposed by comparing a measurement result of exposure quantity at least at one position in a stitching region on the substrate surface of the substrate and a first tolerance value with each other in performing stitching exposure to the substrate, where at least one position is determined by comparing a second tolerance value determined from a measurement result of exposure quantity in the first non-stitching region and the second non-stitching region and a measurement result of exposure quantity in the stitching region with each other.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to an exposure apparatus and a method for manufacturing an article. [Background technology]

[0002] Conventionally, exposure apparatuses perform a process known as stitching exposure, in which adjacent exposure regions on a substrate are partially overlapped with each other while exposing each of the multiple exposure regions to form a pattern over a large area on the substrate. When performing such stitching exposure, it is necessary to suppress variations in the amount of exposure in stitching regions formed by overlapping adjacent exposed regions.

[0003] Patent Document 1 discloses an exposure apparatus that suppresses variations in the amount of exposure light in a joint region by adjusting the shape of an opening of a variable slit that is provided between an illumination optical system and an original and through which exposure light passes. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-53888 A Summary of the Invention [Problem to be solved by the invention]

[0005] On the other hand, in order to suppress variations in the amount of exposure light in a seam region when performing seam exposure in an exposure apparatus, it is necessary to measure the amount of exposure light in the seam region. At this time, if the amount of exposure light is measured at many positions within the joint area, the time required for the measurement increases, resulting in a decrease in throughput.

[0006] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide an exposure apparatus that can suppress variations in the amount of exposure light in a joint area while suppressing a decrease in throughput. [Means for solving the problem]

[0007] The exposure apparatus according to the present invention is an exposure apparatus that projects an image of a pattern of an original onto a substrate surface of a substrate while scanning the original and the substrate in a scanning direction, thereby exposing the substrate, and includes a substrate stage that is movable in the scanning direction and a non-scanning direction perpendicular to the scanning direction within the substrate surface while holding the substrate, a measurement unit that measures an exposure amount at a predetermined position on the substrate surface of the substrate held by the substrate stage, and a control unit that controls exposure, wherein a first exposure area on the substrate surface includes a first non-joint area and a first joint area that are arranged in the non-scanning direction, and a second exposure area on the substrate surface overlaps the first joint area that is arranged in the non-scanning direction. The control unit performs a determination step of determining whether to expose the first exposed area and the second exposed area by comparing a measurement result of the exposure amount by the measurement unit at at least one position in the first exposed area and the second exposed area with a first tolerance value, and the at least one position is determined by comparing a second tolerance value determined from the measurement result of the exposure amount by the measurement unit in the first non-connecting area and the second non-connecting area with the measurement result of the exposure amount by the measurement unit in the first connecting area and the second connecting area. Effect of the Invention

[0008] According to the present invention, it is possible to provide an exposure apparatus that can suppress variations in the amount of exposure light in a joint area while suppressing a decrease in throughput. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic cross-sectional view of an exposure apparatus according to a first embodiment. [Diagram 2] FIG. 2 is a top view illustrating stitching exposure performed in the exposure apparatus according to the first embodiment. [Diagram 3] 5A and 5B are diagrams showing the non-scanning direction position dependence of an integrated exposure amount and a combined integrated exposure amount by stitching exposure in the exposure apparatus according to the first embodiment. [Figure 4]4 is a top view showing the positional relationship between the variable slit and the exposure amount adjustment plate, and the exposure area when performing stitching exposure in the exposure apparatus according to the first embodiment. FIG. [Diagram 5] 5 is a diagram showing the non-scanning direction position dependency of a combined integrated exposure amount by stitching exposure in the exposure apparatus according to the first embodiment. [Figure 6] 6 is a flowchart showing a process of determining whether to adjust the amount of exposure in a seam region in the exposure apparatus according to the first embodiment, and a process of determining a feature point at which an integrated amount of exposure is measured during the process of making the determination. [Figure 7] 13 is a diagram showing the non-scanning direction position dependency of the combined integrated exposure amount by stitching exposure in the exposure apparatus according to the second embodiment. [Figure 8] 10 is a flowchart showing a process for determining a feature point at which an integrated exposure amount is measured when determining whether to adjust the exposure amount of a seam region in an exposure apparatus according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an exposure apparatus according to this embodiment will be described in detail with reference to the accompanying drawings. Note that the drawings shown below are drawn at a scale different from the actual scale in order to facilitate understanding of this embodiment. In the following description, the direction parallel to the optical axis of the projection optical system 4 is defined as the Z direction. In addition, in a cross section (within the substrate surface) perpendicular to the Z direction, the scanning directions of the original 3 and the substrate 16 are defined as the Y direction, and the non-scanning direction perpendicular to the Y direction is defined as the X direction.

[0011] [First embodiment] Conventionally, in the manufacture of liquid crystal panels, organic electroluminescence (EL) displays, semiconductor devices, etc., an exposure apparatus is used in which an original and a substrate coated with a photosensitive agent are moved synchronously with each other while an image of the pattern of the original is projected onto the substrate via a projection optical system. Moreover, in recent years, in order to accommodate the increase in exposure area associated with larger substrates, there has been a demand to form patterns in areas larger than the area (partial area) on the substrate to which the pattern (partial pattern) of the original is transferred by a single scanning exposure.

[0012] A so-called stitching exposure has been proposed in which a pattern is formed over a large area on a substrate by exposing each of a plurality of partial areas that partially overlap each other in a non-scanning direction orthogonal to the scanning direction on the substrate. Here, when performing such stitching exposure, it is important to suppress variations in the amount of exposure in stitching regions formed by overlapping adjacent partial regions.

[0013] In the past, exposure apparatuses have been proposed that suppress variations in the amount of exposure light in such connecting regions by adjusting the shape of the opening of a variable slit through which the exposure light passes, which is provided between the illumination optical system and the original. In addition, an exposure apparatus has been proposed in the past that reduces the difference between the exposure amounts in multiple exposures to a connecting region by periodically varying the position of the substrate stage in a direction parallel to the optical axis of the projection optical system to change the distribution of the exposure amount in the exposure region. Further, conventionally, an exposure apparatus has been proposed in which the amount of exposure light in a joint area is adjusted by rotating a light blocking plate for changing the size of the illumination area of ​​the exposure light.

[0014] On the other hand, in order to suppress variations in the amount of exposure in the seam area when performing such seam exposure in an exposure apparatus, it is necessary to periodically measure the amount of exposure in the seam area. However, if the exposure dose is measured at many positions within the joint area, the time required for the measurement increases, and the throughput of the exposure apparatus decreases. On the other hand, by increasing the measurement interval, it is possible to suppress a decrease in throughput in the exposure apparatus, but in this case, there is a risk that the accuracy of the stitching exposure will decrease because the variation in the exposure amount in the stitching area will not be detected sufficiently.

[0015] Therefore, an object of the present embodiment is to provide an exposure apparatus that can suppress a decrease in throughput while maintaining the accuracy in suppressing the variation in the amount of exposure in the seam area. FIG. 1 shows a schematic cross-sectional view of an exposure apparatus 100 according to the first embodiment.

[0016] The exposure apparatus 100 according to this embodiment is a lithography apparatus used in a photolithography process included in the process of manufacturing devices such as semiconductor devices and flat panel displays (FPDs). Specifically, the exposure apparatus 100 according to this embodiment performs an exposure process in which the pattern of the original 3 is transferred to the substrate 16 by exposing the substrate 16 through an original 3 having an original surface on which a pattern is formed, and projecting an image of the pattern onto the substrate surface of the substrate 16.

[0017] The exposure apparatus 100 according to this embodiment includes an illumination optical system 1, an alignment scope 2, an original stage 27, a projection optical system 4, an exposure amount adjustment plate 19 (exposure amount adjustment unit), a substrate stage 17, and a control unit 20. The illumination optical system 1 is configured to guide exposure light to the original 3, and includes a light source 5, condenser lenses 6 and 8, a fly's eye lens 7, a variable slit 9 (light blocking portion), an imaging optical system 10, and a plane mirror 11.

[0018] The light source 5 includes a mercury lamp and an elliptical mirror, and is configured to emit light. The variable slit 9 is provided between the light source 5 and the original 3, and defines the illumination range on the substrate surface of the substrate 16 by transmitting (passing) only the light emitted from the light source 5 that enters the opening 9p.

[0019] The imaging optical system 10 includes a number of mirrors arranged to image the light that has passed through the variable slit 9 onto the original 3 . The plane mirror 11 is disposed in the illumination optical system 1 so as to bend the optical path of the light emitted from the light source 5 .

[0020] The alignment scope 2 detects alignment marks formed on the original 3 and the substrate 16, respectively, to perform alignment between the original 3 and the substrate 16. The projection optical system 4 projects an image of the pattern of the original 3 held by the original stage 27 onto the surface of the substrate 16 held by the substrate stage 17 .

[0021] Specifically, in the projection optical system 4, the exposure light that passes through the original 3 is transmitted through or reflected by the first parallel plate 13a, the plane mirror 14, the concave mirror 12, the convex mirror 15, the concave mirror 12, the plane mirror 14, and the second parallel plate 13b, in that order, and is guided onto the substrate 16. As a result, an image of the pattern formed on the original 3 is projected and transferred onto the surface of the substrate 16. The projection optical system 4 may be an equal-magnification imaging optical system that projects an image of the pattern of the original 3 onto the substrate surface of the substrate 16 at equal magnification, or may be an enlarged imaging optical system or a reduced imaging optical system.

[0022] The original stage 27 is configured to be movable in the scanning direction and the non-scanning direction while holding the original 3 so that the original surface of the original 3 is positioned at the position of the object plane of the projection optical system 4 . The substrate stage 17 is configured to be movable in the scanning direction and the non-scanning direction while holding the substrate 16 so that the substrate surface of the substrate 16 is positioned at the position of the image plane of the projection optical system 4 .

[0023] In addition, the substrate stage 17 is provided with a light amount sensor 18 (measurement unit) that measures the amount of exposure light guided onto the substrate surface of the substrate 16. Specifically, the light amount sensor 18 can measure the amount of exposure light at a predetermined position that is approximately the same height as the substrate surface of the substrate 16 when the substrate 16 is placed on the substrate stage 17 .

[0024] The exposure amount adjustment plate 19 is made of, for example, a metal, and is provided between the projection optical system 4 and the substrate 16 so as to block a portion of the exposure light that has passed through the projection optical system 4 . Specifically, the exposure amount adjustment plate 19 has a mechanism for moving at least in the non-scanning direction (X direction), and can adjust the amount of exposure light on the substrate 16 by adjusting the amount of exposure light to be blocked.

[0025] The control unit 20 includes a CPU, a memory, and the like, and is configured to control the exposure apparatus 100 as a whole. Specifically, the control unit 20 is configured to control the driving of the exposure amount adjusting plate 19 when performing stitching exposure, which will be described later, for example.

[0026] The exposure apparatus 100 according to this embodiment is configured to be able to perform stitching exposure on the substrate 16 . 2(a) to (c) are diagrams for explaining stitching exposure performed in the exposure apparatus 100 according to this embodiment.

[0027] Specifically, FIG. 2(a) is a top view of substrate 16 illustrating operation in a first exposure, exposing a first exposure area 22a on substrate 16. FIG. In the first exposure, the first exposure area 22a is exposed to the exposure light 23 while the original 3 and the substrate 16 are moved in the scanning direction (Y direction) in synchronization with each other.

[0028] FIG. 2(b) is a top view of the substrate 16 showing the operation after the first exposure area 22a has been exposed. Specifically, in FIG. 2(b), the original 3 and the substrate 16 are moved in the non-scanning direction (X direction) in synchronization with each other, and at this time, the substrate 16 is not exposed to light. At this time, the amount of movement of the original 3 and the substrate 16 in the non-scanning direction is determined so that no unexposed area is formed between the first exposure area 22a and the second exposure area 22b exposed by the second exposure, i.e., so that a portion of both overlaps with each other.

[0029] FIG. 2(c) is a top view of substrate 16 illustrating operation in a second exposure, exposing second exposure area 22b of substrate 16. In the second exposure, the second exposure area 22b is exposed to the exposure light 23 while the original 3 and the substrate 16 are moved in the scanning direction (Y direction) in synchronization with each other. Here, the second exposure region 22b is exposed so as to partially overlap with the first exposure region 22a, so that a stitching region 24 (a region exposed in an overlapping manner by stitching exposure) that partially overlaps with each other is formed between the first exposure region 22a and the second exposure region 22b.

[0030] That is, the first exposure region 22a includes a first non-joint region 25a and a first joint region 24 arranged in the non-scanning direction (FIG. 3). Further, the second exposure region 22b includes a second joint region 24 overlapping the first joint region 24 and a second non-joint region 25b, which are arranged in the non-scanning direction (FIG. 3). In the exposure apparatus 100 according to the present embodiment, scanning exposure is performed twice on the first exposure region 22a and the second exposure region 22b, but the present invention is not limited to this and scanning exposure may be performed three or more times.

[0031] FIG. 3 shows the position dependence in the non-scanning direction of the integrated exposure amount and the combined integrated exposure amount by stitching exposure of the first exposure area 22a and the second exposure area 22b in the exposure apparatus 100 according to this embodiment. Here, the integrated exposure amount at a given position is the integrated value of the exposure amount in one scanning exposure performed on the given position. The total integrated exposure amount at a given position is the sum of the integrated values ​​of the exposure amounts in the respective scanning exposures performed at that given position. In addition, in FIG. 3, the integrated exposure amount of the first non-connecting region 25a when the first exposure region 22a is exposed shows a constant value of 100 percent, and the integrated exposure amount of the second non-connecting region 25b when the second exposure region 22b is exposed shows a constant value of 100 percent.

[0032] Specifically, FIG. 3 shows the non-scanning direction position dependency 26a of the integrated exposure amount in the first exposure area 22a due to the first exposure, and the non-scanning direction position dependency 26b of the integrated exposure amount in the second exposure area 22b due to the second exposure. FIG. 3 also shows the non-scanning direction position dependency 26 of the combined integrated exposure amount of the integrated exposure amount (first integrated exposure amount) in the first exposure area 22a by the first exposure and the integrated exposure amount (second integrated exposure amount) in the second exposure area 22b by the second exposure. The non-scanning direction position dependencies 26a and 26b of the integrated exposure amount shown in FIG. 3 are at the same predetermined positions in the scanning direction.

[0033] The stitching region 24 is overlappingly exposed by a first exposure to the first exposure region 22a and a second exposure to the second exposure region 22b. Therefore, in order to make the total integrated exposure amount uniform over the entire first exposure region 22a and the second exposure region 22b, it is necessary to adjust the total integrated exposure amount in the joint region 24.

[0034] Specifically, the integrated exposure amount of the first exposure region 22a due to the first exposure is adjusted so that the integrated exposure amount in the first non-connecting region 25a is approximately 100 percent, while in the connecting region 24, the integrated exposure amount decreases to 0 percent at the end opposite the first non-connecting region 25a. Also, the integrated exposure amount of the second exposure region 22b by the second exposure is adjusted so that the integrated exposure amount in the second non-connecting region 25b is approximately 100 percent, while in the connecting region 24, the integrated exposure amount decreases to 0 percent at the end opposite the second non-connecting region 25b. This makes it possible to make the total integrated exposure amount in each of the first non-connection region 25a, the connection region 24, and the second non-connection region 25b approximately equal to each other.

[0035] Next, a specific method for adjusting the combined integrated exposure amount in the connection region 24 in the exposure apparatus 100 according to this embodiment will be described.

[0036] Figure 4(a) is a top view showing the positional relationship (first configuration) between the opening 9p formed in the variable slit 9 and the exposure dose adjustment plate 19a and the first exposure area 22a when exposing the first exposure area 22a in the exposure apparatus 100 of this embodiment. In the exposure apparatus 100 according to this embodiment, the exposure amount adjusting plate 19 includes an exposure amount adjusting plate 19a and an exposure amount adjusting plate 19b.

[0037] In the exposure apparatus 100 according to this embodiment, during the first exposure, as shown in FIG. 4(a), the exposure dose adjustment plate 19a is inserted in the non-scanning direction (X direction) so as to block part of the optical path of the exposure light between the projection optical system 4 and the substrate 16, i.e., part of the opening 9p of the variable slit 9. This makes it possible to reduce the amount of exposure in the stitching region 24 when the first exposure region 22a is exposed by the first exposure.

[0038] Figure 4(b) is a top view showing the positional relationship (second configuration) between the opening 9p formed in the variable slit 9 and the exposure dose adjustment plate 19b and the second exposure area 22b when exposing the second exposure area 22b in the exposure apparatus 100 of this embodiment. In the exposure apparatus 100 according to this embodiment, during the second exposure, as shown in FIG. 4(b), the exposure dose adjustment plate 19b is inserted in the non-scanning direction (X direction) so as to block the optical path of the exposure light between the projection optical system 4 and the substrate 16, i.e., part of the opening 9p of the variable slit 9. This makes it possible to reduce the amount of exposure in the stitching region 24 when the second exposure region 22b is exposed by the second exposure.

[0039] That is, in exposure apparatus 100 according to this embodiment, the amount of exposure in joint region 24 in each of the first exposure and second exposure can be adjusted by the magnitude of driving of exposure amount adjusting plates 19a and 19b. Specifically, the exposure adjustment plates 19a and 19b each have edges extending in a direction intersecting the scanning direction, i.e., non-parallel to both the scanning direction and the non-scanning direction, so that the integrated exposure amount in the connecting region 24 can be made approximately the same as the integrated exposure amount in each non-connecting region.

[0040] The integrated exposure amount on the surface of the substrate 16 can be measured by a light amount sensor 18 provided on the substrate stage 17 . Specifically, for the first exposure, the light intensity sensor 18 measures the integrated exposure amount of each of the connecting area 24 of the first exposure area 22a and a part of the first non-connecting area 25a in the first measurement range 9a shown in Figure 4(a). More specifically, for the first exposure, the light amount sensor 18 measures the integrated exposure amount in each of an area (fourth area) corresponding to the joint area 24 and an area (third area) corresponding to a part of the first non-joint area 25a.

[0041] That is, when the light quantity sensor 18 measures the integrated exposure amount in the first measurement range 9a, the exposure amount adjustment plate 19a is inserted in advance so that the exposure amount distribution in the non-scanning direction in the connecting region 24 is continuous between 0 and 100 percent, as shown in FIG. 4(a). Then, the substrate stage 17 is driven so that the light quantity sensor 18 is positioned at a predetermined position in the scanning direction and at an end of the connecting region 24 opposite the first non-connecting region 25a in the non-scanning direction, and the integrated exposure amount of that end is measured by the light quantity sensor 18.

[0042] Next, the substrate stage 17 is stepped in the non-scanning direction so that the light quantity sensor 18 is positioned at a position a predetermined distance away from the end portion toward the first non-connecting region 25a in the non-scanning direction, and the light quantity sensor 18 then measures the integrated exposure amount at that position. Then, by repeating the above step driving and measurement until the light amount sensor 18 is positioned at the end of the first measurement range 9a on the first non-connecting region 25a side, the integrated exposure amount in the first measurement range 9a can be measured.

[0043] In addition, for the second exposure, the light intensity sensor 18 measures the integrated exposure amount of each of the connecting area 24 of the second exposure area 22b and a part of the second non-connecting area 25b in the second measurement range 9b shown in Figure 4 (b). More specifically, for the second exposure, the light amount sensor 18 measures the integrated exposure amount in each of an area corresponding to the joint area 24 and an area corresponding to a part of the second non-joint area 25b.

[0044] That is, when the light quantity sensor 18 measures the integrated exposure amount in the second measurement range 9b, the exposure quantity adjustment plate 19b is inserted in advance so that the exposure quantity distribution in the non-scanning direction in the connecting region 24 is continuous between 0 and 100 percent, as shown in FIG. 4(b). Then, the substrate stage 17 is driven so that the light quantity sensor 18 is positioned at a predetermined position in the scanning direction and at an end of the connecting region 24 opposite the second non-connecting region 25b in the non-scanning direction, and the integrated exposure amount of that end is measured by the light quantity sensor 18.

[0045] Next, the substrate stage 17 is stepped in the non-scanning direction so that the light quantity sensor 18 is positioned at a position a predetermined distance away from the end portion toward the second non-connecting region 25b in the non-scanning direction, and the light quantity sensor 18 then measures the integrated exposure amount at that position. Then, by repeating the above step driving and measurement until the light amount sensor 18 is positioned at the end of the second measurement range 9b on the second non-connecting region 25b side, it is possible to measure the integrated exposure amount in the second measurement range 9b.

[0046] FIG. 5 shows the position dependency in the non-scanning direction of the combined integrated exposure dose measured in the first measurement range 9a and the second measurement range 9b in exposure apparatus 100 according to this embodiment. FIG. 6A is a flow chart showing the process of determining the feature point at which the integrated exposure amount is measured when determining whether to adjust the exposure amount of the connection region 24 in the exposure apparatus 100 according to this embodiment. Each step in the flowchart is executed by the control unit 20.

[0047] First, when the process starts, in a configuration for exposing the first exposure area 22a, the light amount sensor 18 measures the integrated exposure amount of the first measurement range 9a while exposing an area (first area) corresponding to the first exposure area 22a (step S11). In step S11, in the configuration for exposing the second exposure region 22b, the light amount sensor 18 measures the integrated exposure amount in the second measurement range 9b while exposing a region (second region) corresponding to the second exposure region 22b.

[0048] Next, a tolerance value is determined for determining a characteristic point at which the integrated exposure amount is measured when determining whether or not to adjust the exposure amount of the joint area 24 (step S12). Specifically, in step S12, the tolerance value is determined from the integrated exposure amount (total integrated exposure amount) measured in each of the first non-joint region 25a and the second non-joint region 25b.

[0049] More specifically, in step S12, as shown in FIG. 5, the maximum value of the integrated exposure amount measured in the first non-joint region 25a and the integrated exposure amount measured in the second non-joint region 25b is calculated as a first plus-side tolerance value T 1+ Set to. For example, the value obtained by adding 0.5% of the maximum value to the maximum value, in other words, the value obtained by multiplying the maximum value by 1.005, is set as the first plus-side tolerance value T 1+ (second positive tolerance value, second tolerance value).

[0050] The minimum value of the integrated exposure amount measured in the first non-joint region 25a and the integrated exposure amount measured in the second non-joint region 25b is set as a first negative tolerance value T 1- (second negative tolerance value, second tolerance value). For example, the value obtained by subtracting 0.5% of the minimum value from the minimum value, in other words, the value obtained by multiplying the minimum value by 0.995, is set as the first negative tolerance value T 1- It is okay to set it to .

[0051] The first positive tolerance value T 1+ and the first negative tolerance value T 1- is preferably determined from the integrated exposure dose in the first non-connection region 25a and the second non-connection region 25b measured in the exposure apparatus 100 as described above, but is not limited to this. That is, the first positive tolerance value T is calculated using a predetermined measurement value obtained by another device. 1+ and the first negative tolerance value T 1- It is acceptable to determine the following.

[0052] Next, a plus side characteristic point is determined from the total integrated exposure amount measured in the joint region 24 (step S13, determination step). Specifically, in step S13, as shown in FIG. 5, the first plus-side tolerance value T 1+ The positive side feature points 30a and 30b exceeding the positive side are determined. As shown in FIG. 5, the total integrated exposure amount at a plurality of consecutive positions is equal to or smaller than the first plus tolerance value T 1+ If it exceeds , the position with the largest total integrated exposure amount among the multiple positions may be set as the plus side characteristic point.

[0053] Next, a minus side characteristic point is determined from the total integrated exposure amount measured in the joint region 24 (step S14, determining step). Specifically, in step S14, as shown in FIG. 5, the first negative tolerance value T 1- A minus side characteristic point 31a that is smaller than As shown in FIG. 5, the total integrated exposure amount at a plurality of consecutive positions is equal to or smaller than the first negative tolerance value T1- If the total integrated exposure amount is less than 1, the position among the plurality of positions where the total integrated exposure amount is the smallest may be set as the minus side characteristic point.

[0054] The plus side feature points 30a, 30b and the minus side feature point 31a are then stored (stored) in association with the position corresponding to the joint region 24 in the aperture 9p when the first exposure region 22a and the second exposure region 22b are exposed and with the settings of the illumination optical system 1 (step S15).Then, the process ends. Specifically, the position of the opening 9p corresponding to the joint region 24 can be the relative position of the joint region 24 with respect to the opening 9p in the non-scanning direction.

[0055] The settings of the illumination optical system 1 here include, for example, the type of light source 5 and the mode of the light source 5, such as the number and combination of filters that adjust the amount of light emitted from the light source 5. In this manner, the combined integrated exposure dose measured in the first measurement range 9a and the second measurement range 9b is managed by the control unit 20 in association with information on the connection position in the exposure tool 100.

[0056] In the exposure apparatus 100 according to this embodiment, the combined integrated exposure amount at characteristic points such as the positive side characteristic points 30a, 30b and the negative side characteristic point 31a (at least one position) determined above is measured to determine whether to adjust the exposure amount of the connecting region 24. FIG. 6B is a flowchart showing the process of determining whether to adjust the amount of exposure in the connection region 24 in the exposure apparatus 100 according to this embodiment.

[0057] First, the exposure device 100 exposes the positive and negative side feature points of the joint area 24 to light (third exposure) with a configuration that exposes the first exposure area 22a. Then, the light amount sensor 18 measures the integrated exposure amount at each of the positive and negative side feature points of the joint area 24 (step S21). Next, the exposure device 100 exposes the positive side feature point and the negative side feature point of the joint area 24 to light (fourth exposure) with a configuration for exposing the second exposure area 22b. Then, the light amount sensor 18 measures the integrated exposure amount at each of the positive side feature point and the negative side feature point of the joint area 24 (step S22).

[0058] Then, the sum of the two integrated exposure amounts at the positive side characteristic points of the joint area 24 measured as described above is determined to be a second positive side tolerance value T 2+ It is determined whether the difference exceeds (the first positive tolerance value, the first tolerance value) (step S23, comparison step). The second positive tolerance value T 2+ can be determined according to the accuracy required for the total integrated exposure amount of the joint region 24 when compared with the total integrated exposure amount of the first non-joint region 25a and the second non-joint region 25b. In other words, the second positive tolerance value T 2+ is the first positive tolerance value T 1+ It can be determined according to the exposure performance required in the stitching exposure of the exposure apparatus 100.

[0059] If the total integrated exposure amount at the positive side characteristic point is less than the second positive side tolerance value T 2+ If it does not exceed (No in step S23), the process proceeds to step S24. On the other hand, if the total integrated exposure amount at the positive side characteristic point is less than the second positive side tolerance value T 2+ If it exceeds (Yes in step S23), it is determined that the amount of exposure in the connection region 24 needs to be adjusted (step S25, determination step), and the process ends.

[0060] Next, in step S24, the sum of the two integrated exposure amounts at the minus side characteristic points of the joint area 24 measured as described above is calculated based on a second minus side tolerance value T 2- It is determined whether the value is lower than the threshold (comparison process). The second negative tolerance value T2- can be determined according to the accuracy required for the combined integrated exposure amount of the joint region 24 when compared with the integrated exposure amounts of the first non-join region 25a and the second non-join region 25b. In other words, the second negative tolerance value T 2- (First negative tolerance value, first tolerance value) is the first negative tolerance value T 1- It can be determined according to the exposure performance required in the stitching exposure of the exposure apparatus 100.

[0061] If the total integrated exposure amount at the negative side characteristic point is less than the second negative side tolerance value T 2- If it is not below (No in step S24), the process proceeds to step S21 and then continues. On the other hand, if the total integrated exposure amount at the negative side characteristic point is less than the second negative side tolerance value T 2- If it is lower than this (Yes in step S24), it is determined that the amount of exposure in the joint area 24 needs to be adjusted (step S25), and the process ends.

[0062] The total integrated exposure of the positive side characteristic points is the second positive side tolerance value T 2+ and the total integrated exposure amount of the negative side characteristic points is equal to or less than the second negative side tolerance value T 2- At this point, stitching exposure is performed on the first exposure region 22a and the second exposure region 22b. That is, the process of determining whether adjustment of the exposure amount of the stitching region 24 in the exposure apparatus 100 according to this embodiment is necessary may be performed immediately before each stitching exposure performed in the exposure apparatus 100. Furthermore, the process of making this determination may be performed when the product layout is changed, or may be performed every time a predetermined time period elapses.

[0063] In addition, the adjustment (adjustment process) of the exposure amount in the connecting region 24 is performed so as to reduce the absolute value of the difference between the maximum value of the combined integrated exposure amount at each of the multiple positions in the connecting region 24 and the average value of the integrated exposure amount in the first non-connecting region 25a and the second non-connecting region 25b. In addition, the adjustment is performed to reduce the absolute value of the difference between the minimum value of the combined integrated exposure amount at each of the multiple positions within the connecting region 24 and the average value of the integrated exposure amount in the first non-connecting region 25a and the second non-connecting region 25b.

[0064] In other words, in this adjustment, the configuration of the exposure device 100, specifically the positions of the opening 9p formed in the variable slit 9 and the exposure amount adjustment plates 19a and 19b when exposing the first exposure area 22a and the second exposure area 22b, are adjusted so as to reduce the above-mentioned difference. In addition, the number of measurement positions for the total accumulated exposure amount within the connecting region 24 in this adjustment may be determined according to the accuracy of the adjustment, and the adjustment may be performed using the total accumulated exposure amount measured at the positive side characteristic point and the negative side characteristic point within the connecting region 24.

[0065] As described above, in the exposure apparatus 100 according to this embodiment, first, the first plus-side tolerance value T 1+ and the first negative tolerance value T 1- Based on this, feature points including the positive side feature points and the negative side feature points in the joint region 24 are determined. Specifically, in the exposure apparatus 100 according to this embodiment, a first positive tolerance value T 1+ and the first negative tolerance value T 1- is determined. Then, the determined first positive tolerance value T 1+ and the first negative tolerance value T 1- and the measurement result of the total integrated exposure amount by the light amount sensor 18 in the joint area 24 are compared with each other to determine the characteristic points in the joint area 24.

[0066] In the exposure apparatus 100 according to the present embodiment, the measurement result of the total integrated exposure amount by the light amount sensor 18 at the determined characteristic point and the second plus side tolerance value T 2+ and the second negative tolerance value T 2- and are compared with each other. Then, based on the comparison, it is determined whether or not the exposure amount of the joint area 24 needs to be adjusted.

[0067] In this way, in the exposure apparatus 100 according to this embodiment, the number of measurement positions for the combined integrated exposure amount within the connection region 24 when making this determination is reduced, thereby reducing the measurement time and improving throughput. That is, according to this embodiment, it is possible to provide an exposure apparatus that is advantageous in terms of both the accuracy in measuring the total integrated exposure amount in the joint area 24 and the processing time.

[0068] [Second embodiment] FIG. 7(a) shows the position dependency in the non-scanning direction of the combined integrated exposure dose measured in the first measurement range 9a and the second measurement range 9b in the exposure apparatus according to the second embodiment. Since the exposure apparatus according to this embodiment has the same configuration as the exposure apparatus 100 according to the first embodiment, the same members are given the same reference numbers and descriptions thereof are omitted.

[0069] The exposure apparatus according to this embodiment has a first plus-side tolerance value T 1+ The positive feature value and the first negative tolerance value T 1- If no minus feature point below is obtained, the following process is performed. FIG. 8 is a flowchart showing the process of determining the feature point at which the integrated exposure amount is measured when determining whether to adjust the exposure amount of the connection region 24 in the exposure apparatus according to this embodiment. Each step in the flowchart is executed by the control unit 20.

[0070] First, when the process starts, similarly to step S11 in exposure apparatus 100 according to the first embodiment, the combined integrated exposure amount in first measurement range 9a and second measurement range 9b is measured (step S31). Next, a first positive tolerance value T is used to determine a positive characteristic point at which the integrated exposure amount is measured when determining whether to adjust the exposure amount of the connection region 24. 1+ is determined (step S32).

[0071] That is, in step S32, the maximum value of the integrated exposure amount measured in the first non-joint area 25a and the integrated exposure amount measured in the second non-joint area 25b is set as a first plus-side tolerance value T 1+ Set to. For example, the value obtained by adding 0.5% of the maximum value to the maximum value, in other words, the value obtained by multiplying the maximum value by 1.005, is set as the first plus-side tolerance value T 1+ It is okay to set it to .

[0072] Next, the first plus tolerance value T 1+ It is determined whether there is a positive side feature point (first position) that exceeds this, that is, whether the positive side feature point can be determined (step S33). If the positive side feature point is present (Yes in step S33), the positive side feature point is determined (step S34) in the same manner as in step S13 in exposure apparatus 100 according to the first embodiment, and the process proceeds to step S36. On the other hand, as shown in FIG. 7(a), if the positive side feature point is not present (No in step S33), the process proceeds to step S35.

[0073] In step S35, the positions of the exposure dose adjustment plates 19a and 19b as shown in Figures 4(a) and (b) are shifted a predetermined distance in the non-scanning direction so as to reduce the area that is shaded in the exposure area by the opening 9p of the variable slit 9, and then the process returns to step S31. This makes it possible to increase the total integrated exposure amount in the joint area 24 .

[0074] Figure 7(b) shows the position dependence in the non-scanning direction of the combined integrated exposure dose measured in the first measurement range 9a and the second measurement range 9b after shifting the positions of the exposure dose adjustment plates 19a and 19b in the non-scanning direction at least once in step S35. As shown in FIG. 7(b), it can be seen that the combined integrated exposure amount in the joint region 24 is generally increased compared to the case shown in FIG. 7(a). Then, in step S34, the plus side characteristic points 30a and 30b can be determined from the position dependency in the non-scanning direction of the combined integrated exposure amount of the joint region 24 as shown in FIG. 7(b).

[0075] Next, in step S36, the combined integrated exposure amount in the first measurement range 9a and the second measurement range 9b is measured in the same manner as in step S31. Next, a first minus side tolerance value T is used to determine a minus side characteristic point at which the integrated exposure amount is measured when determining whether to adjust the exposure amount of the connection region 24. 1- is determined (step S37).

[0076] That is, in step S37, the minimum value of the integrated exposure amount measured in the first non-joint region 25a and the integrated exposure amount measured in the second non-joint region 25b is set as the first negative tolerance value T 1- Set to. For example, the value obtained by subtracting 0.5% of the minimum value from the minimum value, in other words, the value obtained by multiplying the minimum value by 0.995, is set as the first negative tolerance value T 1- It is okay to set it to .

[0077] Next, the first negative tolerance value T 1- It is determined whether there is a minus side feature point (second position) that is below (step S38), that is, whether the minus side feature point can be determined. If the minus side feature point is present (Yes in step S38), the minus side feature point is determined (step S39) in the same manner as in step S14 in exposure apparatus 100 according to the first embodiment, and the process proceeds to step S41. On the other hand, as shown in FIG. 7(a), if there is no minus side feature point (No in step S38), the process proceeds to step S40.

[0078] In step S40, the positions of the exposure dose adjustment plates 19a and 19b as shown in Figures 4(a) and (b) are shifted a predetermined distance in the non-scanning direction so as to increase the area that is shaded in the exposure area by the opening 9p of the variable slit 9, and then the process returns to step S36. This makes it possible to reduce the total integrated exposure amount in the joint area 24 .

[0079] Figure 7(c) shows the position dependence in the non-scanning direction of the combined integrated exposure dose measured in the first measurement range 9a and the second measurement range 9b after shifting the positions of the exposure dose adjustment plates 19a and 19b in the non-scanning direction at least once in step S40. As shown in FIG. 7(c), it can be seen that the combined integrated exposure amount in the joint region 24 is generally reduced compared to the case shown in FIG. 7(a). Then, in step S39, a minus side characteristic point 31a can be determined from the position dependency in the non-scanning direction of the combined integrated exposure amount of the joint region 24 as shown in FIG. 7(c).

[0080] Finally, in step S41, the plus side feature points 30a and 30b and the minus side feature point 31a are stored in association with the position corresponding to the joint region 24 in the aperture 9p when the first exposure region 22a and the second exposure region 22b are exposed and with the settings of the illumination optical system 1. Then, the process ends. In the exposure apparatus according to this embodiment as well, steps S21 to S25 are carried out in the same manner as in the exposure apparatus 100 according to the first embodiment, to determine whether adjustment of the exposure amount in the connection region 24 is necessary.

[0081] As described above, in the exposure apparatus according to this embodiment, first, the first plus side tolerance value T 1+ and the first negative tolerance value T 1- Based on this, feature points including the positive side feature points and the negative side feature points in the joint region 24 are determined. Then, the total integrated exposure amount measured at the determined characteristic point and the second positive tolerance value T 2+ and the second negative tolerance value T 2- and are compared with each other to determine whether adjustment of the exposure amount in the joint area 24 is necessary. This reduces the time required to measure the total integrated exposure amount in the joint area 24 when making this determination, thereby improving throughput.

[0082] Furthermore, in the exposure apparatus according to this embodiment, when it is not possible to determine a feature point including a positive side feature point and a negative side feature point as described above, the position of the exposure amount adjustment plate 19 is shifted to adjust the exposure amount of the connection region 24 so that the feature point can be determined. This makes it possible to determine whether adjustment of the exposure amount of the stitching region 24 is necessary while dealing with various stitching exposures.

[0083] In the exposure apparatus according to this embodiment, the first negative tolerance value T 1- If the minus-side feature point of the joint region 24 cannot be determined based on the above, the above effect can be obtained even if the central position of the joint region 24 in the non-scanning direction is set as the minus-side feature point. In this embodiment, exposure is performed so that the integrated exposure amount in the first non-connection region 25a and the second non-connection region 25b is substantially constant.

[0084] Although the preferred embodiments have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof. Furthermore, this embodiment includes an exposure method that performs the above-described processing, in addition to the exposure apparatus according to either the first or second embodiment described above.

[0085] [Production method] Next, a method for manufacturing an article using the exposure apparatus according to this embodiment will be described.

[0086] The articles manufactured here include semiconductor devices, display devices, color filters, optical components, and microelectromechanical systems (MEMS). For example, semiconductor devices are manufactured through a front-end process for creating circuit patterns on a wafer and a back-end process including processing steps for completing the circuit chips created in the front-end process into products.

[0087] The pre-processing includes an exposure process in which a wafer coated with a photosensitive agent is exposed using the exposure apparatus according to this embodiment, and a development process in which the photosensitive agent exposed in the exposure process is developed. Then, by carrying out an etching process, an ion implantation process, etc. on the wafer using the developed photosensitive agent pattern as a mask, a circuit pattern is formed on the wafer.

[0088] By repeating these steps of exposure, development, etching, etc., a circuit pattern consisting of multiple layers is formed on the wafer. In the post-process, dicing is performed on the wafer on which the circuit pattern is formed, and chip mounting, bonding and inspection processes are performed.

[0089] The display device is manufactured through a process of forming a transparent electrode. The process of forming a transparent electrode includes the steps of applying a photosensitive agent onto a glass wafer on which a transparent conductive film has been vapor-deposited, exposing the glass wafer on which the photosensitive agent has been applied using an exposure apparatus according to this embodiment, and developing the exposed photosensitive agent.

[0090] According to the method for manufacturing an article according to this embodiment, it is possible to manufacture an article with higher quality and higher productivity than before.

[0091] The disclosure of this embodiment includes the following configurations and methods. (Configuration 1) An exposure apparatus that projects an image of a pattern of an original onto a substrate surface of a substrate while scanning an original and a substrate in a scanning direction, thereby exposing the substrate, the exposure apparatus comprising: a substrate stage that is movable in the scanning direction and a non-scanning direction perpendicular to the scanning direction within the substrate surface while holding the substrate; a measurement unit that measures an exposure amount at a predetermined position on the substrate surface of the substrate held by the substrate stage; and a control unit that controls the exposure, wherein a first exposure area on the substrate surface includes a first non-connecting area and a first connecting area that are arranged in the non-scanning direction, and a second exposure area on the substrate surface includes a second non-connecting area that overlaps the first connecting area that is arranged in the non-scanning direction. an exposure apparatus including a connecting region and a second non-connecting region, wherein a control unit performs a determination step of determining whether to expose the first exposure region and the second exposure region by comparing a measurement result of the exposure amount by the measurement unit at at least one position in the first connecting region and the second connecting region with a first tolerance value, and the at least one position is determined by comparing a second tolerance value determined from the measurement result of the exposure amount by the measurement unit in the first non-connecting region and the second non-connecting region with the measurement result of the exposure amount by the measurement unit in the first connecting region and the second connecting region. (Configuration 2) The exposure apparatus described in Configuration 1, characterized in that the second tolerance value includes a second plus-side tolerance value that is the maximum value of the integrated exposure amount acquired in a third region corresponding to the first non-connection region and the second non-connection region and a second minus-side tolerance value that is the minimum value of the integrated exposure amount acquired in the third region, out of an integrated exposure amount acquired by integrating the exposure amount measured in a first region during a first exposure to expose a first region corresponding to the first exposure region on the substrate stage in a first configuration of the exposure apparatus when exposing the first exposure region, and an integrated exposure amount acquired in a second region during a second exposure to expose a second region corresponding to the second exposure region on the substrate stage in a second configuration of the exposure apparatus when exposing the second exposure region. (Configuration 3) The exposure apparatus described in Configuration 2, characterized in that the at least one position includes a position that is continuous with one another in the non-scanning direction and has the largest total integrated exposure amount among a plurality of positions whose total integrated exposure amount exceeds a second plus side tolerance value, and a position that is continuous with one another in the non-scanning direction and has the smallest total integrated exposure amount among a plurality of positions whose total integrated exposure amount is below a second minus side tolerance value, and the total integrated exposure amount is obtained by adding together a first integrated exposure amount obtained during the first exposure and a second integrated exposure amount obtained during the second exposure. (Configuration 4) An exposure apparatus according to configuration 2 or 3, characterized in that the determination step includes a step of acquiring a first integrated exposure amount at the at least one position by performing a third exposure to expose the at least one position in the first configuration, a step of acquiring a second integrated exposure amount at the at least one position by performing a fourth exposure to expose the at least one position in the second configuration, and a step of comparing a combined integrated exposure amount of the first integrated exposure amount and the second integrated exposure amount at the at least one position with a first tolerance value. (Configuration 5) The exposure apparatus described in Configuration 4, characterized in that the first tolerance value is determined based on the exposure performance of the exposure apparatus and includes a first plus side tolerance value that is greater than the second plus side tolerance value, and a first minus side tolerance value that is determined based on the exposure performance and is smaller than the second minus side tolerance value, and the determination process includes a process of exposing the first exposure area and the second exposure area by the control unit when the combined integrated exposure amount at at least one position is less than the first plus side tolerance value and greater than the first minus side tolerance value. (Configuration 6) An exposure apparatus according to Configuration 5, characterized in that the judgment process includes an adjustment process of adjusting the configuration of the exposure apparatus when the total integrated exposure amount at at least one position exceeds a first positive side tolerance value or is below a first negative side tolerance value. (Configuration 7) The exposure apparatus described in Configuration 6, wherein the adjustment step includes a step of adjusting the configuration of the exposure apparatus so that the absolute value of the difference between the maximum value of the combined integrated exposure amount at each of a plurality of positions in a fourth region corresponding to the first connecting region and the second connecting region and the average value of the integrated exposure amount in the third region, and the absolute value of the difference between the minimum value and the average value of the combined integrated exposure amount at each of the plurality of positions are reduced. (Configuration 8) An exposure apparatus according to configuration 7, wherein the multiple positions are at least one position. (Configuration 9) The exposure apparatus described in any one of Configurations 1 to 8, characterized in that the judgment step includes a determination step of determining at least one position by comparing a combined integrated exposure amount of a first integrated exposure amount obtained by integrating exposure amounts measured in a fourth region corresponding to the first connecting region and the second connecting region during a first exposure to expose a first region corresponding to the first exposure region on the substrate stage in a first configuration of the exposure apparatus when exposing the first exposure region, and a second integrated exposure amount obtained in the fourth region during a second exposure to expose a second region corresponding to the second exposure region on the substrate stage in a second configuration of the exposure apparatus when exposing the second exposure region, with a second tolerance value. (Configuration 10) The exposure apparatus described in Configuration 9, characterized in that the second tolerance value includes a second plus side tolerance value which is the maximum value of the integrated exposure amount acquired in a third region corresponding to the first non-connection region and the second non-connection region, and a second minus side tolerance value which is the minimum value of the integrated exposure amount acquired in the third region, among the integrated exposure amount acquired in the first region during the first exposure and the integrated exposure amount acquired in the second region during the second exposure, and the determination process includes a process of determining, within the fourth region, a position with the largest integrated integrated exposure amount among a plurality of positions that are consecutive to each other in the non-scanning direction and whose respective integrated integrated exposure amounts exceed the second plus side tolerance value, and a position with the smallest integrated integrated exposure amount among a plurality of positions that are consecutive to each other in the non-scanning direction and whose respective integrated integrated exposure amounts are below the second minus side tolerance value. (Configuration 11) An exposure apparatus according to Configuration 10, wherein the determination process includes a process of performing a first exposure and a second exposure, a process of acquiring an integrated exposure amount in the first region and an integrated exposure amount in the second region, and a process of acquiring a combined integrated exposure amount in the fourth region. (Configuration 12) An exposure apparatus according to configuration 11, characterized in that the determination process includes a process of determining a second positive side tolerance value and a second negative side tolerance value as the maximum and minimum values ​​of the integrated exposure amount in the third region, respectively. (Configuration 13) The exposure apparatus described in Configuration 12, wherein the determination step includes a step of determining whether a first position is detected at which the combined integrated exposure amount exceeds a second positive side tolerance value, a step of adjusting the first configuration and the second configuration so that the exposure amount in the fourth region is increased when it is determined that the first position is not detected, a step of acquiring a first integrated exposure amount in the fourth region by performing a first exposure in the adjusted first configuration, and a step of acquiring a second integrated exposure amount in the fourth region by performing a second exposure in the adjusted second configuration. (Configuration 14) The exposure apparatus described in configuration 12 or 13, wherein the determination step includes a step of determining whether a second position is detected at which the total integrated exposure amount falls below a second negative side tolerance value, a step of adjusting the first configuration and the second configuration so that the exposure amount in the fourth region is reduced when it is determined that the second position is not detected, a step of performing a first exposure in the adjusted first configuration to obtain a first integrated exposure amount in the fourth region, and a step of performing a second exposure in the adjusted second configuration to obtain a second integrated exposure amount in the fourth region. (Structure 15) An exposure apparatus described in any one of structures 9 to 14, characterized in that it includes a light source that emits light and a light-shielding section in which an opening through which the light from the light source passes is formed, and is equipped with an illumination optical system that guides the exposure light to the original, and the determination process includes a process of storing by a control unit at least one of the determined positions and at least one of the type of light source, the mode of the light source, and the relative position of the fourth region with respect to the opening in the non-scanning direction in correspondence with each other. (Configuration 16) An exposure apparatus described in any one of configurations 1 to 15, characterized in that it includes an exposure amount adjustment unit that adjusts the exposure amount in the first connecting region and the second connecting region by blocking at least a portion of the exposure light by moving in a non-scanning direction, and is equipped with a projection optical system that guides the exposure light that has passed through the original to the substrate. (Method 1) A method for manufacturing an article, comprising the steps of exposing a substrate by the exposure apparatus according to any one of configurations 1 to 16, and developing the exposed substrate. (Method 2) An exposure method in which an image of a pattern of an original is projected onto the substrate surface while scanning the original and the substrate in the scanning direction in an exposure apparatus including a substrate stage capable of moving in a scanning direction parallel to the substrate surface of the substrate and in a non-scanning direction perpendicular to the scanning direction within the substrate surface while holding the substrate, and a measurement unit that measures an exposure amount at a predetermined position on the substrate surface of the substrate held by the substrate stage, and the substrate is exposed to light, the exposure method comprising: scanning the original and the substrate in the scanning direction while projecting an image of a pattern of the original onto the substrate surface, the exposure method comprising: a first exposure area on the substrate surface including a first non-joint area and a first joint area that are arranged in the non-scanning direction; and a second exposure area on the substrate surface including a second non-joint area that overlaps the first joint area that is arranged in the non-scanning direction. and a second non-connecting region, and the exposure method includes a determination step of determining whether to expose the first exposure region and the second exposure region by comparing a measurement result of the exposure amount by a measurement unit at at least one position in the first connection region and the second connection region with a first tolerance value, and the at least one position is determined by comparing a second tolerance value determined from the measurement result of the exposure amount by the measurement unit in the first non-connecting region and the second non-connecting region with the measurement result of the exposure amount by the measurement unit in the first connection region and the second connection region. [Explanation of symbols]

[0092] 3 Original version 16 Substrate 17 Substrate stage 18 Light quantity sensor (measurement part) 20 Control section 22a First exposure area 22b Second exposure area 24 First joint area, second joint area 25a First non-connected area 25b Second non-connected area 30a, 30b, 31a Feature points (at least one position) 100 Exposure device

Claims

1. 1. An exposure apparatus that exposes a substrate by projecting an image of a pattern of an original onto a substrate surface while scanning an original and a substrate in a scanning direction, comprising: a substrate stage that is movable in the scanning direction and in a non-scanning direction perpendicular to the scanning direction within a surface of the substrate while holding the substrate; a measurement unit that measures an exposure amount at a predetermined position on a surface of the substrate held by the substrate stage; A control unit that controls the exposure; Equipped with the first exposure area on the substrate surface includes a first non-joining area and a first joining area arranged in the non-scanning direction; the second exposure area on the substrate surface includes a second connection area and a second non-connection area that overlap the first connection area and are arranged in the non-scanning direction; the control unit performs a determination step of determining whether to expose the first exposure region and the second exposure region by comparing a measurement result of the exposure amount by the measurement unit at at least one position in the first connection region and the second connection region with a first tolerance value; an exposure apparatus characterized in that the at least one position is determined by comparing a second tolerance value determined from the measurement results of the exposure amount by the measurement unit in the first non-connecting region and the second non-connecting region with the measurement results of the exposure amount by the measurement unit in the first connecting region and the second connecting region.

2. 2. The exposure apparatus according to claim 1, wherein the second tolerance value includes an integrated exposure amount obtained by integrating the exposure amounts measured in a first region during a first exposure to expose a first region corresponding to the first exposure region on the substrate stage in a first configuration of the exposure apparatus when exposing the first exposure region, and an integrated exposure amount obtained in the second region during a second exposure to expose a second region corresponding to the second exposure region on the substrate stage in a second configuration of the exposure apparatus when exposing the second exposure region, the second tolerance value including a second plus side tolerance value that is a maximum value of the integrated exposure amount obtained in a third region corresponding to the first non-connection region and the second non-connection region, and a second minus side tolerance value that is a minimum value of the integrated exposure amount obtained in the third region.

3. the at least one position includes a position that is continuous with one another in the non-scanning direction and has the largest total integrated exposure amount among a plurality of positions at which the total integrated exposure amount exceeds the second plus side tolerance value, and a position that is continuous with one another in the non-scanning direction and has the smallest total integrated exposure amount among a plurality of positions at which the total integrated exposure amount is below the second minus side tolerance value, 3. The exposure apparatus according to claim 2, wherein the combined integrated exposure amount is obtained by adding together a first integrated exposure amount obtained during the first exposure and a second integrated exposure amount obtained during the second exposure.

4. The determination step includes: performing a third exposure in the first configuration to expose the at least one position to obtain a first integrated exposure amount at the at least one position; performing a fourth exposure in the second configuration to expose the at least one position to obtain a second integrated exposure amount at the at least one position; 3. The exposure apparatus according to claim 2, further comprising a step of comparing a total integrated exposure amount of the first integrated exposure amount and the second integrated exposure amount at the at least one position with the first tolerance value.

5. the first tolerance value is determined based on an exposure performance of the exposure apparatus, and includes a first plus side tolerance value that is greater than the second plus side tolerance value, and a first minus side tolerance value that is determined based on the exposure performance, and is smaller than the second minus side tolerance value; 5. The exposure apparatus according to claim 4, wherein the determination process includes a process of exposing the first exposure area and the second exposure area by the control unit when the combined integrated exposure amount at the at least one position is equal to or less than the first positive tolerance value and equal to or greater than the first negative tolerance value.

6. The exposure apparatus according to claim 5, wherein the judgment process includes an adjustment process of adjusting a configuration of the exposure apparatus when the combined integrated exposure amount at the at least one position exceeds the first positive side tolerance value or is below the first negative side tolerance value.

7. The exposure apparatus according to claim 6, characterized in that the adjustment process includes a process of adjusting a configuration of the exposure apparatus so that an absolute value of a difference between a maximum value of the combined integrated exposure amount at each of a plurality of positions within a fourth region corresponding to the first connecting region and the second connecting region and an average value of the integrated exposure amount in the third region, and an absolute value of a difference between a minimum value of the combined integrated exposure amount at each of the plurality of positions and the average value, are reduced.

8. 8. The exposure apparatus of claim 7, wherein the plurality of positions is the at least one position.

9. 2. The exposure apparatus according to claim 1, wherein the determination step includes a determination step of determining the at least one position by comparing a combined integrated exposure amount of a first integrated exposure amount obtained by integrating the exposure amounts measured in the first connecting region and a fourth region corresponding to the second connecting region during a first exposure to expose a first region on the substrate stage corresponding to the first exposure region in a first configuration of the exposure apparatus when exposing the first exposure region, and a second integrated exposure amount obtained in the fourth region during a second exposure to expose a second region on the substrate stage corresponding to the second exposure region in a second configuration of the exposure apparatus when exposing the second exposure region, with the second tolerance value.

10. the second tolerance value includes a second plus-side tolerance value that is a maximum value of the integrated exposure amount acquired in a third region corresponding to the first non-connection region and the second non-connection region, and a second minus-side tolerance value that is a minimum value of the integrated exposure amount acquired in the third region, out of the integrated exposure amount acquired in the first region during the first exposure and the integrated exposure amount acquired in the second region during the second exposure, 10. The exposure apparatus according to claim 9, wherein the determination step includes a step of determining, within the fourth region, a position having the largest total integrated exposure amount among a plurality of positions that are consecutive to one another in the non-scanning direction and at which the total integrated exposure amount exceeds the second plus side tolerance value, and a position having the smallest total integrated exposure amount among a plurality of positions that are consecutive to one another in the non-scanning direction and at which the total integrated exposure amount falls below the second minus side tolerance value.

11. The determining step includes: performing the first exposure and the second exposure; acquiring the integrated exposure amount in the first region and the integrated exposure amount in the second region; acquiring the combined integrated exposure amount in the fourth region; 11. The exposure apparatus according to claim 10, further comprising:

12. 12. The exposure apparatus according to claim 11, wherein the determining step includes a step of determining the second plus side tolerance value and the second minus side tolerance value as a maximum value and a minimum value of the integrated exposure amount in the third region, respectively.

13. The determining step includes: determining whether a first position is detected at which the combined integrated exposure amount exceeds the second positive tolerance value; adjusting the first configuration and the second configuration so that the exposure amount in the fourth region is increased when it is determined that the first position is not detected; performing the first exposure in the adjusted first configuration to obtain the first integrated exposure amount in the fourth region; performing the second exposure in the adjusted second configuration to obtain the second integrated exposure amount in the fourth region; 13. The exposure apparatus according to claim 12, further comprising:

14. The determining step includes: determining whether a second position is detected at which the combined integrated exposure amount falls below the second negative tolerance value; adjusting the first configuration and the second configuration so as to reduce the exposure amount in the fourth region when it is determined that the second position is not detected; performing the first exposure in the adjusted first configuration to obtain the first integrated exposure amount in the fourth region; performing the second exposure in the adjusted second configuration to obtain the second integrated exposure amount in the fourth region; 13. The exposure apparatus according to claim 12, further comprising:

15. an illumination optical system including a light source that emits light and a light-shielding section in which an opening through which the light from the light source passes is formed, and which guides exposure light to the original; 10. The exposure apparatus according to claim 9, wherein the determination step includes a step of storing, by the control unit, the determined at least one position and at least one of the type of the light source, the mode of the light source, and the relative position of the fourth region with respect to the opening in the non-scanning direction in association with each other.

16. 2. The exposure apparatus according to claim 1, further comprising an exposure amount adjustment unit that adjusts the exposure amount in the first connecting region and the second connecting region by blocking at least a portion of the exposure light by moving in the non-scanning direction, and a projection optical system that guides the exposure light that has passed through the original to the substrate.

17. Exposing a substrate by an exposure apparatus according to any one of claims 1 to 16; developing the exposed substrate; A method for producing an article, comprising:

18. an exposure method in which an image of a pattern of an original is projected onto a substrate surface while scanning an original and the substrate in the scanning direction, and the substrate is exposed to light in an exposure apparatus including a substrate stage capable of moving in a scanning direction parallel to a substrate surface of the substrate and in a non-scanning direction within the substrate surface perpendicular to the scanning direction while holding the substrate, and a measurement unit that measures an exposure amount at a predetermined position on the substrate surface of the substrate held by the substrate stage, the exposure method comprising: the first exposure area on the substrate surface includes a first non-joining area and a first joining area arranged in the non-scanning direction; the second exposure area on the substrate surface includes a second connection area and a second non-connection area that overlap the first connection area and are arranged in the non-scanning direction; the exposure method includes a determination step of determining whether to expose the first exposure region and the second exposure region by comparing a measurement result of the exposure amount by the measurement unit at at least one position in the first connection region and the second connection region with a first tolerance value; an exposure method characterized in that the at least one position is determined by comparing a second tolerance value determined from the measurement results of the exposure amount by the measurement unit in the first non-connecting region and the second non-connecting region with the measurement results of the exposure amount by the measurement unit in the first connecting region and the second connecting region.

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