Cooling device and low temperature testing device

Abstract

To provide a cooling device that can be downsized and can easily test an electrical component under the cooled environment.SOLUTION: A cooling device comprises a receptacle on which an electrical component is placed, and a cooling unit having a heat absorber for cooling the electrical component, so as to test the electrical component at a low temperature.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a cooling device and a low-temperature testing device used for performance testing of electrical components such as semiconductor devices (hereinafter referred to as "IC packages"). [Background technology]

[0002] It is known that conventionally, the electrical characteristics of manufactured IC packages are inspected before they are shipped to the market, as disclosed in Japanese Patent Application Laid-Open No. 2003-233691. When testing an IC package, it is placed in a socket for electrical connection with an external device, the socket is mounted on a test board, etc., and the IC package and the test board are connected. When testing at low temperatures, the entire socket mounted on the test board is placed in a chamber, the internal temperature is cooled using an environmental tester such as a cold air cooling device (Thermostream (registered trademark)), and power and test signals are supplied to the IC package to measure its performance. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-248374 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, when measuring the performance of an IC package using the above-mentioned conventional cooling method, a chamber is required to house all of the sockets and the test board, as well as the cold air cooling device used for the test, which results in problems such as a large installation space for the entire device, a long time required for the temperature to drop in the chamber, and high costs. Therefore, there is a demand for a device that can be made smaller and whose performance can be measured more easily.

[0005] The present invention has been made in consideration of the above points, and has an object to provide a cooling device and a low-temperature testing device that can be miniaturized and can easily inspect electrical components in a cooled environment. [Means for solving the problem]

[0006] One aspect of the cooling device according to the present invention is A cooling device for testing electrical components in a low-temperature environment, comprising: a socket in which the electrical component is placed; a cooling unit having a heat absorbing portion for cooling the electrical component; The configuration has the following.

[0007] The low temperature test apparatus of the present invention comprises: A low-temperature test apparatus for performing electrical testing of electrical components in a low-temperature environment, comprising: The cooling device has the above-mentioned configuration, The stand has a wiring section that electrically connects the electrical components to a test control device. Effect of the Invention

[0008] According to the present invention, miniaturization is possible and inspection of electrical components in a cooled environment can be easily performed. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view of a cooling device according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a side view of the cooling device according to the first embodiment of the present invention. [Diagram 3] FIG. 3 is a partial cross-sectional view taken along line AA of FIG. 1, showing a configuration of a main part of the cooling device according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a diagram showing a state in which the electric components are mounted on the cooling device in FIG. [Diagram 5] FIG. 5 is a partial cross-sectional view corresponding to FIG. 4, showing the configuration of a main part of the first modified example of the cooling device. [Figure 6] FIG. 6 is a partial cross-sectional view showing the configuration of a main part of the second modified example of the cooling device, corresponding to FIG. [Figure 7] FIG. 7 is a partial cross-sectional view showing the configuration of a main part of the third modified example of the cooling device, corresponding to FIG. [Figure 8] FIG. 8 is a diagram showing an example of a heat insulating part of the fourth modification of the present cooling device. [Figure 9] FIG. 9 is a diagram showing an example of a heat insulating part of the fifth modification of the present cooling device. [Figure 10] FIG. 10 is a diagram showing an example of a heat insulating part of the sixth modification of the present cooling device. [Figure 11] FIG. 11 is a diagram showing an example of a heat insulating part of the seventh modification of the present cooling device. [Figure 12] FIG. 12 is a diagram showing an example of a heat insulating part of the eighth modification of the present cooling device. [Figure 13] FIG. 13 is a diagram showing an example of a heat insulating part of the ninth modification of the present cooling device. [Figure 14] FIG. 14 is a diagram showing an example of a heat insulating portion of the tenth modification of the present cooling device. [Figure 15] FIG. 15 is a diagram showing an example of a heat insulating part of the eleventh modification of the present cooling device. [Figure 16] FIG. 16 is a side cross-sectional view showing an example of a heat insulating cover part of a twelfth modification of the present cooling device. [Figure 17] FIG. 17 is a diagram showing an example of a heat insulating cover part of the thirteenth modification of the present cooling device. [Figure 18] FIG. 18 is a diagram showing an example of a heat insulating part of the eleventh modification of the present cooling device. [Figure 19] FIG. 19 is a partial cross-sectional side view of a cooling device according to the second embodiment of the present invention. [Figure 20] FIG. 20 is a partial cross-sectional side view of a cooling device according to a third embodiment of the present invention. [Figure 21] FIG. 21 is a partial cross-sectional side view showing a configuration of a main part of another modified example of the cooling device according to the first embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0011] (Embodiment 1) Fig. 1 is a plan view of a cooling device according to a first embodiment of the present invention, Fig. 2 is a side view of the cooling device according to the first embodiment of the present invention, and Fig. 3 is a partial cross-sectional view taken along line A-A in Fig. 1, showing a configuration of a main part of the cooling device according to the first embodiment of the present invention. Also, Fig. 4 is a view showing a state in which an electric component is mounted on the cooling device in Fig. 3.

[0012] In this embodiment, an orthogonal coordinate system (X, Y, Z) is used for the explanation. The same orthogonal coordinate system (X, Y, Z) is used in the drawings described later. In the following, the width, depth, and height of the cooling device 10 are the lengths in the X direction, Y direction, and Z direction, respectively. In addition, the positive side of the Z direction will be described as the "upper side" and the negative side of the Z direction as the "lower side."

[0013] The cooling device 10 is used to measure the performance of an electrical component such as an IC package (electrical component K shown in FIG. 4) by cooling the electrical component K in order to measure the performance in a low-temperature environment (for example, under the test conditions described in JIS C 60068 2-1:2010 6.6).

[0014] The cooling device 10 has a socket 20 that accommodates an electrical component K, a device main body 40 having an inspection board 44 on which the socket is mounted, an insulation section 50 that insulates the electrical component K and a transmission block 6, and a cooling module 60 (transmission block 6, cooling unit 62) connected to the device main body 40.

[0015] In the cooling device 10, an electrical component K (see FIG. 4) placed in the socket 20 is pressed in the Z direction against the board of the device main body 40 to be electrically connected, and the connection portion between the electrical component K and the inspection board 44 is surrounded and insulated by an insulating portion 50 such as an insulating cover 70.

[0016] The cooling device 10 is capable of cooling the electric component K when the electric component K is connected to the inspection board 44 and in a conductive state in which power, signals, etc. can be transmitted and received. The heat insulating section 50 is disposed so as to surround the electric component K and the transmission block 6 connected thereto, and insulates the electric component K and the heat transfer block 6 from the outside air.

[0017] The cooling device 10 is preferably used in a low-temperature test device for performing electrical testing of an electric component K in a low-temperature environment. In this case, the test board 44 is used as a wiring section that electrically connects the electric component K to the test control device, but the present invention is not limited to this, and the wiring section may be provided on the stand 42 of the device main body 40.

[0018] The socket 20 is a socket in which electrical components are placed and which electrically connects the placed electrical components to external electrical components, and may be similar to a well-known IC socket used, for example, for burn-in testing of IC packages.

[0019] The socket 20 has, for example, a contact section 21 (see FIG. 3) on which many contact pins are arranged, a frame-shaped socket body 22 surrounding the contact section (contact unit) 21, and a pressing section 23. The pressing section 23 is provided on a cover member 24 attached to the socket body 22 so as to be able to open and close freely. The cover member 24 is pressed downward by rotating a lever member 25, and the pressing section 23 presses the electric components downward to electrically connect them via the contact pins and presses a protrusion 66 of the cooling module downward. The contact section 21 of the socket 20 has an opening into which a protrusion 66 described later is inserted.

[0020] The socket 20 is mounted on the inspection board 44 of the device body 40, with the socket body 22 mounted on the inspection board 44 and the contact section 21 placed on the wiring of the inspection board. An electrical component K such as an IC package is placed in the socket 20, the cover member 24 is closed, and the lever member 25 is used to press down the cover member 24, electrically connecting the terminals of the electrical component to the electrodes of the wiring board via the contact pins 21a. This makes it possible to perform tests such as a continuity test on the electrical component placed in the socket 20.

[0021] The device main body 40 has a stand 42 on which a test board 44 serving as an external electric component is placed, and a frame-shaped frame portion 43 is fixed to the lower portion of the stand 42. The device main body 40 is supported at a predetermined height by legs hanging down from the corners of the frame portion 43.

[0022] The inspection board 44 has an opening that communicates with the opening 421 of the stand 42 and is located below the electric component K. The protrusion 66 comes into contact with the accommodation portion (the electric component K itself in FIG. 4) through this opening. A heat insulating sheet 46 is laid on the inspection board 44 so as to surround the opening in the XY plane. In this opening, the heat insulating sheet 46 for the electric component K and the connection portion of the electric component K (the portion where the inspection board 44 or the protrusion 66 is connected to the electric component K) may be made of, for example, a heat insulating material having independent foaming properties. The inspection board 44 functions as a wiring section that electrically connects the electric component K and the test control device in the device body 40. The connection to the external test control device is made via an external connection section 49 consisting of a plug arranged on the upper surface of the inspection board 44 in a portion not covered by the insulating cover 70.

[0023] The heat insulating cover 70 is fixed to the stand 42 by a fastening member penetrating the heat insulating sheet 46 and the inspection board 44 via a flange portion 72 that is in surface contact with the heat insulating sheet 46 on the inspection board 44. As a result, the electric component K (the connection portion of the electric component K) on the inspection board 44 is insulated from the outside by the heat insulating cover 70 and the heat insulating sheet 46.

[0024] The stand 42 is a plate-like body, and has an opening 421 that communicates vertically with the inspection board 44 and the contact portion 21 at a portion where the socket 20 is disposed. The protrusion 66 of the cooling module 60 is inserted into the opening 421 and connected to the electric component K. The inspection board 44 is placed on the stand 42 in an appropriate manner according to the measurement content of the performance of the electric component.

[0025] The base 42 is desirably made of an insulating material such as resin, and is desirably formed of a super engineering plastic such as PEI (polyetherimide) that has excellent flame retardancy, heat resistance, and low-temperature characteristics.

[0026] The frame portion 43 supports the stand 42 and the test board 44. The frame portion 43 has an opening 432 larger than the opening 421, and a slide frame portion 45 is attached within the opening 432 so as to be movable in the up and down direction (Z direction) relative to the stand 42. The frame-shaped frame portion 43 is preferably made of a relatively light material that has strength and is easy to move, such as a metal material such as aluminum.

[0027] The lower surface of the stand 42 is configured to come into contact with the slide frame portion 45, which is movable in the vertical direction (the direction in which the socket 20 presses the electric component K), inside the opening 432 of the frame portion 43. The lower surface of the stand 42 is formed corresponding to the shape of the slide frame portion 45. A groove portion 424 is formed in the lower surface of the stand 42, which corresponds to the deformation portion 454 of the slide frame portion 45.

[0028] The cooling module 60 is fixed to the slide frame portion 45 and is attached to the stand 42 within the opening 432 . The slide frame portion 45 is attached to the stand 42 so as to be freely movable in the approaching and separating direction (up and down direction) while being biased upward via a fastening member 452 having a shaft portion having a head and a biasing member (pressure spring portion) such as a coil spring inserted therein. The slide frame portion 45 has a deformation portion 454 which engages with the groove portion 424 of the base 42 in the up-down direction.

[0029] The deformation portion 454 is guided by the engagement with the groove portion 424 and moves in parallel in the vertical direction. In addition, since the slide frame portion 45 and the stand 42 are in contact only at the deformation portion 454, heat is less likely to be conducted from the outside through the members, and the heat insulation effect can be improved. Furthermore, the deformation portion 454 can block the supply of humidity from the outside when testing the electric component K in a low-temperature environment, and can effectively suppress condensation on the sockets, etc.

[0030] In addition, the contact portions are not straight but have a labyrinth shape with curved surfaces due to the deformation portion 454. This makes it possible to more effectively exert the heat insulating effect from the outside to the inside. The cooling unit 62 fixed to the slide frame portion 45 biases the joint (electrical component K) via the protrusion 66 so as to press the joint (electrical component K).

[0031] As a result, when the pressing portion 23 of the socket 20 presses the electric component K downward, the electric component K presses the protrusion 66 downward as shown in FIG. 4. Then, the cooling module 60 moves downward together with the slide frame portion 45 against the biasing force of the biasing member (pressurizing spring portion) of the fastening member 452. The slide frame portion 45 and the cooling module 60 may move up and down relative to the base 42 (movement in the direction of approaching or separating) in parallel along the Z direction without deviation via a guide pin (also called a balancing pin) 68. The guide pin 68 is loosely fitted between the base 42 and the upper portion (transmission block 6) of the cooling module 60 in the up and down direction, and guides the cooling module 60 to move up and down in a balanced state relative to the base 42.

[0032] The slide frame portion 45, like the stand 42, may be made of, for example, resin, and is desirably made of a super engineering plastic such as PEI (polyetherimide) that has excellent flame retardancy, heat resistance, and low-temperature characteristics.

[0033] The cooling module 60 is used to cool an electric component K connected to an external electric component such as the test board 44, and to measure the performance of the electric component K in a low-temperature environment.

[0034] The cooling module 60 has a cooling unit 62 having a heat absorption part, and a transmission block (heat transfer part) 6 having a protrusion 66 connected to an electric component K. The cooling module 60 cools the electric component K by connecting the electric component K to the heat absorption part of the cooling unit 62 via the protrusion 66 of the transmission block 6.

[0035] The cooling unit 62 has a Peltier element, and the heat absorption section functions by passing electricity through the Peltier element. The cooling unit 62 has a transmission block 6 connected to its heat absorption section (cooling section), and cools the electric component K via the transmission block 6 (more specifically, the protrusion 66 of the transmission block 6). The cooling unit 62 may be a well-known one, and the cooling unit 62 includes a heat sink and a blower (DC fan) in that order in the heat generating section.

[0036] The cooling unit 62 is fixed to the slide frame portion 45 so as to close the opening of the slide frame portion 45 from below, and moves together with the slide frame portion 45 . The transfer block 6 has a heat transfer function, is disposed between the socket and the heat absorption portion of the cooling unit 62, and transfers heat from the electric component K disposed in the socket to be absorbed by the heat absorption portion.

[0037] The transmission block 6 has a protrusion 66, which is inserted into the opening 421 of the inspection board 44 and disposed in the slide frame section 45 so as to face the upper surface of the inspection board 44. The protrusion 66 may be provided so as to be capable of transmitting heat from the electric component K. Here, the protrusion 66 is provided so as to abut against the electric component K, but may be connected to the electric component K via another member of the housing section. A temperature detection section 67 is provided in the transmission block 6 to detect the temperature of the electric component K. In this embodiment, the electric component K and the cooling unit 62 are connected via the transmission block 6, but the electric component K and the cooling unit 62 may be directly connected without using the transmission block 6.

[0038] The transmission block 6 is made of a material with high thermal conductivity, for example, aluminum. In the cooling device 10, the protrusion 66 at the tip (upper end) of the transmission block 6 is pressed downward by the electric component K or the connection part with the electric component K, and the cooling unit 62 and the slide frame part 45 move downward. At this time, the space before the slide frame part 45 and the cooling unit 62 move relative to the stand 42 is filled with the heat insulating part 50 without any gaps.

[0039] The heat insulating section 50 has a first heat insulating member 51 and a second heat insulating member 52 in addition to the heat insulating cover 70 and the heat insulating sheet 46 . The first heat insulating member 51 and the second heat insulating member 52 are interposed between the device body 40 and the cooling module 60 (the transmission block 6 and the cooling unit 62) which are movable relative to each other.

[0040] The first heat insulating member 51 and the second heat insulating member 52 inhibit the transfer of heat from the outside of the cooling module 60, the frame portion 43 and the slide frame portion 45 to the transfer block 6 including the protrusion 66 and the electric component K.

[0041] By providing the first heat insulating member 51 and the second heat insulating member 52, the cooling device can more efficiently cool the electric component K to a predetermined temperature. It is preferable that the first heat insulating member 51 and the second heat insulating member 52 have heat insulating properties and are formed so as to be expandable, contractible, and deformable. Furthermore, by providing the first heat insulating member 51 and the second heat insulating member 52, it is possible to block the supply of humidity from the outside, and it is possible to effectively suppress condensation on sockets and the like.

[0042] The first heat insulating member 51 and the second heat insulating member 52 are preferably made of, for example, a sponge, and in particular, are preferably made of a fluorine-based sponge such as a closed-cell fluorine sponge, a fluorine rubber foam, a fluorine rubber sponge, etc. The first heat insulating member and the second heat insulating member in the following modified examples are also made of the same material.

[0043] The first heat insulating member 51 is formed in a frame shape and disposed within the opening 421 of the stand 42 so as to surround the protrusion 66 in the XY directions, and is interposed in close contact with both the protrusion 66 and the opening 421 of the stand 42 so as to fill the gap between them due to the elastic deformation of the first heat insulating member 51 which can be expanded and contracted freely. This blocks the air supply path between the protrusion 66 and the opening 421, making it possible to inhibit the intrusion of heat from below the first heat insulating member 51 to above, and to insulate the space above the first heat insulating member 51 where the connection part between the inspection board and the electric component K is located from the outside.

[0044] The second insulating member 52 is formed in a frame shape and is interposed in the XY direction within the opening 432 of the frame portion 43, between the slide frame portion 45 and the portion of the cooling module 60 inside the slide frame portion 45, specifically, the transmission block 6.

[0045] The second heat insulating member 52 is disposed in close contact with both the inner peripheral surface of the slide frame portion 45 and the cooling module 60 (the transmission block 6 and the cooling unit 62) so as to fill the gap between them in the XY directions (horizontal direction here) by elastic deformation that can expand and contract freely. At the same time, the second heat insulating member 52 is disposed between the stand 42 and the cooling module 60 in the vertical direction (Z direction) so as to fill the gap between them, and is disposed in close contact with both by elastic deformation.

[0046] This blocks the air flow between the slide frame portion 45 and the cooling module 60, preventing heat from entering from below to above the second insulating member 52, and insulating the space above the second insulating member 52 where the connection between the inspection board and the electrical component K is located from the outside.

[0047] In this embodiment, in the configuration in which the electrical component K connected to the inspection board 44 on the stand 42 is cooled by the cooling unit 60, the electrical component K or the connection portion of the electrical component K can be insulated not only from the top surface side of the inspection board 44, but also from below the inspection board 44.

[0048] That is, by providing the first heat insulating member 51 and the second heat insulating member 52 below the inspection board 44 between the cooling module 60 and the device body 40, the connection part of the internal electric component K can be reliably insulated. In addition, when the electric component K is placed in a low-temperature environment and tested, condensation may occur due to the temperature difference between the test environment and the outside air. If condensation occurs in a socket or the like, it may be impossible to perform a normal test, so it is necessary to prevent the condensation from occurring and suppress the influence of the condensation on the test. As described above, by providing the first heat insulating member 51 and the second heat insulating member 52, the inflow of the outside air into the test environment is blocked. This also blocks the supply of humidity from the outside air, so condensation does not occur, and the performance of the electric component K can be accurately measured without the test itself being hindered by condensation.

[0049] Furthermore, the cooling device 10 uses a Peltier cooling unit in particular to absorb heat from the electric component K in the heat absorption section of the cooling unit 62 via the heat transfer section, thereby lowering the temperature of the electric component K. Therefore, unlike cooling by blowing air, cooling can be performed efficiently without using large equipment such as a chamber, and performance tests of electric components K such as IC packages in a low-temperature environment can be efficiently performed in a small space.

[0050] (Modification) Each of the following modified examples is formed by modifying or adding an insulating part that is part of the configuration of the above-mentioned cooling device 10, and when it has the same function as the above-mentioned components, the same name and symbol are used and the description is omitted.

[0051] In the cooling device 10 according to the above embodiment, the second insulating member disposed around the transmission block 6 in the insulating section 50 has been described as a single insulating material that expands and contracts due to elastic deformation. However, as shown in FIG. 5, the second insulating member may be composed of a plurality of insulating materials.

[0052] (Variation 1) FIG. 5 is a partial cross-sectional view corresponding to FIG. 4, showing the configuration of a main part of the first modified example of the cooling device. As in the cooling device shown in the figure, the second heat insulating member (heat insulating section) 52A may be composed of a plurality of frame-shaped heat insulating materials 522, 524 adjacent to each other in the XY direction.

[0053] In the second heat insulating member (heat insulating section) 52A, the heat insulating material 522 is disposed in contact with the transmission block 6 and the cooling unit 62 while leaving a gap from the stand 42, and the heat insulating material 524 is disposed in contact with the stand 42 while leaving a gap 53 from the cooling unit 62. Thus, the contact area of ​​the entire heat insulating member 52A with the stand 42 and the cooling module 60 (transmission block 6, cooling unit 62) is reduced, and the heat insulating effect with the abutting parts can be exhibited by mutual expansion and contraction, so that the insulation of the connection part of the electric component K can be more effectively performed and condensation can be prevented.

[0054] (Variation 2) FIG. 6 is a partial cross-sectional view showing the configuration of a main part of the second modified example of the cooling device, corresponding to FIG. As shown in the figure, a part of the second heat insulating member (heat insulating section) 52B may be displaced to provide a deformed section 521, which is slidably fitted into a recess 425 formed in the lower surface of the mount 42B. That is, the second heat insulating member 52B has a bent surface 521a, which is partially bent, by having the deformed section 521. Meanwhile, the lower surface of the mount 42 adjacent to the second heat insulating member 52B has a corresponding surface 425a having a recess 425 corresponding to the bent surface 521a of the second heat insulating member 52B.

[0055] The second heat insulating member 52B is disposed so as to press the corresponding surface 425a with the bent surface 521a and surround the transmission block 6. As a result, a labyrinth-shaped opposing portion in which a partial gap is formed is formed by the bent surface 521a and the corresponding surface 425a at the opposing portion between the second heat insulating member 52B and the frame 42.

[0056] Since a gap is formed between the second insulating member 52B and the recess 425 of the stand 42, the contact area between the second insulating member 52B and the stand 42B can be reduced, the insulation of the connection portion of the electrical component K can be performed more effectively, and the occurrence of condensation can be prevented.

[0057] (Variation 3) FIG. 7 is a partial cross-sectional view showing the configuration of a main part of the third modified example of the cooling device, corresponding to FIG. As shown in the figure, the contact areas of the second heat insulating member (heat insulating portion) 52C, which is pressed by elastic deformation, with the stand 42 and the slide frame portion 45 may be different from each other. This reduces the paths for heat conduction, and improves the heat insulating effect of the connection portion of the electric component K.

[0058] (Variation 4) FIG. 8 is a diagram showing an example of a heat insulating part of the fourth modification of the present cooling device. As shown in the figure, the width (thickness in the XY directions) of the rectangular frame-shaped second insulation member (insulation section) 52D may be reduced, and an air chamber 53D, which is a space, may be provided adjacent to the second insulation member 52D (in FIG. 8, outside the XY plane of the second insulation member 52D). The second insulation member 52D is configured to be positioned away from the slide frame section 45 on the outside on the YX plane.

[0059] The second heat insulating member 52D is disposed together with the air chamber 53D so as to surround the transmission block 6, and is interposed between the stand 42 and the cooling unit 62. The air chamber 53D is also interposed between the stand 42 and the slide frame portion 45. The contact area of ​​the second heat insulating member 52D with the stand 42 and the cooling module (the transmission block 6 and the cooling unit 62) is smaller than the contact area when a heat insulating member is further provided at the position where the air chamber 53D is disposed. This allows the second heat insulating member 52D to more effectively insulate the connection portion of the electric component K, and prevents condensation from occurring.

[0060] (Variation 5) FIG. 9 is a diagram showing an example of a heat insulating part of the fifth modification of the present cooling device. As shown in the figure, a second heat insulating member (heat insulating section) 52E may be configured by a plurality of frame-shaped heat insulating materials 525, 526 adjacent to each other in the XY direction, and an air chamber 56 may be disposed adjacent to the disconnecting material 526.

[0061] In the second heat insulating member 52E, the heat insulating material 525 is disposed in contact with the cooling module 60 (the transmission block 6 and the cooling unit 62) while leaving a gap between it and the base 42, and the heat insulating material 526 is disposed in contact with the base 42 while leaving a gap 53 between it and the cooling module 60. Furthermore, since the air chamber 56 is formed, the contact area between the base 42 and the cooling module 60 is small. Also, the mutual expansion and contraction can provide a heat insulating effect with the abutting parts, the insulation of the connection part of the electric component K can be performed more effectively, and the occurrence of condensation can be prevented.

[0062] (Variation 6) FIG. 10 is a diagram showing an example of a heat insulating part of the sixth modification of the present cooling device. As shown in the figure, the second heat insulating member (heat insulating section) 52F may have an air chamber 532 adjacent thereto in the XY direction, and an air chamber 534 formed on the upper side (Z direction side) of the second heat insulating member 52F. In this configuration, the second heat insulating member 52F has a shape in which a rib 520 protruding inward is provided on the upper part of a rectangular tubular main body surrounding the transmission block 6. The base 42 has a notch for accommodating the rib 520, and the air chamber 534 is formed between the notch and the rib 520. In this configuration, the gap between the slide frame section 45 and the base 42 and the path through which heat can be transferred from the outside are reduced, so that the heat insulation effect on the connection part of the electric component K can be more effectively performed, and the occurrence of condensation can also be prevented.

[0063] (Variations 7 and 8) FIG. 11 is a diagram showing an example of a heat insulating part of the seventh modification of the present cooling device, and FIG. 12 is a diagram showing an example of a heat insulating part of the eighth modification of the present cooling device. 11, an air chamber 53G may be provided inside a second heat insulating member (heat insulating section) 52G, thereby making it possible to reduce the contact area with the slide frame section 45. Also, as shown in Fig. 12, a configuration may be adopted in which a second heat insulating member 52H has heat insulating materials 525 and 526 each having a rectangular cylindrical shape and arranged at a distance in the XY direction, and an air chamber 53H is provided between the heat insulating materials 525 and 526.

[0064] (Variations 9, 10, and 11) FIG. 13 is a diagram showing an example of a heat insulating part of the ninth modification of the present cooling device. As shown in the figure, a portion of the second insulating member (insulating portion) 52J may be fitted into a notch in the frame 42, and an air chamber 53J may be provided between the second insulating member 52J and the slide frame portion 45, adjacent to the second insulating member 52J.

[0065] As a configuration in which an air chamber is provided inside the second heat insulating member 52, second heat insulating members 52K and 52L of modified examples 10 and 11 shown in FIGS. 14 and 15 may be used instead of the second heat insulating member 52G shown in FIG. By using the second heat insulating members 52K, 52L, air chambers 53K, 53L are formed above and below, which has the same effect and reduces the contact area with the frame 42 and the cooling module 60 (transmission block 6 and cooling unit 62).

[0066] (Variation 12) FIG. 16 is a side cross-sectional view showing an example of a heat insulating cover portion (heat insulating portion) of a twelfth modification of the present cooling device. As shown in the figure, the cooling device 10 may be configured to provide a liquid heat insulating material (sealing material) 55 between the stand 42 and the inspection board 44 to prevent heat conduction between the stand 42 and the inspection board 44, that is, to block the flow of air (indicated by the arrow). Also, a desiccant (moisture absorbing member) 57 such as silica gel may be provided inside the insulation cover 70. In this way, the heat insulating material 55 provides insulation between the stand 42 and the inspection board 44, and the heat insulating sheet 46 can prevent the transfer of air and heat that flows in along the inspection board 44. Furthermore, condensation can be prevented at the connection portion of the electric component K and in the vicinity thereof.

[0067] (Variation 13) FIG. 17 is a diagram showing an example of a heat insulating cover part (heat insulating part) of the thirteenth modification of the present cooling device. As shown in the figure, in addition to the insulating cover 70 that covers the socket 20 on the device body 40, the cooling device 10 may be configured to have a second cover 77 that covers the insulating cover 70 to reduce the influence of outside air. Also, a valve 78 that can communicate between the inside and the outside may be attached to the second cover 77. The second cover 77 is preferably made of a transparent material such as acrylic, similar to the insulating cover 70, and has a high insulating effect.

[0068] Furthermore, a desiccant (moisture absorbing member) 57 may be disposed inside the heat insulating cover 70. Furthermore, an O-ring 58 may be disposed on the socket 20 inside the heat insulating cover 70 so as to surround the connection portion with the electric component K. This provides moisture protection on the socket side, and prevents condensation at the connection portion of the electric component K and in the vicinity thereof. In each of the modified examples, when an air chamber for insulation is provided as the insulation section, the contact area between the insulation member and other structures such as resin members such as the stand 42 and the slide frame section 45 can be reduced, thereby suppressing heat transfer and cooling, and improving insulation properties and condensation prevention properties.

[0069] (Variation 14) FIG. 18 is a diagram showing an example of a heat insulating part of a fourteenth modification of the present cooling device. As shown in the figure, a deformed portion having a bent surface 521M may be provided in a part of the stepped insulation member (insulation portion) 52M, and a part of this deformed portion may be configured to be slidably fitted in a notch 425M provided in the lower surface of the base 42M in the up-down direction (Z direction). The lower surface of the base 42M has a corresponding surface 4250 having a shape corresponding to the bent shape of the upper surface of the stepped insulation member 52M.

[0070] The stepped insulation member 52M is cylindrical (here, rectangular cylindrical) and arranged around the protrusion 66 of the transmission block 6, and insulates the transmission block 6 from the outside. The stepped insulation member 52M has an insulation section main body 501, a horizontal insulation section 502, and an end insulation section 503. The insulation section main body 501, the horizontal insulation section 502, and the end insulation section 503 may be formed integrally, or may be configured to be slidable in the circumferential direction relative to each other.

[0071] The heat insulating portion main body 501 is disposed so as to be in close contact with the protrusion 66 so as to surround the outer periphery of the protrusion 66 and to surround the protrusion 66 on the horizontal outer side (outer side in the XY directions).

[0072] The horizontal insulation section 502 is disposed between the insulation section main body 501 and the end insulation section 503, and is disposed opposite the lower surface (corresponding surface 4250) of the frame 42M with a gap therebetween, together with the upper surface of the insulation section main body 501. The horizontal insulation section 503 is disposed around the protrusion 66 so as to cover the horizontal surface on the outer diameter side of the protrusion 66. The end insulation section 503 is disposed between the frame 42M and the protrusion 66.

[0073] The horizontal insulation section 503 insulates the horizontal portion and prevents condensation, and the end insulation section 503, together with the gap 5031 formed between the corresponding surface 4250 and the base 42M, insulates the area near the tip of the protrusion 66 and prevents condensation.

[0074] By partially fitting the upper part of the stepped insulation member 52M into the cutout portion 425M, a partially spaced apart labyrinth-shaped opposing portion is formed between the curved surface 521M and the lower surface (corresponding surface 4250) of the cutout portion 425M so as to surround the transmission block 6.

[0075] With this configuration, the contact areas between the stepped insulation member 52M and the stand 42M can be reduced, and the insulation of the connection portion of the electrical component K (the portion connected on the protrusion 66 side) can be more effectively performed, thereby preventing the occurrence of condensation.

[0076] Moreover, the heat insulating portion main body 501 is disposed together with the air chamber 53M at the location where the second heat insulating member 52 is disposed in the cooling device 10. That is, the air chamber 53M is provided adjacent to the stepped heat insulating member 52M between the stepped heat insulating member 52M and the slide frame portion 45M.

[0077] The slide frame portion 45M has a deformation portion 454 which vertically engages with the groove portion 424 of the stand 42M. The function of this deformation portion 454 is similar to that of the deformation portion 454 described above.

[0078] Further, grooves are formed in the slide frame portion 45M at the portions facing the base 42M, and a guide pin 68M is inserted across both grooves so as to be movable up and down.

[0079] By configuring the stand 42M, stepped insulation member 52M, air chamber 53M, and slide frame portion 45M, the contact area between the stand 42M and the cooling module 60 (transmission block 6 and cooling unit 62) can be effectively reduced, making it possible to more effectively achieve the same effects as the cooling device 10 described above.

[0080] (Embodiment 2) FIG. 19 is a partial cross-sectional view of a cooling device according to the second embodiment of the present invention, which is different from cooling device 10 of the first embodiment in the mounting position of cooling unit 62 of cooling module 60A.

[0081] The cooling device 200 differs from the cooling device 10 in that a cooling module 60A is disposed on a socket 20A on the device body 40A, rather than on the lower surface of the device body 40A. The cooling device 200 is used to cool the electric component K such as an IC package when measuring the performance of the electric component K, and to perform a performance test in a low-temperature environment.

[0082] The cooling device 200 has a socket 20A that accommodates an electric component K, a device body 40A having an inspection board 44 on which the socket 20A is mounted, a heat insulating cover 70 as a heat insulating part that insulates the electric component K (the connection part of the electric component K), and a cooling module 60A. The cooling module 60A differs from the cooling module 60 only in the shape of a transmission block 6A that is connected to a heat absorption part of a cooling unit 62.

[0083] In the cooling device 400, the cooling unit 62 is attached to the top of the socket 20, the pressing part of the socket 20 is composed of the transmission block 6A, and the electric component K is abutted and pressed from above to connect to the inspection board 44, and the electric component K can be cooled from above in this state. The heat insulating cover 70A has an opening at the top through which the cooling unit 62 is inserted, and the cooling unit 62 is inserted through the opening and attached to the inspection board 44 in a sealed state so as to cover the socket 20A. The connection part between the electric component K and the inspection board 44 is surrounded by a heat insulating part such as the heat insulating cover 70A and is insulated. With this configuration, the low-temperature characteristics of an electric component such as an IC package can be measured with a compact device without causing condensation.

[0084] (Embodiment 3) FIG. 20 is a partial cross-sectional view of a cooling device according to the third embodiment of the present invention, which is different from cooling device 10 of the first embodiment in the mounting position of cooling unit 62 of the cooling module.

[0085] The cooling device 300 is different from the cooling device 10 in that the cooling unit 62C is mounted in parallel with the socket 20B on the device body 40A, not on the underside of the device body 40A. The cooling device 300 has a heat conductive part 306 inside or on the surface of the device body, specifically, the stand 420 on which the inspection board 44 is placed. The heat conductive part 306 may be any part that connects the transfer part (heat transfer part) 66B that contacts the electric component K of the accommodation part (connection part of the electric component K) of the socket 20B and the cooling unit 62C, and allows the heat absorption part of the cooling unit 62C to absorb the heat of the electric component K, and may be made of a metal such as copper, for example.

[0086] When the thermally conductive portion 306 is surface-mounted on the stand 420, it is insulated by a thermally insulating cover or a disconnecting sheet. The thermally conductive portion 306 may be formed of a bus bar or the like provided inside or on the surface of the stand 420. In this case, a thermally insulating portion may be provided so as to surround the periphery of the thermally conductive portion 306. Note that the thermally conductive portion 306 is used to cool the electric component K connected to the inspection board via the contact portion 66B, and a performance test is performed in a low-temperature environment. With this configuration, the low-temperature characteristics of an electric component such as an IC package can be measured with a compact device.

[0087] (Other variations) FIG. 21 is a partial cross-sectional side view showing a configuration of a main part of another modified example of the cooling device according to the first embodiment of the present invention.

[0088] In the first embodiment, the transmission block 6 (specifically, the protrusion 66) which is the heat transfer part of the cooling module 60 is directly abutted against the electric component K to cool it, but this is not limited thereto. As in the cooling device 400 shown in FIG. 21, a protrusion 66C of the transmission block 6C connected to the heat absorption part of the cooling unit 62 of the cooling module 60C may be abutted against the floating part 28 on which the electric component K is placed. That is, the floating part 28 may function as the heat transfer part. The protrusion 66C has a structure insulated from the contact. The temperature detection part 67 is configured to directly abut against the electric component K to measure the temperature. The floating part 28 may be integrally joined to the protrusion 66C.

[0089] This configuration may be appropriately applied to each of the above-mentioned embodiments and modifications, thereby making it possible to obtain the same effect without directly connecting to the electric component K.

[0090] Furthermore, according to each embodiment and each modification, if there is space for installing the stand 42, the low-temperature performance of the IC package can be measured, and the device is useful as a small, mobile low-temperature characteristic inspection device. In some cases, the heat absorbing part of the cooling unit 62 can be changed to a heat generating part, and the transmission block 6 can be connected to the heat generating part to make it possible to transmit heat, so that the characteristics at high temperatures can be easily measured in a small space. More specifically, for example, when a Peltier element is used in the cooling unit, cooling and heating can be switched by reversing the direction of the current flowing through the Peltier element, so that the device can be used to measure performance in a high-temperature environment (for example, JIS C 60068 2-2:2010, etc.) without changing the structure of the device.

[0091] Furthermore, by periodically switching the direction of the current flowing through the Peltier element, cooling and heating can be repeated, making it possible to use it for high and low temperature cycle tests (e.g., JIS C 60068 2-14:2011, etc.).

[0092] The above describes the embodiment of the present invention. Note that the above description is an example of a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. In other words, the description of the configuration of the above device and the shape of each part are examples, and it is clear that various modifications and additions to these examples are possible within the scope of the present invention. [Industrial Applicability]

[0093] The cooling device and low-temperature testing device according to the present invention have the effect of enabling the performance of electrical components such as IC packages to be measured in low-temperature environments efficiently in a small space, and are useful for low-temperature inspection of electrical components. [Explanation of symbols]

[0094] 6, 6A, 6C Transmission block (heat transfer section) 10, 200, 300, 400 chillers 20, 20A, 20B sockets 21 Contact section 21a Contact pin 22 Socket body 23 Pressing section 24 Cover member 25 Lever member 28 Floating section 40, 40A Device body 42, 42B, 42M, 420 Mount 43 Frame section 44 Test Board 45, 45M slide frame 46 Insulation Sheet 50 Insulation section 51 First insulation member 52, 52A, 52B, 52C, 52D, 52E, 52F, 52G, 52H, 52J, 52K, 52L Second heat insulating member 52M Stepped insulation material 53, 53D, 53G, 53H, 53J, 53K, 53L, 53M, 56, 532, 534 Air chamber 55 Insulation 57 Desiccant (moisture absorbing material) 58 O-ring 60, 60A, 60C Cooling Module 62 Cooling Unit 66, 66C protrusion 66B Contact part 67 Temperature detection section 68, 68M Guide pin (parallel pin) 70, 70A Insulation Cover 72 Flange 77 2nd Cover 78 Valve 306 Heat Conduction Section (Heat Transfer Section) 421, 432 Opening 424 Groove 425 Recess 425M Notch 425a, 4250 compatible 452 Fastening members 454, 521 Deformation part 520 Rib 521M curved surface 522, 524, 525, 526 Insulation K Electrical parts

Claims

1. A socket in which an electrical component is placed; a cooling unit having a heat absorbing portion for cooling the electrical component; A cooling device for testing the electrical component in a low temperature environment, comprising:

2. a heat transfer section disposed between the socket and the cooling unit and configured to transfer heat between the electrical component and the heat absorption section; The cooling device according to claim 1 .

3. a stand provided with the socket, the cooling unit, the heat transfer section, and a heat insulating section disposed around the heat transfer section to insulate the heat transfer section from the outside; The cooling device according to claim 1 or 2.

4. The heat insulating section is provided between the base, the heat transfer section, and the cooling unit, and has an elastic member that can be expanded and contracted to press the base, the heat transfer section, and the cooling unit. The cooling device according to claim 3.

5. The heat insulating section is adjacent to the elastic member, and is formed between the base and at least two of the heat transfer section and the cooling unit, and has an air chamber having a heat insulating function. The cooling device according to claim 4.

6. The elastic member has a curved surface, The mount has a corresponding surface formed in correspondence with the curved surface, The elastic member is disposed so as to surround the heat transfer portion with a partial gap formed between the bent surface and the corresponding surface. The cooling device according to claim 4.

7. A heat insulating cover portion for covering the socket is provided on the stand. The cooling device according to claim 3.

8. A moisture absorbing member is disposed inside the heat insulating cover. The cooling device according to claim 7.

9. A low-temperature test apparatus for performing electrical testing of electrical components in a low-temperature environment, comprising: The cooling device according to claim 3, The stand has a wiring section that electrically connects the electrical components and the test control device. Low temperature test equipment.

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