Semiconductor wafer processing system

Abstract

To provide a semiconductor wafer processing system enabling suppression of cost increases even when a plurality of processing devices are installed.SOLUTION: In a semiconductor wafer processing system 1, a plurality of processing devices 10 are arranged side by side in one direction which is an X-axis direction, each of the processing devices 10 includes: a holding table holding a semiconductor wafer; and a processing unit 30 processing the semiconductor wafer held on the holding table, the plurality of processing devices 10 are operated by a common monitor 110 and controlled by a common control unit 100.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a semiconductor wafer processing system. [Background technology]

[0002] The processing apparatus includes a processing device including a holding table and a processing unit, a control unit, and a monitor (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-002256 Summary of the Invention [Problem to be solved by the invention]

[0004] Installing a plurality of the processing devices shown in the above-mentioned Patent Document 1 and the like increases costs.

[0005] An object of the present invention is to provide a semiconductor wafer processing system capable of suppressing a rise in costs even when a plurality of processing apparatuses are installed. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the semiconductor wafer processing system of the present invention is characterized in that a plurality of processing devices, each including a holding table for holding a semiconductor wafer and a processing unit for processing the semiconductor wafer held on the holding table, are installed in a line in one direction, and the plurality of processing devices are operated by a common monitor and controlled by a common control unit.

[0007] The semiconductor wafer processing system may further include a cover extending in the one direction and covering the processing devices.

[0008] In the semiconductor wafer processing system, the processing unit may perform at least one of processing, cleaning, film formation, inspection, imaging, attachment of a support member, and peeling off of a support member on a semiconductor wafer.

[0009] In the semiconductor wafer processing system, the processing unit includes a rotatable spindle, a mount fixed to the tip of the spindle, and a processing tool supported by the mount for processing the semiconductor wafer, and the processing tool may be at least one of a cutting blade, a cutting tool edge, a grinding wheel, and a polishing pad.

[0010] In the semiconductor wafer processing system, the processing unit may be a laser beam application unit that applies a laser beam to the semiconductor wafer. Effect of the Invention

[0011] The present invention has an effect of suppressing an increase in cost even when a plurality of processing apparatuses are installed. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view that illustrates a schematic configuration example of a semiconductor wafer processing system according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing a schematic configuration example of a processing device of the semiconductor wafer processing system shown in FIG. [Diagram 3] FIG. 3 is a side view illustrating a schematic configuration example of a processing unit of the processing apparatus illustrated in FIG. [Figure 4] FIG. 4 is a front view showing an example of a display on a monitor of the semiconductor wafer processing system shown in FIG. [Diagram 5] FIG. 5 is a plan view showing the inside of a processing chamber cover of a semiconductor wafer processing system according to the second embodiment. [Figure 6]FIG. 6 is a plan view showing a schematic example of a case where the holding table of the semiconductor wafer processing system shown in FIG. 5 is moved. [Figure 7] FIG. 7 is a front view, partially in section, typically showing an example of cutting processing in a processing unit of any one of the processing devices in the semiconductor wafer processing system shown in FIG. [Figure 8] FIG. 8 is a front view, partially in section, typically showing an example of cutting processing in a processing unit of any other processing device of the semiconductor wafer processing system shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0014] [Embodiment 1] A semiconductor wafer processing system according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a typical configuration example of the semiconductor wafer processing system according to the first embodiment. Fig. 2 is a perspective view showing a typical configuration example of a processing device of the semiconductor wafer processing system shown in Fig. 1. Fig. 3 is a side view showing a typical configuration example of a processing unit of the processing device shown in Fig. 2. Fig. 4 is a front view showing a typical display example of a monitor of the semiconductor wafer processing system shown in Fig. 1.

[0015] (Semiconductor wafer processing system) 1, the semiconductor wafer processing system 1 includes a plurality of processing devices 10, one control unit 100, one monitor 110, and one input unit 120. The processing device 10 is a device that processes a semiconductor wafer 200 shown in FIG. 2, and in the first embodiment, is a processing device that cuts the semiconductor wafer 200.

[0016] In the first embodiment, the semiconductor wafer 200 to be processed by the processing device 10 is formed in a disk shape using silicon or gallium as a substrate, and devices 203 are formed in areas partitioned in a lattice pattern by a plurality of planned division lines 202 formed in a lattice pattern on a surface 201. The devices 203 are, for example, integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations), or semiconductor memories (semiconductor storage devices). In the first embodiment, the semiconductor wafer 200 has a back surface 204 attached to the center of a tape 205 having a disk shape larger than the outer diameter and an annular frame 206 attached to the outer edge thereof, and is cut by the processing device 10.

[0017] 2, the processing apparatus 10 includes a holding table 20 that suction-holds a semiconductor wafer 200 on a holding surface 21, a processing unit 30 that processes the semiconductor wafer 200 held by the holding table 20, and an imaging unit 40 that captures an image of the semiconductor wafer 200 held by the holding table 20. In addition, the processing apparatus 10 includes a moving unit 50 that moves the holding table 20 and the processing unit 30 relatively to one another, as shown in FIG.

[0018] The moving unit 50 includes an X-axis moving unit 51 which moves the holding table 20 for processing in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 52 which indexes and moves the processing unit 30 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction, a Z-axis moving unit 53 which cuts and moves the processing unit 30 in the Z-axis direction parallel to the vertical direction perpendicular to both the X-axis and Y-axis directions, and a rotational moving unit 54 which rotates the holding table 20 around an axis parallel to the Z-axis direction.

[0019] The X-axis moving unit 51 moves the holding table 20 in the X-axis direction, which is the processing feed direction, to relatively feed the holding table 20 and the processing unit 30 along the X-axis direction. The X-axis moving unit 51 is installed in the apparatus body 11.

[0020] The Y-axis moving unit 52 moves the processing unit 30 in the Y-axis direction, which is the indexing feed direction, to index and feed the holding table 20 and the processing unit 30 relatively along the Y-axis. The Y-axis moving unit 52 is installed on a gate-shaped support frame 12 that stands upright from the apparatus body 11.

[0021] The Z-axis moving unit 53 moves the processing unit 30 in the Z-axis direction, which is the incision feed direction, to relatively incision feed the holding table 20 and the processing unit 30 along the Z-axis direction. The Z-axis moving unit 53 is mounted on a moving frame 13 which is moved in the Y-axis direction by the Y-axis moving unit 52. The rotational moving unit 54 is supported by the X-axis moving unit 51, supports the holding table 20, and is disposed so as to be freely movable in the X-axis direction together with the holding table 20.

[0022] The X-axis moving unit 51, the Y-axis moving unit 52 and the Z-axis moving unit 53 each include a well-known ball screw rotatably provided about its axis, a well-known motor for rotating the ball screw about its axis, and a well-known guide rail for supporting the holding table 20 or the processing unit 30 movably in the X-axis, Y-axis or Z-axis direction. The rotational movement unit 54 includes a motor for rotating the holding table 20 about its axis.

[0023] The holding table 20 is disk-shaped, and a holding surface 21 for holding the semiconductor wafer 200 is formed from porous ceramics or the like. The holding table 20 is provided so as to be movable in the X-axis direction by an X-axis moving unit 51 across a processing area below the processing unit 30 and a carry-in / out area spaced from below the processing unit 30 for carrying in and out the semiconductor wafer 200, and is provided so as to be rotatable about an axis parallel to the Z-axis direction by a rotary moving unit 54.

[0024] The holding table 20 is connected to a vacuum suction source (not shown) and is sucked by the vacuum suction source to suck and hold the semiconductor wafer 200 placed on the holding surface 21. In the first embodiment, the holding table 20 sucks and holds the back surface 204 side of the semiconductor wafer 200 via a tape 205. In addition, a plurality of clamp units 22 that clamp an annular frame 206 are provided around the periphery of the holding table 20, as shown in FIG.

[0025] In the first embodiment, the processing unit 30 is a cutting unit that cuts the semiconductor wafer 200 held by the holding table 20 with a cutting blade 31. The processing unit 30 is provided so as to be movable in the Y-axis direction by a Y-axis moving unit 52 with respect to the semiconductor wafer 200 held by the holding table 20, and is provided so as to be movable in the Z-axis direction by a Z-axis moving unit 53.

[0026] The processing unit 30 is provided on a gate-shaped support frame 12 erected from the device body 11 via a Y-axis moving unit 52, a Z-axis moving unit 53, etc. The processing unit 30 is capable of positioning the cutting blade 31 at any position on the holding surface 21 of the holding table 20 by the Y-axis moving unit 52 and the Z-axis moving unit 53, respectively.

[0027] As shown in Figures 2 and 3, the processing unit 30 includes a spindle housing 32 that is movable in the Y-axis and Z-axis directions by a Y-axis moving unit 52 and a Z-axis moving unit 53, a spindle 33 (shown only in Figure 3) that is supported by the spindle housing 32 so as to be rotatable about an axis parallel to the Y-axis direction and that is rotated about the axis by a spindle motor not shown, a mount 34 (shown only in Figure 3) fixed to the tip of the spindle 33, and a cutting blade 31 that is supported by the mount 34 and attached to the tip of the spindle 33, and is a processing tool that cuts the semiconductor wafer 200.

[0028] The cutting blade 31 is an extremely thin cutting grindstone having a substantially ring shape. In the first embodiment, the cutting blade 31 includes an annular cutting blade for cutting the semiconductor wafer 200, and an annular base that supports the cutting blade at its outer edge and is detachably attached to the spindle 23. The cutting blade includes abrasive grains such as diamond or CBN (Cubic Boron Nitride), and a bond material such as metal or resin. In the present invention, the cutting blade 31 may be a so-called washer blade that includes only the cutting blade.

[0029] The spindle housing 32 is supported by the Z-axis moving unit 53 so as to be freely movable in the Z-axis direction, and is supported by the Y-axis moving unit 52 via the Z-axis moving unit 53 so as to be freely movable in the Y-axis direction. The spindle housing 32 accommodates a portion of the spindle 23 excluding the tip end thereof, a spindle motor (not shown), and the like, and supports the spindle 23 so as to be rotatable about its axis.

[0030] The spindle 23 has a cutting blade 31 fixed to its tip. The spindle 23 is rotated by a spindle motor (not shown), and its tip protrudes from the tip surface of the spindle housing 32. The tip of the spindle 23 is gradually tapered toward the tip, and the cutting blade 31 is attached via a mount 34.

[0031] The axes of the spindle 23 and cutting blade 31 of the processing unit 30 are set parallel to the Y-axis direction.

[0032] The imaging unit 40 is fixed to the processing unit 30 so as to move integrally with the processing unit 30. The imaging unit 40 includes an imaging element that captures an image of a region to be divided of the semiconductor wafer 200 before cutting held on the holding table 20. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 40 captures an image of the semiconductor wafer 200 held on the holding table 20 to obtain an image for performing alignment between the semiconductor wafer 200 and the cutting blade 31, and outputs the obtained image to the control unit 100.

[0033] The processing device 10 also includes an X-axis position detection unit (not shown) for detecting the position of the holding table 20 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the processing unit 30 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the processing unit 30 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a read head.

[0034] The Z-axis position detection unit detects the Z-axis position of the processing unit 30 with the motor pulse of the Z-axis moving unit 53. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit detect the X-axis position of the holding table 20 and the Y-axis or Z-axis position of the lower end of the cutting blade of the cutting blade 31 of the processing unit 30, and output the detection results to the control unit 100. In the first embodiment, the positions of the X-axis, Y-axis, and Z-axis of each component of the processing device 10 are determined based on a predetermined reference position (not shown). The reference position in the Z-axis is the position of the processing unit 30 where the lower end of the cutting blade of the cutting blade 31 is located on the same plane as the holding surface 21.

[0035] The processing apparatus 10 having the above-mentioned configuration starts a processing operation when processing conditions are registered in the control unit 100 by an operator or the like, the semiconductor wafer 200 before cutting is placed on the holding surface 21 of the holding table 20, and the control unit 100 receives an instruction to start the processing operation from the operator. In the processing operation in the first embodiment, the control unit 100 of the processing apparatus 10 suction-holds the back surface 204 of the semiconductor wafer 200 on the holding surface 21 of the holding table 20 via the tape 205, and clamps the annular frame 206 with the clamping section 22.

[0036] In the processing operation in the first embodiment, the control unit 100 of the processing device 10 rotates the spindle 23 around its axis, controls the moving unit 50 to move the holding table 20 toward the processing area, and the imaging unit 40 captures the semiconductor wafer 200, and performs alignment based on the image captured by the imaging unit 40. In the processing operation in the first embodiment, the control unit 100 of the processing device 10 controls the moving unit 50, cutting unit 20, etc. to relatively move the semiconductor wafer 200 and the processing unit 30 along the planned dividing lines 202, while cutting the cutting blade 31 into each planned dividing line 202 to divide the semiconductor wafer 200 into individual devices 203.

[0037] In embodiment 1, in the processing operation, when the processing device 10 cuts all of the planned dividing lines of the semiconductor wafer 200, the control unit 100 controls the moving unit 50 to move the holding table 20 to the loading / unloading area, the control unit 100 stops suction holding of the holding table 20, and the processing operation is completed.

[0038] In the first embodiment, the semiconductor wafer processing system 1 has a plurality of processing devices 10 (four in the first embodiment) arranged in one direction, i.e., the X-axis direction. The semiconductor wafer processing system 1 according to the first embodiment further includes one cover 2 for covering the plurality of processing devices 10. As shown in FIG. 1, the cover 2 includes two first cover members 3 formed in a flat plate shape and extending in the X-axis direction across at least two or more processing devices 10, and two second cover members 4 connecting both edges of the two first cover members 3 in the X-axis direction, and covers the lower part of the device body 11 of the plurality of processing devices 10. Note that, although the most cost-saving is achieved by covering all processing devices 10 with one cover 2, it is also possible to cover at least two or more processing devices 10 with one cover 2 and connect the plurality of covers 2 to each other. In this case, the number of covers 2 can be reduced compared to the conventional design of one cover 2 for one processing device 10, thereby reducing costs.

[0039] In the first embodiment, the upper part of the main body 11 of each processing device 10, i.e., the processing area and the loading / unloading area, of the semiconductor wafer processing system 1 is covered with a processing chamber cover 5, and the upper parts of the main bodies 11 of the processing devices 10 are partitioned by a partition plate 6. For this reason, in the first embodiment, the holding table 20 is restricted from moving in the X-axis direction on the main body 11 of each processing device 10 and from moving across the main bodies 11 of the multiple processing devices 10. In the first embodiment, each processing area of ​​the semiconductor wafer processing system 1 is connected to an exhaust duct (not shown).

[0040] The control unit 100 controls each of the components of the multiple processing devices 10, and causes the processing devices 10 to perform processing operations on the semiconductor wafer 200. That is, in the first embodiment, the multiple processing devices 10 are controlled by a common control unit 100. The control unit 100 is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 10 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling each processing device 10 to each component of each processing device 10 via the input / output interface device.

[0041] The monitor 110 is a display unit composed of a liquid crystal display device or the like that displays the status of the processing operation, images, etc. The monitor 110 can display a selection screen 111 as shown in Fig. 4 for selecting an arbitrary processing device 10 from the multiple processing devices 10, and a device screen for setting various information and processing conditions of the processing device 10 selected on the selection screen 111. Note that the selection screen 111 shown in Fig. 4 indicates each processing device 10 with the reference numerals 10-1, 10-2, 10-3, and 10-4.

[0042] The input unit 120 is used when an operator registers processing conditions and the like, and in the first embodiment, is configured by a touch panel provided on the monitor 110. The input unit 120 can be used to select, for example, any one of the processing devices 10-1, 10-2, 10-3, and 10-4 displayed on a selection screen 111 shown in Fig. 4 by operating the input unit 120. Note that the selection screen 111 shown in Fig. 4 shows an example in which the processing device 10 shown in the shaded area is selected. In this way, in the first embodiment, multiple processing devices 10 are operated by one input unit 120 provided on one monitor 110.

[0043] The semiconductor wafer processing system 1 also includes an alarm unit 130 that emits at least one of sound and light to notify an operator.

[0044] The semiconductor wafer processing system 1 according to the embodiment 1 described above has a plurality of processing devices 10 operated by a common monitor 110 and controlled by a common control unit 100, and therefore has the advantage of being able to suppress increases in costs even when a plurality of processing devices 10 are installed.

[0045] Furthermore, in the semiconductor wafer processing system 1 of embodiment 1, multiple processing devices 10 are installed in a line in the X-axis direction, and instead of each of the multiple processing devices 10 being covered with a cover, multiple processing devices 10 are covered with a single cover 2, thereby making it possible to achieve low costs.

[0046] Furthermore, when multiple independent processing devices 10 are installed side by side, gaps are required between the processing devices 10. However, the semiconductor wafer processing system 1 of embodiment 1 only has partition plates 6 between the processing devices 10, and therefore requires a smaller installation area than when the independent processing devices 10 are installed adjacent to each other.

[0047] [Embodiment 2] The semiconductor wafer processing system according to the second embodiment will be described with reference to the drawings. FIG. 5 is a plan view showing the inside of a processing chamber cover of the semiconductor wafer processing system according to the second embodiment. FIG. 6 is a plan view showing an example of moving the holding table of the semiconductor wafer processing system shown in FIG. 5. FIG. 7 is a front view showing an example of cutting processing in a processing unit of one of the processing devices of the semiconductor wafer processing system shown in FIG. 5, with a partial cross section. FIG. 8 is a front view showing an example of cutting processing in a processing unit of another processing device of the semiconductor wafer processing system shown in FIG. 5, FIG. 5, FIG. 6, FIG. 7 and FIG. 8 are given the same reference numerals to the same parts as those of the first embodiment, and the description thereof will be omitted.

[0048] 5 and 6, in the semiconductor wafer processing system 1 according to the second embodiment, an opening 7 through which the holding table 20 can pass is provided in the partition plate 6, and the holding tables 20 of all the processing devices 10 are provided so as to be movable in the X-axis direction for each of the X-axis moving units 51 and the rotary moving units 54 by a common shaft motor 55, and each holding table 20 is allowed to move across the device bodies 11 of the multiple processing devices 10. That is, in the semiconductor wafer processing system 1 according to the second embodiment, as shown in FIG. 6, the multiple holding tables 20 are positioned on the device body 11 of any of the multiple processing devices 10, and any of the processing units 30 can cut the semiconductor wafer 200 held on the multiple holding tables 20.

[0049] The shaft motor 55 includes a shaft 56 formed in a straight line along the X-axis direction on the device body 11 of the multiple processing devices 10 and consisting of multiple magnets with their north poles joined together and their south poles joined together, and a slider 57 with a built-in coil that is fixed to the X-axis moving unit 51 that supports each holding table 20 movably in the X-axis direction through the shaft 56. When a current is supplied to the coil of the slider 57, the shaft motor 55 moves each holding table 20 independently of each other along the longitudinal direction of the shaft 56.

[0050] Furthermore, the semiconductor wafer processing system 1 according to the second embodiment can cut the semiconductor wafer 200 to the center in the thickness direction of the substrate by using the cutting blade 31 of any one of the processing units 30 among the multiple processing devices 10 to form a cut groove 207 as shown in Fig. 7, and then cut the bottom of the cut groove 207 by using the cutting blade 31 of any other processing unit 30 as shown in Fig. 8. That is, the semiconductor wafer processing system according to the second embodiment can divide the semiconductor wafer 200 into individual devices 203 by performing so-called step processing as shown in Figs. 7 and 8.

[0051] In the semiconductor wafer processing system 1 of embodiment 2, multiple processing devices 10 are operated by a common monitor 110 and controlled by a common control unit 100, so that, similar to embodiment 1, it is possible to suppress increases in costs even when multiple processing devices 10 are installed.

[0052] The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the gist of the present invention. For example, the processing unit 30 is not limited to a cutting unit, and may be a processing unit that performs cutting with a tool, grinding, polishing, cleaning, film formation, inspection, imaging, attaching a support member such as tape, and peeling off a support member such as tape on the semiconductor wafer 200. Thus, in the present invention, the processing unit 30 may be one that performs at least one of processing, cleaning, film formation, inspection, imaging, attaching a support member, and peeling off a support member.

[0053] That is, in the present invention, the processing unit 30 may be any of different types, such as an inspection unit that performs any inspection on the workpiece, an imaging unit, a tape applicator that applies tape to the workpiece, a tape peeler, or a protective film forming unit that forms a protective film of resin or the like on the workpiece.

[0054] In addition, in the present invention, the processing unit 30 may be a laser beam irradiation unit that irradiates the semiconductor wafer 200 with a laser beam having a wavelength that is transparent or absorbent, or may be a processing unit that supplies a processing medium such as a liquid or gas, such as a high-pressure water cleaning nozzle that injects pressurized liquid onto the semiconductor wafer 200, or a plasma generation source.

[0055] In addition, in the present invention, the processing tool of the processing unit 30 is not limited to the cutting blade 31, but may be a cutting tool, a grinding wheel, a polishing pad, etc. Thus, in the present invention, the processing tool may be at least one of the cutting blade 31, the cutting tool, the grinding wheel, and the polishing pad. [Explanation of symbols]

[0056] 1. Semiconductor wafer processing system 2 Cover 10 Processing equipment 20 Holding Table 30 Processing Unit 31 Cutting blade (machining tool) 33 Spindle 34 Mount 100 Control Unit 110 Monitor 200 Semiconductor wafers 205 Tape (supporting member) X one direction

Claims

1. A holding table for holding a semiconductor wafer; a processing unit for processing the semiconductor wafer held on the holding table; A plurality of processing devices including the above are arranged in one direction, The processing devices are operated by a common monitor; A semiconductor wafer processing system controlled by a common control unit.

2. 2. The semiconductor wafer processing system according to claim 1, further comprising a cover extending in said one direction and covering said processing devices.

3. 3. The semiconductor wafer processing system according to claim 1, wherein the processing unit performs at least one of processing, cleaning, film formation, inspection, imaging, attachment of a support member, and peeling off of a support member on the semiconductor wafer.

4. The processing unit includes a rotatable spindle, a mount fixed to a tip of the spindle, and a processing tool supported by the mount for processing a semiconductor wafer; 3. The semiconductor wafer processing system according to claim 1, wherein said processing tool is at least one of a cutting blade, a cutting tool edge, a grinding wheel, and a polishing pad.

5. 3. The semiconductor wafer processing system according to claim 1, wherein said processing unit is a laser beam application unit for applying a laser beam to said semiconductor wafer.

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