Method for manufacturing light adjusting device

Abstract

To provide a method for manufacturing a light adjusting device which does not easily generate breakage of cracking when a mother substrate is cut.SOLUTION: The method for manufacturing a light adjusting device includes: a mother substrate holding step of holding one or two first mother substrates in a holding device; a cutting step of cutting the one or two first mother substrates and cutting out a light adjusting panel; a lamination step of laminating one or two second mother substrates on the one of two first mother substrates having been cut; a panel unit creation step of creating a panel unit by repeating the cutting step and the lamination step; and a conductive member formation step of forming a conductive member in a side part of the panel unit.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing a light control device. [Background technology]

[0002] The light control device includes a panel unit in which a plurality of light control panels are stacked (see, for example, Patent Document 1). The light control panel has, for example, a first substrate, a second substrate, and a liquid crystal layer sealed between these substrates. The panel unit is produced, for example, by cutting four mother substrates in a stacked state in one go using a cutting device such as a dicer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2004-333567 A Summary of the Invention [Problem to be solved by the invention]

[0004] A plurality of stacked mother boards are integrated to have high rigidity. When cutting the stacked mother boards, the mother boards being cut will try to deform due to the external force caused by the cutting, but since the integrated mother boards are difficult to deform, the mother boards may be damaged, such as by cracks, by the cutting.

[0005] The present disclosure has been made in consideration of the above, and aims to provide a manufacturing method for a light control device in which damage such as cracks is less likely to occur when cutting the motherboard. [Means for solving the problem]

[0006] A method for manufacturing a light control device according to one aspect of the present disclosure includes a panel unit in which at least four light control panels, each of which has a first substrate and a second substrate overlapping the first substrate in the first direction, are stacked in the first direction, and a conductive member is provided at an end of the panel unit in a second direction intersecting the first direction and extends in the first direction, the method including a motherboard holding step of holding a motherboard to which a plurality of the light control panels are connected in a holding device, a cutting step of cutting the motherboard to cut out the light control panels after the motherboard holding step, and a cutting step of cutting the motherboard to cut out the light control panels. The method includes a lamination process of laminating a mother board other than the mother board in the first direction on the cut mother board after the cutting process, a panel unit creation process of repeating the cutting process and the lamination process to create the panel unit after the lamination process, and a conductive member formation process of forming the conductive member at an end of the panel unit in the second direction after the panel unit creation process, wherein the mother board and the other mother board each comprise one sheet, or the mother board and the other mother board each comprise two stacked sheets. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view illustrating a light control device according to a first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II of FIG. [Diagram 3] FIG. 3 is a plan view of the first substrate in the first and second light control panels from the top shown in FIG. [Figure 4] FIG. 4 is a plan view of the second substrate in the first and second light control panels from the top shown in FIG. [Diagram 5] FIG. 5 is a plan view of the first substrate in the third and fourth light-adjusting panels from the top shown in FIG. [Figure 6] FIG. 6 is a plan view of the second substrate in the third and fourth light-adjusting panels from the top shown in FIG. [Figure 7] FIG. 7 is a plan view of the motherboard. [Figure 8]FIG. 8 is a schematic diagram of a positioning device for positioning a motherboard. [Figure 9] FIG. 9 is a side view diagrammatically illustrating a first cutting step in the manufacturing process of the light control device. [Figure 10] FIG. 10 is a plan view of FIG. [Figure 11] FIG. 11 is a side view diagrammatically illustrating a lamination step of a second mother substrate in the manufacturing process of the light control device. [Figure 12] FIG. 12 is a side view diagrammatically illustrating a second cutting step in the manufacturing process of the light control device. [Figure 13] FIG. 13 is a side view showing a schematic state in which all cutting steps in the manufacturing process of the light control device have been completed. [Figure 14] FIG. 14 is a perspective view illustrating the light control device according to the first embodiment. [Figure 15] FIG. 15 is a side view that illustrates a schematic view of a holding device according to a first modified example. [Figure 16] FIG. 16 is a side view diagrammatically showing a holding device according to the second modified example. [Figure 17] FIG. 17 is a side view diagrammatically showing a holding device according to a third modified example. [Figure 18] FIG. 18 is a side view diagrammatically illustrating a first cutting step in the manufacturing process of the light control device according to the second embodiment. [Figure 19] FIG. 19 is a side view diagrammatically illustrating a second cutting step in the manufacturing process of the light control device according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] The form (embodiment) for carrying out the present disclosure will be described in detail with reference to the drawings. The present disclosure is not limited to the contents described in the following embodiment. In addition, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the components described below can be appropriately combined.

[0009] The disclosure is merely an example, and those who are skilled in the art can easily conceive of appropriate modifications while keeping the gist of the disclosure are naturally included in the scope of the present disclosure. In addition, in order to make the explanation clearer, the width, thickness, shape, etc. of each part may be shown diagrammatically compared to the actual embodiment, but it is merely an example and does not limit the interpretation of the present disclosure. In addition, in this specification and each figure, the same symbols are given to elements similar to those described above with respect to the previous figures, and detailed explanations may be omitted as appropriate. In the XYZ coordinates shown in the figures, the X direction is the front-back direction, and the X1 side is opposite to the X2 side. The X1 side is also referred to as the front side, and the X2 side is also referred to as the rear side. The Y direction is the left-right direction, and the Y1 side is opposite to the Y2 side. The Y1 side is also referred to as the left side, and the Y2 side is also referred to as the right side. The Z direction is the up-down direction (stacking direction). The Z1 side is opposite to the Z2 side. The Z1 side is also referred to as the upper side, and the Z2 side is also referred to as the lower side.

[0010] [First embodiment] Fig. 1 is a perspective view showing a schematic diagram of a light control device according to a first embodiment of the present invention, and Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1.

[0011] 1 and 2, the light control device 100 according to the first embodiment includes a panel unit 110, a conductive member 500, and a flexible printed circuit board (FPC) 400, which is an example of an external connection wiring. The external connection wiring is not limited to the flexible printed circuit board 400, and may be a conductor.

[0012] 2, in this embodiment, the panel unit 110 is formed by stacking a plurality of (four in this embodiment) light control panels 1 in the Z direction (first direction). The number of stacked light control panels 1 can be, for example, four or more. In this embodiment, the light control panel 1 is a square, but the present invention is not limited to this and also includes polygonal shapes such as an octagon.

[0013] Specifically, as shown in FIG. 2, the four light control panels 1 are stacked in order from the top, with the light control panels 1A, 1B, 1C, and 1D. Each light control panel 1 includes a first substrate 2 disposed on the lower side, a second substrate 3 disposed on the upper side, a seal 600 provided between the first substrate 2 and the second substrate 3, a liquid crystal layer 4 filled inside the seal 600, and a terminal 200. The inside of the seal 600 is an effective area. When viewed from the Z direction, the first substrate 2 and the second substrate 3 have the same size. For example, an external connection wiring (flexible printed circuit board 400) is electrically connected to the terminal 200 of the first substrate 2 in the light control panel 1D located at the bottom.

[0014] 1, a conductive member 500 extends along the Z direction (up-down direction) on the side of the panel unit 110. The conductive member 500 is formed by applying a paste containing a conductive material such as silver (Ag) or carbon (C) to the side of the panel unit 110 and curing it.

[0015] Next, the wiring and terminals of the first substrate 2 and the second substrate 3 constituting the panel unit 110 will be described in detail. Fig. 3 is a plan view of the first substrate in the first and second dimming panels from the top shown in Fig. 2. Fig. 4 is a plan view of the second substrate in the first and second dimming panels from the top shown in Fig. 2. Fig. 5 is a plan view of the first substrate in the third and fourth dimming panels from the top shown in Fig. 2. Fig. 6 is a plan view of the second substrate in the third and fourth dimming panels from the top shown in Fig. 2.

[0016] As shown in FIG. 2 described above, the four light control panels 1 are stacked in the order of the light control panel 1A, the light control panel 1B, the light control panel 1C, and the light control panel 1D from the top.

[0017] As shown in Fig. 3, the first substrate 2 of the light control panel 1A and the light control panel 1B includes first terminals 210, 220, 230, and 240 and a liquid crystal driving electrode 250. The terminal 200 shown in Fig. 2 includes the first terminals 210, 220, 230, and 240. The first substrate 2 is square in plan view and has a first side 21, a second side 22, a third side 23, and a fourth side 24. The first side 21 is located on the X1 side. The second side 22 is located on the X2 side. The third side 23 is located on the Y1 side. The fourth side 24 is located on the Y2 side.

[0018] The first terminal 210 has straight portions 213 and 215. The straight portions 213 and 215 are wide strip-shaped bodies. The straight portion 213 extends from end 211 to end 212. The straight portion 213 extends along the first side 21. The straight portion 215 extends from end 212 to end 214. The end 214 is connected to a wiring 251. A liquid crystal driving electrode 250 is provided in the center of the first substrate 2, and the wiring 251 is electrically connected to the liquid crystal driving electrode 250. The wiring 251 extends in the Y direction. A plurality of liquid crystal driving electrodes 250 are provided, each extending in the X direction.

[0019] The first terminal 220 has straight portions 223 and 225. The straight portions 223 and 225 are wide strips. The straight portion 223 extends from the end 221 to the end 222. The straight portion 223 extends along the second side 22. The straight portion 225 extends from the end 222 to the end 224. The end 224 is connected to a wiring 252. The wiring 252 is connected to a liquid crystal driving electrode 250. The wiring 252 extends in the Y direction.

[0020] The first terminal 230 has a straight portion 233. The straight portion 233 is a wide strip. The straight portion 233 extends from the end 231 to the end 232. The straight portion 233 extends along the third side 23.

[0021] The first terminal 240 has a straight portion 243. The straight portion 243 is a wide strip. The straight portion 243 extends from the end 241 to the end 242. The straight portion 243 extends along the fourth side 24.

[0022] As shown in Fig. 4, the second substrate 3 of the light control panel 1A and the light control panel 1B includes second terminals 310, 320, 330, and 340, and a liquid crystal driving electrode 350. The second substrate 3 is square in plan view, and has a first side 31, a second side 32, a third side 33, and a fourth side 34. The first side 31 is located on the X1 side. The second side 32 is located on the X2 side. The third side 33 is located on the Y1 side. The fourth side 34 is located on the Y2 side.

[0023] The second terminal 310 has a straight portion 313. The straight portion 313 is a wide strip. The straight portion 313 extends from the end 311 to the end 312. The straight portion 313 extends along the first side 31.

[0024] The second terminal 320 has a straight portion 323. The straight portion 323 is a wide strip. The straight portion 323 extends from the end 321 to the end 322. The straight portion 323 extends along the second side 32.

[0025] The second terminal 330 has straight portions 333 and 335. The straight portions 333 and 335 are wide strip-shaped bodies. The straight portion 333 extends from end 331 to end 332. The straight portion 333 extends along the third side 33. The straight portion 335 extends from end 332 to end 334. The end 334 is connected to a wiring 351. A liquid crystal driving electrode 350 is provided in the center of the second substrate 3, and the wiring 351 is electrically connected to the liquid crystal driving electrode 350. The wiring 351 extends in the X direction. A plurality of liquid crystal driving electrodes 350 are provided, each extending in the Y direction.

[0026] The second terminal 340 has straight portions 343 and 345. The straight portions 343 and 345 are wide strips. The straight portion 343 extends from the end 341 to the end 342. The straight portion 343 extends along the fourth side 34. The straight portion 345 extends from the end 342 to the end 344. The end 344 is connected to a wiring 352. The wiring 352 is electrically connected to the liquid crystal driving electrode 350. The wiring 352 extends in the X direction.

[0027] The dimming panels 1C and 1D shown in Figs. 5 and 6 are obtained by rotating the dimming panels 1A and 1B by 90 degrees in a clockwise direction (right-handed direction) in a plan view. Therefore, the positions of the wiring, terminals, and electrodes of the first substrate 2 and the second substrate 3 included in the dimming panels 1C and 1D are also obtained by rotating the wiring, terminals, and electrodes of the first substrate 2 and the second substrate 3 included in the dimming panels 1A and 1B by 90 degrees in a clockwise direction (right-handed direction). The dimming panels 1A and 1B are dimming panels for p-wave polarization, for example, and the dimming panels 1C and 1D are dimming panels for s-wave polarization, for example. In this way, the degree of diffusion of light in two directions can be controlled by driving the dimming panel for p-wave polarization and the dimming panel for s-wave polarization, respectively.

[0028] Next, the manufacture of the light control device 100 will be described. FIG. 7 is a plan view of a motherboard. FIG. 8 is a schematic diagram of a positioning device that positions the motherboard. FIG. 9 is a side view that typically shows a first cutting step in the manufacturing process of the light control device. FIG. 10 is a plan view of FIG. 9. FIG. 11 is a side view that typically shows a lamination step of a second motherboard in the manufacturing process of the light control device. FIG. 12 is a side view that typically shows a second cutting step in the manufacturing process of the light control device. FIG. 13 is a side view that typically shows a state in which all cutting steps in the manufacturing process of the light control device have been completed. FIG. 14 is a perspective view that typically shows the light control device according to the first embodiment.

[0029] First, the mother substrate 120 will be described. As shown in FIG. 7, the mother substrate 120 has, for example, a rectangular shape in a plan view. Specifically, the mother substrate 120 has a first side 121, a second side 122, a third side 123, and a fourth side 124. The mother substrate 120 according to this embodiment connects three light control panels 1 in the left-right direction. That is, in FIG. 7, the first substrate 2 and the second substrate 3 are stacked in a direction perpendicular to the paper surface, and the seal 600 and the liquid crystal layer 4 are provided between the first substrate 2 and the second substrate 3. Therefore, when the mother substrate 120 in FIG. 7 is cut along the cutting line 125, three light control panels 1 are obtained. The cutting line 125 is approximately parallel to the third side 123 and the fourth side 124.

[0030] Next, the positioning device 720 for the mother substrate 120 will be described. As shown in the plan view of FIG. 8, the positioning device 720 for positioning the mother substrate 120 includes positioning members 721, 722, 723, and 724, biasing members 725 and 726, and fixing members 727 and 728. The positioning members abut against the respective sides of the mother substrate 120. The positioning member 721 abuts against the third side 123. The positioning member 722 abuts against the first side 121. The positioning member 723 abuts against the second side 122. The positioning member 724 abuts against the fourth side 124. The fixing member 727 is disposed along a direction perpendicular to the second side 122 and spaced apart from the second side 122. The fixing member 727 and the positioning member 723 are connected via the biasing member 725. The urging member 725 extends approximately parallel to the third side 123 and the fourth side 124. The fixed member 728 is disposed along a direction perpendicular to the fourth side 124 and spaced apart from the fourth side 124. The fixed member 728 and the positioning member 724 are connected via the urging member 726. The urging member 726 extends approximately parallel to the first side 121 and the second side 122.

[0031] Next, a description will be given of a holding device 710 for the mother substrate 120. Fig. 9 is a side view diagrammatically showing a first cutting step in the manufacturing process of the light control device. Fig. 10 is a plan view of Fig. 9.

[0032] As shown in FIG. 9, the holding device 710 includes a mounting plate 711 and a support portion 712. As shown in FIG. 9 and FIG. 10, the mounting plate 711 is a flat plate having a rectangular shape in a plan view. A through hole 713 is provided in the center of the mounting plate 711. The support portion 712 has a cylindrical shape with the through hole 713 provided therein. The through hole 713 of the support portion 712 communicates with the through hole 713 of the mounting plate 711. The holding device 710 has a vacuum suction function. That is, the support portion 712 is connected to a suction device (not shown), and air 714 is sucked into the suction device from the through hole 713 of the support portion 712. This allows the mother substrate 120 to be held on the mounting plate 711 by vacuum suction.

[0033] Next, a cutting device 700 for the mother substrate 120 will be described. The cutting device 700 according to this embodiment is, for example, a dicer 715 shown in Figures 9 and 10. However, in the present invention, in addition to the dicer 715, cutting using a laser, cutting using a wire saw, cutting using a water jet, and the like can also be applied.

[0034] Next, a manufacturing method of the light control device 100 will be described. FIG. 11 is a side view that typically shows a lamination step of a second mother substrate in the manufacturing process of the light control device. FIG. 12 is a side view that typically shows a second cutting step in the manufacturing process of the light control device. FIG. 13 is a side view that typically shows a state in which all cutting steps in the manufacturing process of the light control device have been completed. FIG. 14 is a perspective view that typically shows the light control device according to the first embodiment. The manufacturing method according to this embodiment is characterized in that the mother substrates are cut one by one. Details will be described below.

[0035] (Motherboard holding process) In the motherboard holding step, as shown in Figs. 9 and 10, one motherboard 120 is placed and held on three holding devices 710. The motherboard 120 has three light control panels 1 connected in the left-right direction. In other words, when the motherboard 120 is cut along the cutting lines 125, three light control panels 1 are produced. One holding device 710 is provided for one light control panel 1. As described above, one motherboard 120 is held on the three mounting plates 711 by vacuum suction.

[0036] 9 to 13, the motherboard is positioned by a positioning device 720 (see FIG. 8), but the positioning device 720 is not shown. That is, the motherboard is positioned by the positioning device 720 in all steps up to the production of the panel unit 110.

[0037] (cutting process) The cutting step is performed after the motherboard holding step. In the cutting step, one motherboard 120 is cut to cut out three light control panels 1, as shown in Fig. 9 and Fig. 10. In the cutting step, the motherboard 120 is also positioned by the positioning device 720.

[0038] As described above, the cutting device 700 is, for example, a dicer 715. Specifically, the dicer 715 is used to cut along the cutting line 125 to cut out the three divided pieces 130, that is, divided pieces 131, 132, and 133 (see FIG. 11 ). Each of the divided pieces 131, 132, and 133 corresponds to one light control panel 1.

[0039] (Lamination process) The lamination process is performed after the cutting process. In the lamination process, as shown in Fig. 11, a mother substrate 120A, which is separate from the mother substrate 120, is laminated on the three divided pieces 130. Specifically, a light-transmitting adhesive 610 is applied onto the divided pieces 131, 132, and 133, the mother substrate 120A is placed on the light-transmitting adhesive 610, and the light-transmitting adhesive 610 is cured. In the lamination process, the mother substrate 120A is also positioned by a positioning device 720.

[0040] (cutting process) 12, in the cutting process, the mother substrate 120A is cut including the light-transmitting adhesive 610 to cut out the three divided pieces 130, that is, the divided pieces 131A, 132A, and 133A. That is, the mother substrate 120A and the light-transmitting adhesive 610 are cut out to cut out the three divided pieces 130, that is, the divided pieces 131A, 132A, and 133A. Each of the divided pieces 131A, 132A, and 133A corresponds to one light-control panel 1.

[0041] (Panel unit production process) In the panel unit production process, the cutting process and the stacking process are repeated to produce panel unit 110. That is, a motherboard is stacked on and cut from divided pieces 131A, 132A, and 133A, which are the three divided pieces 130 shown in Fig. 13, and another motherboard is stacked and cut. Here, the third and fourth motherboards from the bottom are rotated 90 degrees clockwise (right-handed) in a plan view relative to the first and second motherboards from the bottom.

[0042] As a result, the segment piece 131A is stacked on the segment piece 131, the segment piece 131B is stacked on the segment piece 131A, and the segment piece 131C is stacked on the segment piece 131B. Each of these segment pieces 131, 131A, 131B, and 131C corresponds to one light control panel 1. Therefore, one panel unit 110 is created by the segment pieces 131, 131A, 131B, and 131C.

[0043] Similarly, division piece 132A is layered on division piece 132, division piece 132B is layered on division piece 132A, and division piece 132C is layered on division piece 132B. One panel unit 110 is created by these division pieces 132, 132A, 132B, and 132C.

[0044] Furthermore, split piece 133A is stacked on split piece 133, split piece 133B is stacked on split piece 133A, and split piece 133C is stacked on split piece 133B. One panel unit 110 is created by these split pieces 133, 133A, 133B, and 133C. In this manner, in this embodiment, three panel units 110 are created by repeating the cutting process and the stacking process.

[0045] (Conductive member forming process) The conductive member forming process is performed after the panel unit creating process. As shown in Fig. 14, in the conductive member forming process, a conductive member 500 is formed on the side of the panel unit 110. Fig. 14 shows a panel unit 110 made of divided pieces 131, 131A, 131B, and 131C located at the leftmost position in Fig. 13. The conductive members 500 are disposed in the center of each side in a plan view of the panel unit 110. Specifically, the conductive members 500 are formed by applying a paste containing a conductive material such as silver (Ag) or carbon (C) to the side of the panel unit 110 and curing it.

[0046] Finally, the flexible printed circuit board 400 is electrically connected to the terminals 200 (see FIG. 2) of the panel unit 110. In this way, the light control device 100 is completed.

[0047] As described above, the manufacturing method of the light control device 100 according to the first embodiment includes a motherboard holding step of holding one motherboard 120 in the holding device 710, a cutting step of cutting the one motherboard 120 to cut out the light control panel 1, a lamination step of laminating one motherboard 120A on the cut one motherboard 120, a panel unit creating step of creating the panel unit 110 by repeating the cutting step and the lamination step, and a conductive member forming step of forming the conductive member 500 on the side of the panel unit 110. Thus, in this embodiment, there is one each of the motherboard 120 and the other motherboard 120A, and in the cutting step, the motherboard 120 and the other motherboard 120A are cut one by one.

[0048] As described above, conventionally, for example, four mother boards are stacked together and then cut to create panel unit 110. However, multiple mother boards integrated into one body of four boards are highly rigid and therefore difficult to deform, and there is a possibility that damage such as cracks may occur due to cutting.

[0049] In contrast, in this embodiment, the mother substrate 120 and the separate mother substrate 120A are cut one by one. Therefore, the mother substrate 120 and the separate mother substrate 120A are easily deformed during cutting, and damage such as cracks due to cutting is less likely to occur.

[0050] Furthermore, according to the first embodiment, in the mother substrate holding step, the mother substrate 120 is held by the holding device 710 by vacuum suction. Therefore, the mother substrate 120 can be held by the holding device 710 by sucking the air 714, and the mother substrate 120 can be removed from the holding device 710 by stopping the suction of the air 714. Thus, the vacuum suction makes it easy to attach and detach the mother substrate 120.

[0051] The holding device 710 is provided for each light control panel 1 obtained by cutting the mother substrate 120. When the mother substrate 120 is cut, foreign matter such as chips generated during cutting falls from the cut portion. Therefore, by arranging one holding device 710 for each light control panel 1 obtained by cutting the mother substrate 120, the foreign matter is less likely to adhere to the holding device 710.

[0052] [First Modification] Next, a holding device according to a first modified example will be described. Fig. 15 is a side view showing a holding device according to a first modified example. In the first embodiment, a holding device 710 having a vacuum suction function is applied, but in the first modified example, a removable reversible adhesive 620 is applied.

[0053] As shown in FIG. 15, the holding device 710A according to the first modification includes a holding member 713A and a reversible adhesive 620. The reversible adhesive 620 is an adhesive that can be repeatedly attached and detached. Three holding members 713A are provided. The holding member 713A includes a mounting plate 711A and a support portion 712A. The mounting plate 711A is, for example, a rectangular flat plate in a plan view. The support portion 712A extends downward from the lower surface of the mounting plate 711A. The reversible adhesive 620 is provided on the mounting plate 711A. The reversible adhesive 620 bonds and holds the mother substrate 120 to the mounting plate 711A.

[0054] As described above, according to the first modification, in the mother substrate holding step, the mother substrate 120 is held by the holding device 710A via the detachable reversible adhesive 620. This allows the mother substrate 120 to be held by the holding device 710A over a wider area, so that the mother substrate 120 can be held more stably. In addition, since the reversible adhesive 620 is detachable, it can be easily removed after the manufacturing process is completed.

[0055] [Second modified example] Next, a holding device according to a second modified example will be described. Fig. 16 is a side view showing a typical holding device according to a second modified example. In the second modified example, one large plate-shaped mounting plate 711B has a vacuum suction function.

[0056] As shown in FIG. 16, a holding device 710B according to the second modification includes a mounting plate 711B. The mounting plate 711B is one large plate-like member. The mounting plate 711B is, for example, rectangular in plan view. A plurality of through holes 713B are provided in the mounting plate 711B. The mounting plate 711B is connected to a suction device (not shown), and air 714 is sucked from the through holes 713B of the mounting plate 711B by the suction device. This allows the mother substrate 120 to be held on the mounting plate 711B by vacuum suction.

[0057] As described above, according to the second modification, the holding device 710B includes the mounting plate 711B, and one holding device 710B is provided for one mother substrate 120. Therefore, the mother substrate 120 can be held over a wider area, and therefore the mother substrate 120 can be held more stably.

[0058] [Third Modification] Next, a holding device according to a third modified example will be described. Fig. 17 is a side view showing a holding device according to a third modified example. In the third modified example, a reversible adhesive 620 is provided on one large plate-like mounting plate 711C.

[0059] As shown in Fig. 17, a holding device 710C according to the third modified example includes a mounting plate 711C and a reversible adhesive 620. The mounting plate 711C is a single large flat plate-like member. The mounting plate 711C does not have a through hole like the mounting plate 711B. The reversible adhesive 620 is provided on the mounting plate 711C. The reversible adhesive 620 bonds and holds the mother substrate 120 to the mounting plate 711C.

[0060] As described above, according to the third modified example, one holding device 710C is provided for one mother substrate 120. The mother substrate 120 is held by the holding device 710C via the removable reversible adhesive 620. Therefore, the mother substrate 120 can be held over a wider area, and therefore the mother substrate 120 can be held more stably.

[0061] [Second embodiment] Next, a manufacturing method of the light control device 100 according to the second embodiment will be described. FIG. 18 is a side view that shows a schematic first cutting step in the manufacturing process of the light control device according to the second embodiment. FIG. 19 is a side view that shows a schematic second cutting step in the manufacturing process of the light control device according to the second embodiment. In the first embodiment, the mother boards are cut one by one, but the manufacturing method according to the second embodiment is characterized in that the mother boards are cut two by two. The following mainly describes the differences from the first embodiment.

[0062] (Motherboard holding process) 18, in the mother substrate holding step, two mother substrates 120 and 120A are placed and held on three holding devices 710. The mother substrates 120 and 120A are bonded in advance via a light-transmitting adhesive 610. Note that in the second embodiment as well, the positioning devices 720 are not shown.

[0063] (cutting process) In the cutting process, as shown in Fig. 18, two mother substrates 120 and 120A are cut to cut out the light control panel 1. That is, as shown in Fig. 18, by cutting out the mother substrate 120 with a dicer 715, divided pieces 131 and 131A, divided pieces 132 and 132A, and divided pieces 133 and 133A are obtained.

[0064] (Lamination process) In the lamination process, as shown in Fig. 19, the separate mother substrates 120B and 120C are laminated on the three divided pieces 131A, 132A, and 133A. The mother substrates 120B and 120C are previously bonded via a light-transmitting adhesive 610. Specifically, the light-transmitting adhesive 610 is applied onto the divided pieces 131A, 132A, and 133A, the mother substrates 120B and 120C are placed on the light-transmitting adhesive 610, and the light-transmitting adhesive 610 is cured. In the lamination process, the mother substrates 120B and 120C are also positioned by a positioning device 720.

[0065] (Cutting process and panel unit creation process) In the cutting step, the mother substrates 120B and 120C are cut to separate pieces, as shown in Fig. 19. In this way, the panel unit 110 is produced.

[0066] As described above, according to the second embodiment, there are two each of the mother substrates 120, 120A and the separate mother substrates 120B, 120C, and in the cutting step, two each of the mother substrates 120, 120A and the separate mother substrates 120B, 120C are cut.

[0067] In this way, even when the mother substrates are cut two at a time, the mother substrates 120, 120A and the other mother substrates 120B, 120C are more likely to deform during cutting than in the conventional method, and damage such as cracks caused by cutting is less likely to occur. Since the mother substrates are cut two at a time, the number of cutting operations is halved compared to the first embodiment. [Explanation of symbols]

[0068] 1, 1A, 1B, 1C, 1D Dimming Panel 2 First board 3 Second board 4 Liquid crystal layer 100 Dimmer 110 Panel unit 120, 120A, 120B, 120C Motherboard 125 Cutting line 130 Split piece 400 Flexible printed circuit board (external connection wiring) 500 Conductive material 610 Translucent adhesive 620 Reversible Adhesive 700 cutting equipment 710, 710A, 710B, 710C holding device 715 Dicer

Claims

1. A method for manufacturing a light control device including: a panel unit in which at least four light control panels, each of which has a first substrate and a second substrate overlapping the first substrate in a first direction, are stacked in the first direction; and a conductive member provided at an end of the panel unit in a second direction intersecting the first direction and extending in the first direction, a motherboard holding step of holding a motherboard to which a plurality of the light control panels are connected in a holding device; a cutting step of cutting the mother board to cut out the light control panel after the mother board holding step; a lamination step of laminating a mother substrate, which is different from the mother substrate, on the cut mother substrate in the first direction after the cutting step; a panel unit creating step of creating the panel unit by repeating the cutting step and the lamination step after the lamination step; a conductive member forming step of forming the conductive member at an end of the panel unit in the second direction after the panel unit creating step, The mother board and the other mother board each are one sheet, or the mother board and the other mother board each are two stacked boards. A method for manufacturing a light control device.

2. the mother substrate and the another mother substrate are each one piece, In the cutting step, the mother substrate and the another mother substrate are cut one by one. A method for manufacturing the light control device according to claim 1 .

3. the mother substrate and the another mother substrate are each two laminated substrates, In the cutting step, the mother substrate and the another mother substrate are cut into two pieces each. A method for manufacturing the light control device according to claim 1 .

4. In the mother substrate holding step, the mother substrate is held by the holding device by vacuum suction. A method for manufacturing the light control device according to claim 1 .

5. In the motherboard holding step, the motherboard is held on the holding device via a removable adhesive. A method for manufacturing the light control device according to claim 1 .

6. The holding device comprises: One is provided for each of the light control panels obtained by cutting the mother board, A method for manufacturing the light control device according to claim 1 .

7. The holding device comprises: One is provided for the mother board, A method for manufacturing the light control device according to claim 1 .

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