Recipe control device

Abstract

To provide a recipe control device that can automatically select a recipe.SOLUTION: In a semiconductor manufacturing system, a recipe control device acquires identification information of a wafer carrier for identifying the wafer carrier transporting a wafer to be processed in a semiconductor processing unit, outputs the identification information of the wafer carrier to a processing control unit, receives wafer carrier-related recipe information which is recipe information related to the identification information of the wafer carrier from the processing control unit, causes the semiconductor processing unit to select a recipe on the basis of the recipe information, receives screen display information that includes the selected recipe, analyzes the received screen display information to obtain displayed recipe information being the recipe included in the screen display information, analyzes whether or not the wafer carrier-related recipe information matches the displayed recipe information, and instructs the semiconductor processing unit to process the wafer according to the wafer carrier-related recipe information when it is determined that the wafer carrier-related recipe information matches the displayed recipe information.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a recipe control device that is connected to a semiconductor processing device and controls the recipe of the semiconductor processing device. [Background technology]

[0002] Publication No. 2986146 describes a recipe management system for semiconductor manufacturing equipment. This system includes a plurality of semiconductor manufacturing equipment, an equipment controller provided for each semiconductor manufacturing equipment, a host control means commonly connected to these equipment controllers and storing a process recipe, and a recipe management means commonly connected to each equipment controller by a transmission line separate from the transmission line connecting the equipment controllers and the host control means and connected to the host control means by a dedicated transmission line for directly sending and receiving information to and from the host control means, the host control means is configured to send process recipes to each equipment controller and to write and read recipes and read recipe history to the recipe management means via the dedicated transmission line, each equipment controller operates each semiconductor manufacturing equipment based on the process recipe sent from the host control means, and the recipe management means stores the history of process recipes used in the semiconductor manufacturing equipment (claim 1).

[0003] In the semiconductor manufacturing apparatus described in Publication No. 2986146, when an operator selects a recipe (paragraph

[0030] ), there is a problem that the operator may select the wrong recipe. This is because there are many recipes for the semiconductor manufacturing apparatus, and the appropriate recipe is left to the discretion of the operator. If a semiconductor is manufactured using an incorrect recipe, the manufactured semiconductor must be discarded. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Publication No. 2986146 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a recipe control device that, in normal operation, allows an operator to select a recipe and automatically selects a recipe simply by connecting to a semiconductor processing device that manufactures semiconductors so as to send and receive information. [Means for solving the problem]

[0006] The above-mentioned problems are based on the knowledge that they can be basically solved by a recipe control device that hacks into the semiconductor processing device (such as its keyboard) to have the semiconductor processing device select a recipe, and also intercepts and analyzes image data for displaying the selected recipe on the display unit of the semiconductor processing device, thereby confirming that the recipe is correct.

[0007] The first invention relates to a recipe control device 11 that is connected to a semiconductor processing device 1 and controls a recipe of the semiconductor processing device 1.

[0008] The semiconductor processing apparatus 1 includes, for example, a semiconductor processing section 3, a processing control section 5 for controlling the semiconductor processing section 3, a display section 7 connected to the processing control section 5, and a recipe storage section 9 connected to the processing control section 5. The recipe storage section 9 is an element for processing wafers carried by a wafer carrier in association with identification information of the wafer carrier. The processing control section 5, the display section 7, and the recipe storage section 9 are included in, for example, a server configured by a stand-alone computer or an on-premise server.

[0009] The recipe control device 11 has an identification information acquisition unit 13, an identification information output unit 15, a recipe receiving unit 17, a recipe selection unit 19, a display information receiving unit 21, a display information analysis unit 23, a recipe analysis unit 25, and a processing command output unit 27.

[0010] The identification information acquisition unit 13 is an element for acquiring identification information of a wafer carrier. The identification information of a wafer carrier is information for identifying a wafer carrier that transports a wafer to be processed in a semiconductor processing device. An example of the identification information of a wafer carrier is bar code information for identifying the wafer carrier.

[0011] The identification information output unit 15 is a component for outputting the wafer carrier identification information acquired by the identification information acquisition unit 13 to the semiconductor processing apparatus 1.

[0012] The recipe receiving unit 17 is an element for receiving, from the semiconductor processing apparatus 1, wafer carrier-related recipe information, which is recipe information related to the identification information of the wafer carrier.

[0013] The recipe selection unit 19 is an element for causing the semiconductor processing apparatus 1 to select a recipe based on the wafer carrier-related recipe information.

[0014] The display information receiving unit 21 is an element for receiving screen display information including the recipe of the selected semiconductor processing apparatus.

[0015] The display information analysis unit 23 is an element for analyzing the screen display information received by the display information receiving unit 21 and obtaining display recipe information, which is a recipe included in the screen display information. For example, the display information analysis unit 23 performs image analysis on the screen display information and obtains the display recipe information, which is a recipe included in the screen display information.

[0016] The recipe analysis unit 25 is an element for analyzing whether the wafer carrier related recipe information and the displayed recipe information match.

[0017] The processing command output unit 27 is an element that issues a command to the semiconductor processing device to process the wafer in accordance with the wafer carrier-related recipe information when the recipe analysis unit 25 determines that the wafer carrier-related recipe information matches the displayed recipe information.

[0018] A second invention relates to a program for causing a computer connected to a semiconductor processing apparatus to function as the above-mentioned recipe control apparatus, and a non-transitory information recording medium storing the program. Effect of the Invention

[0019] The present invention can provide a recipe control device that can automatically select a recipe by simply connecting to a semiconductor processing device for manufacturing semiconductors so as to be able to send and receive information. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1 is a block diagram for explaining a semiconductor processing apparatus and a recipe control apparatus. [Diagram 2] FIG. 2 is a conceptual diagram for explaining the process flow of the semiconductor manufacturing system. [Diagram 3] FIG. 3 is a conceptual diagram showing a state in which an image is displayed on the display unit of the semiconductor processing apparatus when a recipe is selected. [Figure 4] FIG. 4 is a flowchart for analyzing a recipe. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, the embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below, and includes appropriate modifications of the embodiments described below within the scope obvious to those skilled in the art.

[0022] The first invention relates to recipe control device 11. Recipe control device 11 is an element connected to semiconductor processing device 1 and controls the recipe of semiconductor processing device 1. This specification also provides a semiconductor manufacturing system including semiconductor processing device 1 and recipe control device 11. Semiconductor processing device 1 refers to an apparatus for processing semiconductors by performing various processing processes on wafers and manufacturing semiconductors, such as the semiconductor manufacturing apparatus of Japanese Patent No. 2986146, the semiconductor manufacturing apparatus of Japanese Patent No. 4880024, and the semiconductor processing apparatus of Japanese Patent No. 5783975. Recipe control device 11 acquires wafer carrier identification information for identifying a wafer carrier that transports wafers to be processed in a semiconductor processing device, outputs the wafer carrier identification information to the semiconductor processing device, receives wafer carrier-related recipe information which is recipe information associated with the wafer carrier identification information from the semiconductor processing device, causes the semiconductor processing device to select a recipe based on the wafer carrier-related recipe information, receives screen display information including a recipe for the semiconductor processing device from which the recipe has been selected, analyzes the screen display information received by the display information receiving unit to obtain display recipe information which is a recipe included in the screen display information, analyzes whether the wafer carrier-related recipe information and the display recipe information match, and if the recipe analysis unit determines that the wafer carrier-related recipe information and the display recipe information match, commands the semiconductor processing device to process wafers in accordance with the wafer carrier-related recipe information.

[0023] FIG. 1 is a block diagram for explaining a semiconductor processing apparatus and a recipe control apparatus. As shown in FIG. 1, the semiconductor processing apparatus 1 has, for example, a semiconductor processing section 3, a processing control section 5 for controlling the semiconductor processing section 3, a display section 7 connected to the processing control section 5, and a recipe storage section 9 connected to the processing control section 5. The semiconductor processing section 3 is an element for performing various processes (for example, transportation, heating, vapor deposition of a substance, etching) on ​​a wafer. The semiconductor processing section 3 usually has a processor and a memory, and performs various calculations to specifically process a semiconductor. The processing control section 5 is usually a computer including a processor and a memory. The processing control section 5 functions as a host computer. The semiconductor processing section 3 and the processing control section 5 are usually physically separate devices. The recipe storage section 9 is an element for storing a recipe for processing a wafer carried by a wafer carrier in association with identification information of the wafer carrier. The processing control section 5, the display section 7, and the recipe storage section 9 are included in, for example, a server configured by a stand-alone computer or an on-premise server. 1, recipe control device 11 has identification information acquisition unit 13, identification information output unit 15, recipe receiving unit 17, recipe selection unit 19, display information receiving unit 21, display information analysis unit 23, recipe analysis unit 25, and processing command output unit 27. The recipe control device is basically composed of a computer and a server. As shown in FIG. 1, semiconductor processing device 11 is connected to semiconductor processing device 1 via network 31 such as the Internet or an intranet in a state in which information can be exchanged.

[0024] The computer has an input unit, an output unit, a control unit, a calculation unit, and a storage unit, and each element is connected by a bus or the like so as to be able to exchange information. For example, the storage unit may store a control program or various information. When predetermined information is input from the input unit, the control unit reads out the control program stored in the storage unit. Then, the control unit appropriately reads out the information stored in the storage unit and transmits it to the calculation unit. Also, the control unit appropriately transmits the input information to the calculation unit. The calculation unit performs calculation processing using the various information received and stores it in the storage unit. The control unit reads out the calculation result stored in the storage unit and outputs it from the output unit. In this way, various processes and each process are executed. The various units and means execute these various processes. The computer may have a processor, and the processor may realize various functions and various processes. The computer may be standalone. A part of the functions of the computer may be distributed between a server and a terminal. In that case, it is preferable that the server and the terminal are able to exchange information through a network such as the Internet or an intranet. The computer may include a processor and a memory coupled to the processor. The memory may store instructions that, when executed by the processor, cause the computer to perform various processes or function as various elements. The computer may be provided with various teaching data to build a learning model and realize various calculations by machine learning. In this case, the computer may perform various analyses using a learning model created by machine learning and deep learning of AI (artificial intelligence).

[0025] FIG. 2 is a conceptual diagram for explaining the process flow of the semiconductor manufacturing system.

[0026] The identification information acquisition unit 13 acquires the identification information of the wafer carrier. The identification information of the wafer carrier is information for identifying the wafer carrier. The semiconductor manufacturing system transports wafers using a wafer carrier. By identifying the wafer carrier, the wafer to be processed in the semiconductor processing device 1 can be specified. A lot number or the like is displayed on the carrier wafer, for example, by a barcode. Instead of a barcode, information capable of identifying the wafer carrier, such as an RF tag, may be attached to the wafer carrier. To be more specific, the wafer carrier is transported to a barcode reading position of the barcode reader. Then, the barcode reader reads the barcode printed on the wafer carrier. The recipe control device 11 stores code information (identification information of the wafer carrier) in the storage unit, for example, in association with the barcode. For this reason, the recipe control device 11 analyzes the read barcode, reads out code information (identification information of the wafer carrier: for example, the lot number of the wafer carrier) from the storage unit, and stores it in the storage unit. In this way, the identification information acquisition unit 13 can acquire the identification information of the wafer carrier.

[0027] The identification information output unit 15 outputs the identification information of the wafer carrier acquired by the identification information acquisition unit 13 to the semiconductor processing apparatus 1 (processing control unit 5). The recipe control apparatus 11 reads out the code information (identification information of the wafer carrier) from the storage unit, and outputs the code information (identification information of the wafer carrier) to the semiconductor processing apparatus 1 using a network connected to the semiconductor processing apparatus 1. At this time, it is preferable that the recipe control apparatus 11 stores information on a protocol used for communication with the semiconductor processing apparatus 1 in the storage unit, and transmits information to the semiconductor processing apparatus 1 (processing control unit 5: host control means) in accordance with that protocol. This point is also applicable to the following explanations.

[0028] The recipe storage unit 9 of the semiconductor processing apparatus 1 stores a recipe for processing the wafers carried by the wafer carrier in association with the identification information of the wafer carrier. The semiconductor processing apparatus 1 (processing control unit 5) reads out a recipe corresponding to the received wafer carrier identification information from the recipe storage unit 9 using the identification information, and outputs the recipe to the recipe control device 11. The recipe output at this time is wafer carrier-related recipe information (recipe information associated with the identification information of the wafer carrier). In addition to identification information, the recipe is also called a transfer recipe, production recipe, or process recipe, and is processing information for the wafer including various processing conditions, samples used, and processes (e.g., transfer order, type of process chamber, type of gas, gas flow rate, gas temperature, heat treatment temperature, heat treatment time, etc.).

[0029] The recipe receiving unit 17 receives the wafer carrier-related recipe information from the semiconductor processing device 1. The recipe control device 11 may store the received wafer carrier-related recipe information in a storage unit.

[0030] The recipe selection unit 19 is an element for making the semiconductor processing apparatus 1 select a recipe based on the wafer carrier-related recipe information. The recipe control apparatus 11 is in a state in which it can remotely control the semiconductor processing apparatus 1 (the semiconductor processing unit 3 of the semiconductor processing apparatus 1). Such remote control can be achieved by introducing various software and applications, such as Remote Desktop (registered trademark). Since the recipe control apparatus 11 is capable of remotely controlling the semiconductor processing apparatus 1, the recipe selection unit 19 can output an instruction for selecting a recipe to the semiconductor processing apparatus 1, and the semiconductor processing apparatus 1 that receives such an instruction selects a recipe according to the instruction. The recipe control apparatus 11 stores a program for selecting a recipe for the semiconductor processing apparatus 1, and can operate the semiconductor processing apparatus 1 according to the instructions of the program. Therefore, the recipe selection unit 19 makes the semiconductor processing apparatus 1 select a recipe corresponding to the wafer carrier-related recipe information based on the wafer carrier-related recipe information. A preferred embodiment of the recipe control apparatus 11 is to hack a pointing device (for example, one or both of a keyboard and a mouse) that was originally provided in the semiconductor processing apparatus 1 (the semiconductor processing unit 3 of the semiconductor processing apparatus 1). That is, in this case, the recipe selection unit 19 controls the semiconductor processing apparatus 1 by inputting a control signal similar to the control signal output from the pointing device to the semiconductor processing apparatus 1. In this way, the recipe control apparatus 11 (the recipe selection unit 19) can cause the semiconductor processing apparatus 1 to select a recipe. For example, the pointing device originally provided in the semiconductor processing apparatus 1 is connected to the recipe control apparatus 11. Then, the recipe control apparatus 11 analyzes a control signal corresponding to an input key of the pointing device and stores it in the storage unit. Then, the recipe control apparatus 11 inputs a control signal similar to the control signal by the pointing device to the semiconductor processing apparatus 1. In this way, the recipe control apparatus 11 can hack the pointing device of the semiconductor processing apparatus 1. Note that the recipe control apparatus 11 may hack the pointing device by using a control signal common to pointing devices or a control signal that is commonly used.

[0031] The semiconductor processing apparatus 1, which has selected a recipe corresponding to the wafer carrier-related recipe information, outputs screen display information for displaying an image showing the selected recipe on a display unit 7 such as a monitor. Based on this output, an image showing the selected recipe is displayed on the display unit 7. An example of the display unit 7 is the monitor of the semiconductor processing apparatus 3.

[0032] FIG. 3 is a conceptual diagram showing an image displayed on the display unit of the semiconductor processing apparatus when a recipe is selected. The recipe selection screen and the display mode of the recipe differ depending on the semiconductor processing apparatus. In the example shown in FIG. 3, in addition to the recipe identification information (recipe ID), the specific contents of the recipe (such as the type of recipe) are displayed. The example shown in FIG. 3 is merely one example. The semiconductor processing apparatus 1 not only outputs the screen display information to the display unit 7, but also outputs it to the recipe control apparatus 11 without outputting it to the display unit 7. This may be configured so that the recipe control apparatus 11 remotely controlling the semiconductor processing apparatus 1 sends the screen display information to the recipe control apparatus 11.

[0033] The display information receiving unit 21 receives screen display information including the recipe of the selected semiconductor processing device. After the semiconductor processing device 1 outputs the screen display information to the recipe control device 11, the display information receiving unit 21 receives the screen display information. The recipe control device 11 may store the received screen display information in a storage unit as appropriate.

[0034] The display information analysis unit 23 analyzes the screen display information received by the display information receiving unit 21 to obtain display recipe information, which is a recipe included in the screen display information. The display information analysis unit 23 performs image analysis on the screen display information, for example, to obtain display recipe information, which is a recipe included in the screen display information. The display information analysis unit 23 may analyze, for example, the identification information (recipe ID) of the recipe included in the display screen information or the specific content of the recipe based on an identifier such as a tag included in the display screen information. The display information analysis unit 23 may obtain the recipe information included in the display screen information by machine learning using a learning model. The recipe control device 11 may improve accuracy by learning the learning model using past screen display information and the resultant display recipe information as teacher data. In this way, it is usually possible to intercept information to be displayed on the monitor of the semiconductor processing device and obtain recipe information that the semiconductor processing device is about to adopt. Analyzing the display information in this way also checks whether the pointing device of the semiconductor processing device 1 has been hacked. In particular, many old-type semiconductor processing devices 1 are standalone devices, and usually cannot be used to introduce software, etc. Even in such a semiconductor processing device 1, if the pointing device is hacked and the display screen is then analyzed, it is possible to check for malfunctions caused by hacking.

[0035] FIG. 4 is a flowchart for analyzing a recipe. As shown in FIG. 4, the recipe analysis unit 25 analyzes whether the wafer carrier-related recipe information and the displayed recipe information match. The recipe analysis unit 25 reads out the wafer carrier-related recipe information and the displayed recipe information from the storage unit. The recipe information to be read out may be the identification information (recipe ID) of the recipe or the specific contents of the recipe. The recipe analysis unit 25 compares the read out wafer carrier-related recipe information with the displayed recipe information, and analyzes whether they match. The recipe analysis unit 25 stores the analysis result (information on whether they match or not) obtained as a result of the analysis in the storage unit.

[0036] When recipe analysis unit 25 determines that wafer carrier-related recipe information and display recipe information match, processing command output unit 27 issues a command to semiconductor processing device 1 to process the wafer according to wafer carrier-related recipe information. Processing command output unit 27 reads out the analysis result from the storage unit. Then, when the read out analysis result indicates a match, processing command output unit 27 outputs a command to semiconductor processing device 1 to process the wafer according to wafer carrier-related recipe information. Upon receiving the command (processing start command), semiconductor processing device 1 processes the wafer according to the recipe. Recipe processing device 11 that remotely controls semiconductor processing device 1 may remotely control semiconductor processing device 1 to start processing the wafer according to the recipe information. Processing command output unit 27 may output information to semiconductor processing device 1 that a processing start command has been output.

[0037] On the other hand, if the read analysis result indicates a mismatch, the process command output unit 27 outputs a command to the semiconductor processing apparatus 1 to stop the process. In accordance with the command (processing stop command), the semiconductor processing apparatus 1 stops the process based on the recipe. Thereafter, the recipe control apparatus 11 performs the recipe control process again, such as reacquiring the identification information of the wafer carrier.

[0038] This specification also describes a program for causing a computer connected to a semiconductor processing device to function as the above-mentioned recipe control device, and a non-transitory information recording medium storing the program. Examples of non-transitory information recording media include CD-ROMs, DVDs, hard disks, USB memories, and SD cards. [Industrial Applicability]

[0039] The present invention can be used in the semiconductor manufacturing industry. [Explanation of symbols]

[0040] 1. Semiconductor processing equipment 3. Semiconductor Processing Section 5 Processing control section 7 Display section 9 Recipe memory section 11 Recipe control device 13 Identification information acquisition unit 15 Identification information output section 17 Recipe receiver 19 Recipe Selection Section 21 Display information receiving unit 23 Display information analysis section 25 Recipe Analysis Section 27 Processing command output section 31 Network

Claims

1. A recipe control device connected to a semiconductor processing device for controlling a recipe of the semiconductor processing device, comprising: an identification information acquiring unit for acquiring identification information of a wafer carrier for identifying a wafer carrier that carries a wafer to be processed in the semiconductor processing apparatus; an identification information output unit for outputting the identification information of the wafer carrier acquired by the identification information acquisition unit to the semiconductor processing device; a recipe receiving unit for receiving wafer carrier-related recipe information, which is recipe information related to identification information of the wafer carrier, from the semiconductor processing equipment; a recipe selection unit for causing the semiconductor processing equipment to select a recipe based on the wafer carrier related recipe information; a display information receiving unit for receiving screen display information including a recipe of the semiconductor processing apparatus from which the recipe has been selected; a display information analysis unit for analyzing the screen display information received by the display information receiving unit to obtain display recipe information which is a recipe included in the screen display information; a recipe analysis unit for analyzing whether the wafer carrier related recipe information and the displayed recipe information match; a process command output unit that outputs a command to the semiconductor processing device to process the wafer in accordance with the wafer carrier-related recipe information when the recipe analysis unit determines that the wafer carrier-related recipe information and the displayed recipe information match; A recipe control device comprising:

2. The recipe control device according to claim 1 , The semiconductor processing device includes: A semiconductor processing section; A processing control unit for controlling the semiconductor processing unit; A display unit connected to the processing control unit; a recipe storage unit that stores a recipe for processing a wafer carried by the wafer carrier in association with identification information of the wafer carrier; A recipe control device, wherein the process control unit, the display unit, and the recipe storage unit are included in a server configured by a standalone computer or an on-premise server.

3. The recipe control device according to claim 1 , A recipe control device, wherein the identification information of the wafer carrier is bar code information for identifying the wafer carrier.

4. The recipe control device according to claim 1 , The display information analysis unit performs image analysis on the screen display information to obtain display recipe information which is a recipe included in the screen display information.

5. A program for causing a computer connected to a semiconductor processing apparatus to function as a recipe control apparatus for controlling a recipe of the semiconductor processing apparatus, The recipe control device includes: an identification information acquiring unit for acquiring identification information of a wafer carrier for identifying a wafer carrier that carries a wafer to be processed in the semiconductor processing apparatus; an identification information output unit for outputting the identification information of the wafer carrier acquired by the identification information acquisition unit to the semiconductor processing device; a recipe receiving unit for receiving wafer carrier-related recipe information, which is recipe information related to identification information of the wafer carrier, from the semiconductor processing equipment; a recipe selection unit for causing the semiconductor processing equipment to select a recipe based on the wafer carrier related recipe information; a display information receiving unit for receiving screen display information including a recipe of the semiconductor processing apparatus from which the recipe has been selected; a display information analysis unit for analyzing the screen display information received by the display information receiving unit to obtain display recipe information which is a recipe included in the screen display information; a recipe analysis unit for analyzing whether the wafer carrier related recipe information and the displayed recipe information match; a process command output unit that outputs a command to the semiconductor processing device to process the wafer in accordance with the wafer carrier-related recipe information when the recipe analysis unit determines that the wafer carrier-related recipe information and the displayed recipe information match; A program having

6. A non-transitory information recording medium storing the program according to claim 5.

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