Method and apparatus for vapor pressure monitoring
The system addresses cold spots in semiconductor manufacturing by using a heated gas line with a metal body and thermocouples to ensure accurate vapor pressure measurement and uniform deposition.
Patent Information
- Application Number
- JP2024097381
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-06-20
- Filing Date
- 2024-06-17
- Publication Date
- 2025-01-08
AI Technical Summary
Traditional semiconductor manufacturing systems face issues with gas lines having cold spots that cause condensation, leading to non-uniform deposition on wafers and inaccurate vapor pressure measurement due to low pressures.
A system with a gas line having a metal body surrounding a segment, embedded heater rod, and thermocouples, along with an insulator, is used to maintain consistent vapor pressure by heating and monitoring through a pressure sensor outside the enclosure.
The system ensures accurate vapor pressure measurement and uniform deposition by maintaining consistent vapor pressure, reducing condensation and improving deposition uniformity in semiconductor manufacturing.
Smart Images

Figure 2025001652000001_ABST
Abstract
Description
[Technical field]
[0001] The present disclosure relates generally to a method and apparatus for vapor pressure monitoring. More specifically, the present disclosure relates to an enclosure having a through hole for receiving a feedthrough gas line, the feedthrough gas line having an internal heating element, and the feedthrough gas line being coupled to a pressure sensor located outside the enclosure. [Background technology]
[0002] Conventional semiconductor manufacturing systems have gas lines that have cold spots that cause condensation, which can lead to non-uniform deposition on the wafer. In addition, measurements of vapor pressure through the gas lines are inaccurate when the vapor pressure is low. Summary of the Invention
[0003] Various embodiments of the present technology may provide a method and apparatus for vapor pressure monitoring in a semiconductor manufacturing tool. The apparatus may include a vessel containing a chemical and an outlet connected to a gas line, the gas line including a first section connected to a reactor and a second section connected to an exhaust port. The gas line may also include a third section connected to a pressure monitor.
[0004] In one aspect, an apparatus includes a gas line, a metal body surrounding a segment of the gas line, the metal body including a heater rod embedded within the metal body and a first thermocouple connected to the metal body, and an insulator surrounding a portion of the metal body.
[0005] In one embodiment, a portion of the heater rod extends outside the metal body.
[0006] In one embodiment, insulation surrounds a portion of the heater rod that extends outside the metal body.
[0007] In one embodiment, the insulator is separated from the metal body by an air gap.
[0008] In one embodiment, the gas lines extend through the insulation.
[0009] In one embodiment, the metal body is formed from stainless steel.
[0010] In one embodiment, the metallic body further comprises a second thermocouple.
[0011] In one embodiment, the metal body further comprises a second thermocouple, and the first thermocouple is disposed on a first side of the metal body and the second thermocouple is disposed on a second side of the metal body opposite the first side.
[0012] In another aspect, an apparatus comprises a first cabinet comprising a first wall having a first through hole; a second cabinet disposed within the first cabinet and comprising a second wall parallel to the first wall, the second wall comprising a second through hole aligned with the first through hole; and a gas line system comprising a feedthrough device disposed and extending through the first and second through holes, the feedthrough device comprising a gas line and a metal body surrounding a segment of the gas line, the metal body comprising a heater rod comprising a first section embedded within the metal body and a second section extending outside the metal body, a first thermocouple connected to the metal body, and an insulator surrounding a portion of the metal body and the second section of the heater rod.
[0013] In one embodiment, the metallic body further comprises a second thermocouple.
[0014] In one embodiment, the metal body is formed from stainless steel.
[0015] In one embodiment, the insulator comprises polyetheretherketone (PEEK).
[0016] In one embodiment, the second cabinet is separated from the first cabinet by an air gap.
[0017] In one embodiment, the apparatus further comprises a pressure sensor coupled to the gas line and disposed outside the first cabinet.
[0018] In yet another aspect, a system includes a reactor, a first cabinet including a first wall having a first through hole, a second cabinet disposed within the first cabinet and including a second wall parallel to the first wall, the second wall including a second through hole aligned with the first through hole and separated from the first cabinet by an air gap, a container disposed within the second cabinet, and a gas line connected to the container and disposed within the first and second through holes, the gas line including a first section connected to the reactor, a second section connected to an exhaust port, and a third section connected to a pressure sensor, the third section extending through the first and second enclosures, and the pressure sensor disposed outside the second enclosure.
[0019] In one embodiment, the third section includes a feedthrough device disposed and extending through the first and second through holes, the feedthrough device including a gas line and a metal body surrounding a segment of the gas line.
[0020] In one embodiment, the metal body comprises a heater rod having a first section embedded within the metal body and a second section extending outside the metal body, and a first thermocouple connected to the metal body.
[0021] In one embodiment, the system further comprises insulation surrounding a portion of the metal body and the second section of the heater rod, the insulation comprising polyetheretherketone.
[0022] In one embodiment, the metallic body further comprises a second thermocouple opposite the first thermocouple.
[0023] In one embodiment, the metal body is formed from stainless steel.
[0024] A more complete understanding of the present technology may be obtained by reference to the detailed description when considered in conjunction with the following illustrative drawings, in which like reference numbers refer to like elements and steps throughout. [Brief description of the drawings]
[0025] [Figure 1] FIG. 1 representatively illustrates a system in accordance with various embodiments of the present technology. [Figure 2A] FIG. 2A representatively illustrates a perspective view of a portion of an enclosure of a system in accordance with various embodiments of the present technology. [Figure 2B] FIG. 2B representatively illustrates a side view of an enclosure according to various embodiments of the present technology. [Diagram 3] FIG. 3 representatively illustrates a feedthrough section of a gas line in accordance with various embodiments of the present technique. [Figure 4] FIG. 4 illustrates a cross-sectional view of a feedthrough section in accordance with various embodiments of the present technique. [Diagram 5] FIG. 5 is a cross-sectional view of a feedthrough section in accordance with various embodiments of the present technique. [Figure 6] FIG. 6 is a schematic diagram of a system in accordance with various embodiments of the present technology. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0026] The technology may be described in terms of functional block components and various processing steps. Such functional blocks may be realized by any number of components configured to perform the specified functions and to achieve various results.
[0027] In various embodiments, and with reference to FIGS. 1 and 2, the system 100 may include a first enclosure 105 (e.g., a cabinet) and a second enclosure 200 (e.g., a cabinet). Each enclosure 105, 200 may include a number of side walls, a bottom, and a top. The first enclosure 105 may surround the second enclosure 200, and the second enclosure 200 may be separated from the first enclosure 105 by an air gap 210. The first enclosure 105 and the second enclosure 200 may be formed from a metallic material, such as stainless steel or the like. The first enclosure 105 may include a first through hole 135 in a vertically oriented side wall of the first enclosure 105. Similarly, the second enclosure 200 may include a second through-hole 205 in a vertically oriented sidewall of the second enclosure such that the first through-hole 135 is horizontally aligned with the second through-hole 205.
[0028] The second enclosure 200 may be heated. For example, the system 100 may include a heating system (not shown) disposed within or near the second enclosure 200, such as a radiative heat source, a convective heat source, a conductive heat source, or other suitable heat source for heating the interior of the second enclosure 200.
[0029] In various embodiments, the system 100 may further include a container 110 disposed within the second enclosure 200. The container 110 may be configured to hold or otherwise contain a chemical, which may be a solid or liquid chemical. The container 110 may include an outlet port, which may be connected to a gas line system. In various embodiments, the container 110 may further include an inlet (not shown) configured to deliver an inert gas (not shown), such as argon, into the container. The inert gas may be used as a carrier gas to assist in flowing the chemical vapor into the reactor 160.
[0030] In various embodiments, the gas line system may comprise a first section 140, a second section 145, and a third section 150. The first section 140, the second section 145, and the third section 150 may be in fluid communication with each other. The first section 140 may be connected to a reactor 160. Specifically, the first section 140 may fluidly connect the vessel 110 to the reactor 160. The second section 145 may be connected to an exhaust system 125. The exhaust system 125 may comprise a pump (not shown) configured to exhaust gas from the gas line.
[0031] The third section 150 may extend out of and through the first enclosure 105 and the second enclosure 200 and may be connected to a pressure sensor 115, such as a pressure transducer. For example, the pressure sensor 115 may comprise a pressure transducer or other device or system suitable for measuring vapor pressure. In an exemplary embodiment, the pressure sensor 115 is disposed outside the first enclosure 105. The pressure sensor 115 may be configured to monitor the vapor pressure of the chemical within the container 110.
[0032] In various embodiments, and with reference to FIGS. 2-5, the third section 150 may include a feed-through device 135 that extends through a through hole in the first enclosure 105 and the second enclosure 200. The feed-through device 135 may include a gas line 325. The feed-through device 135 may further include a metal body 305 that surrounds a segment of the gas line 325. Specifically, the metal body 305 may be in direct contact with the gas line 325 and may also radially surround the gas line 325. In an exemplary embodiment, the metal body 305 is formed from stainless steel. In an exemplary embodiment, the metal body 305 extends from the interior of the second enclosure 200, through the gap 210, and to the exterior of the first enclosure 105. A larger portion of the metal body 305 may extend outward from the exterior of the first enclosure 105.
[0033] In various embodiments, the metal body 305 may comprise a heater rod 310 configured to heat the metal body 305 and the gas line 325. The heater rod 310 may be embedded within the metal body 305, and a first portion 400 of the heater rod 310 may extend substantially through the length of the metal body 305. A portion of the heater rod 310 may extend outside the metal body 305. In an exemplary embodiment, a second portion 405 of the heater rod 310 is exposed (i.e., not embedded within the metal body) and extends outwardly from the metal body 305 and outwardly from the exterior of the first enclosure 105. The heater rod 310 may comprise a resistive type heater, or any other suitable heating element.
[0034] In various embodiments, the metal body 305 may further comprise temperature sensors, such as a first thermocouple 315 and a second thermocouple 320. The first thermocouple 315 may be attached (e.g., using a lug) to a first side of the metal body 305, and the second thermocouple 320 may be attached (e.g., using a lug) to a second side of the metal body 305 opposite the first side.
[0035] In various embodiments, the system 100 may further comprise an insulator 500 disposed outside the first enclosure 105 and enclosing a portion of the feed-through device 135. For example, the insulator 500 may surround the portion of the metal body 305 housing the heater rod 310 as well as the exposed second portion 405 of the heater rod 310. The insulator 500 may comprise through holes for receiving the gas lines 325, the second portion 405 of the heater rod 310, and at least a portion of the feed-through device 130, such as the thermocouples 315, 320. In an exemplary embodiment, the insulator 500 is formed from PEEK (polyetheretherketone). The insulator 500 may comprise a two-part system coupled together. A surface of the insulator 500 may directly contact the sidewall of the first enclosure 105.
[0036] In various embodiments, the system 100 may further include an accumulator 120 interposed between the vessel 110 and the reactor 160. The accumulator 120 may operate to temporarily store the vapor before the vapor is released into the reactor 160.
[0037] In various embodiments, the system 100 may further include a plurality of valves. For example, the system 100 may include a first valve 605, a second valve 615, a third valve 610, a third valve 620, a fourth valve 640, a fifth valve 645, and a sixth valve 650, a seventh valve 625, and an eighth valve 630, a ninth valve 635, and a tenth valve 610. Some valves, such as the second valve 615, the fourth valve 640, the fifth valve 645, and the sixth valve 650, may be disposed in the first enclosure 105 and the second enclosure 200. The fourth valve 640 and the sixth valve 650 may be disposed along a gas line connecting the vessel 110 to the reactor 160 and the pressure sensor 115. The fifth valve may be disposed coupled to an inlet of the vessel 110. Valve 620 may be disposed upstream of exhaust system 125. A tenth valve 610 may be disposed along a first section of the gas line and upstream of valves 640 and 650. The multiple valves may be in communication with, and operated by, a control system (not shown), such as a controller or processor. In turn, the control system may operate the valves to open and close positions.
[0038] In operation, the vapor pressure of the chemical in the container may be measured using pressure sensor 115. During vapor pressure measurement, valves 645, 615, 605, 610 and 620 will be closed while valves 640 and 650 will be open. This allows vapor / gas to flow through feed-through device 130 and into pressure sensor 115.
[0039] The measured vapor pressure may be transmitted to a control system. The measured pressure may be displayed on a user interface connected to or integrated into the control system. In some cases, the control system may automatically respond to the measured vapor pressure and activate other systems to cause an increase or decrease in the vapor pressure to achieve the desired pressure. For example, the control system may increase the temperature of the second enclosure 200, and therefore the vessel 110, if the measured vapor pressure is lower than the desired vapor pressure. Conversely, the control system may decrease the temperature of the second enclosure and vessel 110 if the measured vapor pressure is higher than the desired vapor pressure. Increasing the temperature of the second enclosure 200 and vessel 110 increases the vapor pressure of the chemical in the vessel 110, and conversely, decreasing the temperature of the second enclosure 200 and vessel 110 decreases the vapor pressure of the chemical in the vessel 110. The temperature of the second enclosure 200 and vessel 110 may be increased incrementally until the desired vapor pressure is reached. In other cases, adjustments to other systems, such as the heating system for the second enclosure 200 and vessel 110, may be performed manually by the user.
[0040] Once the vapor pressure is measured, system 100 may purge / evacuate the chemicals in the gas lines by operating the pump and closing valves 615, 645, 640, and 605. During this purge / evacuation process, valve 620 will be open.
[0041] Once the gas lines are vented, the system 100 may return to the normal deposition process of pulsing and purging. For example, during a pulse, vapor may flow from the vessel 110 to the reactor 160 for a predetermined period of time. During a purge, an inert gas may be flowed into the reactor 160 and out to the exhaust system 125 for a predetermined period of time. The pulse and purge sequence may be repeated any number of times.
[0042] The vapor pressure of a chemical may also be increased or decreased by changing the length of the pulse time, so that if the measured vapor pressure is higher or lower than the desired vapor pressure, the system 100 (or the user) may increase or decrease the pulse time to increase or decrease the vapor pressure.
[0043] The vapor pressure of a chemical may also be increased or decreased by changing the dilution of the chemical vapor. This may be accomplished by increasing or decreasing the amount of inert (carrier) gas flowed into the vessel. As a result, if the measured vapor pressure is higher or lower than the desired vapor pressure, the system 100 (or the user) may increase or decrease the amount of inert gas flowed into the vessel.
[0044] In the preceding description, the technology has been described with reference to certain exemplary embodiments. The specific implementations shown and described are illustrative of the technology and its best modes, and are not intended to otherwise limit the scope of the technology in any way. Indeed, for the sake of brevity, conventional manufacturing, connection, preparation, and other functional aspects of the methods and systems may not be described in detail. Furthermore, the connecting lines shown in the various figures are intended to represent exemplary functional relationships and / or steps between the various elements. Many alternative or additional functional relationships or physical connections may exist in an actual system.
[0045] The present technology has been described with reference to certain exemplary embodiments. However, various modifications and changes may be made without departing from the scope of the present technology. The description and drawings are to be regarded in an illustrative manner, not restrictive, and all such modifications are intended to be included within the scope of the present technology. As a result, the scope of the technology should be determined by the general embodiments described, and their legal equivalents, and not merely by the specific examples described above. For example, the steps recited in any method or process embodiment may be performed in any order, unless expressly specified otherwise, and are not limited to the explicit order presented in the particular example. Furthermore, the components and / or elements recited in any apparatus embodiment may be assembled in various permutations or configured to operate in other ways to produce substantially the same results as the present technology, and therefore are not limited to the specific configurations recited in the particular example.
[0046] Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. Any element that may cause or make more pronounced any benefit, advantage, solution to a problem, or any element that may cause any particular benefit, advantage, or solution, is not, however, construed as a critical, required, or essential feature or component.
[0047] The terms "comprises," "comprising," or any other variation thereof, are intended to refer to an open-ended inclusion, such that a process, method, article, component, or apparatus comprising a list of elements may include not only those elements listed, but also other elements not expressly listed or inherent to such process, method, article, component, or apparatus. In addition to those not specifically listed, other combinations and / or modifications of the above-described structure, arrangement, application, proportions, elements, materials, or components used in the practice of the technology may be varied or otherwise specifically adapted to particular environments, manufacturing specifications, design parameters, or other operating requirements without departing from the general principles thereof.
[0048] The present technology has been described above with reference to exemplary embodiments. However, changes and modifications may be made to the exemplary embodiments without departing from the scope of the technology. These and other changes or modifications are intended to be included within the scope of the technology, as expressed in the following claims. [Explanation of symbols]
[0049] 100 Systems 105 First Enclosure 110 Container 115 Pressure Sensor 120 Accumulator 125 Exhaust System 130 Feed-Through Devices 135 First Through Hole 140 First Section 145 Second Section 150 Third Section 160 Reactor 200 Second Enclosure 205 Second Through Hole 210 void 305 Metal body 310 Heater Rod 315 First Thermocouple 320 Second Thermocouple 325 Gas Line 400 First Part 405 Second Part 500 Insulator
Claims
1. 1. An apparatus comprising: Gas lines and a metal body surrounding a segment of the gas line, a heater rod embedded in the metal body; a metal body comprising a first thermocouple connected to the metal body; an insulator surrounding a portion of the metallic body.
2. The apparatus of claim 1 , wherein a portion of the heater rod extends outside of the metal body.
3. The apparatus of claim 2 , wherein the insulation surrounds the portion of the heater rod that extends outside the metal body.
4. The apparatus of claim 1 , wherein the insulator body is separated from the metallic body by an air gap.
5. The apparatus of claim 1 , wherein the gas lines extend through the insulation.
6. The apparatus of claim 1 , wherein the metal body is formed from stainless steel.
7. The apparatus of claim 1 , wherein the metallic body further comprises a second thermocouple.
8. 2. The apparatus of claim 1, wherein the metal body further comprises a second thermocouple, and wherein the first thermocouple is disposed on a first side of the metal body and the second thermocouple is disposed on a second side of the metal body opposite the first side.
9. 1. An apparatus comprising: a first cabinet having a first wall with a first through hole; a second cabinet disposed within the first cabinet and comprising a second wall parallel to the first wall, the second wall comprising a second through hole aligned with the first through hole; a gas line system comprising a feedthrough device disposed and extending through the first and second through holes, the feedthrough device comprising: Gas lines and a metal body surrounding a segment of the gas line, a heater rod having a first section embedded within the metal body and a second section extending outside the metal body; a metal body comprising a first thermocouple connected to the metal body; and an insulator surrounding a portion of the metal body and the second section of the heater rod.
10. The apparatus of claim 9 , wherein the metallic body further comprises a second thermocouple.
11. The apparatus of claim 9 , wherein the metal body is formed from stainless steel.
12. The apparatus of claim 9 , wherein the insulator comprises polyetheretherketone (PEEK).
13. The apparatus of claim 9 , wherein the second cabinet is separated from the first cabinet by an air gap.
14. 10. The apparatus of claim 9, further comprising a pressure sensor coupled to the gas line and disposed outside the first cabinet.
15. 1. A system comprising: A reactor; and a first cabinet having a first wall with a first through hole; a second cabinet disposed within the first cabinet and comprising a second wall parallel to the first wall, the second wall comprising a second through hole aligned with the first through hole, the second cabinet being separated from the first cabinet by an air gap; a container disposed within the second cabinet; a gas line connected to the vessel and disposed within the first and second through holes, a first section connected to the reactor; a second section connected to the exhaust port; a gas line comprising a third section connected to a pressure sensor, the third section extending through the first and second enclosures, the pressure sensor being positioned outside the second enclosure.
16. the third section including a feedthrough device disposed and extending through the first and second through holes, the feedthrough device comprising: Gas lines and a metal body surrounding the segment of the gas line.
17. The metal body is a heater rod having a first section embedded within the metal body and a second section extending outside the metal body; a first thermocouple connected to the metallic body.
18. 20. The system of claim 17, further comprising insulation surrounding a portion of the metal body and the second section of the heater rod, the insulation comprising polyetheretherketone.
19. 20. The system of claim 17, wherein the metallic body further comprises a second thermocouple opposite the first thermocouple.
20. The system of claim 15 , wherein the metal body is formed from stainless steel.