Imprinting Equipment
Patent Information
- Application Number
- JP2024503565
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-07-21
- Filing Date
- 2022-07-19
- Publication Date
- 2025-07-25
AI Technical Summary
Existing imprint lithography machines face challenges in accurately controlling the imprint gap and maintaining uniformity over larger wafer sizes, such as 300mm, due to insufficient rigidity and thermal management issues, leading to reduced process quality and longer heating/cooling times.
A two-part frame chuck manipulator with separate long-stroke and short-stroke drivers, combined with a spring arrangement and kinematic coupling, allows for precise control of the imprint gap and chuck position, along with a hollow chuck design for thermal management and a semi-automatic stamp loading mechanism.
Enables accurate and stable imprinting on larger wafers with reduced thermal mass, improved process gap control, and efficient loading/unloading, enhancing the quality and throughput of the imprint process.
Smart Images

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