Exposure method, exposure apparatus, measurement method and method for producing article

Abstract

To provide an advantageous technique for reducing a positional deviation of a stage.SOLUTION: There is provided an exposure method for exposing a substrate including: a first step of measuring a positional deviation of a stage to acquire a first measurement value after step-driving the stage holding the substrate according to a first driving profile; a second step of measuring a positional deviation of the stage to acquire a second measurement value after step-driving the stage according to a second driving profile different from the first driving profile; a third step of determining a correction value for correcting a positional deviation of the stage based on the first measurement value acquired in the first step and the second measurement value acquired in the second step; and a fourth step of step-driving the stage while correcting the position of the stage with the correction value determined in the third step and exposing the substrate held by the stage.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an exposure method, an exposure apparatus, a measurement method, and a method for manufacturing an article. [Background technology]

[0002] An exposure apparatus that performs an exposure process on a substrate and a measurement apparatus that performs a measurement process on a substrate have a substrate stage that holds the substrate to be processed. The positional accuracy of the substrate stage is an important factor that affects the accuracy of the exposure process and the measurement process, but it may vary depending on the driving conditions for driving the substrate stage. Therefore, techniques for correcting the position of the substrate stage have been proposed with regard to the positional accuracy of the substrate stage (see Patent Documents 1 to 3).

[0003] Patent Document 1 discloses a technique for correcting the position of a substrate stage in an exposure process. In this technique, the difference between a position measurement result obtained during an acceleration period of the substrate stage and a position measurement result obtained during a constant velocity period of the substrate stage is acquired in advance as a correction value for a measurement error caused by acceleration of the substrate stage. Then, when exposing a substrate while controlling (positioning) the position of the substrate stage (the substrate held by the substrate stage) based on the position measurement result obtained during the acceleration period of the substrate stage, the position of the substrate stage is corrected using the correction value acquired in advance.

[0004] Patent Document 2 discloses a technique for improving the positioning accuracy of a substrate stage. In this technique, the substrate stage is always driven in a constant direction (one direction) during step drive for positioning each shot area of ​​the substrate held by the substrate stage at an exposure position. This leads to an improvement in the positioning accuracy of the substrate stage, since the inertial force acting on the substrate stage during positioning is always in a constant direction.

[0005] Furthermore, Patent Document 3 discloses a technology for measuring the amount of positional deviation of a substrate stage relative to a target position (target value) when exposing a substrate, and feeding back and correcting the position measurement results obtained during the period of positioning (aligning) the substrate stage. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2011-238707 A [Patent Document 2] Japanese Patent Application Publication No. 2-82510 [Patent Document 3] JP 2003-86484 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, when driving the substrate stage, a highly reproducible error may occur between the target position and the actual position of the substrate stage depending on the driving profile (driving conditions) including the step distance, speed, acceleration, etc. In such cases, the conventional technology cannot obtain sufficient positional accuracy of the substrate stage (i.e., the position of the substrate stage cannot be sufficiently corrected), which causes a decrease in accuracy of the exposure process and the measurement process.

[0008] The present invention has been made in consideration of the problems with the conventional techniques, and has an exemplary object to provide a technique that is advantageous for reducing positional deviation of a stage. [Means for solving the problem]

[0009] In order to achieve the above-mentioned object, an exposure method as one aspect of the present invention is an exposure method for exposing a substrate, comprising: a first step of stepping a stage holding the substrate according to a first drive profile, and then measuring a positional deviation of the stage to obtain a first measurement value; a second step of stepping the stage according to a second drive profile different from the first drive profile, and then measuring a positional deviation of the stage to obtain a second measurement value; a third step of determining a correction value for correcting the positional deviation of the stage based on the first measurement value obtained in the first step and the second measurement value obtained in the second step; and a fourth step of stepping the stage while correcting the position of the stage with the correction value obtained in the third step, and exposing the substrate held by the stage.

[0010] Further objects or other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. Effect of the Invention

[0011] According to the present invention, for example, it is possible to provide a technique that is advantageous for reducing positional deviation of a stage. [Brief description of the drawings]

[0012] [Figure 1] 1 is a schematic diagram showing a configuration of an exposure apparatus according to one aspect of the present invention. [Diagram 2] FIG. 2 is a perspective view showing the peripheral configuration of a substrate stage. [Diagram 3] FIG. 2 is a schematic diagram showing a configuration of an alignment optical system. [Figure 4] 11A and 11B are diagrams for explaining positional deviation of the substrate stage caused by step driving of the substrate stage. [Diagram 5] 11 is a flowchart for explaining a method for reducing positional deviation caused by the step driving speed of the substrate stage. [Figure 6]13 is a flowchart for explaining a method for reducing positional deviation caused by step driving acceleration of the substrate stage. [Figure 7] 11 is a flowchart for explaining a method for reducing positional deviation caused by the step direction of the substrate stage. [Figure 8] 11 is a flowchart for explaining a method for reducing positional deviation caused by the step driving speed of the substrate stage. [Figure 9] 13 is a flowchart for explaining a method for reducing positional deviation caused by step driving acceleration of the substrate stage. [Figure 10] 11 is a flowchart for explaining a method for reducing positional deviation caused by the step direction of the substrate stage. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0014] 1 is a schematic diagram showing the configuration of an exposure apparatus 1 according to one aspect of the present invention. The exposure apparatus 1 is a lithography apparatus used in the manufacturing process of devices such as semiconductor elements, and forms a pattern on a substrate by exposing the substrate using an original (mask or reticle). In this embodiment, the exposure apparatus 1 projects a pattern formed on the original onto the substrate via a projection optical system, and performs a process (exposure process) of transferring the pattern of the original onto the substrate.

[0015] The exposure apparatus 1 is embodied, for example, as an exposure apparatus (stepper) that transfers the pattern of an original onto a substrate by fixing the original (i.e., in a step-and-repeat manner).The exposure apparatus 1 may also be embodied as a scanning exposure apparatus (scanner) that transfers the pattern of the original onto a substrate while synchronously scanning the original and the substrate with each other in a scanning direction (i.e., in a step-and-scan manner).

[0016] In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which the direction parallel to the surface on which the substrate is placed is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, respectively, and rotation around the X-axis, Y-axis, and Z-axis are θX, θY, and θZ, respectively.

[0017] 1, the exposure apparatus 1 has a projection optical system PO that projects a pattern formed on an original OR onto a substrate, a substrate stage 101 that holds a substrate 102, and an alignment optical system 103 that detects an alignment mark provided on the substrate 102. The exposure apparatus 1 also has a drive unit 104 that drives the substrate stage 101, a measurement unit 106 that measures the position of the substrate stage 101, a control unit 107, and a memory unit SU.

[0018] The control unit 107 is configured, for example, by a computer (information processing device) including a CPU, a memory, etc., and comprehensively controls each unit of the exposure apparatus 1 in accordance with a program stored in the storage unit SU, etc. In this embodiment, the control unit 107 controls the exposure process of exposing the substrate 102 via the original OR.

[0019] The storage unit SU stores programs and various information (data) required for controlling each part of the exposure apparatus 1 to carry out the exposure process.

[0020] 2 is a perspective view showing the configuration around the substrate stage 101. The substrate stage 101 is configured as, for example, an XYθ stage that can be driven in the X direction, the Y direction, and a rotational (θ) direction around the Z axis.

[0021] The driving unit 104 has a function of driving the substrate stage 101. In this embodiment, the driving unit 104 includes a motor 104X for driving the substrate stage 101 in the X direction, a motor 104Y for driving the substrate stage 101 in the Y direction, and a motor (not shown) for rotationally driving the substrate stage 101 in the θ direction.

[0022] The measurement unit 106 has a function of measuring the position of the substrate stage 101, and in this embodiment, includes laser interferometers 106X, 106Y, and 106θ. The laser interferometers 106X, 106Y, and 106θ measure the positions of the substrate stage 101 in the X direction, Y direction, and θ direction by irradiating light to mirrors 105X and 105Y fixed to the substrate stage 101 and detecting the light reflected by the mirrors 105X and 105Y.

[0023] The control unit 107 constantly measures (monitors) the position of the substrate stage 101 via the measurement unit 106, and based on the measurement results, drives and positions the substrate stage 101 to a target position via the drive unit 104. Furthermore, even after positioning the substrate stage 101, the control unit 107 maintains the substrate stage 101 at the target position based on the measurement results of the measurement unit 106.

[0024] 3 is a schematic diagram showing the configuration of the alignment optical system 103. The alignment optical system 103 is configured as an off-axis scope, and has a function of optically detecting alignment marks assigned to (each shot area of) the substrate 102 to obtain position measurement data. Note that the position measurement data is also a measurement value related to the position of the substrate 102 held by the substrate stage 101.

[0025] In this embodiment, the alignment optical system 103 includes a light source 201, a beam splitter 202, lenses 203 and 206, and a sensor 207. Light from the light source 201 is reflected by the beam splitter 202 and illuminates an alignment mark 204 (pre-alignment mark) or 205 (fine alignment mark) provided on the substrate 102 via the lens 203. The light diffracted by the alignment mark 204 or 205 is received by the sensor 207 via the lens 203, the beam splitter 202, and the lens 206.

[0026] In the exposure apparatus 1, when performing exposure processing on each of the multiple shot areas of the substrate 102, it is necessary to drive the substrate stage 101 according to a drive profile, but depending on the drive profile, a positional deviation may occur in the substrate stage 101. Such a positional deviation of the substrate stage 101 becomes noticeable in driving the substrate stage 101 for positioning each shot area of ​​the substrate 102 at an exposure position, that is, in so-called step driving. Here, the drive profile is a profile that specifies at least one of the speed, acceleration, and driving direction (step direction) in driving (including step driving) of the substrate stage 101. The positional deviation of the substrate stage 101 is a highly reproducible error that occurs between the target position and the actual position of the substrate stage 101. In addition, the step driving is also driving of the substrate stage 101 (driving between shot areas) that is required to position the next shot area at the exposure position after exposing a certain shot area of ​​the substrate 102.

[0027] With reference to FIG. 4(a) and FIG. 4(b), the positional deviation of the substrate stage 101 caused by the step drive of the substrate stage 101 will be specifically described. FIG. 4(a) shows a state (shot layout) in which a plurality of shot areas 301 are arranged at ideal positions on the substrate 102. A step direction 302 indicates the direction in which the substrate stage 101 is driven in the step drive of the substrate stage 101. FIG. 4(b) shows the position of an exposure area 303 (exposure result) formed on the substrate 102 by performing an exposure process on each of the plurality of shot areas 301 on the substrate 102 while driving the substrate stage 101 in steps. As shown in FIG. 4(b), due to the step drive of the substrate stage 101, specifically, a highly reproducible positional deviation occurs between the shot area 301 and the exposure area 303 depending on the speed, acceleration, or step direction in the step drive of the substrate stage 101. Note that the positional deviation between the shot area 301 and the exposure area 303 on the substrate 102 corresponds to the positional deviation of the substrate stage 101. It is possible to reduce the positional deviation of the substrate stage 101 (the positional deviation between the shot area 301 and the exposure area 303) by step driving the substrate stage 101 at a low speed or with a low acceleration. However, this may lead to a decrease in throughput because the time required for step driving of the substrate stage 101 increases.

[0028] Therefore, in this embodiment, a new technique is provided that reduces the positional deviation of the substrate stage 101 caused by the step driving of the substrate stage 101, without step driving the substrate stage 101 at a low speed or low acceleration.

[0029] 5, a method (exposure method) for reducing positional deviation of the substrate stage 101 that occurs depending on the speed (step drive speed) in step drive of the substrate stage 101 will be described. As described above, this method is performed by the control unit 107 comprehensively controlling each unit of the exposure apparatus 1.

[0030] In S401, the exposure recipe for exposing the substrate 102 is referenced, and it is determined whether the maximum speed in the step drive of the substrate stage 101, i.e., the maximum speed of the step drive speed, is an initial speed for the shot layout of the substrate 102. If the maximum speed of the step drive speed is not an initial speed, the process proceeds to S406. On the other hand, if the maximum speed of the step drive speed is an initial speed, the process proceeds to S402.

[0031] In S402, the substrate stage 101 is step-driven at a low speed (first drive profile), and then, while the substrate stage 101 is stationary, a positional deviation of the substrate stage 101 is measured to obtain a first measurement value. Specifically, after the substrate stage 101 is step-driven at a first speed, the alignment optical system 103 detects alignment marks provided in each shot area of ​​the substrate 102 held by the substrate stage 101 to measure the positional deviation of the substrate stage 101. In this way, S402 is a step (first step) of measuring the positional deviation of the substrate stage 101 to obtain a first measurement value after step-driving the substrate stage 101 holding the substrate 102 according to the first drive profile.

[0032] In S403, the substrate stage 101 is step-driven at a high speed (a second driving profile different from the first driving profile), and then, while the substrate stage 101 is stationary, a positional deviation of the substrate stage 101 is measured to obtain a second measurement value. Specifically, after the substrate stage 101 is step-driven at the second speed, an alignment mark provided on the substrate 102 held by the substrate stage 101 is detected by the alignment optical system 103 to measure a positional deviation of the substrate stage 101. In this way, S403 is a step (second step) of measuring a positional deviation of the substrate stage 101 to obtain a second measurement value after step-driving the substrate stage 101 holding the substrate 102 according to the second driving profile.

[0033] It should be noted that the maximum speed (second speed) of the step drive speed in S403 needs only to be greater than the maximum speed (first speed) of the step drive speed in S402. However, it is preferable that the maximum speed of the step drive speed in S403 is (a speed equivalent to) the maximum speed of the step drive speed when actually performing exposure processing on each shot area of ​​the substrate 102. In other words, in S403, the drive profile (second drive profile) when step-driving the substrate stage 101 should be (the same as) the actual exposure drive profile that specifies the step drive of the substrate stage 101 when exposing the substrate 102.

[0034] In S404, a correction value for correcting positional deviation of the substrate stage 101 that occurs depending on the step drive speed is calculated based on the first measurement value acquired in S402 and the second measurement value acquired in S403 (third step). For example, if the second drive profile is the actual exposure drive profile, the difference between the first measurement value and the second measurement value is set as the correction value for correcting positional deviation of the substrate stage 101. Also, if the second drive profile is not the actual exposure drive profile, a correction value for correcting positional deviation of the substrate stage 101 is calculated by performing, for example, linear interpolation on the difference between the first measurement value and the second measurement value.

[0035] In S405, the correction amount calculated in S404 is associated with the exposure recipe (the exposure recipe referenced in S401, in particular the maximum step drive speed included in the exposure recipe) and stored, for example, in a memory unit SU of the exposure apparatus 1 (fifth step).

[0036] In S406, the substrate stage 101 is step-driven while correcting the position of the substrate stage 101 with the correction amount calculated in S404, i.e., the correction amount stored in the storage unit SU, and the substrate 102 held by the substrate stage 101 is exposed (fourth step). For example, the position (positional deviation) of the substrate stage 101 is corrected by step-driving the substrate stage 101 while the correction value is reflected in the measurement value of the position of the substrate stage 101 measured by the measurement unit 106 while the substrate stage 101 is step-driven. Alternatively, the position of the substrate stage 101 may be corrected by step-driving the substrate stage 101 while the correction value is reflected in the target position of the substrate stage 101 while the substrate stage 101 is step-driven.

[0037] As described above, according to this embodiment, it is possible to reduce the positional deviation of the substrate stage 101 that occurs depending on the step drive speed, and to suppress a decrease in the accuracy of the exposure process.

[0038] 6, a method (exposure method) for reducing positional deviation of the substrate stage 101 that occurs depending on the acceleration (step drive acceleration) in the step drive of the substrate stage 101 will be described. As described above, this method is performed by the control unit 107 comprehensively controlling each unit of the exposure apparatus 1.

[0039] In S501, the exposure recipe for exposing the substrate 102 is referenced, and it is determined whether the maximum acceleration in the step drive of the substrate stage 101, i.e., the maximum acceleration of the step drive acceleration, is an initial acceleration for the shot layout of the substrate 102. If the maximum acceleration of the step drive acceleration is not an initial acceleration, the process proceeds to S506. On the other hand, if the maximum acceleration of the step drive acceleration is an initial acceleration, the process proceeds to S502.

[0040] In S502, the substrate stage 101 is step-driven at a low acceleration (first drive profile), and then, while the substrate stage 101 is stationary, a positional deviation of the substrate stage 101 is measured to obtain a first measurement value. Specifically, after the substrate stage 101 is step-driven at the first acceleration, the alignment optical system 103 detects alignment marks provided in each shot area of ​​the substrate 102 held by the substrate stage 101 to measure the positional deviation of the substrate stage 101. In this way, S502 is a step (first step) of measuring the positional deviation of the substrate stage 101 to obtain a first measurement value after step-driving the substrate stage 101 holding the substrate 102 according to the first drive profile.

[0041] In S503, the substrate stage 101 is step-driven at a high acceleration (a second drive profile different from the first drive profile), and then, while the substrate stage 101 is stationary, a positional deviation of the substrate stage 101 is measured to obtain a second measurement value. Specifically, after the substrate stage 101 is step-driven at the second acceleration, an alignment mark provided on the substrate 102 held by the substrate stage 101 is detected by the alignment optical system 103 to measure a positional deviation of the substrate stage 101. In this way, S503 is a step (second step) of measuring a positional deviation of the substrate stage 101 to obtain a second measurement value after step-driving the substrate stage 101 holding the substrate 102 according to the second drive profile.

[0042] It should be noted that the maximum acceleration (second acceleration) of the step drive acceleration in S503 needs only to be greater than the maximum acceleration (first acceleration) of the step drive acceleration in S502. However, it is preferable that the maximum acceleration of the step drive acceleration in S503 is (an acceleration equivalent to) the maximum acceleration of the step drive acceleration when actually performing exposure processing on each shot area of ​​the substrate 102. In other words, in S503, the drive profile (second drive profile) when step-driving the substrate stage 101 should be (the same as) the actual exposure drive profile that specifies the step drive of the substrate stage 101 when exposing the substrate 102.

[0043] In S504, a correction value for correcting the positional deviation of the substrate stage 101 that occurs depending on the step driving acceleration is calculated based on the first measurement value acquired in S502 and the second measurement value acquired in S503 (third step). For example, if the second driving profile is the actual exposure driving profile, the difference between the first measurement value and the second measurement value is set as the correction value for correcting the positional deviation of the substrate stage 101. Also, if the second driving profile is not the actual exposure driving profile, for example, linear interpolation is applied to the difference between the first measurement value and the second measurement value to calculate the correction value for correcting the positional deviation of the substrate stage 101.

[0044] In S505, the correction amount calculated in S504 is associated with the exposure recipe (the exposure recipe referenced in S501, in particular the maximum acceleration of the step drive acceleration included in the exposure recipe) and stored, for example, in a memory unit SU of the exposure apparatus 1 (fifth step).

[0045] In S506, the substrate stage 101 is step-driven while correcting the position of the substrate stage 101 with the correction amount calculated in S504, i.e., the correction amount stored in the storage unit SU, and the substrate 102 held by the substrate stage 101 is exposed (fourth step). For example, the position (positional deviation) of the substrate stage 101 is corrected by step-driving the substrate stage 101 while the correction value is reflected in the measurement value of the position of the substrate stage 101 measured by the measurement unit 106 while the substrate stage 101 is step-driven. Alternatively, the position of the substrate stage 101 may be corrected by step-driving the substrate stage 101 while the correction value is reflected in the target position of the substrate stage 101 while the substrate stage 101 is step-driven.

[0046] As described above, according to this embodiment, it is possible to reduce the positional deviation of the substrate stage 101 that occurs depending on the step drive acceleration, and to suppress a decrease in the accuracy of the exposure process.

[0047] 7, a method (exposure method) for reducing positional deviation of the substrate stage 101 that occurs depending on the step direction in the step drive of the substrate stage 101 will be described. As described above, this method is performed by the control unit 107 comprehensively controlling each unit of the exposure apparatus 1.

[0048] In S601, the exposure recipe for exposing the substrate 102 is referenced, and it is determined whether the step direction in the step drive of the substrate stage 101 is an initial direction for the shot layout of the substrate 102. If the step direction is not an initial direction, the process proceeds to S606. On the other hand, if the step direction is an initial direction, the process proceeds to S602.

[0049] In S602, the substrate stage 101 is step-driven in a first direction (with a first drive profile), and then, while the substrate stage 101 is stationary, a positional deviation of the substrate stage 101 is measured to obtain a first measurement value. Specifically, after the substrate stage 101 is step-driven in the first direction, the alignment optical system 103 detects alignment marks provided in each shot area of ​​the substrate 102 held by the substrate stage 101, thereby measuring a positional deviation of the substrate stage 101. In this manner, S602 is a step (first step) of measuring a positional deviation of the substrate stage 101 to obtain a first measurement value after step-driving the substrate stage 101 holding the substrate 102 according to the first drive profile. Note that the first direction is, for example, a step direction different (i.e., opposite) from the step direction when an exposure process is actually performed on each shot area of ​​the substrate 102.

[0050] In S603, the substrate stage 101 is step-driven in the second direction (with the second drive profile), and then, while the substrate stage 101 is stationary, a positional deviation of the substrate stage 101 is measured to obtain a second measurement value. Specifically, after the substrate stage 101 is step-driven in the second direction, the alignment optical system 103 detects alignment marks provided in each shot area of ​​the substrate 102 held by the substrate stage 101, thereby measuring the positional deviation of the substrate stage 101. In this way, S603 is a process (second process) of measuring a positional deviation of the substrate stage 101 to obtain a second measurement value after step-driving the substrate stage 101 holding the substrate 102 according to the second drive profile. Note that the second direction is, for example, a step direction (the same direction as) when an exposure process is actually performed on each shot area of ​​the substrate 102. In other words, in S603, the drive profile (second drive profile) used when the substrate stage 101 is step-driven is (the same as) the actual exposure drive profile that defines the step-driven operation of the substrate stage 101 when the substrate 102 is exposed.

[0051] In S604, a correction value for correcting the positional deviation of the substrate stage 101 that occurs depending on the step direction is calculated based on the first measurement value acquired in S602 and the second measurement value acquired in S603 (third step). For example, half the difference between the first measurement value and the second measurement value is set as the correction value for correcting the positional deviation of the substrate stage 101.

[0052] In S605, the correction amount found in S604 is associated with the exposure recipe (the exposure recipe referred to in S601, in particular the step direction included in the exposure recipe) and is stored, for example, in a storage unit SU of the exposure apparatus 1 (fifth step).

[0053] In S606, the substrate stage 101 is step-driven while correcting the position of the substrate stage 101 with the correction amount calculated in S604, i.e., the correction amount stored in the storage unit SU, and the substrate 102 held by the substrate stage 101 is exposed (fourth step). For example, the position (positional deviation) of the substrate stage 101 is corrected by step-driving the substrate stage 101 while the correction value is reflected in the measurement value of the position of the substrate stage 101 measured by the measurement unit 106 while the substrate stage 101 is step-driven. Alternatively, the position of the substrate stage 101 may be corrected by step-driving the substrate stage 101 while the correction value is reflected in the target position of the substrate stage 101 while the substrate stage 101 is step-driven.

[0054] As described above, according to this embodiment, it is possible to reduce the positional deviation of the substrate stage 101 that occurs depending on the step direction, and to suppress a decrease in the accuracy of the exposure process.

[0055] Moreover, instead of detecting the alignment marks provided on the substrate 102, it is also possible to reduce the positional deviation of the substrate stage 101 caused by the step driving of the substrate stage 101 from the result obtained by exposing the substrate 102 (exposure result). Below, a method of reducing the positional deviation of the substrate stage 101 using the exposure result will be described.

[0056] First, with reference to FIG. 8, a method (exposure method) for reducing positional deviation of the substrate stage 101 that occurs depending on the speed (step drive speed) in step drive of the substrate stage 101 will be described.

[0057] In S701, the exposure recipe for exposing the substrate 102 is referenced, and it is determined whether the maximum speed in step driving of the substrate stage 101, i.e., the maximum speed of the step driving speed, is an initial speed for the shot layout of the substrate 102. If the maximum speed of the step driving speed is not an initial speed, the process proceeds to S706. On the other hand, if the maximum speed of the step driving speed is an initial speed, the process proceeds to S702.

[0058] In S702, the substrate stage 101 is step-driven at a low speed (first drive profile), and then a positional deviation of the substrate stage 101 is measured from the exposure result of exposing the substrate 102 to obtain a first measurement value. Specifically, after the substrate stage 101 is step-driven at the first speed, the overlay mark obtained by exposing the substrate 102 is inspected by an overlay inspection device to measure the positional deviation of the substrate stage 101. In this way, S702 is a process (first process) of step-driving the substrate stage 101 holding the substrate 102 in accordance with the first drive profile, and then measuring the positional deviation of the substrate stage 101 to obtain a first measurement value.

[0059] In S703, the substrate stage 101 is step-driven at a high speed (second drive profile), and then the positional deviation of the substrate stage 101 is measured from the exposure result of exposing the substrate 102 to obtain a second measurement value. Specifically, after the substrate stage 101 is step-driven at the second speed, the overlay mark obtained by exposing the substrate 102 is inspected by an overlay inspection device to measure the positional deviation of the substrate stage 101. In this way, S703 is a process (second process) in which the substrate stage 101 holding the substrate 102 is step-driven in accordance with the second drive profile, and then the positional deviation of the substrate stage 101 is measured to obtain a second measurement value.

[0060] It should be noted that the maximum speed (second speed) of the step drive speed in S703 needs only to be greater than the maximum speed (first speed) of the step drive speed in S702. However, it is preferable that the maximum speed of the step drive speed in S703 is (a speed equivalent to) the maximum speed of the step drive speed when actually performing exposure processing on each shot area of ​​the substrate 102. In other words, in S703, the drive profile (second drive profile) when step-driving the substrate stage 101 should be (the same as) the actual exposure drive profile that specifies the step drive of the substrate stage 101 when exposing the substrate 102.

[0061] In S704, a correction value for correcting positional deviation of the substrate stage 101 that occurs depending on the step drive speed is calculated based on the first measurement value acquired in S702 and the second measurement value acquired in S703 (third step). For example, if the second drive profile is the actual exposure drive profile, the difference between the first measurement value and the second measurement value is set as the correction value for correcting positional deviation of the substrate stage 101. Also, if the second drive profile is not the actual exposure drive profile, a correction value for correcting positional deviation of the substrate stage 101 is calculated by performing, for example, linear interpolation on the difference between the first measurement value and the second measurement value.

[0062] In S705, the correction amount calculated in S704 is associated with the exposure recipe (the exposure recipe referenced in S701, in particular the maximum step drive speed included in the exposure recipe) and stored, for example, in a memory unit SU of the exposure apparatus 1 (fifth step).

[0063] In S706, the substrate stage 101 is step-driven while correcting the position of the substrate stage 101 with the correction amount calculated in S704, i.e., the correction amount stored in the storage unit SU, and the substrate 102 held by the substrate stage 101 is exposed (fourth step). For example, the position (positional deviation) of the substrate stage 101 is corrected by step-driving the substrate stage 101 while the correction value is reflected in the measurement value of the position of the substrate stage 101 measured by the measurement unit 106 while the substrate stage 101 is step-driven. The position of the substrate stage 101 may also be corrected by step-driving the substrate stage 101 while the correction value is reflected in the target position of the substrate stage 101 while the substrate stage 101 is step-driven.

[0064] As described above, according to this embodiment, it is possible to reduce the positional deviation of the substrate stage 101 that occurs depending on the step drive speed, and to suppress a decrease in the accuracy of the exposure process.

[0065] Next, with reference to FIG. 9, a method (exposure method) for reducing positional deviation of the substrate stage 101 that occurs depending on the acceleration during step driving of the substrate stage 101 (step driving acceleration) will be described.

[0066] In S801, the exposure recipe for exposing the substrate 102 is referenced, and it is determined whether the maximum acceleration in the step drive of the substrate stage 101, i.e., the maximum acceleration of the step drive acceleration, is an initial acceleration for the shot layout of the substrate 102. If the maximum acceleration of the step drive acceleration is not an initial acceleration, the process proceeds to S806. On the other hand, if the maximum acceleration of the step drive acceleration is an initial acceleration, the process proceeds to S802.

[0067] In S802, the substrate stage 101 is step-driven at a low acceleration (first drive profile), and then a positional deviation of the substrate stage 101 is measured from the exposure result of exposing the substrate 102 to obtain a first measurement value. Specifically, after the substrate stage 101 is step-driven at the first acceleration, the overlay mark obtained by exposing the substrate 102 is inspected by an overlay inspection device to measure the positional deviation of the substrate stage 101. In this way, S802 is a process (first process) of step-driving the substrate stage 101 holding the substrate 102 according to the first drive profile, and then measuring the positional deviation of the substrate stage 101 to obtain a first measurement value.

[0068] In S803, the substrate stage 101 is step-driven at a high acceleration (second drive profile), and then the positional deviation of the substrate stage 101 is measured from the exposure result of exposing the substrate 102 to obtain a second measurement value. Specifically, after the substrate stage 101 is step-driven at the second acceleration, the overlay mark obtained by exposing the substrate 102 is inspected by an overlay inspection device to measure the positional deviation of the substrate stage 101. In this way, S803 is a process (second process) of step-driving the substrate stage 101 holding the substrate 102 in accordance with the second drive profile, and then measuring the positional deviation of the substrate stage 101 to obtain a second measurement value.

[0069] It should be noted that the maximum acceleration (second acceleration) of the step drive acceleration in S803 needs only to be greater than the maximum acceleration (first acceleration) of the step drive acceleration in S702. However, it is preferable that the maximum acceleration of the step drive acceleration in S803 is (an acceleration equivalent to) the maximum acceleration of the step drive acceleration when actually performing exposure processing on each shot area of ​​the substrate 102. In other words, in S803, the drive profile (second drive profile) when step-driving the substrate stage 101 should be (the same as) the actual exposure drive profile that specifies the step drive of the substrate stage 101 when exposing the substrate 102.

[0070] In S804, a correction value for correcting the positional deviation of the substrate stage 101 that occurs depending on the step driving acceleration is calculated based on the first measurement value acquired in S802 and the second measurement value acquired in S803 (third step). For example, if the second driving profile is the actual exposure driving profile, the difference between the first measurement value and the second measurement value is set as the correction value for correcting the positional deviation of the substrate stage 101. Also, if the second driving profile is not the actual exposure driving profile, for example, linear interpolation is applied to the difference between the first measurement value and the second measurement value to calculate the correction value for correcting the positional deviation of the substrate stage 101.

[0071] In S805, the correction amount calculated in S804 is associated with the exposure recipe (the exposure recipe referenced in S801, in particular the maximum acceleration of the step drive acceleration included in the exposure recipe) and stored, for example, in a memory unit SU of the exposure apparatus 1 (fifth step).

[0072] In S806, the substrate stage 101 is step-driven while correcting the position of the substrate stage 101 with the correction amount calculated in S804, i.e., the correction amount stored in the storage unit SU, and the substrate 102 held by the substrate stage 101 is exposed (fourth step). For example, the position (positional deviation) of the substrate stage 101 is corrected by step-driving the substrate stage 101 while the correction value is reflected in the measurement value of the position of the substrate stage 101 measured by the measurement unit 106 while the substrate stage 101 is step-driven. Also, the position of the substrate stage 101 may be corrected by step-driving the substrate stage 101 while the correction value is reflected in the target position of the substrate stage 101 while the substrate stage 101 is step-driven.

[0073] As described above, according to this embodiment, it is possible to reduce the positional deviation of the substrate stage 101 that occurs depending on the step drive acceleration, and to suppress a decrease in the accuracy of the exposure process.

[0074] Next, with reference to FIG. 10, a method (exposure method) for reducing the positional deviation of the substrate stage 101 that occurs depending on the step direction in the step drive of the substrate stage 101 will be described.

[0075] In S901, the exposure recipe for exposing the substrate 102 is referenced, and it is determined whether the step direction in the step drive of the substrate stage 101 is an initial direction for the shot layout of the substrate 102. If the step direction is not an initial direction, the process proceeds to S906. On the other hand, if the step direction is an initial direction, the process proceeds to S902.

[0076] In S902, the substrate stage 101 is step-driven in a first direction (with a first drive profile), and then a positional deviation of the substrate stage 101 is measured from the exposure result of exposing the substrate 102 to obtain a first measurement value. Specifically, after the substrate stage 101 is step-driven in the first direction, the overlay mark obtained by exposing the substrate 102 is inspected by an overlay inspection device to measure the positional deviation of the substrate stage 101. In this way, S902 is a process (first process) in which the substrate stage 101 holding the substrate 102 is step-driven according to the first drive profile, and then the positional deviation of the substrate stage 101 is measured to obtain a first measurement value. Note that the first direction is, for example, a step direction different (i.e., opposite) from the step direction when actually performing exposure processing on each shot area of ​​the substrate 102.

[0077] In S903, the substrate stage 101 is step-driven in the second direction (with the second drive profile), and then the positional deviation of the substrate stage 101 is measured from the exposure result of exposing the substrate 102 to obtain a second measurement value. Specifically, after the substrate stage 101 is step-driven in the second direction, the overlay mark obtained by exposing the substrate 102 is inspected by an overlay inspection device to measure the positional deviation of the substrate stage 101. In this way, S903 is a process (second process) of step-driving the substrate stage 101 holding the substrate 102 according to the second drive profile, and then measuring the positional deviation of the substrate stage 101 to obtain a second measurement value. Note that the second direction is, for example, the step direction (the same direction as) when actually performing exposure processing on each shot area of ​​the substrate 102. In other words, in S903, the drive profile (second drive profile) when step-driving the substrate stage 101 is the same as the actual exposure drive profile (the same as) that specifies the step-driving of the substrate stage 101 when exposing the substrate 102.

[0078] In S904, a correction value for correcting the positional deviation of the substrate stage 101 that occurs depending on the step direction is calculated based on the first measurement value acquired in S902 and the second measurement value acquired in S903 (third step). For example, half the difference between the first measurement value and the second measurement value is set as the correction value for correcting the positional deviation of the substrate stage 101.

[0079] In S905, the correction amount found in S904 is associated with the exposure recipe (the exposure recipe referred to in S901, in particular the step direction included in the exposure recipe) and stored, for example, in a storage unit SU of the exposure apparatus 1 (fifth step).

[0080] In S906, the substrate stage 101 is step-driven while correcting the position of the substrate stage 101 with the correction amount calculated in S904, i.e., the correction amount stored in the storage unit SU, and the substrate 102 held by the substrate stage 101 is exposed (fourth step). For example, the position (positional deviation) of the substrate stage 101 is corrected by step-driving the substrate stage 101 while the correction value is reflected in the measurement value of the position of the substrate stage 101 measured by the measurement unit 106 while the substrate stage 101 is step-driven. Alternatively, the position of the substrate stage 101 may be corrected by step-driving the substrate stage 101 while the correction value is reflected in the target position of the substrate stage 101 while the substrate stage 101 is step-driven.

[0081] As described above, according to this embodiment, it is possible to reduce the positional deviation of the substrate stage 101 that occurs depending on the step direction, and to suppress a decrease in the accuracy of the exposure process.

[0082] In this embodiment, when the exposure recipe (including the step drive speed, step drive acceleration, and step direction) is an initial exposure recipe, the correction values ​​are stored in association with the exposure recipe. However, even when the exposure recipe is not an initial exposure recipe, the correction values ​​may have fluctuated due to changes over time, etc. Therefore, it is preferable to periodically update the correction values ​​stored in association with the exposure recipe.

[0083] Furthermore, in this embodiment, when the substrate 102 is exposed, the positional deviation of the substrate stage 101 caused by the step driving of the substrate stage 101 is reduced (corrected). Therefore, basically, alignment (fine adjustment) of the substrate 102 (or the substrate stage 101 holding it) after the step driving is not required. However, the substrate 102 may be aligned after the substrate stage 101 is step driven. In this case, since the positional deviation of the substrate stage 101 caused by the step driving of the substrate stage 101 is reduced, this is advantageous in terms of the time required for alignment of the substrate 102.

[0084] In addition, in this embodiment, an exposure method has been described as an example, but the present invention can also be applied to a measurement method in which a stage holding an object to be measured is driven in steps, and then the object to be measured held on the stage is measured. In this case, the stage is driven in steps while correcting the position of the stage holding the object to be measured with the correction value obtained through the above-mentioned first, second, and third steps, and the object to be measured held by the light stage is measured.

[0085] The manufacturing method of the article in the embodiment of the present invention is suitable for manufacturing articles such as liquid crystal display elements, semiconductor elements, flat panel displays, and MEMS. The manufacturing method includes a step of exposing a substrate coated with a photosensitive agent using the above-mentioned exposure apparatus 1 or exposure method, and a step of developing the exposed photosensitive agent. In addition, an etching step, an ion implantation step, and the like are performed on the substrate using the developed pattern of the photosensitive agent as a mask, and a circuit pattern is formed on the substrate. These steps of exposure, development, etching, and the like are repeated to form a circuit pattern consisting of multiple layers on the substrate. In a post-process, dicing (processing) is performed on the substrate on which the circuit pattern is formed, and chip mounting, bonding, and inspection steps are performed. In addition, the manufacturing method may include other well-known steps (oxidation, film formation, deposition, doping, planarization, resist peeling, etc.). The manufacturing method of the article in the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to the conventional method.

[0086] The disclosure of this specification includes the following exposure method, exposure apparatus, measurement method, and method for manufacturing an article.

[0087] (Item 1) 1. An exposure method for exposing a substrate, comprising the steps of: a first step of measuring a positional deviation of the stage after step-driving the stage holding the substrate in accordance with a first driving profile to obtain a first measurement value; a second step of measuring a positional deviation of the stage after step-driving the stage in accordance with a second driving profile different from the first driving profile to obtain a second measurement value; a third step of determining a correction value for correcting a positional deviation of the stage based on the first measurement value obtained in the first step and the second measurement value obtained in the second step; a fourth step of stepping the stage while correcting the position of the stage using the correction value obtained in the third step, thereby exposing the substrate held by the stage; An exposure method comprising the steps of:

[0088] (Item 2) 2. The exposure method according to item 1, wherein the second drive profile is a drive profile that defines step drive of the stage when exposing the substrate.

[0089] (Item 3) 3. The exposure method described in item 1 or 2, characterized in that the first drive profile and the second drive profile are drive profiles that define at least one of a speed, an acceleration, and a drive direction in step drive of the stage.

[0090] (Item 4) 3. The exposure method according to item 1 or 2, characterized in that a maximum speed in step drive of the stage defined by the second drive profile is greater than a maximum speed in step drive of the stage defined by the first drive profile.

[0091] (Item 5) 3. The exposure method according to item 1 or 2, characterized in that a maximum acceleration in step drive of the stage defined by the second drive profile is greater than a maximum acceleration in step drive of the stage defined by the first drive profile.

[0092] (Item 6) The exposure method described in any one of items 1 to 5, characterized in that in the first and second steps, an alignment mark provided on the substrate held by the stage is detected by an alignment optical system to measure a positional deviation of the stage.

[0093] (Item 7) 6. The exposure method according to any one of items 1 to 5, wherein in the first step and the second step, a positional deviation of the stage is measured by inspecting an overlay mark obtained by exposing the substrate with an overlay inspection device.

[0094] (Item 8) the first driving profile and the second driving profile are driving profiles that define a velocity or an acceleration in step driving of the stage, 3. The exposure method according to item 2, wherein in the third step, a difference between the first measurement value and the second measurement value is obtained as the correction value.

[0095] (Item 9) the first driving profile and the second driving profile are driving profiles that define a driving direction in step driving of the stage, 3. The exposure method according to item 2, wherein in the third step, half of the difference between the first measurement value and the second measurement value is obtained as the correction value.

[0096] (Item 10) 10. The exposure method according to any one of items 1 to 9, characterized in that in the fourth step, the stage is step-driven while the correction value obtained in the third step is reflected in a measurement value of the position of the stage measured while the stage is step-driven.

[0097] (Item 11) 10. The exposure method according to any one of items 1 to 9, wherein in the fourth step, the stage is step-driven while reflecting the correction value obtained in the third step in a target position of the stage while the stage is step-driven.

[0098] (Item 12) 12. The exposure method according to any one of items 1 to 11, further comprising a fifth step of storing the correction value determined in the third step in association with an exposure recipe for exposing the substrate.

[0099] (Item 13) 13. The exposure method according to item 12, wherein in the fifth step, the correction value stored in association with the exposure recipe is periodically updated.

[0100] (Item 14) An exposure apparatus for exposing a substrate, comprising: a stage for holding the substrate; a control unit that controls an exposure process for exposing the substrate held by the stage; having In the exposure process, the stage is step-driven while correcting a position of the stage with a correction value for correcting a positional deviation of the stage, the correction value being calculated based on a first measurement value obtained by measuring a positional deviation of the stage after step-driving the stage holding the substrate in accordance with a first driving profile and a second measurement value obtained by measuring a positional deviation of the stage after step-driving the stage in accordance with a second driving profile different from the first driving profile, and the stage is step-driven while exposing the substrate held by the stage. An exposure apparatus comprising:

[0101] (Item 15) A measurement method for measuring an object to be measured, comprising the steps of: a first step of measuring a positional deviation of the stage after step-driving the stage holding the object to be measured in accordance with a first drive profile, and acquiring a first measurement value; a second step of measuring a positional deviation of the stage after step-driving the stage in accordance with a second driving profile different from the first driving profile to obtain a second measurement value; a third step of determining a correction value for correcting a positional deviation of the stage based on the first measurement value obtained in the first step and the second measurement value obtained in the second step; a fourth step of stepping the stage while correcting the position of the stage using the correction value obtained in the third step, and measuring the object to be measured held by the stage; A measuring method comprising the steps of:

[0102] (Item 16) A step of exposing a substrate using the exposure method according to any one of items 1 to 13; developing the exposed substrate; producing an article from the developed substrate; A method for producing an article, comprising the steps of:

[0103] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0104] 1: exposure apparatus 101: substrate stage 102: substrate 103: alignment optical system 104: drive unit 106: measurement unit 107: control unit

Claims

1. 1. An exposure method for exposing a substrate, comprising the steps of: a first step of measuring a positional deviation of the stage after step-driving the stage holding the substrate in accordance with a first driving profile to obtain a first measurement value; a second step of measuring a positional deviation of the stage after step-driving the stage in accordance with a second driving profile different from the first driving profile to obtain a second measurement value; a third step of calculating a correction value for correcting a positional deviation of the stage based on the first measurement value obtained in the first step and the second measurement value obtained in the second step; a fourth step of stepping the stage while correcting the position of the stage using the correction value obtained in the third step, thereby exposing the substrate held by the stage; An exposure method comprising the steps of:

2. 2. The exposure method according to claim 1, wherein the second drive profile is a drive profile that defines step drive of the stage when exposing the substrate.

3. 2. The exposure method according to claim 1, wherein the first drive profile and the second drive profile are drive profiles that define at least one of a velocity, an acceleration, and a drive direction in step drive of the stage.

4. 2. The exposure method according to claim 1, wherein a maximum speed in step drive of the stage defined by the second drive profile is greater than a maximum speed in step drive of the stage defined by the first drive profile.

5. 2. The exposure method according to claim 1, wherein a maximum acceleration in step drive of the stage defined by the second drive profile is greater than a maximum acceleration in step drive of the stage defined by the first drive profile.

6. 2. The exposure method according to claim 1, wherein in the first step and the second step, a positional deviation of the stage is measured by detecting an alignment mark provided on the substrate held by the stage using an alignment optical system.

7. 2. The exposure method according to claim 1, wherein in the first step and the second step, a positional deviation of the stage is measured by inspecting an overlay mark obtained by exposing the substrate with an overlay inspection device.

8. the first driving profile and the second driving profile are driving profiles that define a velocity or an acceleration in step driving of the stage, 3. The exposure method according to claim 2, wherein in the third step, a difference between the first measurement value and the second measurement value is obtained as the correction value.

9. the first driving profile and the second driving profile are driving profiles that define a driving direction in step driving of the stage, 3. The exposure method according to claim 2, wherein in the third step, half of a difference between the first measurement value and the second measurement value is obtained as the correction value.

10. 2. The exposure method according to claim 1, wherein in the fourth step, the stage is step-driven while the correction value obtained in the third step is reflected in a measurement value of the position of the stage measured while the stage is being step-driven.

11. 2. The exposure method according to claim 1, wherein in the fourth step, the stage is step-driven while the correction value determined in the third step is reflected in a target position of the stage while the stage is step-driven.

12. 2. The exposure method according to claim 1, further comprising a fifth step of storing the correction value determined in the third step in association with an exposure recipe for exposing the substrate.

13. 13. The exposure method according to claim 12, wherein in the fifth step, the correction value stored in association with the exposure recipe is periodically updated.

14. An exposure apparatus for exposing a substrate, comprising: a stage for holding the substrate; a control unit that controls an exposure process for exposing the substrate held by the stage; having In the exposure process, the stage is step-driven while correcting a position of the stage with a correction value for correcting a positional deviation of the stage, the correction value being calculated based on a first measurement value obtained by measuring a positional deviation of the stage after step-driving the stage holding the substrate in accordance with a first driving profile and a second measurement value obtained by measuring a positional deviation of the stage after step-driving the stage in accordance with a second driving profile different from the first driving profile, and the stage is step-driven while exposing the substrate held by the stage. An exposure apparatus comprising:

15. A measurement method for measuring an object to be measured, comprising the steps of: a first step of measuring a positional deviation of the stage after step-driving the stage holding the object to be measured in accordance with a first drive profile, and acquiring a first measurement value; a second step of measuring a positional deviation of the stage after step-driving the stage in accordance with a second driving profile different from the first driving profile to obtain a second measurement value; a third step of calculating a correction value for correcting a positional deviation of the stage based on the first measurement value obtained in the first step and the second measurement value obtained in the second step; a fourth step of stepping the stage while correcting the position of the stage using the correction value obtained in the third step, and measuring the object to be measured held by the stage; A measuring method comprising the steps of:

16. exposing a substrate using the exposure method according to any one of claims 1 to 13; developing the exposed substrate; producing an article from the developed substrate; A method for producing an article, comprising:

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